TWI639834B - Probe card support device and probe card assembly - Google Patents
Probe card support device and probe card assembly Download PDFInfo
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- TWI639834B TWI639834B TW106123705A TW106123705A TWI639834B TW I639834 B TWI639834 B TW I639834B TW 106123705 A TW106123705 A TW 106123705A TW 106123705 A TW106123705 A TW 106123705A TW I639834 B TWI639834 B TW I639834B
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Abstract
一種探針卡支撐裝置，用以支撐一探針卡，包括一剛性承載座、一電路板、一夾具以及複數個剛性支撐柱。電路板設置於剛性承載座上方，電性接觸探針卡，用以通過探針卡傳送及接收訊號。夾具設置於電路板上方。每一該剛性支撐柱具有相對之一第一表面及一第二表面，其中該些剛性支撐柱貫穿電路板，該些第一表面承靠在剛性承載座上，夾具承靠在該些第二表面上，且剛性承載座與夾具透過該些剛性支撐柱貫穿電路板而對鎖。 A probe card supporting device for supporting a probe card comprises a rigid carrier, a circuit board, a clamp and a plurality of rigid support columns. The circuit board is disposed above the rigid carrier and electrically contacts the probe card for transmitting and receiving signals through the probe card. The fixture is placed above the board. Each of the rigid support columns has a first surface opposite to the first surface and a second surface, wherein the rigid support columns extend through the circuit board, the first surfaces bear against the rigid carrier, and the clamps bear against the second On the surface, the rigid carrier and the clamp penetrate the circuit board through the rigid support columns to lock the lock.
Description
本發明是有關於一種探針裝置，且特別是有關於一種探針卡支撐裝置及探針卡總成。 The present invention relates to a probe device, and more particularly to a probe card support device and probe card assembly.
請參照第1圖，習知探針卡總成100，係設置於一測試機台上，用以測試固定於一測試平台11上的一晶片10。習知探針卡總成100包括一探針卡支撐裝置110及一探針卡120。探針卡支撐裝置110，用以支撐探針卡120，包括一剛性承載座111、一電路板112、一夾具113、複數個剛性支撐柱114、複數個第一鎖固件115、複數個第二鎖固件116、一支撐件117及一第三鎖固件118以及一墊片M。該些剛性支撐柱114承靠於剛性承載座111上，電路板112設置於剛性支撐柱114上，電性接觸探針卡120，用以通過探針卡120傳送及接收訊號。夾具113承靠於電路板112上。該些第一鎖固件115穿過剛性承載座111及該些剛性支撐柱114。該些第二鎖固件116穿過夾具113、電路板112及該些剛性支撐柱114。第三鎖固件118穿過剛性承載座111及支撐件117。墊片M設置於該些剛性支撐柱114與電路板112之間。探針卡120包括一探針基板121及複數個探針122，探針基板121設置於電路板112上，該些探 針122設置於探針基板121上，用以接觸晶片10之訊號饋入點及訊號饋出點。 Referring to FIG. 1 , the conventional probe card assembly 100 is disposed on a test machine for testing a wafer 10 fixed on a test platform 11 . The conventional probe card assembly 100 includes a probe card support device 110 and a probe card 120. The probe card support device 110 is configured to support the probe card 120, and includes a rigid carrier 111, a circuit board 112, a clamp 113, a plurality of rigid support columns 114, a plurality of first locks 115, and a plurality of second A locker 116, a support member 117 and a third locker 118, and a spacer M. The rigid support posts 114 bear against the rigid carrier 111. The circuit board 112 is disposed on the rigid support post 114 and electrically contacts the probe card 120 for transmitting and receiving signals through the probe card 120. The clamp 113 bears against the circuit board 112. The first fasteners 115 pass through the rigid carrier 111 and the rigid support columns 114. The second locking members 116 pass through the clamp 113 , the circuit board 112 , and the rigid support columns 114 . The third locking member 118 passes through the rigid carrier 111 and the support member 117. The spacer M is disposed between the rigid support columns 114 and the circuit board 112. The probe card 120 includes a probe substrate 121 and a plurality of probes 122. The probe substrate 121 is disposed on the circuit board 112. The pin 122 is disposed on the probe substrate 121 for contacting the signal feed point and the signal feed point of the wafer 10.
