TWI652238B - Cutting method for laminating substrates - Google Patents
Cutting method for laminating substrates Download PDFInfo
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- TWI652238B TWI652238B TW104108450A TW104108450A TWI652238B TW I652238 B TWI652238 B TW I652238B TW 104108450 A TW104108450 A TW 104108450A TW 104108450 A TW104108450 A TW 104108450A TW I652238 B TWI652238 B TW I652238B
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- scribe
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- liquid crystal
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/076—Laminated glass comprising interlayers
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Nonlinear Science (AREA)
- Thermal Sciences (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Liquid Crystal (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
Abstract
本發明之貼合基板之分斷方法，能夠在液晶基板之分斷時使基板不要的端材部分最大限度地變小，且獲得滑順的分斷面。 The cutting method of the bonded substrate according to the present invention can minimize the unnecessary end material portion of the substrate when cutting the liquid crystal substrate, and obtain a smooth cutting surface.
該分斷方法包含：對密封部(12)照射雷射而形成刻劃導引線溝槽(H1)的階段、對從刻劃導引線溝槽(H1)之位置起隔著間隔而隔離之位置的該密封部(12)照射雷射而形成確定刻劃導引線溝槽(H2)的階段、以及利用刻劃輪(70)沿確定刻劃導引線溝槽(H2)對上部玻璃部(9)及下部玻璃部(8)進行刻劃的階段。 The breaking method includes a step of irradiating the sealing portion (12) with a laser to form a scoring guide line groove (H1), and isolating at a distance from a position where the scoring guide line groove (H1) is spaced. The sealing part (12) at the position is irradiated with laser to form a stage for determining the scribe guide groove (H2), and a scribe wheel (70) is used to align the upper part of the scribe guide groove (H2) to the upper part. The stage where the glass part (9) and the lower glass part (8) are scribed.
Description
本發明是關於一種貼合基板之分斷方法，詳細而言，是關於一種不僅能夠使基板不要的端材部最大限度地變小，也能夠獲得滑順的分斷面的貼合基板之分斷方法。 The present invention relates to a method for cutting a bonded substrate, and in particular, it relates to a method of bonding a substrate that can not only minimize an unnecessary end portion of the substrate, but also obtain a smooth cutting surface.断 方法。 Off method.
一般而言，習知以往在去除液晶基板不要的端材部時，僅利用刻劃輪。 Generally, it has been conventionally known that only the scoring wheel is used when removing an unnecessary end material portion of a liquid crystal substrate.
具體而言，一般的液晶基板，在上部玻璃部與下部玻璃部間填充液晶層後，以液晶層不往外部露液的方式利用密封層圍繞液晶層之框部分而將其密封。 Specifically, a general liquid crystal substrate is filled with a liquid crystal layer between an upper glass portion and a lower glass portion, and is sealed with a sealing layer surrounding a frame portion of the liquid crystal layer so that the liquid crystal layer does not expose liquid to the outside.
亦即，成為使密封層附著在上部玻璃部與下部玻璃部相互對向的面，並以液晶層不往外部流出的方式密封的構造。 That is, it has a structure in which a sealing layer is adhered to the surfaces of the upper glass portion and the lower glass portion facing each other, and is sealed so that the liquid crystal layer does not flow out.
此外，為了提高密封性，而使密封層寬度較寬地形成在基板平面的延伸方向。 In addition, in order to improve the sealing property, the width of the sealing layer is formed in a wide direction in the plane of the substrate.
如此般，在以往習知技術中，由於在液晶基板之框部分包含具有較寬的寬度的密封層，因此存在有如下的實際情形：以較大的邊框(額緣)(bezel)尺寸的狀態使用、或者切除密封層之外周部分以使邊框變小。 As such, in the conventional art, since the frame portion of the liquid crystal substrate includes a sealing layer having a wide width, there is a practical situation as follows: a state with a large frame (bezel) size Use or cut off the outer periphery of the sealing layer to make the frame smaller.
