TWI652703B - Soft magnetic film - Google Patents
Soft magnetic film Download PDFInfo
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- TWI652703B TWI652703B TW103106555A TW103106555A TWI652703B TW I652703 B TWI652703 B TW I652703B TW 103106555 A TW103106555 A TW 103106555A TW 103106555 A TW103106555 A TW 103106555A TW I652703 B TWI652703 B TW I652703B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
- H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
- H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/16—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates the magnetic material being applied in the form of particles, e.g. by serigraphy, to form thick magnetic films or precursors therefor
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Abstract
本發明之軟磁性膜為含有扁平狀之軟磁性粒子之軟磁性膜。於升溫速度10℃/分鐘、頻率1Hz之動態黏彈性測定中的200℃下之拉伸儲存模數E'200與23℃下之拉伸儲存模數E'23之比率E'200/E'23為0.25以上。 The soft magnetic film of the present invention is a soft magnetic film containing flat soft magnetic particles. At a temperature rise rate 10 ℃ / min, the tensile elasticity was measured under the dynamic viscosity frequency of 1Hz in 200 ℃ storage modulus E 'at 200 is the 23 deg.] C and a tensile storage modulus E' 23 ratio of E '200 / E' 23 is 0.25 or more.
Description
本發明係關於一種軟磁性膜。 The present invention relates to a soft magnetic film.
使筆型之位置指示器於位置檢測平面上移動而檢測位置之位置檢測裝置被稱為座標讀取裝置(digitizer)，作為電腦之輸入裝置而普及。該位置檢測裝置具備位置檢測平面板、及配置於其下方且於基板之表面形成有迴路線圈之電路基板(感測器基板)。並且，藉由利用由位置指示器與迴路線圈所產生之電磁感應而檢測位置指示器之位置。 A position detecting device that moves a pen type position indicator on a position detecting plane to detect a position is called a digitizer, and is popular as an input device of a computer. The position detecting device includes a position detecting plane plate and a circuit board (sensor substrate) disposed below the substrate and having a loop coil formed on the surface of the substrate. And, the position of the position indicator is detected by utilizing electromagnetic induction generated by the position indicator and the loop coil.
針對於位置檢測裝置，為了控制電磁感應時所產生的磁通而提高通信效率，提出有於感測器基板之與位置檢測平面相反側之面(相反面)配置含有軟磁性物質之軟磁性膜之方法(例如參照專利文獻1)。 In order to improve the communication efficiency in order to control the magnetic flux generated when the electromagnetic induction is applied to the position detecting device, it is proposed to arrange a soft magnetic film containing a soft magnetic substance on the surface (opposite side) of the sensor substrate opposite to the position detecting plane. The method (for example, refer to Patent Document 1).
專利文獻1中揭示有含有軟磁性粉末、包含丙烯酸系橡膠、酚樹脂、環氧樹脂及三聚氰胺等之黏合劑樹脂、及膦酸金屬鹽的軟磁性膜。該軟磁性膜以較高比率含有膦酸金屬鹽或三聚氰胺，藉此不會對電子機器之可靠性造成影響而對電路基板賦予阻燃性。 Patent Document 1 discloses a soft magnetic film containing a soft magnetic powder, a binder resin including an acrylic rubber, a phenol resin, an epoxy resin, and melamine, and a metal phosphonate salt. The soft magnetic film contains a metal phosphonic acid salt or melamine at a high ratio, thereby imparting flame retardancy to the circuit substrate without affecting the reliability of the electronic device.
[專利文獻1]日本專利特開2012-212790號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-212790
且說，軟磁性膜係安裝於電路基板上，其後實施回焊步驟。但 是，磁性膜若被實施回焊步驟等超過200℃之高溫處理，則會產生相對磁導率等磁特性劣化之不良情況。 Further, the soft magnetic film is mounted on the circuit board, and then the reflow step is performed. but When the magnetic film is subjected to a high temperature treatment of more than 200 ° C, such as a reflow step, the magnetic properties such as relative magnetic permeability are deteriorated.
本發明之目的在於提供一種即便於回焊步驟後，亦可抑制磁特性之劣化的軟磁性膜。 An object of the present invention is to provide a soft magnetic film which can suppress deterioration of magnetic properties even after the reflow step.
本發明之軟磁性膜之特徵在於：其係含有扁平狀之軟磁性粒子者，且於升溫速度10℃/分鐘、頻率1Hz之動態黏彈性測定中的200℃下之拉伸儲存模數E'200與23℃下之拉伸儲存模數E'23之比率E'200/E'23為0.25以上。 The soft magnetic film of the present invention is characterized in that it is a flat-packed soft magnetic particle, and the tensile storage modulus E' at 200 ° C in a dynamic viscoelasticity measurement at a heating rate of 10 ° C/min and a frequency of 1 Hz. a tensile storage modulus E of 200 and 23 deg.] C under the '23 ratio of E' 200 / E '23 is 0.25 or more.
又，本發明之軟磁性膜較佳為200℃下之拉伸儲存模數E'200為8.0×108Pa以上。 Further, the soft magnetic film of the present invention preferably has a tensile storage modulus E' 200 at 200 ° C of 8.0 × 10 8 Pa or more.
又，本發明之軟磁性膜較佳為由含有環氧樹脂、酚樹脂及丙烯酸系樹脂之軟磁性樹脂組合物所形成。 Further, the soft magnetic film of the present invention is preferably formed of a soft magnetic resin composition containing an epoxy resin, a phenol resin, and an acrylic resin.
又，本發明之軟磁性膜較佳為於上述軟磁性樹脂組合物中，相對於除上述軟磁性粒子以外之軟磁性粒子除外成分100質量份，上述環氧樹脂及上述酚樹脂之合計含量為20質量份以上且99質量份以下。 Moreover, in the soft magnetic resin composition of the present invention, the total content of the epoxy resin and the phenol resin is preferably 100 parts by mass of the soft magnetic particle-excluding component other than the soft magnetic particles. 20 parts by mass or more and 99 parts by mass or less.
又，本發明之軟磁性膜較佳為30體積%以上且70體積%。 Further, the soft magnetic film of the present invention is preferably 30% by volume or more and 70% by volume.
又，本發明之軟磁性膜較佳為硬化狀態。 Further, the soft magnetic film of the present invention is preferably in a hardened state.
本發明之軟磁性膜即便於實施回焊步驟等高溫處理後，亦可抑制磁特性之劣化，具備良好之磁特性。 The soft magnetic film of the present invention can suppress deterioration of magnetic properties even after high-temperature treatment such as a reflow step, and has excellent magnetic properties.
本發明之軟磁性熱膜例如係由含有軟磁性粒子及樹脂成分之軟磁性組合物形成為膜狀(片狀)。 The soft magnetic hot film of the present invention is formed into a film shape (sheet shape), for example, from a soft magnetic composition containing soft magnetic particles and a resin component.
作為構成軟磁性粒子之軟磁性材料，例如可列舉：磁性不鏽鋼(Fe-Cr-Al-Si合金)、三達斯特合金(Sendust)(Fe-Si-Al合金)、坡莫合金(Permalloy)(Fe-Ni合金)、矽銅(Fe-Cu-Si合金)、Fe-Si合金、Fe-Si-B(-Cu-Nb)合金、Fe-Si-Cr-Ni合金、Fe-Si-Cr合金、Fe-Si-Al-Ni-Cr合金、鐵氧體等。該等之中，就磁特性之方面而言，可較佳地列舉三達斯特合金(Fe-Si-Al合金)。 Examples of the soft magnetic material constituting the soft magnetic particles include magnetic stainless steel (Fe-Cr-Al-Si alloy), Zendust (Fe-Si-Al alloy), and Permalloy. (Fe-Ni alloy), beryllium copper (Fe-Cu-Si alloy), Fe-Si alloy, Fe-Si-B (-Cu-Nb) alloy, Fe-Si-Cr-Ni alloy, Fe-Si-Cr Alloy, Fe-Si-Al-Ni-Cr alloy, ferrite, and the like. Among these, a tridext alloy (Fe-Si-Al alloy) is preferably exemplified in terms of magnetic properties.
該等之中，可更佳地列舉Si含有比率為9~15質量%的Fe-Si-Al合金。藉此，可提高軟磁性膜之磁性特性。 Among these, an Fe-Si-Al alloy having a Si content ratio of 9 to 15% by mass can be more preferably exemplified. Thereby, the magnetic properties of the soft magnetic film can be improved.
軟磁性粒子係形成為扁平狀(板狀)，即，形成為厚度較薄且面寬廣之形狀。軟磁性粒子之扁平率(扁平度)例如為8以上，較佳為15以上，又，例如為80以下，較佳為65以下。扁平率例如可以將軟磁性粒子之平均粒徑(平均長度)除以軟磁性粒子之平均厚度所得的縱橫比之形式算出。 The soft magnetic particles are formed into a flat shape (plate shape), that is, a shape having a small thickness and a wide surface. The flatness (flatness) of the soft magnetic particles is, for example, 8 or more, preferably 15 or more, and is, for example, 80 or less, preferably 65 or less. The flatness ratio can be calculated, for example, by dividing the average particle diameter (average length) of the soft magnetic particles by the aspect ratio obtained by dividing the average thickness of the soft magnetic particles.
