TWI653365B - 類晶圓基材加工方法及裝置 - Google Patents

類晶圓基材加工方法及裝置 Download PDF

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TWI653365B
TWI653365B TW106133995A TW106133995A TWI653365B TW I653365 B TWI653365 B TW I653365B TW 106133995 A TW106133995 A TW 106133995A TW 106133995 A TW106133995 A TW 106133995A TW I653365 B TWI653365 B TW I653365B
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Taiwan
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substrate
processing
holder
contact holder
contact
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TW106133995A
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TW201819693A (zh
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瑞夫 勞恩布許
Ralph Rauenbusch
托比亞斯 布森尼爾斯
Tobias Bussenius
丹尼爾 布希柏格
Daniel BUCHBERGER
瑞 瑋恩霍德
Ray Weinhold
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德商德國艾托特克公司
Atotech Deutschland Gmbh
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Abstract

本發明係關於使用接觸式夾持器及非接觸式夾持器來加工類晶圓基材之方法。此外，本發明係關於用於加工類晶圓基材之含有接觸式夾持器及非接觸式夾持器的裝置。另外，本發明係關於使用發明裝置加工類晶圓基材。

Description

類晶圓基材加工方法及裝置
本發明係關於用於加工類晶圓基材之方法及裝置。該方法及裝置尤其適合於在加工期間安全就地運輸類晶圓基材。
所屬領域技術中已知使用夾持器運輸類晶圓基材。本文中，使用不同種類之夾持器。過去尤其已使用接觸該基材之表面或邊緣之夾持器。然而，亦已完全確立尤其是使用伯努利夾具之非接觸式夾持器之使用。本文中，兩種類型之夾持器提供特定益處，但針對敏感基材，同時提供特定錯配係成問題的。 接觸基材表面之夾持器通常提供非常準確地處理基材之可能性。然而，所運輸基材趨於在接觸點處對其等之表面造成損傷。 不接觸該表面之夾持器基於無常備接觸點，通常將避免此等局部損傷。然而，此等夾持器更為複雜，且雖然該等基材係固定的，但該等基材可在某種程度上移動。一方面，基於移動期間之慣性效應，基材可移動至側邊上。使用限制邊緣以防止此等移動將導致基材與限制邊緣碰撞之可能性，從而可損傷基材邊緣或甚至可損傷全部基材。此外，所運輸基材之移動及震動將提供在安放基材時損傷基材之風險。將此等基材安放於複雜結構(例如，如WO 2016/096946 A1中所揭露之基材固持器)中將對此程序帶來更大負擔。
