TWI651182B - Method for cutting brittle substrate and scribing device - Google Patents
Method for cutting brittle substrate and scribing device Download PDFInfo
- Publication number
- TWI651182B TWI651182B TW104114950A TW104114950A TWI651182B TW I651182 B TWI651182 B TW I651182B TW 104114950 A TW104114950 A TW 104114950A TW 104114950 A TW104114950 A TW 104114950A TW I651182 B TWI651182 B TW I651182B
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- brittle substrate
- line
- blade
- edge
- blade edge
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
本發明之目的在於延長刀尖之壽命。 The object of the invention is to extend the life of the tool tip.
本發明係將具有突起部PP及與突起部PP相連之前部之刀尖51，按壓於脆性基板4之表面SF。使被按壓之刀尖51於脆性基板4之表面SF上向著前部所朝的方向DA滑動。藉由使刀尖51滑動而於脆性基板4產生塑性變形，藉此於脆性基板4之表面SF上，形成具有溝槽形狀之溝槽線。於使刀尖51滑動時，將刀尖51前部之複數個位置O1及O2設為與脆性基板4之表面SF相同高度之位置。 In the present invention, the blade portion 51 having the protrusion portion PP and the front portion connected to the protrusion portion PP is pressed against the surface SF of the brittle substrate 4. The pressed blade tip 51 is slid on the surface SF of the brittle substrate 4 in the direction DA toward the front portion. A groove line having a groove shape is formed on the surface SF of the brittle substrate 4 by sliding the blade edge 51 to plastically deform the brittle substrate 4. When the blade edge 51 is slid, the plurality of positions O1 and O2 in the front portion of the blade edge 51 are set to the same height as the surface SF of the brittle substrate 4.
Description
本發明係關於脆性基板之分斷方法及劃線裝置。 The present invention relates to a method for breaking a brittle substrate and a scribing device.
於平面顯示面板或太陽電池平板等電性機器之製造中，常常需要分斷玻璃基板等脆性基板。首先於基板上形成劃線，接著沿著該劃線分斷基板。劃線係可藉由使刀尖於基板上滑動而形成。藉由該滑動，於基板上藉由塑性變形而形成溝槽，同時，於該溝槽之正下方形成垂直裂縫。其後，進行所謂斷裂工序之應力賦予。藉由斷裂工序使裂縫於厚度方向完全行進，藉此分斷基板。 In the manufacture of an electric device such as a flat display panel or a solar cell panel, it is often necessary to separate a brittle substrate such as a glass substrate. First, a scribe line is formed on the substrate, and then the substrate is separated along the scribe line. The scribing line can be formed by sliding the tip of the blade on the substrate. By this sliding, a groove is formed on the substrate by plastic deformation, and a vertical crack is formed directly under the groove. Thereafter, stress is applied in a so-called breaking process. The crack is continuously moved in the thickness direction by the breaking process, thereby breaking the substrate.
例如根據日本特開2013-71871號公報，使用具有刀部之金剛石刀頭於基板形成劃線。根據該公報，藉由對金剛石刀頭之刀部噴射冷卻氣體，可抑制因刀部與基板間產生之摩擦熱引起之刀部氧化，藉此實現金剛石刀頭之長壽命化。 For example, according to Japanese Laid-Open Patent Publication No. 2013-71871, a scribe line is formed on a substrate using a diamond cutter having a blade portion. According to this publication, by injecting the cooling gas to the blade portion of the diamond tip, it is possible to suppress oxidation of the blade portion due to frictional heat generated between the blade portion and the substrate, thereby realizing a long life of the diamond tip.
[專利文獻1]日本特開2013-71871號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2013-71871
於脆性基板之劃線中延長刀尖之壽命，於該領域中仍是重要之問題，尋求更進一步之技術。作為刀尖，於非如劃線輪般轉動者，而是使用如金剛石刀尖般滑動者之情形時，該問題尤其嚴重。 Extending the life of the tip in the scribing of the brittle substrate is still an important issue in the field, seeking further techniques. This problem is particularly serious when the tool tip is rotated like a scribing wheel, but is used like a diamond tip.
本發明係為了解決以上問題而完成者，其目的在於提供一種可延長刀尖壽命之脆性基板之分斷方法及劃線裝置。 The present invention has been made to solve the above problems, and an object thereof is to provide a breaking method and a scribing apparatus for a brittle substrate which can extend the life of a blade.
本發明之脆性基板之分斷方法包含以下工序。將具有突起部及與突起部相連之前部之刀尖按壓於一脆性基板之表面。使被按壓之刀尖於脆性基板之表面上向著前部所朝的方向滑動。藉由使刀尖滑動而於脆性基板產生塑性變形，藉此於脆性基板之表面上，形成具有溝槽形狀之至少1條溝槽線。於使刀尖滑動時，將刀尖前部之複數個位置設為與脆性基板表面相同高度之位置。 The breaking method of the brittle substrate of the present invention comprises the following steps. The blade tip having the protrusion and the front portion connected to the protrusion is pressed against the surface of a brittle substrate. The pressed blade edge is slid on the surface of the brittle substrate toward the front portion. At least one groove line having a groove shape is formed on the surface of the brittle substrate by sliding the blade edge to plastically deform the brittle substrate. When the blade tip is slid, the plurality of positions at the front of the blade tip are set to the same height as the surface of the brittle substrate.
根據本發明，於使刀尖滑動時，將刀尖前部之複數個位置設為與脆性基板表面相同高度之位置。藉此，分散刀尖特別會磨損之位置。因此可延長刀尖之壽命。 According to the present invention, when the blade edge is slid, the plurality of positions of the front portion of the blade edge are set to the same height as the surface of the brittle substrate. Thereby, the position where the blade tip is particularly worn is dispersed. This extends the life of the tip.
4‧‧‧玻璃基板(脆性基板) 4‧‧‧Glass substrate (brittle substrate)
4B‧‧‧基板 4B‧‧‧Substrate
4C‧‧‧單元基板(脆性基板) 4C‧‧‧unit substrate (brittle substrate)
4T‧‧‧基板 4T‧‧‧Substrate
9‧‧‧接合部 9‧‧‧ joints
50‧‧‧切割器具 50‧‧‧ cutting instruments
51‧‧‧刀尖 51‧‧‧Tool tip
51v‧‧‧刀尖 51v‧‧‧ pointed
52‧‧‧刀柄 52‧‧‧Knife
60‧‧‧劃線頭 60‧‧‧Drawing head
60V‧‧‧劃線頭 60V‧‧‧Drawing head
60W‧‧‧劃線頭 60W‧‧‧Drawing head
61‧‧‧姿勢調整部 61‧‧‧Position adjustment department
61V‧‧‧姿勢調整部 61V‧‧‧Position Adjustment Department
62‧‧‧保持部 62‧‧‧ Keeping Department
63‧‧‧加壓部 63‧‧‧ Pressurization
63W‧‧‧加壓部 63W‧‧‧Pressure Department
64‧‧‧本體部 64‧‧‧ Body Department
64W‧‧‧本體部 64W‧‧‧ Body Department
70‧‧‧驅動部 70‧‧‧ Drive Department
71‧‧‧載台驅動部 71‧‧‧Motorboard drive department
72‧‧‧列印頭驅動部 72‧‧‧Print head drive
80‧‧‧載台 80‧‧‧stage
90‧‧‧控制部 90‧‧‧Control Department
90V‧‧‧控制部 90V‧‧‧Control Department
91‧‧‧滑動前控制部 91‧‧‧Pre-sliding control department
92‧‧‧滑動控制部 92‧‧‧Sliding Control Department
92V‧‧‧滑動控制部 92V‧‧‧Sliding Control Department
93‧‧‧滑動後控制部 93‧‧‧Sliding Control Department
100‧‧‧劃線裝置 100‧‧‧ scribe device
100V‧‧‧劃線裝置 100V‧‧‧ scribe device
110‧‧‧主體部 110‧‧‧ Main body
111‧‧‧主體本體 111‧‧‧ Main body
112‧‧‧切割器具支持構件 112‧‧‧ Cutting implement support member
151‧‧‧基台本體 151‧‧‧Abutment Ontology
152‧‧‧限制器 152‧‧‧Restrictor
AL‧‧‧輔助線 AL‧‧‧Auxiliary line
AX‧‧‧軸方向 AX‧‧‧ axis direction
CL‧‧‧裂縫線 CL‧‧‧ crack line
DA‧‧‧方向 DA‧‧‧ directions
DB‧‧‧方向 DB‧‧‧ direction
DC‧‧‧方向 DC‧‧ direction
DT‧‧‧厚度方向 DT‧‧‧ thickness direction
ED1‧‧‧邊 ED1‧‧‧ side
ED2‧‧‧邊 ED2‧‧‧ side
ED3‧‧‧邊 ED3‧‧‧ side
ED4‧‧‧邊 ED4‧‧‧ side
F‧‧‧載荷 F‧‧‧load
LD‧‧‧力 LD‧‧‧ force
N1‧‧‧位置 N1‧‧‧ position
N2‧‧‧位置 N2‧‧‧ position
N3‧‧‧位置 N3‧‧‧ position
O1‧‧‧位置 O1‧‧‧ position
O2‧‧‧位置 O2‧‧‧ position
PP‧‧‧突起部 PP‧‧‧Protruding
PPv‧‧‧突起部 PPv‧‧‧Protruding
PS‧‧‧側部 PS‧‧‧ side
PSv‧‧‧側部 PSv‧‧‧ side
SB‧‧‧部分 SB‧‧‧ Section
SC‧‧‧圓錐面 SC‧‧‧Conical surface
SD1‧‧‧頂面(第1面) SD1‧‧‧ top surface (1st side)
SD2‧‧‧側面(第2面) SD2‧‧‧ side (2nd side)
SD3‧‧‧側面(第3面) SD3‧‧‧ side (3rd side)
SF‧‧‧表面 SF‧‧‧ surface
SF1‧‧‧上表面 SF1‧‧‧ upper surface
SL‧‧‧劃線 SL‧‧‧
SLBs‧‧‧箭頭 SLBs‧‧‧ arrow
SLXm‧‧‧直線 SLXm‧‧‧ Straight line
SLXs‧‧‧直線 SLXs‧‧‧ Straight line
SLXw‧‧‧直線 SLXw‧‧‧ Straight line
SLYm‧‧‧直線 SLYm‧‧‧ Straight line
SLYs‧‧‧直線 SLYs‧‧‧ Straight line
SLYw‧‧‧直線 SLYw‧‧‧ Straight line
SLTw‧‧‧箭頭 SLTw‧‧ arrow
ST‧‧‧部分 ST‧‧‧section
TL‧‧‧溝槽線 TL‧‧‧ trench line
TLa~TLe‧‧‧溝槽線 TLa~TLe‧‧‧ trench line
TLm‧‧‧溝槽線 TLm‧‧‧ trench line
IIB‧‧‧箭頭 IIB‧‧‧ arrow
VIIB‧‧‧箭頭 VIIB‧‧‧ arrow
VIIIB‧‧‧箭頭 VIIIB‧‧‧ arrow
XXVB‧‧‧箭頭 XXVB‧‧‧ arrow
XXVIIB‧‧‧箭頭 XXVIIB‧‧‧ arrow
X-Y-Z‧‧‧座標系 X-Y-Z‧‧‧ coordinate system
圖1係概略性顯示本發明實施形態1之劃線裝置之構成之圖。 Fig. 1 is a view schematically showing the configuration of a scribing apparatus according to a first embodiment of the present invention.
圖2(A)係概略性顯示本發明實施形態1之刀尖變位之狀態之圖、及(B)係於其箭頭IIB視角顯示刀尖之圖。 Fig. 2(A) is a view schematically showing a state in which the blade edge is displaced according to the first embodiment of the present invention, and (B) is a view showing the blade edge in the direction of the arrow IIB.
圖3(A)係概略性顯示無裂縫狀態之溝槽線之構成之剖面圖；及(B)係概略性顯示裂縫線之構成之剖面圖。 Fig. 3(A) is a cross-sectional view showing a schematic configuration of a groove line in a non-cracked state; and (B) is a cross-sectional view schematically showing a configuration of a crack line.
圖4係顯示於本發明實施形態1之脆性基板之分斷方法中，於使刀尖滑動時將作為刀尖前部的側部之複數個位置設為與脆性基板表面相同高度之位置之狀態之圖。 4 is a view showing a state in which a plurality of positions of a side portion of a front portion of a cutting edge are set to the same height as a surface of a brittle substrate when the blade edge is slid, in the method of breaking the brittle substrate according to the first embodiment of the present invention. Picture.
圖5(A)~(C)係顯示本發明實施形態1之脆性基板之分斷方法中載荷變化之第1~第3例各者之立體圖。 5(A) to 5(C) are perspective views showing the first to third examples of the load change in the breaking method of the brittle substrate according to the first embodiment of the present invention.
圖6係顯示本發明實施形態1之脆性基板之分斷方法中載荷變化之第4例之剖面圖。 Fig. 6 is a cross-sectional view showing a fourth example of load change in the breaking method of the brittle substrate according to the first embodiment of the present invention.
圖7(A)係概略性顯示本發明實施形態2之刀尖變位之狀態之圖；及(B)係於其箭頭VIIB視角顯示刀尖之圖。 Fig. 7(A) is a view schematically showing a state in which the blade edge is displaced according to the second embodiment of the present invention; and (B) is a view showing the blade edge in the direction of the arrow VIIB.
圖8(A)係顯示於本發明實施形態2之脆性基板之分斷方法中，於使刀尖滑動時將作為刀尖前部的頂面之複數個位置設為與脆性基板表面相同高度之位置之狀態之圖；及(B)係其箭頭VIIIB視角之圖。 8(A) shows a method of dividing a brittle substrate according to a second embodiment of the present invention, wherein a plurality of positions of a top surface of a front portion of the cutting edge are set to be the same height as a surface of the brittle substrate when the blade edge is slid. A diagram of the state of the position; and (B) is a diagram of the angle of view of arrow VIIIB.
圖9係概略性顯示本發明實施形態3之劃線裝置之構成之圖。 Fig. 9 is a view schematically showing the configuration of a scribing apparatus according to a third embodiment of the present invention.
圖10係概略性顯示本發明實施形態3之變化例之劃線頭之構成之圖。 Fig. 10 is a view schematically showing the configuration of a scribing head according to a modification of the third embodiment of the present invention.
圖11(A)及(B)係概略性顯示本發明實施形態4之脆性基板之分斷方法之第1及第2工序各者之俯視圖。 (A) and (B) are plan views schematically showing each of the first and second steps of the breaking method of the brittle substrate according to the fourth embodiment of the present invention.
圖12(A)及(B)係概略性顯示本發明實施形態4之第1變化例之脆性基板之分斷方法之第1及第2工序各者之俯視圖。 (A) and (B) are plan views each showing the first and second steps of the breaking method of the brittle substrate according to the first modification of the fourth embodiment of the present invention.
圖13係概略性顯示本發明實施形態4之第2變化例之脆性基板之分斷方法之俯視圖。 Fig. 13 is a plan view schematically showing a method of dividing a brittle substrate according to a second modification of the fourth embodiment of the present invention.
圖14係概略性顯示本發明實施形態4之第3變化例之脆性基板之分斷方法之俯視圖。 Fig. 14 is a plan view schematically showing a method of dividing a brittle substrate according to a third modification of the fourth embodiment of the present invention.
圖15係概略性顯示本發明實施形態5之脆性基板之分斷方法之第1工序之俯視圖。 Fig. 15 is a plan view schematically showing a first step of the breaking method of the brittle substrate according to the fifth embodiment of the present invention.
圖16係概略性顯示本發明實施形態5之脆性基板之分斷方法之第2工序之俯視圖。 Fig. 16 is a plan view schematically showing a second step of the breaking method of the brittle substrate according to the fifth embodiment of the present invention.
圖17係概略性顯示本發明實施形態5之脆性基板之分斷方法之第3工序之俯視圖。 Fig. 17 is a plan view schematically showing a third step of the breaking method of the brittle substrate according to the fifth embodiment of the present invention.
圖18係概略性顯示本發明實施形態5之第1變化例之脆性基板之分斷方法之俯視圖。 FIG. 18 is a plan view schematically showing a method of dividing a brittle substrate according to a first modification of the fifth embodiment of the present invention.
圖19(A)及(B)係概略性顯示本發明實施形態5之第2變化例之脆性基板之分斷方法之第1及第2工序各者之俯視圖。 19(A) and (B) are plan views schematically showing the first and second steps of the breaking method of the brittle substrate according to the second modification of the fifth embodiment of the present invention.
圖20係概略性顯示本發明實施形態5之第3變化例之脆性基板之分斷方法之俯視圖。 Fig. 20 is a plan view schematically showing a method of dividing a brittle substrate according to a third modification of the fifth embodiment of the present invention.
圖21係概略性顯示本發明實施形態6之脆性基板之分斷方法之俯視圖。 Fig. 21 is a plan view schematically showing a method of dividing a brittle substrate according to a sixth embodiment of the present invention.
圖22(A)及(B)係概略性顯示本發明實施形態7之脆性基板之分斷方法之第1及第2工序各者之俯視圖。 22(A) and (B) are plan views schematically showing each of the first and second steps of the breaking method of the brittle substrate according to the seventh embodiment of the present invention.
圖23(A)及(B)係概略性顯示本發明實施形態8之脆性基板之分斷方法之第1及第2工序各者之俯視圖。 23(A) and 23(B) are plan views schematically showing the first and second steps of the breaking method of the brittle substrate according to the eighth embodiment of the present invention.
圖24係概略性顯示本發明實施形態8之變化例之脆性基板之分斷方法之俯視圖。 Fig. 24 is a plan view schematically showing a method of dividing a brittle substrate according to a modification of the eighth embodiment of the present invention.
圖25(A)係概略性顯示本發明實施形態9之刀尖變位之狀態之圖；及(B)係於其箭頭XXVB視角顯示刀尖之圖。 Fig. 25(A) is a view schematically showing a state in which the blade edge is displaced according to the ninth embodiment of the present invention; and (B) is a view showing the blade edge in the direction of the arrow XXVB.
圖26係顯示於本發明實施形態9之脆性基板之分斷方法中，於使刀尖滑動時將作為刀尖前部的側部之複數個位置設為與脆性基板表面相同高度之位置之狀態之圖。 Fig. 26 is a view showing a state in which the plurality of sides of the front portion of the cutting edge portion are set to the same height as the surface of the brittle substrate when the blade edge is slid, in the breaking method of the brittle substrate according to the ninth embodiment of the present invention. Picture.
圖27(A)係概略性顯示本發明實施形態9之變化例之刀尖變位之狀態之圖；及(B)係於其箭頭XXVIIB視角顯示刀尖之圖。 Fig. 27(A) is a view schematically showing a state in which the blade edge is displaced in a variation of the ninth embodiment of the present invention; and (B) is a view showing the blade edge in the direction of the arrow XXVIIB.
圖28係顯示於本發明實施形態9之變化例之脆性基板之分斷方法中，於使刀尖滑動時將刀尖前部之複數個位置設為與脆性基板表面相同高度之位置之狀態之圖。 FIG. 28 is a view showing a state in which the brittle substrate of the modification of the ninth embodiment of the present invention is in a state in which the plurality of positions of the front edge of the blade edge are set to the same height as the surface of the brittle substrate when the blade edge is slid. Figure.
以下，基於圖式對本發明之實施形態進行說明。另，於以下圖式中對相同或相當部分標註相同之參照編號不重複其說明。 Hereinafter, embodiments of the present invention will be described based on the drawings. In the following figures, the same reference numerals are given to the same or corresponding parts, and the description is not repeated.
圖1係概略性顯示本實施形態之劃線裝置100之構成之圖。圖中，以2點鏈線表示將被分斷之玻璃基板4(脆性基板)。又，為了說明 之方便顯示XYZ正交座標系，於圖示之例中，進行沿著X方向之分斷。劃線裝置100具有劃線頭60、驅動部70、載台80(基板支持部)及控制部90。 Fig. 1 is a view schematically showing the configuration of a scribing apparatus 100 of the present embodiment. In the figure, the glass substrate 4 (brittle substrate) to be broken is indicated by a two-dot chain line. Again, for illustration It is convenient to display the XYZ orthogonal coordinate system, and in the illustrated example, the division along the X direction is performed. The scribing device 100 includes a scribing head 60, a driving unit 70, a stage 80 (substrate supporting unit), and a control unit 90.
劃線頭60包含：切割器具50、姿勢調整部61、保持部62、加壓部63及本體部64。切割器具50具有刀尖51及刀柄52(圖2(A))。姿勢調整部61係可調整切割器具50之姿勢地支持切割器具50。保持部62保持姿勢調整部61。加壓部63係固定於本體部64並可對保持部62施加力之致動器。 The scribing head 60 includes a cutting instrument 50, a posture adjusting unit 61, a holding unit 62, a pressurizing unit 63, and a main body unit 64. The cutting instrument 50 has a blade edge 51 and a shank 52 (Fig. 2(A)). The posture adjusting unit 61 supports the cutting instrument 50 by adjusting the posture of the cutting instrument 50. The holding portion 62 holds the posture adjusting portion 61. The pressurizing portion 63 is an actuator that is fixed to the main body portion 64 and that can apply a force to the holding portion 62.
載台80係支持具有表面SF之一個玻璃基板4(一個脆性基板)者。 The stage 80 supports one glass substrate 4 (one brittle substrate) having a surface SF.
驅動部70係使被支持於載台80之玻璃基板4、與刀尖51相對變位者。因此驅動部70可為使刀尖51及載台80之任一者變位者，或亦可為使刀尖51及載台80各者均變位者。於本實施形態中，驅動部70具有載台驅動部71，其係使載台80變位；及列印頭驅動部72，其係用以使劃線頭60之本體部64變位。載台驅動部71係例如賦予載台80沿著圖中XYZ軸各者之平移變位、與繞圖中Z軸之旋轉變位。列印頭驅動部72係例如賦予劃線頭60之本體部64沿著圖中X軸之並進變位。 The drive unit 70 is a member that is supported by the glass substrate 4 of the stage 80 and that is relatively displaced from the blade edge 51. Therefore, the driving unit 70 may be any one of the blade tip 51 and the stage 80, or may be positioned such that the blade edge 51 and the stage 80 are each displaced. In the present embodiment, the drive unit 70 includes a stage drive unit 71 for displacing the stage 80, and a print head drive unit 72 for displacing the body portion 64 of the scribing head 60. The stage driving unit 71 is, for example, biased by the translational displacement of the stage 80 along the XYZ axis in the drawing and the rotation of the Z axis in the drawing. The print head driving unit 72 is, for example, biased into the main body portion 64 of the scribing head 60 along the X-axis in the drawing.
控制部90具有滑動前控制部91、滑動控制部92及滑動後控制部93。控制部90係控制驅動部70及加壓部63者。 The control unit 90 includes a pre-slide control unit 91, a slide control unit 92, and a post-slide control unit 93. The control unit 90 controls the drive unit 70 and the pressurizing unit 63.
滑動前控制部91係以刀尖51於玻璃基板4之表面SF上之滑動前將刀尖51按壓於表面SF上之方式控制驅動部70。 The slide front control unit 91 controls the drive unit 70 such that the blade edge 51 presses the blade edge 51 against the surface SF before sliding on the surface SF of the glass substrate 4.
滑動控制部92係以刀尖51於玻璃基板4之表面SF上向著刀尖51前部所朝的方向滑動之方式控制驅動部70。又，滑動控制部92係以將於玻璃基板4上滑動之刀尖51前部之複數個位置設為與玻璃基板4表面相同高度之位置之方式控制加壓部63。換言之，滑動控制部92係藉由控制加壓部63，使於玻璃基板4上滑動之刀尖51之前部變位至與玻璃基板4之表面SF相同高度之位置。基於該目的，滑動控制部92係藉由使 加壓部63產生之力變化，使施加於刀尖51之載荷變化。 The slide control unit 92 controls the drive unit 70 such that the blade edge 51 slides on the surface SF of the glass substrate 4 in the direction in which the front end of the blade edge 51 faces. Further, the slide control unit 92 controls the pressurizing unit 63 such that a plurality of positions on the front side of the blade edge 51 that slides on the glass substrate 4 are at the same height as the surface of the glass substrate 4. In other words, the slide control unit 92 controls the pressurizing portion 63 to displace the front portion of the blade edge 51 that slides on the glass substrate 4 to the same height as the surface SF of the glass substrate 4. For this purpose, the slide control unit 92 is made by The force generated by the pressurizing portion 63 changes, and the load applied to the blade edge 51 changes.
滑動後控制部93係以刀尖51於玻璃基板4之表面SF上滑動後，刀尖51自玻璃基板4之表面SF上離開之方式控制驅動部70者。 The sliding control unit 93 controls the driving unit 70 such that the blade edge 51 slides on the surface SF of the glass substrate 4 and the blade edge 51 is separated from the surface SF of the glass substrate 4.
參照圖2(A)及(B)，於刀尖51設置有頂面SD1(第1面)、與包圍頂面SD1之複數個面。該等複數個面包含側面SD2(第2面)及側面SD3(第3面)。頂面SD1及側面SD2和SD3(第1~第3面)朝向互不相同之方向，且彼此相鄰。刀尖51具有頂面SD1、側面SD2及SD3所會合之頂點，並藉由該頂點構成刀尖51之突起部PP。因此，頂面SD1係與突起部PP相連。又，側面SD2及SD3呈構成刀尖51之側部PS之稜線。側部PS係與突起部PP相連，並自突起部PP線狀地延伸。又，由於側部PS如上述般為稜線，故具有線狀延伸之凸形狀。 Referring to FIGS. 2(A) and 2(B), the cutting edge 51 is provided with a top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1. The plurality of faces include a side surface SD2 (second surface) and a side surface SD3 (third surface). The top surface SD1 and the side surfaces SD2 and SD3 (the first to third surfaces) are oriented in mutually different directions and adjacent to each other. The blade tip 51 has a vertex at which the top surface SD1, the side surfaces SD2, and SD3 meet, and the apex constitutes the protrusion PP of the blade edge 51. Therefore, the top surface SD1 is connected to the protrusion PP. Further, the side faces SD2 and SD3 are ridge lines constituting the side portions PS of the blade edge 51. The side PS system is connected to the protrusion PP and extends linearly from the protrusion PP. Moreover, since the side portion PS is a ridge line as described above, it has a convex shape extending linearly.
刀尖51較好為金剛石刀頭。即，自可縮小硬度及表面粗糙度之點而言，刀尖51較好為由金剛石製成。更佳為由單晶金剛石製作刀尖51。進而更佳為自結晶學而言，頂面SD1係{001}面，側面SD2及SD3各自係{111}面。於該情形時，側面SD2及側面SD3雖具有不同朝向，但於結晶學上係相互等價之結晶面。 The tip 51 is preferably a diamond cutter head. That is, the tip 51 is preferably made of diamond in terms of the point where the hardness and the surface roughness can be reduced. More preferably, the tip 51 is made of single crystal diamond. More preferably, in terms of crystallography, the top surface SD1 is a {001} plane, and the side surfaces SD2 and SD3 are each a {111} plane. In this case, although the side surface SD2 and the side surface SD3 have different orientations, they are crystallographically equivalent to each other.
另，可使用非單晶之金剛石，例如，使用以CVD(Chemical Vapor Deposition：化學氣相沈積)法合成之多晶體金剛石。或亦可使用自微粒石墨或非石墨狀碳將不包含鐵族元素等之結合材燒結出之多晶體金剛石粒子藉由鐵族元素等結合材予以結合燒結之金剛石。 Further, a non-single crystal diamond may be used, for example, a polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method. Alternatively, the polycrystalline diamond particles obtained by sintering the binder containing no iron group element or the like from the particulate graphite or the non-graphite carbon may be used to bond the sintered diamond by a bonding material such as an iron group element.
刀柄52係沿著軸方向AX延伸。刀尖51較好為以頂面SD1之法線方向大致沿著軸方向AX之方式安裝於刀柄52。軸方向AX相對於玻璃基板4之表面SF之角度較好為可藉由姿勢調整部61(圖1)調整。於該情形時，藉由姿勢調整部61，可調整刀尖51相對於表面SF之姿勢。 The shank 52 extends along the axial direction AX. The blade edge 51 is preferably attached to the shank 52 so as to be substantially along the axial direction AX in the normal direction of the top surface SD1. The angle of the axial direction AX with respect to the surface SF of the glass substrate 4 is preferably adjusted by the posture adjusting portion 61 (Fig. 1). In this case, the posture of the blade edge 51 with respect to the surface SF can be adjusted by the posture adjusting portion 61.
接著對劃線裝置100之動作進行說明。 Next, the operation of the scribing device 100 will be described.
首先，藉由滑動前控制部91對驅動部70及加壓部63之控制，將 刀尖51按壓於玻璃基板4之表面SF。當刀尖51被按壓於表面SF時，突起部PP位於較基板表面SF更為基板內部側。 First, the control of the drive unit 70 and the pressurizing unit 63 by the pre-sliding control unit 91 will The blade edge 51 is pressed against the surface SF of the glass substrate 4. When the blade edge 51 is pressed against the surface SF, the protrusion portion PP is located on the substrate inner side from the substrate surface SF.
接著，藉由滑動控制部92對驅動部70之控制，使被按壓之刀尖51大致沿著將側部PS投影於上表面SF1上之方向，於表面SF上滑動。 於本實施形態中，滑動中刀尖51之側部PS為前部，使被按壓之刀尖51於玻璃基板4之表面SF上，向著側部PS所朝的方向DA(圖中，+X軸方向)滑動。方向DA係對應於將自刀尖51延伸之軸方向AX投影於表面SF上之方向。滑動中，藉由刀柄52於表面SF上拖曳刀尖51。 Next, by the control of the drive unit 70 by the slide control unit 92, the pressed blade edge 51 slides on the surface SF substantially in the direction in which the side portion PS is projected onto the upper surface SF1. In the present embodiment, the side portion PS of the sliding middle edge 51 is the front portion, and the pressed blade edge 51 is on the surface SF of the glass substrate 4 in the direction DA toward the side portion PS (in the figure, +X) Slide in the direction of the axis. The direction DA corresponds to a direction in which the axial direction AX extending from the blade edge 51 is projected on the surface SF. During the sliding, the blade tip 51 is dragged on the surface SF by the shank 52.
藉由使刀尖51滑動於玻璃基板4而產生塑性變形，藉此於玻璃基板4之表面SF上，形成具有溝槽形狀之至少1條溝槽線TL(圖3(A)或(B))。溝槽線TL係藉由玻璃基板4之塑性變形而產生，但此時亦可略微切削玻璃基板4。然而，由於此種切削可能產生細微之碎片，故較好為盡可能地少。 Plastic deformation is caused by sliding the blade edge 51 on the glass substrate 4, thereby forming at least one groove line TL having a groove shape on the surface SF of the glass substrate 4 (Fig. 3(A) or (B) ). The groove line TL is generated by plastic deformation of the glass substrate 4, but the glass substrate 4 may be slightly cut at this time. However, since such cutting may produce fine fragments, it is preferably as small as possible.
藉由刀尖51之滑動，存在不伴隨裂縫而形成溝槽線TL(圖3(A))之情形，與形成溝槽線TL且實質上幾乎同時形成裂縫線CL之情形。裂縫線CL係自溝槽線TL之凹痕於厚度方向DT伸展之裂縫，於表面SF上線狀地延伸。 By the sliding of the blade edge 51, there is a case where the groove line TL (Fig. 3(A)) is formed without a crack, and the groove line TL is formed and the crack line CL is formed substantially simultaneously. The crack line CL is a slit extending from the groove line TL in the thickness direction DT, and extends linearly on the surface SF.
如為前者之情形，形成溝槽線TL之工序係如下進行：獲得於溝槽線TL之正下方，玻璃基板4於與溝槽線TL之延伸方向(圖中，X軸方向)交叉之方向DC(圖中，Y軸方向)上連續相連之狀態即無裂縫狀態。 為了獲得無裂縫狀態，施加於刀尖51之載荷設為小至不產生裂縫之程度，且大至產生塑性變形之程度。於形成該無裂縫狀態之溝槽線TL(圖3(A))後，藉由後述之方法，藉由使玻璃基板4之裂縫沿著溝槽線TL於厚度方向DT上伸展，可形成裂縫線CL(圖3(B))。藉由裂縫線CL之形成，打破無裂縫狀態。即，裂縫線CL於溝槽線TL正下方，於與溝槽線TL交叉之方向DC上將玻璃基板4之連續相連斷開。 In the case of the former, the process of forming the trench line TL is performed as follows: the direction in which the glass substrate 4 intersects the direction in which the groove line TL extends (in the X-axis direction in the drawing) directly under the groove line TL The state in which DC (in the figure, the Y-axis direction) is continuously connected is a crack-free state. In order to obtain a crack-free state, the load applied to the cutting edge 51 is set to such an extent that cracks are not generated and are large to the extent of plastic deformation. After the groove line TL (FIG. 3(A)) in which the crack-free state is formed, a crack can be formed by stretching the crack of the glass substrate 4 in the thickness direction DT along the groove line TL by a method described later. Line CL (Fig. 3(B)). By the formation of the crack line CL, the crack-free state is broken. That is, the crack line CL is directly below the groove line TL, and the glass substrate 4 is continuously disconnected in the direction DC intersecting the groove line TL.
於任一種情形時，均沿著裂縫線CL分斷玻璃基板4。此時，根據需要，進行所謂之斷裂工序。 In either case, the glass substrate 4 is separated along the crack line CL. At this time, a so-called breaking process is performed as needed.
藉由滑動控制部92，於使刀尖51滑動時將作為刀尖51的前部之側部PS之複數個位置(例如，圖4之位置O1及O2)，設為與玻璃基板4之表面SF相同高度之位置。基於該目的，使施加於正在滑動之刀尖51之載荷變化。可藉由調整加壓部63產生之力而使載荷變化。位置O1及O2例如較好為高度0.5~2.5μm左右，且彼此分開。 When the blade edge 51 is slid, a plurality of positions (for example, positions O1 and O2 in FIG. 4) of the side portion PS of the front portion of the blade edge 51 are set to be the surface of the glass substrate 4 by the slide control portion 92. The position of the same height of SF. For this purpose, the load applied to the blade tip 51 that is sliding is changed. The load can be changed by adjusting the force generated by the pressurizing portion 63. The positions O1 and O2 are, for example, preferably about 0.5 to 2.5 μm in height and are separated from each other.
另，不需要僅將位置O1及O2設為與玻璃基板4之表面SF相同高度之位置，亦可於滑動中使表面SF於位置O1及O2間連續地變位。於該情形時，位置O1及O2間之任意位置均具有與表面SF相同高度之時點。 Further, it is not necessary to set the positions O1 and O2 to the same height as the surface SF of the glass substrate 4, and the surface SF may be continuously displaced between the positions O1 and O2 during sliding. In this case, any position between the positions O1 and O2 has the same height as the surface SF.
根據本實施形態，於1個玻璃基板4上使刀尖51滑動時使對刀尖51之載荷變化。載荷例如可以最大值相對於最小值為1.5~2倍左右之方式變化。藉此，將作為刀尖51前部之側部PS上之位置O1及O2(圖4)設為與玻璃基板4之表面SF相同高度之位置。因此，與於1個玻璃基板4上使刀尖51滑動時僅將刀尖51前部之一個位置(例如僅O1)設為與玻璃基板4之表面SF相同高度之位置之情形相比，分散刀尖51特別會磨損之位置，因此可延長刀尖51之壽命。 According to the present embodiment, when the blade edge 51 is slid on one glass substrate 4, the load on the blade edge 51 is changed. The load can be changed, for example, by a maximum value of about 1.5 to 2 times with respect to the minimum value. Thereby, the positions O1 and O2 (FIG. 4) on the side portion PS of the front portion of the blade edge 51 are set to the same height as the surface SF of the glass substrate 4. Therefore, when the blade edge 51 is slid on one glass substrate 4, only one position (for example, only O1) of the front portion of the blade edge 51 is set to be the same height as the surface SF of the glass substrate 4, and is dispersed. The position of the cutting edge 51 particularly wears, so that the life of the cutting edge 51 can be extended.
可使賦予滑動中之刀尖51之載荷於對1個脆性基板劃線之任意時期變化。以下，對其例進行說明。 The load applied to the blade tip 51 during sliding can be changed at any time during the scribing of one brittle substrate. Hereinafter, an example will be described.
圖5(A)~(C)各者係顯示對作為脆性基板之玻璃基板4劃線之例。 圖中，粗線表示相對較大之載荷，細線表示相對較小之載荷。 Each of FIGS. 5(A) to (C) shows an example in which a glass substrate 4 as a brittle substrate is scribed. In the figure, thick lines indicate relatively large loads, and thin lines indicate relatively small loads.
於圖5(A)之例中，刀尖51(圖2(A))於玻璃基板4之表面SF上之滑動係沿著沿X軸之直線SLXm及沿Y軸之直線SLYm進行。於直線SLXm各者之滑動中對刀尖51賦予載荷變化。於直線SLYm各者中亦相同。 In the example of Fig. 5(A), the sliding of the blade edge 51 (Fig. 2(A)) on the surface SF of the glass substrate 4 is performed along a straight line SLXm along the X-axis and a straight line SLYm along the Y-axis. A load change is applied to the blade edge 51 during the sliding of each of the straight lines SLXm. The same is true for each of the straight lines SLYm.
於圖5(B)之例中，刀尖51(圖2(A))於玻璃基板4之表面SF上之滑 動係沿著沿X軸之直線SLXw及SLXs、與沿Y軸之直線SLYw及SLYs進行。各直線中對滑動中之刀尖51之載荷係一定。直線SLXs上之載荷與直線SLXw上之載荷互不相同。換言之，於直線SLXs及直線SLXw之間使載荷變化。又，SLYs之載荷、與直線SLYw上之載荷互不相同。換言之，於直線SLYs及SLYw之間使載荷變化。於本例中，於彼此相鄰之直線間，所使用之載荷不同。例如，於以排列於一個方向(圖中右方向)之直線SLYs、SLYw、SLYs及SLYw之順序進行滑動之情形時，於其等直線上之滑動中交替地賦予載荷之強弱變化。 In the example of FIG. 5(B), the blade tip 51 (FIG. 2(A)) slides on the surface SF of the glass substrate 4. The dynamic system is performed along straight lines SLXw and SLXs along the X axis and straight lines SLYw and SLYs along the Y axis. The load of the blade tip 51 in the sliding is constant in each straight line. The load on the straight line SLXs is different from the load on the straight line SLXw. In other words, the load is changed between the straight line SLXs and the straight line SLXw. Moreover, the load of the SLYs and the load on the straight line SLYw are different from each other. In other words, the load is changed between the straight lines SLYs and SLYw. In this example, the loads used are different between straight lines adjacent to each other. For example, when sliding in the order of the straight lines SLYs, SLYw, SLYs, and SLYw arranged in one direction (the right direction in the drawing), the load is strongly changed in the sliding on the straight line.
於圖5(C)之例中，刀尖51於玻璃基板4之表面SF上之滑動係沿著沿X軸之直線SLXs及沿Y軸之直線SLYw進行。對各直線上之對滑動中之刀尖51之載荷係一定。直線SLXs上之載荷與直線SLYw上之載荷互不相同。換言之，於直線SLXs及直線SLYw之間使載荷變化。 In the example of Fig. 5(C), the sliding of the cutting edge 51 on the surface SF of the glass substrate 4 is performed along a straight line SLXs along the X-axis and a straight line SLYw along the Y-axis. The load on the blade tip 51 in the pair of sliding on each straight line is constant. The load on the straight line SLXs is different from the load on the straight line SLYw. In other words, the load is changed between the straight line SLXs and the straight line SLYw.
於圖6之例中，於1個單元基板4C(脆性基板)之表面SF上進行滑動。單元基板4C具有由脆性材料製作之基板(例如玻璃基板)4T及4B。 基板4T及4B係經由接合部9彼此層疊。藉此，表面SF具有由基板4T構成之部分ST、與由基板4B構成之部分SB。刀尖51於單元基板4C之表面SF上之滑動係於部分ST上(參照箭頭SLTw)及部分SB上(參照箭頭SLBs)進行。對於部分ST上之滑動中之刀尖51之載荷係一定，且，對於部分SB上之滑動中之刀尖51之載荷係一定。另一方面，與部分ST上相比，較為增大對於部分SB上之滑動中之刀尖51之載荷。換言之，於部分ST及SB之間使載荷變化。 In the example of Fig. 6, sliding is performed on the surface SF of one unit substrate 4C (brittle substrate). The unit substrate 4C has substrates (for example, glass substrates) 4T and 4B made of a brittle material. The substrates 4T and 4B are laminated to each other via the joint portion 9. Thereby, the surface SF has a portion ST composed of the substrate 4T and a portion SB composed of the substrate 4B. The sliding of the blade edge 51 on the surface SF of the unit substrate 4C is performed on the portion ST (see the arrow SLTw) and the portion SB (see the arrow SLBs). The load on the blade tip 51 in the sliding on the portion ST is constant, and the load on the blade tip 51 in the sliding on the portion SB is constant. On the other hand, the load on the blade tip 51 in the sliding on the portion SB is increased as compared with the portion ST. In other words, the load is changed between the portions ST and SB.
參照圖7(A)及(B)，於本實施形態中，使刀尖51朝向與方向DA(圖1(A)及(B))相反之方向DB滑動。另，關於上述以外之構成，與上述實施形態1之構成幾乎相同，故對相同或對應之要素標註相同之符號，不重複其說明。 Referring to Figs. 7(A) and (B), in the present embodiment, the blade edge 51 is slid toward the direction DB opposite to the direction DA (Figs. 1(A) and (B)). The configuration other than the above is substantially the same as the configuration of the first embodiment, and the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.
根據本實施形態，藉由於1個玻璃基板4上使刀尖51滑動時使對刀尖51之載荷變化，而將作為刀尖51前部之頂面SD1上之位置O1及O2(圖8(A))設為與玻璃基板4之表面SF相同高度之位置。藉此，與於1個玻璃基板4上使刀尖51滑動時僅將刀尖51的前部之一個位置設為與玻璃基板4之表面SF相同高度之位置之情形相比，分散刀尖51特別會磨損之位置。因此可延長刀尖51之壽命。 According to the present embodiment, when the blade edge 51 is slid on one glass substrate 4, the load on the blade edge 51 is changed, and the positions O1 and O2 on the top surface SD1 of the front portion of the blade edge 51 are obtained (Fig. 8 (Fig. 8 A)) is set to the same height as the surface SF of the glass substrate 4. As a result, when the blade edge 51 is slid on one glass substrate 4, only one position of the front portion of the blade edge 51 is set to the same height as the surface SF of the glass substrate 4, and the blade tip 51 is dispersed. Especially the location of wear and tear. Therefore, the life of the blade tip 51 can be extended.
又，刀尖51朝向方向DB滑動之情形，與刀尖51朝向方向DA滑動之情形不同，由於於位置O1及O2各者，玻璃基板4與刀尖51以特定之長度接觸(參照圖8(B))，故可進而延長刀尖51之壽命。 Further, when the blade edge 51 slides in the direction DB, unlike the case where the blade edge 51 slides in the direction DA, the glass substrate 4 and the blade edge 51 are in contact with each other at a specific length at the positions O1 and O2 (refer to FIG. 8 (refer to FIG. 8 B)), so that the life of the cutting edge 51 can be further extended.
圖9係概略性顯示本實施形態之劃線裝置100V之構成之圖。圖中，以2點鏈線表示要被分斷之玻璃基板4。又，為了說明之方便顯示XYZ正交座標系，於圖示之例中，進行沿著X方向之分斷。劃線裝置100V具有劃線頭60V與控制部90V。 Fig. 9 is a view schematically showing the configuration of the scribing device 100V of the present embodiment. In the figure, the glass substrate 4 to be broken is indicated by a 2-dot chain line. Moreover, for convenience of explanation, the XYZ orthogonal coordinate system is displayed, and in the illustrated example, the division along the X direction is performed. The scribing device 100V has a scribing head 60V and a control unit 90V.
劃線頭60V具有於使刀尖51(圖2(A))滑動時可使刀尖51姿勢變化(圖中，參照箭頭)之姿勢調整部61V。作為姿勢之變化，例如使相對於表面SF之軸方向AX(圖2(A))或圖7(A)之角度變化。 The scribing head 60V has a posture adjusting unit 61V that can change the posture of the blade edge 51 (see an arrow in the drawing) when the blade edge 51 (Fig. 2(A)) is slid. As the change in posture, for example, the angle with respect to the axial direction AX (Fig. 2 (A)) or Fig. 7 (A) of the surface SF is changed.
控制部90V係控制驅動部70、加壓部63及姿勢調整部61V者，且包含滑動控制部92V。滑動控制部92V係以於玻璃基板4之表面SF上刀尖51向著刀尖51之前部所朝的方向滑動之方式控制驅動部70。又，滑動控制部92V係以將於玻璃基板4上滑動之刀尖51的前部之複數個位置設為與玻璃基板4之表面SF相同高度之位置之方式控制姿勢調整部61V。換言之，滑動控制部92V係藉由控制姿勢調整部61V，使正在玻璃基板4上滑動之刀尖51之前部之、與玻璃基板4之表面SF相同高度之位置變化。基於該目的，滑動控制部92V使刀尖51之姿勢變化。例如，較好為使刀尖51之角度變化1~5°。當刀尖51之姿勢變化時，刀尖 51咬入表面SF中之程度變化，藉此，刀尖51的前部之與玻璃基板4之表面SF相同高度之位置變化。 The control unit 90V controls the drive unit 70, the pressurizing unit 63, and the posture adjusting unit 61V, and includes a slide control unit 92V. The slide control unit 92V controls the drive unit 70 such that the blade edge 51 slides in the direction in which the blade tip 51 faces in the front surface SF of the glass substrate 4. In addition, the slide control unit 92V controls the posture adjustment unit 61V so that the plurality of positions of the front portion of the blade edge 51 that slides on the glass substrate 4 are at the same height as the surface SF of the glass substrate 4. In other words, the slide control unit 92V changes the position of the front portion of the blade edge 51 that slides on the glass substrate 4 at the same height as the surface SF of the glass substrate 4 by the posture adjustment unit 61V. Based on this purpose, the slide control unit 92V changes the posture of the blade edge 51. For example, it is preferable to change the angle of the blade edge 51 by 1 to 5 degrees. When the posture of the cutting edge 51 changes, the cutting edge The degree of biting into the surface SF changes, whereby the position of the front portion of the blade tip 51 at the same height as the surface SF of the glass substrate 4 changes.
圖10係概略性顯示作為本實施形態之劃線頭60V(圖9)變化例之劃線頭60W之構成之圖。劃線頭60W具有：主體部110、切割器具50、加壓部63W、及本體部64W。切割器具50係安裝於主體部110。藉由來自主體部110之作用，將切割器具50以載荷F按壓於玻璃基板4之表面SF。主體部110包含主體本體111及切割器具支持構件112。切割器具支持構件112係可調整切割器具50之刀柄52之軸方向AX(圖2)地支持刀柄52。本體部64W具有基台本體151及限制器152。基台本體151具有可旋轉地支持主體部110之支點ST。限制器152限制主體部110可朝向下方旋轉之範圍。加壓部63W被支持於本體部64W。加壓部63W係以將切割器具50按壓於玻璃基板4之表面SF上之方式對主體部110施加連續性之力LD者。加壓部63W具有用以產生力LD之氣壓缸、與用以傳遞力之按壓銷。 Fig. 10 is a view schematically showing the configuration of a scribing head 60W as a modification of the scribing head 60V (Fig. 9) of the present embodiment. The scribing head 60W has a main body portion 110, a cutting tool 50, a pressurizing portion 63W, and a main body portion 64W. The cutting instrument 50 is attached to the main body portion 110. The cutting tool 50 is pressed against the surface SF of the glass substrate 4 by the load F by the action from the main body portion 110. The main body portion 110 includes a main body body 111 and a cutter support member 112. The cutter support member 112 supports the shank 52 by adjusting the axial direction AX (Fig. 2) of the shank 52 of the cutting tool 50. The body portion 64W has a base body 151 and a limiter 152. The base body 151 has a fulcrum ST that rotatably supports the main body portion 110. The limiter 152 limits the range in which the main body portion 110 can be rotated downward. The pressurizing portion 63W is supported by the body portion 64W. The pressurizing portion 63W applies a continuous force LD to the main body portion 110 such that the cutting tool 50 is pressed against the surface SF of the glass substrate 4. The pressurizing portion 63W has a pneumatic cylinder for generating a force LD and a pressing pin for transmitting a force.
根據本變化例之劃線頭60W，藉由加壓部63W使力LD變化，施加於刀尖51(圖2)之載荷F變化，同時亦可藉由主體部110繞支點ST之旋轉而使刀尖51之姿勢變化。因此，即使於劃線中亦可容易地變更刀尖51之姿勢。又，與具有於劃線中用於調整姿勢之專用機構之情形相比，劃線頭60W具有更簡化之構成。因此，劃線頭60W可容易地輕量化，故亦可應用於低載荷之劃線。 According to the scribing head 60W of the present modification, the force LD is changed by the pressing portion 63W, the load F applied to the cutting edge 51 (Fig. 2) is changed, and the main body portion 110 is rotated around the fulcrum ST. The posture of the blade tip 51 changes. Therefore, the posture of the blade edge 51 can be easily changed even in the scribing. Further, the scribing head 60W has a more simplified configuration than the case of the dedicated mechanism for adjusting the posture in the scribing. Therefore, the scribing head 60W can be easily lightened, and thus can be applied to a low load scribing.
另，關於上述以外之構成，與上述之實施形態1或2之構成大致相同，故對相同或對應之要素標註相同之符號，不重複其說明。 Incidentally, the configuration of the first embodiment or the second embodiment is substantially the same as the above-described configuration, and the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.
於實施形態4以後之脆性基板之分斷方法中，使用實施形態1~3中任一者所說明之方法形成無裂縫狀態之溝槽線TL(圖3(A))，且形成沿著溝槽線TL之裂縫線CL(圖3(B))。另，如上述般，為了形成溝槽線 TL而於刀尖51滑動時，將刀尖51的前部之複數個位置設為與玻璃基板4之表面SF相同高度之位置。 In the breaking method of the brittle substrate after the fourth embodiment, the groove line TL (Fig. 3(A)) in the crack-free state is formed by the method described in any one of the first to third embodiments, and is formed along the groove. The crack line CL of the groove line TL (Fig. 3(B)). In addition, as described above, in order to form a groove line When the TL slides on the blade edge 51, the plurality of positions of the front portion of the blade edge 51 are set to the same height as the surface SF of the glass substrate 4.
參照圖11(A)，首先準備玻璃基板4。作為表面SF(圖2(A))，玻璃基板4具有平坦之上表面SF1。包圍上表面SF1之邊緣包含互相對向之邊ED1及邊ED2。於圖11(A)所示之例中，邊緣係長方形狀。因此邊ED1及邊ED2係互相平行之邊。又，於圖11(A)所示之例中，邊ED1及邊ED2係長方形之短邊。又，玻璃基板4具有垂直於上表面SF1之厚度方向DT(圖2(A))。 Referring to Fig. 11(A), first, the glass substrate 4 is prepared. As the surface SF (Fig. 2(A)), the glass substrate 4 has a flat upper surface SF1. The edge surrounding the upper surface SF1 includes the opposite sides ED1 and ED2. In the example shown in Fig. 11(A), the edges are rectangular. Therefore, the side ED1 and the side ED2 are parallel to each other. Further, in the example shown in Fig. 11(A), the side ED1 and the side ED2 are short sides of a rectangle. Further, the glass substrate 4 has a thickness direction DT perpendicular to the upper surface SF1 (Fig. 2(A)).
接著，於上表面SF1將刀尖51按壓於位置N1。位置N1之詳情係後述。刀尖51之按壓係參照圖2(A)，以於玻璃基板4之上表面SF1上將刀尖51之突起部PP配置於邊ED1及側部PS之間，且將刀尖51之側部PS配置於突起部PP與邊ED2之間之方式進行。 Next, the blade edge 51 is pressed against the position N1 on the upper surface SF1. The details of the position N1 will be described later. Referring to FIG. 2(A), the protrusion PP of the blade edge 51 is disposed between the side ED1 and the side portion PS on the upper surface SF1 of the glass substrate 4, and the side of the blade edge 51 is placed. The PS is disposed between the protrusion portion PP and the side ED2.
接著，於上表面SF1上形成溝槽線TLa~TLe(亦通稱為溝槽線TL)。此時，如實施形態1中說明般，於刀尖51滑動時可對刀尖51賦予載荷或姿勢之變化。具體而言，可與圖5(A)之直線SLXm同樣地於溝槽線TLa~TLe各者上使刀尖51之載荷或姿勢變化。或，亦可與圖5(B)之直線SLXw及SLXs相同，於溝槽線TLa~TLe中不同之溝槽線之間使刀尖51之載荷或姿勢變化。例如，可以相對較大之載荷形成溝槽線TLa、TLc及TLe，以相對較小之載荷形成溝槽線TLb及TLd。 Next, trench lines TLa to TLe (also referred to as trench lines TL) are formed on the upper surface SF1. At this time, as described in the first embodiment, when the blade edge 51 slides, the blade tip 51 can be changed in load or posture. Specifically, the load or posture of the blade edge 51 can be changed on each of the groove lines TLa to TLe in the same manner as the straight line SLXm of FIG. 5(A). Alternatively, similarly to the straight lines SLXw and SLXs of FIG. 5(B), the load or posture of the blade edge 51 may be changed between the groove lines of the groove lines TLa to TLe. For example, the trench lines TLa, TLc, and TLe may be formed with a relatively large load to form the trench lines TLb and TLd with a relatively small load.
溝槽線TL之形成係於位置N1(第1位置)及位置N3之間進行。位置N2(第2位置)位於位置N1及N3之間。因此，於位置N1及N2之間、及於位置N2及N3之間形成溝槽線TL。位置N1及N3係與玻璃基板4之上表面SF1之邊緣隔開。因此，形成之溝槽線TL係可如圖11(A)所示般位於與玻璃基板4之邊緣隔開之位置，或，亦可其中一者或兩者位於上表面SF1之邊緣。所要形成之溝槽線TL於前者之情形時與玻璃基板4之邊緣隔開，於後者之情形時與玻璃基板4之邊緣相接。 The formation of the groove line TL is performed between the position N1 (first position) and the position N3. The position N2 (the second position) is located between the positions N1 and N3. Therefore, the groove line TL is formed between the positions N1 and N2 and between the positions N2 and N3. The positions N1 and N3 are spaced apart from the edge of the upper surface SF1 of the glass substrate 4. Therefore, the groove line TL formed may be located at a position spaced apart from the edge of the glass substrate 4 as shown in FIG. 11(A), or one or both of them may be located at the edge of the upper surface SF1. The groove line TL to be formed is spaced apart from the edge of the glass substrate 4 in the former case, and is in contact with the edge of the glass substrate 4 in the latter case.
位置N1及N2中，位置N1較接近邊ED1；又，位置N1及N2中，位置N2較接近邊ED2。另，於圖11(A)所示之例中，位置N1於邊ED1及ED2中較接近邊ED1，位置N2於邊ED1及ED2中較接近邊ED2，但亦可為位置N1及N2兩者均位於接近邊ED1或ED2中任一者之位置。 In the positions N1 and N2, the position N1 is closer to the side ED1; and in the positions N1 and N2, the position N2 is closer to the side ED2. Further, in the example shown in FIG. 11(A), the position N1 is closer to the side ED1 in the sides ED1 and ED2, and the position N2 is closer to the side ED2 in the sides ED1 and ED2, but may be the positions N1 and N2. They are all located close to either of the sides ED1 or ED2.
於形成溝槽線TL時，於本實施形態中，使刀尖51自位置N1向位置N2變位，進而自位置N2向位置N3變位。即，參照圖2(A)，使刀尖51於自邊ED1朝向邊ED2之方向、即方向DA變位。方向DA對應於將自刀尖51延伸之軸AX投影於上表面SF1上之方向。於該情形時，藉由刀柄52於上表面SF1上拖曳刀尖51。 In the case where the groove line TL is formed, in the present embodiment, the blade edge 51 is displaced from the position N1 to the position N2, and is displaced from the position N2 to the position N3. That is, referring to FIG. 2(A), the blade edge 51 is displaced from the side ED1 toward the side ED2, that is, the direction DA. The direction DA corresponds to a direction in which the axis AX extending from the blade edge 51 is projected on the upper surface SF1. In this case, the blade tip 51 is dragged on the upper surface SF1 by the shank 52.
參照圖11(B)，於形成溝槽線TL後，藉由使玻璃基板4之裂縫沿著溝槽線TL自位置N2向位置N1(圖中，參照虛線箭頭)於厚度方向DT上伸展，而形成裂縫線CL(圖3(B))。裂縫線CL之形成係藉由輔助線AL及溝槽線TL於位置N2交叉而開始。基於該目的，於形成溝槽線TL後形成輔助線AL。輔助線AL係伴隨著厚度方向DT上之裂縫之一般劃線，且係釋放溝槽線TL附近之內部應力之應變者。輔助線AL之形成方法無特別限定，但可如圖11(B)所示，將上表面SF1之邊緣作為基點而形成。 Referring to FIG. 11(B), after the groove line TL is formed, the crack of the glass substrate 4 is stretched in the thickness direction DT from the position N2 to the position N1 (in the figure, with reference to the dotted arrow) along the groove line TL. The crack line CL is formed (Fig. 3(B)). The formation of the crack line CL is started by the intersection of the auxiliary line AL and the groove line TL at the position N2. For this purpose, the auxiliary line AL is formed after the groove line TL is formed. The auxiliary line AL is accompanied by a general scribe line of the crack in the thickness direction DT, and is a strainer that releases the internal stress near the groove line TL. The method of forming the auxiliary line AL is not particularly limited, but as shown in FIG. 11(B), the edge of the upper surface SF1 may be formed as a base point.
另，與自位置N2向位置N1之方向相比，自位置N2向位置N3之方向較難以形成裂縫線CL。即，裂縫線CL之伸展容易度存在方向依存性。因此，可能產生於位置N1及N2之間形成裂縫線CL，但未於位置N2及N3之間形成之現象。本實施形態係以沿著位置N1及N2間分斷玻璃基板4為目的，而非以沿著位置N2及N3間分斷玻璃基板4為目的。因此，必須於位置N1及位置N2間形成裂縫線CL，另一方面，於位置N2及位置N3間裂縫線CL之形成難度則不成問題。 Further, it is more difficult to form the crack line CL from the position N2 to the position N3 than in the direction from the position N2 to the position N1. That is, the ease of stretching of the crack line CL has a direction dependency. Therefore, a crack line CL may be formed between the positions N1 and N2, but it is not formed between the positions N2 and N3. In the present embodiment, the glass substrate 4 is separated between the positions N1 and N2, and the glass substrate 4 is not separated along the positions N2 and N3. Therefore, it is necessary to form the crack line CL between the position N1 and the position N2. On the other hand, the difficulty in forming the crack line CL between the position N2 and the position N3 is not a problem.
接著，沿著裂縫線CL分斷玻璃基板4。具體而言進行斷裂工序。另，若裂縫線CL於其形成時於厚度方向DT完全行進之情形時，可同 時產生裂縫線CL之形成與玻璃基板4之分斷。於該情形時，可省略斷裂工序。 Next, the glass substrate 4 is separated along the crack line CL. Specifically, the breaking process is performed. In addition, if the crack line CL is completely advanced in the thickness direction DT when it is formed, the same can be said. The formation of the crack line CL and the breaking of the glass substrate 4 occur. In this case, the breaking process can be omitted.
藉由以上進行玻璃基板4之分斷。 The division of the glass substrate 4 is performed by the above.
接著，就上述分斷方法之第1~第3變化例，於以下進行說明。 Next, the first to third modifications of the above-described breaking method will be described below.
參照圖12(A)，第1變化例係關於以輔助線AL與溝槽線TL之交叉，作為裂縫線CL(圖11(B))開始形成之契機不夠充分之情形者。參照圖12(B)，藉由對玻璃基板4施加產生彎曲力矩等之外力，使得裂縫沿著輔助線AL於厚度方向DT伸展，結果分離玻璃基板4。藉此開始裂縫線CL之形成。另，於圖12(A)中，輔助線AL形成於玻璃基板4之上表面SF1上，但用以分離玻璃基板4之輔助線AL亦可形成於玻璃基板4之下表面(於上表面SF1相反之表面)上。於該情形時，輔助線AL與溝槽線TL係於俯視佈局上，於位置N2互相交叉，但互相未直接接觸。 Referring to Fig. 12(A), the first variation relates to the case where the intersection of the auxiliary line AL and the groove line TL is insufficient, and the triggering of the crack line CL (Fig. 11(B)) is insufficient. Referring to Fig. 12(B), by applying an external force such as a bending moment to the glass substrate 4, the crack is stretched in the thickness direction DT along the auxiliary line AL, and as a result, the glass substrate 4 is separated. Thereby, the formation of the crack line CL is started. In addition, in FIG. 12(A), the auxiliary line AL is formed on the upper surface SF1 of the glass substrate 4, but the auxiliary line AL for separating the glass substrate 4 may be formed on the lower surface of the glass substrate 4 (on the upper surface SF1). On the opposite surface). In this case, the auxiliary line AL and the groove line TL are arranged in a plan view and intersect each other at the position N2, but are not in direct contact with each other.
參照圖13，於第2變化例中，於玻璃基板4之上表面SF1將刀尖51按壓於位置N3。於形成溝槽線TL時，於本變化例中，使刀尖51自位置N3向位置N2變位，進而自位置N2向位置N1變位。即，參照圖7，使刀尖51自邊ED2朝向邊ED1之方向、即朝向方向DB變位。方向DB對應於與將自刀尖51延伸之軸AX投影於上表面SF1上之方向相反的方向。於該情形時，藉由刀柄52於上表面SF1上推進刀尖51。 Referring to Fig. 13, in the second modification, the blade edge 51 is pressed against the position N3 on the upper surface SF1 of the glass substrate 4. In the case of forming the groove line TL, in the present modification, the blade edge 51 is displaced from the position N3 to the position N2, and further displaced from the position N2 to the position N1. That is, referring to Fig. 7, the blade edge 51 is displaced from the side ED2 toward the side ED1, that is, toward the direction DB. The direction DB corresponds to a direction opposite to a direction in which the axis AX extending from the blade edge 51 is projected on the upper surface SF1. In this case, the cutting edge 51 is advanced on the upper surface SF1 by the shank 52.
參照圖14，於第3變化例中，於形成包含於複數個溝槽線TL之各溝槽線TLm時，與玻璃基板4之上表面SF1之位置N1相比，於位置N2以更大之載荷按壓刀尖51。具體而言，將位置N4作為位置N1及N2之間之位置，且於溝槽線TLm形成到達位置N4之時點，提高刀尖51之載荷。換言之，與位置N1相比，於溝槽線TLm之終端部即位置N4及N3之間提高溝槽線TLm之載荷。藉此，減輕終端部以外之載荷，可更容易引起裂縫線CL自位置N2起形成。 Referring to Fig. 14, in the third modification, when each of the trench lines TLm included in the plurality of trench lines TL is formed, it is larger at the position N2 than the position N1 of the upper surface SF1 of the glass substrate 4. The load presses the blade tip 51. Specifically, the position N4 is set as the position between the positions N1 and N2, and when the groove line TLm is formed to reach the position N4, the load of the blade edge 51 is increased. In other words, the load of the groove line TLm is increased between the positions N4 and N3 which are the end portions of the groove line TLm as compared with the position N1. Thereby, the load other than the end portion can be alleviated, and the crack line CL can be more easily formed from the position N2.
根據本實施形態，可自溝槽線TL更確實地形成裂縫線CL。又， 與實施形態1~3相同，藉由分散刀尖51特別磨損之位置，可延長刀尖51之壽命。 According to the present embodiment, the crack line CL can be formed more reliably from the groove line TL. also, As in the first to third embodiments, the life of the blade tip 51 can be extended by dispersing the position where the blade tip 51 is particularly worn.
對本實施形態之脆性基板之分斷方法，以下使用圖15~圖17進行說明。 The method of dividing the brittle substrate of the present embodiment will be described below with reference to Figs. 15 to 17 .
參照圖15，於本實施形態中，於形成溝槽線TL之前形成輔助線AL。輔助線AL之形成方法本身與圖11(B)(實施形態4)相同。 Referring to Fig. 15, in the present embodiment, the auxiliary line AL is formed before the groove line TL is formed. The method of forming the auxiliary line AL itself is the same as that of Fig. 11 (B) (Embodiment 4).
參照圖16，接著，將刀尖51按壓於上表面SF1，接著，形成溝槽線TL。溝槽線TL之形成方法本身與圖11(A)(實施形態4)相同。輔助線AL及溝槽線TL係於位置N2互相交叉。 Referring to Fig. 16, next, the blade edge 51 is pressed against the upper surface SF1, and then, the groove line TL is formed. The method of forming the trench line TL itself is the same as that of FIG. 11(A) (Embodiment 4). The auxiliary line AL and the groove line TL cross each other at the position N2.
參照圖17，接著，藉由對玻璃基板4施加產生彎曲力矩等之外力之一般斷裂工序，沿著輔助線AL分離玻璃基板4。藉此，開始與實施形態4相同之裂縫線CL之形成(圖中，參照虛線箭頭)。另，於圖15中輔助線AL形成於玻璃基板4之上表面SF1上，但用以分離玻璃基板4之輔助線AL亦可形成於玻璃基板4之下表面上。於該情形時，輔助線AL及溝槽線TL係於俯視佈局上，於位置N2互相交叉，但互相不直接接觸。 Referring to Fig. 17, next, a glass substrate 4 is separated along the auxiliary line AL by applying a general breaking process for generating a force such as a bending moment to the glass substrate 4. Thereby, the formation of the crack line CL which is the same as that of the fourth embodiment (see the dotted arrow in the drawing) is started. Further, in FIG. 15, the auxiliary line AL is formed on the upper surface SF1 of the glass substrate 4, but the auxiliary line AL for separating the glass substrate 4 may be formed on the lower surface of the glass substrate 4. In this case, the auxiliary line AL and the groove line TL are arranged in a plan view and intersect each other at the position N2, but are not in direct contact with each other.
另，關於上述以外之構成，與上述實施形態4之構成幾乎相同。 The configuration other than the above is almost the same as the configuration of the above-described fourth embodiment.
參照圖18，於第1變化例中，藉由輔助線AL及劃線SL於位置N2互相交叉而開始裂縫線CL之形成。 Referring to Fig. 18, in the first modification, the formation of the crack line CL is started by the auxiliary line AL and the scribe line SL intersecting each other at the position N2.
參照圖19(A)，於第2變化例中，與圖13(實施形態4)相同，自位置N3向位置N1進行各溝槽線TL之形成。參照圖19(B)，藉由對玻璃基板4施加產生彎曲力矩等之外力，沿著輔助線AL分離玻璃基板4。藉此開始裂縫線CL之形成(圖中，參照虛線箭頭)。 Referring to Fig. 19(A), in the second modification, as in Fig. 13 (Embodiment 4), the groove lines TL are formed from the position N3 to the position N1. Referring to Fig. 19(B), the glass substrate 4 is separated along the auxiliary line AL by applying an external force such as a bending moment to the glass substrate 4. Thereby, the formation of the crack line CL is started (in the drawing, the dotted arrow is referred to).
參照圖20，於第3變化例中，於形成包含於複數個溝槽線TL之各溝槽線TLm時，與玻璃基板4之上表面SF1之位置N1相比，於位置N2 以更大之力按壓刀尖51。具體而言，將位置N4作為位置N1及N2間之位置，於溝槽線TLm形成到達位置N4之時點，提高刀尖51之載荷。 換言之，與位置N1相比，於溝槽線TL之終端部即位置N4及N3之間提高溝槽線TLm之載荷。藉此，減輕終端部以外之載荷，可更容易引起裂縫線CL自位置N2起形成。 Referring to Fig. 20, in the third modification, when each of the trench lines TLm included in the plurality of trench lines TL is formed, the position N2 is at a position N2 as compared with the position N1 of the upper surface SF1 of the glass substrate 4. Press the tip 51 with a greater force. Specifically, the position N4 is set as the position between the positions N1 and N2, and when the groove line TLm is formed to reach the position N4, the load of the blade edge 51 is increased. In other words, the load of the groove line TLm is increased between the positions N4 and N3 which are the end portions of the groove line TL as compared with the position N1. Thereby, the load other than the end portion can be alleviated, and the crack line CL can be more easily formed from the position N2.
參照圖21，於本實施形態之各溝槽線TL之形成中，使刀尖51自位置N1越過邊ED2滑動。於刀尖51通過邊ED2時，溝槽線TL正下方之基板內部產生之應力之應變被釋放，且裂縫線自位於邊ED2上之溝槽線TL之邊端向位置N1伸展。 Referring to Fig. 21, in the formation of each groove line TL of the present embodiment, the blade edge 51 is slid over the edge ED2 from the position N1. When the cutting edge 51 passes the side ED2, the strain of the stress generated inside the substrate directly below the groove line TL is released, and the crack line extends from the edge end of the groove line TL on the side ED2 toward the position N1.
於形成溝槽線TL時施加於刀尖51之載荷可為一定，但亦可於使刀尖51自位置N1向位置N2變位時，於位置N2增大施加於刀尖51之載荷。例如載荷增大50%左右。使施加有增大之載荷之刀尖51越過邊ED2滑動。換言之，於溝槽線TL之終端部增大刀尖51之載荷。當刀尖51到達邊ED2時，裂縫線自位於邊ED2上之溝槽線TL之邊端經由位置N2向位置N1伸展。於如此進行載荷增大之情形時，由於應力之應變亦增大，且於刀尖51通過邊ED2時更容易釋放該應力之應變，故可更確實地形成裂縫線。 The load applied to the cutting edge 51 at the time of forming the groove line TL may be constant, but the load applied to the cutting edge 51 may be increased at the position N2 when the cutting edge 51 is displaced from the position N1 to the position N2. For example, the load is increased by about 50%. The blade tip 51 to which the increased load is applied is slid over the edge ED2. In other words, the load of the cutting edge 51 is increased at the end portion of the groove line TL. When the cutting edge 51 reaches the side ED2, the crack line extends from the side end of the groove line TL on the side ED2 to the position N1 via the position N2. When the load is increased in this manner, the strain of the stress is also increased, and the strain of the stress is more easily released when the blade edge 51 passes the side ED2, so that the crack line can be formed more surely.
另，關於上述以外之構成，與上述實施形態4之構成大致相同。 The configuration other than the above is substantially the same as the configuration of the above-described fourth embodiment.
參照圖22(A)，於本實施形態之脆性基板之分斷方法中，形成自位置N1經由位置N2到達邊ED2之溝槽線TL。 Referring to Fig. 22(A), in the breaking method of the brittle substrate of the present embodiment, the groove line TL which reaches the side ED2 from the position N1 via the position N2 is formed.
參照圖22(B)，接著於位置N2與邊ED2之間，施加釋放溝槽線TL附近之內部應力的應變之應力。藉此，引起裂縫線沿著溝槽線TL之形成。作為應力之施加，具體而言，於上表面SF1上於位置N2與邊ED2之間(圖中，虛線及邊ED2之間之區域)，使被按壓之刀尖51滑 動。該滑動進行至到達邊ED2為止。刀尖51較好為以交叉於最初形成之溝槽線TL之軌道之方式滑動，更佳為以與最初形成之溝槽線TL之軌道重疊之方式滑動。該再次滑動之長度例如0.5mm左右。又，該再次滑動係可於形成複數條溝槽線TL(圖22(A))後對各條溝槽線TL進行，或，亦可對每條溝槽線TL依序進行1條溝槽線TL之形成及再次滑動之工序。 Referring to Fig. 22(B), a strain stress which releases the internal stress near the groove line TL is applied between the position N2 and the side ED2. Thereby, the formation of the crack line along the groove line TL is caused. As the application of the stress, specifically, on the upper surface SF1 between the position N2 and the side ED2 (the area between the broken line and the side ED2 in the figure), the pressed blade tip 51 is slid move. This sliding proceeds until the edge ED2 is reached. The blade edge 51 preferably slides in such a manner as to intersect the track of the groove line TL originally formed, and more preferably slides in a manner overlapping the track of the groove line TL initially formed. The length of the re-sliding is, for example, about 0.5 mm. Moreover, the re-sliding system may be performed on each of the trench lines TL after forming a plurality of trench lines TL (FIG. 22(A)), or one trench may be sequentially performed for each of the trench lines TL. The process of forming and re-sliding the line TL.
作為變化例，為了於位置N2與邊ED2之間施加應力，可代替上述刀尖51之再次滑動，而於上表面SF1上之位置N2與邊ED2之間照射雷射光。亦可藉由因此產生之熱應力，釋放溝槽線TL附近之內部應力的應變，而可藉此引起裂縫線開始形成。 As a modification, in order to apply a stress between the position N2 and the side ED2, instead of the above-described blade 51 being slid again, the laser beam may be irradiated between the position N2 on the upper surface SF1 and the side ED2. It is also possible to release the strain of the internal stress near the groove line TL by the thermal stress thus generated, thereby causing the crack line to start to be formed.
另，關於上述以外之構成，與上述實施形態4之構成大致相同。 The configuration other than the above is substantially the same as the configuration of the above-described fourth embodiment.
參照圖23(A)，於本實施形態之脆性基板之分斷方法中，藉由使刀尖51自位置N1向位置N2、接著進而向位置N3變位，形成與上表面SF1之邊緣隔開之溝槽線TL。溝槽線TL之形成方法本身與圖11(A)(實施形態4)大致相同。 Referring to Fig. 23(A), in the breaking method of the brittle substrate according to the present embodiment, the edge 51 is separated from the edge of the upper surface SF1 by shifting the blade edge 51 from the position N1 to the position N2 and then to the position N3. The groove line TL. The method of forming the trench line TL itself is substantially the same as that of FIG. 11(A) (Embodiment 4).
參照圖23(B)，進行與圖22(B)(實施形態7或其變化例)相同之應力施加。藉此引起裂縫線沿著溝槽線TL形成。 Referring to Fig. 23(B), the same stress application as in Fig. 22(B) (Embodiment 7 or a modification thereof) is performed. Thereby, the crack line is formed along the groove line TL.
另，關於上述以外之構成係與上述實施形態4之構成大致相同。 The configuration other than the above is substantially the same as the configuration of the above-described fourth embodiment.
參照圖24，作為圖23(A)工序之變化例，於溝槽線TL之形成中，亦可使刀尖51自位置N3向位置N2、接著自位置N2向位置N1變位。 Referring to Fig. 24, as a variation of the step of Fig. 23(A), in the formation of the groove line TL, the blade edge 51 may be displaced from the position N3 to the position N2 and then from the position N2 to the position N1.
參照圖25(A)及(B)，於上述各實施形態中，亦可代替刀尖51(圖2(A)及(B))而使用刀尖51v。刀尖51v具有包含頂點與圓錐面SC之圓錐形狀。刀尖51v之突起部PPv係以頂點構成。刀尖之側部PSv係沿著自頂點延伸至圓錐面SC上之虛擬線(圖25(B)之虛線)構成。藉此，側部 PSv具有線狀延伸之凸形狀。 Referring to Figs. 25(A) and (B), in each of the above embodiments, the blade edge 51v may be used instead of the blade edge 51 (Figs. 2(A) and (B)). The blade tip 51v has a conical shape including a vertex and a conical surface SC. The protrusion PPv of the blade edge 51v is constituted by a vertex. The side portion PSv of the blade tip is formed along a imaginary line extending from the apex to the conical surface SC (dashed line in Fig. 25(B)). With this side The PSv has a convex shape that extends linearly.
於本實施形態中，於滑動中刀尖51v之側部PSv為前部，於玻璃基板4之表面SF上，被按壓之刀尖51v向著側部PS所朝的方向DA滑動。方向DA係對應於將自刀尖51v延伸之軸方向AX投影於表面SF上之方向。滑動中，藉由刀柄52於表面SF上拖曳刀尖51v。 In the present embodiment, the side portion PSv of the blade edge 51v is the front portion during sliding, and the pressed blade edge 51v slides in the direction DA toward the side portion PS on the surface SF of the glass substrate 4. The direction DA corresponds to a direction in which the axial direction AX extending from the blade edge 51v is projected on the surface SF. During the sliding, the blade tip 51v is dragged on the surface SF by the shank 52.
根據本實施形態，藉由於1個玻璃基板4上使刀尖51v滑動時使刀尖51v之載荷或姿勢變化，而將作為刀尖51v的前部之側部PSv上之位置O1及O2(圖26)設為與玻璃基板4之表面SF相同高度之位置。藉此，與於1個玻璃基板4上使刀尖51v滑動時僅將刀尖51v的前部上之一個位置設為與玻璃基板4之表面SF相同高度之位置之情形相比，刀尖51v特別會磨損之位置分散。因此可延長刀尖51v之壽命。 According to the present embodiment, when the blade edge 51v is slid on one glass substrate 4, the load or posture of the blade edge 51v is changed, and the positions O1 and O2 on the side portion PSv of the front portion of the blade edge 51v are shown. 26) A position at the same height as the surface SF of the glass substrate 4. Therefore, the blade edge 51v is compared with the case where only one position on the front portion of the blade edge 51v is set to the same height as the surface SF of the glass substrate 4 when the blade edge 51v is slid on one glass substrate 4. Especially the location of wear and tear is scattered. Therefore, the life of the blade tip 51v can be extended.
參照圖27，作為變化例，可使刀尖51v於與方向DA相反之方向DB滑動。藉由於1個玻璃基板4上使刀尖51v滑動時使刀尖51v之載荷或姿勢變化，將刀尖51v的前部(與側部PSv相反之部分)之位置O1及O2(圖28)設為與玻璃基板4之表面SF相同高度之位置。藉此，與於1個玻璃基板4上使刀尖51v滑動時僅將刀尖51v的前部之一個位置設為與玻璃基板4之表面SF相同高度之位置之情形相比，以更大之面積與玻璃基板4之表面SF接觸，而分散刀尖51v特別會磨損之位置。因此可延長刀尖51v之壽命。 Referring to Fig. 27, as a modification, the blade edge 51v can be slid in the direction DB opposite to the direction DA. By changing the load or posture of the blade edge 51v when the blade edge 51v is slid on one glass substrate 4, the positions O1 and O2 (FIG. 28) of the front portion (the portion opposite to the side portion PSv) of the blade edge 51v are set. It is a position of the same height as the surface SF of the glass substrate 4. Therefore, when the blade edge 51v is slid on one glass substrate 4, only one position of the front portion of the blade edge 51v is set to the same height as the surface SF of the glass substrate 4, and is larger. The area is in contact with the surface SF of the glass substrate 4, and the dispersed blade tip 51v is particularly worn. Therefore, the life of the blade tip 51v can be extended.
於上述各實施形態中，玻璃基板的邊緣之第1及第2邊為長方形之短邊，但第1及第2邊亦可為長方形之長邊。又，邊緣之形狀並非限定於長方形者，例如亦可為正方形。又，第1及第2邊並非限定於直線狀者，亦可為曲線狀。又，於上述各實施形態中，玻璃基板之面為平坦面，但玻璃基板之面亦可彎曲。 In each of the above embodiments, the first and second sides of the edge of the glass substrate are short sides of a rectangle, but the first and second sides may be long sides of a rectangle. Further, the shape of the edge is not limited to a rectangle, and may be, for example, a square. Further, the first and second sides are not limited to a straight line, and may be curved. Further, in each of the above embodiments, the surface of the glass substrate is a flat surface, but the surface of the glass substrate may be curved.
作為特別適合上述之分斷方法之脆性基板雖使用玻璃基板，但脆性基板並非限定於玻璃基板者。脆性基板亦可由玻璃以外製作，例 如陶瓷、矽、化合物半導體、藍寶石、或石英。 A glass substrate is used as the brittle substrate which is particularly suitable for the above-described breaking method, but the brittle substrate is not limited to the glass substrate. The brittle substrate can also be made of glass, for example Such as ceramics, germanium, compound semiconductors, sapphire, or quartz.
劃線裝置之控制部係可藉由包含輸入部、輸出部、記憶部及CPU(Central Processing Uint：中央處理單元)之電腦構成。於該情形時，程式使CPU執行控制部之處理。程式可記錄於記錄媒體。記錄媒體係例如記錄磁碟、固體記憶體記錄磁帶。 The control unit of the scribing device can be constituted by a computer including an input unit, an output unit, a memory unit, and a CPU (Central Processing Unit). In this case, the program causes the CPU to execute the processing of the control unit. The program can be recorded on the recording medium. Recording media are, for example, recording disks, solid memory recording tapes.
本發明係於其發明範圍內，可自由地組合各實施形態，且可適當變化、省略各實施形態。 The present invention is within the scope of the invention, and the respective embodiments can be freely combined, and the respective embodiments can be appropriately changed and omitted.
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| KR (1) | KR101895819B1 (en) |
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| DE102018131179A1 (en) | 2018-12-06 | 2020-06-10 | Schott Ag | Glass element with cut edge and process for its production |
| JP2023123189A (en) * | 2022-02-24 | 2023-09-05 | 株式会社デンソー | Manufacturing method of semiconductor device |
| CN116238058B (en) * | 2023-05-12 | 2023-07-11 | 山东理工大学 | Efficient low-loss processing method for brittle material |
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| JP2013071871A (en) | 2011-09-28 | 2013-04-22 | Mitsuboshi Diamond Industrial Co Ltd | Scribing device |
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- 2015-05-18 CN CN201580034054.2A patent/CN106470814B/en active Active
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| JP2003183040A (en) * | 2001-12-18 | 2003-07-03 | Oputo System:Kk | Point cutter, method of use and apparatus |
| CN101342639A (en) * | 2007-07-12 | 2009-01-14 | 詹诺普蒂克自动化技术有限公司 | Method and device for dividing a plane-parallel plate made of a brittle material into a plurality of individual plates by means of a laser |
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| JP6304375B2 (en) | 2018-04-04 |
| CN106470814A (en) | 2017-03-01 |
| CN106470814B (en) | 2019-02-12 |
| KR101895819B1 (en) | 2018-09-07 |
| TW201603981A (en) | 2016-02-01 |
| KR20170007478A (en) | 2017-01-18 |
| WO2015198748A1 (en) | 2015-12-30 |
| JPWO2015198748A1 (en) | 2017-04-20 |
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