MY192453A - Silicone composition having excellent heat dissipation properties - Google Patents
Silicone composition having excellent heat dissipation propertiesInfo
- Publication number
- MY192453A MY192453A MYPI2019002002A MYPI2019002002A MY192453A MY 192453 A MY192453 A MY 192453A MY PI2019002002 A MYPI2019002002 A MY PI2019002002A MY PI2019002002 A MYPI2019002002 A MY PI2019002002A MY 192453 A MY192453 A MY 192453A
- Authority
- MY
- Malaysia
- Prior art keywords
- heat dissipation
- excellent heat
- silicone composition
- dissipation properties
- properties
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Abstract
The present invention relates to a silicone composition having excellent heat dissipation properties and being applicable to an electronic product and the like.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160154665A KR101864505B1 (en) | 2016-11-21 | 2016-11-21 | Silicone composition having excellent heat-radiating function |
PCT/KR2017/010010 WO2018093030A1 (en) | 2016-11-21 | 2017-09-12 | Silicone composition having excellent heat dissipation properties |
Publications (1)
Publication Number | Publication Date |
---|---|
MY192453A true MY192453A (en) | 2022-08-21 |
Family
ID=62145164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2019002002A MY192453A (en) | 2016-11-21 | 2017-09-12 | Silicone composition having excellent heat dissipation properties |
Country Status (5)
Country | Link |
---|---|
KR (1) | KR101864505B1 (en) |
CN (1) | CN109906249A (en) |
MY (1) | MY192453A (en) |
TW (1) | TWI661006B (en) |
WO (1) | WO2018093030A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11851603B2 (en) | 2018-11-07 | 2023-12-26 | Dow Silicones Corporation | Thermally conductive composition and methods and devices in which said composition is used |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3900267B2 (en) * | 2002-05-09 | 2007-04-04 | 信越化学工業株式会社 | Room temperature curable organopolysiloxane composition |
KR100891974B1 (en) | 2002-12-27 | 2009-04-08 | 주식회사 엘지생활건강 | Anti-irritating cosmetic composition |
EP1878767A1 (en) * | 2006-07-12 | 2008-01-16 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone grease composition and cured product thereof |
JP4572243B2 (en) * | 2008-03-27 | 2010-11-04 | 信越化学工業株式会社 | Thermally conductive laminate and method for producing the same |
JP5507059B2 (en) * | 2008-05-27 | 2014-05-28 | 東レ・ダウコーニング株式会社 | Thermally conductive silicone composition and electronic device |
JP5667740B2 (en) * | 2008-06-18 | 2015-02-12 | 東レ・ダウコーニング株式会社 | Curable organopolysiloxane composition and semiconductor device |
KR100999973B1 (en) * | 2008-12-30 | 2010-12-13 | 남동진 | Heat-dissipating resin composition comprising siloxane compounds |
KR20110121881A (en) * | 2010-05-03 | 2011-11-09 | 주식회사 케이씨씨 | Silicone composition having excellent long-term storage stability and heat-radiating function |
JP5619487B2 (en) * | 2010-06-24 | 2014-11-05 | 東レ・ダウコーニング株式会社 | Thermally conductive silicone grease composition |
GB201212782D0 (en) * | 2012-07-18 | 2012-08-29 | Dow Corning | Organosiloxane compositions |
JP5736525B1 (en) * | 2013-08-02 | 2015-06-17 | 株式会社ダイセル | Curable resin composition and semiconductor device using the same |
WO2015111409A1 (en) * | 2014-01-27 | 2015-07-30 | Dow Corning Toray Co., Ltd. | Silicone gel composition |
-
2016
- 2016-11-21 KR KR1020160154665A patent/KR101864505B1/en active IP Right Grant
-
2017
- 2017-09-12 WO PCT/KR2017/010010 patent/WO2018093030A1/en active Application Filing
- 2017-09-12 CN CN201780068534.XA patent/CN109906249A/en active Pending
- 2017-09-12 MY MYPI2019002002A patent/MY192453A/en unknown
- 2017-11-20 TW TW106140083A patent/TWI661006B/en active
Also Published As
Publication number | Publication date |
---|---|
CN109906249A (en) | 2019-06-18 |
TWI661006B (en) | 2019-06-01 |
KR101864505B1 (en) | 2018-06-29 |
WO2018093030A1 (en) | 2018-05-24 |
KR20180056838A (en) | 2018-05-30 |
TW201825596A (en) | 2018-07-16 |
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