TWI660374B - Shunt resistor and method for manufacturing the same - Google Patents
Shunt resistor and method for manufacturing the same Download PDFInfo
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- TWI660374B TWI660374B TW107114927A TW107114927A TWI660374B TW I660374 B TWI660374 B TW I660374B TW 107114927 A TW107114927 A TW 107114927A TW 107114927 A TW107114927 A TW 107114927A TW I660374 B TWI660374 B TW I660374B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
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Abstract
一種分流電阻器及其製造方法。此分流電阻器包含電阻板體、第一電極板體以及第二電極板體。電阻板體具有相對第一側面與第二側面，第一側面設有至少一第一拼接部，第二側面設有至少一第二拼接部。第一電極板體熔接在電阻板體之第一側面。第一電極板體設有至少一第一接合部，且第一接合部與第一拼接部對應拼接結合。第二電極板體熔接在電阻板體之第二側面。第二電極板體設有至少一第二接合部，且第二接合部與第二拼接部對應拼接結合。 A shunt resistor and a manufacturing method thereof. The shunt resistor includes a resistance plate body, a first electrode plate body, and a second electrode plate body. The resistance plate body has a first side and a second side opposite to each other. The first side is provided with at least one first splicing portion, and the second side is provided with at least one second splicing portion. The first electrode plate body is welded to the first side surface of the resistance plate body. The first electrode plate body is provided with at least one first joint portion, and the first joint portion and the first splicing portion are correspondingly spliced and combined. The second electrode plate body is welded to the second side surface of the resistance plate body. The second electrode plate body is provided with at least one second joint portion, and the second joint portion and the second splicing portion are correspondingly spliced together.
Description
本發明是有關於一種電阻器，且特別是有關於一種具模組化結構之分流電阻器(shunt resistor)及其製造方法。 The present invention relates to a resistor, and more particularly, to a shunt resistor with a modular structure and a manufacturing method thereof.
製造分流電阻器時，一般係利用電子束焊接(E-beam welding)、熱接縫熔接(seam welding)、或雷射焊接(laser beam welding)等技術來結合高導電電極材與電阻合金材，而形成電阻複合材。再藉由裁切與沖壓(punch)電阻複合材來形成多個分流電阻器的初模型。然後，利用調整阻值機台對分流電阻器的初模型進行阻值調整，使分流電阻器的阻值精準化。 When manufacturing shunt resistors, technologies such as E-beam welding, seam welding, or laser beam welding are generally used to combine highly conductive electrode materials with resistance alloy materials. A resistive composite is formed. An initial model of a plurality of shunt resistors is formed by cutting and punching the resistive composite material. Then, the resistance value adjustment of the initial model of the shunt resistor is performed by using the resistance adjusting machine to make the resistance of the shunt resistor accurate.
然而，利用電子束焊接技術熔接電阻複合材時，須全程在真空下焊接，因此焊接加工成本高。電阻複合材經沖壓後的剩餘部分，因其是高導電電極材與電阻合金材的複合材，不易回收再利用。此外，電子束焊接時易產生材料噴濺現象，如此一來不僅會影響電阻合金材的本體，導致分流電阻器之阻值控制不易，也會在分流電阻器的表面形成 孔洞及/或噴濺突起物，而致使分流電阻器的外觀不佳。而且，焊接時，若電子束深度沒有調整適當，會形成很明顯的焊道，如此將導致分流電阻器的阻值不好控制。再者，沖壓時會使得電阻複合材內的應力產生變化，而導致分流電阻器的阻值改變。因此，利用電子束焊接技術所製成之分流電阻器須耗費很多時間進行修阻。 However, when the resistance composite material is welded by the electron beam welding technology, it must be welded under vacuum throughout, so the welding processing cost is high. The remaining part of the resistance composite material after stamping is not easy to recycle because it is a composite material of a highly conductive electrode material and a resistance alloy material. In addition, the material spray phenomenon is easy to occur during electron beam welding. This will not only affect the body of the resistance alloy material, cause the resistance control of the shunt resistor to be difficult, but also form on the surface of the shunt resistor. Holes and / or sprayed protrusions make the appearance of the shunt resistor poor. Moreover, if the electron beam depth is not adjusted properly during welding, a very obvious bead will be formed, which will cause the resistance of the shunt resistor to be difficult to control. Furthermore, the stress in the resistance composite material changes during stamping, which causes the resistance value of the shunt resistor to change. Therefore, the shunt resistor made by the electron beam welding technology must spend a lot of time to repair the resistance.
利用雷射上下對位熔接電阻複合材時，雷射光常有忽大忽小的情況，如此將導致焊道外觀差，並造成分流電阻器的阻值控制不易。此外，雷射焊接技術也有材料剩餘部分不易回收再利用與阻值修整耗時的缺點。 When using the laser to position the welding resistance composite material up and down, the laser light is often slightly larger or smaller, which will cause the appearance of the bead to be poor and the resistance control of the shunt resistor difficult. In addition, the laser welding technology also has the disadvantages that the remaining part of the material is not easy to recycle and time-consuming.
因此，本發明之一目的就是在提供一種分流電阻器及其製造方法，其先將高導電電極材與電阻合金材分別製成可以互相拼接成電阻器模組的電極板體與電阻板體，再透過加壓緊實與通高電流的方式，使電阻器模組之拼接處的異質界面熔接而形成分流電阻器。由於在製作電阻板體時，可先精算其阻值，因此分流電阻器之阻值精確度較高，可大幅縮減分流電阻器之阻值修整時間，有效提高產能。 Therefore, an object of the present invention is to provide a shunt resistor and a manufacturing method thereof. First, a highly conductive electrode material and a resistance alloy material are respectively made into an electrode plate body and a resistance plate body that can be spliced into a resistor module. Then, the heterogeneous interface at the splicing position of the resistor module is welded to form a shunt resistor by means of pressure, compaction and high current. Because the resistance value can be calculated accurately when making the resistance plate, the resistance accuracy of the shunt resistor is high, which can greatly reduce the trimming time of the shunt resistor and effectively increase the productivity.
本發明之另一目的是在提供一種分流電阻器及其製造方法，其電極材與電阻材個別經模組化，因此電極材與電阻材的材料利用率高，電極材與電阻材的剩餘部分回收簡易，且分流電阻器可根據使用需求而具有多樣化的外型。 Another object of the present invention is to provide a shunt resistor and a manufacturing method thereof. The electrode material and the resistance material are individually modularized. Therefore, the material utilization of the electrode material and the resistance material is high, and the remainder of the electrode material and the resistance material The recycling is simple, and the shunt resistor can have various appearances according to the needs of use.
本發明之又一目的是在提供一種分流電阻器及其製造方法，其可將多個電阻器模組依序排列於傳送機構上，並利用耐高溫的導電模組串聯這些電阻器模組，透過對電阻器模組二側端同時施壓，並加電流熔接的方式，可一次生產出大量的分流電阻器，而可大大地提升生產效率。 Another object of the present invention is to provide a shunt resistor and a manufacturing method thereof, which can sequentially arrange a plurality of resistor modules on a transmission mechanism, and use high-temperature-resistant conductive modules in series to connect these resistor modules. By simultaneously applying pressure to both ends of the resistor module and applying current welding, a large number of shunt resistors can be produced at one time, and the production efficiency can be greatly improved.
根據本發明之上述目的，提出一種分流電阻器。此分流電阻器包含電阻板體、第一電極板體、以及第二電極板體。電阻板體具有相對之第一側面與第二側面，第一側面設有至少一第一拼接部，且第二側面設有至少一第二拼接部。第一電極板體熔接在電阻板體之第一側面，其中第一電極板體設有至少一第一接合部，且第一接合部與第一拼接部對應拼接結合。第二電極板體熔接在電阻板體之第二側面，其中第二電極板體設有至少一第二接合部，且第二接合部與第二拼接部對應拼接結合。 According to the above object of the present invention, a shunt resistor is proposed. The shunt resistor includes a resistance plate body, a first electrode plate body, and a second electrode plate body. The resistance plate body has a first side and a second side opposite to each other. The first side is provided with at least a first splicing portion, and the second side is provided with at least a second splicing portion. The first electrode plate body is welded to the first side surface of the resistance plate body. The first electrode plate body is provided with at least a first joint portion, and the first joint portion and the first splicing portion are correspondingly spliced and combined. The second electrode plate body is welded to the second side of the resistance plate body, wherein the second electrode plate body is provided with at least a second joint portion, and the second joint portion and the second splicing portion are correspondingly spliced and combined.
