CN111410920A - Wave-absorbing shielding adhesive film and preparation method thereof - Google Patents
Wave-absorbing shielding adhesive film and preparation method thereof Download PDFInfo
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- CN111410920A CN111410920A CN202010208188.4A CN202010208188A CN111410920A CN 111410920 A CN111410920 A CN 111410920A CN 202010208188 A CN202010208188 A CN 202010208188A CN 111410920 A CN111410920 A CN 111410920A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
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- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a wave-absorbing shielding adhesive film and a preparation method thereof, and the wave-absorbing shielding adhesive film comprises an adhesive film layer, a wave-absorbing layer, a conductive metal layer and an antistatic shading layer which are sequentially arranged, wherein the wave-absorbing layer is made of soft magnetic alloy material, and the antistatic shading layer is made of conductive ink or polyimide; the preparation method comprises the following steps: coating an anti-static shading layer on one surface of the conductive metal layer by taking the conductive metal layer as a substrate, and then drying; coating a soft magnetic alloy material on the other surface of the conductive metal layer, and performing multi-roller hot-pressing curing to obtain an absorption layer; and coating the pressure-sensitive adhesive on the absorption layer, drying, curing and forming a film to obtain the adhesive film layer. The shielding structure can realize effective shielding under the condition of ultrathin thickness, thereby achieving the purposes of resisting electromagnetic wave interference and inhibiting electronic noise.
Description
Technical Field
The invention relates to the technical field of electromagnetic shielding, in particular to a wave-absorbing shielding adhesive film and a preparation method thereof.
Background
Along with the development of increasingly thinner and more integrated designs of electronic devices such as notebook computers, displays, mobile phones and tablet computers, the mutual interference of electromagnetic waves in various frequency bands among electronic components inside the electronic devices is increasingly complex and serious, the existing shielding materials using conductive cloth tapes, conductive foam, metal foils and the like cannot meet the requirement of the complex and variable use environment, and the requirement on the thickness of products is also increasingly strict, so that the higher requirement is provided for the shielding materials used in the existing high-end electronic devices at present.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a wave-absorbing shielding adhesive film and a preparation method thereof, which can realize effective shielding under an ultrathin thickness so as to achieve electromagnetic wave interference resistance and electronic noise suppression.
In order to solve the technical problem, the invention provides a wave-absorbing shielding adhesive film which comprises an adhesive film layer, a wave-absorbing layer, a conductive metal layer and an antistatic shading layer which are sequentially arranged, wherein the wave-absorbing layer is made of a soft magnetic alloy material, and the antistatic shading layer is made of conductive ink or polyimide.
Preferably, the conductive metal layer is a copper foil or an aluminum foil.
Preferably, the film layer is formed by coating acrylic acid glue.
Preferably, the soft magnetic alloy material is prepared from Fe-Si-A l alloy powder or a permalloy film.
Preferably, the thickness of the static elimination light shielding layer is 2-10 um.
Preferably, the thickness of the conductive metal layer is 1-50 um.
Preferably, the thickness of the wave-absorbing layer is 2-100 um.
Preferably, the thickness of the double-sided adhesive layer is 3-50 um.
The preparation method of the wave-absorbing shielding adhesive film comprises the following steps:
s1, coating an anti-static light shielding layer on one surface of the conductive metal layer by taking the conductive metal layer as a substrate, and drying;
s2, coating a soft magnetic alloy material on the other surface of the conductive metal layer, and performing multi-roller hot-pressing solidification to obtain an absorption layer;
and S3, coating acrylic acid glue on the absorption layer to obtain the glue film layer.
Preferably, the method further includes the step of after the step S3;
s4, attaching a release film or release paper on the double-sided adhesive tape layer
The invention has the beneficial effects that:
1. the invention can realize multifunctional shielding function, and solves the problem that the prior single material or simple composite material can not solve.
2. The invention can realize effective shielding under the condition of ultrathin thickness, and the thickness can be prepared from 10um to 200 um; the wave-absorbing shielding adhesive film can realize the effective shielding of electromagnetic waves in the range of 1MHZ-2GHZ, thereby achieving the interference and the suppression of electronic noise, and particularly achieving the shielding effect of more than 80dB in the range of 650-960 MHZ.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic diagram of a wave-absorbing shielding adhesive film attached to an electronic component.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
Referring to fig. 1-2, the invention discloses a wave-absorbing shielding adhesive film, which comprises an adhesive film layer, a wave-absorbing layer, a conductive metal layer and an antistatic shading layer, wherein the wave-absorbing layer is made of soft magnetic alloy material, and the antistatic shading layer is made of conductive ink or polyimide.
The conductive metal layer can be copper foil, and the copper foil has better shielding performance and better heat conductivity than metal foils such as aluminum foil and the like. The thickness of the conductive metal layer may be 1-50 um.
The adhesive film can be acrylic acid glue, the acrylic acid glue is a pressure-sensitive adhesive film, the adhesion performance is good, and the thickness and the viscosity of the film layer can be adjusted in various ways through the acrylic acid glue, so that the adhesive film is suitable for various use conditions. The thickness of the double-sided adhesive layer is 3-50 um.
The soft magnetic alloy material in the wave-absorbing layer can be prepared by Fe-Si-Al alloy powder mixed resin or by using a Fe-Ni permalloy metal film. The interference clutter absorbing and eliminating device can absorb and eliminate the interference clutter of the corresponding frequency band. The soft magnetic alloy material can also be Sendust metal micro powder or FeCuSiBCV micro powder. The thickness of the wave-absorbing layer is 2-100 um.
