TWI661006B - Silicone composition having excellent heat radiation property - Google Patents
Silicone composition having excellent heat radiation property Download PDFInfo
- Publication number
- TWI661006B TWI661006B TW106140083A TW106140083A TWI661006B TW I661006 B TWI661006 B TW I661006B TW 106140083 A TW106140083 A TW 106140083A TW 106140083 A TW106140083 A TW 106140083A TW I661006 B TWI661006 B TW I661006B
- Authority
- TW
- Taiwan
- Prior art keywords
- siloxane
- composition
- siloxane composition
- heat radiation
- item
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本發明有關於在熱輻射方面係優異的一種矽氧烷組合物，其應用於電子產品及類似物。 The invention relates to a siloxane composition excellent in heat radiation, which is applied to electronic products and the like.
Description
本發明有關於一種矽氧烷組合物(silicone composition)，用於改善一電子產品的熱輻射特性(heat radiation property)。 The invention relates to a silicone composition for improving the heat radiation property of an electronic product.
電子產品基本上在使用期間會產生熱。近來，電子產品已被製造地更輕且更小，但由於在相同面積交換大量資訊而會產生更多的熱。 Electronic products basically generate heat during use. Recently, electronic products have been made lighter and smaller, but they generate more heat due to the exchange of large amounts of information in the same area.
因此，為合適地維持一電子產品的性能，係需要移除此電子產品中所產生的熱。特別地，積體電路裝置(integrated circuit devices)，例如使用於桌上型電腦的中央處理器(central processing units，CPUs)與圖形處理單元(graphics processing units，GPUs)、筆記型電腦及類似物，由於操作頻率的加速而增加所產生的熱的量，使得熱輻射的量測係成為一重要議題。 Therefore, in order to properly maintain the performance of an electronic product, it is necessary to remove the heat generated in the electronic product. In particular, integrated circuit devices are, for example, central processing units (CPUs) and graphics processing units (GPUs), notebook computers and the like used in desktop computers, The increase in the amount of heat generated due to the acceleration of the operating frequency makes the measurement system of heat radiation an important issue.
已提出各種方法以移除電子產品中所產生的熱。此一種方法的一例子中，將一導熱材料(thermally conductive materials)，例如是一熱傳導潤滑脂(thermally conductive grease)、一熱傳導性片狀 物(thermally conductive sheet)與一熱傳導性黏著劑(thermally conductive adhesive)，提供在例如是電子產品中的電子元件與散熱器之數個構件之間，以提升此電子產品的熱輻射特性。 Various methods have been proposed to remove heat generated in electronic products. In one example of this method, a thermally conductive material, such as a thermally conductive grease, a thermally conductive sheet, A thermally conductive sheet and a thermally conductive adhesive are provided between, for example, an electronic component in an electronic product and several components of a heat sink to improve the heat radiation characteristics of the electronic product.
此情況下，以導熱材料來說，已知將例如是氧化鋅粉末或氧化鋁粉末之填料與矽油混合於熱輻射組成物中。亦已知將除了氧化鋅粉末與氧化鋁粉末之外的另一填料加入至矽油而成的組成物、或將例如鑽石、氮化硼或具有高導電性的奈米碳管的填料加入至矽油而成的組成物。 In this case, it is known that a filler such as zinc oxide powder or aluminum oxide powder is mixed with silicone oil in a heat radiation composition as a heat conductive material. It is also known to add a composition other than zinc oxide powder and alumina powder to silicone oil, or to add a filler such as diamond, boron nitride, or a nano-carbon tube with high conductivity to silicone oil. And made up of the composition.
然而，此一導熱材料可藉由包括各種填料來改善一電子產品的熱輻射特性，但高含量的填料可能劣化此導熱材料的流動性與處理性(handleability)等，使得當實際應用此導熱材料於一電子產品時而具有許多限制。 However, this thermally conductive material can improve the heat radiation characteristics of an electronic product by including various fillers. However, a high content of the filler may deteriorate the fluidity and handleability of the thermally conductive material, so that when the thermally conductive material is actually applied There are many restrictions on an electronic product from time to time.
[先前技術文件(Prior Art Document)] [Prior Art Document]
[專利文件] [Patent Document]
韓國專利公告號2004-0059034 Korean Patent Bulletin No. 2004-0059034
本發明之一方面提供一種矽氧烷組合物，除了熱輻射特性，還具有優異的流動性與處理性(handleability)等。 According to one aspect of the present invention, a siloxane composition is provided which has excellent fluidity and handleability in addition to heat radiation characteristics.
