TWI663643B - Holding fixture generating device - Google Patents
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Abstract
本發明的課題為提供一種可低成本且短時間地生成用於保持板狀物之保持治具的保持治具生成裝置。解決手段為生成切削裝置之保持治具的保持治具生成裝置，並做成具備基本資訊記憶組件、固有資訊記憶組件、輸入組件、設計資訊生成組件及3維印表機之構成。該基本資訊記憶組件是將保持治具之基本構造作為基本資訊而記憶，該固有資訊記憶組件是將板狀物之大小的資訊、所分割之晶片之大小的資訊、在X軸方向及Y軸方向上各自排列之晶片之數量的資訊作為板狀物之固有資訊而記憶，該輸入組件是輸入固有資訊，該設計資訊生成組件是由已記憶於基本資訊記憶組件之基本資訊和已記憶於固有資訊記憶組件之固有資訊來生成保持治具之設計資訊，該3維印表機是由設計資訊生成保持治具。 An object of the present invention is to provide a holding jig generating device capable of generating a holding jig for holding a plate in a short time at a low cost. The solution is a holding jig generating device for generating a holding jig of a cutting device, and is made up of a basic information memory module, inherent information memory module, input module, design information generating module, and a three-dimensional printer. The basic information memory component memorizes the basic structure of the holding fixture as basic information. The inherent information memory component is information about the size of the plate, the size of the divided chip, and the X-axis and Y-axis. The information of the number of chips arranged in each direction is memorized as the inherent information of the plate. The input component is input inherent information, and the design information generation component is composed of the basic information stored in the basic information storage component and the inherent information stored in the inherent information. The inherent information of the information memory component is used to generate the design information of the holding fixture. The 3D printer is based on the design information to generate the holding fixture.
Description
本發明是有關於生成在保持板狀物之時所使用之保持治具的保持治具生成裝置。 The present invention relates to a holding jig generating device for generating a holding jig used when holding a plate.
以半導體積體電路為代表之以樹脂等密封複數個器件之器件封裝，是例如，以切削刀沿著稱為切割道(street)之分割預定線切削，而分割成對應於各器件之複數個晶片。 A device package represented by a semiconductor integrated circuit and sealed with a plurality of devices, such as a resin, is, for example, cut with a cutter along a predetermined division line called a street, and then divided into a plurality of wafers corresponding to each device. .
在切削如上述之器件封裝的板狀物時，會有使用設計為專用之保持治具來保持板狀物的情形(參照例如專利文獻1)。在此保持治具上設置有吸引已對應於板狀物的各晶片之區域的細孔，和已對應於板狀物之切割道的切削刀用的退刀溝。 When cutting a plate-shaped device package as described above, a holding fixture designed for exclusive use may be used to hold the plate-shaped object (see, for example, Patent Document 1). The holding jig is provided with a pore for attracting a region of each wafer corresponding to the plate-like object, and a retracting groove for a cutter having a cutting path for the plate-like object.
因為藉由使用此保持治具，可以在對應於各晶片的區域中一邊吸引保持板狀物一邊進行切削，因此不易產生已分割之晶片的位置偏移等。藉此，可防止加工不良的發生。 Because the holding jig can be used to perform cutting while attracting and holding the plate-like object in the region corresponding to each wafer, it is difficult to cause the positional deviation of the divided wafer and the like. This can prevent the occurrence of processing defects.
專利文獻1：日本專利特開2011-114145號公報 Patent Document 1: Japanese Patent Laid-Open No. 2011-114145
然而，因為上述之保持治具是被設計為配合板狀物而專用，所以當切割道之配置等的板狀物的設計有變更時，就必須準備新的保持治具。因此，特別是對於進行設計變更的機會較多之少量多樣生產的製造商，保持治具的製造成本及交期已成為問題。 However, since the above-mentioned holding jig is designed to be used exclusively for the plate-like object, it is necessary to prepare a new holding jig when the design of the plate-like object such as the arrangement of the cutting path is changed. Therefore, especially for a small number of diversified manufacturers who have many opportunities for design changes, maintaining the manufacturing cost and delivery time of the fixture has become a problem.
本發明是有鑒於所述問題點而作成的發明，其目的在於提供一種可以低成本且短時間地生成用於保持板狀物之保持治具的保持治具生成裝置。 The present invention has been made in view of the problems described above, and an object thereof is to provide a holding jig generating device that can generate a holding jig for holding a plate-like object at low cost and in a short time.