軟磁性粒子之平均粒徑(平均長度)例如為3.5μm以上，較佳為10μm以上，又，例如為100μm以下。平均厚度例如為0.3μm以上，較佳為0.5μm以上，又，例如為3μm以下，較佳為2.5μm以下。藉由調整軟磁性粒子之扁平率、平均粒徑、平均厚度等，可減小由軟磁性粒子所致之退磁場之影響，其結果，可使軟磁性粒子之磁導率增加。再者，為了使軟磁性粒子之大小均勻，亦可視需要使用利用篩等分級之軟磁性粒子。 The average particle diameter (average length) of the soft magnetic particles is, for example, 3.5 μm or more, preferably 10 μm or more, and is, for example, 100 μm or less. The average thickness is, for example, 0.3 μm or more, preferably 0.5 μm or more, and is, for example, 3 μm or less, or preferably 2.5 μm or less. By adjusting the flatness ratio, the average particle diameter, the average thickness, and the like of the soft magnetic particles, the influence of the demagnetizing field by the soft magnetic particles can be reduced, and as a result, the magnetic permeability of the soft magnetic particles can be increased. Further, in order to make the size of the soft magnetic particles uniform, it is also possible to use soft magnetic particles classified by a sieve or the like as needed.
軟磁性樹脂組合物(進一步而言為軟磁性膜)中之軟磁性粒子之質量比率例如為70質量%以上，較佳為80質量%以上，更佳為85質量%以上，又，例如為95質量%以下，較佳為92質量%以下，更佳為90質量%以下。軟磁性樹脂組合物中之軟磁性粒子之體積比率例如為30體積%以上，較佳為40體積%以上，更佳為50體積%以上，又，例如為80體積%以下，較佳為70體積%以下，更佳為60體積%以下。藉由設 為上述上限以下之範圍，而使軟磁性膜之成形性優異。另一方面，藉由設為上述下限以上之範圍，而使軟磁性膜之磁特性優異。 The mass ratio of the soft magnetic particles in the soft magnetic resin composition (further, the soft magnetic film) is, for example, 70% by mass or more, preferably 80% by mass or more, more preferably 85% by mass or more, and further, for example, 95. The mass% or less is preferably 92% by mass or less, more preferably 90% by mass or less. The volume ratio of the soft magnetic particles in the soft magnetic resin composition is, for example, 30% by volume or more, preferably 40% by volume or more, more preferably 50% by volume or more, and further, for example, 80% by volume or less, preferably 70% by volume. % or less, more preferably 60% by volume or less. By setting The soft magnetic film is excellent in moldability in the range of the upper limit or less. On the other hand, the magnetic properties of the soft magnetic film are excellent by setting the range of the lower limit or more.
作為樹脂成分，可含有熱固性樹脂及熱塑性樹脂中之任一者，較佳為含有熱固性樹脂。 The resin component may contain any of a thermosetting resin and a thermoplastic resin, and preferably contains a thermosetting resin.
作為熱固性樹脂，可列舉：環氧樹脂、酚樹脂、胺基樹脂、不飽和聚酯樹脂、聚胺基甲酸酯樹脂、聚矽氧樹脂、脲樹脂、三聚氰胺樹脂、熱固性聚醯亞胺樹脂、鄰苯二甲酸二烯丙酯樹脂等。可較佳地列舉環氧樹脂、酚樹脂，可更佳地列舉環氧樹脂及酚樹脂之併用。該等可單獨使用或併用2種以上。 Examples of the thermosetting resin include an epoxy resin, a phenol resin, an amine resin, an unsaturated polyester resin, a polyurethane resin, a polyoxyl resin, a urea resin, a melamine resin, and a thermosetting polyimide resin. Diallyl phthalate resin and the like. An epoxy resin or a phenol resin is preferably used, and a combination of an epoxy resin and a phenol resin can be more preferably used. These may be used alone or in combination of two or more.
環氧樹脂例如可使用用作接著劑組合物者，可列舉：雙酚型環氧樹脂(尤其是雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、溴化雙酚A型環氧樹脂、氫化雙酚A型環氧樹脂、雙酚AF型環氧樹脂等)、酚型環氧樹脂(尤其是，苯酚酚醛清漆型環氧樹脂、鄰甲酚酚醛清漆型環氧樹脂等)、聯苯型環氧樹脂、萘型環氧樹脂、茀型環氧樹脂、三羥基苯基甲烷型環氧樹脂、四酚基乙烷型環氧樹脂等。又，例如亦可列舉：乙內醯脲型環氧樹脂、異氰尿酸三縮水甘油酯型環氧樹脂、縮水甘油胺型環氧樹脂等。該等可單獨使用或併用2種以上。 The epoxy resin can be used, for example, as an adhesive composition, and examples thereof include a bisphenol type epoxy resin (especially a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, Brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol AF type epoxy resin, etc.), phenol type epoxy resin (especially, phenol novolac type epoxy resin, o-cresol novolac) A varnish-type epoxy resin, etc., a biphenyl type epoxy resin, a naphthalene type epoxy resin, a fluorene type epoxy resin, a trishydroxyphenylmethane type epoxy resin, a tetraphenol ethane type epoxy resin, or the like. Further, for example, an intramethylene urethane type epoxy resin, a isocyanuric acid triglycidyl type epoxy resin, a glycidylamine type epoxy resin, or the like may be mentioned. These may be used alone or in combination of two or more.
該等環氧樹脂之中，可較佳地列舉雙酚型環氧樹脂，可更佳地列舉雙酚A型環氧樹脂。藉由含有環氧樹脂，而與酚樹脂之反應性優異，其結果，軟磁性膜之耐回焊性優異。 Among these epoxy resins, a bisphenol type epoxy resin is preferable, and a bisphenol A type epoxy resin can be more preferably mentioned. By containing an epoxy resin, it is excellent in reactivity with a phenol resin, and as a result, the soft magnetic film is excellent in reflow resistance.
酚樹脂為環氧樹脂之硬化劑，可列舉：例如苯酚酚醛清漆樹脂、苯酚芳烷基樹脂、甲酚酚醛清漆樹脂、第三丁基苯酚酚醛清漆樹脂、壬基苯酚酚醛清漆樹脂等酚醛清漆型酚樹脂，例如可溶酚醛型酚樹脂，例如聚對羥基苯乙烯等聚羥基苯乙烯。該等可單獨使用或併用2種以上。 The phenol resin is a curing agent for an epoxy resin, and examples thereof include a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, a third butyl phenol novolak resin, and a nonylphenol novolak resin. A phenol resin such as a resol type phenol resin such as polyhydroxystyrene such as polyparaxyl styrene. These may be used alone or in combination of two or more.
該等酚樹脂之中，可較佳地列舉酚醛清漆型樹脂，可更佳地列舉苯酚酚醛清漆樹脂、苯酚芳烷基樹脂，可進而較佳地列舉苯酚芳烷基樹脂。藉由含有該等酚樹脂，而與環氧樹脂之反應性優異，其結果，軟磁性膜之耐回焊性優異。 Among these phenol resins, a novolak type resin is preferably exemplified, and a phenol novolak resin or a phenol aralkyl resin can be more preferably exemplified, and a phenol aralkyl resin can be further preferably exemplified. By containing these phenol resins, the reactivity with an epoxy resin is excellent, and as a result, the soft magnetic film is excellent in the reflow resistance.
在樹脂成分併用環氧樹脂及酚樹脂時，於酚樹脂之羥基當量相對於環氧樹脂之環氧當量100g/eq為1g/eq以上且未達100g/eq之情形時，環氧樹脂相對於樹脂成分100質量份之含有比率例如為15質量份以上，較佳為30質量份以上，更佳為45質量份以上，又，例如亦為70質量份以下，較佳為50質量份以下，酚樹脂相對於樹脂成分100質量份之含有比率例如為5質量份以上，較佳為15質量份以上，又，例如亦為30質量份以下，較佳為25質量份以下。 When the epoxy resin and the phenol resin are used in combination with the resin component, when the hydroxyl equivalent of the phenol resin is 1 g/eq or more and less than 100 g/eq with respect to the epoxy equivalent of the epoxy resin of 100 g/eq, the epoxy resin is relative to the epoxy resin. The content ratio of the resin component is, for example, 15 parts by mass or more, preferably 30 parts by mass or more, more preferably 45 parts by mass or more, and for example, 70 parts by mass or less, preferably 50 parts by mass or less, of phenol. The content ratio of the resin to 100 parts by mass of the resin component is, for example, 5 parts by mass or more, preferably 15 parts by mass or more, and for example, 30 parts by mass or less, preferably 25 parts by mass or less.