本發明提供一種矽氧烷組合物，包括具有0.1至1莫耳百分比(mol%)的與一矽原子形成鍵結的一烷氧基(alkoxy group)的含量的一矽氧烷巨分子單體(silicone macromer)、氧化矽與一填料。此填 料包括二種或更多種選自由氧化鋅、氧化鋁與氮化鋁所組成之群組中的成分。 The present invention provides a siloxane composition comprising a monosiloxane macromonomer having a content of an alkoxy group bound to a silicon atom of 0.1 to 1 mol% (mol%). (silicone macromer), silica and a filler. This fill The material includes two or more ingredients selected from the group consisting of zinc oxide, aluminum oxide, and aluminum nitride.
此矽氧烷巨分子單體可具有在25℃的溫度下之10至50毫帕˙秒(mPa．s)的黏度。 The siloxane macromonomer may have a viscosity of 10 to 50 milliPascal second (mPa.s) at a temperature of 25 ° C.
此矽氧烷巨分子單體可以是由以下化學式1所表示的一化合物。 The siloxane macromonomer may be a compound represented by the following Chemical Formula 1.
化學式1中，n係8至48的一整數。 In Chemical Formula 1, n is an integer of 8 to 48.
氧化鋅(a)、氧化鋁(b)與氮化鋁(c)的混合比例(a：b：c)可以是1：1.20~1.45：0~0.6的重量比例。 The mixing ratio (a: b: c) of zinc oxide (a), aluminum oxide (b), and aluminum nitride (c) may be a weight ratio of 1: 1.20 to 1.45: 0 to 0.6.
此氧化鋅可具有等於或小於3微米的平均粒徑(D50)。 This zinc oxide may have an average particle diameter (D 50 ) of 3 μm or less.
此氧化鋁可具有等於或小於5微米的平均粒徑(D50)。 This alumina may have an average particle diameter (D 50 ) of 5 μm or less.
此氮化鋁可具有等於或小於5微米的平均粒徑(D50)。 This aluminum nitride may have an average particle diameter (D 50 ) of 5 μm or less.
此矽氧烷組合物可更包括一調色劑(toning agent)。 The silicone composition may further include a toning agent.
將說明本發明之例示性實施例。 An exemplary embodiment of the present invention will be described.
本發明之一矽氧烷組合物包括一矽氧烷巨分子單體、氧化矽與一填料。 A silicone composition according to the present invention includes a silicone macromonomer, silicon oxide, and a filler.
本發明之矽氧烷組合物所包括的矽氧烷巨分子單體賦予此矽氧烷組合物流動性，以改善此矽氧烷組合物的處理性(handleability)與加工性等。此矽氧烷巨分子單體可具有0.1至1莫耳百分比(mol%)的一烷氧基(alkoxy group)的含量(具體來說，是指在所有官能基中，與矽原子形成鍵結的烷氧基的比例)，具體來說，0.4至0.6莫耳百分比。當此烷氧基的含量係小於上述範圍，可能增加此矽氧烷組合物的黏度，或是可能劣化熱輻射特性；當此烷氧基的含量超過上述範圍，由於具有低分子量的成分的分離與揮發而可能下降此矽氧烷組合物的可靠度。 The siloxane macromonomer included in the siloxane composition of the present invention imparts fluidity to the siloxane composition to improve the handleability and processability of the siloxane composition. The siloxane macromonomer may have an alkoxy group content of 0.1 to 1 mole percent (mol%) (specifically, it means that in all functional groups, a bond is formed with a silicon atom Ratio of alkoxy groups), specifically 0.4 to 0.6 mole percentage. When the content of the alkoxy group is less than the above range, the viscosity of the siloxane composition may be increased, or the heat radiation characteristics may be deteriorated. When the content of the alkoxy group exceeds the above range, due to the separation of components with low molecular weight And the volatility may decrease the reliability of this silicone composition.
