TWI641797B - Heat dissipating device - Google Patents
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- TWI641797B TWI641797B TW106139032A TW106139032A TWI641797B TW I641797 B TWI641797 B TW I641797B TW 106139032 A TW106139032 A TW 106139032A TW 106139032 A TW106139032 A TW 106139032A TW I641797 B TWI641797 B TW I641797B
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Abstract
本發明提供一種散熱裝置，包括一熱管以及一均溫板。熱管具有一封閉端與一開口端以及一第一毛細結構。第一毛細結構自開口端向外延伸。均溫板具有一上殼體與一下殼體，上殼體與下殼體共同形成一容室，下殼體的內底面具有一第二毛細結構。第一毛細結構伸入容室並疊置於第二毛細結構上。 The invention provides a heat dissipation device, which includes a heat pipe and a temperature equalizing plate. The heat pipe has a closed end and an open end and a first capillary structure. The first capillary structure extends outward from the open end. The temperature equalizing plate has an upper shell and a lower shell, the upper shell and the lower shell together form a chamber, and the inner bottom mask of the lower shell has a second capillary structure. The first capillary structure extends into the chamber and overlaps the second capillary structure.
Description
本發明係關於一種散熱裝置，特別是一種結合熱管跟均溫板的散熱裝置。 The invention relates to a heat dissipation device, especially a heat dissipation device combining a heat pipe and a temperature equalizing plate.
複合式的散熱裝置常見由不同種類的散熱元件例如熱管以及均溫板結合在一起，期盼能兼具兩者的優點而發揮更好的散熱效能，舉例來說，TWM534370便揭露了一種熱管與均溫板結合在一起的設計。不過，由於熱管跟均溫板內部的毛細結構具有不同的特性，因此若是如TWM534370的設計，僅單純地將兩者的毛細結構連接在一起的話，很容易就會發生工作介質無法順利在兩者間流動或傳遞甚至於發生斷層的情況，因此，習知熱管跟均溫板的毛細結構連結設計，仍存在有很大的改善空間。 Compound heat dissipation devices are usually composed of different types of heat dissipation elements such as heat pipes and temperature equalization plates. It is expected to have the advantages of both and play a better heat dissipation performance. The design of the temperature equalizing plate combined together. However, since the capillary structure inside the heat pipe and the temperature equalizing plate have different characteristics, if the design is like TWM534370, if the capillary structure of the two is simply connected together, it will easily happen that the working medium cannot smoothly The flow or transmission between them even occurs when a fault occurs. Therefore, there is still a lot of room for improvement in the conventional heat pipe and capillary structure design of the temperature equalizing plate.
針對上述所提當熱管跟均溫板結合時，習知技術並未針對兩者的毛細結構要如何穩固地連接在一起，因而容易發生工作介質無法於毛細結構間順利傳遞的缺點，本發明提出一種讓熱管的毛細結構跟均溫板的毛細結構穩固結合在一起的方法與結構，同時也針對抽真空與注液過程中熱管容易發生凹陷或變形的問題，一併提出解決的方案。 In view of the above mentioned when the heat pipe is combined with the temperature equalizing plate, the conventional technology does not aim at how to firmly connect the capillary structures of the two, so that the working medium cannot be smoothly transferred between the capillary structures, the present invention proposes A method and structure for stably combining the capillary structure of the heat pipe with the capillary structure of the temperature equalizing plate, and also proposes a solution to the problem that the heat pipe is prone to sag or deformation during vacuuming and liquid injection.
為達上述目的，於一實施例中，本發明提供一種散熱裝置，散熱裝置包括一熱管以及一均溫板。熱管具有一封閉端與一開口端，熱管還包括一第一毛細結構，第一毛細結構自開口端向外延伸。均溫板具有一上殼體與一下殼體，上殼體與下殼體共同形成一容室，下殼體的內底面具有一第二毛細結構。第一毛細結構伸入容室並疊置於第二毛細結構上。 To achieve the above objective, in one embodiment, the present invention provides a heat dissipation device. The heat dissipation device includes a heat pipe and a temperature equalizing plate. The heat pipe has a closed end and an open end. The heat pipe further includes a first capillary structure that extends outward from the open end. The temperature equalizing plate has an upper shell and a lower shell, the upper shell and the lower shell together form a chamber, and the inner bottom mask of the lower shell has a second capillary structure. The first capillary structure extends into the chamber and overlaps the second capillary structure.
