TWI678756B - Apparatus for transportation of a carrier in a vacuum chamber, system for vacuum processing of a substrate, and method for transportation of a carrier in a vacuum chamber - Google Patents

Apparatus for transportation of a carrier in a vacuum chamber, system for vacuum processing of a substrate, and method for transportation of a carrier in a vacuum chamber Download PDF

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TWI678756B
TWI678756B TW107126344A TW107126344A TWI678756B TW I678756 B TWI678756 B TW I678756B TW 107126344 A TW107126344 A TW 107126344A TW 107126344 A TW107126344 A TW 107126344A TW I678756 B TWI678756 B TW I678756B
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carrier
track section
path
transmission
lower track
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TW201913860A (en
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奧利佛 黑蒙
Oliver Heimel
克里斯蒂安沃爾夫岡 埃曼
Christian Wolfgang Ehmann
雷波 林登博克
Ralph Lindenberg
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美商應用材料股份有限公司
Applied Materials, Inc.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

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Abstract

提供一種用於一真空室(101)中傳輸一載體(10)的設備(100)，設備(100)包括一第一傳輸系統(112)和一路徑轉換組件(150)，第一傳輸系統(112)提供於沿著一傳輸方向(T)上的一第一傳輸路徑(T1)且包括一下軌道區段(121)和一上軌道區段(122)，路徑轉換組件(150)用以於一路徑轉換方向(S)上移動載體，而使載體遠離第一傳輸路徑(T1)；設備更包括一致動器(125)，用於轉換於傳輸位置(I)的一第一距離和路徑轉換位置(II)的一第二距離之間，傳輸位置(I)的一第一距離係於下軌道區段(121)和上軌道區段(122)之間，路徑轉換位置(II)的一第二距離係於下軌道區段(121)和上軌道區段(122)之間，第一距離係小於第二距離。此外，敘述一種包括一路徑轉換組件的系統和一種於真空室中傳輸一載體的方法。 Provided is a device (100) for transferring a carrier (10) in a vacuum chamber (101). The device (100) includes a first transfer system (112) and a path switching assembly (150). 112) Provided along a first transmission path (T1) along a transmission direction (T) and includes a lower track section (121) and an upper track section (122). The path conversion component (150) is used for a The carrier is moved in the path switching direction (S), so that the carrier is away from the first transmission path (T1); the device further includes an actuator (125) for switching a first distance from the transmission position (I) and the path switching position Between a second distance of (II), a first distance of the transmission position (I) is between a lower track section (121) and an upper track section (122), and a second of the path switching position (II) The distance is between the lower track section (121) and the upper track section (122), and the first distance is smaller than the second distance. In addition, a system including a path switching assembly and a method for transporting a carrier in a vacuum chamber are described.

Description

用於真空室中傳輸載體的設備、用於真空處理基 板的系統、以及用於真空室中傳輸載體的方法 Equipment for transferring carriers in a vacuum chamber, for vacuum processing substrates Plate system and method for transferring a carrier in a vacuum chamber

本揭露的實施例是關於一種用於一真空室中傳輸一載體的設備、一種用於真空處理一基板的系統、以及一種用於真空室中傳輸一載體的方法。本揭露的實施例特別是關於具有一沉積設備和具有配置成移動一載體於一第一傳輸路徑和一第二傳輸路徑之間的一路徑轉換組件的一真空系統。特別是於一真空室中用於改變一載體之一軌道的多種方法。 Embodiments of the present disclosure relate to an apparatus for transferring a carrier in a vacuum chamber, a system for vacuum processing a substrate, and a method for transferring a carrier in a vacuum chamber. Embodiments of the present disclosure are particularly related to a vacuum system having a deposition apparatus and a path switching assembly configured to move a carrier between a first transport path and a second transport path. In particular, various methods for changing one orbit of a carrier in a vacuum chamber.

用於基板上的層沉積的技術，包括例如濺鍍沉積、蒸鍍、及化學氣相沉積(chemical vapor deposition，CVD)。濺鍍沉積製程可以用於在基板上沉積材料層，例如絕緣材料或導體材料的材料層。 Techniques for layer deposition on a substrate include, for example, sputtering deposition, evaporation, and chemical vapor deposition (CVD). The sputtering deposition process can be used to deposit a material layer on the substrate, such as a material layer of an insulating material or a conductive material.

為了沉積一多層堆疊，可以安排一系列的線上處理模組。線上處理系統包括多個依序安排的處理模組，例如沉積模組和選 擇性更包括其他處理模組，例如清潔模組和/或蝕刻模組，其中各項相關處理係依序地於處理模組中進行，使得多個基板可以連續地或近似連續地於線上處理系統中進行處理。 In order to deposit a multilayer stack, a series of online processing modules can be arranged. The online processing system includes a plurality of processing modules arranged in sequence, such as a deposition module and a selective module. Optionally, it also includes other processing modules, such as a cleaning module and / or an etching module, in which various related processes are sequentially performed in the processing module, so that multiple substrates can be processed continuously or approximately continuously on the line. Processing in the system.

基板可能被一載體所攜帶，例如一種用於攜帶載體的攜帶裝置。典型地，係使用一傳輸系統傳送載體通過真空系統。傳輸系統可配置為使承載有基板的載體沿著一或更多傳輸路徑傳送。於真空系統中可以提供鄰近彼此的至少二傳輸路徑，例如一第一傳輸路徑，用於傳輸載體於一向前方向上，以及一第二傳輸路徑，用於傳輸載體於相對向前方向的一返回方向上。 The substrate may be carried by a carrier, such as a carrying device for carrying the carrier. Typically, a transport system is used to transfer the carrier through the vacuum system. The transfer system may be configured to transfer the carrier carrying the substrate along one or more transfer paths. At least two transmission paths adjacent to each other can be provided in the vacuum system, such as a first transmission path for transmitting a carrier in a forward direction, and a second transmission path for transmitting a carrier in a return direction relative to the forward direction. on.

傳輸系統可具有滾輪或其他支撐件配置成支撐和傳送載體沿著傳輸路徑和/或從一傳輸路徑到另一傳輸路徑(又可稱為「路徑轉換」或「軌道轉換」)。在載體的傳輸期間，載體和一載體支撐件之間的磨擦可以產生微粒雜質，微粒雜質可能會對真空系統內的真空環境造成負面影響。微粒雜質會汙染沉積在基板上的層，以及降低沉積層的品質。 The transport system may have rollers or other supports configured to support and transport the carrier along the transport path and / or from one transport path to another transport path (also referred to as "path transition" or "track transition"). During transport of the carrier, friction between the carrier and a carrier support can generate particulate impurities, which may negatively affect the vacuum environment in the vacuum system. Particulate impurities can contaminate the layer deposited on the substrate and reduce the quality of the deposited layer.

基於上述情況，因而存在有用於一真空室中傳輸一載體的新設備、用於真空處理一基板的系統、以及在一真空室中傳輸載體時用於減少於真空室中產生微粒雜質的方法等需求。再者，也存在有可於一真空室中於至少二傳輸路徑之間提供一便利的路徑轉換且同時減少真空室中微粒雜質的產生而提供新設備、系統和方法的需求。 Based on the above, there are new equipment for transferring a carrier in a vacuum chamber, a system for vacuum processing a substrate, and a method for reducing the generation of particulate impurities in the vacuum chamber when transferring the carrier in a vacuum chamber demand. Furthermore, there is also a need to provide new equipment, systems, and methods that can provide a convenient path switch between at least two transmission paths in a vacuum chamber while reducing the generation of particulate impurities in the vacuum chamber.

有鑑於上述情況，提供一種用於一真空室中傳輸一載體的設備、一種用於真空處理一基板的系統、以及一種用於真空室中傳輸一載體的方法。本揭露的其他方面、優點、及特徵，係藉由請求項、說明書、及所附圖式而變得明朗。 In view of the foregoing, an apparatus for transferring a carrier in a vacuum chamber, a system for vacuum processing a substrate, and a method for transferring a carrier in a vacuum chamber are provided. Other aspects, advantages, and features of this disclosure are made clear by the claims, the description, and the drawings.

根據本揭露的一方面，提供一種用於一真空室中傳輸一載體的設備，該設備包括一第一傳輸系統，該第一傳輸系統提供於沿著一傳輸方向上的一第一傳輸路徑，其中該第一傳輸系統包括一下軌道區段和一上軌道區段。該設備更包括一路徑轉換組件和一致動器，該路徑轉換組件用以於一路徑轉換方向上移動該載體，而使該載體遠離該第一傳輸路徑，該致動器用於調整於該第一傳輸系統的該下軌道區段和該上軌道區段之間的一距離。 According to an aspect of the present disclosure, there is provided an apparatus for transporting a carrier in a vacuum chamber, the apparatus including a first transport system provided on a first transport path along a transport direction, The first transmission system includes a lower track section and an upper track section. The device further includes a path conversion component and an actuator for moving the carrier in a path conversion direction to move the carrier away from the first transmission path, and the actuator is used to adjust to the first A distance between the lower track section and the upper track section of the transmission system.

該致動器可能配置成用於轉換於傳輸位置(I)的一第一距離和路徑轉換位置(II)的一第二距離之間，傳輸位置(I)的一第一距離係於該下軌道區段(121)和該上軌道區段(122)之間，路徑轉換位置(II)的一第二距離係於該下軌道區段(121)和該上軌道區段(122)之間，該第一距離係小於該第二距離。 The actuator may be configured to switch between a first distance in the transmission position (I) and a second distance in the path switching position (II), and a first distance in the transmission position (I) is below A second distance between the path switching position (II) between the track section (121) and the upper track section (122) is between the lower track section (121) and the upper track section (122). The first distance is smaller than the second distance.

在一些實施例中，該第一傳輸系統可能配置成沿著在該傳輸方向上的該第一傳輸路徑而非接觸式地傳輸該載體。在傳輸期間，該載體可能被固持於一垂直方向上，特別是於該上軌道區段和該下軌道區段的一載體傳輸空間。特別是第一傳輸系統可能為一磁性懸浮系統。 In some embodiments, the first transmission system may be configured to non-contactly transport the carrier along the first transmission path in the transmission direction. During transport, the carrier may be held in a vertical direction, particularly a carrier transport space in the upper track section and the lower track section. In particular, the first transmission system may be a magnetic levitation system.

根據本揭露的另一方面，提供一種用於真空處理一基板的系統。該系統包括一真空室和一或多個處理工具，安排該或該些處理工具於該真空室中，該真空室係選自由沉積源、濺鍍源、蒸鍍源、表面處理工具、加熱裝置、清潔裝置、蝕刻工具以及前述之組合所組成的群組。該系統更包括任一在此敘述的實施例的設備。 According to another aspect of the present disclosure, a system for vacuum processing a substrate is provided. The system includes a vacuum chamber and one or more processing tools, and the processing tools are arranged in the vacuum chamber. The vacuum chamber is selected from a deposition source, a sputtering source, an evaporation source, a surface treatment tool, and a heating device. , Cleaning devices, etching tools, and a combination of the foregoing. The system further includes the apparatus of any of the embodiments described herein.

根據本揭露的又一方面，提供一種用於傳輸一載體於一真空室中的方法。該方法包括在一第一傳輸路徑的一下軌道區段和一上軌道區段之間，於一傳輸方向上沿著該第一傳輸路徑傳輸一載體；增加該下軌道區段和該上軌道區段之間的一距離；以及移動該載體於橫向於該傳輸方向的一路徑轉換方向上，而使該載體遠離該第一傳輸路徑。 According to yet another aspect of the present disclosure, a method for transporting a carrier in a vacuum chamber is provided. The method includes transmitting a carrier along the first transmission path in a transmission direction between a lower track section and an upper track section of a first transmission path; adding one of the lower track section and the upper track section; A distance between them; and moving the carrier in a path switching direction transverse to the transmission direction, so that the carrier is far from the first transmission path.

根據本揭露的又一方面，提供一種用於一真空室中傳輸一載體的方法。該方法包括沿著於一傳輸方向上的一第一傳輸路徑傳輸一載體；以及移動該載體到水平偏移於該第一傳輸路徑的一第二傳輸路徑，包括降低該載體、移動該載體於一路徑轉換方向上，以及舉升該載體。 According to yet another aspect of the present disclosure, a method for transporting a carrier in a vacuum chamber is provided. The method includes transmitting a carrier along a first transmission path in a transmission direction; and moving the carrier to a second transmission path horizontally offset from the first transmission path, including lowering the carrier and moving the carrier at A path changes direction, and the carrier is lifted.

實施例也針對用於進行所揭露之方法的設備，並包括用於執行所述之方法方面的設備部分的設備。這些方法方面可以由硬體元件、以適當軟體編程的電腦、二者的任意組合、或以任何其他方式執行。此外，根據本揭露的實施例也針對用於運作所述設備的方法。用於運作所述設備的方法包括用於實行設備的每個功能的方法方面。 Embodiments are also directed to a device for performing the disclosed method, and include a device for performing a device portion of the method aspect. These method aspects may be performed by hardware components, a computer programmed with appropriate software, any combination of the two, or in any other manner. In addition, embodiments according to the present disclosure are also directed to a method for operating the device. The method for operating the device includes method aspects for performing each function of the device.