For the static electricity eliminating light shielding layer, one way is to use a conductive ink which can eliminate static electricity generated during use and prevent light leakage. The conductive ink consists of conductive filler, adhesive, solvent and additive. The conductive filler is generally silver powder and copper powder, and gold powder, graphite, carbon black (existing special conductive carbon black), carbon fiber, nickel powder and the like are also used. Examples of the synthetic resin used as the binder include epoxy resin, alkyd resin, acrylic resin, urethane resin, and phenol resin. Additives such as a dispersant, a slip agent, a coupling agent and the like are added according to needs.
For the static elimination shading layer, another mode is to adopt polyimide, namely PI, and the polyimide material has better temperature resistance (280 ℃), and has excellent corrosion resistance and friction resistance. The thickness of the static elimination shading layer is 2-10 um.
For the static electricity eliminating shading layer, a polyimide-conductive ink composite film can be used, conductive carbon black is added into polyimide in a molten state, and then the polyimide is coated on the conductive metal layer to form a film, so that the polyimide-conductive ink composite film has good shading performance, the polyimide is modified by the conductive carbon black, the polyimide-conductive ink composite film has conductivity, and the whole friction resistance is improved.
The invention also discloses a preparation method of the wave-absorbing shielding adhesive film, which comprises the following steps:
s1, coating an anti-static light shielding layer on one surface of the conductive metal layer by taking the conductive metal layer as a substrate, and drying;
s2, coating a soft magnetic alloy material on the other surface of the conductive metal layer, and performing multi-roller hot-pressing solidification to obtain an absorption layer;
s3, coating acrylic acid glue on the absorption layer to obtain a glue film layer, wherein if the acrylic acid glue is coated on the absorption layer, the thickness of the glue film layer is controllable, and the glue film layer is uniform;
and S4, attaching a release film or release paper on the double-sided adhesive tape layer.
By the process, the wave-absorbing shielding adhesive film with better shielding performance can be obtained. Table 1 shows several wave-absorbing shielding adhesive films with different thicknesses and their shielding properties. Wherein the soft magnetic alloy material in the wave absorbing layer is Fe-Si-Al alloy powder, and the static eliminating shading layer adopts conductive ink. The conductive metal layer is made of copper foil.
TABLE 1
From the above table, it can be seen that the thicknesses of the double-sided adhesive layer, the wave-absorbing layer, the conductive metal layer and the static electricity eliminating light shielding layer are adjustable, and the electromagnetic wave is effectively shielded within the range of 1MHZ-2GHZ, so that interference and electronic noise suppression are achieved, and the shielding and noise reduction effects of more than 80dB can be achieved particularly within the range of 650 plus 960 MHZ.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (10)
1. The wave-absorbing shielding adhesive film is characterized by comprising an adhesive film layer, a wave-absorbing layer, a conductive metal layer and an antistatic shading layer which are sequentially arranged, wherein the wave-absorbing layer is made of soft magnetic alloy materials, and the antistatic shading layer is made of conductive ink or polyimide.
2. The wave-absorbing shielding adhesive film of claim 1, wherein the conductive metal layer is a copper foil or an aluminum foil.
3. The wave-absorbing masking adhesive film of claim 1, wherein the adhesive film layer is formed by coating acrylic acid glue.
4. The film of claim 1, wherein the soft magnetic alloy material is made of Fe-Si-Al alloy powder or Fe-Ni permalloy film.
5. The wave-absorbing masking adhesive film of claim 1, wherein the static-eliminating light-shielding layer has a thickness of 2-10 um.
6. The wave-absorbing shielding adhesive film of claim 1, wherein the thickness of the conductive metal layer is 1-50 um.
7. The wave-absorbing masking adhesive film of claim 1, wherein the wave-absorbing layer has a thickness of 2-100 um.
8. The wave-absorbing masking adhesive film of claim 1, wherein the thickness of the adhesive film layer is 3-50 um.
9. A preparation method of the wave-absorbing shielding adhesive film of any one of claims 1 to 8, which is characterized by comprising the following steps:
s1, coating an anti-static light shielding layer on one surface of the conductive metal layer by taking the conductive metal layer as a substrate, and drying;
s2, coating a soft magnetic alloy material on the other surface of the conductive metal layer, and performing multi-roller hot-pressing solidification to obtain an absorption layer;
and S3, coating acrylic acid glue on the absorption layer to obtain the glue film layer.
10. The method for preparing a wave-absorbing masking adhesive film according to claim 9, further comprising, after S3:
and S4, attaching a release film or release paper on the adhesive film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010208188.4A CN111410920A (en) | 2020-03-23 | 2020-03-23 | Wave-absorbing shielding adhesive film and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010208188.4A CN111410920A (en) | 2020-03-23 | 2020-03-23 | Wave-absorbing shielding adhesive film and preparation method thereof |
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| Publication Number | Publication Date |
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| CN111410920A true CN111410920A (en) | 2020-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010208188.4A Pending CN111410920A (en) | 2020-03-23 | 2020-03-23 | Wave-absorbing shielding adhesive film and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115678422A (en) * | 2022-11-04 | 2023-02-03 | 苏州铂韬新材料科技有限公司 | Multilayer coating |
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Application publication date: 20200714 |
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