TWI657122B - 各向異性導電膜及使用其的連接結構 - Google Patents

各向異性導電膜及使用其的連接結構 Download PDF

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Publication number
TWI657122B
TWI657122B TW106113371A TW106113371A TWI657122B TW I657122 B TWI657122 B TW I657122B TW 106113371 A TW106113371 A TW 106113371A TW 106113371 A TW106113371 A TW 106113371A TW I657122 B TWI657122 B TW I657122B
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TW
Taiwan
Prior art keywords
anisotropic conductive
conductive film
mpa
seconds
item
Prior art date
Application number
TW106113371A
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English (en)
Chinese (zh)
Other versions
TW201738343A (zh
Inventor
申潁株
權純榮
金荷娜
高連助
朴永祐
宋基態
韓在善
Original Assignee
南韓商三星Ｓｄｉ股份有限公司
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Application filed by 南韓商三星Ｓｄｉ股份有限公司 filed Critical 南韓商三星Ｓｄｉ股份有限公司
Publication of TW201738343A publication Critical patent/TW201738343A/zh
Application granted granted Critical
Publication of TWI657122B publication Critical patent/TWI657122B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Non-Insulated Conductors (AREA)
TW106113371A 2016-04-29 2017-04-21 各向異性導電膜及使用其的連接結構 TWI657122B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??10-2016-0053116 2016-04-29
KR1020160053116A KR101991992B1 (ko) 2016-04-29 2016-04-29 이방 도전성 필름 및 이를 이용한 접속 구조체

Publications (2)

Publication Number Publication Date
TW201738343A TW201738343A (zh) 2017-11-01
TWI657122B true TWI657122B (zh) 2019-04-21

Family

ID=60221940

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106113371A TWI657122B (zh) 2016-04-29 2017-04-21 各向異性導電膜及使用其的連接結構

Country Status (3)

Country Link
KR (1) KR101991992B1 (ko)
CN (1) CN107338008B (ko)
TW (1) TWI657122B (ko)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201513140A (zh) * 2013-09-30 2015-04-01 Samsung Sdi Co Ltd 各向異性導電膜和使用其的半導體裝置
TW201515851A (zh) * 2013-10-31 2015-05-01 Samsung Sdi Co Ltd 各向異性導電膜和使用其的半導體裝置
TW201610088A (zh) * 2014-09-01 2016-03-16 三星Ｓｄｉ股份有限公司 各向異性導電膜和由其連接的半導體裝置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010121007A (ja) * 2008-11-18 2010-06-03 Sumitomo Electric Ind Ltd 異方導電性フィルム
KR101362868B1 (ko) * 2010-12-29 2014-02-14 제일모직주식회사 이중층 이방성 도전성 필름
KR101706818B1 (ko) * 2014-04-30 2017-02-15 제일모직주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치
KR101731677B1 (ko) * 2014-08-29 2017-04-28 삼성에스디아이 주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치
KR101716548B1 (ko) * 2014-09-17 2017-03-14 삼성에스디아이 주식회사 이방 도전성 필름 및 이를 이용한 반도체 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201513140A (zh) * 2013-09-30 2015-04-01 Samsung Sdi Co Ltd 各向異性導電膜和使用其的半導體裝置
TW201515851A (zh) * 2013-10-31 2015-05-01 Samsung Sdi Co Ltd 各向異性導電膜和使用其的半導體裝置
TW201610088A (zh) * 2014-09-01 2016-03-16 三星Ｓｄｉ股份有限公司 各向異性導電膜和由其連接的半導體裝置

Also Published As

Publication number Publication date
CN107338008B (zh) 2020-03-17
CN107338008A (zh) 2017-11-10
TW201738343A (zh) 2017-11-01
KR20170123883A (ko) 2017-11-09
KR101991992B1 (ko) 2019-06-21

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