為了確保測試良率與品質，探針卡120需與測試機台保持平行。然而，習知探針卡總成100具有以下缺點：探針122在測試過程中會因為測試受力產生變形彎曲，使探針122推擠探針基板121，進而出現側向應力。習知探針卡總成100是以夾具113與該些剛性支撐柱114夾持電路板112並以第二鎖固件116鎖附固定，由於電路板112的材質與這些機構件(夾具113、剛性支撐柱114及第二鎖固件116)的材質不同，鎖固與夾持力量有限，當測試過程中產生過大的側向應力，會使電路板112產生位移造成接觸不良。由於電路板112的製程關係會產生板厚不均勻的問題，以習知結構夾持電路板112方式及鎖固方式會因電路板112的厚度不均使機構件(夾具113、剛性支撐柱114及第二鎖固件116)鎖固後歪斜，為了使該些探針122的一端與測試機台保持平行，習知結構必須考量電路板112在製程上公差大的問題，需要利用塞墊片M方式調整水平。 To ensure test yield and quality, the probe card 120 needs to be parallel to the test machine. However, the conventional probe card assembly 100 has the disadvantage that the probe 122 is deformed and bent due to the test force during the test, and the probe 122 is pushed against the probe substrate 121, thereby causing lateral stress. The conventional probe card assembly 100 is clamped to the circuit board 112 by the clamp 113 and the rigid support columns 114 and is locked and fixed by the second lock 116. Due to the material of the circuit board 112 and the mechanical components (the clamp 113, the rigidity The material of the support column 114 and the second locking member 116) is different, and the locking and clamping force is limited. When the lateral stress is generated during the test, the circuit board 112 is displaced and the contact is poor. Since the process relationship of the circuit board 112 may cause unevenness of the board thickness, the conventional structure clamping the circuit board 112 and the locking method may cause the machine components (the jig 113 and the rigid support column 114) due to the uneven thickness of the circuit board 112. And the second locking member 116) is locked and skewed. In order to keep one end of the probes 122 parallel to the testing machine, the conventional structure must consider the problem that the circuit board 112 has a large tolerance on the process, and the plug gasket M is required. Way to adjust the level.
故，有需要提供一種探針卡支撐裝置及探針卡總成，以解決習知技術存在的問題。 Therefore, there is a need to provide a probe card support device and a probe card assembly to solve the problems of the prior art.
本發明之主要目的在於提供一種探針卡支撐裝置，其機構件可以保持平行，不會受到電路板的厚度不均的影響而產生歪斜，因此可藉由機構件來使探針卡與測試機台保持平行。 The main object of the present invention is to provide a probe card supporting device, wherein the machine members can be kept parallel without being affected by the thickness unevenness of the circuit board, so that the probe card and the testing machine can be made by the machine member. The stations remain parallel.
本發明之另一目的在於提供一種探針卡總成，其機構件可以保持平行，不會受到電路板的厚度不均的影響而產生歪斜，因此可藉由機 構件來使探針卡與測試機台保持平行。 Another object of the present invention is to provide a probe card assembly in which the machine members can be kept parallel without being affected by the thickness unevenness of the circuit board, thereby causing skew. Components to keep the probe card parallel to the test machine.
