TWI671004B - Electromagnetic interference (emi) shielding film - Google Patents
Electromagnetic interference (emi) shielding film Download PDFInfo
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Abstract
一種電磁波屏蔽膜，係包括：導電膠層；第一金屬鍍覆層，係形成於該導電膠層上；第二金屬鍍覆層，係接觸形成於該第一金屬鍍覆層上，俾使該第一金屬鍍覆層位於該導電膠層與第二金屬鍍覆層之間；以及具色彩遮蔽性之絕緣層，係形成於該第二金屬鍍覆層上，俾使該第二金屬鍍覆層位於該第一金屬鍍覆層與具色彩遮蔽性之絕緣層之間，並令該導電膠層、第一金屬鍍覆層、第二金屬鍍覆層和具色彩遮蔽性之絕緣層的厚度總和為10至53微米(μm)，且該第一金屬鍍覆層和第二金屬鍍覆層之厚度總和為1至3μm。本發明係利用至少二層的金屬鍍覆層提升電磁波屏蔽性能，並進一步降低電磁波屏蔽膜之厚度。 An electromagnetic wave shielding film comprises: a conductive adhesive layer; a first metal plating layer is formed on the conductive adhesive layer; and a second metal plating layer is formed on the first metal plating layer by contact, so that The first metal plating layer is located between the conductive adhesive layer and the second metal plating layer; and a color shielding insulating layer is formed on the second metal plating layer, and the second metal plating is performed The coating layer is disposed between the first metal plating layer and the color shielding insulating layer, and the conductive adhesive layer, the first metal plating layer, the second metal plating layer and the color shielding insulating layer The sum of the thicknesses is 10 to 53 micrometers (μm), and the total thickness of the first metal plating layer and the second metal plating layer is 1 to 3 μm. The invention utilizes at least two layers of metal plating layers to enhance electromagnetic wave shielding performance and further reduce the thickness of the electromagnetic wave shielding film.
Description
本發明係有關於一種遮蔽電磁波之層結構，更詳而言之，係有關於一種用於軟性印刷電路板之電磁波屏蔽膜。 The present invention relates to a layer structure for shielding electromagnetic waves, and more particularly to an electromagnetic wave shielding film for a flexible printed circuit board.
由於電子產品朝向輕薄短小型、高功能化以及高速度化發展。因此，小型電子產品的配線材料大多採用設計自由度高、彎曲性良好的軟性印刷電路板(Flexible Printed Circuit，FPC)，並且在不斷向高功能化及高速度化發展的同時，制定了各種電磁波干擾(EMI)的對策。目前，市場上已推出適用於薄膜型FPC的遮罩膜，並廣泛應用在手機、數位照相機、數位攝影機等小型電子產品中。 As electronic products are becoming lighter, shorter, smaller, more functional, and more advanced. Therefore, most of the wiring materials for small-sized electronic products use flexible printed circuit (FPC) with high design freedom and good flexibility, and various electromagnetic waves have been developed while continuing to be highly functional and high-speed. Interference (EMI) countermeasures. At present, a mask film suitable for a film type FPC has been introduced on the market, and is widely used in small electronic products such as mobile phones, digital cameras, and digital cameras.
習知技術中，係採用塑膠材料作為電磁干擾之遮罩膜，其製造方法可為於塑膠材與導電膠之間摻雜導電性之纖維或金屬顆粒，以形成導電型塑膠材料，然而，塑膠材與導電性之纖維或金屬顆粒之膨脹係數、玻璃轉移溫度(Tg)等特性不同，易造成結合性不佳、導電性降低等問題。 In the prior art, a plastic material is used as a mask film for electromagnetic interference, and the manufacturing method thereof may be that a conductive fiber or a metal particle is doped between the plastic material and the conductive rubber to form a conductive plastic material, however, the plastic material The properties of the material and the conductive fiber or metal particle are different from those such as the expansion coefficient and the glass transition temperature (Tg), which may cause problems such as poor bonding and lower conductivity.