根據本發明所提供之保持治具生成裝置，是生成切削裝置之保持治具的保持治具生成裝置，其中該切削裝置具備有用以保持被分割為複數個晶片之板狀物的保持組件、將用以切削保持於該保持組件上之板狀物之切削刀可旋轉地裝配的切削組件、使該保持組件和該切削組件在X軸方向上相對地切削進給的切削進給組件，以及使該保持組件和該切削組件因應晶片的大小而在Y軸方向上相對地分度進給的分度進給組件，且該保持組件包含上表面形成有吸引口之基座、和裝卸自如地裝設在該基座上並具有保持板狀物之保持面的保持治具。該保持治具生成裝置的特 徵在於包含：基本資訊記憶組件，將該保持治具之基本構造作為基本資訊而記憶；固有資訊記憶組件，將板狀物之大小的資訊、所分割之晶片之大小的資訊、在X軸方向及Y軸方向上各自排列之晶片之數量的資訊作為板狀物的固有資訊而記憶；輸入組件，輸入該固有資訊；設計資訊生成組件，由記憶於該基本資訊記憶組件之該基本資訊和記憶於該固有資訊記憶組件之該固有資訊生成該保持治具之設計資訊；以及3維印表機，由該設計資訊生成該保持治具。 The holding jig generating device provided according to the present invention is a holding jig generating device for generating a holding jig of a cutting device, wherein the cutting device is provided with a holding assembly for holding a plate-shaped object divided into a plurality of wafers, A cutting assembly rotatably assembled by a cutting blade for cutting a plate-shaped object held on the holding assembly, a cutting feed assembly that causes the holding assembly and the cutting assembly to relatively cut feed in the X-axis direction, and The holding unit and the cutting unit are relatively index-feeding units that are index-feeding in the Y-axis direction in accordance with the size of the wafer, and the holding unit includes a base with a suction opening formed on the upper surface, and is detachably mounted. A holding jig provided on the base and having a holding surface for holding a plate. Features of the holding jig generating device The features include: a basic information memory component, which memorizes the basic structure of the holding fixture as basic information; an inherent information memory component, which includes information on the size of the plate, the information on the size of the divided chip, and the X-axis direction. And the information of the number of chips arranged in the Y-axis direction are stored as the inherent information of the plate; the input component is used to input the inherent information; the design information generation component is used to store the basic information and memory in the basic information storage component Design information of the holding jig is generated from the inherent information of the inherent information memory component; and a 3D printer generates the holding jig from the design information.
較理想的是，在本發明中，該基本資訊包含將該保持治具上下貫通而在該保持面形成開口且連接到形成於該基座之上表面的該吸引口之細孔的資訊、因應晶片來區劃該保持面之切削刀的退刀溝的資訊、該保持治具之厚度的資訊，且該設計資訊生成組件是因應所分割之晶片之大小的資訊，和在X軸方向及Y軸方向上各自排列之晶片之數量的資訊，而分別在X軸方向及Y軸方向上設定該退刀溝的條數與間隔，並因應板狀物之大小的資訊來設定該保持治具的外形。 Preferably, in the present invention, the basic information includes information on the pores which penetrate the holding jig up and down to form an opening in the holding surface and are connected to the pores formed on the suction opening formed on the upper surface of the base. The chip is used to distinguish the information of the undercut of the cutter on the holding surface, the thickness of the holding jig, and the design information generating component is the information corresponding to the size of the divided wafer, and the X-axis direction and Y-axis Information of the number of wafers arranged in each direction, and set the number and interval of the retraction grooves in the X-axis direction and the Y-axis direction, respectively, and set the shape of the holding fixture according to the information of the size of the plate .
又，較理想的是，在本發明中，該設計資訊生成組件是因應所分割之晶片之大小的資訊來設定該細孔的孔徑。 In addition, it is preferable that, in the present invention, the design information generating component sets the aperture diameter of the fine hole according to the information of the size of the divided wafer.
本發明之保持治具生成裝置，因為是以設計資訊生成組件從記憶於基本資訊記憶組件之保持治具的基本資訊和記憶於固有資訊記憶組件之板狀物的固有資訊中，生成保持治具的設計資訊，再根據此設計資訊以3維印表機生成保持治具，因此可以低成本且短時間地生成用於保持板狀物之保持治具。 The holding jig generating device of the present invention uses a design information generating component to generate the holding jig from the basic information of the holding jig stored in the basic information memory component and the inherent information of the plate-shaped object stored in the inherent information memory component. Based on this design information, a holding fixture is generated by a 3D printer based on this design information. Therefore, a holding fixture for holding a plate can be generated at low cost and in a short time.