因此，需要提供用於類晶圓基材之經改良加工方法及用於實現該方法以在運輸期間安全就地處理該基材之裝置。 前述問題藉由如獨立技術方案及描述中所揭露之發明來解決。提供額外益處之進一步修改包含於獨立技術方案及下列描述中。然而，即使是本文中未明確陳述但可自本文中所討論之聯繫中直接推論或識別之進一步益處亦由本發明及本文中所揭露之本發明及其之實施例來解決。 本發明係關於用於加工類晶圓基材之方法，其包括下列步驟： i)在裝載器件中提供基材； ii)使用非接觸式夾持器或接觸式夾持器將該基材自該裝載器件運輸至對位器件； iii)在該對位器件中對位該基材； iv)使用接觸式夾持器將經對位基材運輸至連接器件，其中該連接器件提供基材固持器； v)將該經對位基材緊固於該連接器件中之基材固持器中； vi)使用接觸式夾持器將包括經對位基材之基材固持器進一步運輸至處理器件； vii)在該處理器件中處理仍緊固於各自基材固持器中之基材； viii)將包括經處理基材之基材固持器運輸至該連接器件，其中自該各自基材固持器解開該經處理基材； ix)使用非接觸式夾持器將經處理基材進一步運輸至後處理器件； x)在該後處理器件中後處理該基材； xi)使用非接觸式夾持器將經後處理基材自後處理器件運輸至儲存器件或使用非接觸式夾持器將其運回至裝載器件。 此外，本發明係關於用於加工類晶圓基材之裝置，其具有裝載器件、對位器件、連接器件、處理器件、後處理器件、儲存器件及接觸式夾持器與非接觸式夾持器，該接觸式夾持器與該非接觸式夾持器兩者均可依下列方式運輸基材： - 非接觸式夾持器或接觸式夾持器可將該基材自該裝載器件運輸至可對位該基材之對位器件； - 接觸式夾持器可將經對位基材自該對位器件運輸至連接器件，該連接器件可將經對位基材緊固於基材固持器中且將經處理基材解開至基材固持器外； - 接觸式夾持器可將該基材固持器自該連接器件運輸至可處理該基材之處理器件且將其運回至該連接器件； - 接觸式夾持器可將經處理基材自該連接器件運輸至該後處理器件； - 非接觸式夾持器可將經後處理基材自該後處理器件運輸至該儲存器件或運回至該裝載器件。 此外，本發明係關於將本發明方法或發明裝置用於加工提供類框架結構之類晶圓基材。通常，應預期接觸式夾持器及非接觸式夾持器之錯配累積且提供較壞之結果。然而，令人驚訝的是，注意到，在後處理時夾持器類型之此改變導致極大減小對非常敏感之測試基材之損壞。 如本文中所使用之術語「非接觸式夾持器」係指可在不與該基材表面接觸之情況下處理基材之夾持器。然而，通常，此等非接觸式夾持器較佳進一步提供至少一限制邊緣。若該基材遠離該非接觸式夾持器之居中位置而移動，則此限制邊緣可接觸該基材邊緣。因此，此限制邊緣通常對在基於(例如)該基材之慣性之移動期間防止損失該基材非常有用。 如本文中所使用之術語「接觸式夾持器」係指可在接觸物件時處置該物件之夾持器。此接觸式夾持器之實例係可在接觸基材表面時運輸基材之接觸式夾持器。較佳地，此接觸式夾持器選擇性地在該基材之外部分(如表示該基材表面之最外10%之區域(基於該基材表面之表面積))處接觸該基材。該接觸式夾持器之另一實例係可運輸基材固持器之夾持器。可運輸基材固持器之此夾持器(例如)附接至該基材固持器之某些懸掛元件以可逆地連接至該基材固持器。本文中，可運輸基材固持器之此夾持器較佳機械附接至該基材固持器。然而，其亦可使用熟習該技術者已知之任何其他方式來將其本身附接至此基材固持器(如使用真空吸取)。提供此等懸掛元件之基材固持器之實例可自(例如WO 2016/096946 A1)獲得。該發明方法及裝置似乎尤其適合於提供用於緊固及電接觸該基材之方式的此等基材固持器。 若組件或構件由術語「可...」或「可提供...」來限定，則視為藉由指稱擬執行之功能來將此等術語限制於此等經限定組件或構件之範疇內。換言之，該等組件或構件經特別修改或構形以完成該指定功能。