考量此矽氧烷組合物的流動性，此矽氧烷巨分子單體可在25℃的溫度下具有10至50毫帕˙秒(mPa．s)的黏度。當此矽氧烷巨分子單體的黏度係小於10毫帕˙秒，由於此矽氧烷巨分子單體與此填料的不良混合性質(mixing property)，此矽氧烷巨分子單體與此填料係可能互相分離；當黏度超過50毫帕˙秒，由於流動性的缺乏而難以含有高含量的填料，而可能劣化此矽氧烷組合物的熱輻射特性。具體來說，此矽氧烷巨分子單體的黏度在25℃的溫度下可以是12至42毫帕˙秒，更具體來說，22至23毫帕˙秒。 Considering the fluidity of the siloxane composition, the siloxane macromonomer can have a viscosity of 10 to 50 milliPascal seconds (mPa.s) at a temperature of 25 ° C. When the viscosity of the silicone macromonomer is less than 10 mPa · s, due to the poor mixing property of the silicone macromonomer and the filler, the silicone macromonomer is not compatible with the filler. The filler systems may be separated from each other; when the viscosity exceeds 50 mPa · s, it is difficult to contain a high content of filler due to lack of fluidity, which may degrade the heat radiation characteristics of the silicone composition. Specifically, the viscosity of the siloxane macromonomer may be 12 to 42 mPa · s at 25 ° C., more specifically, 22 to 23 mPa · s.
此矽氧烷巨分子單體可以是由以下化學式1所表示的一化合物。 The siloxane macromonomer may be a compound represented by the following Chemical Formula 1.
化學式1中，n係8至48的一整數。具體來說，n可以是10 至40的一整數，更具體來說可以是20至30的一整數。 In Chemical Formula 1, n is an integer of 8 to 48. Specifically, n can be 10 An integer from 40 to 40, more specifically an integer from 20 to 30.
本發明之矽氧烷組合物中所包括的氧化矽可防止此矽氧烷巨分子單體與水氣接觸，並改善此矽氧烷組合物的耐久性(機械強度)。此氧化矽可具有195至250公尺2/克(m2/g)的比表面積。可使用以一矽氮烷化合物(silazane compound)進行表面處理(surface-treated)的一氧化矽來確保分散性。當氧化矽的比表面積係超出上述範圍，可能劣化氧化矽的分散性與流動性。同時，此矽氮烷化合物的特定例子可包括六亞甲基二矽氮烷(hexamethylene disilazane，HMDZ)及類似物。 The silicon oxide included in the silicone composition of the present invention can prevent the silicone macromonomer from coming into contact with water vapor, and improve the durability (mechanical strength) of the silicone composition. This silicon oxide may have a specific surface area of 195 to 250 meters 2 / gram (m 2 / g). Dispersion can be ensured by using silicon oxide surface-treated with a silazane compound. When the specific surface area of the silicon oxide exceeds the above range, the dispersibility and fluidity of the silicon oxide may be deteriorated. Meanwhile, specific examples of the silazane compound may include hexamethylene disilazane (HMDZ) and the like.
考量此矽氧烷組合物的流動性與熱輻射特性，基於此矽氧烷巨分子單體的100重量份，此氧化矽的含量可以是1至5重量份。當氧化矽的含量係超出上述範圍，可能劣化耐久性或分散性。 Considering the fluidity and heat radiation characteristics of the siloxane composition, based on 100 parts by weight of the siloxane macromonomer, the content of the silicon oxide may be 1 to 5 parts by weight. When the content of silicon oxide is out of the above range, durability or dispersibility may be deteriorated.
本發明之矽氧烷組合物中所包括的填料包括二種或更多種選自由氧化鋅、氧化鋁與氮化鋁所組成之群組中的成分，並賦予此矽氧烷組合物導熱性以改善此矽氧烷組合物的熱輻射特性等。 The filler included in the silicone composition of the present invention includes two or more components selected from the group consisting of zinc oxide, aluminum oxide, and aluminum nitride, and imparts thermal conductivity to the silicone composition. In order to improve the heat radiation characteristics of the silicone composition.
特別地，本發明之矽氧烷組合物之用作填料的氧化鋅、氧化鋁與氮化鋁的粒徑係最佳化。甚至當此矽氧烷組合物含有高含量的填料時，仍可能降低使用此矽氧烷組合物的基板的接觸熱阻，而不會裂化此矽氧烷組合物的流動性。 In particular, the particle size of zinc oxide, aluminum oxide, and aluminum nitride used as fillers of the silicone composition of the present invention is optimized. Even when the silicone composition contains a high content of filler, it is possible to reduce the contact thermal resistance of the substrate using the silicone composition without cracking the fluidity of the silicone composition.