在本發明一實施例中，下殼體具有一開口，熱管之開口端***該開口內。 In an embodiment of the invention, the lower housing has an opening, and the open end of the heat pipe is inserted into the opening.
在本發明一實施例中，上殼體與下殼體共同形成一開口，熱管之開口端***該開口內。 In an embodiment of the invention, the upper housing and the lower housing jointly form an opening, and the open end of the heat pipe is inserted into the opening.
在本發明一實施例中，均溫板更包括一第三毛細結構，形成於第一毛細結構與第二毛細結構的交會處。 In an embodiment of the invention, the temperature equalizing plate further includes a third capillary structure formed at the intersection of the first capillary structure and the second capillary structure.
在本發明一實施例中，第三毛細結構係疊置於第一毛細結構該第二毛細結構上。 In an embodiment of the invention, the third capillary structure is stacked on the first capillary structure and the second capillary structure.
在本發明一實施例中，第一毛細結構係夾設於第二毛細結構與第三毛細結構之間。 In an embodiment of the invention, the first capillary structure is sandwiched between the second capillary structure and the third capillary structure.
在本發明一實施例中，第三毛細結構係由金屬粉末燒結而成。 In an embodiment of the invention, the third capillary structure is formed by sintering metal powder.
在本發明一實施例中，熱管具有一內頂面與一內底面，第一毛細結構與內頂面及內底面接觸而為一支撐結構。 In an embodiment of the invention, the heat pipe has an inner top surface and an inner bottom surface, and the first capillary structure is in contact with the inner top surface and the inner bottom surface to form a support structure.
在本發明一實施例中，第一毛細結構之厚度，等於內頂面至內底面之距離。 In an embodiment of the invention, the thickness of the first capillary structure is equal to the distance from the inner top surface to the inner bottom surface.
在本發明一實施例中，第一毛細結構之剖面面積，占熱管管內剖面面積的30%至70%。 In an embodiment of the invention, the cross-sectional area of the first capillary structure accounts for 30% to 70% of the cross-sectional area of the heat pipe.
在本發明一實施例中，第一毛細結構為金屬編織網。 In an embodiment of the invention, the first capillary structure is a metal braided mesh.
在本發明一實施例中，第一毛細結構為纖維束。 In an embodiment of the invention, the first capillary structure is a fiber bundle.
在本發明一實施例中，第一毛細結構為粉末燒結。 In an embodiment of the invention, the first capillary structure is powder sintering.
在本發明一實施例中，均溫板更包括一注液口。 In an embodiment of the invention, the temperature equalizing plate further includes a liquid injection port.
在本發明一實施例中，熱管之封閉端，未封閉前為散熱裝置之注液口。 In an embodiment of the invention, the closed end of the heat pipe is the liquid injection port of the heat dissipation device before being closed.
在本發明一實施例中，更包括一工作介質填充於熱管與均溫板內。 In an embodiment of the invention, a working medium is further filled in the heat pipe and the temperature equalizing plate.
在本發明一實施例中，均溫板係在與熱管連接處具有一擴大之開口。 In an embodiment of the invention, the temperature equalizing plate has an enlarged opening at the connection with the heat pipe.
1‧‧‧散熱裝置 1‧‧‧radiating device
2‧‧‧熱管 2‧‧‧heat pipe
21‧‧‧封閉端 21‧‧‧Closed end
22‧‧‧開口端 22‧‧‧Open end
23‧‧‧第一毛細結構 23‧‧‧The first capillary structure
231‧‧‧剖面面積 231‧‧‧ Cross-sectional area
232‧‧‧厚度 232‧‧‧thickness
24‧‧‧剖面面積 24‧‧‧ Cross-sectional area
25‧‧‧內頂面 25‧‧‧Inner top surface
26‧‧‧內底面 26‧‧‧Inner bottom
3‧‧‧均溫板 3‧‧‧Even temperature plate
31‧‧‧上殼體 31‧‧‧Upper case
32‧‧‧下殼體 32‧‧‧Lower case
321‧‧‧開口 321‧‧‧ opening
322‧‧‧內底面 322‧‧‧Inner bottom
33‧‧‧容室 33‧‧‧Room
34‧‧‧第二毛細結構 34‧‧‧Second capillary structure
35‧‧‧第三毛細結構 35‧‧‧The third capillary structure
36‧‧‧注液口 36‧‧‧Injection port
37‧‧‧開口 37‧‧‧ opening
第1A圖至第1D圖係依據本發明之第一實施例所提供散熱裝置，其組裝示意圖與立體結構示意圖。 FIGS. 1A to 1D are schematic diagrams of the assembly and the three-dimensional structure of the heat dissipation device according to the first embodiment of the present invention.