如第200495566號日本專利揭示之電磁波屏蔽材料，係由環氧樹脂之絕緣層結合導電黏著層，導電黏著層係由 熱硬化環氧樹脂、導電金屬粉、阻燃劑所組成。又，為達到軟性印刷電路板對於難燃性及電磁波屏蔽等特性之需求，於熱硬化環氧樹脂中加入阻燃劑。其雖可提高電磁波屏敝膜的阻燃性，然而，為達到較好的屏蔽能力，往往得填充更多的導電粉體，惟導電粉體含量越高，導電黏著層和與其接觸之層體之間的接著性相對越差。 The electromagnetic wave shielding material disclosed in Japanese Patent No. 200495566 is a conductive adhesive layer bonded by an insulating layer of an epoxy resin, and the conductive adhesive layer is composed of It consists of heat-hardened epoxy resin, conductive metal powder and flame retardant. Further, in order to meet the demand for characteristics such as flame retardancy and electromagnetic wave shielding of a flexible printed circuit board, a flame retardant is added to the thermosetting epoxy resin. Although it can improve the flame retardancy of the electromagnetic wave screen film, however, in order to achieve better shielding ability, it is often necessary to fill more conductive powder, but the higher the conductive powder content, the conductive adhesive layer and the layer body in contact therewith. The connectivity between them is relatively poor.
故，亟需要開發一種具有良好之電磁波屏蔽效果且能保有良好接著性的電磁波屏蔽膜。 Therefore, it is necessary to develop an electromagnetic wave shielding film which has a good electromagnetic wave shielding effect and can maintain good adhesion.
一種電磁波屏蔽膜，係包括：導電膠層；第一金屬鍍覆層，係形成於該導電膠層上；第二金屬鍍覆層，係接觸形成於該第一金屬鍍覆層上，俾使該第一金屬鍍覆層位於該導電膠層與第二金屬鍍覆層之間；以及具色彩遮蔽性之絕緣層，係形成於該第二金屬鍍覆層上，俾使該第二金屬鍍覆層位於該第一金屬鍍覆層與具色彩遮蔽性之絕緣層之間，並令該導電膠層、第一金屬鍍覆層、第二金屬鍍覆層和具色彩遮蔽性之絕緣層的厚度總和為10至53微米(μm)，且該第一金屬鍍覆層和第二金屬鍍覆層之厚度總和為1至3μm。 An electromagnetic wave shielding film comprises: a conductive adhesive layer; a first metal plating layer is formed on the conductive adhesive layer; and a second metal plating layer is formed on the first metal plating layer by contact, so that The first metal plating layer is located between the conductive adhesive layer and the second metal plating layer; and a color shielding insulating layer is formed on the second metal plating layer, and the second metal plating is performed The coating layer is disposed between the first metal plating layer and the color shielding insulating layer, and the conductive adhesive layer, the first metal plating layer, the second metal plating layer and the color shielding insulating layer The sum of the thicknesses is 10 to 53 micrometers (μm), and the total thickness of the first metal plating layer and the second metal plating layer is 1 to 3 μm.
本發明係利用至少二層的金屬鍍覆層提升電磁波屏蔽性能，並進一步降低電磁波屏蔽膜之厚度。在不同實施態樣中，導電膠層可具有至少二個子層，且其中一子層含有複數導電粒子，並令該含有複數導電粒子的子層不接觸該第一金屬鍍覆層，以提升導電膠層與第一金屬鍍覆層之 間的密著性和黏著性。此外，導電膠層具有三個子層時，可令中間的子層含有複數導電粒子，兩側的子層則不含有複數導電粒子，以提升導電膠層兩側介面之密著性和黏著性。 The invention utilizes at least two layers of metal plating layers to enhance electromagnetic wave shielding performance and further reduce the thickness of the electromagnetic wave shielding film. In different embodiments, the conductive adhesive layer may have at least two sub-layers, and one of the sub-layers contains a plurality of conductive particles, and the sub-layer containing the plurality of conductive particles does not contact the first metal plating layer to enhance the conductive Adhesive layer and first metal plating layer The adhesion and adhesion between the two. In addition, when the conductive adhesive layer has three sub-layers, the intermediate sub-layer may contain a plurality of conductive particles, and the sub-layers on both sides do not contain a plurality of conductive particles to improve the adhesion and adhesion of the interfaces on both sides of the conductive adhesive layer.