用作此填料的氧化鋅可具有等於或小於3微米的平均粒徑(D50)，具體來說，0.3至0.6微米。當氧化鋅的平均粒徑(D50)係超出上述範圍，可能降低此填料的填充率(filling rate)。 The zinc oxide used as this filler may have an average particle diameter (D 50 ) of 3 μm or less, specifically, 0.3 to 0.6 μm. When the average particle diameter (D 50 ) of the zinc oxide is out of the above range, the filling rate of the filler may be reduced.
基於此矽氧烷巨分子單體的100重量份，此氧化鋅的含量可 以是400至900重量份。當此氧化鋅的含量係超出上述範圍，係可能劣化此矽氧烷組合物的熱輻射特性。 Based on 100 parts by weight of this siloxane macromonomer, the content of this zinc oxide can be Therefore, it is 400 to 900 parts by weight. When the content of the zinc oxide is out of the above range, the thermal radiation characteristics of the siloxane composition may be deteriorated.
用作此填料的氧化鋁的平均粒徑(D50)可以是等於或小於5微米，具體來說等於或小於3微米，且形狀可以是球狀的。當氧化鋁的平均粒徑(D50)係超出上述範圍，係可能惡化此矽氧烷組合物的熱阻。 The average particle diameter (D 50 ) of alumina used as this filler may be 5 μm or less, specifically 3 μm or less, and the shape may be spherical. When the average particle diameter (D 50 ) of the alumina exceeds the above range, the thermal resistance of the siloxane composition may be deteriorated.
基於此矽氧烷巨分子單體的100重量份，此氧化鋁的含量可以是400至1,000重量份。當此氧化鋁的含量係超出上述範圍，係可能惡化此矽氧烷組合物的熱輻射特性與加工性。 The alumina content may be 400 to 1,000 parts by weight based on 100 parts by weight of the siloxane macromonomer. When the content of the alumina exceeds the above range, the heat radiation characteristics and processability of the siloxane composition may be deteriorated.
用作此填料的氮化鋁的可具有等於或小於5微米的平均粒徑(D50)，具體來說等於或小於1微米，且形狀可以是球狀的。當氮化鋁的平均粒徑(D50)係超出上述範圍，係可能惡化此矽氧烷組合物的熱阻。 The aluminum nitride used as this filler may have an average particle diameter (D 50 ) of 5 μm or less, specifically 1 μm or less, and the shape may be spherical. When the average particle diameter (D 50 ) of the aluminum nitride is out of the above range, the thermal resistance of the siloxane composition may be deteriorated.
基於此矽氧烷巨分子單體的100重量份，此氮化鋁的含量可以是100至300重量份。當此氮化鋁的含量係超出上述範圍，係可能惡化此矽氧烷組合物的加工性。 The content of the aluminum nitride may be 100 to 300 parts by weight based on 100 parts by weight of the siloxane macromonomer. When the content of the aluminum nitride exceeds the above range, the processability of the siloxane composition may be deteriorated.
當二或更多種的氧化鋅(a)、氧化鋁(b)與氮化鋁(c)之中係選擇作為填料並互相混合，其混合比例(a：b：c)可以是1：1.20~1.45：0~0.6的重量比例，具體來說可以是1：1.30~1.38：0.40~0.6的重量比例。當氧化鋅、氧化鋁與氮化鋁的混合比係超出上述範圍，係可能下降此矽氧烷組合物的導熱性，從而劣化此矽氧烷組合物的熱輻射特性。 When two or more kinds of zinc oxide (a), aluminum oxide (b) and aluminum nitride (c) are selected as fillers and mixed with each other, the mixing ratio (a: b: c) may be 1: 1.20 A weight ratio of ~ 1.45: 0 to 0.6, specifically a weight ratio of 1: 1.30 to 1.38: 0.40 to 0.6. When the mixing ratio of zinc oxide, aluminum oxide, and aluminum nitride is out of the above range, the thermal conductivity of the siloxane composition may be reduced, thereby deteriorating the heat radiation characteristics of the siloxane composition.
同時，本發明之矽氧烷組合物可更包括一調色劑(toning agent)以調整顏色。 At the same time, the silicone composition of the present invention may further include a toning agent to adjust the color.