然而，最近亦存在有將液晶基板相互地連結成平面而使用的情形，且在該情形，存在有影像具體顯現時在密封層外周部分彼此之連結 部位影像不滑順的問題點。 However, recently, there have been cases where the liquid crystal substrates are connected to each other to form a flat surface, and in this case, there is a connection between the outer peripheral portions of the sealing layer when the image is specifically displayed. The image of the part is not smooth.
為了解決如此般之問題點，而為了最大限度地切取液晶基板之密封層之寬度，於是利用刻劃輪以較深地侵入至液晶基板之密封層的方式進行分斷。 In order to solve such a problem, and in order to cut the width of the sealing layer of the liquid crystal substrate to the maximum extent, the scoring wheel is used to break into the sealing layer of the liquid crystal substrate in a deep manner.
然而，在利用刻劃輪對液晶基板之密封層進行刻劃時，因密封層所具有的物性，而產生了刻劃輪一邊進行刻劃一邊失去直進性、無法沿刻劃預定線進行移動等而往其他方向行進，從而使基板變不佳的問題點。 However, when the sealing layer of a liquid crystal substrate is scored by a scoring wheel, due to the physical properties of the sealing layer, the scoring wheel loses straightness while scoring and cannot move along the scribe line. The problem is that the substrate is not good because it is traveling in other directions.
此外，在最近，將多個液晶基板以平面並以框相互地抵接以使大型影像具體顯現而販售的影像裝置變多，從而為了使能具體顯現影像的液晶層以外的部分、例如密封層為最小的研究廣為試行。 In addition, recently, a large number of imaging devices have been sold in which a large number of liquid crystal substrates are brought into contact with each other in a plane and a frame, so that portions other than the liquid crystal layer that can specifically display the images, for example, are sealed. The smallest layer of research is widely piloted.
本發明是為了解決如上述般之問題而創造出，其目的在於提供一種在利用雷射對液晶基板等貼合基板進行刻劃時，不僅能夠使基板不要的端材部最大限度地變小，而且亦能夠獲得滑順的分斷面的貼合基板之分斷方法。 The present invention was created in order to solve the problems as described above, and an object thereof is to provide a method for scoring a bonded substrate such as a liquid crystal substrate by using a laser, which can not only minimize an unnecessary end portion of the substrate, Furthermore, a method for cutting a bonded substrate with a smooth cutting surface can also be obtained.
為了解決上述課題，本發明之一實施形態之貼合基板之分斷方法，係用於對形成在貼合基板(10)之上部玻璃部(9)與下部玻璃部(8)間的密封部(12)上進行分斷，其特徵在於包含以下階段：對該密封部(12)照射雷射而在該密封部(12)形成刻劃導引線溝槽(H1)；在形成該刻劃導引線溝槽(H1)後，對從該刻劃導引線溝槽(H1)之位置起隔著間隔而隔離之位置的該密封部(12)照射雷射，而在該密封部(12)形成確定刻劃導引線溝槽(H2)；以及，在形成該確定刻劃導引線溝槽(H2)後，利用刻劃輪(70)沿該確定刻劃導引線溝 槽(H2)對該上部玻璃部(9)及該下部玻璃部(8)進行刻劃。 In order to solve the above problems, a method for cutting a bonded substrate according to an embodiment of the present invention is used to seal a sealing portion formed between an upper glass portion (9) and a lower glass portion (8) of the bonded substrate (10). (12) is divided, and is characterized in that it includes the following steps: irradiating a laser on the sealing portion (12) to form a scoring guide wire groove (H1) in the sealing portion (12); After the guide wire groove (H1), a laser is irradiated to the sealing portion (12) at a position separated by a gap from the position where the guide wire groove (H1) is marked, and the sealing portion ( 12) forming a definite scribe guide groove (H2); and after forming the definite scribe guide groove (H2), using a scribe wheel (70) along the definite scribe guide groove The groove (H2) scores the upper glass portion (9) and the lower glass portion (8).