1、2、3‧‧‧電磁波屏蔽膜 1, 2, 3‧‧‧ electromagnetic shielding film
10‧‧‧第一離型膜 10‧‧‧First release film
11‧‧‧導電膠層 11‧‧‧Electrical adhesive layer
110‧‧‧第一子層 110‧‧‧First sub-layer
111‧‧‧第二子層 111‧‧‧ second sub-layer
112‧‧‧第三子層 112‧‧‧ third sub-layer
12‧‧‧第一金屬鍍覆層 12‧‧‧First metal plating
13‧‧‧第二金屬鍍覆層 13‧‧‧Second metal plating
14‧‧‧具色彩遮蔽性之絕緣層 14‧‧‧Color-shielding insulation
15‧‧‧第二離型膜 15‧‧‧Separate release film
第1圖係顯示本發明第一具體實施方式之電磁波屏蔽膜。 Fig. 1 is a view showing an electromagnetic wave shielding film according to a first embodiment of the present invention.
第2圖係顯示本發明第二具體實施方式之電磁波屏蔽膜。 Fig. 2 is a view showing an electromagnetic wave shielding film according to a second embodiment of the present invention.
第3圖係顯示本發明第三具體實施方式之電磁波屏蔽膜。 Fig. 3 is a view showing an electromagnetic wave shielding film according to a third embodiment of the present invention.
以下係藉由特定的具體實例說明本發明之實施方式，熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之優點及功效。本發明亦可以其它不同的方式予以實施，即，在不悖離本發明所揭示之範疇下，能予不同之修飾與改變。 The embodiments of the present invention are described by way of specific examples, and those skilled in the art can readily appreciate the advantages and effects of the present invention from the disclosure herein. The invention may be embodied in other different forms, and various modifications and changes can be made without departing from the scope of the invention.
須知，本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本發明可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本發明所能產生之功效及所能達成之目的下，均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時，本說明書中所引用之如「上」、 「第一」、「第二」及「一」等之用語，亦僅為便於敘述之明瞭，而非用以限定本發明可實施之範圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本發明可實施之範疇。 It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. At the same time, as quoted in this manual, The terms "first", "second" and "one" are used for convenience of description only, and are not intended to limit the scope of the invention, and the relative relationship is changed or adjusted. The content is also considered to be within the scope of the invention.
請參照第1圖，係顯示本發明之第一具體實施方式之電磁波屏蔽膜。該電磁波屏蔽膜1係包括：導電膠層11；第一金屬鍍覆層12，係形成於該導電膠層11上；第二金屬鍍覆層13，係接觸形成於該第一金屬鍍覆層12上，俾使該第一金屬鍍覆層12位於該導電膠層11與第二金屬鍍覆層13之間；以及具色彩遮蔽性之絕緣層14，係形成於該第二金屬鍍覆層13上，俾使該第二金屬鍍覆層13位於該第一金屬鍍覆層12與具色彩遮蔽性之絕緣層14之間，並令該導電膠層11、第一金屬鍍覆層12、第二金屬鍍覆層13和具色彩遮蔽性之絕緣層14的厚度總和為10至53μm，該第一金屬鍍覆層和第二金屬鍍覆層之厚度總和為1至3μm，且該電磁波屏蔽膜1係具有70dB至95dB的屏蔽率。 Referring to Fig. 1, there is shown an electromagnetic wave shielding film according to a first embodiment of the present invention. The electromagnetic wave shielding film 1 includes: a conductive adhesive layer 11; a first metal plating layer 12 formed on the conductive adhesive layer 11; and a second metal plating layer 13 formed in contact with the first metal plating layer 12, the first metal plating layer 12 is located between the conductive adhesive layer 11 and the second metal plating layer 13; and a color shielding insulating layer 14 is formed on the second metal plating layer 13, the second metal plating layer 13 is located between the first metal plating layer 12 and the color shielding insulating layer 14, and the conductive adhesive layer 11, the first metal plating layer 12, The sum of the thicknesses of the second metal plating layer 13 and the color shielding insulating layer 14 is 10 to 53 μm, and the total thickness of the first metal plating layer and the second metal plating layer is 1 to 3 μm, and the electromagnetic wave shielding The film 1 has a shielding ratio of 70 dB to 95 dB.