10‧‧‧載體 10‧‧‧ carrier

11‧‧‧基板 11‧‧‧ substrate

12‧‧‧遮罩 12‧‧‧Mask

100、200、300、400‧‧‧設備 100, 200, 300, 400‧‧‧ equipment

101‧‧‧真空室 101‧‧‧vacuum chamber

105‧‧‧處理工具 105‧‧‧Processing tools

112‧‧‧第一傳輸系統 112‧‧‧First Transmission System

114‧‧‧第二傳輸系統 114‧‧‧Second Transmission System

121‧‧‧下軌道區段 121‧‧‧ lower track section

122‧‧‧上軌道區段 122‧‧‧ Upper Track Section

123‧‧‧第二下軌道區段 123‧‧‧Second lower track segment

124‧‧‧第二上軌道區段 124‧‧‧Second Upper Track Section

125‧‧‧致動器 125‧‧‧Actuators

141‧‧‧上側導件 141‧‧‧Upper guide

142‧‧‧下側導件 142‧‧‧Lower side guide

150‧‧‧路徑轉換組件 150‧‧‧path conversion component

152‧‧‧載體固持部分 152‧‧‧Carrier holding part

154‧‧‧上固持裝置 154‧‧‧ Upper holding device

302‧‧‧第一磁單元 302‧‧‧First magnetic unit

304‧‧‧第二磁單元 304‧‧‧Second magnetic unit

311‧‧‧第一臂 311‧‧‧first arm

312‧‧‧第二臂 312‧‧‧second arm

610、620、630、710、720、730、740‧‧‧方塊 610, 620, 630, 710, 720, 730, 740‧‧‧ blocks

I‧‧‧傳輸位置 I‧‧‧Transfer location

II‧‧‧路徑轉換位置 II‧‧‧Path Change Location

L1‧‧‧第一準位 L1‧‧‧First level

L2‧‧‧第二準位 L2‧‧‧Second level

S‧‧‧路徑轉換方向 S‧‧‧ Path change direction

T1‧‧‧第一傳輸路徑 T1‧‧‧first transmission path

T2‧‧‧第二傳輸路徑 T2‧‧‧Second transmission path

T3‧‧‧處理位置 T3‧‧‧Processing position

V‧‧‧傳輸方向 V‧‧‧Transmission direction

為了可以理解本揭露上述特徵的細節，可以參照實施例，得到對於簡單總括於上之揭露內容更詳細的敘述。所附之圖式是關於本揭露的實施例，並敘述如下：第1A圖示出根據在此敘述的實施例的一用於載體的傳輸設備的示意圖。 In order to understand the details of the above-mentioned features of the disclosure, reference may be made to the embodiment to obtain a more detailed description of the disclosure that is simply summarized above. The attached drawings are related to the embodiments of the present disclosure and are described as follows: FIG. 1A illustrates a schematic diagram of a transmission device for a carrier according to the embodiments described herein.

第1B圖示出第1A圖的設備於一路徑轉換位置的示意圖。 FIG. 1B is a schematic diagram illustrating the device of FIG. 1A in a path switching position.

第2圖示出根據在此敘述的實施例的一包括用於傳輸載體的系統的俯視圖。 FIG. 2 shows a top view of a system including a carrier for transporting a carrier according to an embodiment described herein.

第3A-H圖示出根據在此敘述的實施例的一用於傳輸載體與設備的方法的各種階段。 3A-H illustrate various stages of a method for transporting a carrier and a device according to embodiments described herein.

第4A-B圖示出根據在此敘述的實施例的一用於傳輸載體與設備的方法的後續階段。 Figures 4A-B illustrate subsequent stages of a method for transporting a carrier and a device according to an embodiment described herein.

第5A-D圖示出根據在此敘述的實施例的一用於傳輸載體與設備的方法的各種階段。 5A-D illustrate various stages of a method for transporting a carrier and a device according to the embodiments described herein.

第6圖示出根據在此敘述的實施例的一用於傳輸載體的方法的流程圖。 FIG. 6 shows a flowchart of a method for transmitting a carrier according to an embodiment described herein.

第7圖示出根據在此敘述的實施例的一用於傳輸載體的方法的流程圖。 FIG. 7 shows a flowchart of a method for transmitting a carrier according to an embodiment described herein.

現在將對於本揭露的各種實施例進行詳細說明，實施例的一或多個示例係繪示於圖中。在以下對於圖式的敘述中，相同的元 件符號是指示相同的元件。一般來說，只會對於個別實施例的不同之處進行敘述。各個示例的提供只是用於解釋本揭露，而非欲用於限制本揭露。此外，作為一實施例的一部分而被繪示或敘述的特徵，可以被用於或結合其他實施例，以產生又另一實施例。所述內容意欲包括使得的修改及變動。 Various embodiments of the present disclosure will now be described in detail. One or more examples of the embodiments are shown in the drawings. In the following description of the schema, the same elements The part symbol indicates the same element. Generally, only the differences between the individual embodiments will be described. Each example is provided to explain the present disclosure and is not intended to limit the present disclosure. In addition, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet another embodiment. The content is intended to include modifications and alterations.

一種用於一真空室中傳輸一載體的設備，可以提供一、二或多個傳輸路徑，其中可以沿著傳輸路徑移動或傳送載體。第一傳輸路徑T1可能延伸下一個到第二傳輸路徑，例如實質上平行於第一傳輸路徑T1。第一傳輸路徑T1和/或第二傳輸路徑T2可能延伸於一傳輸方向T上，傳輸方向T可能為一實質上水平方向。 An apparatus for transporting a carrier in a vacuum chamber, which can provide one, two or more transport paths, wherein the carrier can be moved or transported along the transport path. The first transmission path T1 may extend from the next to the second transmission path, for example, substantially parallel to the first transmission path T1. The first transmission path T1 and / or the second transmission path T2 may extend in a transmission direction T, and the transmission direction T may be a substantially horizontal direction.

第一傳輸路徑T1和第二傳輸路徑T2可能於路徑轉換方向S上水平偏移於彼此之間。於路徑轉換方向S上第一傳輸路徑T1和第二傳輸路徑T2之間的距離可能為10公分或更多，特別是20公分或更多，和/或100公分或更少，特別是50公分或更少。 The first transmission path T1 and the second transmission path T2 may be horizontally shifted from each other in the path switching direction S. The distance between the first transmission path T1 and the second transmission path T2 in the path switching direction S may be 10 cm or more, especially 20 cm or more, and / or 100 cm or less, especially 50 cm Or less.

在此敘述的用於傳輸一載體的設備可能為真空處理系統的一部分，例如一系列的線上處理系統，使得一基板可以連續地或準近似連續地進行處理。設備可能配置成用以置換或移動載體到第二傳輸路徑T2和處理位置T3的至少其中之一，而使載體遠離第一傳輸路徑T1，其中基板可以於處理位置T3進行處理。特別是，設備可以側向置換載體從第一傳輸路徑T1上的第一位置到遠離於路徑轉移方向S上的第一軌道的第二位置。路徑轉移方向S可能橫向於傳輸方向T，特別是實質上垂直於傳輸方向T。當載體於路徑轉移位置S上被移動從一傳 輸路徑到另一傳輸路徑，所述移動可以又稱為「路徑轉換」或「軌道轉換」。 The equipment for transporting a carrier described herein may be part of a vacuum processing system, such as a series of in-line processing systems, so that a substrate can be processed continuously or quasi-continuously. The device may be configured to replace or move the carrier to at least one of the second transport path T2 and the processing position T3, while keeping the carrier away from the first transport path T1, where the substrate can be processed at the processing position T3. In particular, the device may laterally displace the carrier from a first position on the first transmission path T1 to a second position remote from the first track in the path transfer direction S. The path transition direction S may be transverse to the transmission direction T, and in particular substantially perpendicular to the transmission direction T. When the carrier is moved at the path transfer position S from a pass To another transmission path, the movement may also be referred to as "path transition" or "orbit transition".

在一些實施例中，一載體係沿著於傳輸方向T上的第一傳輸路徑T1傳送；係移動到處理位置T3而遠離路徑轉換方向S上的第一傳輸路徑T1，其中基板可以於處理位置T3進行處理；係移動於路徑轉換方向S上，以及沿著第二傳輸路徑T2傳送。 In some embodiments, a carrier is transported along a first transport path T1 in a transport direction T; it is moved to a processing position T3 and away from the first transport path T1 in a path switching direction S, where the substrate may be at the processing position T3 performs processing; moves in the path switching direction S, and transmits along the second transmission path T2.

設備可能包括一傳輸系統。傳輸系統可能配置用以沿著第一和/或第二傳輸路徑非接觸式地傳輸一載體，例如使用一磁力。換言之，傳輸系統可能不使用一機械力(mechanical force)來傳輸載體。相反地，傳輸系統可能磁性地推或拉載體而使載體朝向一新的位置。被使用於本揭露中通篇的用詞「非接觸式的(contactless)」和「非接觸式地(contactlessly)」係可以被理解意指為不是藉由使用於載體和傳輸系統之間的機械接觸來移動載體，而是藉由排斥和/或吸引磁力來磁性移動載體。在一些實施方案中，在所有沿著第一和/或第二傳輸路徑的傳輸期間，因而存在有於設備和載體之間的非機械接觸式。 The equipment may include a transmission system. The transmission system may be configured to contactlessly transport a carrier along the first and / or second transmission path, for example using a magnetic force. In other words, the transfer system may not use a mechanical force to transfer the carrier. Conversely, the transport system may magnetically push or pull the carrier toward the carrier to a new location. The terms "contactless" and "contactlessly" used throughout this disclosure can be understood to mean not by using machinery between the carrier and the transmission system Contact to move the carrier, but to move the carrier magnetically by repelling and / or attracting magnetic forces. In some embodiments, there is a non-mechanical contact between the device and the carrier during all transmissions along the first and / or second transmission path.

傳輸系統在一些實施例中可能為一磁性懸浮系統。磁性懸浮系統可能包括一上軌道和一下軌道，其中載體可能於一實質上垂直方向傳輸，其中垂直方向於上軌道和下軌道之間。上軌道可能被安排於下軌道之上。磁性懸浮系統的磁和/或驅動單元可能被安排於上軌道和/或下軌道。舉例而言，可能安排活性磁性驅動單元於上軌道，配置成用以非接觸式地固持載體於上軌道，以及可能安排驅動單元於下軌道，配置成用以沿著軌道移動載體。 The transmission system may be a magnetic levitation system in some embodiments. The magnetic levitation system may include an upper track and a lower track, wherein the carrier may be transported in a substantially vertical direction, wherein the vertical direction is between the upper track and the lower track. The upper track may be arranged above the lower track. The magnetic and / or drive unit of the magnetic levitation system may be arranged on the upper track and / or the lower track. For example, an active magnetic drive unit may be arranged on the upper track, configured to non-contactly hold the carrier on the upper track, and a drive unit may be arranged on the lower track, configured to move the carrier along the track.

在傳輸載體期間，由於載體的非接觸式傳輸減少載體和傳輸系統的區段之間的機械接觸，因而有益於產生減少數量的微粒雜質，其中傳輸系統的區段例如是滾輪(rollers)。因此，於真空室中的真空環境不受傳輸載體的負面影響。可以改良在基板上的沉積層的純度(purity)，特別是因為使用用以非接觸式地傳輸的傳輸系統時，微粒雜質的產生為最小化或甚至避免產生微粒雜質。 During the transfer of a carrier, the non-contact transport of the carrier reduces the mechanical contact between the carrier and a section of the transport system, which is beneficial for producing a reduced amount of particulate impurities, where the sections of the transport system are rollers for example. Therefore, the vacuum environment in the vacuum chamber is not adversely affected by the transfer carrier. The purity of the deposited layer on the substrate can be improved, especially since the generation of particulate impurities is minimized or even avoided when using a transmission system for non-contact transfer.

第1A圖繪示根據在此敘述的實施例的用於傳輸一載體10於傳輸位置(I)的真空室101中一設備100的示意圖。於傳輸位置(I)中，載體10可以沿著於一傳輸方向T上的第一傳輸路徑T1傳送。在非接觸式的傳輸期間，可能提供一(小)縫隙於載體和上軌道區段之間以及於載體和下軌道區段之間。 FIG. 1A is a schematic diagram of a device 100 in a vacuum chamber 101 for transferring a carrier 10 to a transfer position (I) according to the embodiment described herein. In the transfer position (I), the carrier 10 can transfer along a first transfer path T1 in a transfer direction T. During non-contact transmission, a (small) gap may be provided between the carrier and the upper track section and between the carrier and the lower track section.