亦可為：在該上部玻璃部(9)與該下部玻璃部(8)間，形成有外周部分由該密封部(12)密封的液晶部(30)；以該液晶部(30)為基準，該刻劃導引線溝槽(H1)形成在較該確定刻劃導引線溝槽(H2)更遠的位置。 Alternatively, a liquid crystal portion (30) whose outer peripheral portion is sealed by the sealing portion (12) is formed between the upper glass portion (9) and the lower glass portion (8); based on the liquid crystal portion (30) The scribing guide line groove (H1) is formed at a position farther than the determined scribing guide line groove (H2).
亦可為：在形成該刻劃導引線溝槽(H1)的階段之前，包含在該密封部(12)預先設定用於形成該確定刻劃導引線溝槽(H2)的位置；對僅以在該刻劃導引線溝槽(H1)形成時由該密封部(12)產生的氣泡不會到達該確定刻劃導引線溝槽(H2)之形成預定位置的距離而隔離的位置之該密封部(12)照射雷射，形成該刻劃導引線溝槽(H1)。 Alternatively, before the step of forming the scribe guide groove (H1), a position included in the seal portion (12) for forming the definite scribe guide groove (H2) is set in advance; It is isolated only by a distance at which the bubble generated by the sealing portion (12) when the scribe groove (H1) is formed will not reach the predetermined position where the scribe groove (H2) is formed. The sealing part (12) at the position is irradiated with laser to form the scored guide wire groove (H1).
根據本發明，具有如下之效果：藉由在以雷射對貼合基板之密封部進行刻劃時所產生的氣泡不往貼合基板之液晶層側流入，而能夠防止液晶層被汙染、成為不良品等。 According to the present invention, it is possible to prevent the liquid crystal layer from being contaminated or damaged by preventing bubbles generated when the sealing portion of the bonded substrate is scribed by laser from flowing into the liquid crystal layer side of the bonded substrate. Defective products.
此外，還具有以下效果：能夠良好地形成貼合基板之分斷面，並且能夠使貼合基板之分離性提高。 In addition, there is also an effect that a divided surface of the bonded substrate can be formed satisfactorily, and the separability of the bonded substrate can be improved.
H1‧‧‧刻劃導引線溝槽 H1‧‧‧Scribe guide line groove
H2‧‧‧確定刻劃導引線溝槽 H2‧‧‧ Determine the groove of the guide line
9‧‧‧上部玻璃部 9‧‧‧ Upper glass section
8‧‧‧下部玻璃部 8‧‧‧ Lower glass section
10‧‧‧貼合基板 10‧‧‧ Laminated substrate
12‧‧‧密封部 12‧‧‧Sealing Department
14‧‧‧端材部 14‧‧‧End material department
30‧‧‧液晶部 30‧‧‧LCD Department
70‧‧‧刻劃輪(其刻劃路徑) 70‧‧‧ scribing wheel (its scribing path)
圖1a，係表示本發明之藉由雷射對貼合基板之密封部進行一次刻劃前之狀態的俯視圖。 FIG. 1a is a plan view showing a state before the sealing portion of the bonded substrate is scribed once by a laser according to the present invention.
圖1b，係圖1a之A部分的部分剖面圖。 Fig. 1b is a partial cross-sectional view of part A of Fig. 1a.
圖1c，係表示密封部之假想之確定刻劃線的圖式。 FIG. 1c is a drawing showing an imaginary definite scribe line of the sealing portion.
圖1d，係表示密封部經一次刻劃之狀態的圖式。 FIG. 1d is a view showing a state where the seal portion is scribed once.
圖2a，係表示本發明之藉由雷射對貼合基板之密封部進行二次刻劃前 之狀態的俯視圖。 FIG. 2a shows the method of the present invention before performing a second scribe on the sealing portion of the bonded substrate by laser Top view of the state.
圖2b，係圖2a之B部分的部分剖面圖。 Fig. 2b is a partial cross-sectional view of part B of Fig. 2a.
圖2c，係表示密封部之假想之確定刻劃線的圖式。 Fig. 2c is a drawing showing an imaginary definite scribe line of the sealing portion.
圖2d，係表示密封部經二次刻劃之狀態的圖式。 FIG. 2d is a diagram showing a state where the seal portion is subjected to the second scribe.