此外，本發明之電磁波屏蔽膜復可包括第一離型膜10，係形成於該導電膠層11上，使該導電膠層11位於該第一離型膜10與第一金屬鍍覆層12之間，以保護該導電膠層11。 In addition, the electromagnetic wave shielding film of the present invention may further include a first release film 10 formed on the conductive adhesive layer 11 such that the conductive adhesive layer 11 is located on the first release film 10 and the first metal plating layer 12 Between the layers to protect the conductive adhesive layer 11.
同樣地，本發明之電磁波屏蔽膜復可包括第二離型膜15，係形成於該具色彩遮蔽性之絕緣層14上，使該具色彩遮蔽性之絕緣層14位於該第二離型膜15與第二金屬鍍覆層13之間，以保護該具色彩遮蔽性之絕緣層14。 Similarly, the electromagnetic wave shielding film of the present invention may further include a second release film 15 formed on the color shielding insulating layer 14 such that the color shielding insulating layer 14 is located on the second release film. 15 is interposed between the second metal plating layer 13 to protect the color shielding insulating layer 14.
在本發明之電磁波屏蔽膜中，該導電膠層之厚度係5至25μm，且該導電膠層係含有複數導電粒子，其材質可選自金、銀、銅、鋁、鋅、鐵及鎳所組成群組之至少一者，當然，亦可選擇其他可導電之粒子，以形成導電膠層。於一具體實施例中，以該導電膠層之總重計，該複數導電粒子之含量為5至55%。另外，該導電膠層亦可包含至少二個以上的子層，以提升該導電膠層以提升導電膠層介面之密著性和黏著性。該導電膠層復包括聚合物，例如，環氧樹脂、丙烯酸系樹脂、胺基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂和聚醯亞胺系樹脂，並可選自其所組成群組的至少一者和搭配複數導電粒子，以形成該導電膠層。 In the electromagnetic wave shielding film of the present invention, the conductive adhesive layer has a thickness of 5 to 25 μm, and the conductive adhesive layer contains a plurality of conductive particles, and the material thereof may be selected from the group consisting of gold, silver, copper, aluminum, zinc, iron, and nickel. At least one of the group is formed, of course, other conductive particles may be selected to form a conductive adhesive layer. In one embodiment, the plurality of conductive particles are present in an amount of from 5 to 55% based on the total weight of the conductive adhesive layer. In addition, the conductive adhesive layer may also include at least two sub-layers to enhance the conductive adhesive layer to improve the adhesion and adhesion of the conductive adhesive layer interface. The conductive adhesive layer further includes a polymer, for example, an epoxy resin, an acrylic resin, a urethane resin, a ruthenium rubber resin, a polyparaxylene resin, a bismaleimide resin, and a poly The quinone imine resin may be selected from at least one of the group consisting of and a plurality of conductive particles to form the conductive adhesive layer.