第1B圖繪示第1A圖於路徑轉換位置(II)之示意圖。於路徑轉換位置(II)中，載體10可以移動到路徑轉換方向S上而使載體10遠離第一傳輸路徑T1，例如朝向第二傳輸路徑T2。根據一些實施例，設備100可以為一真空系統的一部分，例如濺鍍沉積系統(sputter deposition system)或蒸鍍沉積系統(evaporation deposition system)。 FIG. 1B is a schematic diagram of FIG. 1A at the path switching position (II). In the path switching position (II), the carrier 10 can be moved to the path switching direction S to move the carrier 10 away from the first transmission path T1, for example, toward the second transmission path T2. According to some embodiments, the apparatus 100 may be part of a vacuum system, such as a sputtering deposition system or an evaporation deposition system.

載體10可以為配置成一用以攜帶基板11的基板載體。舉例而言，載體10可能包括一夾具裝置，例如一固持表面的一磁性夾具或一靜電式夾具，用以夾持基板11而使基板11朝向載體10。在其他實施例中，載體10可能配置成用於攜帶一不同物件，例如一遮罩(mask)或一掩膜(shield)。載體10可能配置成用以固持基板11於實質上垂直方向上。換言之，在傳輸載體10的期間，於基板11的主要表面和重力向 量(gravity vector)之間的角度可能典型地少於20°。舉例而言，於基板的主要表面和重力向量之間的角度可能從-10°到+10°，特別是從-1°到-5°，其中負的角度意指標定向下地朝向基板。 The carrier 10 may be a substrate carrier configured to carry the substrate 11. For example, the carrier 10 may include a fixture device, such as a magnetic fixture or an electrostatic fixture holding a surface, for holding the substrate 11 so that the substrate 11 faces the carrier 10. In other embodiments, the carrier 10 may be configured to carry a different object, such as a mask or a shield. The carrier 10 may be configured to hold the substrate 11 in a substantially vertical direction. In other words, during the transfer of the carrier 10, the main surface of the substrate 11 and the direction of gravity The angle between the gravity vectors may typically be less than 20 °. For example, the angle between the main surface of the substrate and the gravity vector may be from -10 ° to + 10 °, especially from -1 ° to -5 °, where a negative angle means that the index is directed toward the substrate.

載體10可能配置成用以攜帶一大面積基板，特別是用於顯示器製造的一大面積基板。在實施例中，基板可能有一被處理的表面積，其中被處理的表面積為1平方公尺或更多，特別是5平方公尺或更多，或甚至10平方公尺或更多。因此，載體可能有一基板固持表面，基板固持表面有1平方公尺或更多的尺寸，特別是5平方公尺或更多，或甚至10平方公尺或更多。舉例而言，載體10的高度可能為1公尺或更多，特別是2公尺或更多，和/或載體10的寬度可能為1公尺或更多，特別是2公尺或更多。載體10可能配置成用以攜帶基板於一實質上垂直方向上。 The carrier 10 may be configured to carry a large-area substrate, particularly a large-area substrate for display manufacturing. In an embodiment, the substrate may have a processed surface area, wherein the processed surface area is 1 square meter or more, particularly 5 square meters or more, or even 10 square meters or more. Therefore, the carrier may have a substrate holding surface having a size of 1 square meter or more, especially 5 square meters or more, or even 10 square meters or more. For example, the height of the carrier 10 may be 1 meter or more, especially 2 meters or more, and / or the width of the carrier 10 may be 1 meter or more, especially 2 meters or more . The carrier 10 may be configured to carry the substrate in a substantially vertical direction.

設備100包括一第一傳輸系統112，配置成用以沿著於傳輸方向T上的第一傳輸路徑T1傳輸載體10，特別是一傳輸系統，傳輸系統配置成用於載體的非接觸式的傳送。第一傳輸系統112可能為一第一磁性懸浮系統，配置成用以沿著第一傳輸路徑T1非接觸式地傳輸載體。第一傳輸系統112包括一下軌道區段121和一上軌道區段122。載體可能被傳輸於下軌道區段121和上軌道區段122的一載體傳輸空間。可能安排第一傳輸系統112的磁性單元於下軌道區段121和/或上軌道區段122。舉例而言，可能安排多個活性控制磁性單元於上軌道區段122用以非接觸式地固持載體10於上軌道區段122之下。 The device 100 comprises a first transmission system 112 configured to transmit the carrier 10 along a first transmission path T1 in the transmission direction T, and in particular a transmission system configured to be used for contactless transmission of the carrier . The first transmission system 112 may be a first magnetic levitation system configured to contactlessly transport the carrier along the first transmission path T1. The first transmission system 112 includes a lower track section 121 and an upper track section 122. The carrier may be transported in a carrier transport space of the lower track section 121 and the upper track section 122. The magnetic unit of the first transmission system 112 may be arranged in the lower track section 121 and / or the upper track section 122. For example, multiple active control magnetic units may be arranged in the upper track section 122 to hold the carrier 10 under the upper track section 122 in a non-contact manner.

設備100更包括一路徑轉移組件150。路徑轉移組件150可能配置成用以於路徑轉換方向S上移動載體而使載體遠離第一傳輸路徑T1。特別是，路徑轉移組件150可能配置成用以於實質上垂直於傳輸方向T的路徑轉換方向S上移動載體，使載體從第一傳輸路徑T1移動到第二傳輸路徑T2。或者或此外，路徑轉移組件150可能配置成用以移動載體到處理位置T3，載體係於處理位置T3進行處理，例如塗佈。處理位置T3可能水平偏移於第一和第二傳輸路徑。 The device 100 further includes a path transfer component 150. The path transfer component 150 may be configured to move the carrier in the path switching direction S to move the carrier away from the first transmission path T1. In particular, the path transfer component 150 may be configured to move the carrier in a path switching direction S that is substantially perpendicular to the transmission direction T to move the carrier from the first transmission path T1 to the second transmission path T2. Alternatively or in addition, the path transfer assembly 150 may be configured to move the carrier to the processing position T3, and the carrier is tied to the processing position T3 for processing, such as coating. The processing position T3 may be horizontally offset from the first and second transmission paths.

如第1A圖和第1B圖所繪示，當安排載體於處理位置T3，可能安排一處理工具105於真空室中，用以處理載體所固持的基板11。處理工具105可以為配置成沉積基板上的一塗佈材料的一沉積源。 As shown in FIG. 1A and FIG. 1B, when the carrier is arranged at the processing position T3, a processing tool 105 may be arranged in the vacuum chamber to process the substrate 11 held by the carrier. The processing tool 105 may be a deposition source configured to deposit a coating material on a substrate.

設備100更包括一致動器125，用以轉換於如第1A圖所述的傳輸位置(I)和如第1B圖所述的路徑轉換位置(II)之間。於傳輸位置(I)中，安排下軌道區段121和上軌道區段122於彼此間的一第一距離，以及於路徑轉換位置(II)中，安排下軌道區段121和上軌道區段122於彼此間的一第二距離。第一距離係小於第二距離。 The device 100 further includes an actuator 125 for switching between the transmission position (I) as shown in FIG. 1A and the path switching position (II) as shown in FIG. 1B. In the transmission position (I), the lower track section 121 and the upper track section 122 are arranged at a first distance from each other, and in the path switching position (II), the lower track section 121 and the upper track section 122 are arranged at A second distance from each other. The first distance is smaller than the second distance.

換言之，根據在此敘述的實施例，於第一傳輸系統的下軌道區段121和上軌道區段122之間的距離可以調整，特別是增加和/或減少。第一距離(小距離)可能適合用於傳輸方向上非接觸式地傳輸載體於下軌道區段121和上軌道區段122之間。當提供上軌道區段一相對小的距離，要於路徑轉換方向上移動載體遠離第一傳輸路徑T1則可能顯得困難。第一傳輸系統的下軌道區段121和上軌道區段122之間的一 第二距離(大距離)可能適合用於移動載體遠離第一傳輸路徑，例如於路徑轉換方向上到第二傳輸路徑T2和/或處理位置T3。 In other words, according to the embodiments described herein, the distance between the lower track section 121 and the upper track section 122 of the first transmission system may be adjusted, particularly increased and / or decreased. The first distance (small distance) may be suitable for contactlessly transferring the carrier between the lower track section 121 and the upper track section 122 in the transmission direction. When a relatively small distance is provided for the upper track section, it may appear difficult to move the carrier away from the first transmission path T1 in the path switching direction. A first transmission system between the lower track section 121 and the upper track section 122 The second distance (large distance) may be suitable for moving the carrier away from the first transmission path, for example, to the second transmission path T2 and / or the processing position T3 in the path switching direction.

在一些實施例中，下軌道區段121和上軌道區段122之間的第一距離可能為1公尺或更多，特別是2公尺或更多。舉例而言，第一距離可能稍大於載體的垂直尺寸，使得載體可以於下軌道區段和上軌道區段之間非接觸式地傳輸。第二距離可能為比第一距離大多個毫米或公分，特別是於第一距離和第二距離的差距可能為5毫米或更多，20毫米或更多，40毫米或更多，或甚至100毫米或更多。換言之，致動器125可能配置成用於改變下軌道區段和上軌道區段之間的距離5毫米或更多，20毫米或更多，40毫米或更多，或甚至100毫米或更多。 In some embodiments, the first distance between the lower track section 121 and the upper track section 122 may be 1 meter or more, especially 2 meters or more. For example, the first distance may be slightly larger than the vertical size of the carrier, so that the carrier can be transmitted non-contact between the lower track section and the upper track section. The second distance may be several millimeters or centimeters larger than the first distance, especially the difference between the first distance and the second distance may be 5 mm or more, 20 mm or more, 40 mm or more, or even 100 Mm or more. In other words, the actuator 125 may be configured to change the distance between the lower track section and the upper track section by 5 mm or more, 20 mm or more, 40 mm or more, or even 100 mm or more.

換言之，沿著路徑轉換組件被安排於第一傳輸路徑的一部分，可能提供一致動器125用於增加於下軌道區段121和上軌道區段122之間的第一距離。致動器可能包括一驅動裝置，例如一發電機、一水力裝置或一氣動裝置，用於增加於下軌道區段121和上軌道區段122之間的距離。在一些實施例中，為了要增加上軌道區段122和下軌道區段121之間的距離，致動器125可能配置成用於移動下軌道區段121遠離上軌道區段122，例如於一垂直方向，以及特別是向下方向。在一些實施例中，為了要增加於上軌道區段122和下軌道區段121之間的距離，致動器125可能配置成用於移動上軌道區段122遠離下軌道區段121，例如於垂直方向，以及特別是向上方向。 In other words, along the path conversion assembly is arranged at a part of the first transmission path, it is possible to provide the actuator 125 for increasing the first distance between the lower track section 121 and the upper track section 122. The actuator may include a driving device, such as a generator, a hydraulic device, or a pneumatic device, for increasing the distance between the lower track section 121 and the upper track section 122. In some embodiments, in order to increase the distance between the upper track section 122 and the lower track section 121, the actuator 125 may be configured to move the lower track section 121 away from the upper track section 122, such as in a vertical direction , And especially downwards. In some embodiments, in order to increase the distance between the upper track section 122 and the lower track section 121, the actuator 125 may be configured to move the upper track section 122 away from the lower track section 121, such as in a vertical direction , And especially upwards.

遠離第一傳輸路徑T1的載體的一路徑轉換可能包括沿著於傳輸方向T上的第一傳輸路徑傳輸載體，同時提供第一傳輸載體 112於如第1A圖所述之傳輸位置(I)。伴隨於上軌道區段和下軌道區段之間的一較大距離，可能停止載體，以及可能移動第一傳輸系統112於如第1B圖所述之路徑轉換位置(II)。因此，載體可能被移動遠離於路徑轉換位置S上的第一傳輸路徑T1。 A path conversion of a carrier far from the first transmission path T1 may include transmitting the carrier along the first transmission path in the transmission direction T, while providing the first transmission carrier 112 at the transmission position (I) as shown in FIG. 1A. With a large distance between the upper track section and the lower track section, the carrier may be stopped, and the first transmission system 112 may be moved to the path switching position (II) as shown in FIG. 1B. Therefore, the carrier may be moved away from the first transmission path T1 at the path switching position S.

因為多個原因，於路徑轉換位置中，移動載體遠離於路徑轉換位置S上的第一傳輸路徑T1可能更簡單。舉例而言，永久磁鐵的磁力影響，可能從上和下軌道區段作用於載體上，可能藉由移動上和下軌道區段遠離彼此而減少。此外，於路徑轉換位置(II)上，連接到上和/或下軌道區段的側導軌(side guiding rails)可能不會干擾載體。此外，於路徑轉換位置上，提供一較大的空間於上軌道區段和下軌道區段之間，藉由路徑轉換組件可以使載體的側轉換更容易以及可以提供更多個路徑轉換組件。在路徑轉換的期間，可以避免於載體和軌道之間的接觸。 For multiple reasons, it may be simpler for the mobile carrier to move away from the first transmission path T1 at the path switching position S in the path switching position. For example, the magnetic influence of a permanent magnet may act on the carrier from the upper and lower track sections, and may be reduced by moving the upper and lower track sections away from each other. Furthermore, at the path switching position (II), the side guiding rails connected to the upper and / or lower track sections may not interfere with the carrier. In addition, at the path switching position, a larger space is provided between the upper track section and the lower track section. The path switching module can make the side switching of the carrier easier and can provide more path switching modules. During the path change, contact between the carrier and the track can be avoided.