2‧‧‧保持治具生成裝置 2‧‧‧ holding fixture generating device
4‧‧‧3維印表機(附加製造裝置) 4‧‧‧3-dimensional printer (additional manufacturing device)
6、24‧‧‧基台 6, 24‧‧‧ abutment
6a‧‧‧作業區域 6a‧‧‧Working area
8‧‧‧列印頭 8‧‧‧ print head
10‧‧‧儲槽 10‧‧‧ storage tank
11‧‧‧板狀物 11‧‧‧ plate
12‧‧‧移動機構 12‧‧‧ mobile agency
13‧‧‧金屬框體 13‧‧‧ metal frame
13a‧‧‧表面 13a‧‧‧ surface
13b‧‧‧背面 13b‧‧‧Back
14‧‧‧控制裝置 14‧‧‧Control device
14a‧‧‧基本資訊記憶部(基本資訊記憶組件) 14a‧‧‧Basic Information Memory Unit (Basic Information Memory Unit)
14b‧‧‧固有資訊記憶部(固有資訊記憶組件) 14b‧‧‧Inherent Information Memory Unit (Inherent Information Memory Unit)
14c‧‧‧設計資訊生成部(設計資訊生成組件) 14c‧‧‧Design Information Generation Department (Design Information Generation Component)
15‧‧‧器件區域 15‧‧‧device area
16‧‧‧螢幕(輸入組件) 16‧‧‧Screen (input component)
17‧‧‧外周剩餘區域 17‧‧‧ Outer peripheral area
19‧‧‧切割道(分割預定線) 19‧‧‧ cutting road (scheduled dividing line)
21‧‧‧樹脂 21‧‧‧resin
22‧‧‧切削裝置 22‧‧‧ cutting device
23‧‧‧載台 23‧‧‧ carrier
24a‧‧‧開口 24a‧‧‧ opening
26‧‧‧X軸移動台 26‧‧‧X-axis mobile stage
28‧‧‧防塵防滴蓋 28‧‧‧Dustproof and drip-proof cover
30‧‧‧保持台(保持組件) 30‧‧‧holding table (holding assembly)
32‧‧‧基座 32‧‧‧ base
32a‧‧‧基座頂面 32a‧‧‧Top surface of base
32b、32c‧‧‧吸引口 32b, 32c
34‧‧‧保持治具 34‧‧‧ maintain fixture
34a‧‧‧保持面 34a‧‧‧ holding surface
34b‧‧‧保持治具的底面 34b‧‧‧ keep the underside of the jig
34c‧‧‧退刀溝 34c‧‧‧Drawback trench
34d‧‧‧細孔 34d‧‧‧pore
36a、36b‧‧‧電磁閥 36a, 36b‧‧‧ solenoid valve
38‧‧‧吸引源 38‧‧‧ Attraction source
40‧‧‧切削單元(切削組件) 40‧‧‧cutting unit (cutting assembly)
42‧‧‧支撐構造 42‧‧‧ support structure
44‧‧‧切削單元移動機構(分度進給組件) 44‧‧‧ cutting unit moving mechanism (index feed assembly)
46‧‧‧切削刀 46‧‧‧Cutter
X、Y、Z‧‧‧方向 X, Y, Z‧‧‧ directions
圖1是模式地顯示本實施形態之保持治具生成裝置之構成例的圖。 FIG. 1 is a diagram schematically showing a configuration example of a holding jig generating device according to this embodiment.
圖2是模式地顯示使用保持治具之切削裝置之構成例的立體圖。 FIG. 2 is a perspective view schematically showing a configuration example of a cutting device using a holding jig.
圖3(A)是模式地顯示板狀物的平面圖，圖3(B)是模式地顯示板狀物的底面圖，圖3(C)是模式地顯示板狀物的側面圖。 FIG. 3 (A) is a plan view schematically showing a plate, FIG. 3 (B) is a bottom view schematically showing a plate, and FIG. 3 (C) is a side view schematically showing a plate.
圖4(A)是模式地顯示保持治具的平面圖，圖4(B)是模式地顯示已載置於基座的上表面之狀態的保持治具的圖。 FIG. 4 (A) is a plan view schematically showing the holding jig, and FIG. 4 (B) is a view schematically showing the holding jig in a state of being placed on the upper surface of the base.
參照附圖，說明本發明之實施形態。圖1是模式地顯示本實施形態之保持治具生成裝置之構成例的圖。如圖1所示，保持治具生成裝置2具備有可生成任意之3維構造的3維印表機(附加製造裝置)4。 An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a diagram schematically showing a configuration example of a holding jig generating device according to this embodiment. As shown in FIG. 1, the holding jig generating device 2 is provided with a three-dimensional printer (additional manufacturing device) 4 capable of generating an arbitrary three-dimensional structure.
在3維印表機4之基台6的上表面上配置有列印頭(printer head)8。列印頭8具備例如供給光硬化型之液狀樹脂 的儲槽10，和產生使液狀樹脂硬化之紫外線等的光的光源(圖未示)，並藉由移動機構12而在水平方向上移動。 A printer head 8 is arranged on the upper surface of the base 6 of the three-dimensional printer 4. The print head 8 includes, for example, a light-curable liquid resin The storage tank 10 and a light source (not shown) that generates light such as ultraviolet rays for curing the liquid resin are moved in the horizontal direction by the moving mechanism 12.