在本發明之電磁波屏蔽膜中，形成該第一金屬鍍覆層之材質係選自銀、銅、鎳及鋁所組成群組的至少一者，形成該第二金屬鍍覆層之材質係選自銀、銅、鎳及鋁所組成群組的至少一者，且第一金屬鍍覆層之材質與第二金屬鍍覆層之材質可為不同。於較佳的實施態樣中，形成該第一金屬鍍覆層和形成該第二金屬鍍覆層之材質係獨立選自銀和銅所組成群組的至少一者。本發明之第一金屬鍍覆層和第二金屬鍍覆層係藉由真空濺鍍、真空蒸鍍或電鍍的方式形成，並控制各該金屬鍍覆層之厚度分別係500至1500nm(0.5μm至1.5μm)，亦即，該第一金屬鍍覆層之厚度係500至1500nm(0.5μm至1.5μm)，且該第二金屬鍍覆層之厚度係50至1500nm(0.5μm至1.5μm)。然而，該第一 金屬鍍覆層和第二金屬鍍覆層之厚度總和係1000至3000nm(1μm至3μm)，以降低該電磁波屏蔽膜之總厚度。 In the electromagnetic wave shielding film of the present invention, the material for forming the first metal plating layer is at least one selected from the group consisting of silver, copper, nickel, and aluminum, and the material for forming the second metal plating layer is selected. At least one of the group consisting of silver, copper, nickel, and aluminum, and the material of the first metal plating layer and the material of the second metal plating layer may be different. In a preferred embodiment, the material for forming the first metal plating layer and the second metal plating layer is independently selected from at least one of the group consisting of silver and copper. The first metal plating layer and the second metal plating layer of the present invention are formed by vacuum sputtering, vacuum evaporation or electroplating, and the thickness of each of the metal plating layers is controlled to be 500 to 1500 nm (0.5 μm, respectively). Up to 1.5 μm), that is, the thickness of the first metal plating layer is 500 to 1500 nm (0.5 μm to 1.5 μm), and the thickness of the second metal plating layer is 50 to 1500 nm (0.5 μm to 1.5 μm). . However, the first The sum of the thicknesses of the metal plating layer and the second metal plating layer is 1000 to 3000 nm (1 μm to 3 μm) to reduce the total thickness of the electromagnetic wave shielding film.
在本發明之電磁波屏蔽膜中，該具色彩遮蔽性之絕緣層的厚度係5至25μm。此外，該具色彩遮蔽性之絕緣層復包括聚合物，例如，環氧樹脂、丙烯酸系樹脂、胺基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂和聚醯亞胺系樹脂，並可選自其所組成群組的至少一者。該具色彩遮蔽性之絕緣層亦包含油墨，例如黑色油墨，以提供遮蔽色彩遮蔽效果。於一具體實施態樣中，該具色彩遮蔽性之絕緣層包括聚醯亞胺系樹脂或由聚醯亞胺系樹脂所形成，以令具色彩遮蔽性之絕緣層的硬度4H至6H，以防止刮傷電磁波屏蔽膜。 In the electromagnetic wave shielding film of the present invention, the thickness of the color-shielding insulating layer is 5 to 25 μm. Further, the color-shielding insulating layer further includes a polymer, for example, an epoxy resin, an acrylic resin, a urethane resin, a ruthenium rubber resin, a polyparaxylene resin, and a double horse 醯The imide resin and the polyamidene resin may be selected from at least one of the group consisting of them. The color-shielding insulating layer also contains an ink, such as a black ink, to provide a shaded color masking effect. In a specific embodiment, the color-shielding insulating layer comprises a polyimide-based resin or a polyimide-based resin to make the color-shielding insulating layer have a hardness of 4H to 6H. Prevents scratching of the electromagnetic wave shielding film.
為了得到本發明之電磁波屏蔽膜，本發明復提供該電磁波屏蔽膜之製備方式。首先，可在第二離型膜上貼合一具色彩遮蔽性之絕緣層，或者利用塗佈法將包含聚合物和油墨之塗料塗佈於在第二離型膜上，經過烘烤後固化該塗料。接著，在該具色彩遮蔽性之絕緣層上形成第二金屬鍍覆層和第一金屬鍍覆層，最後再塗佈用於形成該導電膠層之塗料和貼合第一離型膜。 In order to obtain the electromagnetic wave shielding film of the present invention, the present invention provides a method of preparing the electromagnetic wave shielding film. First, a color-shielding insulating layer may be attached to the second release film, or the coating containing the polymer and the ink may be applied on the second release film by a coating method, and cured after baking. The coating. Next, a second metal plating layer and a first metal plating layer are formed on the color-shielding insulating layer, and finally a coating for forming the conductive adhesive layer and a first release film are bonded.