於酚樹脂之羥基當量相對於環氧樹脂之環氧當量100g/eq為100g/eq以上且未達200g/eq之情形時，環氧樹脂相對於樹脂成分100質量份之含有比率例如為10質量份以上，較佳為25質量份以上，又，例如亦為50質量份以下，酚樹脂相對於樹脂成分100質量份之含有比率例如為10質量份以上，較佳為25質量份以上，又，例如亦為50質量份以下。 When the hydroxyl equivalent of the phenol resin is 100 g/eq or more and less than 200 g/eq with respect to the epoxy equivalent 100 g/eq of the epoxy resin, the content ratio of the epoxy resin to 100 parts by mass of the resin component is, for example, 10 mass. The content of the phenol resin to 100 parts by mass of the resin component is, for example, 10 parts by mass or more, preferably 25 parts by mass or more, more preferably 25 parts by mass or more, and further preferably 25 parts by mass or more. For example, it is also 50 parts by mass or less.
於酚樹脂之羥基當量相對於環氧樹脂之環氧當量100g/eq為200g/eq以上且1000g/eq以下之情形時，環氧樹脂相對於樹脂成分100質量份之含有比率例如為5質量份以上，較佳為15質量份以上，又，例如亦為30質量份以下，酚樹脂相對於樹脂成分100質量份之含有比率例如為15質量份以上，較佳為35質量份以上，又，例如亦為70質量份以下。 When the hydroxyl equivalent of the phenol resin is 200 g/eq or more and 1000 g/eq or less with respect to the epoxy equivalent 100 g/eq of the epoxy resin, the content ratio of the epoxy resin to 100 parts by mass of the resin component is, for example, 5 parts by mass. The content ratio of the phenol resin to 100 parts by mass of the resin component is, for example, 15 parts by mass or more, preferably 35 parts by mass or more, and more preferably, for example, 15 parts by mass or more. It is also 70 mass parts or less.
再者，併用2種環氧樹脂之情形之環氧當量係將各環氧樹脂之環氧當量乘以各環氧樹脂相對於環氧樹脂總量之質量比率，再將其等相加所得的全部環氧樹脂之環氧當量。 Furthermore, the epoxy equivalent of the two epoxy resins is used to multiply the epoxy equivalent of each epoxy resin by the mass ratio of each epoxy resin to the total amount of the epoxy resin, and then add them together. Epoxy equivalent of all epoxy resins.
又，酚樹脂中之羥基當量相對於環氧樹脂之環氧基每1當量，例如為0.2當量以上，較佳為0.5當量以上，又，例如亦為2.0當量以下，較佳為1.2當量以下。若羥基之量在上述範圍內，則半硬化狀態下之軟磁性膜之硬化反應變得良好，又，可抑制劣化。 In addition, the hydroxyl group equivalent of the phenol resin is, for example, 0.2 equivalent or more, preferably 0.5 equivalent or more, and also 2.0 equivalents or less, preferably 1.2 equivalents or less, per equivalent of the epoxy group of the epoxy resin. When the amount of the hydroxyl group is within the above range, the hardening reaction of the soft magnetic film in the semi-hardened state becomes good, and deterioration can be suppressed.
樹脂成分除熱固性樹脂以外亦較佳為含有丙烯酸系樹脂。更佳為併用丙烯酸系樹脂、環氧樹脂及酚樹脂。進而較佳為樹脂成分僅由環氧樹脂、酚樹脂及丙烯酸系樹脂構成。藉由使樹脂成分含有該等樹脂，而於藉由積層複數層半硬化狀態之軟磁性膜並進行熱壓而製造一片硬化狀態之軟磁性膜時，可獲得積層界面無不均而均勻且磁特性良好之軟磁性膜。 The resin component preferably contains an acrylic resin in addition to the thermosetting resin. More preferably, an acrylic resin, an epoxy resin, and a phenol resin are used in combination. Further preferably, the resin component is composed only of an epoxy resin, a phenol resin, and an acrylic resin. When the resin component contains the resin, a soft magnetic film in a hardened state is produced by laminating a plurality of layers of a semi-hardened soft magnetic film, whereby a laminated interface can be obtained without unevenness and uniformity. A soft magnetic film with good characteristics.
作為丙烯酸系樹脂，例如可列舉藉由以具有直鏈或分支之烷基之(甲基)丙烯酸烷基酯之1種或2種以上作為單體成分並使該單體成分聚合而獲得的丙烯酸系聚合物等。再者，「(甲基)丙烯酸(醯)」表示「丙烯酸(醯)及/或甲基丙烯酸(醯)」。 The acrylic resin is, for example, acrylic acid obtained by polymerizing one or two or more kinds of alkyl (meth)acrylates having a linear or branched alkyl group as a monomer component and polymerizing the monomer component. It is a polymer or the like. Further, "(meth)acrylic acid (醯)" means "acrylic acid (醯) and/or methacrylic acid (醯)".
作為烷基，例如可列舉：甲基、乙基、丙基、異丙基、正丁基、第三丁基、異丁基、戊基、異戊基、己基、庚基、環己基、2-乙基己基、辛基、異辛基、壬基、異壬基、癸基、異癸基、十一烷基、月桂基、十三烷基、十四烷基、硬脂基、十八烷基、十二烷基等碳數1~20之烷基。可較佳地列舉碳數1~6之烷基。 Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a n-butyl group, a tert-butyl group, an isobutyl group, a pentyl group, an isopentyl group, a hexyl group, a heptyl group, a cyclohexyl group, and 2 -ethylhexyl, octyl, isooctyl, decyl, isodecyl, decyl, isodecyl, undecyl, lauryl, tridecyl, tetradecyl, stearyl, octadecyl An alkyl group such as an alkyl group or a dodecyl group having 1 to 20 carbon atoms. An alkyl group having 1 to 6 carbon atoms is preferred.
丙烯酸系聚合物亦可為(甲基)丙烯酸烷基酯與其他單體之共聚物。 The acrylic polymer may also be a copolymer of an alkyl (meth)acrylate and another monomer.
作為其他單體，可列舉：例如丙烯酸縮水甘油酯、甲基丙烯酸縮水甘油酯等含縮水甘油基之單體，例如丙烯酸、甲基丙烯酸、丙烯酸羧基乙酯、丙烯酸羧基戊酯、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸等含羧基之單體，例如順丁烯二酸酐、伊康酸酐等酸酐單體，例如(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯 酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯或丙烯酸(4-羥基甲基環己基)-甲酯等含羥基之單體，例如苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺基丙酯、(甲基)丙烯醯氧基萘磺酸等含磺酸基之單體，丙烯醯基磷酸2-羥基乙酯等含磷酸基之單體，例如苯乙烯單體、丙烯腈等。 Examples of the other monomer include glycidyl group-containing monomers such as glycidyl acrylate and glycidyl methacrylate, such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxy amyl acrylate, and itaconic acid. a carboxyl group-containing monomer such as maleic acid, fumaric acid or crotonic acid, for example, an acid anhydride monomer such as maleic anhydride or itaconic anhydride, for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl methacrylate, (meth) acrylate Acid 4-hydroxybutyl ester, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate Or a hydroxyl group-containing monomer such as (4-hydroxymethylcyclohexyl)-methyl acrylate, such as styrenesulfonic acid, allylsulfonic acid, 2-(methyl)propenylamine-2-methylpropanesulfonic acid , (meth) acrylamide propyl sulfonic acid, sulfopropyl (meth) acrylate, sulfonic acid group-containing monomer such as (meth) propylene phthaloxy naphthalene sulfonic acid, 2-hydroxy propyl decyl phosphate A phosphate group-containing monomer such as an ester, such as a styrene monomer, acrylonitrile or the like.
該等之中，可較佳地列舉含縮水甘油基之單體、含羧基之單體或含羥基之單體。於丙烯酸系樹脂為(甲基)丙烯酸烷基酯與除該等以外之其他單體之共聚物之情形、即丙烯酸系樹脂具有縮水甘油基、羧基或羥基之情形時，軟磁性膜之耐熱性優異。 Among these, a glycidyl group-containing monomer, a carboxyl group-containing monomer or a hydroxyl group-containing monomer can be preferably exemplified. When the acrylic resin is a copolymer of an alkyl (meth)acrylate and a monomer other than the above, that is, when the acrylic resin has a glycidyl group, a carboxyl group or a hydroxyl group, the heat resistance of the soft magnetic film Excellent.
於為(甲基)丙烯酸烷基酯與其他單體之共聚物之情形時，其他單體之調配比率(質量)係相對於共聚物較佳為40質量%以下。 In the case of a copolymer of an alkyl (meth) acrylate and another monomer, the compounding ratio (mass) of the other monomer is preferably 40% by mass or less based on the copolymer.
丙烯酸系樹脂之重量平均分子量例如為1×105以上，較佳為3×105以上，又，例如亦為1×106以下。藉由設為該範圍，而使軟磁性膜之接著性、耐熱性優異。再者，重量平均分子量可藉由凝膠滲透層析法(GPC)，利用標準聚苯乙烯換算值而測定。 The weight average molecular weight of the acrylic resin is, for example, 1 × 10 5 or more, preferably 3 × 10 5 or more, and is, for example, also 1 × 10 6 or less. By setting it as this range, it is excellent in the adhesiveness and heat resistance of a soft magnetic film. Further, the weight average molecular weight can be measured by gel permeation chromatography (GPC) using a standard polystyrene equivalent value.