圖3a，係表示本發明之藉由雷射對貼合基板之密封部進行一次及二次刻劃後之狀態的俯視圖。 FIG. 3a is a plan view showing a state in which the sealing portion of the bonded substrate is subjected to primary and secondary scribing by laser according to the present invention.
圖3b，係圖3a之C部分的部分剖面圖。 Fig. 3b is a partial cross-sectional view of part C of Fig. 3a.
圖3c，係表示利用刻劃輪進行刻劃之狀態的圖式。 Fig. 3c is a diagram showing a state where the scribe is performed by using a scribe wheel.
圖3d，係表示基板經分斷之狀態的圖式。 FIG. 3d is a view showing a state where the substrate is broken.
圖4，係表示本發明之對貼合基板之密封部進行雷射刻劃時之氣泡行進方向的圖式。 FIG. 4 is a diagram showing a bubble traveling direction when the laser scribe is performed on the sealing portion of the bonded substrate according to the present invention.
參照所附圖式具體地說明本發明之一實施形態之貼合基板之分斷方法。 A method for cutting a bonded substrate according to an embodiment of the present invention will be specifically described with reference to the attached drawings.
如圖1a及圖1b所示，本實施形態之貼合基板10，包含上部玻璃部9及下部玻璃部8，且在該等上部玻璃部9與下部玻璃部8間形成有液晶部30。而且，以液晶部30不往貼合基板10外部漏液之方式將液晶部30之外周以密封部12密封。 As shown in FIGS. 1 a and 1 b, the bonded substrate 10 according to this embodiment includes an upper glass portion 9 and a lower glass portion 8, and a liquid crystal portion 30 is formed between the upper glass portion 9 and the lower glass portion 8. In addition, the outer periphery of the liquid crystal portion 30 is sealed by the sealing portion 12 so that the liquid crystal portion 30 does not leak to the outside of the bonding substrate 10.
密封部12由於具有黏著性與密封性，因此可使上部玻璃部9及下部玻璃部8黏著，並且使以上部玻璃部9與下部玻璃部8間的液晶部30不流出之方式而密封的狀態得以維持。此外，密封部12，形成為以液晶部30不漏液的方式而較寬廣地塗布在上部玻璃部9及下部玻璃部8之延伸 方向的形態。 Since the sealing portion 12 has adhesiveness and sealing properties, the upper glass portion 9 and the lower glass portion 8 can be adhered, and the liquid crystal portion 30 between the upper glass portion 9 and the lower glass portion 8 can be sealed without flowing out. To be maintained. In addition, the sealing portion 12 is formed to be widely applied to the extension of the upper glass portion 9 and the lower glass portion 8 so that the liquid crystal portion 30 does not leak liquid. The shape of the direction.
亦即，本實施形態之貼合基板10，具有在製造時已填充液晶部30的狀態下接合固定上部玻璃部9及下部玻璃部8而成的構造。 That is, the bonded substrate 10 according to the present embodiment has a structure in which the upper glass portion 9 and the lower glass portion 8 are bonded and fixed in a state where the liquid crystal portion 30 is filled during manufacture.
另一方面，在上部玻璃部9及下部玻璃部8包含密封部12並於外周部分存在不要的端材部14。 On the other hand, the upper glass portion 9 and the lower glass portion 8 include the sealing portion 12 and an unnecessary end material portion 14 is provided on the outer peripheral portion.
然而，在多個貼合基板10相互抵接的狀態下於貼合基板10之液晶部30具體顯現影像時，若相互抵接的面寬度較寬則無法具體顯現良好的影像，因此有必要將包含有形成在貼合基板10外周部分的密封部12的不要的端材部14去除。 However, when a plurality of bonded substrates 10 are in contact with each other in the liquid crystal portion 30 of the bonded substrate 10 to specifically display an image, if the width of the contacting surfaces is wide, a good image cannot be specifically displayed. The unnecessary end material portion 14 including the sealing portion 12 formed on the outer peripheral portion of the bonded substrate 10 is removed.
因此，在本實施形態之分斷方法中，首先對密封部12照射雷射而對密封部12早先於上部玻璃部9及下部玻璃部8進行刻劃。 Therefore, in the cutting method of this embodiment, first, the sealing portion 12 is irradiated with laser light, and the sealing portion 12 is scribed before the upper glass portion 9 and the lower glass portion 8 earlier.
