TWI619056B - Curved touch panel and its preparation method - Google Patents
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Abstract
本創作的彎曲的觸控面板包含一第一玻璃基板、一第一感應電極層、一第二玻璃基板、一第二感應電極層及一第一黏膠層，該第一感應電極層疊設於該第一玻璃基板的內表面上，該第二感應電極層疊設於該第二玻璃基板的內表面上，且該第一黏膠層貼附於該第一感應電極層與該第二感應電極層之間，該第一玻璃基板的內表面、該第一玻璃基板的外表面、該第二玻璃基板的內表面及該第二玻璃基板的外表面為曲面。所述彎曲的觸控面板兼具有良好溫度耐受性、良好表面耐磨性及長使用壽命之優點。The curved touch panel of the present invention comprises a first glass substrate, a first sensing electrode layer, a second glass substrate, a second sensing electrode layer and a first adhesive layer. The first sensing electrodes are stacked on the first sensing electrode. On the inner surface of the first glass substrate, the second sensing electrode is laminated on the inner surface of the second glass substrate, and the first adhesive layer is attached to the first sensing electrode layer and the second sensing electrode. The inner surface of the first glass substrate, the outer surface of the first glass substrate, the inner surface of the second glass substrate, and the outer surface of the second glass substrate are curved surfaces between the layers. The curved touch panel has the advantages of good temperature resistance, good surface wear resistance and long service life.
Description
本創作係關於一種觸控面板，尤其是指一種彎曲的觸控面板。本創作另關於一種觸控面板之製法，尤其是指一種製備前述彎曲的觸控面板之製法。The present invention relates to a touch panel, and more particularly to a curved touch panel. The present invention relates to a method for manufacturing a touch panel, and more particularly to a method for preparing the curved touch panel.
為了使生活更為方便，促使科技的快速發展，連帶提昇了半導 體的製程能力，使得早期的顯示螢幕從僅能看發展到能觸控使用，甚至將可觸 控的裝置製備的非常小而得以應用在個人行動裝置上，使每個人都能帶著這些 個人行動裝置在全世界的任何地方使用，提升了生活的方便性、娛樂性。In order to make life more convenient and promote the rapid development of technology, the semiconductor process capability has been enhanced, which has enabled the early display screen to be developed from touch-only to touch-sensitive use, and even the touch-sensitive device is very small. It is applied to personal mobile devices, enabling everyone to use these personal mobile devices anywhere in the world, improving the convenience and entertainment of life.
如圖9及圖10所示，現有技術的一種彎曲的觸控面板80包含有二PET(polyethylene terephthalate，聚對苯二甲酸乙二酯)基板81、二感應電極層82及一黏著層83。於製作時，該等感應電極層82係分別經由微影技術形成於該等PET基板81的內側面上；然後，依據需求將該等PET基板81彎曲後，令該等感應電極層82透過該黏著層83相貼合，即獲得該彎曲的觸控面板80。As shown in FIG. 9 and FIG. 10 , a curved touch panel 80 of the prior art comprises a PET (polyethylene terephthalate) substrate 81 , two sensing electrode layers 82 , and an adhesive layer 83 . At the time of fabrication, the sensing electrode layers 82 are formed on the inner side surfaces of the PET substrates 81 via lithography; then, the PET substrates 81 are bent as needed, and the sensing electrode layers 82 are passed through the electrodes. The adhesive layer 83 is attached to each other, that is, the curved touch panel 80 is obtained.
然而，PET基板81對於溫度變化較為敏感，易受溫度影響而產生明顯的熱脹冷縮現象，使所述現有技術的彎曲的觸控面板80產生分層剝離的現象，進而損壞。又，PET基板81之表面強度較低，於長期使用下容易產生深淺不一的刮痕，從而破壞感應電極層82並影響到所述彎曲的觸控面板80的觸控感應功能，縱然現有技術為保護PET基板81通常會於PET基板81的外側面(未設置有感應電極層82之一側面)上設置一防刮保護層，但於長期使用下該防刮保護層會因逐漸磨耗而消失，仍會導致PET基板81的毀損及觸控感應功能的不良。However, the PET substrate 81 is sensitive to temperature changes, is susceptible to temperature, and causes significant thermal expansion and contraction, causing the prior art curved touch panel 80 to be delaminated and damaged. Moreover, the surface strength of the PET substrate 81 is low, and it is easy to produce scratches of different depths under long-term use, thereby damaging the sensing electrode layer 82 and affecting the touch sensing function of the curved touch panel 80, even though the prior art In order to protect the PET substrate 81, a scratch-resistant protective layer is usually disposed on the outer surface of the PET substrate 81 (the side surface of the sensing electrode layer 82 is not provided), but the scratch-resistant protective layer may disappear due to gradual wear under long-term use. It still causes damage to the PET substrate 81 and poor touch sensing function.