丙烯酸系樹脂之玻璃轉移點(Tg)例如為-30℃以上，較佳為-20℃以上，又，例如亦為30℃以下，較佳為15℃以下。若為上述下限以上，則半硬化狀態之軟磁性膜之接著性優異。另一方面，若為上述上限以下，則軟磁性膜之操作性優異。再者，玻璃轉移點可藉由使用動態黏彈性測定裝置(DMA(Dynamic Mechanical Analyzer，動態機械分析儀)，頻率1Hz，升溫速度10℃/分鐘)所測得之損耗正切(tanδ)之極大值而獲得。 The glass transition point (Tg) of the acrylic resin is, for example, -30 ° C or higher, preferably -20 ° C or higher, and is also, for example, 30 ° C or lower, preferably 15 ° C or lower. When it is more than the above lower limit, the soft magnetic film in a semi-hardened state is excellent in adhesion. On the other hand, when it is less than or equal to the above upper limit, the soft magnetic film is excellent in handleability. Furthermore, the glass transition point can be measured by a dynamic viscoelasticity measuring device (DMA (Dynamic Mechanical Analyzer), frequency 1 Hz, heating rate 10 ° C / min) to measure the maximum value of the loss tangent (tan δ) And get.
於樹脂成分含有丙烯酸系樹脂之情形時，樹脂成分中之熱固性樹脂之含有比率例如為20質量%以上，較佳為超過50質量%，更佳為 60質量%以上，更佳為65質量%以上。又，例如為90質量%以下，較佳為80質量%以下，進而較佳為70質量%以下。於熱固性樹脂之含有比率為上述範圍之情形、尤其是富含熱固性樹脂(超過50質量%)之情形時，可有效地抑制由高溫所致之樹脂之膨脹、進而軟磁性膜之空隙之產生，因此軟磁性膜之耐回焊優異。 When the resin component contains an acrylic resin, the content ratio of the thermosetting resin in the resin component is, for example, 20% by mass or more, preferably 50% by mass or more, more preferably 60% by mass or more, more preferably 65% by mass or more. Further, for example, it is 90% by mass or less, preferably 80% by mass or less, and more preferably 70% by mass or less. When the content ratio of the thermosetting resin is in the above range, in particular, when the thermosetting resin is contained (more than 50% by mass), the expansion of the resin due to the high temperature and the generation of the void of the soft magnetic film can be effectively suppressed. Therefore, the soft magnetic film is excellent in reflow resistance.
樹脂成分中之丙烯酸系樹脂之含有比率例如為10質量%以上，較佳為20質量%以上，更佳為30質量%以上，又，例如為80質量%以下，較佳為未達50質量%，更佳為40質量%以下，進而較佳為35質量%以下。 The content ratio of the acrylic resin in the resin component is, for example, 10% by mass or more, preferably 20% by mass or more, more preferably 30% by mass or more, and for example, 80% by mass or less, preferably less than 50% by mass. More preferably, it is 40 mass% or less, More preferably, it is 35 mass% or less.
軟磁性樹脂組合物中之樹脂成分之含有比率例如為5質量%以上，較佳為8質量%以上，更佳為10質量%以上，又，例如為30質量%以下，較佳為20質量%以下，更佳為15質量%以下。藉由設為上述範圍，而使軟磁性膜之成膜性、磁特性優異。 The content ratio of the resin component in the soft magnetic resin composition is, for example, 5% by mass or more, preferably 8% by mass or more, more preferably 10% by mass or more, and further, for example, 30% by mass or less, preferably 20% by mass. Hereinafter, it is more preferably 15% by mass or less. By setting it as the said range, it is excellent in the film-forming property and magnetic characteristics of a soft magnetic film.
又，熱固性樹脂(較佳為包含環氧樹脂及酚樹脂之熱固性樹脂)之含有比率係相對於自軟磁性樹脂組合物中除軟磁性粒子以外的軟磁性粒子除外成分100質量份，例如為20質量份以上，較佳為40質量份以上，更佳為超過50質量份，進而較佳為60質量份以上，最佳為65質量份以上，又，例如為99質量份以下，較佳為90質量份以下，更佳為80質量份以下，最佳為70質量份以下。藉由設為上述範圍，而使軟磁性膜之耐回焊性優異。 In addition, the content ratio of the thermosetting resin (preferably a thermosetting resin containing an epoxy resin and a phenol resin) is 100 parts by mass, for example, 20 parts of the soft magnetic particle-excluding component other than the soft magnetic particles in the soft magnetic resin composition. The mass part or more is preferably 40 parts by mass or more, more preferably 50 parts by mass or more, still more preferably 60 parts by mass or more, most preferably 65 parts by mass or more, and further, for example, 99 parts by mass or less, preferably 90%. It is more preferably 80 parts by mass or less, and most preferably 70 parts by mass or less. By setting it as the said range, the soft magnetic film is excellent in the reflow resistance.
再者，更具體而言，軟磁性粒子除外成分係包含樹脂成分、視需要添加之熱硬化觸媒(下述)及添加劑(下述)之成分，且不含軟磁性粒子及溶劑。 More specifically, the soft magnetic particle-excluding component contains a component of a resin component, a thermosetting catalyst (described below) and an additive (described below) which are optionally added, and does not contain soft magnetic particles and a solvent.
樹脂成分亦可含有熱固性樹脂及丙烯酸系樹脂以外之其他熱塑性樹脂。 The resin component may contain a thermoplastic resin other than a thermosetting resin or an acrylic resin.
作為此種熱塑性樹脂，例如可列舉：天然橡膠、丁基橡膠、異 戊二烯橡膠、氯丁二烯橡膠、乙烯-乙酸乙烯酯共聚物、共聚物、聚丁二烯樹脂、聚碳酸酯樹脂、熱塑性聚醯亞胺樹脂、聚醯胺樹脂(6-尼龍、6,6-尼龍等)、苯氧基樹脂、飽和聚酯樹脂(PET(polyethylene terephthalate，聚對苯二甲酸乙二酯)、PBT(polybutylene terephthalate，聚對苯二甲酸丁二酯)等)、聚醯胺醯亞胺樹脂、氟樹脂等。該等樹脂可單獨使用或併用2種以上。 Examples of such a thermoplastic resin include natural rubber, butyl rubber, and the like. Pentadiene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, copolymer, polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resin (6-nylon, 6 , 6-nylon, etc.), phenoxy resin, saturated polyester resin (PET (polyethylene terephthalate), PBT (polybutylene terephthalate, polybutylene terephthalate), etc.) Amidoxime resin, fluororesin, and the like. These resins may be used alone or in combination of two or more.
軟磁性樹脂組合物(進一步而言為軟磁性膜)較佳為含有熱硬化觸媒。 The soft magnetic resin composition (further, a soft magnetic film) preferably contains a thermosetting catalyst.
作為熱硬化觸媒，只要為藉由加熱而促進樹脂成分之硬化之觸媒，則並無限定，例如可列舉：具有咪唑骨架之鹽、具有三苯基膦結構之鹽、具有三苯基硼烷結構之鹽、含胺基之化合物等。可較佳地列舉具有咪唑骨架之鹽。 The thermosetting catalyst is not limited as long as it is a catalyst for promoting the curing of the resin component by heating, and examples thereof include a salt having an imidazole skeleton, a salt having a triphenylphosphine structure, and triphenylboron. a salt of an alkane structure, a compound containing an amine group, and the like. A salt having an imidazole skeleton can be preferably exemplified.
作為具有咪唑骨架之鹽，例如可列舉：2-苯基咪唑(商品名：2PZ)、2-乙基-4-甲基咪唑(商品名：2E4MZ)、2-甲基咪唑(商品名：2MZ)、2-十一烷基咪唑(商品名：C11Z)、2-苯基-4,5-二羥基甲基咪唑(商品名：2PHZ-PW)、2,4-二胺基-6-(2'-甲基咪唑基(1)')乙基均三異三聚氰酸加成物(商品名：2MAOK-PW)等(上述商品名均為四國化成公司製造)。熱硬化觸媒可單獨使用或併用2種以上。 Examples of the salt having an imidazole skeleton include 2-phenylimidazole (trade name: 2PZ), 2-ethyl-4-methylimidazole (trade name: 2E4MZ), and 2-methylimidazole (trade name: 2MZ). ), 2-undecylimidazole (trade name: C11Z), 2-phenyl-4,5-dihydroxymethylimidazole (trade name: 2PHZ-PW), 2,4-diamino-6-( 2'-Methylimidazolyl (1)') Ethyl An isocyanurate adduct (trade name: 2MAOK-PW), etc. (the above-mentioned trade names are all manufactured by Shikoku Chemicals Co., Ltd.). The heat-curing catalyst may be used singly or in combination of two or more.
熱硬化觸媒之形狀例如可列舉球狀、橢球狀等。 Examples of the shape of the heat-curing catalyst include a spherical shape, an ellipsoid shape, and the like.