第2A圖至第2D圖係依據本發明之第一實施例所提供的散熱裝置，從側面視角所顯示的組裝過程與剖面結構。 FIGS. 2A to 2D are the assembly process and cross-sectional structure shown from a side view of the heat dissipation device according to the first embodiment of the present invention.
第3A圖係本發明所提供的散熱裝置，其均溫板上形成有注液口的立體示意圖。 FIG. 3A is a perspective view of a heat dissipation device provided by the present invention, in which a liquid injection port is formed on a temperature equalizing plate.
第3B圖與第3C圖係本發明所提供的散熱裝置，其熱管內部的結構示意圖。 FIG. 3B and FIG. 3C are schematic diagrams of the internal structure of the heat pipe of the heat dissipation device provided by the present invention.
第4圖係本發明所提供的散熱裝置，其均溫板在結構上的另一種實施方式。 FIG. 4 is another embodiment of the heat dissipation device provided by the present invention in its structure of a temperature equalizing plate.
請同時參照第1A圖至第1D圖以及第2A圖至第2D圖，其係本發明之第一實施例所提供散熱裝置組裝過程的立體示意圖以及側面示意圖。散熱裝置1包括一熱管2以及一均溫板3。熱管2具有一封閉端21以及一開口端22，並且熱管2內部還設置有第一毛細結構23。從第1A圖所示熱管2與均溫板3尚未組裝前的立體示意圖可以觀察到，第一毛細結構23係從熱管的開口端22向外延伸，突出於熱管2之外。而均溫板3則具有一上殼體31以及一下殼體32，兩者共同形成一容室33，並且均溫板3在下殼體上32形成有一開口321。而由第1A圖所示的立體示意圖可以觀察到，本實施例係在均溫板3下殼體32的內底面322上，會預先形成有一第二毛細結構34，第二毛細結構可由粉末、編織網或纖維束燒結而成。 Please refer to FIGS. 1A to 1D and FIGS. 2A to 2D at the same time, which are a perspective schematic view and a side schematic view of the assembly process of the heat dissipation device provided in the first embodiment of the present invention. The heat dissipation device 1 includes a heat pipe 2 and a temperature equalizing plate 3. The heat pipe 2 has a closed end 21 and an open end 22, and a first capillary structure 23 is also provided inside the heat pipe 2. From the perspective schematic view of the heat pipe 2 and the temperature equalizing plate 3 shown in FIG. 1A before being assembled, it can be observed that the first capillary structure 23 extends outward from the open end 22 of the heat pipe and protrudes beyond the heat pipe 2. The temperature equalizing plate 3 has an upper shell 31 and a lower shell 32, which together form a chamber 33, and the temperature equalizing plate 3 has an opening 321 formed in the lower shell 32. As can be seen from the perspective schematic view shown in FIG. 1A, this embodiment is formed on the inner bottom surface 322 of the lower housing 32 of the temperature equalizing plate 3, and a second capillary structure 34 is formed in advance, and the second capillary structure can be made of powder, Sintered woven mesh or fiber bundle.