在一些實施例中，介於如第1A圖所述之傳輸位置(I)和如第1B圖所述之路徑轉換位置(II)之間的轉換可能包括使用致動器以移動下軌道區段121於一向下方向上。舉例而言，下軌道區段121可能被向下移動20毫米或更多的距離，特別是40毫米或更多，更特別是80毫米或更多。下軌道區段121和上軌道區段122之間的垂直空間可以增加用於使路徑轉換的移動更容易。 In some embodiments, the transition between the transmission position (I) as described in FIG. 1A and the path transition position (II) as described in FIG. 1B may include using an actuator to move the lower track section 121 in a downward direction. For example, the lower track section 121 may be moved downward by a distance of 20 mm or more, particularly 40 mm or more, and more particularly 80 mm or more. The vertical space between the lower track section 121 and the upper track section 122 may increase the movement for making the path transition easier.

在一些可能與在此敘述的其他實施例結合的實施例中，路徑轉換組件150包括於路徑轉換方向S上的可移動的載體固持部分152，用於轉換於路徑轉換方向S上的載體固持部分152所固持的載體 10。舉例而言，載體10可能被機械地支撐在載體固持部分152之上。如第1B圖所述的實施例中，載體10係由載體固持部分152支撐於之下，例如載體10可以被置於載體固持部分152之上。在一些實施例中，載體固持部分可能固持於載體的側邊或載體之上方。舉例而言，載體固持部分152可能包括一磁性夾具，用以夾持載體到載體固持部分152。 In some embodiments that may be combined with other embodiments described herein, the path switching component 150 includes a movable carrier holding portion 152 in the path switching direction S, and is used to switch to the carrier holding portion in the path switching direction S. 152 Holders 10. For example, the carrier 10 may be mechanically supported on the carrier holding portion 152. As shown in FIG. 1B, the carrier 10 is supported by the carrier holding portion 152. For example, the carrier 10 may be placed on the carrier holding portion 152. In some embodiments, the carrier holding portion may be held on the side of the carrier or above the carrier. For example, the carrier holding portion 152 may include a magnetic clamp for holding the carrier to the carrier holding portion 152.

可能提供一驅動裝置(又可稱為「交叉驅動(cross drive)」)，用以於路徑轉換方向S上移動載體固持部分152以轉換載體從第一傳輸路徑T1到第二傳輸路徑T2和處理位置T3中的至少其中之一。可能安排驅動裝置(未繪示於圖中)於真空室101的外側，以及載體固持部分152可能延伸通過真空室101的一壁。或者，可能安排驅動裝置於真空室101之內。 It is possible to provide a driving device (also known as a "cross drive") for moving the carrier holding portion 152 in the path switching direction S to switch the carrier from the first transmission path T1 to the second transmission path T2 and process At least one of the positions T3. A driving device (not shown) may be arranged on the outside of the vacuum chamber 101, and the carrier holding portion 152 may extend through a wall of the vacuum chamber 101. Alternatively, the driving device may be arranged inside the vacuum chamber 101.

驅動裝置可能配置成用於移動於路徑轉換方向S上移動載體固持部分152之10公分或更多的一距離，特別是20公分或更多，從第一傳輸路徑T1到第二傳輸路徑T2。舉例而言，第一傳輸路徑T1和第二傳輸路徑T2之間的距離可能為25公分或更多以及100公分或更少。 The driving device may be configured to move a distance of 10 cm or more, in particular 20 cm or more, from the first transmission path T1 to the second transmission path T2 in the path switching direction S by a distance of 10 cm or more. For example, the distance between the first transmission path T1 and the second transmission path T2 may be 25 cm or more and 100 cm or less.

如第1B圖所述之實施例的載體固持部分152包括一載體支撐表面，用於定位載體於載體支撐表面上方。舉例而言，載體10可能藉由下軌道區段121被移動於一向下方向上以及被置於載體固持部分152的支撐表面之上。因此，路徑轉換組件150可能於路徑轉換方向S上移動載體固持部分152，用以傳送載體遠離第一傳輸路徑T1。 The carrier holding portion 152 of the embodiment shown in FIG. 1B includes a carrier supporting surface for positioning the carrier above the carrier supporting surface. For example, the carrier 10 may be moved in a downward direction by the lower track section 121 and placed on a supporting surface of the carrier holding portion 152. Therefore, the path switching component 150 may move the carrier holding portion 152 in the path switching direction S to transfer the carrier away from the first transmission path T1.

在一些可能結合在此敘述的其他實施例的實施例中，可能提供一第二傳輸系統114，用以沿著一第二傳輸路徑T2傳輸載體 10。第二傳輸系統114可能為一第二磁性懸浮系統，第二磁性懸浮系統係提供於沿著第二傳輸路徑T2。第二傳輸路徑T2可能水平偏移於第二傳輸路徑T1。路徑轉換組件150可能可移動於路徑轉換方向S上從第一傳輸路徑T1到第二傳輸路徑T2和處理位置T3中的至少其中之一。 In some embodiments that may be combined with other embodiments described herein, a second transmission system 114 may be provided for transmitting a carrier along a second transmission path T2. 10. The second transmission system 114 may be a second magnetic levitation system. The second magnetic levitation system is provided along the second transmission path T2. The second transmission path T2 may be horizontally offset from the second transmission path T1. The path switching component 150 may be movable in the path switching direction S from at least one of the first transmission path T1 to the second transmission path T2 and the processing position T3.

特別是，路徑轉換組件150的載體固持部分152可能可移動於路徑轉換方向S上，用以傳送載體10從第一傳輸路徑T1到第二傳輸路徑T2和/或處理位置T3，處理位置T3係皆水平偏移於第一和第二傳輸路徑。 In particular, the carrier holding portion 152 of the path conversion component 150 may be movable in the path conversion direction S to transfer the carrier 10 from the first transmission path T1 to the second transmission path T2 and / or the processing position T3. The processing position T3 is Both are horizontally offset from the first and second transmission paths.

相似於第一傳輸系統112，第二傳輸系統114可能包括一第二下軌道區段123和一第二上軌道區段124，其中載體可以沿著第二下軌道區段123和第二上軌道區段124之間的第二傳輸路徑T2傳送。 Similar to the first transmission system 112, the second transmission system 114 may include a second lower track section 123 and a second upper track section 124, wherein the carrier may be along the second lower track section 123 and the second upper track section The second transmission path T2 between 124 is transmitted.

在一些實施例中，可能提供一致動器，用於增加和/或減少第二下軌道區段123和第二上軌道區段124之間的距離。在一些實施例中，可能提供一單獨的致動器(例如致動器125)，用於增加和/或減少第一傳輸系統112的下軌道區段121和上軌道區段122之間以及第二傳輸系統114的第二下軌道區段123和第二上軌道區段124之間的距離。在一些實施例中，可能提供一第一致動器，用於增加和/或減少第一傳輸系統112的下軌道區段121和上軌道區段122之間的距離，以及可能提供一第二致動器，用於第二傳輸系統114的第二下軌道區段123和第二上軌道區段124之間的距離。 In some embodiments, an actuator may be provided for increasing and / or decreasing the distance between the second lower track section 123 and the second upper track section 124. In some embodiments, a separate actuator (eg, actuator 125) may be provided for increasing and / or decreasing between the lower track section 121 and the upper track section 122 of the first transmission system 112 and the second The distance between the second lower track section 123 and the second upper track section 124 of the transmission system 114. In some embodiments, a first actuator may be provided for increasing and / or decreasing the distance between the lower track section 121 and the upper track section 122 of the first transmission system 112, and a second actuation may be provided. An actuator for the distance between the second lower track section 123 and the second upper track section 124 of the second transmission system 114.

特別是，在一些實施例中，第二傳輸系統114的第二下軌道區段123可能可移動於一垂直方向V上，特別是於一向下方向上到一路徑轉換位置(II)和於一向上方向上到一傳輸位置(I)。 In particular, in some embodiments, the second lower track section 123 of the second transmission system 114 may be movable in a vertical direction V, particularly in a downward direction to a path switching position (II) and in an upward direction Direction to a transmission position (I).

在一些可能與在此敘述的其他實施例配置的實施例中，第一傳輸系統112的下軌道區段121係可獨立地移動於第二傳輸系統114的第二下軌道區段123的一垂直方向V上。第1A圖繪示出下軌道區段121和第二下軌道區段123於對應於一傳輸位置(I)的一上方位置，使載體可於傳輸位置(I)上沿著第一和第二傳輸路徑傳輸。第1B圖繪示出下軌道區段121和第二下軌道區段123於對應於一路徑轉換位置(II)的一下方位置上，使傳輸路徑之間可進行路徑轉換。 In some embodiments that may be configured with other embodiments described herein, the lower track section 121 of the first transmission system 112 is independently movable in a vertical direction of the second lower track section 123 of the second transmission system 114 Direction V. FIG. 1A shows the lower track section 121 and the second lower track section 123 at an upper position corresponding to a transfer position (I), so that the carrier can move along the first and second positions at the transfer position (I). Transmission path transmission. FIG. 1B illustrates that the lower track section 121 and the second lower track section 123 are at a lower position corresponding to a path switching position (II), so that the path can be switched between transmission paths.

如第1A圖所繪示的，於傳輸位置(I)中，第二懸浮系統的一上側導件141和/或一下側導件142可能避免路徑轉換從第一傳輸路徑載體T1到第二傳輸路徑T2。如第1B圖所繪示的路徑轉換位置(II)的轉換之後，由於上和下軌道區段之間增加的距離，於路徑轉換方向S上載體係可經過上側導件141和下側導件142而移動。 As shown in FIG. 1A, in the transfer position (I), an upper guide 141 and / or a lower guide 142 of the second suspension system may prevent path switching from the first transmission path carrier T1 to the second transmission Path T2. As shown in FIG. 1B, after the conversion of the path switching position (II), due to the increased distance between the upper and lower track sections, the uploading system in the path switching direction S can pass the upper guide 141 and the lower guide 142. While moving.

第2圖示出根據在此敘述的實施例的包括一種用於傳輸一載體的一設備的系統200的俯視圖。設備可能對應於如第1A圖和第1B圖敘述的設備100，如此一來可樹立一以上實施例之參考，此處不再重複描述以上實施例。 FIG. 2 shows a top view of a system 200 including a device for transporting a carrier according to an embodiment described herein. The device may correspond to the device 100 described in FIG. 1A and FIG. 1B. In this way, reference for more than one embodiment can be established, and the above embodiment will not be described repeatedly here.

根據在此敘述的實施例的用於一基板的真空處理的系統200包括一真空室101，根據任何在此敘述的實施例的設備100，以及一或更多被安排於真空室101的處理工具105。一或更多的處理工具可 能係選自由沉積源、濺鍍源、蒸鍍源、表面處理工具、加熱裝置、清潔裝置、蝕刻工具以及前述之組合所組成的群組。 A system 200 for vacuum processing of a substrate according to the embodiments described herein includes a vacuum chamber 101, an apparatus 100 according to any of the embodiments described herein, and one or more processing tools arranged in the vacuum chamber 101 105. One or more processing tools are available Can be selected from the group consisting of a deposition source, a sputtering source, an evaporation source, a surface treatment tool, a heating device, a cleaning device, an etching tool, and a combination thereof.

第一傳輸路徑T1和水平偏移於第一傳輸路徑T1的第二傳輸路徑T2係延伸過真空室101。可選擇地，可以提供一基板被處理的一處理位置T3，處理位置T3係水平偏移於第一傳輸路徑T1和第二傳輸路徑T2。在一些實施例中，提供一遮罩12於載體10的處理位置T3和處理工具105之間。遮罩12可能為例如一邊緣排除遮罩(edge exclusion mask)或一微細金屬遮罩(fine metal mask)。舉例而言，遮罩12可能避免基板的一部分被塗佈和/或遮罩可能具有一開口圖案對應於欲沉積在基板上的一材料圖案。 The first transmission path T1 and the second transmission path T2 horizontally offset from the first transmission path T1 extend through the vacuum chamber 101. Alternatively, a processing position T3 at which a substrate is processed may be provided, and the processing position T3 is horizontally offset from the first transmission path T1 and the second transmission path T2. In some embodiments, a mask 12 is provided between the processing position T3 of the carrier 10 and the processing tool 105. The mask 12 may be, for example, an edge exclusion mask or a fine metal mask. For example, the mask 12 may prevent a portion of the substrate from being coated and / or the mask may have an opening pattern corresponding to a material pattern to be deposited on the substrate.