例如，可藉由對形成於基台6內之作業區域6a噴射液狀樹脂，並照射紫外線等光，而使液狀樹脂硬化以生成3維構造。像這樣，在本實施形態之3維印表機4中，所採用的是將液狀材料選擇性地噴射而使其固化的材料噴射方式(代表性的是噴墨方式)。 For example, the liquid resin can be sprayed on the working area 6 a formed in the base 6 and irradiated with light such as ultraviolet rays to harden the liquid resin to produce a three-dimensional structure. As described above, in the three-dimensional printer 4 of the present embodiment, a material ejection method (typically an inkjet method) is used in which a liquid material is selectively ejected and cured.
但是，在3維印表機4上也可以採用其他方式。作為其他方式，有例如，將流動性的材料擠壓出，並在堆積的同時使其硬化的材料擠壓方式(代表性的是FDM(Fused Deposition Modeling)(註冊商標))，或將液狀的結合劑吹附在粉末材料上，而選擇性地使其固化的結合材噴射方式等。 However, other methods may be adopted on the 3-dimensional printer 4. Other methods include, for example, a material extrusion method (typically FDM (Fused Deposition Modeling) (registered trademark)) in which a fluid material is extruded and hardened while being stacked, or a liquid The bonding agent is blown on the powder material, and the bonding material is selectively sprayed.
在此3維印表機4上連接有控制裝置14。控制裝置14具備有記憶保持治具之基本資訊(基本構造)之基本資訊記憶部(基本資訊記憶組件)14a。在保持治具之基本資訊中包含有例如，用於吸引板狀物之細孔的資訊、用於避開與切削刀之干涉的退刀溝的資訊、保持治具之厚度的資訊等。 A control device 14 is connected to the three-dimensional printer 4. The control device 14 includes a basic information storage unit (basic information storage unit) 14a having basic information (basic structure) of a memory holding jig. The basic information of the holding fixture includes, for example, information for attracting the pores of the plate-like object, information for retracting the groove for avoiding interference with the cutter, and information for maintaining the thickness of the fixture.
又，控制裝置14具備有記憶板狀物之固有資訊的固有資訊記憶部(固有資訊記憶組件)14b。板狀物的固有資訊包含有例如，板狀物之大小的資訊、由板狀物所分割出之晶片的大小的資訊、在X軸方向及Y軸方向上各自排列之晶片的數量的資訊等。 In addition, the control device 14 includes a unique information storage unit (unique information storage unit) 14b that stores the unique information of the plate-like object. The inherent information of the plate-shaped object includes, for example, information on the size of the plate-shaped object, information on the size of the wafer divided by the plate-shaped object, information on the number of wafers arranged in the X-axis direction and the Y-axis direction, etc. .
此外，控制裝置14還具備由記憶於基本資訊記憶部14a之基本資訊及記憶於固有資訊記憶部14b之固有資訊，來生成保持治具之設計資訊的設計資訊生成部(設計資訊生成組件)14c。3維印表機4是根據此設計資訊而生成所期望的保持治具。 In addition, the control device 14 further includes a design information generation unit (design information generation unit) 14c that generates design information for the fixture from the basic information stored in the basic information storage unit 14a and the inherent information stored in the inherent information storage unit 14b. . The 3D printer 4 generates a desired holding jig based on this design information.
在3維印表機4之基台6的上表面，配置有成為使用者介面之觸控面板式的螢幕(輸入組件)16。在此螢幕16上可顯示例如，保持治具生成裝置2的可動狀況等資訊。又，使用者可以藉由將板狀物的固有資訊輸入到此螢幕16，而使固有資訊記憶於控制裝置14內的固有資訊記憶部14b中。 On the upper surface of the base 6 of the three-dimensional printer 4, a touch panel type screen (input unit) 16 serving as a user interface is arranged. This screen 16 can display information such as the movement status of the holding jig generating device 2. In addition, the user can input the unique information of the plate-like object to the screen 16 so that the unique information is stored in the unique information storage unit 14 b in the control device 14.
其次，針對以保持治具生成裝置2所生成之保持治具等進行說明。圖2是模式地顯示使用保持治具之切削裝置之構成例的立體圖。如圖2所示，切削裝置22具備有支撐各構造之基台24。 Next, the holding jig and the like generated by the holding jig generating device 2 will be described. FIG. 2 is a perspective view schematically showing a configuration example of a cutting device using a holding jig. As shown in FIG. 2, the cutting device 22 includes a base 24 that supports each structure.