為達上述之目的，本發明提供一種探針卡支撐裝置，用以支撐一探針卡，包括一剛性承載座、一電路板、一夾具以及複數個剛性支撐柱。電路板設置於剛性承載座上方，電性接觸探針卡，用以通過探針卡傳送及接收訊號。夾具設置於電路板上方。每一該剛性支撐柱具有相對之一第一表面及一第二表面，其中該些剛性支撐柱貫穿電路板，該些第一表面承靠在剛性承載座上，夾具承靠在該些第二表面上，且剛性承載座與夾具透過該些剛性支撐柱貫穿電路板而對鎖。 To achieve the above object, the present invention provides a probe card supporting device for supporting a probe card, including a rigid carrier, a circuit board, a clamp, and a plurality of rigid support columns. The circuit board is disposed above the rigid carrier and electrically contacts the probe card for transmitting and receiving signals through the probe card. The fixture is placed above the board. Each of the rigid support columns has a first surface opposite to the first surface and a second surface, wherein the rigid support columns extend through the circuit board, the first surfaces bear against the rigid carrier, and the clamps bear against the second On the surface, the rigid carrier and the clamp penetrate the circuit board through the rigid support columns to lock the lock.
在本發明之一實施例中，探針卡支撐裝置更包括複數個第一鎖固件及複數個第二鎖固件，其中該些第一鎖固件穿過該剛性承載座及該些剛性支撐柱以鎖固該剛性承載座及該些剛性支撐柱，該些第二鎖固件穿過該夾具及該些剛性支撐柱以鎖固該夾具及該些剛性支撐柱。 In an embodiment of the invention, the probe card supporting device further includes a plurality of first locking members and a plurality of second locking members, wherein the first locking members pass through the rigid carrier and the rigid supporting columns The rigid carrier and the rigid support columns are locked, and the second fasteners pass through the clamp and the rigid support columns to lock the clamp and the rigid support columns.
在本發明之一實施例中，該電路板與該夾具之間具有一間距。 In an embodiment of the invention, the circuit board has a spacing from the fixture.
在本發明之一實施例中，該電路板具有複數個固定孔，該些剛性支撐柱穿過該電路板的該些固定孔。 In an embodiment of the invention, the circuit board has a plurality of fixing holes, and the rigid supporting columns pass through the fixing holes of the circuit board.
在本發明之一實施例中，該些剛性支撐柱分別貫穿該電路板的二側邊。 In an embodiment of the invention, the rigid support columns respectively penetrate the two sides of the circuit board.
在本發明之一實施例中，探針卡支撐裝置更包括複數個可調式支撐頂柱，可移動地設置於剛性承載座上且支撐該電路板。 In an embodiment of the invention, the probe card support device further includes a plurality of adjustable support top posts movably disposed on the rigid carrier and supporting the circuit board.
在本發明之一實施例中，該些可調式支撐頂柱藉由往該電路 板方向移動或遠離該電路板方向移動來調整該電路板的位置，而使該電路板維持在一預定平面。 In an embodiment of the invention, the adjustable support top posts are passed to the circuit The board moves in or away from the board to adjust the position of the board while maintaining the board in a predetermined plane.
在本發明之一實施例中，該些可調式支撐頂柱接近該電路板的一端位於同一水平面，該些可調式支撐頂柱遠離該電路板的另一端位於不同水平面。 In an embodiment of the invention, the adjustable support top pillars are located at the same horizontal plane near one end of the circuit board, and the adjustable support top pillars are located at different horizontal planes away from the other end of the circuit board.
在本發明之一實施例中，一種探針卡總成，用以電連接一晶片之至少一訊號饋入點及至少一訊號饋出點，包括上述之探針卡支撐裝置及該探針卡。 In one embodiment of the present invention, a probe card assembly is configured to electrically connect at least one signal feed point and at least one signal feed point of a chip, including the probe card support device and the probe card. .
在本發明之一實施例中，該探針卡包括一探針基板及複數個探針，該探針基板設置於該電路板上，該些探針設置於該探針基板上，用以接觸該晶片之該訊號饋入點及該訊號饋出點，該電路板電性連接該些探針，用以產生測試訊號通過該訊號饋入點至該晶片，及通過該訊號饋出點接收該晶片產生之回饋訊號。 In one embodiment of the present invention, the probe card includes a probe substrate and a plurality of probes. The probe substrate is disposed on the circuit board, and the probes are disposed on the probe substrate for contacting The signal feed point of the chip and the signal feed point, the circuit board is electrically connected to the probes for generating a test signal through the signal feed point to the chip, and receiving the signal through the signal feed point The feedback signal generated by the wafer.