設備100包括一用於沿著第一傳輸路徑T1非接觸式地傳輸載體10的第一傳輸系統112，一用於沿著第二傳輸路徑T2非接觸式地傳輸載體10的第二傳輸系統114，以及一配置成傳送載體10從第一傳輸路徑T1到第二傳輸路徑T2和/或處理位置T3於路徑轉換方向S上的路徑轉換組件150。路徑轉換組件150可能包括一載體固持部分152，載體固持部分152係配置成固持和/或支撐可移動於路徑轉換方向S上的載體10。 The device 100 comprises a first transport system 112 for contactlessly transporting the carrier 10 along a first transport path T1, and a second transport system 114 for contactlessly transporting the carrier 10 along a second transport path T2 And a path switching component 150 configured to transfer the carrier 10 from the first transmission path T1 to the second transmission path T2 and / or the processing position T3 in the path switching direction S. The path switching component 150 may include a carrier holding portion 152 configured to hold and / or support the carrier 10 movable in the path switching direction S.

第一傳輸系統112可能包括一下軌道區段121(如第2圖指示的虛線)，以及一致動器，致動器係配置成移動下軌道區段121於一垂直方向上。下軌道區段121於傳輸方向T上的長度可能等於或大於載體10於傳輸方向T上的長度。可能提供下軌道區段121沿著路徑轉換組件150被安排於第一傳輸路徑的一區段。因此，下軌道區段121可以 於一向下方向上移動，用於使路徑轉換組件傳送載體10遠離第一傳輸路徑T1於路徑轉換方向S上。 The first transmission system 112 may include a lower track section 121 (as indicated by the dashed line in FIG. 2), and an actuator. The actuator is configured to move the lower track section 121 in a vertical direction. The length of the lower track section 121 in the transmission direction T may be equal to or greater than the length of the carrier 10 in the transmission direction T. It is possible to provide a lower track section 121 arranged along a path conversion assembly 150 in a section of the first transmission path. Therefore, the lower track section 121 can Moving in a downward direction, used to move the path switching component transport carrier 10 away from the first transmission path T1 in the path switching direction S.

在一些實施例中，第二傳輸系統114可能包括一第二下軌道區段123(如第2圖指示的虛線)，以及一致動器，致動器係配置成移動第二下軌道區段123於一垂直方向上。第二下軌道區段123於傳輸方向T上的長度可能等於或大於載體10於傳輸方向T上的長度。可能提供第二下軌道區段123沿著路徑轉換組件150被安排於第二傳輸路徑的一區段。因此，第二下軌道區段123可以於一向下方向上移動，用於使路徑轉換組件傳送載體10遠離第二傳輸路徑T2於路徑轉換方向S上。 In some embodiments, the second transmission system 114 may include a second lower track section 123 (as indicated by the dashed line in FIG. 2), and an actuator configured to move the second lower track section 123. In a vertical direction. The length of the second lower track section 123 in the transmission direction T may be equal to or greater than the length of the carrier 10 in the transmission direction T. It is possible to provide a second lower track section 123 arranged along a path conversion assembly 150 on a section of the second transmission path. Therefore, the second lower track section 123 can be moved in a downward direction for moving the path switching component transport carrier 10 away from the second transmission path T2 in the path switching direction S.

第3A-H圖示出根據在此敘述的實施例的藉由設備300用於傳輸一載體的一方法的各種階段。設備300可能相似於如第1A圖和第1B圖所繪示的設備100，如此一來可樹立一以上實施例之參考，此處不再重複描述以上實施例。 3A-H illustrate various stages of a method for transmitting a carrier by the device 300 according to the embodiments described herein. The device 300 may be similar to the device 100 as shown in FIG. 1A and FIG. 1B. In this way, reference for more than one embodiment can be established, and the above embodiment will not be described repeatedly here.

設備300包括一第一傳輸系統112以及一第二傳輸系統114，第一傳輸系統112係配置成沿著第一傳輸路徑T1的一載體的一非接觸式傳輸，第二傳輸系統114係配置成沿著水平偏移從第一傳輸路徑T1的第二傳輸路徑T2的一載體的一非接觸式傳輸。 The device 300 includes a first transmission system 112 and a second transmission system 114. The first transmission system 112 is configured as a non-contact transmission along a carrier of the first transmission path T1, and the second transmission system 114 is configured as A non-contact transmission of a carrier along a horizontal offset from a second transmission path T2 of a first transmission path T1.

此外，可能提供路徑轉換組件150，用於傳送載體10從第一傳輸路徑T1到第二傳輸路徑T2和/或處理位置T3。處理位置T3在第3E圖中僅是敘述之用，且是可選擇的。換言之，可以從第一傳輸路徑於路徑轉換方向上直接傳送載體到第二傳輸路徑，來代替從第一傳輸路徑T1傳送載體到處理位置T3然後再傳送到第二傳輸路徑T2。或 者，，可以可能被從如第3E圖所繪示的處理位置T3傳送載體回到第一傳輸路徑T1，而非傳送載體到第二傳輸路徑T2。 In addition, a path switching component 150 may be provided for transferring the carrier 10 from the first transmission path T1 to the second transmission path T2 and / or the processing position T3. The processing position T3 in FIG. 3E is only for narrative purpose and is optional. In other words, instead of transferring the carrier from the first transmission path T1 to the processing position T3 and then to the second transmission path T2, the carrier can be directly transferred from the first transmission path in the path switching direction. or Alternatively, it may be possible to transfer the carrier from the processing position T3 as shown in FIG. 3E back to the first transmission path T1 instead of transmitting the carrier to the second transmission path T2.

路徑轉換組件150可能包括一載體固持部分152，載體固持部分152係配置成固持和/或支撐載體，其中載體固持部分152與載體可能可移動於路徑轉換方向S上。路徑轉換組件係配置成於路徑轉換方向S上移動載體。 The path conversion component 150 may include a carrier holding portion 152 configured to hold and / or support the carrier, wherein the carrier holding portion 152 and the carrier may be movable in the path switching direction S. The path switching component is configured to move the carrier in the path switching direction S.

第一傳輸系統112包括一下軌道區段121，和/或第二傳輸系統114可能包括一第二下軌道區段123，下軌道區段121係可移動於一垂直方向V上的，第二下軌道區段123係可移動於垂直方向V上的。下軌道區段121和第二下軌道區段123可能被相鄰地設置和彼此間相互平行，使得一載體可以於路徑轉換方向S上於下軌道區段121和第二下軌道區段123之間傳送，特別是不改變載體10的方向(orientation)進行傳送。換言之，在路徑轉換的期間，載體可能維持一實質上與傳輸方向T對準的垂直方向。 The first transmission system 112 includes a lower track section 121, and / or the second transmission system 114 may include a second lower track section 123. The lower track section 121 is movable in a vertical direction V, and the second lower track section 121 is movable. The track section 123 is movable in the vertical direction V. The lower track section 121 and the second lower track section 123 may be arranged adjacent to each other and parallel to each other, so that a carrier can be positioned between the lower track section 121 and the second lower track section 123 in the path switching direction S. Between transmissions, in particular, without changing the orientation of the carrier 10. In other words, during the path change, the carrier may maintain a vertical direction substantially aligned with the transmission direction T.

於第3A圖中，一載體係藉由第一傳輸系統112沿著於傳輸方向T上的第一傳輸路徑T1傳送。傳送可能為一非接觸式傳送。換言之，載體10可能藉由磁力被固持於下軌道區段121之上的一距離(例如大約2毫米的一距離)，磁力例如作用於之下的排斥磁力和/或作用於之上的吸引磁力。於第3A圖中，一傳輸位置(I)示出配置用於沿著第一傳輸路徑T1的非接觸式傳送，其中一第一距離提供於第一傳輸系統112的下軌道區段121和上軌道區段122之間。 In FIG. 3A, a carrier is transmitted by a first transmission system 112 along a first transmission path T1 in a transmission direction T. The transmission may be a contactless transmission. In other words, the carrier 10 may be held at a distance (for example, a distance of about 2 millimeters) above the lower track section 121 by a magnetic force, such as a repulsive magnetic force acting below and / or an attractive magnetic force acting above. . In FIG. 3A, a transmission position (I) shows a contactless transmission configured along a first transmission path T1, wherein a first distance is provided in the lower track section 121 and the upper track of the first transmission system 112 Between sections 122.

載體10係沿著如第3A圖所繪示的第一傳輸路徑T1而傳送到一位置，安排路徑轉換組件150於第一傳輸路徑T1。 The carrier 10 is transferred to a position along the first transmission path T1 as shown in FIG. 3A, and the path conversion component 150 is arranged on the first transmission path T1.

在一些可能結合其他實施例的實施例中，路徑轉換組件150包括一上固持裝置154，上固持裝置154係配置成固持和/或穩定載體10的一上部分。上固持裝置154可能可移動於路徑轉換方向S上。上固持裝置154可能選擇性同時可移動於一垂直方向V上。當磁性懸浮系統關閉時，上固持裝置154可能配置成避免載體傾斜的移動。 In some embodiments, which may be combined with other embodiments, the path conversion assembly 150 includes an upper holding device 154 configured to hold and / or stabilize an upper portion of the carrier 10. The upper holding device 154 may be movable in the path switching direction S. The upper holding device 154 may be selectively movable in a vertical direction V at the same time. When the magnetic levitation system is closed, the upper holding device 154 may be configured to prevent tilted movement of the carrier.

在一些實施例中，上固持裝置154可能配置成接觸式載體10的一上端部和/或可能被移動於垂直方向V上以接觸載體10的上端部。舉例而言，上固持裝置154可能包括複數指狀物或其他固持裝置，當第一傳輸系統112提供的磁性懸浮關閉時，複數指狀物或其他固持裝置係配置成從載體上方接觸和夾持載體。舉例而言，於路徑轉換方向S上的側向穩定可能由上固持裝置154所提供。如第3B圖所繪示，上固持裝置154提供於路徑轉換方向上載體的側向穩定和避免傾斜的移動。 In some embodiments, the upper holding device 154 may be configured to contact an upper end portion of the carrier 10 and / or may be moved in the vertical direction V to contact the upper end portion of the carrier 10. For example, the upper holding device 154 may include a plurality of fingers or other holding devices. When the magnetic suspension provided by the first transmission system 112 is closed, the plurality of fingers or other holding devices are configured to contact and hold from above the carrier Carrier. For example, lateral stability in the path switching direction S may be provided by the upper holding device 154. As shown in FIG. 3B, the upper holding device 154 provides lateral stability of the carrier in the path switching direction and avoids tilting movement.

在一些實施例中，可能減少或關閉第一傳輸系統112的磁性懸浮力，使得載體10形成與下軌道區段121機械接觸和由下軌道區段121所支撐。舉例而言，藉由逐漸減少第一磁性懸浮系統的磁性懸浮力，載體可以平順地置於下軌道區段121上。 In some embodiments, the magnetic levitation force of the first transmission system 112 may be reduced or closed, so that the carrier 10 is brought into mechanical contact with and supported by the lower track section 121. For example, by gradually reducing the magnetic levitation force of the first magnetic levitation system, the carrier can be smoothly placed on the lower track section 121.

為了要將載體置於下軌道區段121上，由第一傳輸系統112提供的磁性懸浮力的衰減係更詳細繪示於第4A圖與第4B圖。於第4A圖中，藉由第一傳輸系統112，載體係非接觸式地被固持於下軌道區段121的一距離。舉例而言，被安排於上軌道區段122的活性磁性單 元301可能非接觸式地固持載體10於下軌道區段121之上的一距離。於第4B圖中，藉由上固持裝置154穩定載體的一上部分係，以及減少或關閉磁性懸浮力，用以將載體置於下軌道區段121的一基板支撐表面。下軌道區段121可能之後下降。 In order to place the carrier on the lower track section 121, the attenuation system of the magnetic levitation force provided by the first transmission system 112 is shown in more detail in FIGS. 4A and 4B. In FIG. 4A, by the first transmission system 112, the carrier is non-contactly held at a distance from the lower track section 121. For example, an active magnetic sheet arranged in the upper track section 122 The element 301 may hold the carrier 10 at a distance above the lower track section 121 in a non-contact manner. In FIG. 4B, an upper part of the carrier is stabilized by the upper holding device 154, and the magnetic levitation force is reduced or closed to place the carrier on a substrate supporting surface of the lower track section 121. The lower track section 121 may later descend.

根據本揭露的可能達成物件的一獨立項的一其他方面，致動器125係配置成用於降低下軌道區段121和所支撐的載體10，用於將載體置於路徑轉換組件的載體固持部分152上。 According to another aspect of this disclosure that may achieve a separate item of the object, the actuator 125 is configured to lower the lower track section 121 and the supported carrier 10, and is used to place the carrier in the carrier holding of the path conversion assembly. On section 152.