請參考第1B圖以及第2B圖，當熱管2與均溫板3要組裝，熱管2的開口端22會從均溫板3的開口321***(或是置入於開口321上)，讓第一 毛細結構23得以伸入容室33內並且疊置於第二毛細結構34上。在本發明中，熱管2的第一毛細結構23係***均溫板3的開口處而非深入均溫板3的內部，避免影響到均溫板3的正常運作。由第2B圖所示的側面示意圖可以觀察到，本實施例所提供的散熱裝置1，其熱管2的第一毛細結構23是疊置在均溫板3的第二毛細結構34上的，也就是說第一毛細結構23與第二毛細結構34在水平方向上是有部分重疊的，如此的設計能夠更確保日後填充於熱管2跟均溫板3內的工作介質(圖中未示)，得以順利地在第一毛細結構23與第二毛細結構34之間傳遞或是移動，不致發生斷層或是中斷的情況。 Please refer to FIGS. 1B and 2B. When the heat pipe 2 and the temperature equalizing plate 3 are to be assembled, the open end 22 of the heat pipe 2 will be inserted from the opening 321 of the temperature equalizing plate 3 (or placed in the opening 321). One The capillary structure 23 can extend into the chamber 33 and overlap the second capillary structure 34. In the present invention, the first capillary structure 23 of the heat pipe 2 is inserted into the opening of the temperature equalizing plate 3 instead of going deep into the temperature equalizing plate 3 to avoid affecting the normal operation of the temperature equalizing plate 3. As can be seen from the side schematic diagram shown in FIG. 2B, the heat dissipation device 1 provided in this embodiment has the first capillary structure 23 of the heat pipe 2 stacked on the second capillary structure 34 of the temperature equalizing plate 3, also That is to say, the first capillary structure 23 and the second capillary structure 34 partially overlap in the horizontal direction, such a design can further ensure that the working medium filled in the heat pipe 2 and the temperature equalizing plate 3 in the future (not shown), It can be smoothly transferred or moved between the first capillary structure 23 and the second capillary structure 34, so that no fault or interruption occurs.
請參考第1C圖以及第2C圖，當熱管2的第一毛細結構23與均溫板3的第二毛細結構34搭接在一起後，本實施例可在均溫板3內第一毛細結構23與第二毛細結構34的交會處，再形成一第三毛細結構35。此第三毛細結構35可如第1C圖與第2C圖所示，疊置於第一毛細結構23跟第二毛細結構34上，也就是在水平方向上，第三毛細結構35會與第一毛細結構23或是與第二毛細結構34有部分的重疊，如此的設計可讓第一毛細結構23與第二毛細結構34兩者更加穩固地結合在一起。而從第2C圖所示的側面示意圖，也可觀察到突出於熱管2的第一毛細結構23，夾設在第二毛細結構34跟第三毛細結構35之間的設計。在本實施例中，第三毛細結構35的形成方式，可選擇在第一毛細結構23跟第二毛細結構34的交會處鋪設粉末、編織網或是纖維束，並經由燒結程序而予以形成，如此可讓第一毛細結構23與第二毛細結構34更加穩固地結合在一起而不致分離。 Please refer to FIG. 1C and FIG. 2C. After the first capillary structure 23 of the heat pipe 2 and the second capillary structure 34 of the temperature equalizing plate 3 are overlapped together, the first capillary structure in the temperature equalizing plate 3 in this embodiment At the intersection of 23 and the second capillary structure 34, a third capillary structure 35 is formed. The third capillary structure 35 can be stacked on the first capillary structure 23 and the second capillary structure 34 as shown in FIGS. 1C and 2C, that is, in the horizontal direction, the third capillary structure 35 will be in contact with the first The capillary structure 23 may partially overlap the second capillary structure 34. Such a design allows the first capillary structure 23 and the second capillary structure 34 to be more firmly combined. From the side schematic view shown in FIG. 2C, the design of the first capillary structure 23 protruding from the heat pipe 2 and sandwiched between the second capillary structure 34 and the third capillary structure 35 can also be observed. In this embodiment, the third capillary structure 35 may be formed by laying powder, woven mesh or fiber bundle at the intersection of the first capillary structure 23 and the second capillary structure 34 and forming it through a sintering process. In this way, the first capillary structure 23 and the second capillary structure 34 can be combined more firmly without separation.
請參考第1D圖與第2D圖，當第三毛細結構35設置完成而使讓第一毛細結構23跟第二毛細結構34連結在一起後，可再藉由硬焊或是常見的金屬封邊製程來讓均溫板3的上殼體31與下殼體32結合在一起，並且也將下殼體32的開口321與熱管2間的縫隙藉由壓合、接合膠或填充焊料等方式予以封閉。 Please refer to FIGS. 1D and 2D. After the third capillary structure 35 is set up so that the first capillary structure 23 and the second capillary structure 34 are connected together, it can be edge-sealed by brazing or common metal The process is to combine the upper casing 31 and the lower casing 32 of the temperature equalizing plate 3, and also to seal the gap between the opening 321 of the lower casing 32 and the heat pipe 2 by pressing, bonding glue, or filling solder. Closed.
