TWI629665B - Defect inspection method and defect inspection system - Google Patents

Defect inspection method and defect inspection system Download PDF

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TWI629665B
TWI629665B TW106141065A TW106141065A TWI629665B TW I629665 B TWI629665 B TW I629665B TW 106141065 A TW106141065 A TW 106141065A TW 106141065 A TW106141065 A TW 106141065A TW I629665 B TWI629665 B TW I629665B
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image
defect
optical film
grayscale value
inspection method
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TW106141065A
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TW201926247A (en
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林寬宏
吳柏徵
洪嘉嬬
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住華科技股份有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8809Adjustment for highlighting flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9511Optical elements other than lenses, e.g. mirrors

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  • Health & Medical Sciences (AREA)
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Abstract

缺陷檢查方法及缺陷檢測系統。缺陷檢查方法包括一影像擷取步驟與一轉換步驟。影像擷取步驟包括對一光學薄膜的一表面進行拍攝動作以產生一二維影像。轉換步驟包括將二維影像轉換成一灰階值曲線。灰階值曲線包括對應光學薄膜之一凹凸缺陷部分的缺陷灰階值曲線。 Defect inspection method and defect detection system. The defect inspection method includes an image acquisition step and a conversion step. The image capturing step includes shooting a surface of an optical film to generate a two-dimensional image. The conversion step includes converting a two-dimensional image into a grayscale value curve. The grayscale value curve includes a defect grayscale value curve corresponding to a concave-convex defect portion of the optical film.

Description

缺陷檢查方法及缺陷檢測系統 Defect inspection method and defect detection system

本發明是有關於一種缺陷檢查方法及缺陷檢測系統,且特別是有關於用於光學薄膜之凹凸缺陷檢查方法。 The present invention relates to a defect inspection method and a defect inspection system, and more particularly, to a concave-convex defect inspection method for an optical film.

隨著科技的進步,對於液晶顯示裝置所運用的各種光學組件的要求亦高。然而,於光學組件的生產過程中,卻容易因各種因素而產生瑕疵,進而降低顯示品質。因此,在光學組件的生產系統中係配置有缺陷之檢測系統,以及早排除具有缺陷的光學組件。 With the advancement of technology, the requirements for various optical components used in liquid crystal display devices are also high. However, in the production process of optical components, defects are easily caused by various factors, thereby reducing the display quality. Therefore, a defect detection system is configured in the production system of the optical component, and the defective optical component is eliminated early.

本發明係有關於一種缺陷檢查方法及缺陷檢測系統。 The invention relates to a defect inspection method and a defect detection system.

根據本發明之一方面,提出一種缺陷檢查方法,包括一影像擷取步驟與一轉換步驟。影像擷取步驟包括對一光學薄膜的一表面進行拍攝動作以產生一二維影像。轉換步驟包括將二維影像轉換成一灰階值曲線。灰階值曲線包括對應光學薄膜之一凹凸缺陷部分的缺陷灰階值曲線。 According to an aspect of the present invention, a defect inspection method is provided, which includes an image capturing step and a converting step. The image capturing step includes shooting a surface of an optical film to generate a two-dimensional image. The conversion step includes converting a two-dimensional image into a grayscale value curve. The grayscale value curve includes a defect grayscale value curve corresponding to a concave-convex defect portion of the optical film.

根據本發明之另一方面,提出一種缺陷檢查方法,包括影像擷取步驟與轉換步驟。影像擷取步驟包括對一光學薄膜的一表面進行拍攝動作以產生一二維影像。轉換步驟包括將根據二維影像的資料轉換成一三維資料。三維資料包括光學薄膜之一凹凸缺陷部分相對於一平坦部分的一高度差值。 According to another aspect of the present invention, a defect inspection method is provided, which includes an image capturing step and a converting step. The image capturing step includes shooting a surface of an optical film to generate a two-dimensional image. The converting step includes converting the data based on the two-dimensional image into a three-dimensional data. The three-dimensional data includes a height difference between an uneven defect portion and a flat portion of the optical film.

根據本發明之又另一方面,提出一種缺陷檢測系統。缺陷檢測系統用於檢測一光學薄膜。缺陷檢測系統包括一光源、一影像擷取裝置、及一狹縫板。光源配置於光學薄膜之一側。影像擷取裝置配置於光學薄膜之另一側。狹縫板具有一狹縫。狹縫板配置於光源與光學薄膜之間,以使一入射光線穿過狹縫。影像擷取裝置係偏移自光源與狹縫的延伸連線。當影像擷取裝置的影像感測器對準於光源與狹縫的延伸連線時,所感測出的影像亮度為I0。當影像擷取裝置於平行光學薄膜之移動方向上偏移自光源與狹縫的延伸連線時,所感測出的影像亮度為I1。I1/I0係為0.5~0.9可觀測光學薄膜的一缺陷位置點。 According to yet another aspect of the present invention, a defect detection system is proposed. The defect inspection system is used to inspect an optical film. The defect detection system includes a light source, an image capturing device, and a slit plate. The light source is disposed on one side of the optical film. The image capturing device is disposed on the other side of the optical film. The slit plate has a slit. The slit plate is disposed between the light source and the optical film, so that an incident light passes through the slit. The image capture device is offset from the extended connection of the light source and the slit. When the image sensor of the image capture device is aligned with the extended connection between the light source and the slit, the brightness of the image is I 0 . When the image capturing device is shifted from the extension line of the light source and the slit in the moving direction of the parallel optical film, the brightness of the image sensed is I 1 . I 1 / I 0 is a defect location point of 0.5 ~ 0.9 observable optical film.