回到第3B圖，致動器可能係配置成於一向下方向上移動下軌道區段121遠離上軌道區段122，使得下軌道區段121和上軌道區段122之間的距離增加。下軌道區段121所支撐於之上的載體10降低到載體固持部分152，直到載體被置於載體固持部分152之上。舉例而言，下軌道區段121可能係被降低從一第一準位L1降到載體固持部分152的準位之20毫米或更多的一距離，特別是40毫米或更多。 Returning to FIG. 3B, the actuator may be configured to move the lower rail section 121 away from the upper rail section 122 in a downward direction, so that the distance between the lower rail section 121 and the upper rail section 122 increases. The carrier 10 on which the lower rail section 121 is supported is lowered to the carrier holding portion 152 until the carrier is placed on the carrier holding portion 152. For example, the lower track section 121 may be lowered by a distance of 20 mm or more, particularly 40 mm or more, from a first level L1 to a level of the carrier holding portion 152.

如第3B圖和第3C圖所繪示，路徑轉換組件150的下軌道區段121和載體固持部分152可能配置成從下方支撐載體10。換言之，載體10的底表面可能首先被置於下軌道區段121之上(第3B圖)和之後被置於載體固持部分152之上(第3C圖)。 As shown in FIGS. 3B and 3C, the lower track section 121 and the carrier holding portion 152 of the path conversion assembly 150 may be configured to support the carrier 10 from below. In other words, the bottom surface of the carrier 10 may be placed first on the lower track section 121 (FIG. 3B) and then on the carrier holding portion 152 (FIG. 3C).

更如第3B圖所繪示，下軌道區段121和所支撐於之上的載體可能被移動於向下方向，而使載體遠離上軌道區段122，直到載體10置於載體固持部分152上。下軌道區段可能持續向下移動直到下軌道區段121置於第二準位L2，例如如第3C圖所繪示的於載體固持部分152的準位之下。第一準位L1和第二準位L2之間的距離可能為40毫米或更 多，特別是80毫米或更多。因此，第一距離(例如於傳輸位置(I)上於下軌道區段121和上軌道區段122之間的距離和第二距離(例如於路徑轉換位置(II)上於下軌道區段121和上軌道區段122之間的距離)之間的差異可能為40毫米或更多，特別是80毫米或更多。 As shown in FIG. 3B, the lower track section 121 and the carrier supported thereon may be moved in a downward direction, and the carrier is moved away from the upper track section 122 until the carrier 10 is placed on the carrier holding portion 152. The lower track section may continue to move downward until the lower track section 121 is positioned at a second level L2, for example, below the level of the carrier holding portion 152 as shown in FIG. 3C. The distance between the first level L1 and the second level L2 may be 40 mm or more More, especially 80 mm or more. Therefore, the first distance (e.g., the distance between the lower track section 121 and the upper track section 122 at the transmission position (I) and the second distance (e.g., the lower track section 121 and the path transition position (II) The difference between the distance between the upper track segments 122) may be 40 mm or more, especially 80 mm or more.

根據一些可以與在此敘述的其他實施例結合的實施例，第一傳輸系統112為一磁性懸浮系統，磁性懸浮系統係配置成非接觸式地固持載體從傳輸位置(I)上的下軌道區段121之上，特別是藉由磁力作用於載體上。此外，下軌道區段121可能包括一載體支撐件，用於從下方機械式地支撐載體。特別是，在非接觸式傳送的期間，載體可能從下軌道區段之上懸浮，以及在路徑轉換的期間，載體可能接觸下軌道區段和被支撐於下軌道區段上。 According to some embodiments that can be combined with other embodiments described herein, the first transfer system 112 is a magnetic levitation system configured to contactlessly hold the carrier from the lower track area on the transfer position (I) Above the segment 121, in particular, a magnetic force acts on the carrier. In addition, the lower rail section 121 may include a carrier support for mechanically supporting the carrier from below. In particular, the carrier may levitate from above the lower track section during non-contact transfer, and the carrier may contact and be supported on the lower track section during path switching.

由於支撐在下軌道區段121上載體10的向下移動，載體10和上軌道區段122之間的一距離可以增加。由於藉由載體固持部分152之相對於所支撐的載體10的下軌道區段121的向下移動，增加載體10和下軌道區段121之間的一距離。因為可以增加在路徑轉換的期間載體10之上與之下的自由空間，因此，可以更容易轉換移動載體於路徑轉換方向S上。 Due to the downward movement of the carrier 10 supported on the lower track section 121, a distance between the carrier 10 and the upper track section 122 can be increased. Due to the downward movement of the carrier holding portion 152 relative to the lower track section 121 of the supported carrier 10, a distance between the carrier 10 and the lower track section 121 is increased. Since the free space above and below the carrier 10 during the path switching can be increased, it is easier to switch the moving carrier in the path switching direction S.

如第3D圖和第3E圖所繪示的，載體固持部分152和支撐於之上的載體10可能被移動於路徑轉換方向S上，而使載體10從第一傳輸路徑T1到第二傳輸路徑T2(第3D圖)和/或到處理位置(第3E圖)，於處理位置上基板可以藉由處理工具105進行處理。 As shown in FIGS. 3D and 3E, the carrier holding portion 152 and the carrier 10 supported thereon may be moved in the path switching direction S, so that the carrier 10 moves from the first transmission path T1 to the second transmission path. T2 (Figure 3D) and / or to the processing position (Figure 3E), at which the substrate can be processed by the processing tool 105.

在一些可以與在此敘述的其他實施例結合的實施例中，載體10係傳送到第二傳輸路徑T2。在一些實施例中，提供於沿著第二傳輸路徑T2的第二傳輸系統114可能包括一第二下軌道區段123，下軌道區段123係可移動於一垂直方向上。 In some embodiments that can be combined with other embodiments described herein, the carrier 10 is transmitted to the second transmission path T2. In some embodiments, the second transmission system 114 provided along the second transmission path T2 may include a second lower track section 123, and the lower track section 123 is movable in a vertical direction.

如第3F圖所繪示的，第二下軌道區段123可能被移動從一路徑轉換位置於一向上方向上，直到載體形成與第二下軌道區段123接觸和藉由第二下軌道區段123從載體固持部分152被舉升。舉例而言，第二下軌道區段123可能被移動於向上方向上，從一第二準位L2到一第一準位L1，第二準位L2係於載體固持部分152的準位之下，第一準位L1係於載體固持部分152的準位之上。 As shown in FIG. 3F, the second lower track section 123 may be moved from a path to a position in an upward direction until the carrier comes into contact with the second lower track section 123 and passes through the second lower track section. The segment 123 is lifted from the carrier holding portion 152. For example, the second lower track section 123 may be moved in an upward direction, from a second level L2 to a first level L1, and the second level L2 is below the level of the carrier holding portion 152 The first level L1 is above the level of the carrier holding portion 152.

藉由移動第二下軌道區段123於向上方向上，如第3G圖所繪示的，可以減少第二傳輸系統114的第二下軌道區段123和一第二上軌道區段124之間的一距離，直到達到傳輸位置(I)。傳輸位置(I)係繪示於第3H圖中。 By moving the second lower track section 123 in the upward direction, as shown in FIG. 3G, the number of times between the second lower track section 123 of the second transmission system 114 and a second upper track section 124 can be reduced. A distance until reaching the transmission position (I). The transmission position (I) is shown in Figure 3H.

於第3H圖所繪示的傳輸位置(I)中，第二傳輸系統114的磁性懸浮可以被開啟，用於非接觸式地固持載體於第二下軌道區段123和第二上軌道區段124之間。而後，載體可以沿著第二傳輸路徑T2傳送，例如於傳輸方向T上。 In the transfer position (I) shown in FIG. 3H, the magnetic suspension of the second transfer system 114 can be turned on for non-contactly holding the carrier in the second lower track section 123 and the second upper track section 124 between. Then, the carrier can be transmitted along the second transmission path T2, for example, in the transmission direction T.

路徑轉換組件150的載體固持部分152可以移動於路徑轉換方向S上而回到第一傳輸路徑T1，一第二載體可能執行路徑轉換於路徑轉換方向S上。 The carrier holding portion 152 of the path switching component 150 can move in the path switching direction S and return to the first transmission path T1. A second carrier may perform path switching in the path switching direction S.

第5A-D圖示出根據在此敘述的實施例的傳輸一載體和一設備400的一方法的各種階段。設備400可能相似於如第3A-H圖所繪示的設備300，如此一來可樹立一以上實施例之參考，此處不再重複描述以上實施例。 5A-D illustrate various stages of a method of transporting a carrier and a device 400 according to the embodiments described herein. The device 400 may be similar to the device 300 as shown in FIGS. 3A-H. In this way, a reference for more than one embodiment can be established, and the above embodiment will not be described repeatedly here.

第4A圖的設備400包括一路徑轉換組件150，路徑轉換組件150係配置成傳送載體從第一傳輸路徑T1到第二傳輸路徑T2和/或到處理位置T3，而同時維持一載體10的實質上恆定方向。 The device 400 in FIG. 4A includes a path conversion component 150 configured to transfer a carrier from a first transmission path T1 to a second transmission path T2 and / or to a processing position T3 while maintaining the essence of a carrier 10 Up constant direction.

路徑轉換組件150可能包括一可移動於路徑轉換方向S上的載體固持部分152和一可移動於路徑轉換方向S上的上固持裝置154。 The path conversion component 150 may include a carrier holding portion 152 that is movable in the path switching direction S and an upper holding device 154 that is movable in the path switching direction S.

在一些可以與在此敘述的其他實施例結合的實施例中，上固持裝置154係配置成固持和/或穩定載體10的一上部分，特別是當減少或關閉磁性懸浮系統的一磁性懸浮係。一「載體的上部分」可能被理解成一垂直方向的載體的一上方部分(upper part)，包括上部50%，特別是垂直方向的載體的上部20%。特別是上固持裝置可能穩定載體的上端。 In some embodiments that may be combined with other embodiments described herein, the upper holding device 154 is configured to hold and / or stabilize an upper portion of the carrier 10, particularly when a magnetic levitation system is reduced or closed. . An "upper part of a carrier" may be understood as an upper part of a carrier in a vertical direction, including an upper part of 50%, especially an upper part of a carrier in a vertical direction. In particular, the upper holding device may stabilize the upper end of the carrier.

上固持裝置154可能穩定載體於路徑轉換方向S上，例如藉由施予相對直接穩定力於載體相對的兩側。 The upper holding device 154 may stabilize the carrier in the path switching direction S, for example, by applying a relatively direct stabilization force on opposite sides of the carrier.

上固持裝置154可能包括至少一磁單元，用以於路徑轉換方向S上施加一排斥磁力於載體的上部分上。在一些可以與在此敘述的其他實施例結合的實施例中，上固持裝置154包括一第一磁單元302，用以從一第一側施加排斥磁力於載體的上部分上，一第二磁單元 304，用以從相對第一側的一第二側施加一排斥磁力於載體的上部分上。 The upper holding device 154 may include at least one magnetic unit for applying a repulsive magnetic force on the upper portion of the carrier in the path switching direction S. In some embodiments that can be combined with other embodiments described herein, the upper holding device 154 includes a first magnetic unit 302 for applying a repulsive magnetic force from a first side to the upper part of the carrier, and a second magnetic unit 304, for applying a repulsive magnetic force to the upper part of the carrier from a second side opposite to the first side.

磁性相對單元可能被固定於載體10的上區域，例如分別與第一磁單元301和第二磁單元304磁性接觸。特別是，上固持裝置154的第一磁單元302可能施加一排斥磁力於被固定於載體相對第一側的一第二側的一磁性相對單元上。可能非接觸式地穩定載體於第一磁單元302和第二磁單元304之間的一中心區域。 The magnetic opposing unit may be fixed to the upper region of the carrier 10, for example, magnetically contact the first magnetic unit 301 and the second magnetic unit 304, respectively. In particular, the first magnetic unit 302 of the upper holding device 154 may apply a repulsive magnetic force to a magnetic opposite unit that is fixed to a second side opposite to the first side of the carrier. It is possible to contactlessly stabilize a carrier in a central region between the first magnetic unit 302 and the second magnetic unit 304.

上固持裝置154可能係與載體固持部分一起和同步可移動於路徑轉換方向S上，例如用於傳送載體於軌道之間。 The upper holding device 154 may be movable in the path switching direction S together with the carrier holding part and synchronized, for example, for transferring the carrier between the tracks.

在一些實施例中，上固持裝置154可能包括一第一臂311和一第二臂312，其中第一臂311可能獨立於第二臂312而可移動於路徑轉換方向S上。舉例而言，一第一側向穩定單元例如第一磁單元302，可能被固定到第一臂311，以及一第二側向穩定單元例如第二磁單元304，可能被固定到第二臂312。為了要穩定載體於第一臂和第二臂之間，於關閉載體的磁性懸浮之前，第一臂311可能從第二側被移動而朝向載體。 In some embodiments, the upper holding device 154 may include a first arm 311 and a second arm 312, wherein the first arm 311 may be independent of the second arm 312 and movable in the path switching direction S. For example, a first lateral stabilization unit such as the first magnetic unit 302 may be fixed to the first arm 311, and a second lateral stabilization unit such as the second magnetic unit 304 may be fixed to the second arm 312 . In order to stabilize the carrier between the first arm and the second arm, the first arm 311 may be moved from the second side toward the carrier before the magnetic suspension of the carrier is turned off.