因此，現有技術的彎曲的觸控面板80係具有溫度耐受性差、表面耐磨性差等缺點，故容易損壞而使用壽命短。Therefore, the curved touch panel 80 of the prior art has disadvantages such as poor temperature tolerance and poor surface wear resistance, so that it is easily damaged and has a short service life.
鑒於上述現有技術的缺點，本創作的一目的在於提供一種彎曲的觸控面板，其溫度耐受性及表面耐磨性均佳，從而具有使用壽命長之優點。In view of the above-mentioned shortcomings of the prior art, it is an object of the present invention to provide a curved touch panel which is excellent in temperature tolerance and surface abrasion resistance, thereby having the advantage of long service life.
為達到前述的創作目的，本創作所採取的技術手段為令該彎曲的觸控面板，其中包含： 一第一玻璃基板，其中包含有一內表面及一相反於該內表面的外表面； 一第一感應電極層，其疊設於該第一玻璃基板的內表面上； 一第二玻璃基板，其中包含有一內表面及一相反於該內表面的外表面； 一第二感應電極層，其疊設於該第二玻璃基板的內表面上；以及 一第一黏膠層，其貼附於該第一感應電極層與該第二感應電極層之間； 其中，該第一玻璃基板的內表面、該第一玻璃基板的外表面、該第二玻璃基板的內表面及該第二玻璃基板的外表面皆為曲面。In order to achieve the foregoing creative purpose, the technical means adopted by the present invention is to make the curved touch panel comprising: a first glass substrate including an inner surface and an outer surface opposite to the inner surface; a sensing electrode layer stacked on an inner surface of the first glass substrate; a second glass substrate including an inner surface and an outer surface opposite to the inner surface; a second sensing electrode layer, the stack And disposed on the inner surface of the second glass substrate; and a first adhesive layer attached between the first sensing electrode layer and the second sensing electrode layer; wherein an inner surface of the first glass substrate The outer surface of the first glass substrate, the inner surface of the second glass substrate, and the outer surface of the second glass substrate are curved surfaces.
基於上述技術手段，所述彎曲的觸控面板至少具有下述優點：一、避免於因溫度變化所衍生的分層剝離之現象發生；二、具有良好表面強度從而於未設置額外的防刮保護層之條件下，即可提供第一感應電極層與第二感應電極層有效的保護作用，使觸控感應功能保持正常。Based on the above technical means, the curved touch panel has at least the following advantages: first, avoiding the phenomenon of delamination due to temperature change; second, having good surface strength so that no additional scratch protection is provided Under the condition of the layer, the first sensing electrode layer and the second sensing electrode layer can provide effective protection, so that the touch sensing function remains normal.
因此，所述彎曲的觸控面板兼具有良好溫度耐受性、良好表面耐磨性及長使用壽命之優點。Therefore, the curved touch panel has the advantages of good temperature resistance, good surface wear resistance and long service life.
較佳的是，所述的彎曲的觸控面板還包含一第三玻璃基板及一第二黏膠層，該第三玻璃基板包含有一內表面、一相反於該內表面的外表面及一貫穿成形於該內表面與外表面之間的貫孔，該第二黏膠層貼附於該第三玻璃基板的內表面與該第一玻璃基板的外表面之間，且該第三玻璃基板的內表面及該第三玻璃基板的外表面皆為曲面。Preferably, the curved touch panel further includes a third glass substrate and a second adhesive layer, the third glass substrate includes an inner surface, an outer surface opposite to the inner surface, and a through a through hole formed between the inner surface and the outer surface, the second adhesive layer is attached between the inner surface of the third glass substrate and the outer surface of the first glass substrate, and the third glass substrate Both the inner surface and the outer surface of the third glass substrate are curved surfaces.
較佳的是，該第一玻璃基板的軟化溫度、該第二玻璃基板的軟化溫度、該第三玻璃基板的軟化溫度、該第一感應電極層的熔點、該第二感應電極層的熔點皆高於該第一黏膠層的軟化溫度，且該第一玻璃基板的軟化溫度、該第二玻璃基板的軟化溫度、該第三玻璃基板的軟化溫度、該第一感應電極層的熔點、該第二感應電極層的熔點皆高於該第二黏膠層的軟化溫度。Preferably, the softening temperature of the first glass substrate, the softening temperature of the second glass substrate, the softening temperature of the third glass substrate, the melting point of the first sensing electrode layer, and the melting point of the second sensing electrode layer are both Higher than the softening temperature of the first adhesive layer, and the softening temperature of the first glass substrate, the softening temperature of the second glass substrate, the softening temperature of the third glass substrate, the melting point of the first sensing electrode layer, The melting point of the second sensing electrode layer is higher than the softening temperature of the second adhesive layer.