具體而言，首先，以如圖1c中所表示的點線箭頭般設定密封部12實際欲分斷的部分(以下，亦稱為假想的確定刻劃線)。然後，設定從假想的確定刻劃線往外側、亦即端材部14側隔離既定距離的位置，使雷射照射裝置1移動至該位置。 Specifically, first, a portion (hereinafter, also referred to as an imaginary definite scribe line) that the seal portion 12 is to be broken off is set like a dotted line arrow shown in FIG. 1c. Then, the position where the predetermined distance is separated from the imaginary scribe line toward the outside, that is, the end material portion 14 side is set, and the laser irradiation device 1 is moved to that position.
然後，如圖1c所示般，利用雷射照射裝置1，對從假想的確定刻劃線往端材部14側隔離的位置照射雷射，而在密封部12形成刻劃導引線溝槽H1。 Then, as shown in FIG. 1c, the laser irradiation device 1 is used to irradiate the laser from a position determined to be isolated from the imaginary scribe line to the end material portion 14 side to form a score guide groove in the seal portion 12. H1.
然而，在對密封部12照射雷射而在密封部12形成刻劃導引線溝槽H1時，從已被加熱及熔融的密封部12產生氣泡。該氣泡，往刻劃導引線溝槽H1之兩側、亦即往與刻劃導引線溝槽H1交叉之方向行進。 However, when the seal portion 12 is irradiated with laser light to form a scored guide wire groove H1 in the seal portion 12, air bubbles are generated from the seal portion 12 that has been heated and melted. The bubbles travel to both sides of the scoring guide line groove H1, that is, in a direction crossing the scoring guide line groove H1.
雖然往與刻劃導引線溝槽H1交叉之方向行進的氣泡中的一 部分往端材部14側行進，而另一部分往液晶部30側行進，但由於密封部12之寬度較寬，因此氣泡不侵入液晶部30內。此外，若事先考量在刻劃導引線溝槽H1形成時所產生的氣泡之行進距離等，並在以氣泡不到達假想的確定刻劃線般的充分分離的位置設定好刻劃導引線溝槽H1，則氣泡便不會越過假想的確定刻劃線的位置。 Although one of the air bubbles traveling in a direction crossing the scribe guide groove H1 A part runs toward the end material portion 14 side, and another part runs toward the liquid crystal portion 30 side. However, since the width of the sealing portion 12 is wide, air bubbles do not enter the liquid crystal portion 30. In addition, if the travel distance and the like of the bubbles generated when the scribe line groove H1 is formed are considered in advance, and the scribe line is set at a position where the bubbles do not reach the imaginary definite scribe line and are sufficiently separated. In the groove H1, the bubble does not cross the position of the imaginary definite scribe line.
另一方面，產生氣泡的刻劃導引線溝槽H1周圍的物性強度弱化。 On the other hand, the physical strength around the scribe line groove H1 where the bubbles are generated is weakened.
如此般在形成有刻劃導引線溝槽H1後，使雷射照射裝置1移動至預先設定好作為假想的確定刻劃線的位置，如圖2d所示般，形成確定刻劃導引線溝槽H2。 After the groove H1 is formed as described above, the laser irradiation device 1 is moved to a position preset as an imaginary definite scribe line, and a definite scribe guide line is formed as shown in FIG. 2d. Trench H2.
在確定刻劃導引線溝槽H2形成時所產生的氣泡，被往刻劃導引線溝槽H1形成時先產生的氣泡區域側誘導。 It is determined that the bubbles generated when the scoring guide line groove H2 is formed are induced to the side of the bubble region that is generated first when the scoring guide line groove H1 is formed.
其理由為：由於在形成刻劃導引線溝槽H1時，因氣泡的產生而使刻劃導引線溝槽H1周圍之物性強度弱化，因此在確定刻劃導引線溝槽H2形成時所產生之氣泡，被往該弱化的部分誘導。 The reason is that when the scoring guideline groove H1 is formed, the physical strength around the scoring guideline groove H1 is weakened due to the generation of air bubbles. Therefore, when it is determined that the scoring guideline groove H2 is formed, The generated bubbles are induced to the weakened part.