依據本發明之一實施例，上述第一拼接部與第二拼接部均為凹陷部，第一接合部與第二接合部均為凸出部。或者，第一拼接部與第二拼接部均為凸出部，第一接合部與第二接合部均為凹陷部。 According to an embodiment of the present invention, the first splicing portion and the second splicing portion are both recessed portions, and the first joint portion and the second joint portion are both convex portions. Alternatively, the first splicing portion and the second splicing portion are both convex portions, and the first joining portion and the second joining portion are both recessed portions.
依據本發明之一實施例，上述之第一拼接部與第二拼接部之形狀彼此不同，且第一接合部與第二接合部之形狀彼此不同。 According to an embodiment of the present invention, the shapes of the first splicing portion and the second splicing portion are different from each other, and the shapes of the first joining portion and the second joining portion are different from each other.
根據本發明之上述目的，另提出一種分流電阻器之製造方法。在此方法中，提供電阻板體、第一電極板體、以及第二電極板體，其中電阻板體具有相對之第一側面與第 二側面，第一側面設有至少一第一拼接部，第二側面設有至少一第二拼接部，且第一電極板體設有至少一第一接合部，第二電極板體設有至少一第二接合部。對應拼接第一接合部與第一拼接部、以及對應拼接第二接合部與第二拼接部，以將第一電極板體預結合於電阻板體之第一側面、以及將第二電極板體預結合於第二側面。對第一電極板體與第二電極板體進行壓合步驟，以使第一電極板體與電阻板體之第一側面貼合而形成第一拼接接面、以及使第二電極板體與電阻板體之第二側面貼合而形成第二拼接接面。經由第一電極板體與第二電極板體對第一電極板體、第二電極板體與電阻板體施加電流，以使第一電極板體與電阻板體在第一拼接接面處熔接、以及使第二電極板體與電阻板體在第二拼接接面處熔接。 According to the above object of the present invention, another method for manufacturing a shunt resistor is proposed. In this method, a resistive plate body, a first electrode plate body, and a second electrode plate body are provided, wherein the resistive plate body has a first side surface opposite to a first Two sides, the first side is provided with at least a first splicing portion, the second side is provided with at least a second splicing portion, and the first electrode plate body is provided with at least a first joint portion, and the second electrode plate body is provided with at least one A second joint. The first joint portion and the first joint portion are spliced correspondingly, and the second joint portion and the second joint portion are spliced correspondingly, so as to pre-bond the first electrode plate body to the first side of the resistance plate body, and the second electrode plate body. Pre-bonded on the second side. A pressing step is performed on the first electrode plate body and the second electrode plate body, so that the first electrode plate body and the first side surface of the resistor plate are adhered to form a first splicing surface, and the second electrode plate body and The second side surface of the resistor plate is bonded to form a second splicing surface. A current is applied to the first electrode plate body, the second electrode plate body, and the resistance plate body through the first electrode plate body and the second electrode plate body, so that the first electrode plate body and the resistance plate body are welded at the first splicing surface. And welding the second electrode plate body and the resistance plate body at the second splicing surface.
依據本發明之一實施例，上述對第一電極板體、第二電極板體與電阻板體施加電流係在惰性氣體環境下進行。 According to an embodiment of the present invention, the application of the current to the first electrode plate body, the second electrode plate body, and the resistance plate body is performed under an inert gas environment.
依據本發明之一實施例，上述係利用第一高導電模組與第二高導電模組分別壓合在第一電極板體與第二電極板體上來進行壓合步驟，以及利用電源經由第一高導電模組與第二高導電模組對第一電極板體、第二電極板體與電阻板體施加電流。 According to an embodiment of the present invention, the foregoing is performed by using the first high-conductivity module and the second high-conductivity module to be pressed on the first electrode plate body and the second electrode plate body, respectively, and using a power source via the first A high-conductivity module and a second high-conductivity module apply current to the first electrode plate body, the second electrode plate body, and the resistance plate body.
依據本發明之一實施例，上述對第一電極板體、第二電極板體與電阻板體施加電流時，分流電阻器之製 造方法更包含將第一電極板體與第二電極板體分別置於第一導熱底座與第二導熱底座上。 According to an embodiment of the present invention, when the current is applied to the first electrode plate body, the second electrode plate body, and the resistance plate body, the shunt resistor is manufactured. The manufacturing method further includes placing the first electrode plate body and the second electrode plate body on the first heat conducting base and the second heat conducting base, respectively.
根據本發明之上述目的，更提出一種分流電阻器之製造方法。在此方法中，將複數個電阻器模組置於傳送機構上，其中每個電阻器模組包含電阻板體、第一電極板體與第二電極板體，電阻板體具有相對之第一側面與第二側面，第一電極板體拼接於電阻板體之第一側面，第二電極板體拼接於電阻板體之第二側面。經由每個電阻器模組之第一電極板體與第二電極板體對每個電阻器模組進行壓合步驟，以使每個電阻器模組之第一電極板體與電阻板體之第一側面貼合而形成第一拼接接面、以及使第二電極板體與電阻板體之第二側面貼合而形成第二拼接接面。經由每個電阻器模組之第一電極板體與第二電極板體對這些電阻器模組施加電流，以使每個電阻器模組之第一電極板體與電阻板體在第一拼接接面處熔接、以及使每個電阻器模組之第二電極板體與電阻板體在第二拼接接面處熔接。 According to the above object of the present invention, a method for manufacturing a shunt resistor is further provided. In this method, a plurality of resistor modules are placed on the transfer mechanism, wherein each resistor module includes a resistance plate body, a first electrode plate body and a second electrode plate body, and the resistance plate body has a first On the side and the second side, the first electrode plate is spliced to the first side of the resistance plate, and the second electrode plate is spliced to the second side of the resistance plate. Compressing each resistor module through the first electrode plate body and the second electrode plate body of each resistor module, so that the first electrode plate body and the resistor plate body of each resistor module The first side surface is bonded to form a first splicing surface, and the second electrode plate body and the second side surface of the resistance plate body are bonded to form a second splicing surface. A current is applied to these resistor modules through the first electrode plate body and the second electrode plate body of each resistor module, so that the first electrode plate body and the resistance plate body of each resistor module are spliced at the first time. Welding at the interface, and welding the second electrode plate body and the resistor plate body of each resistor module at the second splicing surface.
依據本發明之一實施例，上述之電阻器模組具有相對之第一側端與第二側端，且這些電阻器模組係利用位於這些電阻器模組之第一側端之複數個第一碳棒板與位於這些電阻器模組之第二側端之複數個第二碳棒板串接，或者係利用位於這些電阻器模組之第一側端之複數個第一鎢棒板與位於這些電阻器模組之第二側端之複數個第二鎢棒板串接。對這些電阻器模組進行壓合步驟包含利用加壓模從這些電阻器模組之第一側端與第二側端壓合第一碳棒板與第 二碳棒板，或者從這些電阻器模組之第一側端與第二側端壓合第一鎢棒板與第二鎢棒板。 According to an embodiment of the present invention, the above-mentioned resistor module has opposite first side ends and second side ends, and the resistor modules use a plurality of first resistors located on the first side ends of the resistor modules. A carbon rod plate is connected in series with a plurality of second carbon rod plates located at the second side ends of the resistor modules, or a plurality of first tungsten rod plates located at the first side ends of the resistor modules and A plurality of second tungsten rod plates located at the second side ends of the resistor modules are connected in series. The pressing step of the resistor modules includes pressing a first carbon rod plate and a first carbon rod plate from the first side end and the second side end of the resistor modules by using a pressure die. Two carbon rod plates, or a first tungsten rod plate and a second tungsten rod plate are pressed from the first side end and the second side end of these resistor modules.
依據本發明之一實施例，上述對這些電阻器模組施加電流時係在惰性氣體環境下進行。 According to an embodiment of the present invention, the application of current to the resistor modules is performed under an inert gas environment.
