TWI624080B - 發光二極體晶片 - Google Patents
發光二極體晶片 Download PDFInfo
- Publication number
- TWI624080B TWI624080B TW103120945A TW103120945A TWI624080B TW I624080 B TWI624080 B TW I624080B TW 103120945 A TW103120945 A TW 103120945A TW 103120945 A TW103120945 A TW 103120945A TW I624080 B TWI624080 B TW I624080B
- Authority
- TW
- Taiwan
- Prior art keywords
- pattern
- emitting diode
- convex pattern
- concave
- convex
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 76
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims description 17
- 230000032823 cell division Effects 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 9
- 238000000605 extraction Methods 0.000 abstract description 16
- 239000010410 layer Substances 0.000 description 72
- 235000012431 wafers Nutrition 0.000 description 54
- 210000004027 cell Anatomy 0.000 description 6
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 5
- 229910002601 GaN Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 210000004508 polar body Anatomy 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130071583A KR20140148098A (ko) | 2013-06-21 | 2013-06-21 | 발광 다이오드 칩 |
??10-2013-0071583 | 2013-06-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201513393A TW201513393A (zh) | 2015-04-01 |
TWI624080B true TWI624080B (zh) | 2018-05-11 |
Family
ID=52104921
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103120945A TWI624080B (zh) | 2013-06-21 | 2014-06-18 | 發光二極體晶片 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20140148098A (ko) |
TW (1) | TWI624080B (ko) |
WO (1) | WO2014204271A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108987425B (zh) * | 2018-07-19 | 2020-09-18 | 豪威半导体(上海)有限责任公司 | 微led显示器及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100095134A (ko) * | 2009-02-20 | 2010-08-30 | 엘지이노텍 주식회사 | 발광소자 및 그 제조방법 |
US20110284894A1 (en) * | 2010-05-24 | 2011-11-24 | Hee Young Beom | Light emitting device, light emitting device package, and lighting device system |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007258338A (ja) * | 2006-03-22 | 2007-10-04 | Rohm Co Ltd | 半導体発光素子 |
KR101081135B1 (ko) * | 2010-03-15 | 2011-11-07 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
KR20120005662A (ko) * | 2010-07-09 | 2012-01-17 | 엘지이노텍 주식회사 | 발광 소자 |
-
2013
- 2013-06-21 KR KR1020130071583A patent/KR20140148098A/ko not_active Application Discontinuation
-
2014
- 2014-06-18 TW TW103120945A patent/TWI624080B/zh active
- 2014-06-20 WO PCT/KR2014/005482 patent/WO2014204271A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100095134A (ko) * | 2009-02-20 | 2010-08-30 | 엘지이노텍 주식회사 | 발광소자 및 그 제조방법 |
US20110284894A1 (en) * | 2010-05-24 | 2011-11-24 | Hee Young Beom | Light emitting device, light emitting device package, and lighting device system |
Also Published As
Publication number | Publication date |
---|---|
KR20140148098A (ko) | 2014-12-31 |
TW201513393A (zh) | 2015-04-01 |
WO2014204271A1 (en) | 2014-12-24 |
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