熱硬化觸媒之調配比率係相對於樹脂成分100質量份，例如為0.1質量份以上，較佳為0.3質量份以上，又，例如為5質量份以下，較佳為3質量份以下。藉由將熱硬化觸媒之調配比率設在上述範圍內，可以較低溫度且短時間將半硬化狀態之軟磁性膜加熱硬化，又，耐回焊性優異。 The blending ratio of the heat-hardening catalyst is, for example, 0.1 parts by mass or more, preferably 0.3 parts by mass or more, and further, for example, 5 parts by mass or less, preferably 3 parts by mass or less, based on 100 parts by mass of the resin component. By setting the blending ratio of the thermosetting catalyst within the above range, the soft magnetic film in the semi-hardened state can be heat-hardened at a relatively low temperature and for a short period of time, and the reflow resistance is excellent.
軟磁性樹脂組合物(進一步而言為軟磁性膜)亦可進而視需要含有其他添加劑。作為添加劑，例如可列舉分散劑、交聯劑、無機填充材 料等市售或公知者。 The soft magnetic resin composition (further, a soft magnetic film) may further contain other additives as needed. Examples of the additive include a dispersant, a crosslinking agent, and an inorganic filler. It is commercially available or known to the public.
軟磁性樹脂組合物較佳為含有分散劑。 The soft magnetic resin composition preferably contains a dispersing agent.
作為分散劑，例如可列舉：聚醚磷酸酯、矽烷偶合劑、鈦酸酯偶合劑。可較佳地列舉聚醚磷酸酯。藉由使軟磁性樹脂組合物含有分散劑、尤其是聚醚磷酸酯，可提高軟磁性樹脂組合物之塗佈性，並且可更進一步提高軟磁性膜之磁特性。 Examples of the dispersant include a polyether phosphate, a decane coupling agent, and a titanate coupling agent. A polyether phosphate ester is preferably exemplified. By providing the soft magnetic resin composition with a dispersant, particularly a polyether phosphate, the applicability of the soft magnetic resin composition can be improved, and the magnetic properties of the soft magnetic film can be further improved.
作為聚醚磷酸酯，例如可列舉：聚氧伸烷基烷基醚磷酸酯、聚氧伸烷基烷基苯基醚磷酸酯等。可較佳地列舉聚氧伸烷基烷基醚磷酸酯。 Examples of the polyether phosphates include polyoxyalkylene alkyl alkyl ether phosphates and polyoxyalkylene alkylphenyl ether phosphates. A polyoxyalkylene alkyl ether phosphate can be preferably exemplified.
聚氧伸烷基烷基醚磷酸酯具有1~3個烷基-氧基-聚(伸烷氧)基鍵結於磷酸鹽之磷原子上之形態。於此種烷基-氧基-聚(伸烷氧)基[即聚氧伸烷基烷基醚部位]中，作為聚(伸烷氧)部位之伸烷氧之重複數並無特別限制，例如可自2~30(較佳為3~20)之範圍內適當選擇。作為聚(伸烷氧)部位之伸烷基，可較佳地列舉碳數為2~4之伸烷基。具體而言，可列舉：伸乙基、伸丙基、伸異丙基、伸丁基、異丁基等。又，作為烷基並無特別限制，例如可較佳地列舉碳數為6~30之烷基，可更佳地列舉碳數為8~20之烷基。具體而言，作為烷基，例如可列舉：癸基、十一烷基、十二烷基、十三烷基、十四烷基、十五烷基、十六烷基、十七烷基、十八烷基等。再者，於聚氧伸烷基烷基醚磷酸酯具有複數個烷基-氧基-聚(伸烷氧)基之情形時，複數個烷基可不同亦可相同。再者，聚醚磷酸酯亦可為與胺等之混合物。 The polyoxyalkylene alkyl ether phosphate has a form in which 1 to 3 alkyl-oxy-poly(alkylene oxide) groups are bonded to a phosphorus atom of a phosphate. In the alkyl-oxy-poly(alkylene oxide) group [that is, the polyoxyalkylene alkyl ether moiety], the number of repetitions of the alkoxy group as the poly(alkylene oxide) moiety is not particularly limited. For example, it can be appropriately selected from the range of 2 to 30 (preferably 3 to 20). The alkylene group having a poly(alkylene oxide) moiety is preferably an alkylene group having a carbon number of 2 to 4. Specific examples thereof include an ethyl group, a propyl group, an extended isopropyl group, a butyl group, an isobutyl group and the like. Further, the alkyl group is not particularly limited, and examples thereof include an alkyl group having 6 to 30 carbon atoms, and more preferably an alkyl group having 8 to 20 carbon atoms. Specifically, examples of the alkyl group include a mercapto group, an undecyl group, a dodecyl group, a tridecyl group, a tetradecyl group, a pentadecyl group, a hexadecyl group, and a heptadecyl group. Octadecyl and the like. Further, in the case where the polyoxyalkylene alkyl ether phosphate has a plurality of alkyl-oxy-poly(alkylene oxide) groups, the plurality of alkyl groups may be different or the same. Further, the polyether phosphate may also be a mixture with an amine or the like.
聚醚磷酸酯之酸值例如為10以上，較佳為15以上，又，例如為200以下，較佳為150以下。酸值可藉由中和滴定法等而測定。 The acid value of the polyether phosphate is, for example, 10 or more, preferably 15 or more, and is, for example, 200 or less, preferably 150 or less. The acid value can be measured by a neutralization titration method or the like.
作為矽烷偶合劑，例如可列舉：3-甲基丙烯醯氧基丙基三甲氧基矽烷、2-(3,4-環氧環己基)乙基三甲氧基矽烷等。 Examples of the decane coupling agent include 3-methacryloxypropyltrimethoxydecane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, and the like.
分散劑可單獨使用或併用2種以上。 The dispersing agent may be used singly or in combination of two or more.
作為分散劑之具體例，可列舉：楠本化成公司之HIPLAAD系列(「ED152」、「ED153」、「ED154」、「ED118」、「ED174」、「ED251」)、信越化學公司製造之KBM系列(「KBM303」、「KBM503」)等。 Specific examples of the dispersing agent include the HIPLAAD series ("ED152", "ED153", "ED154", "ED118", "ED174", "ED251"), and the KBM series manufactured by Shin-Etsu Chemical Co., Ltd. "KBM303", "KBM503"), etc.
分散劑之含有比率係相對於軟磁性粒子100質量份，例如為0.1質量份以上，較佳為0.2質量份以上。又，例如為5質量份以下，較佳為2質量份以下。 The content ratio of the dispersing agent is, for example, 0.1 part by mass or more, preferably 0.2 part by mass or more, based on 100 parts by mass of the soft magnetic particles. Further, for example, it is 5 parts by mass or less, preferably 2 parts by mass or less.
軟磁性樹脂組合物可藉由將上述成分以上述含有比率加以混合而製備。 The soft magnetic resin composition can be prepared by mixing the above components in the above-mentioned content ratio.
軟磁性樹脂組合物可藉由將上述成分以上述含有比率加以混合而製備。 The soft magnetic resin composition can be prepared by mixing the above components in the above-mentioned content ratio.
軟磁性膜例如可藉由如下步驟而製造：製備步驟，其係使軟磁性樹脂組合物溶解或分散於溶劑中而製備軟磁性樹脂組合物溶液；乾燥步驟，其係藉由塗佈於脫模基材之表面並使之乾燥而獲得半硬化狀態之軟磁性膜；及熱壓步驟，其係將半硬化狀態之軟磁性膜積層複數片並進行熱壓。 The soft magnetic film can be produced, for example, by a preparation step of preparing a soft magnetic resin composition solution by dissolving or dispersing the soft magnetic resin composition in a solvent; and a drying step by coating the release film A surface of the substrate is dried and dried to obtain a soft magnetic film in a semi-hardened state; and a hot pressing step of laminating a plurality of soft magnetic films in a semi-hardened state and hot pressing.
首先，使軟磁性樹脂組合物溶解或分散於溶劑中(製備步驟)。藉此，製備軟磁性樹脂組合物溶液。 First, the soft magnetic resin composition is dissolved or dispersed in a solvent (preparation step). Thereby, a soft magnetic resin composition solution was prepared.
作為溶劑，可列舉：例如丙酮、甲基乙基酮(MEK)等酮類，例如乙酸乙酯等酯類，例如丙二醇單甲醚等醚類，例如N,N-二甲基甲醯胺等醯胺類等有機溶劑等。又，作為溶劑，亦可列舉：例如水，例如甲醇、乙醇、丙醇、異丙醇等醇等水系溶劑。 The solvent may, for example, be a ketone such as acetone or methyl ethyl ketone (MEK), or an ester such as ethyl acetate, or an ether such as propylene glycol monomethyl ether, for example, N,N-dimethylformamide or the like. An organic solvent such as guanamine. Further, examples of the solvent include water, for example, an aqueous solvent such as an alcohol such as methanol, ethanol, propanol or isopropanol.
軟磁性樹脂組合物溶液中之固形物成分量例如為10質量%以上，較佳為30質量%以上，又，例如為90質量%以下，較佳為70質量%以下。 The amount of the solid content component in the soft magnetic resin composition solution is, for example, 10% by mass or more, preferably 30% by mass or more, and further, for example, 90% by mass or less, preferably 70% by mass or less.