較佳的是，該第一玻璃基板的軟化溫度、該第二玻璃基板及該第三玻璃基板的軟化溫度為180°C至300°C，該第一感應電極層的熔點及該第二感應電極層的熔點為310°C至800°C，該第一黏膠層的軟化溫度為100°C至290°C，該第二黏膠層的軟化溫度為100°C至290°C。Preferably, the softening temperature of the first glass substrate, the softening temperature of the second glass substrate and the third glass substrate are 180 ° C to 300 ° C, the melting point of the first sensing electrode layer and the second sensing The electrode layer has a melting point of 310 ° C to 800 ° C, the first adhesive layer has a softening temperature of 100 ° C to 290 ° C, and the second adhesive layer has a softening temperature of 100 ° C to 290 ° C.
較佳的是，該第一玻璃基板的厚度為0.2微米(μm)至8微米，該第二玻璃基板的厚度為0.2微米至8微米，該第三玻璃基板的厚度為0.2微米至8微米。Preferably, the first glass substrate has a thickness of 0.2 micrometers (μm) to 8 micrometers, the second glass substrate has a thickness of 0.2 micrometers to 8 micrometers, and the third glass substrate has a thickness of 0.2 micrometers to 8 micrometers.
較佳的是，該第一感應電極層的材質包含氧化銦錫或氧化鋅，該第二感應電極層的材質包含氧化銦錫(indium tin oxide，ITO)或氧化鋅(ZnO)。Preferably, the material of the first sensing electrode layer comprises indium tin oxide or zinc oxide, and the material of the second sensing electrode layer comprises indium tin oxide (ITO) or zinc oxide (ZnO).
較佳的是，該第一感應電極層的厚度為110奈米至200奈米，該第二感應電極層的厚度為110奈米至200奈米。Preferably, the first sensing electrode layer has a thickness of 110 nm to 200 nm, and the second sensing electrode layer has a thickness of 110 nm to 200 nm.
較佳的是，該第一黏膠層的厚度為300微米至800微米，該第二黏膠層的厚度為300微米至800微米。Preferably, the first adhesive layer has a thickness of 300 micrometers to 800 micrometers, and the second adhesive layer has a thickness of 300 micrometers to 800 micrometers.
本創作另提供一種彎曲的觸控面板的製法，其步驟包含： 形成一第一感應電極層於一第一玻璃基板的內表面上、形成一第二感應電極層於一第二玻璃基板的內表面上並提供一成型模具，其中，該成型模具包含有一頂面、一凹設於該頂面上的塑形面、一位置相反於該頂面的底面、一貫穿成型於該塑形面與該底面之間的通道及一成型於該塑形面與頂面之間且於該通道連通的塑形空間，且該塑形面為一曲面； 以一第一黏膠層貼合該第一感應電極層與該第二感應電極層，以獲得一待成型體，其中，該第一玻璃基板的軟化溫度、該第二玻璃基板的軟化溫度、該第一感應電極層的熔點、該第二感應電極層的熔點皆高於該第一黏膠層的軟化溫度； 放置該待成型體於該成型模具的塑形面的頂側並令一真空袋包覆該成型模具及該待成型體，其中，該真空袋具有一開口，該開口位於該成型模具的底面之外且與該通道相連通； 加熱以使該第一黏膠層軟化並以一抽氣幫浦經由該開口及該開口與該通道對該真空袋內部及塑形空間抽氣，從而使該待成型體彎曲貼附於該成型模具的塑形面上並使該真空袋緊貼於該成型模具及彎曲的待成型體上，其中，該第一玻璃基板的內表面、該第一玻璃基板的外表面、該第二玻璃基板的內表面及該第二玻璃基板的外表面皆為曲面；以及 冷卻固化該軟化的第一黏膠層，以獲得所述彎曲的觸控面板。The present invention further provides a method for manufacturing a curved touch panel, the method comprising: forming a first sensing electrode layer on an inner surface of a first glass substrate to form a second sensing electrode layer in a second glass substrate a molding die is provided on the surface, wherein the molding die comprises a top surface, a molding surface recessed on the top surface, a bottom surface opposite to the top surface, and a molding surface formed therethrough a passage between the bottom surface and a molding space formed between the molding surface and the top surface and communicating with the passage, and the molding surface is a curved surface; the first adhesive layer is attached to the first surface a sensing electrode layer and the second sensing electrode layer to obtain a body to be molded, wherein a softening temperature of the first glass substrate, a softening temperature of the second glass substrate, a melting point of the first sensing electrode layer, and a second The melting point of the sensing electrode layer is higher than the softening temperature of the first adhesive layer; placing the body to be molded on the top side of the molding surface of the molding die and allowing a vacuum bag to cover the molding die and the body to be molded, Wherein the vacuum bag has an opening The opening is located outside the bottom surface of the molding die and communicates with the passage; heating to soften the first adhesive layer and passing the air pump through the opening and the opening and the passage to the inside of the vacuum bag The shaping space is evacuated, so that the body to be molded is bent and attached to the molding surface of the molding die, and the vacuum bag is in close contact with the molding die and the curved body to be molded, wherein the first glass substrate The inner surface, the outer surface of the first glass substrate, the inner surface of the second glass substrate, and the outer surface of the second glass substrate are all curved surfaces; and cooling and curing the softened first adhesive layer to obtain the Curved touch panel.