當散熱裝置1的熱管2與均溫板3完成連接後，會進行後續的 抽真空以及注液程序，將工作介質(圖中未示)注入本實施例所提供的散熱裝置中。本發明可如第3A圖所示，將一注液口36設置在均溫板3上，或者也可讓熱管2原先的封閉端21先做為注液口，其做法是讓熱管2的兩端均為開口端，並且以遠離均溫板3的該開口端做為注液口，等到注液完成後再予以封閉而成為熱管2的封閉端21。 After the heat pipe 2 of the heat dissipation device 1 is connected to the temperature equalizing plate 3, the subsequent Vacuuming and liquid injection procedures inject working medium (not shown) into the heat dissipation device provided in this embodiment. In the present invention, as shown in FIG. 3A, a liquid injection port 36 is provided on the temperature equalizing plate 3, or the original closed end 21 of the heat pipe 2 can be used as a liquid injection port first. The ends are all open ends, and the open end away from the temperature equalizing plate 3 is used as a liquid injection port, which is closed after the liquid injection is completed to become the closed end 21 of the heat pipe 2.
為了避免熱管2在抽真空以及注液的過程中產生變形或是擠壓，甚至於是破裂的情況，因此本發明特別在熱管2設置第一毛細結構23時即事先予以設計，目標是讓第一毛細結構23可做為熱管2的支撐結構。為了達成這個目的，在第一毛細結構23的材質上，本發明可選用金屬編織網、纖維束或是粉末燒結等毛細種類，特別是藉由粉末燒結所形成的毛細結構，在外型上更不容易變型，適合做為向外延伸的毛細結構。在毛細結構的設置規則上，以第3B圖或第3C圖所示的剖面圖來看，本發明可讓第一毛細結構23的剖面面積231，占熱管2管內剖面面積24的30%至70%，如此一來，當熱管2發生產生形變或被擠壓時，第一毛細結構23便可抵靠於熱管2的內頂面25及內底面26，或是與熱管2的內頂面25及內底面26接觸。此外，本發明所提供的散熱裝置1中，若是熱管2的外型如第3B圖所示為一扁管的話，在第一毛細結構23的設置上，除了可安排讓第一毛細結構23的剖面面積231，占熱管2管內剖面面積24的30%至70%外，也可安排讓第一毛細結構23之厚度232等於熱管2內頂面25至內底面26之距離。而若是熱管的形狀如第3C圖所示為一比較不規則的形狀例如具有壓痕或是內凹等結構時，由於較難區分出內頂面與內底面，此時第一毛細結構的設置，則仍是沿用讓第一毛細結構23的剖面面積231，占熱管2管內剖面面積24的30%至70%的做法。 In order to prevent the heat pipe 2 from being deformed or squeezed or even broken during the process of evacuation and liquid injection, the present invention is specifically designed in advance when the heat pipe 2 is provided with the first capillary structure 23, and the goal is to make the first The capillary structure 23 can be used as a supporting structure of the heat pipe 2. In order to achieve this goal, in the material of the first capillary structure 23, the present invention can select capillary types such as metal braided mesh, fiber bundle, or powder sintering, especially the capillary structure formed by powder sintering, which is even less in appearance Easy to deform, suitable as a capillary structure extending outwards. In terms of the arrangement rules of the capillary structure, according to the cross-sectional view shown in FIG. 3B or FIG. 3C, the present invention allows the cross-sectional area 231 of the first capillary structure 23 to account for 30% of the cross-sectional area 24 in the heat pipe 2 to 70%, as a result, when the heat pipe 2 is deformed or squeezed, the first capillary structure 23 can abut against the inner top surface 25 and the inner bottom surface 26 of the heat pipe 2 or the inner top surface of the heat pipe 2 25 and the inner bottom surface 26 are in contact. In addition, in the heat dissipation device 1 provided by the present invention, if the shape of the heat pipe 2 is a flat tube as shown in FIG. 3B, in the arrangement of the first capillary structure 23, in addition to the arrangement of the first capillary structure 23 The cross-sectional area 231 occupies 30% to 70% of the inner cross-sectional area 24 of the heat pipe 2. The thickness 232 of the first capillary structure 23 can also be arranged to be equal to the distance from the inner top surface 25 to the inner bottom surface 26 of the heat pipe 2. If the shape of the heat pipe is a relatively irregular shape as shown in FIG. 3C, such as an indentation or a concave structure, it is difficult to distinguish the inner top surface from the inner bottom surface. At this time, the setting of the first capillary structure Then, the method of letting the cross-sectional area 231 of the first capillary structure 23 still account for 30% to 70% of the cross-sectional area 24 of the inner tube of the heat pipe 2 is used.