根據態樣，本發明係關於用於加工類晶圓基材之方法，其包括下列步驟： i)在裝載器件中提供基材； ii)使用非接觸式夾持器或接觸式夾持器將該基材自該裝載器件運輸至對位器件； iii)在該對位器件中對位該基材； iv)使用接觸式夾持器將經對位基材運輸至連接器件，其中該連接器件提供基材固持器； v)將該經對位基材緊固於該連接器件中之基材固持器中； vi)使用接觸式夾持器將包括經對位基材之基材固持器進一步運輸至處理器件； vii)在該處理器件中處理仍緊固於各自基材固持器中之基材； viii)將包括經處理基材之基材固持器運輸至該連接器件，其中自該各自基材固持器解開該經處理基材； ix)使用非接觸式夾持器將經處理基材進一步運輸至後處理器件； x)在該後處理器件中後處理該基材； xi)使用非接觸式夾持器將經後處理基材自該後處理器件運輸至儲存器件或使用非接觸式夾持器將其運回至該裝載器件。 本文中，須注意，(例如)步驟ii)可包含未明確提及之進一步步驟。例如，在將類晶圓基材運輸至對位器件之前對其進行某些檢測以偵測缺陷。 本文中，應瞭解，前述方法可利用多種裝載器件、對位器件、處理器件等等。前述方法經證明對加工尤其敏感之類晶圓基材尤其有用。本文中，前述方法步驟之組合提供類晶圓基材之安全加工且大幅降低損壞風險。 本文中所使用之較佳類型之非接觸式夾持器係伯努利夾持器。此伯努利夾持器利用基於氣流之伯努利夾具來對該基材提供黏著力，同時避免該基材表面與伯努利夾持器之接觸。 本發明中可使用之處理器件之實例係用於濕處理之處理器件，較佳為a)化學或電解金屬沈積、b)化學或電解蝕刻、及/或c)化學或電解清洗，更佳為電解金屬沈積、化學蝕刻及/或化學清洗。本發明方法經證明對用於化學或電解金屬沈積(電解金屬沈積更佳)之處理器件尤其有用。本文中所使用之尤其較佳類型之處理器件係用於電解銅沈積之處理器件(較佳為用於垂直電解銅沈積之處理器件)。 較佳類型之接觸式夾持器(尤其是如步驟iv)及ix)中所使用的可在接觸基材表面時運輸該基材之接觸式夾持器)係使用真空吸取之夾持器。 在本發明之較佳實施例中，該接觸式夾持器(尤其是可在接觸基材表面時運輸該基材之接觸式夾持器)係使用真空吸取之夾持器，且該非接觸式夾持器係伯努利型夾持器。此等夾持器經證明對運輸諸多種類型之基材尤其有用且可靠。 可在接觸該基材表面時運輸該基材之特定較佳類型之接觸式夾持器係提供可使用真空可逆地附接基材之至少3個(較佳為至少4個，更佳為至少6個)噴嘴之接觸式夾持器。此等接觸式夾持器經證明對將先前經對位之基材運輸至特定位置非常高效。較佳地，該等噴嘴經定位於該接觸式夾持器之表面之***處，以將該接觸式夾持器與該基材之接觸面積減小至最小值。 如本文中所使用之術語「連接器件」係指用於將該基材緊固至基材固持器之器件。較佳地，此連接器件係該裝置內之穩固附接器件。本文中，例如，將基材固持器引入至該連接器件中且將其打開。此後，將基材安放於打開之基材固持器中。接著，關閉該基材固持器且將其自該連接器件移除。或，(例如)將該基材固持器之第一部分引入至該連接器件中。在將該基材安放於該基材固持器之該第一部分上之後，將該基材固持器之第二部分可逆地緊固至該第一基材固持器部分。較佳地，關閉該基材固持器或可逆地堅固此第二基材固持器部分係基於整合於如WO 2016/096946 A1中所揭露之基材固持器中的機制。 此外，該基材之對位較佳導致用於該處理器件中之後續處理的經精確對位之基材。此精確對位提供將基材精確地定位於用於(例如)電解金屬沈積之基材固持器中以確保安全電接觸的可能性。此對位器件之實例係來自奧地利Mechatronic Systemtechnik GmbH之預對位器1207。 通常，該基材包括擬處理之至少一表面，例如，兩個表面。在處理及預處理該基材期間，擬處理之表面變得越來越敏感，且因此，越來越易於在加工該基材期間(尤其是運輸期間)損壞。該接觸式夾持器或該非接觸式夾持器較佳可在運輸期間在擬處理之基材表面上抓緊該基材。經證明，若步驟ii)、iv)、ix)及xi)之接觸式夾持器或非接觸式夾持器可完成此將尤其有用。 應注意，使用經配置固定至一或多個接觸式夾持器及非接觸式夾持器或可逆地附接至一或多個接觸式夾持器或非接觸式夾持器之多功能機械臂可尤其節省空間地實踐該發明方法及該裝置。