請參照第2及3圖，係說明本發明之電磁波屏蔽膜中的導電膠層亦可包含至少二個以上的子層的實施態樣。 Referring to Figures 2 and 3, the conductive adhesive layer in the electromagnetic wave shielding film of the present invention may also include an embodiment in which at least two or more sub-layers are included.
請參照第2圖，係顯示本發明之第二具體實施方式之電磁波屏蔽膜2。該電磁波屏蔽膜2係包括：導電膠層11，包括第一子層110和第二子層111，且該第一子層110和 第二子層111中之一層係包含複數導電粒子，例如該第二子層111包含複數導電粒子，且該第一子層110係位於該第一金屬鍍覆層12與該第二子層111之間；第一金屬鍍覆層12，係形成於該導電膠層11上；第二金屬鍍覆層13，係接觸形成於該第一金屬鍍覆層12上，俾使該第一金屬鍍覆層12位於該導電膠層11與第二金屬鍍覆層13之間；以及具色彩遮蔽性之絕緣層14，係形成於該第二金屬鍍覆層13上，俾使該第二金屬鍍覆層13位於該第一金屬鍍覆層12與具色彩遮蔽性之絕緣層14之間，並令該導電膠層11、第一金屬鍍覆層12、第二金屬鍍覆層13和具色彩遮蔽性之絕緣層14的厚度總和為10至53μm，且該第一金屬鍍覆層和第二金屬鍍覆層之厚度總和為1至3μm。 Referring to Fig. 2, an electromagnetic wave shielding film 2 according to a second embodiment of the present invention is shown. The electromagnetic wave shielding film 2 includes a conductive adhesive layer 11 including a first sub-layer 110 and a second sub-layer 111, and the first sub-layer 110 and One of the second sub-layers 111 includes a plurality of conductive particles. For example, the second sub-layer 111 includes a plurality of conductive particles, and the first sub-layer 110 is located at the first metal plating layer 12 and the second sub-layer 111. a first metal plating layer 12 is formed on the conductive adhesive layer 11; a second metal plating layer 13 is formed on the first metal plating layer 12 to cause the first metal plating The coating layer 12 is located between the conductive adhesive layer 11 and the second metal plating layer 13; and a color shielding insulating layer 14 is formed on the second metal plating layer 13 to plate the second metal plating layer. The coating layer 13 is located between the first metal plating layer 12 and the color shielding insulating layer 14, and the conductive metal layer 11, the first metal plating layer 12, the second metal plating layer 13 and the color The total thickness of the shielding insulating layer 14 is 10 to 53 μm, and the total thickness of the first metal plating layer and the second metal plating layer is 1 to 3 μm.