藉由上述的步驟，由所述彎曲的觸控面板的製法所製得的彎曲的觸控面板至少具有下述優點：一、避免於因溫度變化所衍生的分層剝離之現象發生；二、具有良好表面強度從而於未設置額外的防刮保護層之條件下，即可提供第一感應電極層與第二感應電極層有效的保護作用，使觸控感應功能保持正常。Through the above steps, the curved touch panel produced by the method of the curved touch panel has at least the following advantages: first, avoiding the phenomenon of delamination caused by temperature changes; With good surface strength, the first sensing electrode layer and the second sensing electrode layer can be effectively protected under the condition that no additional scratch-resistant protective layer is provided, so that the touch sensing function remains normal.
因此，所述彎曲的觸控面板的製法係具有能製得一兼具有良好溫度耐受性、良好表面耐磨性及長使用壽命等特點的彎曲的觸控面板之優點。Therefore, the method for manufacturing the curved touch panel has the advantage of being able to produce a curved touch panel having good temperature resistance, good surface wear resistance and long service life.
較佳的是，所述加熱以使該第一黏膠層軟化並以一抽氣幫浦經由該開口及該開口與該通道對該真空袋內部及塑形空間抽氣，從而使該待成型體彎曲貼附於該成型模具的塑形面上並使該真空袋緊貼於該成型模具及彎曲的待成型體上之步驟包含：以100°C至290°C之溫度使該第一黏膠層軟化並以一抽氣幫浦經由該開口及該開口與該通道對該真空袋內部及塑形空間抽氣至真空度為1×10 -1托耳(torr)至1×10 -7托耳，從而使該待成型體彎曲貼附於該成型模具的塑形面上並使該真空袋緊貼於該成型模具及彎曲的待成型體上。 Preferably, the heating is to soften the first adhesive layer and evacuate the inside of the vacuum bag and the shaping space through the opening and the opening through an opening, thereby making the to-be formed The step of attaching the body to the molding surface of the molding die and attaching the vacuum bag to the molding die and the curved body to be molded comprises: making the first adhesive at a temperature of 100 ° C to 290 ° C The rubber layer is softened and the inside of the vacuum bag and the shaping space are evacuated to a vacuum of 1×10 −1 torr to 1×10 -7 through the opening and the opening and the passage. The bracket is such that the body to be molded is bent and attached to the molding surface of the molding die and the vacuum bag is in close contact with the molding die and the curved body to be molded.