100‧‧‧分流電阻器 100‧‧‧ shunt resistor
100a‧‧‧分流電阻器 100a‧‧‧ shunt resistor
100b‧‧‧分流電阻器 100b‧‧‧ shunt resistor
100c‧‧‧分流電阻器 100c‧‧‧ shunt resistor
110‧‧‧電阻板體 110‧‧‧ resistance plate
110a‧‧‧電阻板體 110a‧‧‧ resistance plate
110b‧‧‧電阻板體 110b‧‧‧ resistance plate
110c‧‧‧電阻板體 110c‧‧‧ resistance plate
112‧‧‧第一側面 112‧‧‧First side
112a‧‧‧第一側面 112a‧‧‧First side
112b‧‧‧第一側面 112b‧‧‧First side
112c‧‧‧第一側面 112c‧‧‧First side
114‧‧‧第二側面 114‧‧‧ second side
114a‧‧‧第二側面 114a‧‧‧second side
114b‧‧‧第二側面 114b‧‧‧ second side
114c‧‧‧第二側面 114c‧‧‧Second side
116‧‧‧第一拼接部 116‧‧‧The first splicing department
116a‧‧‧第一拼接部 116a‧‧‧First stitching department
116b‧‧‧第一拼接部 116b‧‧‧The first splicing department
116c‧‧‧第一拼接部 116c‧‧‧The first splicing department
118‧‧‧第二拼接部 118‧‧‧Second Splicing Department
118a‧‧‧第二拼接部 118a‧‧‧Second Splicing Department
118b‧‧‧第二拼接部 118b‧‧‧Second Splicing Department
118c‧‧‧第二拼接部 118c‧‧‧Second Splicing Department
120‧‧‧第一電極板體 120‧‧‧First electrode plate body
120a‧‧‧第一電極板體 120a‧‧‧first electrode plate
120b‧‧‧第一電極板體 120b‧‧‧first electrode plate
120c‧‧‧第一電極板體 120c‧‧‧First electrode plate body
122‧‧‧側面 122‧‧‧ side
122a‧‧‧側面 122a‧‧‧ side
122b‧‧‧側面 122b‧‧‧ side
122c‧‧‧側面 122c‧‧‧ side
124‧‧‧第一接合部 124‧‧‧first joint
124a‧‧‧第一接合部 124a‧‧‧first joint
124b‧‧‧第一接合部 124b‧‧‧first joint
124c‧‧‧第一接合部 124c‧‧‧First joint
130‧‧‧第二電極板體 130‧‧‧Second electrode plate body
130a‧‧‧第二電極板體 130a‧‧‧Second electrode plate body
130b‧‧‧第二電極板體 130b‧‧‧Second electrode plate body
130c‧‧‧第二電極板體 130c‧‧‧Second electrode plate body
132‧‧‧側面 132‧‧‧ side
132a‧‧‧側面 132a‧‧‧ side
132b‧‧‧側面 132b‧‧‧ side
132c‧‧‧側面 132c‧‧‧ side
134‧‧‧第二接合部 134‧‧‧Second junction
134a‧‧‧第二接合部 134a‧‧‧Second junction
134b‧‧‧第二接合部 134b‧‧‧Second junction
134c‧‧‧第二接合部 134c‧‧‧Second junction
200‧‧‧電阻板體 200‧‧‧ resistance plate
202‧‧‧第一側面 202‧‧‧First side
204‧‧‧第二側面 204‧‧‧ second side
206‧‧‧第一拼接部 206‧‧‧The first splicing department
208‧‧‧第二拼接部 208‧‧‧Second Splicing Department
210‧‧‧第一電極板體 210‧‧‧First electrode plate body
212‧‧‧側面 212‧‧‧side
214‧‧‧第一接合部 214‧‧‧first joint
216‧‧‧第一拼接接面 216‧‧‧The first splicing interface
220‧‧‧第二電極板體 220‧‧‧Second electrode plate
222‧‧‧側面 222‧‧‧side
224‧‧‧第二接合部 224‧‧‧Second Joint
226‧‧‧第二拼接接面 226‧‧‧Second splicing interface
230‧‧‧壓力 230‧‧‧ pressure
240‧‧‧電源 240‧‧‧ Power
242‧‧‧第一導線 242‧‧‧First Lead
244‧‧‧第二導線 244‧‧‧Second Lead
250‧‧‧第一高導電模組 250‧‧‧The first high conductivity module
252‧‧‧第二高導電模組 252‧‧‧The second highest conductive module
260‧‧‧分流電阻器 260‧‧‧ shunt resistor
260a‧‧‧電阻器模組 260a‧‧‧ Resistor Module
262‧‧‧第一側端 262‧‧‧first side
264‧‧‧第二側端 264‧‧‧second side
270‧‧‧惰性氣體 270‧‧‧ inert gas
280‧‧‧第一導熱底座 280‧‧‧The first thermal base
282‧‧‧第二導熱底座 282‧‧‧Second heat conduction base
300‧‧‧步驟 300‧‧‧ steps
310‧‧‧步驟 310‧‧‧step
320‧‧‧步驟 320‧‧‧ steps
330‧‧‧步驟 330‧‧‧step
400‧‧‧傳送機構 400‧‧‧ delivery agency
402‧‧‧方向 402‧‧‧direction
410‧‧‧壓力 410‧‧‧pressure
420‧‧‧第一高導電模組 420‧‧‧The first high conductivity module
422‧‧‧第二高導電模組 422‧‧‧Second highest conductive module
430‧‧‧加壓模 430‧‧‧Pressure mold
440‧‧‧電源 440‧‧‧ Power
442‧‧‧第一導線 442‧‧‧ the first wire
444‧‧‧第二導線 444‧‧‧Second Lead
500‧‧‧步驟 500‧‧‧ steps
510‧‧‧步驟 510‧‧‧step
520‧‧‧步驟 520‧‧‧step
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之說明如下：〔圖1〕係繪示依照本發明之第一實施方式的一種分流電阻器的剖面示意圖；〔圖2A〕係繪示依照本發明之第二實施方式的一種分流電阻器的上視示意圖；〔圖2B〕係繪示沿著圖2A之AA剖面線剖切所獲得之分流電阻器的剖面示意圖；〔圖3A〕係繪示依照本發明之第三實施方式的一種分流電阻器的上視示意圖；〔圖3B〕係繪示沿著圖3A之BB剖面線剖切所獲得之分流電阻器的剖面示意圖；〔圖4〕係繪示依照本發明之第四實施方式的一種分流電阻器的裝置立體示意圖；〔圖5〕係繪示依照本發明之一實施方式的一種製造分流電阻器的裝置示意圖； 〔圖6〕係繪示依照本發明之一實施方式的一種製造分流電阻器的流程圖；〔圖7〕係繪示依照本發明之另一實施方式的一種製造分流電阻器的裝置示意圖；以及〔圖8〕係繪示依照本發明之另一實施方式的一種製造分流電阻器的流程圖。 In order to make the above and other objects, features, advantages, and embodiments of the present invention more comprehensible, the description of the drawings is as follows: [FIG. 1] A shunt resistor according to a first embodiment of the present invention [Fig. 2A] is a schematic top view of a shunt resistor according to a second embodiment of the present invention; [Fig. 2B] is a shunt obtained by cutting along the AA section line of Fig. 2A A cross-sectional schematic diagram of a resistor; [FIG. 3A] is a schematic top view of a shunt resistor according to a third embodiment of the present invention; [FIG. 3B] is a schematic diagram obtained by cutting along a BB section line of FIG. 3A [FIG. 4] is a schematic perspective view showing a device of a shunt resistor according to a fourth embodiment of the present invention; [FIG. 5] is a view showing a manufacturing method according to an embodiment of the present invention Device diagram of shunt resistor; [FIG. 6] A flowchart showing a method for manufacturing a shunt resistor according to an embodiment of the present invention; [FIG. 7] A diagram showing a device for manufacturing a shunt resistor according to another embodiment of the present invention; and [FIG. 8] FIG. 8 is a flowchart of manufacturing a shunt resistor according to another embodiment of the present invention.
請參照圖1，其係繪示依照本發明之第一實施方式的一種分流電阻器的剖面示意圖。在本實施例中，分流電阻器100主要包含電阻板體110、以及第一電極板體120與第二電極板體130。可利用沖壓電阻合金材的方式製作出具有所需形狀與阻值的電阻板體110。電阻板體110之材料包括但不限於為錳銅錫(MnCuSn)合金、錳銅鎳(MnCuNi)合金、錳銅(MnCu)合金、鎳鉻鋁(NiCrAl)合金、鎳鉻鋁矽(NiCrAlSi)合金、與鐵鉻鋁(FeCrAl)合金。 Please refer to FIG. 1, which is a schematic cross-sectional view of a shunt resistor according to a first embodiment of the present invention. In this embodiment, the shunt resistor 100 mainly includes a resistance plate body 110, and a first electrode plate body 120 and a second electrode plate body 130. The resistance plate body 110 having a desired shape and resistance value can be manufactured by punching a resistance alloy material. The material of the resistance plate body 110 includes, but is not limited to, a manganese copper tin (MnCuSn) alloy, a manganese copper nickel (MnCuNi) alloy, a manganese copper (MnCu) alloy, a nickel chromium aluminum (NiCrAl) alloy, and a nickel chromium aluminum silicon (NiCrAlSi) alloy. , And iron chromium aluminum (FeCrAl) alloy.