此外，為了能夠讓縮小散熱裝置1整體的體積或厚度，本發明所提供的散熱裝置1，可如第4圖所示，在均溫板3上形成有段差結構，也就是讓均溫板3在與熱管2連接處才具有擴大的開口37，其他未與熱管2連接的地方則維持較薄的外型，如此便可讓散熱裝置1的體積不致影響到應用標 的(例如電子裝置)內部空間的規劃。 In addition, in order to reduce the overall volume or thickness of the heat dissipation device 1, the heat dissipation device 1 provided by the present invention may have a step structure on the temperature equalizing plate 3 as shown in FIG. Only the connection with the heat pipe 2 has an enlarged opening 37, and other places not connected with the heat pipe 2 maintain a thin appearance, so that the volume of the heat dissipation device 1 will not affect the application standard Planning of the internal space (such as electronic devices).
在上述實施例中，散熱裝置1的均溫板3，是以板狀的上殼體31與具有凹陷空間的下殼體32做為範例，但並不以此為限，均溫板3的上殼體31跟下殼體32，也可為對稱的結構，兩者都具有內凹的內部空間，此時，原先用來跟熱管2連接的開口321，也就可以形成於上殼體31上。此外，上殼體31與下殼體32也可在其他實施例中，均形成有部分的開口，因而能夠共同夾設住熱管2。 In the above embodiment, the temperature equalizing plate 3 of the heat dissipation device 1 takes the plate-like upper casing 31 and the lower casing 32 having a recessed space as examples, but it is not limited to this. The upper casing 31 and the lower casing 32 may also have a symmetrical structure, both of which have a concave internal space. At this time, the opening 321 that was originally used to connect with the heat pipe 2 may also be formed in the upper casing 31 on. In addition, the upper casing 31 and the lower casing 32 may also have partial openings in other embodiments, so that the heat pipe 2 can be sandwiched together.
Claims (15)
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| TW106139032A TWI641797B (en) | 2017-11-10 | 2017-11-10 | Heat dissipating device |
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| TW106139032A TWI641797B (en) | 2017-11-10 | 2017-11-10 | Heat dissipating device |
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| TW201918680A TW201918680A (en) | 2019-05-16 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200840986A (en) * | 2007-04-02 | 2008-10-16 | Neobulb Technologies Inc | Heat pipe and making thereof |
| TWM534370U (en) * | 2016-07-26 | 2016-12-21 | Taiwan Microloops Corp | Vapor chamber and heat pipe combined structure |
| TW201730498A (en) * | 2016-02-25 | 2017-09-01 | 訊凱國際股份有限公司 | Communication-type thermal conduction device |
| TW201730501A (en) * | 2015-12-28 | 2017-09-01 | Furukawa Electric Co Ltd | Heat pipe |
| TW201736794A (en) * | 2016-04-07 | 2017-10-16 | 訊凱國際股份有限公司 | Heat-conducting structure |
-
2017
- 2017-11-10 TW TW106139032A patent/TWI641797B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200840986A (en) * | 2007-04-02 | 2008-10-16 | Neobulb Technologies Inc | Heat pipe and making thereof |
| TW201730501A (en) * | 2015-12-28 | 2017-09-01 | Furukawa Electric Co Ltd | Heat pipe |
| TW201730498A (en) * | 2016-02-25 | 2017-09-01 | 訊凱國際股份有限公司 | Communication-type thermal conduction device |
| TW201736794A (en) * | 2016-04-07 | 2017-10-16 | 訊凱國際股份有限公司 | Heat-conducting structure |
| TWM534370U (en) * | 2016-07-26 | 2016-12-21 | Taiwan Microloops Corp | Vapor chamber and heat pipe combined structure |
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| TW201918680A (en) | 2019-05-16 |
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