較佳的是，於放置該待成型體於該成型模具的塑形面的頂側並令一真空袋包覆該成型模具及該待成型體之步驟之前，所述的彎曲的觸控面板的製法還包含下述步驟： 放置一具有一內表面、一相反於該內表面的外表面及一穿設於該內表面與外表面之間的貫孔的第三玻璃基板於該塑形面上，其中，該第三玻璃基板的內表面的形狀與該第三玻璃基板的外表面的形狀與該塑形面的形狀相同，且該第三玻璃基板的軟化溫度高於該第一黏膠層的軟化溫度，該貫孔與該通道軸向相通；以及 設置一第二黏膠層於該待成型體與該第三玻璃基板的內表面之間，其中，該第一玻璃基板的軟化溫度、該第二玻璃基板的軟化溫度、該第三玻璃基板的軟化溫度、該第一感應電極層的熔點、該第二感應電極層的熔點皆高於該第二黏膠層的軟化溫度； 放置該待成型體於該成型模具的塑形面的頂側並令一真空袋包覆該成型模具及該待成型體之步驟包含： 放置該待成型體於該塑形面及該第三玻璃基板的頂側並令該真空袋包覆該成型模具、該第三玻璃基板及該待成型體； 加熱以使該第一黏膠層軟化並以一抽氣幫浦經由該開口及該開口與該通道對該真空袋內部及塑形空間抽氣，從而使該待成型體彎曲貼附於該成型模具的塑形面上並使該真空袋緊貼於該成型模具及彎曲的待成型體上之步驟包含： 加熱以令該第一黏膠層及該第二黏膠層軟化並以一抽氣幫浦經由該開口及該開口、該通道與該貫孔對該真空袋內部及塑形空間抽氣，以使該待成型體彎曲而透過該第二黏膠層及該第三強化玻璃貼附於該塑形面上並使該真空袋緊貼於該成型模具及彎曲的待成型體上；且 冷卻固化該軟化的第一黏膠層，以獲得所述彎曲的觸控面板之步驟包含： 冷卻固化該軟化的第一黏膠層及該軟化的第二黏膠層，以獲得所述彎曲的觸控面板。Preferably, before the step of placing the body to be molded on the top side of the molding surface of the molding die and allowing a vacuum bag to cover the molding die and the body to be molded, the curved touch panel The method further includes the steps of: placing a third glass substrate having an inner surface, an outer surface opposite to the inner surface, and a through hole penetrating between the inner surface and the outer surface on the molding surface The shape of the inner surface of the third glass substrate is the same as the shape of the outer surface of the third glass substrate, and the softening temperature of the third glass substrate is higher than the first adhesive layer. a softening temperature, the through hole is in axial communication with the channel; and a second adhesive layer is disposed between the body to be molded and an inner surface of the third glass substrate, wherein a softening temperature of the first glass substrate, The softening temperature of the second glass substrate, the softening temperature of the third glass substrate, the melting point of the first sensing electrode layer, and the melting point of the second sensing electrode layer are both higher than the softening temperature of the second adhesive layer; The molded body to be molded into the molding die The step of molding the top surface of the molding surface and wrapping the vacuum bag with the molding die and the body to be molded comprises: placing the body to be molded on the molding surface and the top side of the third glass substrate and making the vacuum bag Covering the molding die, the third glass substrate and the body to be molded; heating to soften the first adhesive layer and to internalize and shape the vacuum bag through the opening and the opening and the passage through an air pump The space is evacuated, so that the step of bending the attached body to be attached to the molding surface of the molding die and the vacuum bag is in close contact with the molding die and the curved body to be molded comprises: heating to make the first The adhesive layer and the second adhesive layer are softened and the inside of the vacuum bag and the shaping space are evacuated through the opening and the opening, the passage and the through hole, so that the body to be molded is bent And attaching the second adhesive layer and the third tempered glass to the molding surface, and attaching the vacuum bag to the molding die and the curved body to be molded; and cooling and curing the softened first adhesive layer The glue layer to obtain the curved touch panel comprises: The softened first adhesive layer and the softened second adhesive layer are cured to obtain the curved touch panel.
較佳的是，加熱以令該第一黏膠層及該第二黏膠層軟化並以一抽氣幫浦經由該開口及該開口、該通道與該貫孔對該真空袋內部及塑形空間抽氣，以使該待成型體彎曲而透過該第二黏膠層及該第三強化玻璃貼附於該塑形面上並使該真空袋緊貼於該成型模具及彎曲的待成型體上之步驟包含：以100°C至290°C之溫度使該第一黏膠層及該第二黏膠層軟化並以一抽氣幫浦經由該開口及該開口、該通道與該貫孔對該真空袋內部及塑形空間抽氣至真空度為1×10 -1托耳至1×10 -7托耳，從而使該待成型體彎曲而透過該第二黏膠層及該第三強化玻璃貼附於該塑形面上並使該真空袋緊貼於該成型模具及彎曲的待成型體上。 Preferably, heating is performed to soften the first adhesive layer and the second adhesive layer and to form and shape the vacuum bag through the opening and the opening, the passage and the through hole by an air pump Space evacuating to bend the body to be molded and adhere to the molding surface through the second adhesive layer and the third tempered glass, and to adhere the vacuum bag to the molding die and the curved body to be molded The step of: comprising: softening the first adhesive layer and the second adhesive layer at a temperature of 100 ° C to 290 ° C and passing the air pump through the opening and the opening, the channel and the through hole Pumping the inside of the vacuum bag and the shaping space to a degree of vacuum of 1×10 −1 Torr to 1×10 -7 Torr, thereby bending the body to be molded through the second adhesive layer and the third A tempered glass is attached to the molding surface and the vacuum bag is adhered to the molding die and the curved body to be molded.