電阻板體110包含彼此相對之第一側面112與第二側面114，其中第一側面112設有至少一個第一拼接部116，第二側面114設有至少一個第二拼接部118。第一側面112設置的第一拼接部116與第二側面114設置的第二拼接部118的形狀可彼此相同，亦可彼此不同。舉例而言，如圖1所示，第一拼接部116與第二拼接部118具有實質相同的形狀。此外，第一拼接部116與第二拼接部118可為分別凹設於第一側面112與第二側面114的兩個凹陷部。第一拼接 部116與第二拼接部118亦可為分別凸設於第一側面112與第二側面114的兩個凸出部。在一些特定例子中，第一拼接部116與第二拼接部118之形態可彼此不同，例如第一拼接部116與第二拼接部118之其中一者為凹陷部，另一者為凸出部。 The resistance plate body 110 includes a first side surface 112 and a second side surface 114 opposite to each other. The first side surface 112 is provided with at least one first splicing portion 116 and the second side surface 114 is provided with at least one second splicing portion 118. The shapes of the first splicing portion 116 provided on the first side 112 and the second splicing portion 118 provided on the second side 114 may be the same or different from each other. For example, as shown in FIG. 1, the first splicing portion 116 and the second splicing portion 118 have substantially the same shape. In addition, the first splicing portion 116 and the second splicing portion 118 may be two recessed portions recessed in the first side surface 112 and the second side surface 114, respectively. First splicing The portion 116 and the second splicing portion 118 may also be two protruding portions respectively protruding from the first side surface 112 and the second side surface 114. In some specific examples, the shapes of the first stitching portion 116 and the second stitching portion 118 may be different from each other. For example, one of the first stitching portion 116 and the second stitching portion 118 is a recessed portion, and the other is a protruding portion. .
第一電極板體120與第二電極板體130可為利用沖壓導電電極材的方式而形成具有所需形狀的電極。第一電極板體120與第二電極板體130為分流電阻器100給電流與量電壓之處。第一電極板體120與第二電極板體130之材料為高導電材料，例如銅。第一電極板體120具有側面122，且第一電極板體120之側面122可熔接於電阻板體110之第一側面112。第一電極板體120之側面122設有至少一第一接合部124。第一電極板體120之第一接合部124的數量與電阻板體110之第一側面112的第一拼接部116的數量相同，且第一接合部124的位置與第一拼接部116的位置對應，第一接合部124與第一拼接部116的形狀互補而可與第一拼接部116對應拼接結合。對應於第一拼接部116之形狀，第一接合部124可為凸設於第一電極板體120之側面122的凸出部。在第一拼接部116為凸出部的例子中，第一接合部124可為凹設於第一電極板體120之側面122的凹陷部。 The first electrode plate body 120 and the second electrode plate body 130 may be formed into electrodes having a desired shape by punching a conductive electrode material. The first electrode plate body 120 and the second electrode plate body 130 are where the shunt resistor 100 supplies current and voltage. The material of the first electrode plate body 120 and the second electrode plate body 130 is a highly conductive material, such as copper. The first electrode plate body 120 has a side surface 122, and the side surface 122 of the first electrode plate body 120 can be welded to the first side surface 112 of the resistance plate body 110. The side surface 122 of the first electrode plate body 120 is provided with at least one first joint portion 124. The number of the first joint portions 124 of the first electrode plate body 120 is the same as the number of the first joint portions 116 of the first side surface 112 of the resistor plate body 110, and the positions of the first joint portions 124 and the positions of the first joint portions 116 are the same. Correspondingly, the shapes of the first joint portion 124 and the first splicing portion 116 are complementary, and the first splicing portion 116 can be spliced and combined with the first splicing portion 116 correspondingly. Corresponding to the shape of the first splicing portion 116, the first bonding portion 124 may be a protruding portion protruding from the side surface 122 of the first electrode plate body 120. In the example where the first splicing portion 116 is a protruding portion, the first joint portion 124 may be a recessed portion recessed in the side surface 122 of the first electrode plate body 120.
第二電極板體130具有側面132，且第二電極板體130之側面132可熔接於電阻板體110之第二側面114。第二電極板體130之側面132設有至少一第二接合部134。第 二電極板體130之第二接合部134的數量與電阻板體110之第二側面114的第二拼接部118的數量相同，且第二接合部134的位置與第二拼接部118的位置對應，第二接合部134與第二拼接部118的形狀互補而可與第二拼接部118對應拼接結合。第二接合部134可為凸設於第二電極板體130之側面132的凸出部，或者可為凹設於第二電極板體130之側面132的凹陷部，視第二拼接部118的形狀而改變。 The second electrode plate body 130 has a side surface 132, and the side surface 132 of the second electrode plate body 130 can be welded to the second side surface 114 of the resistance plate body 110. The side surface 132 of the second electrode plate body 130 is provided with at least one second joint portion 134. First The number of the second joint portions 134 of the two electrode plate body 130 is the same as the number of the second joint portions 118 of the second side surface 114 of the resistor plate body 110, and the positions of the second joint portions 134 correspond to the positions of the second joint portions 118. The shapes of the second joint portion 134 and the second splicing portion 118 are complementary and can be spliced and combined correspondingly with the second splicing portion 118. The second joint portion 134 may be a convex portion protruding from the side surface 132 of the second electrode plate body 130, or may be a concave portion recessed from the side surface 132 of the second electrode plate body 130. Shape.
第一電極板體120的第一接合部124與第二電極板體130的第二接合部134的形狀可彼此相同，亦可彼此不同。舉例而言，如圖1所示，第一接合部124與第二接合部134具有實質相同的形狀。第一接合部124與第二接合部134之形態可彼此不同，例如第一接合部124與第二接合部134之其中一者為凹陷部，另一者為凸出部，視電阻板體110上對應拼接之第一拼接部116與第二拼接部118的形態而定。 The shapes of the first joint portion 124 of the first electrode plate body 120 and the second joint portion 134 of the second electrode plate body 130 may be the same as each other or different from each other. For example, as shown in FIG. 1, the first joint portion 124 and the second joint portion 134 have substantially the same shape. The shapes of the first bonding portion 124 and the second bonding portion 134 may be different from each other. For example, one of the first bonding portion 124 and the second bonding portion 134 is a recessed portion, and the other is a protruding portion. The shapes of the first splicing portion 116 and the second splicing portion 118 corresponding to the upper stitching are determined.
在本實施方式中，電阻板體110之第一側面112與第一電極板體120之側面122熔接，且電阻板體110之第一拼接部116與第一電極板體120之第二接合部124亦熔接在一起，藉此第一電極板體120可黏合在電阻板體110之第一側面112上。電阻板體110之第二側面114與第二電極板體130之側面132熔接，且電阻板體110之第二拼接部118與第二電極板體130之第二接合部134亦熔接在一起，藉此第二電極板體130可黏合在電阻板體110之第二側面114上，而構成分流電阻器100。由於沖壓出之電阻板體110的 電阻值與分流電阻器100所需電阻值差異不大，且無需再經沖壓切分，因此於第一電極板體120與第二電極板體130和電阻板體110熔接後，僅需小修分流電阻器100之初模型的電阻值。 In this embodiment, the first side surface 112 of the resistance plate body 110 and the side surface 122 of the first electrode plate body 120 are welded, and the first splicing portion 116 of the resistance plate body 110 and the second joint portion of the first electrode plate body 120 are fused. 124 is also welded together, whereby the first electrode plate body 120 can be adhered to the first side surface 112 of the resistance plate body 110. The second side surface 114 of the resistance plate body 110 is fused to the side surface 132 of the second electrode plate body 130, and the second splicing portion 118 of the resistance plate body 110 and the second joint portion 134 of the second electrode plate body 130 are also fused together. As a result, the second electrode plate body 130 can be adhered to the second side surface 114 of the resistance plate body 110 to form a shunt resistor 100. Because of the stamped resistance plate 110 The difference between the resistance value and the resistance value required by the shunt resistor 100 is not large, and there is no need to cut through the punching. Therefore, after the first electrode plate body 120 is welded to the second electrode plate body 130 and the resistance plate body 110, only a small repair is required to shunt the current. The resistance value of the initial model of the resistor 100.
