TWI655726B - 扇出型半導體封裝 - Google Patents

扇出型半導體封裝 Download PDF

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Publication number
TWI655726B
TWI655726B TW107116224A TW107116224A TWI655726B TW I655726 B TWI655726 B TW I655726B TW 107116224 A TW107116224 A TW 107116224A TW 107116224 A TW107116224 A TW 107116224A TW I655726 B TWI655726 B TW I655726B
Authority
TW
Taiwan
Prior art keywords
fan
layer
semiconductor package
hole
semiconductor wafer
Prior art date
Application number
TW107116224A
Other languages
English (en)
Chinese (zh)
Other versions
TW201830617A (zh
Inventor
李文熙
Moon Hee Yi
鄭注奐
Joo Hwan Jung
鄭栗敎
Yul Kyo Chung
Original Assignee
南韓商三星電機股份有限公司
Samsung Electro-Mechanics Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020160166951A external-priority patent/KR102016492B1/ko
Application filed by 南韓商三星電機股份有限公司, Samsung Electro-Mechanics Co., Ltd. filed Critical 南韓商三星電機股份有限公司
Publication of TW201830617A publication Critical patent/TW201830617A/zh
Application granted granted Critical
Publication of TWI655726B publication Critical patent/TWI655726B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02379—Fan-out arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW107116224A 2016-04-25 2017-01-24 扇出型半導體封裝 TWI655726B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20160049830 2016-04-25
??10-2016-0049830 2016-04-25
??10-2016-0117321 2016-09-12
KR1020160117321A KR20170121666A (ko) 2016-04-25 2016-09-12 팬-아웃 반도체 패키지
??10-2016-0166951 2016-12-08
KR1020160166951A KR102016492B1 (ko) 2016-04-25 2016-12-08 팬-아웃 반도체 패키지

Publications (2)

Publication Number Publication Date
TW201830617A TW201830617A (zh) 2018-08-16
TWI655726B true TWI655726B (zh) 2019-04-01

Family

ID=60383554

Family Applications (2)

Application Number Title Priority Date Filing Date
TW107116224A TWI655726B (zh) 2016-04-25 2017-01-24 扇出型半導體封裝
TW106102511A TWI630690B (zh) 2016-04-25 2017-01-24 扇出型半導體封裝

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW106102511A TWI630690B (zh) 2016-04-25 2017-01-24 扇出型半導體封裝

Country Status (2)

Country Link
KR (1) KR20170121666A (ko)
TW (2) TWI655726B (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101973445B1 (ko) 2017-11-07 2019-04-29 삼성전기주식회사 팬-아웃 센서 패키지 및 카메라 모듈
KR102185706B1 (ko) * 2017-11-08 2020-12-02 삼성전자주식회사 팬-아웃 반도체 패키지
US10643919B2 (en) 2017-11-08 2020-05-05 Samsung Electronics Co., Ltd. Fan-out semiconductor package
KR102099749B1 (ko) * 2018-01-19 2020-04-10 삼성전자주식회사 팬-아웃 반도체 패키지
KR102063470B1 (ko) 2018-05-03 2020-01-09 삼성전자주식회사 반도체 패키지
KR102070563B1 (ko) * 2018-06-01 2020-01-29 삼성전자주식회사 전자파 차폐 구조물 및 이를 포함하는 반도체 패키지
KR102099748B1 (ko) * 2018-06-04 2020-04-13 삼성전자주식회사 전자부품 패키지
CN110838475A (zh) * 2018-08-17 2020-02-25 深南电路股份有限公司 芯片组件及其制作方法
KR102555814B1 (ko) 2018-11-05 2023-07-14 삼성전자주식회사 반도체 패키지
KR102626315B1 (ko) * 2018-11-13 2024-01-17 삼성전자주식회사 반도체 패키지
KR102513088B1 (ko) * 2018-11-20 2023-03-23 삼성전자주식회사 팬-아웃 센서 패키지
KR102530322B1 (ko) 2018-12-18 2023-05-10 삼성전자주식회사 반도체 패키지
KR102586072B1 (ko) * 2019-05-21 2023-10-05 삼성전기주식회사 반도체 패키지 및 이를 포함하는 안테나 모듈
US11776899B2 (en) * 2020-05-11 2023-10-03 Mediatek Inc. Via array design for multi-layer redistribution circuit structure
CN113782496A (zh) * 2020-06-10 2021-12-10 讯芯电子科技（中山）有限公司 半导体封装装置和半导体封装装置制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214258A (ja) * 2002-12-27 2004-07-29 Renesas Technology Corp 半導体モジュール
US20140202741A1 (en) * 2012-03-01 2014-07-24 Fujikura Ltd. Component built-in board and method of manufacturing the same
US9214434B1 (en) * 2011-11-22 2015-12-15 Amkor Technology, Inc. Fan-out semiconductor package
US20160113127A1 (en) * 2014-10-16 2016-04-21 Infineon Technologies Ag Electronic module having an electrically insulating structure with material having a low modulus of elasticity

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5326269B2 (ja) * 2006-12-18 2013-10-30 大日本印刷株式会社 電子部品内蔵配線板、及び電子部品内蔵配線板の放熱方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214258A (ja) * 2002-12-27 2004-07-29 Renesas Technology Corp 半導体モジュール
US9214434B1 (en) * 2011-11-22 2015-12-15 Amkor Technology, Inc. Fan-out semiconductor package
US20140202741A1 (en) * 2012-03-01 2014-07-24 Fujikura Ltd. Component built-in board and method of manufacturing the same
US20160113127A1 (en) * 2014-10-16 2016-04-21 Infineon Technologies Ag Electronic module having an electrically insulating structure with material having a low modulus of elasticity

Also Published As

Publication number Publication date
TW201830617A (zh) 2018-08-16
KR20170121666A (ko) 2017-11-02
TW201803051A (zh) 2018-01-16
TWI630690B (zh) 2018-07-21

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