本發明之矽氧烷組合物所包括的此調色劑賦予(impart)此矽 氧烷組合物顏色。此調色劑可包括碳黑、苯胺黑、鈦黑(titanium black)、乙炔黑、其混和物或類似物。考量此矽氧烷組合物的顏色、流動性與熱輻射特性，基於此矽氧烷巨分子單體的100重量份，此調色劑可以是0.5至1重量份。當此調色劑的含量係超出上述範圍，係可能劣化此矽氧烷組合物的絕緣性(insulation property)。 The toner included in the silicone composition of the present invention imparts the silicon Oxane composition color. This toner may include carbon black, aniline black, titanium black, acetylene black, a mixture thereof, or the like. Considering the color, fluidity, and heat radiation characteristics of the silicone composition, the toner may be 0.5 to 1 part by weight based on 100 parts by weight of the silicone macromonomer. When the content of the toner exceeds the above range, the insulation property of the siloxane composition may be deteriorated.
本發明之矽氧烷組合物可在25℃的溫度下具有10,000至70,000毫帕˙秒的黏度。本發明之矽氧烷組合物具有在上述範圍的黏度，因此其流動性係優異，且係可改善加工性，例如分散性(dispensability)與絲網印刷性(screen printability)。 The silicone composition of the present invention may have a viscosity of 10,000 to 70,000 mPa · s at a temperature of 25 ° C. The siloxane composition of the present invention has a viscosity in the above range, and therefore has excellent fluidity and can improve processability, such as dispersability and screen printability.
此外，本發明之矽氧烷組合物具有2.9瓦/米˙開爾文度(W/mK)或更大的高導熱性與低熱阻，而使當此矽氧烷組合物係應用於一加熱元件(例如，一電子產品)，係可能增加此加熱元件的熱輻射特性。 In addition, the silicone composition of the present invention has a high thermal conductivity and a low thermal resistance of 2.9 watts / meter Kelvin (W / mK) or more, so that when the silicone composition is applied to a heating element ( For example, an electronic product) may increase the heat radiation characteristics of the heating element.
以下，將根據實施例詳細說明本發明。然而，以下實施例係本發明之例示性實施例，且以下實施例並不限制本發明。 Hereinafter, the present invention will be described in detail based on examples. However, the following examples are exemplary embodiments of the present invention, and the following examples do not limit the present invention.
[實施例1][Example 1]
將每一成分稱重並加入至1-公升行星式攪拌機(1-liter planetary mixer)，然後在25℃的溫度下混合4小時以製備一矽氧烷組合物。此情況下，每一成分的組成係如表1所示，且每一成分的含量係基於矽氧烷巨分子單體的100重量份來稱重。此外，填料的平均粒徑係藉由使用由日機裝株式會社(Nikkiso Co.,Ltd)所製造的粒徑分析儀Micro-track MT3300EX來測量。 Each ingredient was weighed and added to a 1-liter planetary mixer, and then mixed at a temperature of 25 ° C. for 4 hours to prepare a monosiloxane composition. In this case, the composition of each component is shown in Table 1, and the content of each component is weighed based on 100 parts by weight of the siloxane macromonomer. In addition, the average particle diameter of the filler is measured by using a particle size analyzer Micro-track MT3300EX manufactured by Nikkiso Co., Ltd.
[實施例2至7][Examples 2 to 7]
除了使用下表1所示的組成物，係以如實施例1相同的方式來製備一矽氧烷組合物。 A monosiloxane composition was prepared in the same manner as in Example 1 except that the composition shown in Table 1 below was used.
[比較例1與2][Comparative Examples 1 and 2]
除了使用下表2所示的組成物，係以如實施例1相同的方式來製備一矽氧烷組合物。 A monosiloxane composition was prepared in the same manner as in Example 1 except that the composition shown in Table 2 below was used.
[實驗例][Experimental example]
所製備的矽氧烷組合物的物理性質係評估如下，其結果係下表3所示。 The physical properties of the prepared silicone composition were evaluated as follows, and the results are shown in Table 3 below.
1.比重：水的重量與此矽氧烷組合物的重量係藉由使用一比重杯(specific gravity cup)來測量，並藉由重量比來計算。 1. Specific Gravity: The weight of water and the weight of the siloxane composition are measured by using a specific gravity cup and calculated by the weight ratio.
2.顏色：係以目視觀察此矽氧烷組合物。 2. Color: This silicone composition is visually observed.
3.黏度：此矽氧烷組合物係置於25℃之溫度的一恆溫空間24小時，然後在剪切速率10(1/s)的黏度係藉由使用由Brickfield Company公司所製造的一流變儀粘度計(rheometer viscometer)來測量。 3. Viscosity: This silicone composition is placed in a constant temperature space at a temperature of 25 ° C for 24 hours, and then the viscosity at a shear rate of 10 (1 / s) is determined by using a first-class change made by Brickfield Company Rheometer viscometer.