請參照圖2A與圖2B，其中圖2A係繪示依照本發明之第二實施方式的一種分流電阻器的上視示意圖，圖2B係繪示沿著圖2A之AA剖面線剖切所獲得之分流電阻器的剖面示意圖。本實施方式之分流電阻器100a與上述之分流電阻器100之架構類似，二者之間的差異在於電阻板體110a之第一拼接部116a與第二拼接部118a的形狀分別不同於電阻板體110之第一拼接部116與第二拼接部118，且第一電極板體120a之第一接合部124a與第二電極板體130a之第二接合部134a分別不同於第一電極板體120之第一接合部124與第二電極板體130之第二接合部134。 Please refer to FIG. 2A and FIG. 2B, where FIG. 2A is a schematic top view of a shunt resistor according to a second embodiment of the present invention, and FIG. 2B is a diagram obtained by cutting along a section line AA in FIG. 2A A schematic cross-sectional view of a shunt resistor. The structure of the shunt resistor 100a in this embodiment is similar to that of the shunt resistor 100 described above. The difference between the two is that the shapes of the first splicing portion 116a and the second splicing portion 118a of the resistance plate body 110a are different from those of the resistance plate body. The first splicing portion 116 and the second splicing portion 118 of 110, and the first joining portion 124a of the first electrode plate body 120a and the second joining portion 134a of the second electrode plate body 130a are different from those of the first electrode plate body 120, respectively. The first joint portion 124 and the second joint portion 134 of the second electrode plate body 130.
在分流電阻器100a中，電阻板體110a之第一拼接部116a與第二拼接部118a為凸起部，且第一拼接部116a凸設於電阻板體110a之第一側面112a，第二拼接部118a凸設於電阻板體110a之第二側面114a。第一拼接部116a與第二拼接部118a之上視形狀可為倒T字形。對應於電阻板體110a之第一拼接部116a與第二拼接部118a，第一接合部124a與第二接合部134a為凹陷部，且第一接合部124a凹入第一電極板體120a之側面122a，第二接合部134a凹入第二電極板體130a之側面132a。在較佳實施例中，如圖2B所示，第一接合部124a並未貫穿電極板體120a，第二接合部 134a並未貫穿電極板體130a，電阻板體110a之第一拼接部116a與第二拼接部118a分別設置在第一接合部124a與第二接合部134a中且由第一電極板體120a與第二電極板體130a所承載。 In the shunt resistor 100a, the first splicing portion 116a and the second splicing portion 118a of the resistance plate body 110a are convex portions, and the first splicing portion 116a is protruded from the first side surface 112a and the second splicing of the resistance plate body 110a. The portion 118a is protruded from the second side surface 114a of the resistance plate body 110a. The first splicing part 116a and the second splicing part 118a may have an inverted T shape when viewed from above. The first splicing portion 116a and the second splicing portion 118a corresponding to the resistance plate body 110a, the first bonding portion 124a and the second bonding portion 134a are recessed portions, and the first bonding portion 124a is recessed into the side of the first electrode plate body 120a. 122a, the second joint portion 134a is recessed into the side surface 132a of the second electrode plate body 130a. In a preferred embodiment, as shown in FIG. 2B, the first bonding portion 124a does not penetrate the electrode plate body 120a, and the second bonding portion 134a does not penetrate the electrode plate body 130a. The first splicing portion 116a and the second splicing portion 118a of the resistance plate body 110a are respectively disposed in the first joint portion 124a and the second joint portion 134a, and the first electrode plate body 120a and the first Carried by the two electrode plate body 130a.
請參照圖3A與圖3B，其中圖3A係繪示依照本發明之第三實施方式的一種分流電阻器的上視示意圖，圖3B係繪示沿著圖3A之BB剖面線剖切所獲得之分流電阻器的剖面示意圖。本實施方式之分流電阻器100b與上述之分流電阻器100a之架構類似，二者之間的差異在於電阻板體110b之第一拼接部116b與第二拼接部118b的形狀分別不同於電阻板體110a之第一拼接部116a與第二拼接部118a，且第一電極板體120b之第一接合部124b與第二電極板體130b之第二接合部134b分別不同於第一電極板體120a之第一接合部124a與第二電極板體130a之第二接合部134a。 Please refer to FIG. 3A and FIG. 3B, where FIG. 3A is a schematic top view of a shunt resistor according to a third embodiment of the present invention, and FIG. 3B is a diagram obtained by cutting along a BB section line of FIG. 3A A schematic cross-sectional view of a shunt resistor. The structure of the shunt resistor 100b in this embodiment is similar to that of the shunt resistor 100a described above. The difference between the two is that the shapes of the first splicing portion 116b and the second splicing portion 118b of the resistance plate body 110b are different from those of the resistance plate body. The first splicing portion 116a and the second splicing portion 118a of 110a, and the first joining portion 124b of the first electrode plate body 120b and the second joining portion 134b of the second electrode plate body 130b are different from those of the first electrode plate body 120a, respectively. The first joint portion 124a and the second joint portion 134a of the second electrode plate body 130a.
在分流電阻器100b中，分別凸設於電阻板體110b之第一側面112b與第二側面114b的第一拼接部116b與第二拼接部118b均為弧形凸起部。對應於電阻板體110b之第一拼接部116b與第二拼接部118b，分別凹入第一電極板體120b之側面122b與第二電極板體130b之側面132b的第一接合部124b與第二接合部134b則均為凹弧部。在較佳實施例中，如圖3B所示，第一接合部124b並未貫穿第一電極板體120b，第二接合部134b並未貫穿第二電極板體130b，電阻板體110b之第一拼接部116b與第二拼接部 118b分別設置在第一接合部124b與第二接合部134b中且由第一電極板體120b與第二電極板體130b所承載。 In the shunt resistor 100b, the first splicing portion 116b and the second splicing portion 118b protruding from the first side 112b and the second side 114b of the resistance plate body 110b, respectively, are arc-shaped protrusions. The first splicing portion 116b and the second splicing portion 118b corresponding to the resistance plate body 110b are respectively recessed into the side surface 122b of the first electrode plate body 120b and the side surface 132b of the second electrode plate body 130b. The joint portions 134b are all concave arc portions. In a preferred embodiment, as shown in FIG. 3B, the first bonding portion 124b does not penetrate the first electrode plate body 120b, the second bonding portion 134b does not penetrate the second electrode plate body 130b, and the first of the resistance plate body 110b Stitching section 116b and second splicing section 118b is respectively provided in the first bonding portion 124b and the second bonding portion 134b and is carried by the first electrode plate body 120b and the second electrode plate body 130b.
請參照圖4，其係繪示依照本發明之第四實施方式的一種分流電阻器的裝置立體示意圖。本實施方式之分流電阻器100c與上述之分流電阻器100b之架構類似，二者之間的差異在於電阻板體110c具有兩個第一拼接部116c與兩個第二拼接部118c，且第一電極板體120c具有兩個第一接合部124c，第二電極板體130c具有兩個第二接合部134c。 Please refer to FIG. 4, which is a schematic perspective view of a device for a shunt resistor according to a fourth embodiment of the present invention. The structure of the shunt resistor 100c in this embodiment is similar to that of the above-mentioned shunt resistor 100b. The difference between the two is that the resistor board 110c has two first splicing portions 116c and two second splicing portions 118c, and the first The electrode plate body 120c has two first joint portions 124c, and the second electrode plate body 130c has two second joint portions 134c.
在分流電阻器100c中，分別凸設於電阻板體110c之相對之第一側面112c與第二側面114c的第一拼接部116c與第二拼接部118c均為直立的類圓柱狀凸起部。對應於電阻板體110c之第一拼接部116c與第二拼接部118c，凹入第一電極板體120c之側面122c的第一接合部124c、以及凹入第二電極板體130c之側面132c的第二接合部134c則均為直立的弧形凹弧部。在本實施例中，第一接合部124c並未貫穿第一電極板體120c，第二接合部134c並未貫穿第二電極板體130c，第一拼接部116c與第二拼接部118c分別設置在第一接合部124c與第二接合部134c中且由第一電極板體120c與第二電極板體130c所承載。 In the shunt resistor 100c, the first splicing portion 116c and the second splicing portion 118c protruding from the opposite first side 112c and the second side 114c of the resistance plate body 110c, respectively, are upright column-like convex portions. Corresponding to the first splicing portion 116c and the second splicing portion 118c of the resistance plate body 110c, the first bonding portion 124c recessed into the side surface 122c of the first electrode plate body 120c and the side surface 132c recessed into the second electrode plate body 130c The second joint portions 134c are all upright arc-shaped concave arc portions. In this embodiment, the first joint portion 124c does not penetrate the first electrode plate body 120c, the second joint portion 134c does not penetrate the second electrode plate body 130c, and the first splicing portion 116c and the second splicing portion 118c are respectively disposed at The first joint portion 124c and the second joint portion 134c are carried by the first electrode plate body 120c and the second electrode plate body 130c.