在基台24的上表面，形成有在X軸方向(前後方向，切削進給方向)上較長之矩形的開口24a。在此開口24a內設置有X軸移動台26、使X軸移動台26在X軸方向上移動之X軸移動機構(切削進給組件)(圖未示)，以及覆蓋X軸移動機構之防塵防滴蓋28。 On the upper surface of the base 24, a rectangular opening 24a that is long in the X-axis direction (front-rear direction, cutting feed direction) is formed. Inside this opening 24a are provided an X-axis moving table 26, an X-axis moving mechanism (cutting feed unit) (not shown) that moves the X-axis moving table 26 in the X-axis direction, and dust-proof covering the X-axis moving mechanism Anti-drip cover 28.
在X軸移動台26上配置有用於吸引保持板狀物11的保持台(保持組件)30。保持台30包含具備2種吸引口的基座32。在此基座32之上表面32a上裝設有對應於板狀物11的保持治具34。 A holding table (holding unit) 30 for sucking and holding the plate-like object 11 is arranged on the X-axis moving table 26. The holding table 30 includes a base 32 having two types of suction ports. A holding jig 34 corresponding to the plate-like object 11 is mounted on the upper surface 32 a of the base 32.
圖3(A)是模式地顯示板狀物11的平面圖，圖3(B)是模式地顯示板狀物11的底面圖，圖3(C)是模式地顯示板狀物11的側面圖。如圖3(A)及圖3(B)所示，板狀物11就是所謂的器件封裝(封裝基板)，並包含以平面來看大致形成為矩形之金屬框體13。 FIG. 3 (A) is a plan view schematically showing the plate-like object 11, FIG. 3 (B) is a bottom view showing the plate-like object 11 schematically, and FIG. 3 (C) is a side view showing the plate-like object 11 schematically. As shown in FIG. 3 (A) and FIG. 3 (B), the plate 11 is a so-called device package (package substrate), and includes a metal frame 13 that is formed into a substantially rectangular shape in plan view.
金屬框體13是以例如，42合金(鐵和鎳的合金)或銅等之金屬所構成，並包含有複數個器件區域15(此處為3個器件區域15)，和包圍各器件區域15之外周剩餘區域17。 The metal frame 13 is made of, for example, a 42 alloy (an alloy of iron and nickel) or copper, and includes a plurality of device regions 15 (here, three device regions 15), and surrounds each of the device regions 15 The remaining area is 17.
各器件區域15是以交叉之複數條切割道(分割預定線)19進一步被區劃成複數個區域(此處為48個區域)，且在各區域中配置有IC或LSI、LED等之器件(器件晶片)(圖未示)。 Each device region 15 is further divided into a plurality of regions (here, 48 regions) with a plurality of intersecting scribe lines (scheduled division lines) 19, and devices such as ICs, LSIs, and LEDs are arranged in each region ( Device wafer) (not shown).
又，在金屬框體13的背面13b側設置有密封複數個器件之樹脂21。如圖3(C)所示，樹脂21是形成為預定之厚度，並從金屬框體13之背面13b突出。藉由此樹脂21，使各器件區域15的整個背面13b側被覆蓋。 Further, a resin 21 is provided on the back surface 13b side of the metal frame 13 to seal a plurality of devices. As shown in FIG. 3 (C), the resin 21 is formed to a predetermined thickness and protrudes from the back surface 13b of the metal frame body 13. With this resin 21, the entire back surface 13b side of each device region 15 is covered.
如圖3(A)所示，在金屬框體13的表面13a側設置有對應於各器件之複數個載台23。各載台23的周圍形成有複數個電極墊(圖未示)。 As shown in FIG. 3 (A), a plurality of stages 23 corresponding to each device are provided on the surface 13a side of the metal frame body 13. A plurality of electrode pads (not shown) are formed around each stage 23.
此板狀物11是例如，從金屬框體13的背面13b側將器件配置於各載台23上，並在以金屬線(圖未示)等連接各器件之電極和配置於載台23的周圍的電極墊之後，以樹脂21密封背面13b側而得到。藉由沿著切割道19分割此板狀物11，可以形成已用樹脂密封的複數個晶片。 This plate-shaped object 11 is, for example, a device arranged on each stage 23 from the back surface 13b side of the metal frame 13 and an electrode connected to each device with a metal wire (not shown) or the like and arranged on the stage 23 The surrounding electrode pad was obtained by sealing the back surface 13b side with resin 21. By dividing the plate 11 along the dicing path 19, a plurality of wafers which have been sealed with a resin can be formed.