為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下: In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are described in detail below in conjunction with the accompanying drawings:

10‧‧‧光學薄膜 10‧‧‧ Optical Film

11‧‧‧輥輪 11‧‧‧ roller

12‧‧‧影像處理單元 12‧‧‧Image Processing Unit

13‧‧‧控制單元 13‧‧‧Control unit

14‧‧‧週期訊號產生單元 14‧‧‧ period signal generation unit

17‧‧‧顯示單元 17‧‧‧display unit

100‧‧‧缺陷檢測系統 100‧‧‧ Defect detection system

110‧‧‧光源 110‧‧‧light source

110a‧‧‧發光面 110a‧‧‧ light emitting surface

120‧‧‧影像擷取裝置 120‧‧‧Image capture device

130‧‧‧狹縫板 130‧‧‧Slit Plate

130s‧‧‧狹縫 130s‧‧‧Slit

250‧‧‧二維影像 250‧‧‧ 2D image

252‧‧‧缺陷影像 252‧‧‧Defective image

254‧‧‧平面影像 254‧‧‧plane image

256‧‧‧第一像素部分 256‧‧‧ the first pixel part

258‧‧‧第二像素部分 258‧‧‧Second Pixel Section

350‧‧‧加強二維影像 350‧‧‧ Enhance 2D image

471、473‧‧‧圖像 471, 473‧‧‧ images

D1‧‧‧移動方向 D1‧‧‧ direction of movement

LA‧‧‧光軸 LA‧‧‧ Optical axis

Li‧‧‧入射光線 Li‧‧‧ incident light

Ls‧‧‧散射光線 Ls‧‧‧ scattered light

P‧‧‧區域 P‧‧‧Area

S901‧‧‧影像擷取步驟 S901‧‧‧Image capture steps

S902‧‧‧轉換步驟 S902‧‧‧ Conversion steps

S903‧‧‧顯示步驟 S903‧‧‧Display steps

S904‧‧‧判斷步驟 S904‧‧‧Judging steps

S9021‧‧‧訊號加強步驟 S9021‧‧‧Signal Steps

S9022‧‧‧第一轉換步驟 S9022‧‧‧First conversion step

S9023‧‧‧第二轉換步驟 S9023‧‧‧Second conversion step

第1圖繪示根據本發明一實施例概念之缺陷檢查方法。 FIG. 1 illustrates a defect inspection method according to an embodiment of the present invention.

第2圖繪示根據本發明一實施例概念之缺陷檢測系統。 FIG. 2 illustrates a defect detection system according to an embodiment of the present invention.

第3圖為一實施例中對光學薄膜進行影像擷取步驟所得的二 維影像。 FIG. 3 is a second image obtained by performing an image capturing step on an optical film in an embodiment. Dimensional image.

第4圖為一實施例中經轉換步驟後得到的二維影像。 FIG. 4 is a two-dimensional image obtained after the conversion step in an embodiment.

第5圖為一實施例中經轉換步驟所得二維影像之缺陷影像沿剖面線所對應之灰階值關係曲線。 FIG. 5 is a grayscale value relationship curve of a defect image along a section line of a two-dimensional image obtained through a conversion step in an embodiment.

第6圖顯示一實施例中凹凸缺陷部分其灰階值積分與實質高度值的關係。 FIG. 6 shows the relationship between the grayscale value integral and the substantial height value of the concave-convex defect part in an embodiment.

第7圖為一實施例中凹凸缺陷部分的圖像。 FIG. 7 is an image of a concave-convex defect portion in an embodiment.

第8圖為一實施例中凹凸缺陷部分的剖面位置對應高度值的曲線。 Fig. 8 is a graph showing the height value of the cross-sectional position of the concave-convex defect portion in an embodiment.

請參照第1圖,其繪示根據本發明一實施例概念之光學薄膜的缺陷檢查方法,方法可包括影像擷取步驟S901、轉換步驟S902、顯示步驟S903與判斷步驟S904。 Please refer to FIG. 1, which illustrates a defect inspection method of an optical film according to an embodiment of the present invention. The method may include an image capture step S901, a conversion step S902, a display step S903, and a determination step S904.

一實施例中,缺陷檢查方法可利用第2圖繪示缺陷檢測系統100執行。請參照第2圖,缺陷檢測系統100可用於檢測被移送之光學薄膜10,光學薄膜10在生產線上經由輥輪11沿著一移動方向D1而被搬運,藉由缺陷檢測系統100可即時辨別缺陷,以及早排除具有缺陷的部分。在一實施例中,本發明可用於檢測光學薄膜捲材或片狀光學薄膜。 In one embodiment, the defect inspection method can be executed by using the defect detection system 100 shown in FIG. 2. Please refer to FIG. 2. The defect detection system 100 can be used to detect the optical film 10 being transferred. The optical film 10 is transported along the moving direction D1 via the roller 11 on the production line. The defect detection system 100 can instantly identify the defect. , Early exclusion of defective parts. In one embodiment, the present invention can be used to detect optical film rolls or sheet-like optical films.