較佳地，多功能機械臂經可逆地附接至接觸式夾持器或非接觸式夾持器，其中步驟ii)、iv)、ix)及xi)之接觸式夾持器及非接觸式夾持器經可逆地附接至此機械臂。例如，若使用此多功能機械臂，則可藉由用於步驟xi)中之非接觸式夾持器來輕易地替代步驟ix)中所使用之接觸式夾持器，其中相同機械臂可用於兩個步驟。 在本發明之進一步實施例中，多功能機械臂經可逆地附接至接觸式夾持器或非接觸式夾持器，其中步驟ii)、iv)、ix)、vi)及xi)之接觸式夾持器及非接觸式夾持器經可逆地附接至此機械臂。 此外，在本發明之進一步實施例中，步驟vii)之基材處理較佳係處理該基材之兩個表面。經證明，若該處理包含在該基材之兩側上之金屬沈積(較佳為電解金屬沈積)，則此類型之處理尤其有用。此等基材似乎將提供經增大之穩定性，從而允許(例如)較快移動顯然對慣性效應較不敏感之此基材且因此允許進一步提供加工時間之進一步縮減。 在本發明之較佳實施例中，該後處理包含乾燥該基材。在此乾燥程序之後使用非接觸式夾持器將極大減少對該基材表面之損壞。在該乾燥程序之後，該基材之經處理表面似乎尤其敏感，而在該乾燥程序之前，處理之後的基材似乎對表面損傷之敏感程度遠不及此。可使用之乾燥方法之實例係馬蘭戈尼乾燥法。 此外，該後處理器件中較佳包含至少一進一步後處理，例如沖洗。例如，經證明，該後處理包含沖洗及乾燥該基材通常係有益的。將該等兩個步驟組合於該後處理器件中將允許避免當將該基材緊固至該基材固持器時對該基材之沖洗步驟，該沖洗步驟需要(例如)明顯更大數量之清洗液體。本文中所使用之術語「沖洗」係指可清洗該基材表面之任何清洗程序。 雖然各步驟中可使用不同類型之接觸式夾持器或非接觸式夾持器，但通常，較佳在步驟iv)及ix)中使用相同接觸式夾持器。將相同接觸式夾持器用於此步驟允許減小組件數目且簡化所需要之器件及維護。在本發明之一些實施例中，若在步驟ii)中使用接觸式夾持器，則相同接觸式夾持器將用於步驟ii)、iv)及ix)中。 另外，在步驟ii)中利用非接觸式夾持器通常係有益的。雖然此時該基材表面似乎較不敏感，但使用此非接觸式夾持器似乎仍將為諸多基材提供一些進一步改良。 通常可使用步驟ii)及xi)中之相同非接觸式夾持器來實現組件數目之進一步減小及該器件及維護之簡化。應注意，在方法之兩個步驟中可有利地使用相同類型之非接觸式夾持器。 此外，經證明，使用如上文所解釋之非接觸式夾持器或接觸式夾持器(較佳為可在接觸該基材表面時運輸該基材之接觸式夾持器)係更有利的，其中該非接觸式夾持器或接觸式夾持器係可在該雙面夾持器之各面上運輸基材之雙面夾持器。經證明，在自由步驟ii)、iv)、ix)組成之群組選擇(更佳自由步驟iv)或ix)組成之群組選擇)之至少一步驟中利用此非接觸式夾持器或接觸式夾持器尤其有用。尤其地，較佳在步驟iv)及ix)中使用接觸式夾持器(較佳為相同接觸式夾持器)。應注意，使用此非接觸式夾持器或接觸式夾持器(較佳為可在接觸該基材表面時運輸基材之接觸式夾持器)允許進一步縮短該基材之加工時間，此係因為此允許同時可逆地附接兩個基材且同時組合加工多個基材之步驟。例如，當該機械臂移動至該連接器件以自該基材固持器獲得經處理基材時，附接至其之接觸式夾持器可已攜帶另一經對位(經處理或未經處理)基材且替代該基材固持器中所含有之基材。 本文中所揭露之發明方法經證明對類晶圓基材(如晶圓)非常有用。本文中，應注意，該發明方法對加工提供類框架結構之晶圓尤其有用。本文中所使用之片語「類框架結構」係指其中較薄內部分由較厚外部分包圍之結構。較佳地，該較厚外部分經定位於該類框架結構之邊緣處以提供穩定框架，從而導致該晶圓之穩定。可(例如)藉由磨蝕該晶圓之內部分以留出該晶圓之框架區域來產生此等晶圓。此「類框架結構」之實例係Taiko晶圓。 該裝載器件通常用於將該基材引入至該裝置中且將經處理基材取出該裝置。本文中，經證明，該裝載器件包括可儲存至少一基材之匣係有益的。