其次，將軟磁性樹脂組合物溶液塗佈於脫模基材(隔片、芯材等) 之表面並進行乾燥(乾燥步驟)。 Next, the soft magnetic resin composition solution is applied to a release substrate (separator, core material, etc.) The surface is dried and dried (drying step).
作為塗佈方法並無特別限定，例如可列舉：刮刀法、輥式塗佈、網版塗佈、凹版塗佈等。 The coating method is not particularly limited, and examples thereof include a doctor blade method, roll coating, screen coating, and gravure coating.
作為乾燥條件，乾燥溫度例如為70℃以上且160℃以下，乾燥時間例如為1分鐘以上且5分鐘以下。 The drying temperature is, for example, 70° C. or higher and 160° C. or lower, and the drying time is, for example, 1 minute or longer and 5 minutes or shorter.
作為隔片，例如可列舉：聚對苯二甲酸乙二酯(PET)膜、聚乙烯膜、聚丙烯膜、紙等。該等隔片之表面例如藉由氟系剝離劑、丙烯酸長鏈烷基酯系剝離劑、聚矽氧系剝離劑等進行了脫模處理。 Examples of the separator include a polyethylene terephthalate (PET) film, a polyethylene film, a polypropylene film, and paper. The surface of the separator is subjected to a release treatment by, for example, a fluorine-based release agent, an acrylic long-chain alkyl ester release agent, a polyoxymethylene release agent, or the like.
作為芯材，可列舉：例如塑膠膜(例如聚醯亞胺膜、聚酯膜、聚對苯二甲酸乙二酯膜、聚萘二甲酸乙二酯膜、聚碳酸酯膜等)、金屬膜(例如鋁箔等)，例如經玻璃纖維或塑膠製不織纖維等強化之樹脂基板、矽基板、玻璃基板等。 Examples of the core material include a plastic film (for example, a polyimide film, a polyester film, a polyethylene terephthalate film, a polyethylene naphthalate film, a polycarbonate film, etc.), and a metal film. (for example, aluminum foil, etc.), for example, a resin substrate reinforced by a glass fiber or a non-woven fabric made of plastic, a ruthenium substrate, a glass substrate, or the like.
隔片或芯材之平均厚度例如為1μm以上且500μm以下。 The average thickness of the separator or the core material is, for example, 1 μm or more and 500 μm or less.
藉此，獲得半硬化狀態之軟磁性膜。 Thereby, a soft magnetic film in a semi-hardened state is obtained.
該軟磁性膜係於室溫(具體而言為25℃)下為半硬化狀態(B階段狀態)，且具備良好之接著性之軟磁性熱固性接著膜。 The soft magnetic film is a soft magnetic thermosetting adhesive film having a semi-hardened state (B-stage state) at room temperature (specifically, 25 ° C) and having good adhesion.
軟磁性膜(半硬化狀態)之平均厚度例如為5μm以上，較佳為50μm以上，又，例如為500μm以下，較佳為250μm以下。 The average thickness of the soft magnetic film (semi-hardened state) is, for example, 5 μm or more, preferably 50 μm or more, and is, for example, 500 μm or less, or preferably 250 μm or less.
其次，準備複數片所獲得之半硬化狀態之軟磁性膜，藉由熱壓而對複數片軟磁性膜沿著厚度方向進行熱壓(熱壓步驟)。藉此，將半硬化狀態之軟磁性膜(進一步而言為軟磁性組合物)加熱硬化。又，可使軟磁性粒子以高比率填充至軟磁性膜內，從而提高磁特性。 Next, a soft magnetic film in a semi-hardened state obtained by a plurality of sheets is prepared, and a plurality of soft magnetic films are hot-pressed in the thickness direction by hot pressing (hot pressing step). Thereby, the soft magnetic film (further, the soft magnetic composition) in a semi-hardened state is heat-hardened. Further, the soft magnetic particles can be filled into the soft magnetic film at a high ratio to improve the magnetic properties.
熱壓可使用公知之壓製機而實施，例如可列舉平行板壓製機等。 The hot pressing can be carried out by using a known press, and examples thereof include a parallel plate press and the like.
軟磁性膜(半硬化狀態)之積層片數例如為2層以上，又，例如為20層以下，較佳為5層以下。藉此，可調整為所期望之厚度之軟磁性 膜。 The number of laminated layers of the soft magnetic film (semi-hardened state) is, for example, two or more layers, and is, for example, 20 or less, preferably 5 or less. Thereby, the soft magnetic properties can be adjusted to the desired thickness membrane.
加熱溫度例如為80℃以上，較佳為100℃以上，又，例如為200℃以下，較佳為180℃以下。 The heating temperature is, for example, 80 ° C or higher, preferably 100 ° C or higher, and is, for example, 200 ° C or lower, preferably 180 ° C or lower.
加熱時間例如為0.1小時以上，較佳為0.2小時以上，又，例如為24小時以下，較佳為2小時以下。 The heating time is, for example, 0.1 hour or longer, preferably 0.2 hour or longer, and for example, 24 hours or shorter, preferably 2 hours or shorter.
壓力例如為10MPa以上，較佳為20MPa以上，又，例如為500MPa以下，較佳為200MPa以下。 The pressure is, for example, 10 MPa or more, preferably 20 MPa or more, and is, for example, 500 MPa or less, preferably 200 MPa or less.
藉此，可將半硬化狀態之軟磁性膜加熱硬化而獲得硬化狀態(C階段狀態)之軟磁性膜。 Thereby, the soft magnetic film in a semi-hardened state can be heat-hardened to obtain a soft magnetic film in a hardened state (C-stage state).
該軟磁性膜之平均厚度例如為5μm以上，較佳為50μm以上，又，例如為500μm以下，較佳為250μm以下。 The average thickness of the soft magnetic film is, for example, 5 μm or more, preferably 50 μm or more, and for example, 500 μm or less, preferably 250 μm or less.
23℃下之拉伸儲存模數E'23例如為8.0×108Pa以上，較佳為1.0×109Pa以上，更佳為1.0×1010Pa以上，又，例如為1.0×1020Pa以下。 The tensile storage modulus E' 23 at 23 ° C is, for example, 8.0 × 10 8 Pa or more, preferably 1.0 × 10 9 Pa or more, more preferably 1.0 × 10 10 Pa or more, and further, for example, 1.0 × 10 20 Pa. the following.
200℃下之拉伸儲存模數E'200例如為1.0×108Pa以上，較佳為8.0×108Pa以上，更佳為5.0×109Pa以上，又，例如為1.0×1020Pa以下。藉此，使軟磁性膜之耐回焊性更優異。 The tensile storage modulus E' 200 at 200 ° C is, for example, 1.0 × 10 8 Pa or more, preferably 8.0 × 10 8 Pa or more, more preferably 5.0 × 10 9 Pa or more, and further, for example, 1.0 × 10 20 Pa. the following. Thereby, the reflow resistance of the soft magnetic film is further improved.
E'200相對於E'23之比率E'200/E'23為0.25以上，較佳為0.40以上，更佳為0.42以上，進而較佳為0.45以上，又，例如為0.90以下。藉此，軟磁性膜之耐回焊性優異。 E '200 is with respect to E' 23 ratio of E '200 / E' 23 is 0.25 or more, preferably 0.40 or more, more preferably 0.42 or more, further preferably 0.45 or more, and, for example, 0.90 or less. Thereby, the soft magnetic film is excellent in reflow resistance.
再者，拉伸儲存模數(E'23、E'200)係使用動態黏彈性測定裝置於升溫速度10℃/分鐘、頻率1Hz之條件下進行測定。 Further, the tensile storage modulus (E' 23 , E' 200 ) was measured using a dynamic viscoelasticity measuring apparatus under the conditions of a temperature increase rate of 10 ° C / min and a frequency of 1 Hz.
軟磁性膜較佳為軟磁性膜所含之扁平狀軟磁性粒子沿著軟磁性膜之二維之面內方向排列。即，以使扁平狀軟磁性粒子之長邊方向(與厚度方向正交之方向)沿著軟磁性膜之面方向之方式配向。藉此，軟磁性膜以高比率填充軟磁性粒子而使磁特性優異。又，實現軟磁性 膜之薄膜化。 The soft magnetic film is preferably such that the flat soft magnetic particles contained in the soft magnetic film are arranged along the two-dimensional in-plane direction of the soft magnetic film. In other words, the longitudinal direction of the flat soft magnetic particles (the direction orthogonal to the thickness direction) is aligned along the surface direction of the soft magnetic film. Thereby, the soft magnetic film fills the soft magnetic particles at a high ratio, and the magnetic properties are excellent. Also, to achieve soft magnetic Thin film formation.
軟磁性膜之相對磁導率(回焊步驟前)例如為150以上，較佳為160以上，更佳為180以上，又，例如為500以下。 The relative magnetic permeability (before the reflow step) of the soft magnetic film is, for example, 150 or more, preferably 160 or more, more preferably 180 or more, and for example, 500 or less.