缺陷檢測系統100可適用於各種光學薄膜10。舉例來說,光學薄膜10可為一單層或多層膜片,例如可為一偏光片、 相位差膜、增亮膜或其他對光學之增益、配向、補償、轉向、直交、擴散、保護、防黏、耐刮、抗眩、反射抑制、高折射率等有所助益的膜片;於前述偏光片之至少一面附著有保護薄膜之偏光板、相位差薄膜等;保護薄膜,材料例如可選自:纖維素系樹脂、丙烯酸系樹脂、非結晶性聚烯烴系樹脂、聚酯系樹脂、聚碳酸酯系樹脂及其組合,但本揭露不限於這些薄膜。 The defect detection system 100 is applicable to various optical films 10. For example, the optical film 10 may be a single-layer or multi-layer film, such as a polarizer, Retardation film, brightness enhancement film or other films that are helpful for optical gain, alignment, compensation, steering, orthogonal, diffusion, protection, anti-stick, scratch resistance, anti-glare, reflection suppression, high refractive index, etc .; A polarizing plate, a retardation film, and the like with a protective film attached to at least one side of the aforementioned polarizer; the protective film can be selected from, for example, cellulose resin, acrylic resin, amorphous polyolefin resin, and polyester resin. , Polycarbonate resins, and combinations thereof, but this disclosure is not limited to these films.

缺陷檢測系統100包括一光源110以及一影像擷取裝置120。可例如是螢光燈、金屬鹵素燈或LED燈,光源110具有一發光面110a。在一較佳的實施例中,光源110為LED燈。影像擷取裝置120可為線掃描相機,其具有影像感測器,影像感測器例如是感光耦合元件(Charge Coupled Device,CCD)或是任何具有光電轉換能力的元件。 The defect detection system 100 includes a light source 110 and an image capturing device 120. It can be, for example, a fluorescent lamp, a metal halide lamp or an LED lamp, and the light source 110 has a light emitting surface 110a. In a preferred embodiment, the light source 110 is an LED lamp. The image capture device 120 may be a line scan camera, which has an image sensor. The image sensor is, for example, a Charge Coupled Device (CCD) or any element having a photoelectric conversion capability.

如第2圖所示,光源110和影像擷取裝置120係配置於被移送之光學薄膜10的相對二側。具體而言,光源110係從光學薄膜10之一側照射光,而影像擷取裝置120於光學薄膜10的另一側接收穿透光學薄膜10之光線的透射光圖像。本揭露中,光的照射角度並未特別限定。在一實施例中,光源110係於光學薄膜10之一側垂直地照射光,亦即,沿著光源110之發光面110a之光軸LA的入射光線Li係垂直於光學薄膜10的表面照射。於此,所述之光軸LA係一條假想線,其為發光面110a之法線。在一實施例中,影像擷取裝置120是正對著光學薄膜10的表面拍攝影像,也就是說,影像擷取裝置120係朝著平行於光源110之 發光面110a之光軸LA的方向拍攝光學薄膜10,亦即影像擷取裝置120並未呈傾斜的角度拍攝光學薄膜10。 As shown in FIG. 2, the light source 110 and the image capturing device 120 are disposed on two opposite sides of the optical film 10 being transferred. Specifically, the light source 110 irradiates light from one side of the optical film 10, and the image capturing device 120 receives a transmitted light image of light passing through the optical film 10 on the other side of the optical film 10. In this disclosure, the irradiation angle of light is not particularly limited. In one embodiment, the light source 110 irradiates light vertically on one side of the optical film 10, that is, the incident light Li along the optical axis LA of the light emitting surface 110 a of the light source 110 is irradiated perpendicularly to the surface of the optical film 10. Here, the optical axis LA is an imaginary line, which is a normal line of the light emitting surface 110a. In one embodiment, the image capturing device 120 captures an image facing the surface of the optical film 10, that is, the image capturing device 120 faces the light source 110 parallel to the light source 110. The optical film 10 is photographed in the direction of the optical axis LA of the light emitting surface 110a, that is, the image capturing device 120 does not photograph the optical film 10 at an inclined angle.

在一實施例中,缺陷檢測系統100更具有一狹縫板130,狹縫板130可由金屬、陶瓷或高分子材料所製成。狹縫板130配置於光源110與光學薄膜10之間,用以侷限光線行進的角度。在一實施例中,光源110之發光面110a之光軸LA與狹縫130s之中軸線(未標示)的延伸連線係垂直於光學薄膜10的表面,以限制穿過狹縫130s之入射光線Li垂直於光學薄膜10的表面照射。 In one embodiment, the defect detection system 100 further includes a slit plate 130. The slit plate 130 may be made of metal, ceramic, or polymer material. The slit plate 130 is disposed between the light source 110 and the optical film 10 to limit an angle of travel of the light. In an embodiment, the extended connecting line between the optical axis LA of the light emitting surface 110a of the light source 110 and the central axis (not labeled) of the slit 130s is perpendicular to the surface of the optical film 10 to limit incident light passing through the slit 130s Li is irradiated perpendicular to the surface of the optical film 10.

影像擷取裝置120可在平行於光學薄膜10之移動方向D1上移動,例如可由一移動單元來控制影像擷取裝置120的移動,以使影像擷取裝置120偏移光源110與狹縫130s的延伸連線配置。另一實施例中,亦可使影像擷取裝置120固定不動,而光源110與狹縫板130同時一體地於平行光學薄膜10之移動方向D1上移動(或相反方向),以使影像擷取裝置120偏移自光源110與狹縫130s的延伸連線。 The image capturing device 120 can be moved in a movement direction D1 parallel to the optical film 10. For example, a moving unit can control the movement of the image capturing device 120 so that the image capturing device 120 is offset from the light source 110 and the slit 130s. Extension wiring configuration. In another embodiment, the image capturing device 120 can also be fixed, and the light source 110 and the slit plate 130 can be moved simultaneously (or in the opposite direction) in the moving direction D1 of the parallel optical film 10 at the same time to enable image capturing. The device 120 is offset from the extension line of the light source 110 and the slit 130s.