特別是，上固持裝置154可能可移動於路徑轉換方向S上，使得於載體的一路徑轉換的期間可以非接觸式地穩定載體的上區域。 In particular, the upper holding device 154 may be movable in the path switching direction S, so that the upper region of the carrier can be stabilized in a non-contact manner during a path switching of the carrier.

在一些實施例中，上固持裝置154係可移動於路徑轉換方向S上，但不是於垂直方向V上。在其他實施例中，上固持裝置154係可移動於路徑轉換方向S和垂直方向V上。 In some embodiments, the upper holding device 154 is movable in the path switching direction S, but not in the vertical direction V. In other embodiments, the upper holding device 154 is movable in the path switching direction S and the vertical direction V.

在一些可以與在此敘述的其他實施例結合的實施例中，於關於上固持裝置154的載體的一垂直移動的期間，上固持裝置154可能被配置成提供載體的側向穩定。舉例而言，上固持裝置154可能提供一第一垂直位置的載體的側向穩定，載體係被安排於相對於上固持裝置154的一第一垂直位置和上固持裝置154的一第二垂直位置。第一垂直位置和第二垂直位置可能垂直偏移於彼此間，例如30毫米或更多的一距離。特別是，不垂直移動上固持裝置，上固持裝置可能提供載體的側向穩定，提供載體到一第一垂直準位和一第二垂直準位。 In some embodiments that can be combined with other embodiments described herein, the upper holding device 154 may be configured to provide lateral stability of the carrier during a vertical movement of the carrier with respect to the upper holding device 154. For example, the upper holding device 154 may provide lateral stability of the carrier in a first vertical position, and the carrier is arranged in a first vertical position relative to the upper holding device 154 and a second vertical position in the upper holding device 154. . The first vertical position and the second vertical position may be vertically offset from each other, such as a distance of 30 mm or more. In particular, without vertically moving the upper holding device, the upper holding device may provide lateral stability of the carrier, providing the carrier to a first vertical level and a second vertical level.

在一些實施例中，上固持裝置154的至少一磁單元和/或載體10的至少一磁性相對單元可能有30毫米或更多的一垂直尺寸，特別是40毫米或更多，更特別的是50毫米或更多。因此，至少一磁單元可能磁性接觸至少一磁性相對單元，當磁性相對單元係垂直轉移於磁單元例如30毫米或更多的一距離。 In some embodiments, the at least one magnetic unit of the upper holding device 154 and / or the at least one magnetic opposite unit of the carrier 10 may have a vertical dimension of 30 mm or more, particularly 40 mm or more, and more particularly 50 mm or more. Therefore, at least one magnetic unit may magnetically contact at least one magnetic opposing unit when the magnetic opposing unit is vertically transferred to the magnetic unit by a distance of, for example, 30 mm or more.

於第5A圖中，安排一載體10於一垂直準位於一第一傳輸路徑T1上。被配置作為一第一磁性懸浮系統的第一傳輸系統112穩定載體於垂直方向和軌道轉換方向上。 In FIG. 5A, a carrier 10 is arranged on a first transmission path T1 in a vertical direction. The first transmission system 112 configured as a first magnetic levitation system stabilizes the carrier in the vertical direction and the track switching direction.

於第5B圖中，移動上固持裝置154從相對的兩側朝向載體於路徑轉換方向S上。載體可以於上固持裝置154的第一磁單元302和第二磁單元304之間被非接觸式地穩定。 In FIG. 5B, the moving upper holding device 154 faces the carrier from the opposite sides in the path switching direction S. The carrier can be stabilized in a non-contact manner between the first magnetic unit 302 and the second magnetic unit 304 of the upper holding device 154.

而後，可以關閉第一傳輸系統112的磁性懸浮。 Thereafter, the magnetic levitation of the first transmission system 112 can be turned off.

第5C圖中移動載體10於相對於上固持裝置的一向下方向上到一第二垂直準位，例如20毫米、40毫米或更多的一距離。舉例 而言，下軌道區段121和支撐於之上的載體可能於一向下方向上移動。配置上固持裝置154，使得載體在關於上固持裝置的載體垂直移動的期間而被穩定。舉例而言，第一磁單元302和第二磁單元304可能於垂直方向V上延伸超過30毫米或更多的一距離，特別是40毫米或更多。 In FIG. 5C, the moving carrier 10 is in a downward direction relative to the upper holding device to a second vertical level, such as a distance of 20 mm, 40 mm, or more. For example In other words, the lower track section 121 and the carrier supported thereon may move in a downward direction. The upper holding device 154 is configured so that the carrier is stabilized during the vertical movement of the carrier with respect to the carrier of the upper holding device. For example, the first magnetic unit 302 and the second magnetic unit 304 may extend a distance of more than 30 mm or more in the vertical direction V, especially 40 mm or more.

而後，載體10可以於路徑轉換方向S上移動，例如藉由移動載體固持部分152一起和實質上同步上固持裝置154於路徑轉換方向上。 Thereafter, the carrier 10 can be moved in the path switching direction S, for example, by moving the carrier holding portion 152 together with the substantially synchronously holding device 154 in the path switching direction.

當藉由第一和第二傳輸系統而固持和穩定載體，可以移動上固持裝置154遠離載體。 When the carrier is held and stabilized by the first and second transfer systems, the upper holding device 154 can be moved away from the carrier.

根據在此敘述的另一方面，繪示一用於一載體於一真空室的方法。 According to another aspect described herein, a method for a carrier in a vacuum chamber is illustrated.

第6圖係根據在此敘述的實施例的敘述的一第一方法的一流程圖。 FIG. 6 is a flowchart of a first method according to the embodiment described herein.

於方塊610中，一載體10係沿著於一傳輸方向T上的一第一傳輸路徑T1傳送。在傳送的期間，安排載體10於一第一傳輸系統112的下軌道區段121和一上軌道區段122之間的一載體傳送空間。載體可能於下軌道區段和上軌道區段之間的載體傳送空間非接觸式地傳送，例如藉由一磁性懸浮系統。 In block 610, a carrier 10 is transmitted along a first transmission path T1 in a transmission direction T. During the transfer, the carrier 10 is arranged in a carrier transfer space between a lower track section 121 and an upper track section 122 of a first transport system 112. The carrier may be transferred non-contact in the carrier transfer space between the lower track section and the upper track section, for example by a magnetic levitation system.

於方塊620中，增加下軌道區段121和上軌道區段122的一距離。舉例而言，向下移動下軌道區段，例如於一垂直方向上，遠離上軌道區段。或者或此外，向上移動上軌道區段，例如於一垂直方向上，遠離下軌道區段。可能提供一致動器用以降低下軌道區段。 In block 620, a distance between the lower track section 121 and the upper track section 122 is increased. For example, the lower track section is moved downward, for example, away from the upper track section in a vertical direction. Alternatively or in addition, the upper track section is moved upward, for example in a vertical direction, away from the lower track section. An actuator may be provided to lower the lower track section.

於方塊630中，載體係於橫於傳輸方向T的一路徑轉換方向S上，特別是到一第二傳輸路徑T2和/或到一處理位置T3，而使載體遠離第一傳輸路徑T1。特別是載體可能於路徑轉換方向S上移動。 In block 630, the carrier is in a path switching direction S that is transverse to the transmission direction T, particularly to a second transmission path T2 and / or to a processing position T3, so that the carrier is far from the first transmission path T1. In particular, the carrier may move in the path switching direction S.

當載體於路徑轉換方向S上移動，第二傳輸系統114的一第二下軌道區段123和一第二上軌道區段124之間的一距離可能被設為一大距離。這可能使載體得以進入第二傳輸路徑T2。 When the carrier moves in the path switching direction S, a distance between a second lower track section 123 and a second upper track section 124 of the second transmission system 114 may be set to a large distance. This may allow the carrier to enter the second transmission path T2.

當載體於路徑轉換方向S上移動，第二傳輸系統114的一第二下軌道區段123和一第二上軌道區段124之間的一距離可能被設為一大距離。這可能使載體得以進入第二傳輸路徑T2。 When the carrier moves in the path switching direction S, a distance between a second lower track section 123 and a second upper track section 124 of the second transmission system 114 may be set to a large distance. This may allow the carrier to enter the second transmission path T2.

可能提供一或更多其他傳輸階段於方塊610和620之間和/或於方塊620和630之間。例如第3A圖到第3H圖敘述的傳送方法之參考。此處不再重複描述以上實施例。 One or more other transmission stages may be provided between blocks 610 and 620 and / or between blocks 620 and 630. For example, reference is made to the transmission methods described in FIGS. 3A to 3H. The above embodiments are not repeatedly described here.

第7圖係繪示根據在此敘述的實施例的一用於傳輸一載體於一真空室中的第二方法的流程圖。 FIG. 7 is a flowchart illustrating a second method for transferring a carrier in a vacuum chamber according to the embodiment described herein.

於方塊710中，一載體沿著於一傳輸方向T上的一第一傳輸路徑T1非接觸地傳送，特別是藉由一第一磁性懸浮系統。 In block 710, a carrier is contactlessly transported along a first transmission path T1 in a transmission direction T, especially by a first magnetic levitation system.

而後，載體被移動到一第二傳輸路徑T2，第二傳輸路徑T2係水平偏移於第一傳輸路徑T1。 Then, the carrier is moved to a second transmission path T2, and the second transmission path T2 is horizontally offset from the first transmission path T1.

移動載體到第二傳輸路徑包括，於方塊720中降低載體於第一傳輸路徑T1上，於方塊730中移動載體於一路徑轉換方向S上到第二傳輸路徑T2上，以及於方塊740中舉升載體於第二傳輸路徑T2上。 Moving the carrier to the second transmission path includes lowering the carrier on the first transmission path T1 in block 720, moving the carrier in a path switching direction S to the second transmission path T2 in block 730, and lifting in block 740 The carrier is on the second transmission path T2.

於方塊720中，載體可能被置於一第一傳輸系統112的一下軌道區段121之上，特別是藉由減少或關閉由第一傳輸系統所提供的磁性懸浮力。 At block 720, the carrier may be placed on the lower track section 121 of a first transmission system 112, particularly by reducing or turning off the magnetic levitation force provided by the first transmission system.

下軌道區段121和支撐於之上的載體可能於一向下方向上移動。可能提供一致動器，用以移動下軌道區段121於垂直方向上，特別是遠離第一傳輸系統的一上軌道區段122。因此，可以藉由致動器而增加下軌道區段121和上軌道區段122之間的一距離。 The lower track section 121 and the carrier supported thereon may move in a downward direction. An actuator may be provided to move the lower track section 121 in a vertical direction, particularly an upper track section 122 away from the first transport system. Therefore, a distance between the lower track section 121 and the upper track section 122 can be increased by the actuator.

於方塊720中，載體可能被降低於一路徑轉換組件150的一載體固持部分152之上，路徑轉換組件150的載體固持部分152和所支撐的載體係於路徑轉換方向S上移動。一驅動裝置，特別是一交叉驅動，可能提供用以移動載體固持部分152於路徑轉換方向S上。 In block 720, the carrier may be lowered above a carrier holding portion 152 of a path conversion component 150, and the carrier holding portion 152 and the supported carrier of the path conversion component 150 move in the path conversion direction S. A drive device, particularly a cross drive, may be provided to move the carrier holding portion 152 in the path switching direction S.

於方塊750中，提供沿著第二傳輸路徑T2的一第二傳輸系統114的一第二下軌道區段123可能於一向上方向上移動。第二下軌道區段123可能於向上方向上移動，直到載體從載體固持部分152被提升和被安排於載體固持部分152之上的一預定的準位。特別是，第二下軌道區段123可能被移動前到第二傳輸系統的一第二上軌道區段。可以因此而減少第二下軌道區段和第二下軌道區段之間的距離。 In block 750, a second lower track section 123 of a second transmission system 114 provided along the second transmission path T2 may move in an upward direction. The second lower track section 123 may move in an upward direction until the carrier is lifted from the carrier holding portion 152 and arranged at a predetermined level above the carrier holding portion 152. In particular, the second lower track section 123 may be moved to a second upper track section of the second transmission system. The distance between the second lower track section and the second lower track section can thus be reduced.

而後，載體可以沿著第二傳輸路徑T2非接觸式地傳送。 The carrier can then be transferred non-contact along the second transmission path T2.

雖然上述內容是關於本揭露的實施例，但可在不背離本揭露的基本範圍的情況下，設計出本揭露其他和更進一步的實施例，本揭露的範圍係由下列的申請專利範圍決定。 Although the above contents are related to the embodiments of the disclosure, other and further embodiments of the disclosure can be designed without departing from the basic scope of the disclosure. The scope of the disclosure is determined by the scope of the following patent applications.