該軟磁性膜例如可設為僅由軟磁性膜之單層構成之單層構造、於芯材之單面或兩面積層有軟磁性膜之多層構造、於軟磁性膜之單面或兩面積層有隔片之多層構造等形態。 The soft magnetic film can be, for example, a single layer structure composed of only a single layer of a soft magnetic film, a multilayer structure having a soft magnetic film on one side or a two-layer layer of the core material, or a single-sided or two-layer layer on the soft magnetic film. The shape of the multilayer structure of the separator.
又，上述實施形態中係積層複數片半硬化狀態之軟磁性膜並進行熱壓，但例如亦可對1片(單層)半硬化狀態之軟磁性膜實施熱壓。 Further, in the above-described embodiment, a plurality of soft magnetic films in a semi-hardened state are laminated and hot pressed. However, for example, one piece (single layer) of a soft magnetic film in a semi-hardened state may be subjected to hot pressing.
又，上述實施形態中係對半硬化狀態之軟磁性膜進行熱壓，但亦可不實施熱壓。即，亦可直接以半硬化狀態使用軟磁性膜。半硬化狀態之軟磁性膜之表面具備接著性，因此例如可不使用接著劑而直接積層於電路基板。其後，亦可視需要進行加熱硬化而製成硬化狀態之軟磁性膜。 Further, in the above embodiment, the soft magnetic film in the semi-hardened state is hot-pressed, but hot pressing may not be performed. That is, the soft magnetic film can also be used directly in a semi-hardened state. Since the surface of the semi-hardened soft magnetic film has adhesiveness, it can be directly laminated on the circuit board without using an adhesive, for example. Thereafter, it may be heat-hardened as needed to form a soft magnetic film in a hardened state.
該軟磁性膜例如可較佳地用作用以於天線、線圈、或表面形成有該等之電路基板上積層之軟磁性膜(磁性膜)。更具體而言，可用於智慧型手機、電腦、位置檢測裝置等用途。 The soft magnetic film can be preferably used, for example, as a soft magnetic film (magnetic film) for laminating an antenna, a coil, or a circuit board on which the surface is formed. More specifically, it can be used for smart phones, computers, position detection devices, and the like.
為了將軟磁性膜積層於電路基板，可列舉如下方法：將硬化狀態之軟磁性膜經由接著劑層而固定於電路基板之方法、將半硬化狀態之軟磁性膜直接貼附於電路基板後將半硬化狀態之軟磁性膜加熱硬化而固定於電路基板之方法等。 In order to laminate a soft magnetic film on a circuit board, a method in which a soft magnetic film in a cured state is fixed to a circuit board via an adhesive layer, and a soft magnetic film in a semi-hardened state is directly attached to a circuit board, A method in which a soft magnetic film in a semi-hardened state is heat-hardened and fixed to a circuit board.
就無需接著劑層而可使電子機器小型化之觀點而言，可較佳地列舉將半硬化狀態之軟磁性膜直接貼附於電路基板後將軟磁性膜加熱硬化之方法。 From the viewpoint of miniaturization of an electronic device without an adhesive layer, a method of directly bonding a soft magnetic film in a semi-hardened state to a circuit board and then heat-hardening the soft magnetic film can be preferably used.
又，就絕緣性之觀點而言，可較佳地列舉將硬化狀態之軟磁性膜經由接著劑層而固定於電路基板之方法。 Moreover, from the viewpoint of insulation, a method of fixing a soft magnetic film in a cured state to a circuit board via an adhesive layer is preferably exemplified.
接著劑層可使用通常用作電路基板之接著劑層之公知者，例如 可藉由塗佈環氧系接著劑、聚醯亞胺系接著劑、丙烯酸系接著劑等接著劑及進行乾燥而形成。接著劑層之厚度例如為10~100μm。 The subsequent layer can be used by a person who is generally used as an adhesive layer of a circuit substrate, for example, It can be formed by applying an adhesive such as an epoxy-based adhesive, a polyimide-based adhesive, or an acrylic adhesive, and drying. The thickness of the subsequent layer is, for example, 10 to 100 μm.
並且，該軟磁性膜之200℃下之拉伸儲存模數E'200相對於23℃下之拉伸儲存模數E'23之比率(E'200/E'23)為0.25以上，因此即便於對軟磁性膜進行回焊處理之情形時，亦可抑制該軟磁性膜之相對磁導率之劣化。即，耐回焊優異。藉此，即便對具備該軟磁性膜之安裝電路基板實施回焊步驟，軟磁性膜亦可對安裝電路基板確實地發揮出良好之磁特性。 Further, the tensile storage modulus E at 200 deg.] C of the soft magnetic film of the '200 with respect to the tensile storage modulus E under the 23 ℃' ratio (E '200 / E' 23 ) 23 of 0.25 or more, even In the case where the soft magnetic film is subjected to the reflow treatment, the deterioration of the relative magnetic permeability of the soft magnetic film can also be suppressed. That is, it is excellent in reflow resistance. Thereby, even if the reflow process is performed on the mounted circuit board including the soft magnetic film, the soft magnetic film can surely exhibit excellent magnetic characteristics to the mounted circuit board.
回焊步驟中之溫度例如為200℃以上，較佳為250℃以上，又，例如為500℃以下，較佳為300℃以下。 The temperature in the reflow step is, for example, 200 ° C or higher, preferably 250 ° C or higher, and further, for example, 500 ° C or lower, preferably 300 ° C or lower.
回焊保存時間例如為1秒以上，較佳為5秒以上，又，例如為10分鐘以下，較佳為5分鐘以下。 The reflow storage time is, for example, 1 second or longer, preferably 5 seconds or longer, and is, for example, 10 minutes or shorter, preferably 5 minutes or shorter.
回焊步驟後之軟磁性膜之相對磁導率例如為150以上，較佳為160以上，更佳為180以上，又，例如為500以下。 The relative magnetic permeability of the soft magnetic film after the reflow step is, for example, 150 or more, preferably 160 or more, more preferably 180 or more, and for example, 500 or less.
以下揭示實施例及比較例，進一步具體地說明本發明，但本發明並不限定於任何實施例及比較例。以下所示之實施例之數值可替換為上述實施形態中所記載之數值(即上限值或下限值)。 The present invention will be specifically described below by way of examples and comparative examples, but the present invention is not limited to any examples and comparative examples. The numerical values of the examples shown below can be replaced with the numerical values (i.e., the upper limit value or the lower limit value) described in the above embodiments.
以使軟磁性粒子相對於軟磁性樹脂組合物成為50體積%之方式將軟磁性粒子500質量份、丙烯酸酯系聚合物59質量份、雙酚A型環氧樹脂(「Epikote 1004」)8質量份、雙酚A型環氧樹脂(「Epikote YL980」)4質量份、苯酚芳烷基樹脂5質量份、2-苯基-4,5-二羥基甲基咪唑(「2PHZ-PW」熱硬化觸媒)0.81質量份(相對於樹脂成分100質量份為1.0質量份)、及聚醚磷酸酯(分散劑)2.5質量份(相對於軟磁性粒子100質量份為0.5質量份)加以混合，藉此獲得軟磁性樹脂組合物。 500 parts by mass of soft magnetic particles, 59 parts by mass of acrylate-based polymer, and bisphenol A-type epoxy resin ("Epikote 1004") 8 masses so that the soft magnetic particles are 50% by volume based on the soft magnetic resin composition. 4 parts by mass of bisphenol A type epoxy resin ("Epikote YL980"), 5 parts by mass of phenol aralkyl resin, and 2-phenyl-4,5-dihydroxymethylimidazole ("2PHZ-PW" thermosetting) 0.81 parts by mass of the catalyst (1.0 parts by mass based on 100 parts by mass of the resin component) and 2.5 parts by mass of the polyether phosphate (dispersant) (0.5 parts by mass based on 100 parts by mass of the soft magnetic particles) are mixed. This obtained a soft magnetic resin composition.
藉由使該軟磁性樹脂組合物溶解於甲基乙基酮中而製備固形物成分濃度43質量%之軟磁性樹脂組合物溶液。 A soft magnetic resin composition solution having a solid content concentration of 43% by mass was prepared by dissolving the soft magnetic resin composition in methyl ethyl ketone.
將該軟磁性樹脂組合物溶液塗佈於經聚矽氧脫模處理之包含聚對苯二甲酸乙二酯膜之隔片(平均厚度為50μm)上，其後於130℃下乾燥2分鐘。藉此，製造積層有隔片之半硬化狀態之軟磁性膜(僅軟磁性膜之平均厚度，90μm)。 The soft magnetic resin composition solution was applied onto a separator (having an average thickness of 50 μm) containing a polyethylene terephthalate film by polyfluorination-releasing treatment, followed by drying at 130 ° C for 2 minutes. Thereby, a soft magnetic film (only the average thickness of the soft magnetic film, 90 μm) in which the separator was laminated in a semi-hardened state was produced.
其次，將該軟磁性膜積層4層，於175℃、30分鐘、20MPa之條件下藉由熱壓進行加熱硬化，藉此製作硬化狀態之軟磁性膜。 Next, the soft magnetic film was laminated in four layers and heat-hardened by hot pressing at 175 ° C for 30 minutes and 20 MPa to prepare a soft magnetic film in a cured state.