在本發明之一實施例中，該探針座的一側向應力小於該些剛性支撐柱鎖固該電路板之鎖固力。 In an embodiment of the invention, the lateral stress of the probe holder is smaller than the locking force of the rigid support columns to lock the circuit board.
在本發明之一實施例中，該電路板位於之平面、該探針基板位於之平面及該些探針的一端共同定義之平面均平行一預設平面。 In an embodiment of the invention, the plane of the circuit board, the plane of the probe substrate and the plane defined by one end of the probes are parallel to a predetermined plane.
在本發明之一實施例中，該探針座承靠在該夾具上。 In an embodiment of the invention, the probe holder bears against the clamp.
由於本發明實施例的剛性支撐柱貫穿電路板，該些第一表面承靠在剛性承載座上，夾具承靠在該些第二表面上，且剛性承載座與夾具透過該些剛性支撐柱貫穿電路板而對鎖，因此這些機構件(剛性承載座、夾 具及剛性支撐柱)可以保持平行，不會受到電路板的厚度不均的影響而產生歪斜，因此可藉由這些機構件(剛性承載座、夾具及剛性支撐柱)來使探針卡與測試機台保持平行。 Since the rigid support column of the embodiment of the present invention penetrates the circuit board, the first surfaces bear against the rigid carrier, the clamps bear against the second surfaces, and the rigid carrier and the clamp penetrate through the rigid support columns. The board is locked, so these components (rigid carrier, clip) With rigid support columns) can be kept parallel and will not be affected by the uneven thickness of the board, so the probes can be tested and tested by these components (rigid carrier, clamp and rigid support column). The machines are kept parallel.
10、20‧‧‧晶片 10, 20‧‧‧ wafer
11、21‧‧‧測試平台 11, 21‧‧‧ test platform
100、200‧‧‧探針卡總成 100,200‧‧‧ probe card assembly
110、210‧‧‧探針卡支撐裝置 110, 210‧‧‧ probe card support device
111、211‧‧‧剛性承載座 111, 211‧‧‧ rigid carrier
112、212‧‧‧電路板 112, 212‧‧‧ circuit board
113、213‧‧‧夾具 113, 213‧‧ ‧ fixture
114、214‧‧‧剛性支撐柱 114, 214‧‧‧ rigid support columns
115、215‧‧‧第一鎖固件 115, 215‧‧‧ first lock firmware
116、216‧‧‧第二鎖固件 116, 216‧‧‧ second lock firmware
117‧‧‧支撐件 117‧‧‧Support
118‧‧‧第三鎖固件 118‧‧‧ Third lock firmware
217‧‧‧可調式支撐頂柱 217‧‧‧Adjustable support column
120、220‧‧‧探針卡 120, 220‧‧ ‧ probe card
121、221‧‧‧探針基板 121, 221‧‧‧ probe substrate
122、222‧‧‧探針 122, 222‧‧ ‧ probe
2121‧‧‧固定孔 2121‧‧‧Fixed holes
2141‧‧‧第一表面 2141‧‧‧ first surface
2142‧‧‧第二表面 2142‧‧‧ second surface
G‧‧‧間距 G‧‧‧ spacing
M‧‧‧墊片 M‧‧‧shims
第1圖為習知探針卡總成之剖視圖。 Figure 1 is a cross-sectional view of a conventional probe card assembly.
第2圖為本發明實施例之探針卡總成之剖視圖。 2 is a cross-sectional view of a probe card assembly in accordance with an embodiment of the present invention.