由於入射光線Li穿過狹縫130s時會產生繞射效應,因此在光學薄膜10上會產生亮暗交錯的干涉條紋,以更便於檢測出光學薄膜10上的凹凸缺陷所造成的亮度變化。此外,當穿過狹縫130s的入射光線Li穿過光學薄膜10上厚度局部變化的區域P,即凹凸缺陷時,光線會產生散射。由於影像擷取裝置120係偏移自光源110與狹縫130s的延伸連線,故影像擷取裝置120可接收一部分的散射光線Ls,而影響影像擷取裝置120所接收的 光量。另一方面,當不具有凹凸缺陷的情況中,由於不會產生散射光線,故影像擷取裝置120所接收的光量不會變化。藉此,只要入射光線Li穿過光學薄膜10上的凹凸缺陷,光線即會產生散射而影響影像擷取裝置120所接收的光量,與未具有凹凸缺陷的區域相比之下,影像擷取裝置120所接收的影像亮度會有變化,故可提升凹凸缺陷區域的影像對比,而能更容易地檢測出是否有缺陷存在。 Because the incident light Li passes through the slit 130s, a diffraction effect is generated, so light and dark interlaced interference fringes are generated on the optical film 10, so that it is easier to detect the brightness change caused by the concave-convex defects on the optical film 10. In addition, when the incident light Li passing through the slit 130s passes through the area P where the thickness is locally changed on the optical film 10, that is, the concave-convex defect, the light is scattered. Since the image capturing device 120 is offset from the extended connection of the light source 110 and the slit 130s, the image capturing device 120 can receive a part of the scattered light Ls, which affects the image receiving device 120 receiving. The amount of light. On the other hand, when there is no concave-convex defect, since scattered light is not generated, the amount of light received by the image capturing device 120 does not change. As a result, as long as the incident light Li passes through the concave-convex defect on the optical film 10, the light will be scattered and affect the amount of light received by the image capturing device 120. Compared with the area without the concave-convex defect, the image capturing device The brightness of the received image 120 will change, so the contrast of the concave and convex defect area can be improved, and it can be more easily detected whether there is a defect.

其中,當影像擷取裝置120的影像感測器對準於光源110與狹縫130s的延伸連線時,所感測出的影像亮度為I0。接著,若影像擷取裝置120於平行光學薄膜10之移動方向D1上移動而偏移自光源110與狹縫130s的延伸連線時,所感測出的影像亮度下降至I1。在本揭露中,可根據I1/I0的比值範圍來調整影像擷取裝置120或光學薄膜10的偏移量。當I1/I0的範圍落在0.5~0.9之間,較佳的範圍I1/I0在0.8~0.85之間時,可足以觀察出光學薄膜10之凹凸缺陷所造成的亮度變化,而定位出缺陷位置點。在一實施例中,可於此製程中,同時標記此凹凸缺陷位置點於光學薄膜10之上。 Wherein, when the image sensor of the image capturing device 120 is aligned with the extended connection between the light source 110 and the slit 130s, the brightness of the image is I 0 . Then, if the image capturing device 120 moves in the moving direction D1 of the parallel optical film 10 and deviates from the extended connection line between the light source 110 and the slit 130s, the brightness of the sensed image decreases to I 1 . In the present disclosure, the offset of the image capturing device 120 or the optical film 10 can be adjusted according to the ratio range of I 1 / I 0 . When the range of I 1 / I 0 falls between 0.5 and 0.9, and the preferred range of I 1 / I 0 is between 0.8 and 0.85, it is sufficient to observe the brightness change caused by the concave-convex defects of the optical film 10, and Locate the defect location. In one embodiment, the position of the concave-convex defect can be marked on the optical film 10 at the same time in this process.

此外,缺陷檢測系統100更包括一影像處理單元12、一週期訊號產生單元14、一控制單元13及一顯示單元17。影像處理單元12可接收並處理影像擷取裝置120所發送的影像訊號,以對訊號進行影像處理,影像處理單元12例如可為影像擷取卡。週期訊號產生單元14可依據光學薄膜10的移送速度發送一週期 訊號,例如可為編碼器。控制單元13可耦接於影像處理單元12與顯示單元17,並接收來自週期訊號產生單元14的週期訊號,以及對影像擷取裝置120傳輸攝像訊號,控制單元13例如可為電腦。藉此,作業人員得以從控制單元13及顯示單元17取得影像擷取裝置120所拍攝之透射光圖像(資訊),以檢測影像中是否缺陷。顯示單元17可包括任何能對使用人員顯示影像的顯示裝置,例如液晶顯示器、LED顯示器等等,也可具有供使用人員以觸控方式操作介面的觸控功能。 In addition, the defect detection system 100 further includes an image processing unit 12, a periodic signal generating unit 14, a control unit 13 and a display unit 17. The image processing unit 12 may receive and process the image signal sent by the image capturing device 120 to perform image processing on the signal. The image processing unit 12 may be, for example, an image capturing card. The periodic signal generating unit 14 can send one cycle according to the transfer speed of the optical film 10 The signal may be, for example, an encoder. The control unit 13 may be coupled to the image processing unit 12 and the display unit 17, and receives a periodic signal from the periodic signal generating unit 14, and transmits a camera signal to the image capture device 120. The control unit 13 may be a computer, for example. Thereby, the operator can obtain the transmitted light image (information) captured by the image capturing device 120 from the control unit 13 and the display unit 17 to detect whether there is a defect in the image. The display unit 17 may include any display device capable of displaying an image to a user, such as a liquid crystal display, an LED display, or the like, and may also have a touch function for the user to operate the interface in a touch manner.