圖4(A)是模式地顯示保持治具34的平面圖，圖4(B)是模式地顯示載置於基座32之上表面32a之狀態的保持治具34的圖。如圖4(A)及圖4(B)所示，保持治具34是形成為大致矩形的平板狀，且其上表面成為吸引保持板狀物11的保持面34a。 FIG. 4 (A) is a plan view schematically showing the holding jig 34, and FIG. 4 (B) is a diagram showing the holding jig 34 in a state of being placed on the upper surface 32a of the base 32. As shown in FIGS. 4 (A) and 4 (B), the holding jig 34 is formed into a substantially rectangular flat plate shape, and the upper surface thereof is a holding surface 34a that attracts and holds the plate-like object 11.
在保持面34a上形成有對應於板狀物11之切割道19的退刀溝34c。藉由此退刀溝34c，將保持治具34之保持面34a區劃成與板狀物11所分割出之各晶片對應的複數個區域。 The holding surface 34 a is formed with an undercut groove 34 c corresponding to the cutting path 19 of the plate-like object 11. As a result of the retracting groove 34c, the holding surface 34a of the holding jig 34 is divided into a plurality of areas corresponding to each wafer divided by the plate-like object 11.
退刀溝34c之寬度比切削刀的寬度還要寬，且退刀溝34c的深度比切削刀的切入深度還要深。因此，沿著切割道19切削板狀物11時，即使將切削刀切入地較深，切削刀也不會與保持治具34相干涉。再者，是將保持治具34形成為比退刀溝34c的深度還要厚。 The width of the undercut groove 34c is wider than the width of the cutter, and the depth of the undercut groove 34c is deeper than the cutting depth of the cutter. Therefore, when cutting the plate-shaped object 11 along the cutting path 19, the cutting blade does not interfere with the holding jig 34 even if the cutting blade is cut deep. In addition, the holding jig 34 is formed to be thicker than the depth of the retracting groove 34c.
以退刀溝34c所區劃出的各區域中形成有上下貫通保持治具34而在保持面34a形成開口之細孔34d。如圖4(B)所示，當將保持治具34載置於基座32之上表面32a時，各細孔34d就會和形成於基座32之上表面32a側之中央部分的吸引口32b連接。 In each region defined by the undercut groove 34c, a small hole 34d is formed which penetrates the holding jig 34 up and down and forms an opening in the holding surface 34a. As shown in FIG. 4 (B), when the holding fixture 34 is placed on the upper surface 32a of the base 32, each of the small holes 34d and the suction opening formed in the central portion of the upper surface 32a side of the base 32 32b connection.
吸引口32b，是通過電磁閥36a而連接到吸引源38。因此，只要將板狀物11重疊於已載置於基座32之上表面32a之狀態的保持治具34的保持面34a上，且在將對應於板狀物11之各晶片的區域對齊各細孔34d之後打開電磁閥36a，就能夠以保持台30吸引保持板狀物11。 The suction port 32b is connected to a suction source 38 through a solenoid valve 36a. Therefore, as long as the plate-shaped object 11 is superposed on the holding surface 34a of the holding jig 34 in a state of being placed on the upper surface 32a of the base 32, the area corresponding to each wafer of the plate-shaped object 11 is aligned with each other. After opening the solenoid valve 36 a after the small hole 34 d, the holding plate 30 can be attracted and held by the holding table 30.
再者，基座32之上表面32a側的外周部分形成有用於將保持治具34裝設在基座32上之吸引口32c。此吸引口32c是通過電磁閥36b而連接著吸引源38。因此，只要使保持治具34的下表面34b接觸基座32之上表面32a，再打開電磁閥36b，就可以將保持治具34裝設在基座32之上表面32a上。 Furthermore, a suction port 32c for mounting the holding jig 34 on the base 32 is formed in an outer peripheral portion on the upper surface 32a side of the base 32. The suction port 32c is connected to a suction source 38 through a solenoid valve 36b. Therefore, as long as the lower surface 34b of the holding jig 34 contacts the upper surface 32a of the base 32, and then the solenoid valve 36b is opened, the holding jig 34 can be mounted on the upper surface 32a of the base 32.
如圖2所示，在基台24的上表面上，是將支撐切削板狀物11之切削單元(切削組件)40的門型的支撐構造42配置成跨越開口24a。支撐構造42的前面上部設置有使切削單元40在Y軸方向(分度進給方向)及Z軸方向(鉛直方向)上移動之切削單元移動機構(分度進給組件)44。 As shown in FIG. 2, on the upper surface of the base 24, a gate-shaped support structure 42 that supports a cutting unit (cutting unit) 40 of the cutting plate 11 is disposed so as to span the opening 24 a. A cutting unit moving mechanism (indexing feed unit) 44 for moving the cutting unit 40 in the Y-axis direction (indexing feed direction) and the Z-axis direction (vertical direction) is provided on the front upper portion of the support structure 42.