以下配合圖式及本創作的較佳實施例，進一步闡述本創作為達預定創作目的所採取的技術手段。In the following, in conjunction with the drawings and the preferred embodiment of the present invention, the technical means adopted by the present creation for the purpose of predetermined creation are further explained.
實施例1 彎曲的觸控面板及其製法Embodiment 1 Curved touch panel and its preparation method
本實施例的彎曲的觸控面板的製法如下所述：The method of manufacturing the curved touch panel of this embodiment is as follows:
請參閱圖1至3所示，以微影技術於一第一玻璃基板10的內表面11上形成一第一感應電極層20、以微影技術於一第二玻璃基板30的內表面31上形成一第二感應電極層25並提供一成型模具40，該成型模具40包含有一頂面41、一凹設於該頂面41上的塑形面42、一位置相反於該頂面41的底面43、一貫穿成型於該塑形面42與該底面43之間的通道44及一成型於該塑形面42與頂面41之間且於該通道44連通的塑形空間45，該塑形面42為一曲面。其中，該第一玻璃基板10的軟化溫度低於該第一感應電極層20的熔點與該第二感應電極層25的熔點，該第二玻璃基板30的軟化溫度低於該第一感應電極層20的熔點與該第二感應電極層25的熔點。Referring to FIGS. 1 to 3, a first sensing electrode layer 20 is formed on the inner surface 11 of a first glass substrate 10 by lithography, and is lithographically applied to the inner surface 31 of a second glass substrate 30. A second sensing electrode layer 25 is formed and a molding die 40 is formed. The molding die 40 includes a top surface 41, a molding surface 42 recessed on the top surface 41, and a bottom surface opposite to the top surface 41. 43. A passage 44 formed between the molding surface 42 and the bottom surface 43 and a molding space 45 formed between the molding surface 42 and the top surface 41 and communicating with the passage 44, the shaping Face 42 is a curved surface. The softening temperature of the first glass substrate 10 is lower than the melting point of the first sensing electrode layer 20 and the melting point of the second sensing electrode layer 25. The softening temperature of the second glass substrate 30 is lower than the first sensing electrode layer. The melting point of 20 is the melting point of the second sensing electrode layer 25.
於本實施例中，該第一玻璃基板10的軟化溫度為200°C，該第二玻璃基板30的軟化溫度為200°C，該第一玻璃基板10的厚度為100微米，該第二玻璃基板30的厚度為100微米，該第一感應電極層20及該第二感應電極層25係由氧化銦錫所製成，該第一感應電極層20的熔點及該第二感應電極層25的熔點為350°C，且該第一感應電極層20的厚度為100奈米(nm)，該第二感應電極層25的厚度為100奈米。In this embodiment, the softening temperature of the first glass substrate 10 is 200 ° C, the softening temperature of the second glass substrate 30 is 200 ° C, and the thickness of the first glass substrate 10 is 100 μm. The substrate 30 has a thickness of 100 μm. The first sensing electrode layer 20 and the second sensing electrode layer 25 are made of indium tin oxide. The melting point of the first sensing electrode layer 20 and the second sensing electrode layer 25 are The melting point is 350 ° C, and the thickness of the first sensing electrode layer 20 is 100 nanometers (nm), and the thickness of the second sensing electrode layer 25 is 100 nm.