請參照第3圖，係顯示本發明之第三具體實施方式之電磁波屏蔽膜3。該電磁波屏蔽膜3係包括：導電膠層11，包括第一子層110、第二子層111和第三子層112，且該第二子層111包含複數導電粒子，第三子層112形成於該第二子層111上，使該第二子層111係位於該第一子層110與該第三子層112之間；第一金屬鍍覆層12，係形成於該導電膠層11上；第二金屬鍍覆層13，係接觸形成於該第一金屬鍍覆層12上，俾使該第一金屬鍍覆層12位於該導電膠層11與第二金屬鍍覆層13之間；以及具色彩遮蔽性之絕緣層14，係形成於該第二金屬鍍覆層13上，俾使該第二金屬鍍覆層13位於該第一金屬鍍覆層12與具色彩遮蔽性之絕緣層14之間，並令該導電膠層11、第一金屬鍍 覆層12、第二金屬鍍覆層13和具色彩遮蔽性之絕緣層14的厚度總和為10至53μm，且該第一金屬鍍覆層和第二金屬鍍覆層之厚度總和為1至3μm。 Referring to Fig. 3, an electromagnetic wave shielding film 3 according to a third embodiment of the present invention is shown. The electromagnetic wave shielding film 3 includes a conductive adhesive layer 11 including a first sub-layer 110, a second sub-layer 111, and a third sub-layer 112, and the second sub-layer 111 includes a plurality of conductive particles, and the third sub-layer 112 is formed. On the second sub-layer 111, the second sub-layer 111 is disposed between the first sub-layer 110 and the third sub-layer 112. The first metal plating layer 12 is formed on the conductive adhesive layer 11. a second metal plating layer 13 is formed on the first metal plating layer 12 so that the first metal plating layer 12 is located between the conductive adhesive layer 11 and the second metal plating layer 13 And a color-shielding insulating layer 14 is formed on the second metal plating layer 13 so that the second metal plating layer 13 is located on the first metal plating layer 12 and is insulated by color shielding. Between the layers 14, and the conductive paste layer 11, the first metal plating The total thickness of the cladding layer 12, the second metal plating layer 13, and the color-shielding insulating layer 14 is 10 to 53 μm, and the total thickness of the first metal plating layer and the second metal plating layer is 1 to 3 μm. .
實施例1至5本發明之電磁波屏蔽膜 Embodiments 1 to 5 of the electromagnetic wave shielding film of the present invention
本發明實施例1至5之電磁波屏蔽膜中，該具有色彩遮蔽性之絕緣層為6μm油墨層(由聚醯亞胺與15重量%之碳黑(CABOT公司；REGAL®400R)組成)、以如表1所示厚度之二銅鍍覆層作為第一和第二金屬鍍覆層，以及由含有導電粒子之複合樹脂(環氧樹脂和壓克力樹脂以1：1之比例混合而得)形成如表1所示厚度之導電膠層，其中，以該導電膠層之總重計，含量為15%之鎳粉、15%之銀粉和15%之銅粉所混合而成之導電粒子。 In the electromagnetic wave shielding film according to Embodiments 1 to 5 of the present invention, the insulating layer having color concealing property is a 6 μm ink layer (composed of polythenimine and 15% by weight of carbon black (CABOT Co.; REGAL ® 400R)) The two-copper plating layer of the thickness shown in Table 1 is used as the first and second metal plating layers, and the composite resin containing the conductive particles (the epoxy resin and the acrylic resin are mixed in a ratio of 1:1) A conductive paste layer having a thickness as shown in Table 1 was formed, wherein conductive particles of 15% nickel powder, 15% silver powder, and 15% copper powder were mixed based on the total weight of the conductive paste layer.
比較例1至5習知電磁波屏蔽膜 Comparative Examples 1 to 5 Conventional Electromagnetic Wave Shielding Films
與實施例1至5之製法相同，差別在於，於比較例1至4之電磁波屏蔽膜中僅具有單層金屬鍍覆層，其中，比較例1和2的導電膠層包括第一、第二和第三子層，而比較例5具有二層金屬層，其各層的厚度係如表1所示。 The same manner as in the production methods of Examples 1 to 5, except that the electromagnetic wave shielding films of Comparative Examples 1 to 4 have only a single metal plating layer, wherein the conductive adhesive layers of Comparative Examples 1 and 2 include the first and second layers. And the third sub-layer, and Comparative Example 5 has two metal layers, the thickness of each of which is as shown in Table 1.
測試例 Test case
將本發明實施例1至5和比較例1至5之電磁波屏蔽裁切為將133mm(外徑)/76mm(內徑)之尺寸的中空圓形試片，並依下述方法量測本發明實施例1至5和比較例1至5之電磁波屏蔽膜的電磁波屏蔽性，將結果紀錄於表2。 The electromagnetic wave shields of the inventive examples 1 to 5 and comparative examples 1 to 5 were cut into hollow circular test pieces having a size of 133 mm (outer diameter) / 76 mm (inner diameter), and the present invention was measured by the following method. The electromagnetic wave shielding properties of the electromagnetic wave shielding films of Examples 1 to 5 and Comparative Examples 1 to 5 were recorded in Table 2.