切削單元40具備有圓環狀之切削刀46，該切削刀46是裝設在構成與Y軸方向平行之旋轉軸的主軸(圖未示)之一端側。主軸的另一端側連結有馬達等旋轉驅動源(圖未示)，且切削刀46是藉由透過主軸從旋轉驅動源傳達之旋轉力而旋轉。 The cutting unit 40 is provided with an annular cutting blade 46 which is mounted on one end side of a main shaft (not shown) constituting a rotation axis parallel to the Y-axis direction. A rotary drive source (not shown) such as a motor is connected to the other end side of the spindle, and the cutter 46 is rotated by a rotational force transmitted from the rotary drive source through the spindle.
其次，針對使用本實施形態之保持治具生成裝置2之保持治具生成方法進行說明。在本實施形態之保持治具生成方法中，首先，實施將板狀物11之固有資訊登錄到保持治具生成裝置2上的登錄步驟。 Next, a holding jig generating method using the holding jig generating device 2 of this embodiment will be described. In the holding jig generating method of this embodiment, first, a registration step of registering the unique information of the plate-like object 11 to the holding jig generating device 2 is performed.
在此登錄步驟中，會將下列資訊分別輸入螢幕16：板狀物11之X軸方向及Y軸方向的大小的資訊、由板狀物11所分割出之晶片在X軸方向及Y軸方向上的大小資訊，以及在X軸方向及Y軸方向上各自在板狀物11上排列之晶片的 數量的資訊。 In this registration step, the following information is input to the screen 16: the size information of the X-axis and Y-axis directions of the plate 11 and the X-axis and Y-axis directions of the wafer divided by the plate 11 And the size information of the wafers, and the wafers arranged on the plate 11 in the X-axis direction and the Y-axis direction, respectively. Quantity of information.
例如，在圖3(A)、圖3(B)及圖3(C)所示之板狀物11上，是形成為在被吸引保持在保持治具34上的狀態下，在X軸方向上排列有6個×3的晶片，在Y軸方向上排列有8個晶片。因此，就會將在X軸方向上為6個×3，在Y軸方向上為8個，各自作為晶片的數量的資訊輸入到螢幕16。所輸入的資訊會作為板狀物11的固有資訊而被記憶在固有資訊記憶部14b中。 For example, the plate-shaped object 11 shown in FIG. 3 (A), FIG. 3 (B), and FIG. 3 (C) is formed so that it may be attracted and held on the holding jig 34 in the X-axis direction. Six x 3 wafers are arranged on the wafer, and eight wafers are arranged in the Y-axis direction. Therefore, 6 × 3 in the X-axis direction and 8 in the Y-axis direction are input to the screen 16 as the number of chips. The input information is stored in the unique information storage unit 14b as the unique information of the plate-like object 11.
實施過登錄步驟之後，會實施生成保持治具34之設計資訊的設計資訊生成步驟。在此設計資訊生成步驟中，是根據記憶於基本資訊記憶部14a之保持治具34的基本資訊，和記憶於固有資訊記憶部14b之板狀物11的固有資訊，來使設計資訊生成部14c生成保持治具34的設計資訊。 After the registration step is performed, a design information generation step of generating design information of the holding fixture 34 is performed. In this design information generation step, the design information generation unit 14c is made based on the basic information stored in the holding jig 34 stored in the basic information storage unit 14a and the plate-shaped object 11 stored in the unique information storage unit 14b. Design information of the holding fixture 34 is generated.
再者，在基本資訊記憶部14a中，會事先將保持治具34之細孔34d的資訊、退刀溝34c的資訊，以及保持治具34之厚度的資訊作為基本資訊而先記憶起來。這些資訊，因為與板狀物11之設計無關而且是共通的，因此幾乎沒有變更的必要。 Further, in the basic information storage unit 14a, the information of the pores 34d of the fixture 34, the information of the retracting groove 34c, and the information of the thickness of the fixture 34 are stored as basic information in advance. Since this information is irrelevant to the design of the plate 11 and is common, there is almost no need to change it.
具體來說，設計資訊生成部14c是根據晶片之X軸方向及Y軸方向中的大小的資訊，以及在X軸方向及Y軸方向上各自排列之晶片的數量的資訊，來決定退刀溝34c的配置(條數、間隔等)。又，設計資訊生成部14c是根據板狀物11之X軸方向及Y軸方向中的大小的資訊來設定保持治具34的外形。此外，設計資訊生成部14c是根據晶片之X軸 方向及Y軸方向中的大小的資訊來設定細孔34d的孔徑。 Specifically, the design information generating unit 14c determines the retraction groove based on the size information in the X-axis direction and the Y-axis direction of the wafer, and the information on the number of wafers respectively arranged in the X-axis direction and the Y-axis direction. 34c configuration (number, interval, etc.). The design information generating unit 14c sets the external shape of the holding jig 34 based on the size information in the X-axis direction and the Y-axis direction of the plate-like object 11. The design information generating unit 14c is based on the X-axis of the chip. The information of the size in the direction and the Y-axis direction sets the hole diameter of the pore 34d.