請同時參照圖5與圖6，其係分別繪示依照本發明之一實施方式的一種製造分流電阻器的裝置示意圖與流程圖。在本實施例中，製造分流電阻器260時，首先進行步驟300，以提供電阻板體200、第一電極板體210、以及第二電極板體220。電阻板體200具有相對之第一側面202與 第二側面204，其中第一側面202設有至少一個第一拼接部206，第二側面204設有至少一個第二拼接部208。對應於電阻板體200之第一側面202與第二側面204的結構，第一電極板體210之側面212設有至少一個第一接合部214，第二電極板體220之側面222設有至少一個第二接合部224。電阻板體200之第一拼接部206可和第一電極板體210之第一接合部214對應拼接，電阻板體200之第二拼接部208可和第二電極板體220之第二接合部224對應拼接。電阻板體200、第一電極板體210與第二電極板體220的材料、製作方式、以及拼接部和接合部的形式與變化如同上述實施方式，於此不再贅述。 Please refer to FIG. 5 and FIG. 6 at the same time, which respectively illustrate a schematic diagram and a flowchart of a device for manufacturing a shunt resistor according to an embodiment of the present invention. In this embodiment, when the shunt resistor 260 is manufactured, step 300 is first performed to provide a resistance plate body 200, a first electrode plate body 210, and a second electrode plate body 220. The resistance plate body 200 has a first side surface 202 opposite to A second side surface 204, wherein the first side surface 202 is provided with at least one first splicing portion 206, and the second side surface 204 is provided with at least one second splicing portion 208. Corresponding to the structure of the first side surface 202 and the second side surface 204 of the resistance plate body 200, the side surface 212 of the first electrode plate body 210 is provided with at least one first joint portion 214, and the side surface 222 of the second electrode plate body 220 is provided with at least One second joint 224. The first splicing portion 206 of the resistance plate body 200 may be spliced correspondingly to the first joining portion 214 of the first electrode plate body 210, and the second splicing portion 208 of the resistance plate body 200 may be connected to the second joining portion of the second electrode plate body 220. 224 corresponds to stitching. The materials of the resistance plate body 200, the first electrode plate body 210, and the second electrode plate body 220, the manufacturing methods, and the forms and changes of the splicing portion and the joint portion are the same as those in the foregoing embodiment, and are not repeated here.
接下來，進行步驟310，對應拼接電阻板體200之第一拼接部206與第一電極板體210之第一接合部214、以及對應拼接電阻板體200之第二拼接部208與第二電極板體220之第二接合部224。藉此，第一電極板體210可預結合於電阻板體200之側面202，第二電極板體220可預結合於電阻板體200之側面204，而形成電阻器模組260a。電阻器模組260a具有相對之第一側端262與第二側端264。 Next, step 310 is performed, corresponding to the first splicing portion 206 of the splicing resistance plate body 200 and the first joining portion 214 of the first electrode plate body 210, and the second splicing portion 208 and the second electrode of the splicing resistance plate body 200. The second joint portion 224 of the plate body 220. Thereby, the first electrode plate body 210 can be pre-bonded to the side surface 202 of the resistance plate body 200, and the second electrode plate body 220 can be pre-bonded to the side surface 204 of the resistance plate body 200 to form a resistor module 260a. The resistor module 260 a has a first side end 262 and a second side end 264 opposite to each other.
接著，進行步驟320，對第一電極板體210與第二電極板體220施加壓力230，而從電阻器模組260a的第一側端262與第二側端264分別將第一電極板體210與第二電極板體220朝著電阻板體200的方向加壓並壓合至電阻板體200的第一側面202與第二側面204。依據通電流大小而定，壓力230較佳為約0.1MPa(百萬帕)至10MPa之間。 藉此壓合步驟，可使第一電極板體210之側面212與電阻板體200之第一側面202貼合而形成第一拼接接面216，以及使第二電極板體220之側面222與電阻板體200之第二側面204貼合而形成第二拼接接面226，其中第一拼接接面216及第二拼接接面226均為異質接面。在一些例子中，可利用耐高溫之第一高導電模組250來壓合第一電極板體210、與耐高溫之第二高導電模組252來壓合第二電極板體220。耐高溫之第一高導電模組250與第二高導電模組252之材料可採用熔點超過攝氏3000度的導電材質。在一些示範例子中，第一高導電模組250與第二高導電模組252可為碳棒板、鎢棒板、或其他高導電高熔點材料(例如不鏽鋼)。 Next, step 320 is performed to apply pressure 230 to the first electrode plate body 210 and the second electrode plate body 220, and the first electrode plate body is respectively received from the first side end 262 and the second side end 264 of the resistor module 260a. 210 and the second electrode plate body 220 are pressed toward the resistance plate body 200 and pressed to the first side surface 202 and the second side surface 204 of the resistance plate body 200. Depending on the magnitude of the current flow, the pressure 230 is preferably between about 0.1 MPa (million Pascals) and 10 MPa. With this pressing step, the side surface 212 of the first electrode plate body 210 and the first side 202 of the resistance plate body 200 can be bonded to form a first splicing surface 216, and the side surface 222 of the second electrode plate body 220 and The second side surface 204 of the resistance plate body 200 is bonded to form a second splicing interface 226, wherein the first splicing interface 216 and the second splicing interface 226 are both heterogeneous interfaces. In some examples, the first electrode plate body 210 can be pressed by the first high-conductive module 250 with high temperature resistance, and the second electrode plate body 220 can be pressed by the second high-conductive module 252 with high temperature resistance. The high-temperature-resistant first high-conductivity module 250 and the second high-conductivity module 252 may be made of a conductive material having a melting point exceeding 3000 degrees Celsius. In some exemplary examples, the first high-conductivity module 250 and the second high-conductivity module 252 may be carbon rod plates, tungsten rod plates, or other high-conductivity and high-melting-point materials (such as stainless steel).
然後，進行步驟330，以利用電源240經由電阻板體200之兩側的第一電極板體210與第二電極板體220，來對第一電極板體210、第二電極板體220以及電阻板體200施加電流。電源240可為直流電源或交流電源。此外，電源240所施加之電流的大小與電阻板體200和第一電極板體210與第二電極板體220間壓合的壓力230有關。舉例來說，若壓力230較低，電阻板體200和第一電極板體210與第二電極板體220間的接觸電阻較高，可以施加較低的電流；若壓力230較高，電阻板體200和第一電極板體210與第二電極板體220間的接觸電阻較低，因此可施加較高的電流。然而，壓力230太高會影響電阻板體200的阻值偏高與電阻板體200和第一電極板體210與第二電極板體220間的接觸電阻較低，加上高電流所提供的熱量可使電阻板體200 的材料產生退火的效果，藉此可使電阻板體200的阻值比較穩定，因此步驟330較佳是採用施加高電流的方式來進行。在一些示範例子中，電源240所施加之電流可為約700A至約800A，或者更高電流。 Then, step 330 is performed to use the power source 240 to pass through the first electrode plate body 210 and the second electrode plate body 220 on both sides of the resistance plate body 200 to the first electrode plate body 210, the second electrode plate body 220, and the resistor. The plate 200 applies a current. The power source 240 may be a DC power source or an AC power source. In addition, the magnitude of the current applied by the power source 240 is related to the pressure 230 between the resistance plate body 200 and the first electrode plate body 210 and the second electrode plate body 220. For example, if the pressure 230 is low, the contact resistance between the resistance plate body 200 and the first electrode plate body 210 and the second electrode plate body 220 is high, and a lower current can be applied; if the pressure 230 is high, the resistance plate The contact resistance between the body 200, the first electrode plate body 210, and the second electrode plate body 220 is low, so that a high current can be applied. However, if the pressure 230 is too high, the resistance value of the resistance plate body 200 is high and the contact resistance between the resistance plate body 200 and the first electrode plate body 210 and the second electrode plate body 220 is low. Heat can make the resistance plate 200 The material has an annealing effect, thereby making the resistance of the resistance plate 200 relatively stable. Therefore, step 330 is preferably performed by applying a high current. In some exemplary examples, the current applied by the power source 240 may be about 700A to about 800A, or higher.