以表1中所記載之材料及調配比率獲得軟磁性樹脂組合物。使用該軟磁性樹脂組合物，除此以外，以與實施例1相同之方式製造實施例2及3之硬化狀態之軟磁性膜。 The soft magnetic resin composition was obtained from the materials and the blending ratios shown in Table 1. A soft magnetic film of the cured state of Examples 2 and 3 was produced in the same manner as in Example 1 except that the soft magnetic resin composition was used.
以使軟磁性粒子相對於軟磁性樹脂組合物成為40體積%之方式將軟磁性粒子500質量份及乙烯-乙酸乙烯酯共聚物106質量份加以混合，藉此獲得軟磁性樹脂組合物。 The soft magnetic resin composition was obtained by mixing 500 parts by mass of the soft magnetic particles and 106 parts by mass of the ethylene-vinyl acetate copolymer so that the soft magnetic particles were 40% by volume with respect to the soft magnetic resin composition.
使該軟磁性樹脂組合物溶解於甲苯中，藉此製備固形物成分濃度40質量%之軟磁性樹脂組合物溶液。 The soft magnetic resin composition was dissolved in toluene to prepare a soft magnetic resin composition solution having a solid content concentration of 40% by mass.
將該軟磁性樹脂組合物溶液塗佈於經聚矽氧脫模處理之包含聚對苯二甲酸乙二酯膜之隔片(平均厚度為50μm)上，其後於130℃下乾燥2分鐘。藉此，製造積層有隔片之半硬化狀態之軟磁性膜(僅軟磁性膜之平均厚度，90μm)。 The soft magnetic resin composition solution was applied onto a separator (having an average thickness of 50 μm) containing a polyethylene terephthalate film by polyfluorination-releasing treatment, followed by drying at 130 ° C for 2 minutes. Thereby, a soft magnetic film (only the average thickness of the soft magnetic film, 90 μm) in which the separator was laminated in a semi-hardened state was produced.
其次，將該軟磁性膜積層4層，於175℃、30分鐘、20MPa之條件下藉由熱壓進行加熱硬化，藉此製作比較例1之軟磁性膜。 Next, the soft magnetic film was laminated in four layers and heat-hardened by hot pressing at 175 ° C for 30 minutes and 20 MPa to prepare a soft magnetic film of Comparative Example 1.
以表1中所記載之材料及調配比率獲得軟磁性樹脂組合物。使用該軟磁性樹脂組合物，除此以外，以與實施例1相同之方式製造比較例2之軟磁性膜。 The soft magnetic resin composition was obtained from the materials and the blending ratios shown in Table 1. A soft magnetic film of Comparative Example 2 was produced in the same manner as in Example 1 except that the soft magnetic resin composition was used.
針對各實施例及各比較例之軟磁性膜，基於下述條件實施動態黏彈性測定，分別求出23℃下之拉伸儲存模數E'23與200℃下之拉伸儲存模數E'200。 With respect to the soft magnetic films of the respective examples and comparative examples, dynamic viscoelasticity measurement was carried out based on the following conditions, and the tensile storage modulus E' 23 at 23 ° C and the tensile storage modulus E' at 200 ° C were respectively determined. 200 .
動態黏彈性測定裝置(MDA)：商品名「RSAIII」，Rheometric Scientific公司製造 Dynamic Viscoelasticity Measuring Device (MDA): trade name "RSAIII", manufactured by Rheometric Scientific
模式：拉伸模式 Mode: Stretch mode
升溫速度：10℃/分鐘 Heating rate: 10 ° C / min
頻率：1Hz Frequency: 1Hz
樣品厚度：90μm Sample thickness: 90μm
夾頭間距：20mm Chuck spacing: 20mm
應變：0.1% Strain: 0.1%
測定溫度範圍：0℃~210℃ Measuring temperature range: 0 ° C ~ 210 ° C
將該等結果及比率(E'200/E'23)示於表1。 The results and ratios (E' 200 /E' 23 ) are shown in Table 1.
使用阻抗分析儀(Impedance Analyzer)(Agilent公司製造，「4294A」)，藉由單線圈法(頻率1MHz)測定各實施例及各比較例之軟磁性熱膜之相對磁導率。將結果示於表1。 The relative magnetic permeability of the soft magnetic hot film of each of the examples and the comparative examples was measured by a single coil method (frequency: 1 MHz) using an Impedance Analyzer ("4294A" manufactured by Agilent Co., Ltd.). The results are shown in Table 1.
將各實施例及各比較例之軟磁性膜積層於電路基板，使該軟磁性膜積層電路基板於260℃、10秒鐘之條件下通過IR(Infrared Ray，紅外線)回焊爐內部，藉此實施回焊步驟。 The soft magnetic film of each of the examples and the comparative examples was laminated on a circuit board, and the soft magnetic film laminated circuit board was passed through an IR (Infrared Ray) reflow furnace at 260 ° C for 10 seconds. Perform the reflow step.
使用阻抗分析儀(Impedance Analyzer)(Agilent公司製造， 「4294A」)，藉由單線圈法(頻率1MHz)測定已實施該回焊步驟之軟磁性膜積層電路基板之軟磁性膜之相對磁導率。將結果示於表1。 Using an Impedance Analyzer (manufactured by Agilent, "4294A") The relative magnetic permeability of the soft magnetic film of the soft magnetic film laminated circuit substrate on which the reflow step was carried out was measured by a single coil method (frequency: 1 MHz). The results are shown in Table 1.
關於表中之各成分中之數值，於無特別記載之情形時表示質量份。又，以下對表中各成分之簡稱之詳情進行記載。 The numerical values in the respective components in the table indicate the parts by mass unless otherwise specified. In addition, the details of the abbreviations of the components in the table are described below.
．Fe-Si-Al合金：商品名「SP-7」，軟磁性粒子，扁平狀，平均粒徑65μm，Meito公司製造 . Fe-Si-Al alloy: trade name "SP-7", soft magnetic particles, flat shape, average particle size 65μm, manufactured by Meito
．丙烯酸酯系聚合物：商品名「Pagoclone W-197CM」，以丙烯酸乙酯-甲基丙烯酸甲酯為主成分之丙烯酸酯系聚合物，根上工業公司製造 . Acrylate-based polymer: trade name "Pagoclone W-197CM", acrylate-based polymer containing ethyl acrylate-methyl methacrylate as main component, manufactured by Kokusai Industrial Co., Ltd.
．雙酚A型環氧樹脂：商品名「Epikote 1004」，環氧當量875~975g/eq，JER公司製造 . Bisphenol A type epoxy resin: trade name "Epikote 1004", epoxy equivalent 875~975g/eq, manufactured by JER
．雙酚A型環氧樹脂：商品名「Epikote YL980」，環氧當量180~190g/eq，JER公司製造 . Bisphenol A type epoxy resin: trade name "Epikote YL980", epoxy equivalent 180~190g/eq, manufactured by JER
．4官能胺基縮水甘油基型環氧樹脂：商品名「Tetrad-C」，環氧當量105g/eq，三菱瓦斯化學工業公司製造 . 4-functional aminoglycidyl epoxy resin: trade name "Tetrad-C", epoxy equivalent 105g/eq, manufactured by Mitsubishi Gas Chemical Industry Co., Ltd.
．苯酚芳烷基樹脂：商品名「Milex XLC-4L」，羥基當量170g/eq，三井化學公司製造 . Phenol aralkyl resin: trade name "Milex XLC-4L", hydroxyl equivalent 170g / eq, manufactured by Mitsui Chemicals Co., Ltd.
．2-苯基-4,5-二羥基甲基咪唑：熱硬化觸媒，商品名「Curezol 2PHZ-PW」，四國化成公司製造 . 2-Phenyl-4,5-dihydroxymethylimidazole: thermosetting catalyst, trade name "Curezol 2PHZ-PW", manufactured by Shikoku Chemicals Co., Ltd.
．聚醚磷酸酯：分散劑，商品名「HIPLAAD ED152」，楠本化成公司製造，酸值20 . Polyether phosphate: dispersant, trade name "HIPLAAD ED152", manufactured by Nanben Chemical Company, acid value 20
．乙烯-乙酸乙烯酯共聚物：商品名「EV170」，Mitsui-Dupont Polychemical公司製造 . Ethylene-vinyl acetate copolymer: trade name "EV170", manufactured by Mitsui-Dupont Polychemical
再者，上述發明係以本發明之例示之實施形態提供，但其僅為例示，不作限定性地解釋。該技術領域之業者所明確之本發明之變化例包含於下述申請專利範圍內。 Further, the invention is provided by the exemplified embodiments of the invention, but is merely illustrative and not to be construed as limiting. Variations of the invention as clarified by those skilled in the art are included in the scope of the following claims.
本發明之軟磁性膜可應用於各種工業製品，例如可用於座標讀取裝置等位置檢測裝置等。 The soft magnetic film of the present invention can be applied to various industrial products, for example, it can be used for a position detecting device such as a coordinate reading device.
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