4.導熱性：此矽氧烷組合物係注入用一廚房包裝(kitchen wrap)所覆蓋的一3公分厚的模具(3cm-thick mold)，然後係藉由使用由京都電子工業株式會社(Kyoto Denshi Kogyo Co.,Ltd)所製造的一熱導率計(QTM-500)來測量導熱性。 4. Thermal conductivity: This silicone composition is injected into a 3 cm-thick mold covered with a kitchen wrap, and then is used by Kyoto Electronics Industry Co., Ltd. (Kyoto A thermal conductivity meter (QTM-500) manufactured by Denshi Kogyo Co., Ltd) was used to measure the thermal conductivity.
5.熱阻：此矽氧烷組合物係放入明導國際公司(Mentor Graphics Company)的熱瞬態測試儀(T3-ster)與熱介面材料量測儀設備(Dyntim facilities)的一量測工具內，然後根據厚度測量其熱阻。 5. Thermal resistance: This siloxane composition is a measurement of thermal transient tester (T3-ster) and thermal interface material measuring instrument equipment (Dyntim facilities) of Mentor Graphics Company Inside the tool, then measure its thermal resistance based on thickness.
[表3]
請參照表3，可以確定的是，本發明之矽氧烷組合物具有優異的導熱性。 Referring to Table 3, it can be determined that the siloxane composition of the present invention has excellent thermal conductivity.
本發明之一矽氧烷組合物由於良好的流動性而可具有優異的處理性(handleability)與優異的加工性，且由於高導熱性與低接觸熱阻而展現優異的熱輻射特性。因此，當本發明之矽氧烷組合物係應用於加熱元件(例如電腦的圖形處理單元(GPUs)與中央處理器(CPUs)、車用電子(automotive electronics)中的電子控制單元(electronic control units，ECU)與換流器和電氣元件中的電源模組(power modules))，從加熱元件所產生的熱可有效地被傳導，以改善熱輻射特性。 One of the siloxane compositions of the present invention has excellent handleability and excellent processability due to good fluidity, and exhibits excellent heat radiation characteristics due to high thermal conductivity and low contact thermal resistance. Therefore, when the siloxane composition of the present invention is applied to heating elements (for example, computer graphics processing units (GPUs) and central processing units (CPUs), electronic control units in automotive electronics) , ECU) and inverters and power modules in electrical components, the heat generated from the heating elements can be effectively conducted to improve the heat radiation characteristics.
雖然本發明已以實施例顯示和說明，但本發明所屬技術領域中具有通常知識者當知，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been shown and described by embodiments, those with ordinary knowledge in the technical field to which the present invention pertains should know that various changes and modifications can be made without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.
Claims (6)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??10-2016-0154665 | 2016-11-21 | ||
| KR1020160154665A KR101864505B1 (en) | 2016-11-21 | 2016-11-21 | Silicone composition having excellent heat-radiating function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201825596A TW201825596A (en) | 2018-07-16 |
| TWI661006B true TWI661006B (en) | 2019-06-01 |
Family
ID=62145164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106140083A TWI661006B (en) | 2016-11-21 | 2017-11-20 | Silicone composition having excellent heat radiation property |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR101864505B1 (en) |
| CN (1) | CN109906249A (en) |
| MY (1) | MY192453A (en) |
| TW (1) | TWI661006B (en) |
| WO (1) | WO2018093030A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020093258A1 (en) | 2018-11-07 | 2020-05-14 | Dow Global Technologies Llc | Thermally conductive composition and methods and devices in which said composition is used |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201000559A (en) * | 2008-05-27 | 2010-01-01 | Dow Corning Toray Co Ltd | Thermally conductive silicone composition and electronic device |
| KR20100079046A (en) * | 2008-12-30 | 2010-07-08 | 남동진 | Heat-dissipating resin composition comprising siloxane compounds |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3900267B2 (en) * | 2002-05-09 | 2007-04-04 | 信越化学工業株式会社 | Room temperature curable organopolysiloxane composition |
| KR100891974B1 (en) | 2002-12-27 | 2009-04-08 | 주식회사 엘지생활건강 | Anti-irritating cosmetic composition |
| EP1878767A1 (en) * | 2006-07-12 | 2008-01-16 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone grease composition and cured product thereof |