在一些例子中，電源240之兩極分別透過第一導線242及第二導線244連接電阻器模組260a兩側之第一高導電模組250與第二高導電模組252。電源240經由第一導線242與第一高導電模組250、以及第二導線244與第二高導電模組252，而對第一電極板體210、第二電極板體220以及電阻板體200施加電流。由於異質的第一拼接接面216與第二拼接接面226處的電阻最大，電流通過時為最大功率區，溫度最高，因此第一拼接接面216與第二拼接接面226處的電阻板體200以及第一電極板體210與第二電極板體220最先熔融。此時，在外加壓力230下，第一電極板體210與第二電極板體220的材料與電阻板體200的材料置換，而使第一電極板體210與電阻板體200在第一拼接接面216處熔接在一起，以及使第二電極板體220與電阻板體200在第二拼接接面226處熔接在一起，而形成分流電阻器260。 In some examples, the two poles of the power source 240 are connected to the first high-conductivity module 250 and the second high-conductivity module 252 on both sides of the resistor module 260a through the first wire 242 and the second wire 244, respectively. The power source 240 passes through the first lead 242 and the first highly conductive module 250 and the second lead 244 and the second highly conductive module 252 to the first electrode plate body 210, the second electrode plate body 220, and the resistance plate body 200. Apply current. Because the resistance at the heterogeneous first splicing interface 216 and the second splicing interface 226 is the largest, the current is the maximum power region, and the temperature is the highest, so the resistance plate at the first splicing interface 216 and the second splicing interface 226 The body 200, the first electrode plate body 210, and the second electrode plate body 220 are first melted. At this time, under the applied pressure 230, the material of the first electrode plate body 210 and the second electrode plate body 220 is replaced with the material of the resistance plate body 200, so that the first electrode plate body 210 and the resistance plate body 200 are spliced at the first time. The junction surface 216 is fused together, and the second electrode plate body 220 and the resistance plate body 200 are fused together at the second splicing surface 226 to form a shunt resistor 260.
在本實施例中，對第一電極板體210、第二電極板體220以及電阻板體200施加電流的操作較佳係在惰性氣體270(例如氮氣或氬氣)的環境下進行，以保護熔接處，避免熔接處氧化。此外，對第一電極板體210、第二電極板體220與電阻板體200施加電流時，可將第一電極板體210及第二電極板體220分別放置於第一導熱底座280與第二導 熱底座282上。在一些示範例子中，第一導熱底座280較接近第一高導電模組250而遠離第一拼接接面216，第二導熱底座282較接近第二高導電模組252而遠離第二拼接接面226，以利用第一導熱底座280與第二導熱底座282來分別將第一電極板體210與第二電極板體220的熱導掉，而將熱集中在第一拼接接面216與第二拼接接面226處。 In this embodiment, the operation of applying current to the first electrode plate body 210, the second electrode plate body 220, and the resistance plate body 200 is preferably performed under an environment of an inert gas 270 (such as nitrogen or argon) to protect Avoid welding at the weld. In addition, when current is applied to the first electrode plate body 210, the second electrode plate body 220, and the resistance plate body 200, the first electrode plate body 210 and the second electrode plate body 220 may be placed on the first heat conductive base 280 and the first Second Leader On the thermal base 282. In some exemplary examples, the first thermally conductive base 280 is closer to the first highly conductive module 250 and away from the first splicing interface 216, and the second thermally conductive base 282 is closer to the second highly conductive module 252 and away from the second splicing interface. 226. Use the first heat conducting base 280 and the second heat conducting base 282 to conduct the heat of the first electrode plate body 210 and the second electrode plate body 220 respectively, and concentrate the heat on the first splicing surface 216 and the second 226 joints.
由於本方法係先將電極材與電阻合金材分別製成可以互相拼接的第一電極板體210及第二電極板體220、與電阻板體200，再利用加壓並通高電流的方式來將第一電極板體210及第二電極板體220分別熔接於電阻板體200之第一側面202與第二側面204，因此可先精算電阻板體200的阻值。再加上熔接後無需再經沖壓切分，因此可提升分流電阻器260的阻值精確度，而可大幅縮減分流電阻器260之阻值修整時間，進而可提高產能。此外，電極材與電阻合金材係分別切分成第一電極板體210及第二電極板體220、與電阻板體200後再熔接，因此不但電極材與電阻材的材料利用率高，剩餘部分回收簡易，且分流電阻器更可根據實際需求而具有多樣化的外型。 Because this method firstly forms the electrode material and the resistance alloy material into a first electrode plate body 210, a second electrode plate body 220, and a resistance plate body 200 that can be spliced to each other, and then uses a method of pressurizing and passing a high current to The first electrode plate body 210 and the second electrode plate body 220 are welded to the first side surface 202 and the second side surface 204 of the resistance plate body 200, respectively, so the resistance value of the resistance plate body 200 can be calculated first. In addition, there is no need to cut through punching after welding, so the resistance accuracy of the shunt resistor 260 can be improved, and the trimming time of the shunt resistor 260 can be greatly reduced, which can increase the productivity. In addition, the electrode material and the resistance alloy material are respectively divided into the first electrode plate body 210 and the second electrode plate body 220, and then welded to the resistance plate body 200. Therefore, not only the material utilization rate of the electrode material and the resistance material is high, but the remaining portion The recycling is simple, and the shunt resistor can have a variety of appearances according to actual needs.
請同時參照圖7與圖8，其係分別繪示依照本發明之另一實施方式的一種製造分流電阻器的裝置示意圖與流程圖。本實施方式係採用批次生產方式，可快速大量生產。在一些實施例中，可先進行步驟500，以提供數個如圖5所示之電阻器模組260a，並將這些電阻器模組260a依序排列於傳送機構400上。傳送機構400可沿著方向402將電 阻器模組260a往前輸送。電阻器模組260a橫向排列於傳送機構400上，且每個電阻器模組260a之第一電極板體210與第二電極板體220可分別突出於傳送機構400的相對二側。傳送機構400可例如為輸送帶。電阻器模組260a之架構已描述於上述實施方式，於此不再贅述。 Please refer to FIG. 7 and FIG. 8 at the same time, which respectively illustrate a schematic diagram and a flowchart of a device for manufacturing a shunt resistor according to another embodiment of the present invention. This embodiment adopts a batch production method, and can quickly mass-produce. In some embodiments, step 500 may be performed first to provide a plurality of resistor modules 260 a as shown in FIG. 5, and the resistor modules 260 a are sequentially arranged on the transmission mechanism 400. The transfer mechanism 400 can transfer electricity along the direction 402 The resistor module 260a is forwarded. The resistor modules 260 a are arranged laterally on the transfer mechanism 400, and the first electrode plate body 210 and the second electrode plate body 220 of each resistor module 260 a may respectively protrude from two opposite sides of the transfer mechanism 400. The transfer mechanism 400 may be, for example, a conveyor belt. The structure of the resistor module 260a has been described in the above embodiment, and is not repeated here.
接下來，可進行步驟510，以經由每個電阻器模組260a的第一電極板體210與第二電極板體220對電阻器模組260a施加壓力410，而從每個電阻器模組260a的第一側端262與第二側端264將第一電極板體210與第二電極板體220分別壓合至電阻板體200的第一側面202與第二側面204。藉此，如圖5所示，可使第一電極板體210之側面212與電阻板體200之第一側面202貼合而形成第一拼接接面216，且可使第二電極板體220之側面222與電阻板體200之第二側面204貼合而形成第二拼接接面226。依據通電流大小而定，壓力410較佳為約0.1MPa至10MPa之間。 Next, step 510 may be performed to apply a pressure 410 to the resistor module 260a through the first electrode plate body 210 and the second electrode plate body 220 of each resistor module 260a, and from each resistor module 260a The first side end 262 and the second side end 264 are respectively pressed to the first electrode plate body 210 and the second electrode plate body 220 to the first side surface 202 and the second side surface 204 of the resistance plate body 200, respectively. Thereby, as shown in FIG. 5, the side surface 212 of the first electrode plate body 210 and the first side surface 202 of the resistance plate body 200 can be bonded to form a first splicing surface 216, and the second electrode plate body 220 can be made. The side surface 222 is bonded to the second side surface 204 of the resistance plate body 200 to form a second splicing connection surface 226. Depending on the magnitude of the current flow, the pressure 410 is preferably between about 0.1 MPa and 10 MPa.