Claims (20)

一種用於一真空室(101)中傳輸一載體(10)的設備，包括：一第一傳輸系統(112)，提供於沿著一傳輸方向(T)上的一第一傳輸路徑(T1)，且包括一下軌道區段(121)和一上軌道區段(122)，其中該載體在沿著該第一傳輸路徑的傳輸期間，該載體被固持於該下軌道區段(121)和該上軌道區段(122)之間的一載體傳輸空間；一路徑轉換組件(150)，用以於一路徑轉換方向(S)上移動該載體，而使該載體遠離該第一傳輸路徑(T1)；以及一致動器(125)，用於調整該下軌道區段(121)和該上軌道區段(122)之間的一距離。A device for transferring a carrier (10) in a vacuum chamber (101), comprising: a first transfer system (112) provided on a first transfer path (T1) along a transfer direction (T) And includes a lower track section (121) and an upper track section (122), wherein the carrier is held by the lower track section (121) and the upper track during the transmission along the first transmission path. A carrier transmission space between the sections (122); a path switching component (150) for moving the carrier in a path switching direction (S), so that the carrier is far from the first transmission path (T1); And an actuator (125) for adjusting a distance between the lower track section (121) and the upper track section (122). 如申請專利範圍第1項所述之設備，其中該第一傳輸系統(112)係配置成用於非接觸式地傳送該載體於沿著該傳輸方向上的該第一傳輸路徑。The device according to item 1 of the patent application scope, wherein the first transmission system (112) is configured to contactlessly transport the carrier along the first transmission path along the transmission direction. 如申請專利範圍第1項所述之設備，其中該路徑轉換組件(150)包括一載體固持部分(152)，可於該路徑轉換方向(S)上移動，以在該路徑轉換方向(S)上傳送由該載體固持部分(152)所固持的該載體(10)。The device according to item 1 of the scope of patent application, wherein the path conversion component (150) includes a carrier holding portion (152) that can be moved in the path conversion direction (S) to be in the path conversion direction (S) The carrier (10) held by the carrier holding portion (152) is transferred up. 如申請專利範圍第3項所述之設備，其中該致動器(125)係配置成用於降低該下軌道區段(121)和該下軌道區段(121)所支撐的該載體(10)，用於將該載體置於該載體固持部分(152)上。The device according to item 3 of the patent application scope, wherein the actuator (125) is configured to lower the lower track section (121) and the carrier (10) supported by the lower track section (121) ) For placing the carrier on the carrier holding portion (152). 如申請專利範圍第1項所述之設備，更包括一第二傳輸系統(114)提供於沿著水平地偏移於該第一傳輸路徑(T1)的一第二傳輸路徑(T2)，該路徑轉換組件(150)的一載體固持部分(152)係可在該路徑轉換方向(S)上移動，自該第一傳輸路徑(T1)可移動至該第二傳輸路徑(T2)與一處理位置T3的至少其中之一，該處理位置T3係水平地偏移於該第一傳輸路徑和該第二傳輸路徑。The device according to item 1 of the scope of patent application, further comprising a second transmission system (114) provided along a second transmission path (T2) horizontally offset from the first transmission path (T1), the A carrier holding part (152) of the path conversion component (150) is movable in the path conversion direction (S), and from the first transmission path (T1) to the second transmission path (T2) and a process At least one of positions T3, the processing position T3 is horizontally offset from the first transmission path and the second transmission path. 如申請專利範圍第5項所述之設備，其中該第二傳輸系統(114)包括一第二下軌道區段(123)，該下軌道區段(123)係可移動於一垂直方向(V)上。The device according to item 5 of the patent application scope, wherein the second transmission system (114) includes a second lower track section (123), and the lower track section (123) is movable in a vertical direction (V )on. 如申請專利範圍第1項所述之設備，其中該致動器(125)係配置成用於移動該下軌道區段(121)於遠離該上軌道區段(122)的一向下方向上。The device according to item 1 of the patent application scope, wherein the actuator (125) is configured to move the lower track section (121) in a downward direction away from the upper track section (122). 如申請專利範圍第5項所述之設備，其中該致動器(125)係配置成用於移動該上軌道區段(122)於遠離該下軌道區段(121)的一向上方向上。The device according to item 5 of the patent application scope, wherein the actuator (125) is configured to move the upper track section (122) in an upward direction away from the lower track section (121). 如申請專利範圍第1項到第8項中任一項所述之設備，其中該第一傳輸系統(112)係為一第一磁性懸浮系統，該第一磁性懸浮系統係配置成用於非接觸式地固持該載體於該下軌道區段(121)上方呈一距離，該下軌道區段(121)更包括一載體支撐件，用於機械地支撐該載體於該載體支撐件上。The device according to any one of claims 1 to 8, wherein the first transmission system (112) is a first magnetic levitation system, and the first magnetic levitation system is configured for non- The carrier is held in contact with the carrier at a distance above the lower track section (121), and the lower track section (121) further includes a carrier support for mechanically supporting the carrier on the carrier support. 如申請專利範圍第1項到第8項中任一項所述之設備，其中該路徑轉換組件(150)包括一上固持裝置(154)，該上固持裝置(154)係配置成由固持和穩定該載體(10)的一上部分所組成的群組的至少其中之一，該上固持裝置(154)係可移動至少於該路徑轉換方向(S)上。The device according to any one of claims 1 to 8 in the scope of patent application, wherein the path conversion assembly (150) includes an upper holding device (154) configured to be held by the holding and At least one of a group consisting of an upper part of the carrier (10) is stabilized, and the upper holding device (154) is movable at least in the path switching direction (S). 如申請專利範圍第10項所述之設備，其中該上固持裝置(154)包括一第一磁單元(302)和一第二磁單元(304)，該第一磁單元(302)係用於從一第一側以施加排斥磁力於該載體(10)的該上部分上，該第二磁單元(304)係用於從與該第一側相對的一第二側以施加一排斥磁力於該載體(10)的該上部分上。The device according to item 10 of the scope of patent application, wherein the upper holding device (154) includes a first magnetic unit (302) and a second magnetic unit (304), and the first magnetic unit (302) is used for A repulsive magnetic force is applied to the upper part of the carrier (10) from a first side, and the second magnetic unit (304) is used to apply a repulsive magnetic force from a second side opposite to the first side. On the upper part of the carrier (10). 如申請專利範圍第1項到第8項中任一項所述之設備，其中該下軌道區段(121)和該路徑轉換組件(150)的該載體固持部分(152)係配置成從該載體下方支撐該載體(10)。The device according to any one of claims 1 to 8, wherein the lower track section (121) and the carrier holding portion (152) of the path conversion assembly (150) are configured to be separated from the The carrier (10) is supported under the carrier. 一種用於一基板的真空處理的系統，包括：一真空室(101)；如申請專利範圍第1項到第12項之任一項所述之該設備(100)；以及一或多個處理工具(105)，被安排於該真空室(101)中，該真空室(101)係選自由沉積源、濺鍍源、蒸鍍源、表面處理工具、加熱裝置、清潔裝置、蝕刻工具以及前述之組合所組成的群組。A system for vacuum processing a substrate, comprising: a vacuum chamber (101); the device (100) as described in any one of patent application scope items 1 to 12; and one or more processes A tool (105) is arranged in the vacuum chamber (101). The vacuum chamber (101) is selected from the group consisting of a deposition source, a sputtering source, an evaporation source, a surface treatment tool, a heating device, a cleaning device, an etching tool, and the foregoing. A group of combinations. 一種用於傳輸一載體於一真空室中的方法，包括：在一第一傳輸系統(112)的一下軌道區段(121)和一上軌道區段(122)之間，於一傳輸方向(T)上沿著該第一傳輸路徑(T1)傳輸一載體；增加該下軌道區段(121)和一上軌道區段(122)之間的一距離；以及移動該載體於橫向於該傳輸方向(T)的一路徑轉換方向(S)上，而使該載體遠離該第一傳輸路徑(T1)。A method for transporting a carrier in a vacuum chamber, comprising: between a lower track section (121) and an upper track section (122) of a first transport system (112) in a transport direction (T ) On a carrier along the first transmission path (T1); increasing a distance between the lower track section (121) and an upper track section (122); and moving the carrier transversely to the transmission direction ( T) in a path switching direction (S), so that the carrier is far from the first transmission path (T1). 如申請專利範圍第14項所述之方法，其中該載體(10)係被非接觸式地沿著該傳輸方向(T)上的該第一傳輸路徑(T1)傳輸，且於該第一傳輸系統(112)的該下軌道區段(121)和該上軌道區段(122)之間傳輸。The method according to item 14 of the scope of patent application, wherein the carrier (10) is non-contactly transmitted along the first transmission path (T1) in the transmission direction (T), and is transmitted on the first transmission Transmission between the lower track section (121) and the upper track section (122) of the system (112). 一種用於一真空室中一載體的傳輸方法，包括：沿著於一傳輸方向(T)上的一第一傳輸路徑(T1)傳送一載體(10)；以及移動該載體到水平偏移於該第一傳輸路徑(T1)的一第二傳輸路徑(T2)，包括降低該載體、移動該載體於一路徑轉換方向(S)上，以及舉升該載體。A transport method for a carrier in a vacuum chamber, comprising: transporting a carrier (10) along a first transport path (T1) in a transport direction (T); and moving the carrier to a horizontal offset from A second transmission path (T2) of the first transmission path (T1) includes lowering the carrier, moving the carrier in a path switching direction (S), and lifting the carrier. 如申請專利範圍第16項所述之方法，其中該載體(10)係被非接觸式地沿著該傳輸方向(T)上的該第一傳輸路徑(T1)傳送。The method according to item 16 of the application, wherein the carrier (10) is non-contactly transmitted along the first transmission path (T1) in the transmission direction (T). 如申請專利範圍第16項所述之方法，其中降低該載體(10)包括：將該載體置於一第一傳輸系統(112)的一下軌道區段(121)上，該下軌道區段(121)係被提供於沿著該第一傳輸路徑(T1)；以及移動該下軌道區段(121)於一向下方向。The method according to item 16 of the patent application scope, wherein lowering the carrier (10) comprises: placing the carrier on a lower track section (121) of a first transport system (112), the lower track section ( 121) is provided along the first transmission path (T1); and the lower track section (121) is moved in a downward direction. 如申請專利範圍第16項到第18項任一所述之方法，其中該載體係降低到一路徑轉換組件(150)的一載體固持部分(152)上，該路徑轉換組件(150)的該載體固持部分(152)係於該路徑轉換方向(S)上移動所支撐的該載體。The method according to any one of claims 16 to 18 in the scope of patent application, wherein the carrier is lowered to a carrier holding part (152) of a path conversion component (150), and the path conversion component (150) The carrier holding portion (152) is the carrier supported by the path moving direction (S). 如申請專利範圍第19項所述之方法，其中舉升該載體包括：一第二傳輸系統(114)的一第二下軌道區段(123)係沿著該第二傳輸路徑(T2)提供，移動該第二傳輸系統(114)的該第二下軌道區段(123)於一向上方向，直到該載體自該載體固持部分(152)被舉升以及被安排於該載體固持部分(152)之上的一預定準位。The method as described in claim 19, wherein lifting the carrier comprises: a second lower track section (123) of a second transmission system (114) provided along the second transmission path (T2) , Moving the second lower track section (123) of the second transmission system (114) in an upward direction until the carrier is lifted from the carrier holding portion (152) and arranged at the carrier holding portion (152) ) Above a predetermined level.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110299961A1 (en) * 2008-06-27 2011-12-08 Applied Materials Inc. Processing system and method of operating a processing system
US20150170947A1 (en) * 2012-04-26 2015-06-18 Intevac, Inc. System and method for bi-facial processing of substrates
US20170244070A1 (en) * 2014-02-04 2017-08-24 Applied Materials, Inc. System for depositing one or more layers on a substrate supported by a carrier and method using the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4711770B2 (en) * 2005-08-01 2011-06-29 株式会社アルバック Conveying apparatus, vacuum processing apparatus, and conveying method
EP1973154B1 (en) * 2007-03-13 2012-04-25 Applied Materials, Inc. Device for moving a carrier in a vacuum chamber
JP5059583B2 (en) * 2007-12-26 2012-10-24 東京エレクトロン株式会社 Vacuum device, vacuum processing system, and vacuum chamber pressure control method
KR101243743B1 (en) * 2010-02-18 2013-03-13 주식회사 아바코 Substrate transferring apparatus, substrate processing apparatus with it and substrate processing method using it
KR102192244B1 (en) * 2013-12-30 2020-12-17 삼성디스플레이 주식회사 Apparatus for transferring substrate
WO2017125123A1 (en) * 2016-01-18 2017-07-27 Applied Materials, Inc. Apparatus for transportation of a substrate carrier in a vacuum chamber, system for vacuum processing of a substrate, and method for transportation of a substrate carrier in a vacuum chamber

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110299961A1 (en) * 2008-06-27 2011-12-08 Applied Materials Inc. Processing system and method of operating a processing system
US20150170947A1 (en) * 2012-04-26 2015-06-18 Intevac, Inc. System and method for bi-facial processing of substrates
US20170244070A1 (en) * 2014-02-04 2017-08-24 Applied Materials, Inc. System for depositing one or more layers on a substrate supported by a carrier and method using the same

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