電磁波遮罩性： Electromagnetic wave masking:
依據ASTM D 4935-99參考標準使用同軸傳輸線測試製具(Coaxial transmission line holder)與網路分析儀(型號Wiltron 37225B)之量測設備分別於1GHz至10GHz操作頻 率範圍進行量測。具體的係將電磁波屏蔽膜之圓形試片製於同軸傳輸線測試製具中，補償同軸傳輸線測試製具的補償電容，輸入網路分析儀之欲量測的範圍(例如，1GHz至10GHz)，並校正網路分析儀使***損失(Insertion loss)接近0dB，即能自電磁波衰減程度，得到各實施例比較例之電磁屏蔽膜之遮罩值(屏蔽效能)。 Coaxial transmission line holder and network analyzer (model Wiltron 37225B) measuring equipment operating at 1 GHz to 10 GHz according to ASTM D 4935-99 reference standard The rate range is measured. Specifically, the circular test piece of the electromagnetic wave shielding film is fabricated in the coaxial transmission line test tool, and the compensation capacitance of the coaxial transmission line test tool is compensated, and the range of the input network analyzer is measured (for example, 1 GHz to 10 GHz). And correcting the network analyzer so that the insertion loss is close to 0 dB, that is, the degree of attenuation of the electromagnetic wave can be obtained, and the mask value (shielding efficiency) of the electromagnetic shielding film of the comparative example of each embodiment is obtained.
由表2可見，本發明實施例1至5之電磁屏蔽膜之屏蔽效果明顯優於比較例1至5，且由比較例4或5可見， 無論僅有單層金屬層或具有二層金屬層，其於1GHz至10GHz操作頻率下之電磁屏蔽效果皆無法高於70dB。再比較實施例4和5於1G、4G、6G、9G和10G的操作頻率下之電磁屏蔽效果可知，當第一金屬鍍覆層和第二金屬鍍覆層之厚度總和相同時，第二金屬鍍覆層厚於第一金屬鍍覆層，對於1G、4G、6G、9G和10G的操作頻率下之電磁屏蔽效果並無顯著的影響。 It can be seen from Table 2 that the shielding effect of the electromagnetic shielding films of Embodiments 1 to 5 of the present invention is significantly better than that of Comparative Examples 1 to 5, and can be seen by Comparative Example 4 or 5. Regardless of whether there is only a single metal layer or a two-layer metal layer, the electromagnetic shielding effect at an operating frequency of 1 GHz to 10 GHz cannot be higher than 70 dB. Comparing the electromagnetic shielding effects of the operating frequencies of Examples 4 and 5 at 1G, 4G, 6G, 9G and 10G, it can be seen that when the sum of the thicknesses of the first metal plating layer and the second metal plating layer is the same, the second metal The plating layer is thicker than the first metal plating layer and has no significant effect on the electromagnetic shielding effect at operating frequencies of 1G, 4G, 6G, 9G and 10G.
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| CN206481556U (en) * | 2017-02-24 | 2017-09-08 | 昆山雅森电子材料科技有限公司 | Have the high shielding EMI screened films of black polyamide thin film |
| WO2018022840A1 (en) * | 2016-07-28 | 2018-02-01 | 3M Innovative Properties Company | Stretchable electrically-conductive adhesive tape |
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| WO2018022840A1 (en) * | 2016-07-28 | 2018-02-01 | 3M Innovative Properties Company | Stretchable electrically-conductive adhesive tape |
| CN206481556U (en) * | 2017-02-24 | 2017-09-08 | 昆山雅森电子材料科技有限公司 | Have the high shielding EMI screened films of black polyamide thin film |
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