在已實施設計資訊生成步驟之後，就可以實施根據設計資訊而以3維印表機4生成保持治具34的保持治具生成步驟。所生成之保持治具34，可以在上述之切削裝置2上使用。 After the design information generation step has been performed, the holding jig generation step of generating the holding jig 34 by the 3D printer 4 based on the design information can be performed. The generated holding jig 34 can be used in the cutting device 2 described above.
如以上所述，因為本實施形態之保持治具生成裝置2，是以設計資訊生成部(設計資訊生成組件)14c從已記憶於基本資訊記憶部(基本資訊記憶組件)14a中的保持治具34的基本資訊和已記憶於固有資訊記憶部(固有資訊記憶組件)14b中的板狀物11的固有資訊，來生成保持治具34的設計資訊，並根據此設計資訊而以3維印表機4生成保持治具34，因此可以低成本且短時間地生產用於保持板狀物11之保持治具34。 As described above, the holding jig generating device 2 of this embodiment is a holding jig that has been stored in the basic information storage unit (basic information storage unit) 14a by the design information generation unit (design information generation unit) 14c. The basic information of 34 and the inherent information of the plate 11 that has been stored in the inherent information storage unit (inherent information storage unit) 14b are used to generate the design information of the holding fixture 34, and based on this design information, it is printed in three dimensions. Since the machine 4 generates the holding jig 34, the holding jig 34 for holding the plate 11 can be produced at low cost and in a short time.
再者，本發明並不受限於上述實施形態之記載，並可進行各種變更而實施。例如，在上述實施形態中，雖然是以相同材料形成整個保持治具，但是也可以用不同的材料形成與板狀物接觸之保持面和保持治具的本體。此時，可以用硬度低的材料形成保持面，且用硬度高的材料形成保持治具的本體。 In addition, this invention is not limited to the description of the said embodiment, Various changes can be implement | achieved. For example, in the above embodiment, although the entire holding jig is formed of the same material, the holding surface contacting the plate and the main body of the holding jig may be formed of different materials. In this case, the holding surface may be formed of a material having a low hardness, and the body of the holding jig may be formed of a material having a high hardness.
又，在上述實施形態中，雖然是使用已事先記憶於基本資訊記憶部(基本資訊記憶組件)之基本資訊來生成保持治具的設計資訊，但是基本資訊也可以在每次生成保持治具時進行登錄。此時，即使構造並非一般之保持治具也可以容易地生成。 In the above embodiment, the design information of the holding fixture is generated using the basic information stored in the basic information storage unit (basic information storage unit) in advance. However, the basic information may be generated each time the holding fixture is generated. Log in. In this case, even if the structure is not a general holding jig, it can be easily produced.
又，在上述實施形態中，雖然是根據晶片的X軸方向及Y軸方向中之大小的資訊來設定細孔的孔徑，但細孔的孔徑也可以作為保持治具的基本資訊而事先記憶在基本資訊記憶部(基本資訊記憶組件)中。又，也可以將複數個器件區域15的距離和位置等事先記憶到基本資訊記憶部(基本資訊記憶組件)等中。 In the above embodiment, although the pore diameter is set based on the size information in the X-axis direction and the Y-axis direction of the wafer, the pore diameter can also be stored in advance as basic information for holding the jig. In the basic information storage unit (basic information storage unit). Further, the distances, positions, and the like of the plurality of device regions 15 may be stored in advance in a basic information storage unit (basic information storage unit) and the like.
另外，上述實施形態之構成、方法等，只要在不脫離本發明之目的之範圍內，均可適當變更而實施。 In addition, the configuration, method, and the like of the above embodiments can be appropriately modified and implemented as long as they do not depart from the purpose of the present invention.
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| CN101339575A (en) * | 2008-08-07 | 2009-01-07 | 上海交通大学 | Three-dimensional visualized process design system and its design method |
| TW201118939A (en) * | 2009-11-26 | 2011-06-01 | Disco Corp | Cutting apparatus and cutting method |
| JP2011114145A (en) * | 2009-11-26 | 2011-06-09 | Disco Abrasive Syst Ltd | Cutting device and cutting method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016030409A (en) | 2016-03-07 |
| TW201608624A (en) | 2016-03-01 |
| KR102275110B1 (en) | 2021-07-07 |
| JP6370148B2 (en) | 2018-08-08 |
| KR20160015153A (en) | 2016-02-12 |
| CN105313334B (en) | 2019-04-26 |
| CN105313334A (en) | 2016-02-10 |
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