(例如)若應加工不同類型之基材以評估其等之不同，則使用可含有一基材之匣係有益的。然而，通常，該匣較佳可含有複數個基材，如至少五個(更佳為至少十個)基材。使用此等匣將提供複數個基材可經引入且經自動加工，從而極大減小所需要之手動互動之數量的益處。更佳地，依將未處理基材儲存於一匣中而將經處理基材儲存於另一匣中之方式使用不同匣。 令人驚訝的是，使用該發明方法亦將允許自動加工自動提供類框架結構之複數個晶圓。通常，其中加工儲存於裝載器件中之多個基材的發明方法較佳重複至少兩次(更佳至少五次)。 該儲存器件可(例如)為經穩固附接的或可移除的匣，其中該儲存器件可用於暫時收集至少一基材。此儲存器件可用作該發明方法之後的程序之起始點。例如，經處理基材可經受一些後續之光阻劑剝離程序，其等發生於該發明裝置之不同部分中。 根據該發明方法之尤其較佳實施例，該基材處理包含如電解銅或鎳沈積之電解金屬沈積，且後處理該基材包含乾燥該基材(更佳包含沖洗及乾燥該基材)。據推測，將該基材精確安放於該基材固持器中以提供清楚界定之電接觸與作為後處理程序之此乾燥步驟之後令人驚訝地極大減小表面損壞之可能性的組合係導致經處理基材之質量極大提高之主要原因。 應注意，該發明方法尤其適合於用作潔淨室程序。本文中，基本上減少引入擬加工之基材及取出經加工基材之手動互動的高程度自動化似乎將極大減小損壞及污染之風險。本文中，通常，在表示此潔淨室內之特定裝置的封閉空間中實施該發明方法更佳。使用該發明方法可在僅需要較小數量之空間的情況下組合此等步驟。 根據另一態樣，本發明係關於用於加工類晶圓基材之裝置，其具有裝載器件、對位器件、連接器件、處理器件、後處理器件、儲存器件及接觸式夾持器及非接觸式夾持器，該接觸式夾持器與該非接觸式夾持器兩者均可依下列方式運輸基材： - 非接觸式夾持器或接觸式夾持器可將該基材自該裝載器件運輸至可對位該基材之對位器件； - 接觸式夾持器可將經對位基材自該對位器件運輸至連接器件，該連接器件可將經對位基材緊固於基材固持器中且自基材固持器解開經處理基材； - 接觸式夾持器可將該基材固持器自該連接器件運輸至可處理該基材之處理器件且將其運回至該連接器件； - 接觸式夾持器可將經處理基材自該連接器件運輸至該後處理器件； - 非接觸式夾持器可將經後處理基材自該後處理器件運輸至該儲存器件或運回至該裝載器件。 通常，該裝置更佳含有上文就該方法而言所指定之組件。 此外，該處理器件較佳係用於濕處理，較佳為a)化學或電解金屬沈積、b)化學或電解蝕刻、及/或c)化學或電解清洗，更佳為電解金屬沈積、化學蝕刻及/或化學清洗。本發明方法經證明對用於化學或電解金屬沈積(電解金屬沈積更佳)之處理器件尤其有用。本文中所使用之尤其較佳類型之處理器件係用於電解銅沈積之處理器件(較佳為用於電解銅沈積之垂直處理器件)。 根據另一態樣，本發明係關於將該發明方法或該發明裝置用於處理類晶圓基材之用途，其中該類晶圓基材係提供類框架結構之晶圓。應注意，該發明方法及裝置尤其適合於處理此等類型之晶圓。 通常，該裝置較佳提供將包括提供至少一基材之匣的裝載器件引入至該裝置中或將該裝載器件自該裝置取出之至少一開口。本文中，該至少一開口較佳係可手動操作的。尤其當將匣用作該裝載器件之部分(其中該匣可提供複數個基材)時，此開口允許簡單且高效地引入將擬處理之基材且移除經處理基材。 應注意，該發明裝置經證明對垂直電鍍尤其有用。此程序可(例如)用於將如銅或鎳之金屬電沈積至半導體晶圓之表面上。 提供下列非限制性實例以繪示本發明之較佳實施例且促進理解本發明，但該等實例不意在限制由隨附於本文中之技術方案所界定之本發明之範疇。 圖1展示發明裝置之一部分之示意性立體圖。本文中，該裝置提供裝載器件1，其包括左側上含有多個類晶圓基材之匣，其中該類晶圓基材係提供類框架結構之晶圓。使用非接觸式夾持器3將此等基材自裝載器件1運輸至對位器件2，該非接觸式夾持器係可逆地附接至機械臂7之伯努利型夾持器。