為了讓本發明之上述及其他目的、特徵、優點能更明顯易懂，下文將特舉本發明較佳實施例，並配合所附圖式，作詳細說明如下。再者，本發明所提到的方向用語，例如上、下、頂、底、前、後、左、右、內、外、側面、周圍、中央、水平、橫向、垂直、縱向、軸向、徑向、最上層或最下層等，僅是參考附加圖式的方向。因此，使用的方向用語是用以說明及理解本發明，而非用以限制本發明。 The above and other objects, features and advantages of the present invention will become more <RTIgt; Furthermore, the directional terms mentioned in the present invention, such as upper, lower, top, bottom, front, rear, left, right, inner, outer, side, surrounding, central, horizontal, horizontal, vertical, longitudinal, axial, Radial, uppermost or lowermost, etc., only refer to the direction of the additional schema. Therefore, the directional terminology used is for the purpose of illustration and understanding of the invention.
請參照第2圖，本發明實施例之一種探針卡總成200係設置於一測試設備上，用以測試固定於一測試平台21上的一晶片20。探針卡總成200用以電連接晶片20之至少一訊號饋入點及至少一訊號饋出點。探針卡總成200包括一探針卡支撐裝置210及一探針卡220。探針卡支撐裝置210，用以支撐探針卡220，包括一剛性承載座211、一電路板212、一夾具213以及複數個剛性支撐柱214。電路板212設置於剛性承載座211上方，電性接觸探針卡220，用以通過探針卡220傳送及接收訊號。夾具213設置於電路板212上方。每一該剛性支撐柱214具有相對之一第一表面2141及一第二表面 2142，其中該些剛性支撐柱214貫穿電路板212，該些第一表面2141承靠在剛性承載座211上，夾具213承靠在該些第二表面2142上，且剛性承載座211與夾具213透過該些剛性支撐柱214貫穿電路板212而對鎖。 Referring to FIG. 2, a probe card assembly 200 according to an embodiment of the present invention is disposed on a test device for testing a wafer 20 fixed on a test platform 21. The probe card assembly 200 is configured to electrically connect at least one signal feed point of the wafer 20 and at least one signal feed point. The probe card assembly 200 includes a probe card support device 210 and a probe card 220. The probe card supporting device 210 is configured to support the probe card 220, and includes a rigid carrier 211, a circuit board 212, a clamp 213, and a plurality of rigid support columns 214. The circuit board 212 is disposed above the rigid carrier 211 and electrically contacts the probe card 220 for transmitting and receiving signals through the probe card 220. The clamp 213 is disposed above the circuit board 212. Each of the rigid support columns 214 has a first surface 1141 and a second surface 2142, wherein the rigid support columns 214 extend through the circuit board 212. The first surfaces 2141 bear against the rigid carrier 211. The clamps 213 bear against the second surfaces 2142, and the rigid carrier 211 and the clamp 213 The lock is locked through the rigid support posts 214 through the circuit board 212.
由於本實施例的剛性支撐柱214貫穿電路板212，該些第一表面2141直接承靠在剛性承載座211上，夾具213直接承靠在該些第二表面2142上，且剛性承載座211與夾具213透過該些剛性支撐柱214貫穿電路板212而對鎖，因此這些機構件(剛性承載座211、夾具213及剛性支撐柱214)可以保持平行，不會受到電路板212的厚度不均的影響而產生歪斜，因此可藉由這些機構件(剛性承載座211、夾具213及剛性支撐柱214)來使探針卡220與測試機台保持平行。此外，這些機構件包括剛性承載座211、夾具213及剛性支撐柱214，可有效吸收探針卡220於測試過程中因測試受力而產生的側向應力，使得探針卡220可以得到良好的支撐並與測試機台保持平行。 Since the rigid support post 214 of the embodiment penetrates the circuit board 212, the first surface 2141 directly bears on the rigid carrier 211, and the clamp 213 directly bears on the second surfaces 2142, and the rigid carrier 211 and The clamp 213 is locked to the circuit board 212 through the rigid support columns 214, so that the machine members (the rigid carrier 211, the clamp 213 and the rigid support column 214) can be kept parallel without being uneven by the thickness of the circuit board 212. The effect is skewed, so the probe card 220 can be kept parallel to the test machine by these mechanical components (rigid carrier 211, clamp 213 and rigid support post 214). In addition, the mechanical components include the rigid carrier 211, the clamp 213 and the rigid support column 214, which can effectively absorb the lateral stress generated by the probe card 220 during the test due to the test force, so that the probe card 220 can be well obtained. Support and keep parallel with the test machine.
