TWI655726B - 扇出型半導體封裝 - Google Patents
扇出型半導體封裝 Download PDFInfo
- Publication number
- TWI655726B TWI655726B TW107116224A TW107116224A TWI655726B TW I655726 B TWI655726 B TW I655726B TW 107116224 A TW107116224 A TW 107116224A TW 107116224 A TW107116224 A TW 107116224A TW I655726 B TWI655726 B TW I655726B
- Authority
- TW
- Taiwan
- Prior art keywords
- fan
- layer
- semiconductor package
- hole
- semiconductor wafer
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
- H01L2224/0237—Disposition of the redistribution layers
- H01L2224/02379—Fan-out arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20160049830 | 2016-04-25 | ||
??10-2016-0049830 | 2016-04-25 | ||
??10-2016-0117321 | 2016-09-12 | ||
KR1020160117321A KR20170121666A (ko) | 2016-04-25 | 2016-09-12 | 팬-아웃 반도체 패키지 |
??10-2016-0166951 | 2016-12-08 | ||
KR1020160166951A KR102016492B1 (ko) | 2016-04-25 | 2016-12-08 | 팬-아웃 반도체 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201830617A TW201830617A (zh) | 2018-08-16 |
TWI655726B true TWI655726B (zh) | 2019-04-01 |
Family
ID=60383554
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107116224A TWI655726B (zh) | 2016-04-25 | 2017-01-24 | 扇出型半導體封裝 |
TW106102511A TWI630690B (zh) | 2016-04-25 | 2017-01-24 | 扇出型半導體封裝 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106102511A TWI630690B (zh) | 2016-04-25 | 2017-01-24 | 扇出型半導體封裝 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR20170121666A (ko) |
TW (2) | TWI655726B (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101973445B1 (ko) | 2017-11-07 | 2019-04-29 | 삼성전기주식회사 | 팬-아웃 센서 패키지 및 카메라 모듈 |
KR102185706B1 (ko) * | 2017-11-08 | 2020-12-02 | 삼성전자주식회사 | 팬-아웃 반도체 패키지 |
US10643919B2 (en) | 2017-11-08 | 2020-05-05 | Samsung Electronics Co., Ltd. | Fan-out semiconductor package |
KR102099749B1 (ko) * | 2018-01-19 | 2020-04-10 | 삼성전자주식회사 | 팬-아웃 반도체 패키지 |
KR102063470B1 (ko) | 2018-05-03 | 2020-01-09 | 삼성전자주식회사 | 반도체 패키지 |
KR102070563B1 (ko) * | 2018-06-01 | 2020-01-29 | 삼성전자주식회사 | 전자파 차폐 구조물 및 이를 포함하는 반도체 패키지 |
KR102099748B1 (ko) * | 2018-06-04 | 2020-04-13 | 삼성전자주식회사 | 전자부품 패키지 |
CN110838475A (zh) * | 2018-08-17 | 2020-02-25 | 深南电路股份有限公司 | 芯片组件及其制作方法 |
KR102555814B1 (ko) | 2018-11-05 | 2023-07-14 | 삼성전자주식회사 | 반도체 패키지 |
KR102626315B1 (ko) * | 2018-11-13 | 2024-01-17 | 삼성전자주식회사 | 반도체 패키지 |
KR102513088B1 (ko) * | 2018-11-20 | 2023-03-23 | 삼성전자주식회사 | 팬-아웃 센서 패키지 |
KR102530322B1 (ko) | 2018-12-18 | 2023-05-10 | 삼성전자주식회사 | 반도체 패키지 |
KR102586072B1 (ko) * | 2019-05-21 | 2023-10-05 | 삼성전기주식회사 | 반도체 패키지 및 이를 포함하는 안테나 모듈 |
US11776899B2 (en) * | 2020-05-11 | 2023-10-03 | Mediatek Inc. | Via array design for multi-layer redistribution circuit structure |
CN113782496A (zh) * | 2020-06-10 | 2021-12-10 | 讯芯电子科技(中山)有限公司 | 半导体封装装置和半导体封装装置制造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004214258A (ja) * | 2002-12-27 | 2004-07-29 | Renesas Technology Corp | 半導体モジュール |
US20140202741A1 (en) * | 2012-03-01 | 2014-07-24 | Fujikura Ltd. | Component built-in board and method of manufacturing the same |
US9214434B1 (en) * | 2011-11-22 | 2015-12-15 | Amkor Technology, Inc. | Fan-out semiconductor package |
US20160113127A1 (en) * | 2014-10-16 | 2016-04-21 | Infineon Technologies Ag | Electronic module having an electrically insulating structure with material having a low modulus of elasticity |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5326269B2 (ja) * | 2006-12-18 | 2013-10-30 | 大日本印刷株式会社 | 電子部品内蔵配線板、及び電子部品内蔵配線板の放熱方法 |
-
2016
- 2016-09-12 KR KR1020160117321A patent/KR20170121666A/ko unknown
-
2017
- 2017-01-24 TW TW107116224A patent/TWI655726B/zh active
- 2017-01-24 TW TW106102511A patent/TWI630690B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004214258A (ja) * | 2002-12-27 | 2004-07-29 | Renesas Technology Corp | 半導体モジュール |
US9214434B1 (en) * | 2011-11-22 | 2015-12-15 | Amkor Technology, Inc. | Fan-out semiconductor package |
US20140202741A1 (en) * | 2012-03-01 | 2014-07-24 | Fujikura Ltd. | Component built-in board and method of manufacturing the same |
US20160113127A1 (en) * | 2014-10-16 | 2016-04-21 | Infineon Technologies Ag | Electronic module having an electrically insulating structure with material having a low modulus of elasticity |
Also Published As
Publication number | Publication date |
---|---|
TW201830617A (zh) | 2018-08-16 |
KR20170121666A (ko) | 2017-11-02 |
TW201803051A (zh) | 2018-01-16 |
TWI630690B (zh) | 2018-07-21 |
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