基於對位器件2之大小，圖中未展示該裝置之細節(如用於固持及對位該基材之臂)。對位器件2對位該基材，從而在使用接觸式夾持器將基材運輸至連接器件5之前提供經精確對位之基材。本文中，該接觸式夾持器係經可逆地附接至機械臂7之真空吸取夾持器。藉由該基材固持器將該基材緊固至基材固持器(圖中未展示)。 此後，使用接觸式夾持器將該基材固持器運輸至該處理器件(圖中未展示)。在處理該基材(該基材之兩側上包含電解金屬沈積)之後，將含有該基材之基材固持器運輸至連接器件5。此處，自該基材固持器解開該基材。 使用接觸式夾持器將該經解開且經處理基材運輸至後處理器件6，該接觸式夾持器係經可逆地附接至機械臂7之真空吸取夾持器。在後處理器件6中發生包含乾燥該基材之後處理。此後，使用非接觸式夾持器3將該基材運輸至裝載器件1，該非接觸式夾持器係經可逆地附接至機械臂7之伯努利夾持器。 圖2展示如圖1中所展示之發明裝置之一部分之示意性側圖。本文中，該側視圖展示用於引入包括提供該等基材之匣的裝載器件之開口的蓋10。 圖3展示如圖1中所展示之發明裝置之一部分之示意性前視圖且圖4展示其之示意性俯視圖。 圖5展示自如圖1中所展示之發明裝置之一部分之背面的示意性橫截面。本文中，展示含有包括該匣之裝載器件1的開口之蓋10。此外，展示用於將該基材(例如)自對位器件2運輸至連接器件5之機械臂7之背面。 圖6展示如圖1中所展示之發明裝置之示意性立體圖之細節。本文中，展示非接觸式夾持器3經附接於其之機械臂7之一部分。在左側上展示對位器件2之一部分，其中可見用於固持及對位該基材的該等壁之一部分。 圖7展示接觸式夾持器4之示意性立體圖，該接觸式夾持器可在接觸如圖1中所展示之發明裝置中所使用之基材表面時運輸該基材。本文中，標記包含於該接觸式夾持器4中之八個噴嘴9之三者。該等噴嘴9提供接觸式夾持器4之表面之***以最小化接觸式夾持器4在該基材表面上之接觸面積。 圖8展示如圖1中所展示之發明裝置中所使用之非接觸式夾持器3之示意性立體圖。本文中，圖中未展示位於非接觸式夾持器3之中間的提供伯努利效應之開口。非接觸式夾持器3之平面中心區域由四個限制邊緣8包圍以防止該基材離開非接觸式夾持器3之中心。
1‧‧‧裝載器件
2‧‧‧對位器件
3‧‧‧非接觸式夾持器
4‧‧‧接觸式夾持器
5‧‧‧連接器件
6‧‧‧後處理器件
7‧‧‧機械臂
8‧‧‧限制邊緣
9‧‧‧噴嘴
10‧‧‧引入裝載器件之開口之蓋
為更完整理解本發明，參考結合隨附圖式而考量之下列[實施方式]，在該等圖式中： 圖1展示發明裝置之一部分之示意性立體圖。 圖2展示如圖1中所展示之發明裝置之一部分之示意性側視圖。 圖3展示如圖1中所展示之發明裝置之一部分之示意性前視圖。 圖4展示如圖1中所展示之發明裝置之一部分之示意性俯視圖。 圖5展示自如圖1中所展示之發明裝置之一部分之背面的示意性橫截面。 圖6展示如圖1中所展示之發明裝置之示意性立體圖之剪切圖。 圖7展示接觸式夾持器4之示意性立體圖，該接觸式夾持器可在接觸如圖1中所展示之發明裝置中所使用之基材表面時運輸該基材。 圖8展示如圖1中所展示之發明裝置中所使用之非接觸式夾持器3之示意性立體圖。

Claims (19)

  1. 一種用於加工類晶圓基材之方法，其包括下列步驟：i)在裝載器件(1)中提供該基材；ii)使用非接觸式夾持器(3)或接觸式夾持器(4)將該基材自該裝載器件(1)運輸至對位器件(2)；iii)在該對位器件(2)中對位該基材；iv)使用接觸式夾持器(4)將該經對位基材運輸至連接器件(5)，其中該連接器件(5)提供基材固持器；v)將該經對位基材緊固於該連接器件(5)中之該基材固持器中；vi)使用接觸式夾持器將包括該經對位基材之該基材固持器進一步運輸至處理器件；vii)在該處理器件中處理仍緊固於該各自基材固持器中之該基材；viii)將包括該經處理基材之該基材固持器運輸至該連接器件(5)，其中自該各自基材固持器解開該經處理基材；ix)使用接觸式夾持器(4)將該經處理基材進一步運輸至後處理器件(6)；x)在該後處理器件(6)中後處理該基材；xi)使用非接觸式夾持器(3)將該經後處理基材自該後處理器件(6)運輸至儲存器件或使用非接觸式夾持器(3)將其運回至該裝載器件(1)。