如第3圖所示,一實施例中,對光學薄膜10進行影像擷取步驟S901所得的二維影像250,即影像擷取裝置120所發送的影像訊號。二維影像250包括分別對應光學薄膜10之厚度局部變化的區域,即凹凸缺陷部分的一缺陷影像252與平坦部分,即表面平整的非缺陷部分的一平面影像254。一實施例中,影像擷取步驟S901所得之二維影像250中,缺陷影像252的像素灰階係異於平面影像254的像素灰階。如第3圖所示,缺陷影像252包括第一像素部分256與第二像素部分258,其中第一像素部分256係亮像素部分,第二像素部分258係暗像素部分。亮像素部分的像素灰階可高於平面影像254的像素灰階。暗像素部分的像素灰階可低於平面影像254的像素灰階。 As shown in FIG. 3, in an embodiment, the two-dimensional image 250 obtained by performing the image capturing step S901 on the optical film 10 is the image signal sent by the image capturing device 120. The two-dimensional image 250 includes regions corresponding to local changes in the thickness of the optical film 10, namely, a defect image 252 of a concave and convex defect portion and a flat portion, ie, a planar image 254 of a non-defective portion with a flat surface. In one embodiment, in the two-dimensional image 250 obtained in the image capturing step S901, the pixel gray level of the defect image 252 is different from the pixel gray level of the planar image 254. As shown in FIG. 3, the defective image 252 includes a first pixel portion 256 and a second pixel portion 258, wherein the first pixel portion 256 is a bright pixel portion and the second pixel portion 258 is a dark pixel portion. The pixel gray level of the bright pixel portion may be higher than the pixel gray level of the planar image 254. The pixel gray level of the dark pixel portion may be lower than the pixel gray level of the planar image 254.

由影像擷取步驟S901所得之二維影像250只能顯示出凹凸缺陷部分的二維變形量,即視角在正面對光學薄膜10之平坦部分方向時能檢測到的長度、寬度、直徑、半徑、面積等 變形量。但在一些情況下,對於光學薄膜10的品質評估,凹凸缺陷部分的第三維型變量,即高度形變資料比二維平面形變資料具有更重要的參考價值。 The two-dimensional image 250 obtained by the image capturing step S901 can only display the two-dimensional deformation amount of the bump defect portion, that is, the length, width, diameter, radius, Area, etc. Deformation. However, in some cases, for the quality evaluation of the optical film 10, the third-dimensional variable of the bump defect portion, that is, the height deformation data has more important reference value than the two-dimensional plane deformation data.

因此,根據本揭露之實施例概念,係可透過轉換步驟S902、顯示步驟S903得知凹凸缺陷部分相對於平坦部分凹下、凸起的程度,例如凹下、凸起區域的高度值,而大幅增加檢測光學薄膜10之品質的精準度。 Therefore, according to the embodiment concept of the present disclosure, it is possible to know the degree of depression and protrusion of the concave-convex defect portion relative to the flat portion through the conversion step S902 and the display step S903, such as the height value of the concave and convex areas, and greatly Increase the accuracy of detecting the quality of the optical film 10.

一實施例中,根據本揭露之實施例概念,係可透過轉換步驟S902、顯示步驟S903得知凹凸缺陷部分相對於平坦部分凹下、凸起的程度,例如凹下、凸起區域的最大高度值。 In an embodiment, according to the embodiment concept of the present disclosure, it is possible to know the degree of depression and protrusion of the concave-convex defect portion relative to the flat portion through the conversion step S902 and the display step S903, such as the maximum height of the concave and convex areas. value.

一實施例中,係由控制單元13執行轉換步驟S902、判斷步驟S904,並可由顯示單元17執行顯示步驟S903。 In one embodiment, the conversion unit S902 and the determination step S904 are executed by the control unit 13, and the display step S903 is executed by the display unit 17.

實施例中,可選擇性地先執行一訊號加強步驟S9021,以將二維影像250轉換成一加強二維影像350。 In the embodiment, a signal enhancement step S9021 may be selectively performed first to convert the two-dimensional image 250 into an enhanced two-dimensional image 350.

一實施例中,訊號加強步驟S9021可包括將如第3圖所示之二維影像250根據像素灰階轉換成如第4圖以所示之灰階顯示像素的加強二維影像350。 In an embodiment, the signal enhancement step S9021 may include converting the two-dimensional image 250 shown in FIG. 3 according to the pixel gray level into an enhanced two-dimensional image 350 of the gray-scale display pixels shown in FIG. 4.

一實施例中,訊號加強步驟S9021係以平面影像254設定為基準灰階值,並以基準灰階值對應調變缺陷影像252的灰階值。如第4圖所示,可將平面影像254從原來的基準灰階值像素轉換為灰階值更低的深色背景影像,以強化平面影像254與缺陷影像252之間的灰階差異,進一步凸顯出缺陷影像252的範圍, 以能夠更精確地擷取出缺陷影像252,以產生加強二維影像350。 In an embodiment, the signal enhancement step S9021 sets the planar image 254 as a reference grayscale value, and uses the reference grayscale value to correspond to the grayscale value of the defective image 252. As shown in Figure 4, the planar image 254 can be converted from the original reference grayscale value pixels to a darker background image with a lower grayscale value to enhance the grayscale difference between the planar image 254 and the defect image 252, further Highlights the extent of the defect image 252, In this way, the defective image 252 can be captured more accurately to generate an enhanced two-dimensional image 350.

