TWI674046B - 基板裂斷裝置 - Google Patents

基板裂斷裝置 Download PDF

Info

Publication number
TWI674046B
TWI674046B TW104111210A TW104111210A TWI674046B TW I674046 B TWI674046 B TW I674046B TW 104111210 A TW104111210 A TW 104111210A TW 104111210 A TW104111210 A TW 104111210A TW I674046 B TWI674046 B TW I674046B
Authority
TW
Taiwan
Prior art keywords
substrate
air bearing
unit
breaking
present
Prior art date
Application number
TW104111210A
Other languages
English (en)
Chinese (zh)
Other versions
TW201608945A (zh
Inventor
朱阮鏞
張成雲
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201608945A publication Critical patent/TW201608945A/zh
Application granted granted Critical
Publication of TWI674046B publication Critical patent/TWI674046B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW104111210A 2014-08-21 2015-04-08 基板裂斷裝置 TWI674046B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0108865 2014-08-21
KR1020140108865A KR101659454B1 (ko) 2014-08-21 2014-08-21 기판 브레이크 장치

Publications (2)

Publication Number Publication Date
TW201608945A TW201608945A (zh) 2016-03-01
TWI674046B true TWI674046B (zh) 2019-10-01

Family

ID=55416044

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104111210A TWI674046B (zh) 2014-08-21 2015-04-08 基板裂斷裝置

Country Status (4)

Country Link
JP (2) JP6520341B2 (ko)
KR (1) KR101659454B1 (ko)
CN (1) CN105382944B (ko)
TW (1) TWI674046B (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003170417A (ja) * 2001-12-07 2003-06-17 Murata Mfg Co Ltd セラミックブロック体のカット方法およびカット装置
JP2005001264A (ja) * 2003-06-12 2005-01-06 Sharp Corp 分断装置および分断方法
TW201417156A (zh) * 2012-10-26 2014-05-01 Mitsuboshi Diamond Ind Co Ltd 脆性材料基板之分斷方法與分斷裝置
JP2014087937A (ja) * 2012-10-29 2014-05-15 Mitsuboshi Diamond Industrial Co Ltd 積層脆性材料基板のブレイク装置および積層脆性材料基板のブレイク方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57109918A (en) * 1980-12-26 1982-07-08 Toshiba Corp Cutting device of glass substrate
AT391858B (de) * 1988-04-25 1990-12-10 Lisec Peter Vorrichtung zum brechen von einseitig geritzten glastafeln
JP2766123B2 (ja) * 1992-05-27 1998-06-18 鹿児島日本電気株式会社 ガラス基板のプレス式切断方法
JP2001162615A (ja) * 1999-12-13 2001-06-19 Sumitomo Kinzoku Kozan Siporex Kk コーナーパネル用穿孔装置
WO2004096721A1 (ja) * 2003-04-28 2004-11-11 Mitsuboshi Diamond Industrial Co., Ltd. 脆性基板分断システムおよび脆性基板分断方法
JP4619024B2 (ja) * 2004-03-19 2011-01-26 芝浦メカトロニクス株式会社 脆性材料の割断加工システム及びその方法
KR20060006862A (ko) * 2006-01-05 2006-01-19 장형규 이동 통신 단말기를 이용한 복약 시간 고지 시스템 및 방법
KR100748305B1 (ko) * 2006-03-02 2007-08-09 삼성에스디아이 주식회사 절단된 기판의 이송방법
KR100786126B1 (ko) * 2007-08-14 2007-12-18 주식회사 아바코 비접촉 방식에 의한 피절단물의 평탄도를 유지하는스크라이브 헤드 장치 및 그 스크라이브 방법
KR100956355B1 (ko) * 2008-06-10 2010-05-07 세메스 주식회사 스크라이빙 장치
JP5256554B2 (ja) * 2008-07-18 2013-08-07 株式会社シライテック 液晶パネルの割断装置
JP5249979B2 (ja) * 2010-03-18 2013-07-31 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法およびこれに用いるレーザ加工装置
JP5182339B2 (ja) * 2010-08-31 2013-04-17 三星ダイヤモンド工業株式会社 基板ブレーク装置
JP5187366B2 (ja) * 2010-08-31 2013-04-24 三星ダイヤモンド工業株式会社 基板ブレーク装置
JP2014101244A (ja) * 2012-11-19 2014-06-05 Dainippon Printing Co Ltd ガラス基板切断装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003170417A (ja) * 2001-12-07 2003-06-17 Murata Mfg Co Ltd セラミックブロック体のカット方法およびカット装置
JP2005001264A (ja) * 2003-06-12 2005-01-06 Sharp Corp 分断装置および分断方法
TW201417156A (zh) * 2012-10-26 2014-05-01 Mitsuboshi Diamond Ind Co Ltd 脆性材料基板之分斷方法與分斷裝置
JP2014087937A (ja) * 2012-10-29 2014-05-15 Mitsuboshi Diamond Industrial Co Ltd 積層脆性材料基板のブレイク装置および積層脆性材料基板のブレイク方法

Also Published As

Publication number Publication date
JP2016043689A (ja) 2016-04-04
TW201608945A (zh) 2016-03-01
KR20160023076A (ko) 2016-03-03
JP2019081373A (ja) 2019-05-30
KR101659454B1 (ko) 2016-09-23
CN105382944A (zh) 2016-03-09
CN105382944B (zh) 2019-08-09
JP6520341B2 (ja) 2019-05-29

Similar Documents

Publication Publication Date Title
TWI429604B (zh) Method for breaking the brittle material substrate
TWI612016B (zh) 裂斷裝置
JP6716900B2 (ja) 分断装置
US20150279716A1 (en) Apparatus and method for detaching chip
TWI592378B (zh) Glass plate separation device
PH12018501980A1 (en) Chip packaging apparatus and method thereof
TW201608625A (zh) 基板裂斷裝置
KR20140011469A (ko) 취성 재료 기판의 브레이크 장치
KR101972480B1 (ko) 마이크로 소자를 타겟 오브젝트에 동시에 전사하는 장치
TWI674046B (zh) 基板裂斷裝置
TW201544470A (zh) 用於刻劃玻璃板的方法及系統
KR100956355B1 (ko) 스크라이빙 장치
KR101100350B1 (ko) 박판 소재 성형용 프레스 금형장치
JP2017013239A (ja) ブレイク装置及びブレイク方法
JP5523030B2 (ja) ブレイク装置
JP2013258294A (ja) 接続構造体の製造装置及びその製造方法
MX2017012205A (es) Metodo de fabricacion de un cabezal de impresion de chorro de tinta.
TW201805256A (zh) 玻璃基板不停止分斷裝置
KR100751235B1 (ko) 스크라이브 장치
JP2018001410A (ja) スチームブレイクユニット
TWI690499B (zh) 貼合基板之刻劃頭裝置
JP2017100925A (ja) 分断装置
JP2014101244A (ja) ガラス基板切断装置
TWI301476B (en) Scribing apparatus
JP2016087957A (ja) スチームブレイクユニット

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees