TWI643828B - 刻劃裝置 - Google Patents

刻劃裝置 Download PDF

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Publication number
TWI643828B
TWI643828B TW104101935A TW104101935A TWI643828B TW I643828 B TWI643828 B TW I643828B TW 104101935 A TW104101935 A TW 104101935A TW 104101935 A TW104101935 A TW 104101935A TW I643828 B TWI643828 B TW I643828B
Authority
TW
Taiwan
Prior art keywords
substrate
gripper
cutter wheel
scoring
scribe line
Prior art date
Application number
TW104101935A
Other languages
English (en)
Chinese (zh)
Other versions
TW201600480A (zh
Inventor
得永直
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201600480A publication Critical patent/TW201600480A/zh
Application granted granted Critical
Publication of TWI643828B publication Critical patent/TWI643828B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
    • B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Clamps And Clips (AREA)
TW104101935A 2014-06-26 2015-01-21 刻劃裝置 TWI643828B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014131721A JP6357915B2 (ja) 2014-06-26 2014-06-26 スクライブ装置
JPJP2014-131721 2014-06-26

Publications (2)

Publication Number Publication Date
TW201600480A TW201600480A (zh) 2016-01-01
TWI643828B true TWI643828B (zh) 2018-12-11

Family

ID=55165440

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104101935A TWI643828B (zh) 2014-06-26 2015-01-21 刻劃裝置

Country Status (4)

Country Link
JP (1) JP6357915B2 (ja)
KR (1) KR102304765B1 (ja)
CN (1) CN105314836B (ja)
TW (1) TWI643828B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108495574B (zh) * 2016-01-25 2021-12-24 欧莱雅 用于双内容物的包装和分配装置
JP2018094664A (ja) * 2016-12-12 2018-06-21 三星ダイヤモンド工業株式会社 端材除去装置
KR102331075B1 (ko) * 2017-03-17 2021-11-25 주식회사 케이씨텍 기판 처리 장치
KR101970620B1 (ko) * 2017-03-20 2019-08-13 주식회사 케이씨텍 기판 처리 장치
KR101993140B1 (ko) * 2019-02-28 2019-06-26 제일유리 주식회사 유리 절곡장치
CN114406879B (zh) * 2022-01-14 2023-03-21 深圳特斯特半导体设备有限公司 适用于机群式分布的自动化划片机

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM469313U (zh) * 2013-02-04 2014-01-01 Shirai Tech Ltd 薄板面板之切斷裝置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3918792B2 (ja) * 2003-09-17 2007-05-23 松下電器産業株式会社 炊飯器
EP1741527A1 (en) * 2004-03-15 2007-01-10 Mitsuboshi Diamond Industrial Co., Ltd. Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method
JP5058451B2 (ja) * 2005-06-02 2012-10-24 コーニングジャパン株式会社 板材の分断ユニット、この分断ユニットを有する分断装置、および、この分断装置を有する分断設備
JP4915294B2 (ja) * 2007-06-15 2012-04-11 東芝三菱電機産業システム株式会社 集積型薄膜太陽電池の製造に用いられるガラス基板の分割方法
JP2010052995A (ja) * 2008-08-29 2010-03-11 Mitsuboshi Diamond Industrial Co Ltd マザー基板のスクライブ方法
KR101331067B1 (ko) 2012-06-01 2013-11-19 한국미쯔보시다이아몬드공업(주) 취성 재료 기판의 수직 공급 로더 컨베이어 장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM469313U (zh) * 2013-02-04 2014-01-01 Shirai Tech Ltd 薄板面板之切斷裝置

Also Published As

Publication number Publication date
KR20160001605A (ko) 2016-01-06
KR102304765B1 (ko) 2021-09-23
CN105314836B (zh) 2019-06-18
JP6357915B2 (ja) 2018-07-18
TW201600480A (zh) 2016-01-01
CN105314836A (zh) 2016-02-10
JP2016007844A (ja) 2016-01-18

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