  2. 如請求項1之用於加工基材之方法，其中在用於濕處理之該處理器件中處理該基材。
  3. 如請求項2之用於加工基材之方法，其中在用於a)化學或電解金屬沈積、b)化學或電解蝕刻、及/或c)化學或電解清洗之該處理器件中處理該基材。
  4. 如請求項2之用於加工基材之方法，其中在用於電解金屬沈積、化學蝕刻及/或化學清洗之該處理器件中處理該基材。
  5. 如請求項1之用於加工基材之方法，其中該接觸式夾持器(4)係使用真空吸取之夾持器且該非接觸式夾持器(3)係伯努利型夾持器。
  6. 如請求項1至4中之任一者之用於加工基材之方法，其中該基材之該對位導致用於該處理器件中之後續處理的經精確對位基材。
  7. 如請求項1或5之用於加工基材之方法，其中該基材包括擬處理之至少一表面且該接觸式夾持器(4)或該非接觸式夾持器(3)可在運輸期間在擬處理之該表面上抓緊該基材。
  8. 如請求項1或5之用於加工基材之方法，其中使用機械臂，且步驟ii)、iv)、ix)及xi)之該接觸式夾持器(4)或非接觸式夾持器(3)經可逆地附接至該機械臂(7)。
  9. 如請求項1至4中之任一者之用於加工基材之方法，其中步驟vii)之該基材之該處理係處理該基材之兩個表面。
  10. 如請求項1至4中之任一者之用於加工基材之方法，其中該後處理包含：乾燥該基材。
  11. 如請求項1至4中之任一者之用於加工基材之方法，其中該基材係提供類框架結構之晶圓。
  12. 如請求項1至4中之任一者之用於加工基材之方法，其中該裝載器件(1)包括可儲存至少一基材之匣。
  13. 如請求項1或5之用於加工基材之方法，其中步驟iv)及ix)中所使用之該接觸式夾持器係雙面夾持器，其可在該雙面夾持器之各面上運輸基材。
  14. 一種用於加工類晶圓基材之裝置，其具有裝載器件(1)、對位器件、連接器件(5)、處理器件、後處理器件(6)、儲存器件及接觸式夾持器(4)與非接觸式夾持器，該接觸式夾持器(4)與該非接觸式夾持器兩者均可依下列方式運輸該基材：非接觸式夾持器(3)或接觸式夾持器(4)可將該基材自該裝載器件(1)運輸至可對位該基材之該對位器件(2)；接觸式夾持器(4)可將經對位基材自該對位器件(2)運輸至該連接器件(5)，該連接器件(5)可將該經對位基材緊固於基材固持器中且自基材固持器解開經處理基材；接觸式夾持器(4)可將該基材固持器自該連接器件(5)運輸至可處理該基材之該處理器件且將其運回至該連接器件(5)；接觸式夾持器(4)可將該經處理基材自該連接器件(5)運輸至該後處理器件(6)；非接觸式夾持器(3)可將該經後處理基材自該後處理器件(6)運輸至該儲存器件或運回至該裝載器件(1)。
  15. 如請求項14之用於加工基材之裝置，其中該處理器件係用於濕處理。
  16. 如請求項15之用於加工基材之裝置，其中該處理器件係用於a)化學或電解金屬沈積、b)化學或電解蝕刻、及/或c)化學或電解清洗。
  17. 如請求項15之用於加工基材之裝置，其中該處理器件係用於電解金屬沈積、化學蝕刻及/或化學清洗。
  18. 如請求項14至17之任一者之用於加工基材之裝置，其中該基材包括擬處理之至少一表面，且該接觸式夾持器(4)或該非接觸式夾持器(3)可在運輸期間在該基材之擬處理表面上抓緊該基材。
  19. 一種如請求項1至13之任何者之方法或如請求項14至18之任何者之用於加工類晶圓基材之裝置之用途，其中該類晶圓基材係提供類框架結構之晶圓。
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