接著，請參閱圖1及圖2所示，令該第一感應電極層20與該第二感應電極層25經由一第一黏膠層50相貼合，以獲得一待成型體60。於本實施例中，係先塗佈成型該第一黏膠層50於該第一感應電極層20上，再令該第一黏膠層50與該第二感應電極層25相黏接，但不以此為限。於其他實施例中，係先塗佈成型該第一黏膠層50於該第二感應電極層25上，再令該第一黏膠層50與該第一感應電極層20相黏接。其中，該第一玻璃基板10的軟化溫度、該第二玻璃基板30的軟化溫度、該第一感應電極層20的熔點、該第二感應電極層25的熔點皆高於該第一黏膠層50的軟化溫度，於本實施例中，該第一黏膠層50為電絕緣體，該第一黏膠層50的軟化溫度為190°C，該第一黏膠層50的厚度為300到800微米。Next, referring to FIG. 1 and FIG. 2, the first sensing electrode layer 20 and the second sensing electrode layer 25 are adhered via a first adhesive layer 50 to obtain a body 60 to be molded. In this embodiment, the first adhesive layer 50 is first formed on the first sensing electrode layer 20, and the first adhesive layer 50 is bonded to the second sensing electrode layer 25, but Not limited to this. In other embodiments, the first adhesive layer 50 is first formed on the second sensing electrode layer 25, and the first adhesive layer 50 is bonded to the first sensing electrode layer 20. The softening temperature of the first glass substrate 10, the softening temperature of the second glass substrate 30, the melting point of the first sensing electrode layer 20, and the melting point of the second sensing electrode layer 25 are both higher than the first adhesive layer. In the present embodiment, the first adhesive layer 50 is an electrical insulator, the first adhesive layer 50 has a softening temperature of 190 ° C, and the first adhesive layer 50 has a thickness of 300 to 800. Micron.
然後，請參閱圖3所示，將該待成型體60放置於該成型模具40的塑形面42的頂側並令一真空袋65包覆該成型模具40及該待成型體60，其中，該真空袋65具有一開口651，該開口651位於該成型模具40的底面43之外且與該通道44相連通。於本實施例中，將該待成型體60係放置於該成型模具40的頂面41上。Then, as shown in FIG. 3, the body to be molded 60 is placed on the top side of the molding surface 42 of the molding die 40, and a vacuum bag 65 is wrapped around the molding die 40 and the body to be molded 60, wherein The vacuum bag 65 has an opening 651 that is outside the bottom surface 43 of the molding die 40 and that communicates with the passage 44. In the present embodiment, the body 60 to be molded is placed on the top surface 41 of the molding die 40.
接下來，請參閱圖3至圖4所示，以190°C的溫度令該第一黏膠層50軟化並以一抽氣幫浦經由該開口651及該開口651與該通道44對該真空袋65內部及塑形空間45抽氣，以使該待成型體60彎曲貼附於該成型模具40的塑形面42上並使該真空袋65緊貼於該成型模具40及彎曲的待成型體60上。Next, referring to FIG. 3 to FIG. 4, the first adhesive layer 50 is softened at a temperature of 190 ° C and the vacuum is applied to the vacuum through the opening 651 and the opening 651 and the passage 44 by a pumping pump. The inside of the bag 65 and the molding space 45 are evacuated, so that the body to be molded 60 is bent and attached to the molding surface 42 of the molding die 40, and the vacuum bag 65 is in close contact with the molding die 40 and the curved molding to be formed. On body 60.
其中，該第一黏膠層50軟化後，由於該軟化後的第一黏膠層50仍具有一定的黏性，故位於該第一黏膠層50兩側的該第一玻璃基板10與該第一感應電極層20及該第二玻璃基板30與該第二感應電極層25，係能原先相對固定的狀態轉變為可相對作小幅度位移動，但仍不至於相分離。於該抽氣幫浦抽氣之過程中，該真空袋65會先受空氣壓力的作用而緊貼於該第二玻璃基板30的外表面32及成型模具40上，然後該抽氣幫浦會持續經由該通道44對塑形空間45抽氣並產生空氣壓力於該第一玻璃基板10與該第二玻璃基板30上，令該第一玻璃基板10與該第二玻璃基板30藉由本身的韌性對應該成型模具40的塑形面42的形狀彎曲，最後使得該待成型體60彎曲貼附於該塑形面42上。於本實施例中，當該待成型體60彎曲貼附於該成型模具40的塑形面42上時，該第一玻璃基板10的內表面11與外表面12彎曲為曲面，該第二玻璃基板30的內表面31與外表面32彎曲為曲面，且該第二玻璃基板30的外表面32係與該成型模具40的塑形面42相貼靠。After the softening of the first adhesive layer 50, the first adhesive layer 50 is still viscous, so the first glass substrate 10 on both sides of the first adhesive layer 50 and the first adhesive layer 50 The first sensing electrode layer 20 and the second glass substrate 30 and the second sensing electrode layer 25 are capable of being relatively fixed in a relatively fixed state, but are still not separated by phase. During the evacuation of the pumping pump, the vacuum bag 65 is first pressed against the outer surface 32 of the second glass substrate 30 and the molding die 40 by the air pressure, and then the pumping pump will be Continuously pumping the shaping space 45 through the passage 44 and generating air pressure on the first glass substrate 10 and the second glass substrate 30, so that the first glass substrate 10 and the second glass substrate 30 are The toughness is curved in conformity with the shape of the molding surface 42 of the molding die 40, and finally the shape to be molded 60 is bent and attached to the molding surface 42. In this embodiment, when the body to be molded 60 is bent and attached to the molding surface 42 of the molding die 40, the inner surface 11 and the outer surface 12 of the first glass substrate 10 are curved into a curved surface, and the second glass is curved. The inner surface 31 and the outer surface 32 of the substrate 30 are curved into a curved surface, and the outer surface 32 of the second glass substrate 30 is in contact with the molding surface 42 of the molding die 40.
