TWI629467B - 晶圓檢查方法及晶圓檢查裝置 - Google Patents
晶圓檢查方法及晶圓檢查裝置 Download PDFInfo
- Publication number
- TWI629467B TWI629467B TW105126193A TW105126193A TWI629467B TW I629467 B TWI629467 B TW I629467B TW 105126193 A TW105126193 A TW 105126193A TW 105126193 A TW105126193 A TW 105126193A TW I629467 B TWI629467 B TW I629467B
- Authority
- TW
- Taiwan
- Prior art keywords
- optical system
- wafer
- defect
- detected
- inspection method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8803—Visual inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-198513 | 2015-10-06 | ||
JP2015198513A JP6493136B2 (ja) | 2015-10-06 | 2015-10-06 | ウェーハ検査方法およびウェーハ検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201719153A TW201719153A (zh) | 2017-06-01 |
TWI629467B true TWI629467B (zh) | 2018-07-11 |
Family
ID=58538652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105126193A TWI629467B (zh) | 2015-10-06 | 2016-08-17 | 晶圓檢查方法及晶圓檢查裝置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6493136B2 (ko) |
KR (1) | KR101885614B1 (ko) |
TW (1) | TWI629467B (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107976401B (zh) * | 2016-10-24 | 2020-05-01 | 京元电子股份有限公司 | 半导体组件外观检验设备及其光学路径结构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000162141A (ja) * | 1998-11-27 | 2000-06-16 | Hitachi Ltd | 欠陥検査装置および方法 |
JP2008275540A (ja) * | 2007-05-02 | 2008-11-13 | Hitachi High-Technologies Corp | パターン欠陥検査装置および方法 |
CN101241084B (zh) * | 2007-02-06 | 2011-05-25 | 台湾积体电路制造股份有限公司 | 晶圆检查的方法和*** |
JP2013238534A (ja) * | 2012-05-16 | 2013-11-28 | Shin Etsu Handotai Co Ltd | ウエーハ表面の評価方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57132044A (en) * | 1981-02-10 | 1982-08-16 | Hitachi Metals Ltd | Discriminating method of surface defect |
KR100327340B1 (ko) * | 1999-09-30 | 2002-03-06 | 윤종용 | 웨이퍼 표면 검사방법 |
JP2001153635A (ja) * | 1999-11-29 | 2001-06-08 | Sumitomo Metal Ind Ltd | 半導体ウェ−ハの品質評価方法 |
JP4761427B2 (ja) | 2004-07-02 | 2011-08-31 | 東京エレクトロン株式会社 | 被処理体表面検査装置 |
JP4343911B2 (ja) * | 2006-02-06 | 2009-10-14 | 株式会社日立製作所 | 欠陥検査装置 |
US7912658B2 (en) * | 2008-05-28 | 2011-03-22 | Kla-Tencor Corp. | Systems and methods for determining two or more characteristics of a wafer |
JP5433201B2 (ja) * | 2008-10-23 | 2014-03-05 | 株式会社Sumco | ウェーハ裏面の評価方法 |
-
2015
- 2015-10-06 JP JP2015198513A patent/JP6493136B2/ja active Active
-
2016
- 2016-08-17 TW TW105126193A patent/TWI629467B/zh active
- 2016-09-12 KR KR1020160116964A patent/KR101885614B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000162141A (ja) * | 1998-11-27 | 2000-06-16 | Hitachi Ltd | 欠陥検査装置および方法 |
CN101241084B (zh) * | 2007-02-06 | 2011-05-25 | 台湾积体电路制造股份有限公司 | 晶圆检查的方法和*** |
JP2008275540A (ja) * | 2007-05-02 | 2008-11-13 | Hitachi High-Technologies Corp | パターン欠陥検査装置および方法 |
JP2013238534A (ja) * | 2012-05-16 | 2013-11-28 | Shin Etsu Handotai Co Ltd | ウエーハ表面の評価方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101885614B1 (ko) | 2018-08-06 |
KR20170041128A (ko) | 2017-04-14 |
JP6493136B2 (ja) | 2019-04-03 |
JP2017072443A (ja) | 2017-04-13 |
TW201719153A (zh) | 2017-06-01 |
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