在本發明之一實施例中，探針卡220承靠在夾具213上。探針卡220包括一探針基板221及複數個探針222，探針基板221設置於電路板212上，該些探針222設置於探針基板221上，用以接觸晶片10之訊號饋入點及訊號饋出點，電路板212電性連接該些探針222，用以產生測試訊號通過訊號饋入點至晶片10，及通過訊號饋出點接收晶片10產生之回饋訊號。 In one embodiment of the invention, the probe card 220 bears against the clamp 213. The probe card 220 includes a probe substrate 221 and a plurality of probes 222. The probe substrate 221 is disposed on the circuit board 212. The probes 222 are disposed on the probe substrate 221 for contacting the signal feed of the wafer 10. The signal board 212 is electrically connected to the probes 222 for generating test signals through the signal feed points to the wafer 10, and receiving the feedback signals generated by the wafers 10 through the signal feed points.
在本發明之一實施例中，探針卡220的一側向應力小於該些剛性支撐柱214鎖固電路板212之鎖固力。其中該些探針222於測試過程中受力而推擠探針基板221，進而產生側向應力。由於探針卡220的一側向應力小於該些剛性支撐柱214鎖固電路板212之鎖固力，這些機構 件包括剛性承載座211、夾具213及剛性支撐柱214，可有效吸收探針卡220的側向應力，使得探針卡220可以得到良好的支撐並使得該些探針222的一端與測試機台可以保持平行。 In one embodiment of the invention, the lateral stress of the probe card 220 is less than the locking force of the rigid support posts 214 to secure the circuit board 212. The probes 222 are forced to push the probe substrate 221 during the test to generate lateral stress. Since the lateral stress of the probe card 220 is smaller than the locking force of the rigid support posts 214 to lock the circuit board 212, these mechanisms The device includes a rigid carrier 211, a clamp 213 and a rigid support column 214, which can effectively absorb the lateral stress of the probe card 220, so that the probe card 220 can be well supported and one end of the probes 222 and the test machine Can be kept parallel.
在本發明之一實施例中，探針卡支撐裝置210更包括複數個第一鎖固件215及複數個第二鎖固件216，其中該些第一鎖固件216穿過剛性承載座211及該些剛性支撐柱214以鎖固剛性承載座211及該些剛性支撐柱214，該些第二鎖固件215穿過夾具213及該些剛性支撐柱214以鎖固夾具213及該些剛性支撐柱214。 In an embodiment of the present invention, the probe card supporting device 210 further includes a plurality of first locking members 215 and a plurality of second locking members 216, wherein the first locking members 216 pass through the rigid carrier 211 and the The rigid support post 214 is configured to lock the rigid carrier 211 and the rigid support posts 214 . The second fasteners 215 pass through the clamp 213 and the rigid support posts 214 to lock the clamp 213 and the rigid support columns 214 .
在本發明之一實施例中，電路板212與夾具213之間具有一間距G。電路板212具有複數個固定孔2121，該些剛性支撐柱214穿過電路板212的該些固定孔2121。該些剛性支撐柱214分別貫穿電路板212的二側邊。由於電路板212與夾具213之間具有一間距G，因此夾具213不會受到電路板212的厚度不均的影響而產生歪斜，夾具213可以保持平行。 In one embodiment of the invention, the circuit board 212 and the clamp 213 have a spacing G therebetween. The circuit board 212 has a plurality of fixing holes 2121 that pass through the fixing holes 2121 of the circuit board 212. The rigid support columns 214 extend through the two sides of the circuit board 212, respectively. Since there is a gap G between the circuit board 212 and the jig 213, the jig 213 is not affected by the thickness unevenness of the circuit board 212, and the jig 213 can be kept parallel.