亦即，在本實施形態之分斷方法中，在確定刻劃導引線溝槽H2形成時所產生之氣泡，不往液晶部30側移動，而僅偏往相對變弱的刻劃導引線溝槽H1側移動。 That is, in the cutting method of this embodiment, the bubbles generated when the scribe guide line groove H2 is formed are determined, and do not move to the side of the liquid crystal portion 30, but only toward the relatively weak scribe guide. The wire groove H1 side moves.
因此，氣泡侵入液晶部30而產生問題的情況不會發生。 Therefore, it does not occur that air bubbles enter the liquid crystal section 30 and cause a problem.
接著，如圖3a及圖3b所示，利用刻劃輪70沿確定刻劃導引線溝槽H2切割上部玻璃部9及下部玻璃部8。 Next, as shown in FIGS. 3 a and 3 b, the upper glass portion 9 and the lower glass portion 8 are cut by the scoring wheel 70 along the scoring guide line groove H2.
由於藉由雷射刻劃而將密封部12加熱及熔融且化作氣泡， 因此在圖3b之H2的區域不殘留密封部12。因此，在利用刻劃輪70進行刻劃時，僅對上部玻璃部9及下部玻璃部8進行刻劃。因此，能夠在無密封部12之干擾下對貼合基板10進行刻劃，能夠獲得使貼合基板10之斷面品質提高並且使貼合基板10之分離性提高的效果。 Since the sealing portion 12 is heated and melted by the laser scribing and turned into bubbles, Therefore, the sealing portion 12 does not remain in the region H2 in FIG. 3b. Therefore, when scoring is performed using the scoring wheel 70, only the upper glass portion 9 and the lower glass portion 8 are scribed. Therefore, the bonded substrate 10 can be scored without interference from the sealing portion 12, and the effects of improving the sectional quality of the bonded substrate 10 and improving the separability of the bonded substrate 10 can be obtained.
本實施形態之分斷方法，由於在以雷射對貼合基板10之密封部12進行刻劃後，利用刻劃輪70進行刻劃，因此能夠滑順地進行上部玻璃部9及下部玻璃部8之分斷。 In the cutting method of this embodiment, after the sealing portion 12 of the bonded substrate 10 is scribed by laser, the scribe wheel 70 is used to scribe, so that the upper glass portion 9 and the lower glass portion can be smoothly performed. 8 off.
此外，本實施形態之分斷方法，由於先以雷射對密封部12進行刻劃，因此具有能夠最大限度地減少貼合基板10之端材部14、且能夠以使邊框最大限度地變小的方式進行製造的優點。 In addition, in the cutting method of this embodiment, since the sealing portion 12 is scribed by a laser first, the end portion 14 can be minimized and the frame can be minimized. The advantages of manufacturing in a way.
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| KR1020140106714A KR101596296B1 (en) | 2014-06-25 | 2014-08-18 | Method for cutting of bonded substrate |
| ??10-2014-0106714 | 2014-08-18 |
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| JP2002172479A (en) * | 2000-09-20 | 2002-06-18 | Seiko Epson Corp | Laser parting method, laser parting device, manufacturing method for liquid crystal device, and manufacturing device for liquid crystal |
| JP2002287107A (en) * | 2001-03-28 | 2002-10-03 | Hitachi Ltd | Liquid crystal display device and method for manufacturing the same |
| JP2003002676A (en) * | 2001-06-19 | 2003-01-08 | Seiko Epson Corp | Method for splitting substrate and method for producing liquid crystal device |
| KR100689314B1 (en) * | 2003-11-29 | 2007-03-08 | 엘지.필립스 엘시디 주식회사 | Method of cutting liquid crystal display panel |
| US20090230102A1 (en) | 2005-10-28 | 2009-09-17 | Masanobu Soyama | Method for Creating Scribe Line on Brittle Material Substrate and Apparatus for Creating Scribe Line |
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