接著,執行轉換步驟S902。轉換步驟S902包括一第一轉換步驟S9022,第一轉換步驟S9022包括將加強二維影像350轉換成一灰階值曲線,如第5圖所示。舉例來說,可透過影像處理方法進行轉換。例如能以平面影像254設定為基準灰階值,並以基準灰階值對應調變缺陷影像252的灰階值,以將加強二維影像350之缺陷影像252的每個位置之灰階值沿剖面線AB形成一對應之灰階值曲線。 Next, a conversion step S902 is performed. The conversion step S902 includes a first conversion step S9022. The first conversion step S9022 includes converting the enhanced two-dimensional image 350 into a grayscale value curve, as shown in FIG. 5. For example, conversion can be performed through image processing methods. For example, the planar image 254 can be set as a reference grayscale value, and the grayscale value of the defective image 252 can be adjusted correspondingly with the reference grayscale value to enhance the grayscale value of each position of the defective image 252 of the two-dimensional image 350. The section line AB forms a corresponding grayscale value curve.

一實施例中,如第5圖所示,顯示步驟S903可於顯示單元17顯示產生後之加強二維影像350之缺陷影像252沿剖面線AB所對應之灰階值曲線。 In an embodiment, as shown in FIG. 5, the display step S903 may display the grayscale value curve corresponding to the generated defect image 252 of the enhanced two-dimensional image 350 along the section line AB on the display unit 17.

舉例來說,於灰階值曲線中,缺陷影像252之第一像素部分256的灰階值係大於基準灰階值128,第二像素部分258的灰階值係小於基準灰階值128。基準灰階值並不限於第5圖所示的數值128,於其他實施例中也定義為其他數值。 For example, in the grayscale value curve, the grayscale value of the first pixel portion 256 of the defective image 252 is larger than the reference grayscale value 128, and the grayscale value of the second pixel portion 258 is smaller than the reference grayscale value 128. The reference grayscale value is not limited to the value 128 shown in FIG. 5, and is also defined as other values in other embodiments.

一實施例中,亦可省略前述訊號加強步驟S9021,而直接執行第一轉換步驟S9022,製作轉換針對二維影像250之缺陷影像252沿剖面線AB所對應之灰階值曲線。第一轉換步驟如前實施例所述,在此不再贅述。 In one embodiment, the aforementioned signal strengthening step S9021 may be omitted, and the first conversion step S9022 may be directly executed to generate a grayscale value curve corresponding to the defect image 252 converted to the two-dimensional image 250 along the section line AB. The first conversion step is as described in the previous embodiment, and details are not described herein again.

但第5圖之灰階值曲線能表示出缺陷凹下、凸起的程度,仍無法直接對應表示出凹凸缺陷部分的實際高度數值。 However, the gray-scale value curve in FIG. 5 can indicate the degree of depression and convexity of the defect, and still cannot directly correspond to the actual height value of the concave-convex defect portion.

因此,一實施例中,轉換步驟S902更可包括一第 二轉換步驟S9023,以將如第5圖所示之灰階值曲線轉換成一三維資料,其中三維資料包括光學薄膜10之凹凸缺陷部分相對於平坦部分的實際高度差值。 Therefore, in an embodiment, the conversion step S902 may further include a first step. The second conversion step S9023 is to convert the grayscale value curve shown in FIG. 5 into a three-dimensional data, where the three-dimensional data includes an actual height difference value of the uneven defect portion of the optical film 10 with respect to the flat portion.

一實施例中,第二轉換步驟S9023包括:一運算步驟及一比對步驟。例如對第5圖的灰階值曲線先進行一運算步驟後,再經比對步驟以產生一三維資料。 In one embodiment, the second conversion step S9023 includes: an operation step and a comparison step. For example, an operation step is performed on the grayscale value curve in FIG. 5, and then a comparison step is performed to generate a three-dimensional data.

一實施例中,運算步驟包括基於灰階值曲線的灰階值差、灰階值比例、灰階值微分、灰階值積分、或上述之組合進行運算,但不限於此,亦可採用其他的統計方式進行運算分析。以下實施例之第二轉換步驟,係以灰階值積分作為運算方式進行說明,但本發明並不以此為限。 In one embodiment, the calculation step includes performing calculations based on the grayscale value difference of the grayscale value curve, the grayscale value ratio, the grayscale value differentiation, the grayscale value integration, or a combination of the above, but is not limited thereto, and other Statistical analysis of operations. The second conversion step in the following embodiments is described by using the gray-scale value integration as an operation method, but the present invention is not limited thereto.

比對步驟包括:將運算步驟之結果,例如灰階曲線積分對應實際缺陷樣本數據,以得到一實際缺陷高度之三維資料。 The comparison step includes: integrating the result of the operation step, such as the integration of the gray scale curve with the actual defect sample data, to obtain a three-dimensional data of the actual defect height.

一實施例中,實際缺陷樣本數據的蒐集方式,請同時參照第7圖與第8圖。第7圖與第8圖係事先利用表面輪廓量測儀器量測缺陷樣本之實際三維資料,以得到缺陷樣本之三維資料。 In an embodiment, for the collection method of actual defect sample data, please refer to FIG. 7 and FIG. 8 at the same time. Figures 7 and 8 show the actual three-dimensional data of the defect sample by using a surface profile measuring instrument in advance to obtain the three-dimensional data of the defect sample.

請參照第7圖,在一實施例中,三維資料包括以顏色顯示高度的圖像471,及顯示顏色對應之高度值的圖像473。一實施例中,圖像471即可表示光學薄膜10之凹凸缺陷部分及附***坦部分的分佈輪廓,其中高度為0的部分即為平坦部分,高度 大於、小於0的部分即為凹凸缺陷部分,且相對於平坦部分,即數值0的差異數值即為凹凸缺陷部分實際凹下或凸起的高度數值。使用者能透過此資料直接了解光學薄膜10之凹凸缺陷部分相對於平坦部分凹下或凸起的實質高度值。 Referring to FIG. 7, in an embodiment, the three-dimensional data includes an image 471 displaying a height in color, and an image 473 displaying a height value corresponding to the color. In an embodiment, the image 471 can represent the distribution contours of the concave-convex defect portions and the nearby flat portions of the optical film 10, where the portion with a height of 0 is the flat portion, and the height The part greater than, less than 0 is the unevenness part, and the difference value with respect to the flat part, that is, the value 0 is the height value of the actual concave or convex part of the unevenness part. The user can directly understand the actual height value of the concave and convex defect portion of the optical film 10 with respect to the concave or convex portion of the flat portion through this data.