在一些例子中，可分別設置數個耐高溫之第一高導電模組420與數個耐高溫之第二高導電模組422於電阻器模組260a的第一側端420與第二側端422，並利用這些第一高導電模組420與第二高導電模組422來對電阻器模組260a施加壓力410。當第一高導電模組420與第二高導電模組422分別壓在電阻器模組260a的第一側端262與第二側端264上時，這些電阻器模組260a透過第一高導電模組420與第二高導電模組422形成串接。耐高溫之第一高導電模組420與第二高導電模組422之材料可採用熔點超過攝氏 3000度的導電材質。舉例而言，第一高導電模組420與第二高導電模組422可為碳棒板或鎢棒板。在一些示範例子中，對電阻器模組260a進行壓合步驟時，可利用加壓模430從電阻器模組260a之第一側端262與第二側端264先分別施壓於第一高導電模組420與第二高導電模組422，再透過第一高導電模組420與第二高導電模組422施加壓力410於電阻器模組260a。 In some examples, several high-temperature-resistant first high-conductivity modules 420 and several high-temperature-resistant second high-conductivity modules 422 may be respectively disposed at the first side ends 420 and the second side ends of the resistor module 260a. 422, and use these first high-conductivity module 420 and second high-conductivity module 422 to apply pressure 410 to the resistor module 260a. When the first highly conductive module 420 and the second highly conductive module 422 are pressed on the first side end 262 and the second side end 264 of the resistor module 260a, respectively, these resistor modules 260a pass through the first high conductivity The module 420 is connected in series with the second highly conductive module 422. The materials of the first high-conductivity module 420 and the second high-conductivity module 422 that can withstand high temperatures can use melting points exceeding Celsius 3000 degrees conductive material. For example, the first high-conductivity module 420 and the second high-conductivity module 422 may be carbon rod plates or tungsten rod plates. In some exemplary examples, when pressing the resistor module 260a, the pressing die 430 can be used to press the first side end 262 and the second side end 264 of the resistor module 260a to the first height respectively. The conductive module 420 and the second highly conductive module 422 apply pressure 410 to the resistor module 260a through the first highly conductive module 420 and the second highly conductive module 422.
然後，可進行步驟520，以利用電源440經由每個電阻器模組260a之第一電極板體210與第二電極板體220，來同時對電阻器模組260a施加電流。電源440可為直流電源或交流電源。在一些示範例子中，電源440所施加之電流可為約700A至約800A或者更高。 Then, step 520 may be performed to apply a current to the resistor module 260a at the same time using the power source 440 through the first electrode plate body 210 and the second electrode plate body 220 of each resistor module 260a. The power source 440 may be a DC power source or an AC power source. In some exemplary examples, the current applied by the power source 440 may be about 700A to about 800A or higher.
在一些例子中，電源440之兩極透過第一導線442及第二導線444而分別與電阻器模組260a之第一側端262之最遠離的第一高導電模組420、以及電阻器模組260a之第二側端264之最接近的第二高導電模組422連接，藉此這些電阻器模組260a可透過第一高導電模組420及第二高導電模組422而與電源440串聯。電源440經由第一導線442與第一高導電模組420、以及第二導線444與第二高導電模組422，而對所有電阻器模組260a之第一電極板體210、第二電極板體220以及電阻板體200施加電流，以熔融第一拼接接面216處的電阻板體200與第一電極板體210、以及第二拼接接面226處的電阻板體200與第二電極板體220。再藉由外加壓力410，使每個電阻器模組260a之第一電極板體 210與電阻板體200在第一拼接接面216處熔接在一起、以及使每個電阻器模組260a之第二電極板體220與電阻板體200在第二拼接接面226處熔接在一起，而同時形成多個分流電阻器260。 In some examples, the two poles of the power source 440 pass through the first lead 442 and the second lead 444 and are separated from the first high-conductivity module 420 and the resistor module 260 that are the farthest from the first side end 262 of the resistor module 260a, respectively. The closest second highly conductive module 422 of the second side end 264 of 260a is connected, whereby these resistor modules 260a can be connected in series with the power source 440 through the first highly conductive module 420 and the second highly conductive module 422. . The power supply 440 passes through the first lead 442 and the first high-conductivity module 420 and the second lead 444 and the second high-conductivity module 422 to the first electrode plate body 210 and the second electrode plate of all the resistor modules 260a. A current is applied to the body 220 and the resistance plate body 200 to fuse the resistance plate body 200 and the first electrode plate body 210 at the first splicing surface 216, and the resistance plate body 200 and the second electrode plate at the second splicing surface 226.体 220. By applying a pressure 410, the first electrode plate body of each resistor module 260a is made. 210 and the resistance plate body 200 are welded together at the first splicing surface 216, and the second electrode plate body 220 and the resistance plate 200 of each resistor module 260a are welded together at the second splicing surface 226 A plurality of shunt resistors 260 are formed at the same time.
在一些示範例子中，對所有電阻器模組260a施加電流的操作係在惰性氣體的環境下進行，以避免熔接處氧化。此外，對電阻器模組260a施加電流時，可將所有第一電極板體210及第二電極板體220分別放置於導熱底座(未繪示)上，並使導熱底座分別較接近第一高導電模組420與第二高導電模組422而較遠離第一拼接接面216與第二拼接接面226，以利用導熱底座將第一電極板體210與第二電極板體220的熱導掉，而將熱集中在第一拼接接面216與第二拼接接面226處。 In some exemplary examples, the operation of applying current to all the resistor modules 260a is performed under an inert gas environment to avoid oxidation at the weld. In addition, when a current is applied to the resistor module 260a, all of the first electrode plate body 210 and the second electrode plate body 220 can be placed on a thermally conductive base (not shown), and the thermally conductive bases are respectively closer to the first height. The conductive module 420 and the second highly conductive module 422 are relatively far from the first splicing surface 216 and the second splicing surface 226, so as to use a thermally conductive base to conduct the heat of the first electrode plate body 210 and the second electrode plate body 220. The heat is concentrated at the first splicing interface 216 and the second splicing interface 226.
由於本方法係利用第一高導電模組420與第二高導電模組422串聯許多電阻器模組260a，再透過第一高導電模組420與第二高導電模組422對每個電阻器模組260a的第一側端262與第二側端264同時施壓且加電流的熔接方式，可一次生產出大量的分流電阻器260，因此可大幅提升生產效率。 Since this method uses the first high-conductivity module 420 and the second high-conductivity module 422 in series with many resistor modules 260a, each of the resistors is passed through the first high-conductivity module 420 and the second high-conduction module 422 The welding method in which the first side end 262 and the second side end 264 of the module 260a are simultaneously pressed and applied with current can produce a large number of shunt resistors 260 at a time, and thus the production efficiency can be greatly improved.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何在此技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed as above by way of example, it is not intended to limit the present invention. Any person with ordinary knowledge in this technical field can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the appended patent application.
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| CN1272945A (en) * | 1997-10-02 | 2000-11-08 | 松下电器产业株式会社 | Resistor and method for manufacturing the same |
| CN101097232A (en) * | 2007-03-30 | 2008-01-02 | 桐乡市伟达电子有限公司 | Forming method of current divider |
| TW201415790A (en) * | 2012-06-14 | 2014-04-16 | Skyworks Solutions Inc | Power amplifier modules including related systems, devices, and methods |
| US20160008914A1 (en) * | 2013-03-29 | 2016-01-14 | Jfe Steel Corporation | Resistance spot welding system |
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| EP1353340A4 (en) * | 2001-01-15 | 2008-06-04 | Matsushita Electric Works Ltd | Shunt resistance and method of adjusting the shunt resistance |
| US7911319B2 (en) * | 2008-02-06 | 2011-03-22 | Vishay Dale Electronics, Inc. | Resistor, and method for making same |
| JP6643859B2 (en) * | 2015-10-15 | 2020-02-12 | サンコール株式会社 | Manufacturing method of shunt resistor |
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| CN1272945A (en) * | 1997-10-02 | 2000-11-08 | 松下电器产业株式会社 | Resistor and method for manufacturing the same |
| CN101097232A (en) * | 2007-03-30 | 2008-01-02 | 桐乡市伟达电子有限公司 | Forming method of current divider |
| TW201415790A (en) * | 2012-06-14 | 2014-04-16 | Skyworks Solutions Inc | Power amplifier modules including related systems, devices, and methods |
| US20160008914A1 (en) * | 2013-03-29 | 2016-01-14 | Jfe Steel Corporation | Resistance spot welding system |
| CN107000109A (en) * | 2014-12-01 | 2017-08-01 | 杰富意钢铁株式会社 | Resistance spot welding method |
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