在本發明之一實施例中，探針卡支撐裝置210更包括複數個可調式支撐頂柱217，可移動地設置於剛性承載座211上且支撐電路板212。該些可調式支撐頂柱217藉由往電路板212方向移動(上升)或遠離電路板212方向移動(下降)來調整電路板212的位置，而使電路板212維持在一預定平面。該些可調式支撐頂柱217接近電路板212的一端2171位於同一水平面，該些可調式支撐頂柱217遠離電路板212的另一端2172位於不同水平面。在本發明之一實施例中，電路板212位於之平面、探針基板221位於之平面及該些探針222的一端共同定義之平面均平行一預設平面。 In one embodiment of the present invention, the probe card support device 210 further includes a plurality of adjustable support top posts 217 movably disposed on the rigid carrier 211 and supporting the circuit board 212. The adjustable support top posts 217 adjust the position of the circuit board 212 by moving (rising) toward or away from the circuit board 212 to maintain the circuit board 212 in a predetermined plane. The adjustable support top pillars 217 are located at the same horizontal plane near the one end 2171 of the circuit board 212. The adjustable support top pillars 217 are located at different levels from the other end 2172 of the circuit board 212. In one embodiment of the present invention, the plane on which the circuit board 212 is located, the plane on which the probe substrate 221 is located, and the plane defined by one end of the probes 222 are both parallel to a predetermined plane.
由於本發明實施例的剛性支撐柱214貫穿電路板212，該些第一表面2141承靠在剛性承載座211上，夾具213承靠在該些第二表面2142上，且剛性承載座211與夾具213透過該些剛性支撐柱214貫穿電路板212而對鎖，因此這些機構件(剛性承載座211、夾具213及剛性支撐柱214)可以保持平行，不會受到電路板212的厚度不均的影響而產生歪斜，因此可藉由這些機構件包括剛性承載座211、夾具213及剛性支撐柱214使探針卡220與測試機台保持平行。 Since the rigid support post 214 of the embodiment of the present invention penetrates the circuit board 212, the first surface 2141 bears against the rigid carrier 211, and the clamp 213 bears against the second surface 2142, and the rigid carrier 211 and the clamp 213 through the rigid support columns 214 through the circuit board 212 to lock, so these mechanical components (rigid carrier 211, clamp 213 and rigid support column 214) can remain parallel, without being affected by the thickness unevenness of the circuit board 212 The skew is generated so that the probe card 220 can be kept parallel to the test machine by these mechanical members including the rigid carrier 211, the clamp 213, and the rigid support post 214.
雖然本發明已以較佳實施例揭露，然其並非用以限制本發明，任何熟習此項技藝之人士，在不脫離本發明之精神和範圍內，當可作各種更動與修飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 The present invention has been disclosed in its preferred embodiments, and is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.
Claims (11)
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| TW106123705A TWI639834B (en) | 2017-07-14 | 2017-07-14 | Probe card support device and probe card assembly |
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| TW106123705A TWI639834B (en) | 2017-07-14 | 2017-07-14 | Probe card support device and probe card assembly |
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| TW201908735A TW201908735A (en) | 2019-03-01 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201109676A (en) * | 2009-09-15 | 2011-03-16 | Mpi Corp | High frequency probe card |
| TWM499560U (en) * | 2014-12-27 | 2015-04-21 | Star Techn Inc | Test assembly |
| TW201534926A (en) * | 2014-03-06 | 2015-09-16 | Technoprobe Spa | High-planarity probe card for a testing apparatus for electronic devices |
| TWM544631U (en) * | 2017-04-05 | 2017-07-01 | 中華精測科技股份有限公司 | Supporting structure for load board of probing card |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201109676A (en) * | 2009-09-15 | 2011-03-16 | Mpi Corp | High frequency probe card |
| TW201534926A (en) * | 2014-03-06 | 2015-09-16 | Technoprobe Spa | High-planarity probe card for a testing apparatus for electronic devices |
| TWM499560U (en) * | 2014-12-27 | 2015-04-21 | Star Techn Inc | Test assembly |
| TWM544631U (en) * | 2017-04-05 | 2017-07-01 | 中華精測科技股份有限公司 | Supporting structure for load board of probing card |
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