一實施例中,係將第7圖所示之最大高度做為第6圖所示之灰階曲線積分與實質高度值之關係中的對應高度。 In one embodiment, the maximum height shown in FIG. 7 is used as the corresponding height in the relationship between the gray scale curve integral and the actual height value shown in FIG. 6.

請參照第8圖,另一實施例中,三維資料包括凹凸缺陷部分的剖面位置與對應之高度差值的關係曲線。使用者能透過此資料直接了解光學薄膜10之凹凸缺陷部分相對於平坦部分凹下或凸起的實質高度值。 Referring to FIG. 8, in another embodiment, the three-dimensional data includes a relationship curve between a cross-sectional position of a concave and convex defect portion and a corresponding height difference. The user can directly understand the actual height value of the concave and convex defect portion of the optical film 10 with respect to the concave or convex portion of the flat portion through this data.

一實施例中,可以第8圖所示之最大高度值做為第6圖所示之灰階曲線積分與實質高度值之關係中的對應高度。 In an embodiment, the maximum height value shown in FIG. 8 can be used as the corresponding height in the relationship between the gray scale curve integral and the actual height value shown in FIG. 6.

呈上所述,經過第二轉換步驟S9023後,可獲得如第6圖所示之灰階曲線積分與實質高度值之關係圖。 As mentioned above, after the second conversion step S9023, the relationship between the grayscale curve integral and the actual height value shown in FIG. 6 can be obtained.

接著,一實施例中,判斷步驟S904可根據凹凸缺陷部分的實質高度值判斷光學薄膜10的形變程度並設定產品出貨規格水準。一實施例中,如第6圖所示,舉例來說,可利用實質高度值的設定規格來作為評估依據。舉例來說,實質高度值大於設定規格的凹凸缺陷部分可用作評估光學薄膜10是否能作為產品出貨的依據,小於設定規格的凹凸缺陷部分則可忽略不計。 Next, in an embodiment, the determination step S904 may determine the deformation degree of the optical film 10 according to the substantial height value of the concave-convex defect portion and set the product shipping specification level. In an embodiment, as shown in FIG. 6, for example, a setting specification of a substantial height value may be used as an evaluation basis. For example, the unevenness portion having a substantial height value greater than a set specification can be used as a basis for evaluating whether the optical film 10 can be used as a basis for product shipment, and the unevenness portion that is smaller than the set specification can be ignored.

一實施例中,設定規格可僅設定單一個數值,或依不同的評估標準使用不同的數值。一實施例中,設定規格為5μm, 若光學薄膜10在1cm2面積中發現6個以上實質高度值大於此設定規格的凹凸缺陷部分,表示缺陷的群集密度過高,則判定光學薄膜10品質不良,無法作為產品出貨。另一實施例中,設定規格為7μm,若光學薄膜10發現有實質高度值大於此設定規格的凹凸缺陷部分,無論缺陷數量多少,皆判定光學薄膜10品質不良,無法作為產品出貨。判斷步驟S904並不限於利用控制單元13自動化判斷。其他實施例中,一些情況下,也可藉由操作人員透過顯示單元17所顯示的資訊進行人為判斷。本揭露不限於此,可根據實際需求使用其他的評估方法。 In one embodiment, the setting specification may set only a single value, or use different values according to different evaluation standards. In one embodiment, the setting specification is 5 μm. If the optical film 10 finds more than 6 concave-convex defect portions with a substantial height value greater than the setting specification in an area of 1 cm 2 , which indicates that the cluster density of the defects is too high, the quality of the optical film 10 is judged to be poor. , Cannot be shipped as a product. In another embodiment, the set specification is 7 μm. If the optical film 10 finds concave and convex defect portions with a substantial height value greater than the set specification, regardless of the number of defects, the optical film 10 is judged to be of poor quality and cannot be shipped as a product. The determination step S904 is not limited to the automatic determination by the control unit 13. In other embodiments, in some cases, an operator may also make an artificial judgment by using the information displayed by the display unit 17. This disclosure is not limited to this, and other evaluation methods can be used according to actual needs.

根據以上,本發明之實施例中,係將影像擷取步驟所得之只能提供二維平面尺寸資訊的缺陷影像,透過轉換步驟轉換成包括缺陷實質高度值的三維資訊,並能透過缺陷高度資訊判斷光學薄膜之凹凸缺陷部分在高度上的變形程度,因此能更精準評估光學薄膜的品質。 According to the above, in the embodiment of the present invention, the defect image that can only provide two-dimensional plane size information obtained in the image capturing step is converted into three-dimensional information including the actual height value of the defect through the conversion step, and the defect height information can be passed through Determining the degree of deformation of the concave and convex defect portion of the optical film in height, so that the quality of the optical film can be more accurately evaluated.

綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In summary, although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.