| JP4572243B2 (en) * | 2008-03-27 | 2010-11-04 | 信越化学工業株式会社 | Thermally conductive laminate and method for producing the same |
| JP5667740B2 (en) * | 2008-06-18 | 2015-02-12 | 東レ・ダウコーニング株式会社 | Curable organopolysiloxane composition and semiconductor device |
| KR20110121881A (en) * | 2010-05-03 | 2011-11-09 | 주식회사 케이씨씨 | Silicone composition having excellent long-term storage stability and heat-radiating function |
| JP5619487B2 (en) * | 2010-06-24 | 2014-11-05 | 東レ・ダウコーニング株式会社 | Thermally conductive silicone grease composition |
| GB201212782D0 (en) * | 2012-07-18 | 2012-08-29 | Dow Corning | Organosiloxane compositions |
| CN104583325B (en) * | 2013-08-02 | 2016-11-09 | 株式会社大赛璐 | Hardening resin composition and use its semiconductor device |
| WO2015111409A1 (en) * | 2014-01-27 | 2015-07-30 | Dow Corning Toray Co., Ltd. | Silicone gel composition |
-
2016
- 2016-11-21 KR KR1020160154665A patent/KR101864505B1/en active IP Right Grant
-
2017
- 2017-09-12 WO PCT/KR2017/010010 patent/WO2018093030A1/en active Application Filing
- 2017-09-12 CN CN201780068534.XA patent/CN109906249A/en active Pending
- 2017-09-12 MY MYPI2019002002A patent/MY192453A/en unknown
- 2017-11-20 TW TW106140083A patent/TWI661006B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201000559A (en) * | 2008-05-27 | 2010-01-01 | Dow Corning Toray Co Ltd | Thermally conductive silicone composition and electronic device |
| KR20100079046A (en) * | 2008-12-30 | 2010-07-08 | 남동진 | Heat-dissipating resin composition comprising siloxane compounds |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109906249A (en) | 2019-06-18 |
| KR101864505B1 (en) | 2018-06-29 |
| TW201825596A (en) | 2018-07-16 |
| MY192453A (en) | 2022-08-21 |
| WO2018093030A1 (en) | 2018-05-24 |
| KR20180056838A (en) | 2018-05-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4933094B2 (en) | Thermally conductive silicone grease composition | |
| EP3299419B1 (en) | Thermally conductive composition | |
| TWI667291B (en) | Thermally conductive fluorenone composition | |
| JP2009096961A (en) | Heat-conductive silicone grease composition excellent in reworkability | |
| WO2018131486A1 (en) | Thermally conductive resin composition, heat dissipation sheet, heat dissipation member and method for producing same | |
| CN101775216A (en) | High thermal conducting organic silicon composite and producing method thereof | |
| CN107177345A (en) | A kind of heat conduction Silica hydrogel and preparation method | |
| KR20110122484A (en) | Silicone polymer composition having an excellent heat-radiating function | |
| JP7047199B1 (en) | Thermally conductive grease composition | |
| EP4069781A1 (en) | Highly thermally conductive flowable silicone composition | |
| JP7015424B1 (en) | Thermally conductive silicone grease composition and its manufacturing method | |
| TWI661006B (en) | Silicone composition having excellent heat radiation property | |
| KR101775288B1 (en) | Silicone composition having excellent long-term storage stability and heat-radiating function | |
| TWI816100B (en) | Thermal conductive silicone composition | |
| WO2006043334A1 (en) | Silicone composition for heat dissipation | |
| KR20110121881A (en) | Silicone composition having excellent long-term storage stability and heat-radiating function | |
| JP2012052137A (en) | Heat conductive silicone grease composition | |
| WO2022215292A1 (en) | Thermally conductive grease composition | |
| JP7220812B2 (en) | Trialkoxy-functional branched siloxane composition | |
| Kumaresan et al. | Synthesis of dispensable PDMS/Al2O3/GO thermal gap filler and performance comparison with commercial thermal gap fillers for electronics packaging applications | |
| WO2022099432A1 (en) | Aluminum nitride filled thermally conductive silicone composition | |
| TW202409203A (en) | Heat-conducting silicon composition and application thereof | |
| WO2024024498A1 (en) | Thermally conductive silicone composition and production method therefor | |
| JP2004342758A (en) | Heat dissipating sheet | |
| CN117693552A (en) | Heat conductive silicone composition |