Claims (10)

一種缺陷檢查方法,包括:一影像擷取步驟,包括對一光學薄膜的一表面進行拍攝動作以產生一二維影像;一轉換步驟,包括將該二維影像轉換成一灰階值曲線,該灰階值曲線包括對應該光學薄膜之一凹凸缺陷部分的缺陷灰階值曲線;及一判斷步驟,包括根據該缺陷灰階值曲線判斷該光學薄膜之該凹凸缺陷部分的形變情況。A defect inspection method includes: an image capturing step including photographing a surface of an optical film to generate a two-dimensional image; a conversion step including converting the two-dimensional image into a grayscale value curve, the grayscale The step value curve includes a grayscale value curve of a defect corresponding to a concave and convex defect portion of the optical film; and a determining step includes determining a deformation condition of the concave and convex defect portion of the optical film according to the grayscale value curve of the defect. 如申請專利範圍第1項所述之缺陷檢查方法,其中該轉換步驟包括將該影像擷取步驟所得該二維影像根據像素灰階轉換成該灰階值曲線。The defect inspection method according to item 1 of the scope of the patent application, wherein the conversion step includes converting the two-dimensional image obtained by the image capturing step into the grayscale value curve according to the pixel grayscale. 如申請專利範圍第1項所述之缺陷檢查方法,其中該二維影像包括分別對應該光學薄膜之該凹凸缺陷部分與一平坦部分的缺陷影像與平面影像,該缺陷影像的像素灰階係異於該平面影像的像素灰階。The defect inspection method according to item 1 of the scope of patent application, wherein the two-dimensional image includes a defect image and a planar image corresponding to the uneven defect portion and a flat portion of the optical film, respectively, and the grayscale of the defect image is different. The gray level of pixels in the plane image. 如申請專利範圍第1項所述之缺陷檢查方法,更包括一資料顯示步驟,包括將該灰階值曲線顯示在一顯示單元中,其中顯示的資料包括該二維影像之缺陷影像的剖面位置與對應灰階值的關係曲線。The defect inspection method according to item 1 of the scope of patent application, further comprising a data display step, including displaying the grayscale value curve in a display unit, wherein the displayed data includes a cross-sectional position of the defect image of the two-dimensional image. Relationship with the corresponding grayscale value. 一種缺陷檢查方法,包括:一影像擷取步驟,包括對一光學薄膜的一表面進行拍攝動作以產生一二維影像;一轉換步驟,包括將根據該二維影像的資料轉換成一三維資料,該三維資料包括該光學薄膜之一凹凸缺陷部分相對於一平坦部分的一高度差值。A defect inspection method includes: an image capturing step including performing a photographing action on a surface of an optical film to generate a two-dimensional image; a conversion step including converting data based on the two-dimensional image into a three-dimensional data, The three-dimensional data includes a height difference between an uneven defect portion of the optical film and a flat portion. 如申請專利範圍第5項所述之缺陷檢查方法,更包括於該轉換步驟前,進行一訊號加強步驟,其中該訊號加強步驟係以基準灰階值對應調變該二維影像而形成一灰階顯示像素的影像。The defect inspection method described in item 5 of the scope of patent application, further includes performing a signal enhancement step before the conversion step, wherein the signal enhancement step is to adjust the two-dimensional image correspondingly with a reference gray level value to form a gray Image of the display pixel. 如申請專利範圍第5項所述之缺陷檢查方法,其中該轉換步驟包括:將該二維影像轉換成一灰階值曲線;及將該灰階值曲線轉換成該三維資料。The defect inspection method according to item 5 of the scope of patent application, wherein the conversion step includes: converting the two-dimensional image into a grayscale value curve; and converting the grayscale value curve into the three-dimensional data. 如申請專利範圍第7項所述之缺陷檢查方法,其中將該灰階值曲線轉換成該三維資料包括基於灰階值差、灰階值比例、灰階值微分、灰階值積分、或上述之組合做運算。The defect inspection method according to item 7 of the scope of patent application, wherein converting the grayscale value curve into the three-dimensional data includes based on grayscale value difference, grayscale value ratio, grayscale value differentiation, grayscale value integration, or the above Combination to do the operation. 如申請專利範圍第5項所述之缺陷檢查方法,更包括一判斷步驟,包括根據該高度差值判斷該光學薄膜的形變程度。The defect inspection method described in item 5 of the scope of patent application, further includes a determining step, including determining a degree of deformation of the optical film according to the height difference. 一種缺陷檢測系統,用於檢測一光學薄膜,並包括:一光源,配置於該光學薄膜之一側;一影像擷取裝置,配置於該光學薄膜之另一側;及一狹縫板,具有一狹縫,該狹縫板配置於該光源與該光學薄膜之間,以使一入射光線穿過該狹縫;其中,該影像擷取裝置係偏移自該光源與該狹縫的延伸連線,其中當該影像擷取裝置的影像感測器對準於該光源與該狹縫的延伸連線時,所感測出的影像亮度為I0;當該影像擷取裝置於平行該光學薄膜之移動方向上偏移自該光源與該狹縫的延伸連線時,所感測出的影像亮度為I1;且其中,I1/I0係為0.5~0.9可觀測該光學薄膜的一缺陷位置點。A defect detection system for detecting an optical film and includes: a light source disposed on one side of the optical film; an image capturing device disposed on the other side of the optical film; and a slit plate having A slit, the slit plate is disposed between the light source and the optical film, so that an incident light passes through the slit; wherein the image capturing device is offset from the extension of the light source and the slit; Line, wherein when the image sensor of the image capture device is aligned with the extended connection of the light source and the slit, the brightness of the image sensed is I 0 ; when the image capture device is parallel to the optical film When the moving direction is shifted from the extended line connecting the light source and the slit, the brightness of the image sensed is I 1 ; and I 1 / I 0 is 0.5 to 0.9, and a defect of the optical film can be observed. 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