此外，本實施例是先以190°C的溫度令該第一黏膠層50軟化，再以該抽氣幫浦經由該開口651及該開口651與該通道44對該真空袋65內部及塑形空間45抽氣，從而使該待成型體60彎曲貼附於該成型模具40的塑形面42上並使該真空袋65緊貼於該成型模具40及彎曲的待成型體60上，但不以此為限。於一些實施例中，亦可於令該第一黏膠層50軟化之同時，令該抽氣幫浦經由該開口651及該開口651與該通道44對該真空袋65內部及塑形空間45抽氣，而達到使該待成型體60彎曲貼附於該成型模具40的塑形面42上並使該真空袋65緊貼於該成型模具40及彎曲的待成型體60上之結果。於另些實施例中，也可先以該抽氣幫浦經由該開口651及該開口651與該通道44對該真空袋65內部及塑形空間45抽氣，再令該第一黏膠層50軟化，進而達到使該待成型體60彎曲貼附於該成型模具40的塑形面42上並使該真空袋65緊貼於該成型模具40及彎曲的待成型體60上之結果。In addition, in this embodiment, the first adhesive layer 50 is first softened by a temperature of 190 ° C, and the vacuum pump 65 is internally and plasticized by the air pumping pump through the opening 651 and the opening 651 and the passage 44. The shape space 45 is evacuated, so that the body to be molded 60 is bent and attached to the molding surface 42 of the molding die 40, and the vacuum bag 65 is in close contact with the molding die 40 and the curved body to be molded 60, but Not limited to this. In some embodiments, the first adhesive layer 50 can be softened, and the air pumping pump can pass the air pump to the inside of the vacuum bag 65 and the shaping space 45 through the opening 651 and the opening 651 and the passage 44. The air is sucked to achieve the result that the molded body 60 is bent and attached to the molding surface 42 of the molding die 40 and the vacuum bag 65 is brought into close contact with the molding die 40 and the curved body to be molded 60. In other embodiments, the vacuum pump 65 can be evacuated through the opening 651 and the opening 651 and the channel 44, and the first adhesive layer can be further evacuated. 50 is softened, and the result is that the molded body 60 is bent and attached to the molding surface 42 of the molding die 40, and the vacuum bag 65 is brought into close contact with the molding die 40 and the curved body to be molded 60.
之後，請參閱圖4及圖5所示，使該軟化的第一黏膠層50冷卻固化後，將真空袋65及成型模具40移除，即獲得本實施例的彎曲的觸控面板1。Thereafter, referring to FIG. 4 and FIG. 5, after the softened first adhesive layer 50 is cooled and solidified, the vacuum bag 65 and the molding die 40 are removed, and the curved touch panel 1 of the present embodiment is obtained.
請參閱圖4及圖5所示，由上述彎曲的觸控面板1的製法所製得的本實施例的彎曲的觸控面板1包含有一第一玻璃基板10、一第一感應電極層20、一第二玻璃基板30、一第二感應電極層25及一第一黏膠層50，該第一玻璃基板10包含有一內表面11及一相反於該內表面11的外表面12，該第一感應電極層20疊設於該第一玻璃基板10的內表面11上，該第二玻璃基板30包含有一內表面31及一相反於該內表面31的外表面32，該第二感應電極層25疊設於該第二玻璃基板30的內表面31上，該第一黏膠層50貼附於該第一感應電極層20與該第二感應電極層25之間。其中，該第一玻璃基板10的內表面11、該第一玻璃基板10的外表面12、該第二玻璃基板30的內表面31及該第二玻璃基板30的外表面32皆為曲面。As shown in FIG. 4 and FIG. 5 , the curved touch panel 1 of the present embodiment, which is formed by the method of manufacturing the curved touch panel 1 , includes a first glass substrate 10 , a first sensing electrode layer 20 , a second glass substrate 30, a second sensing electrode layer 25 and a first adhesive layer 50. The first glass substrate 10 includes an inner surface 11 and an outer surface 12 opposite to the inner surface 11, the first The sensing electrode layer 20 is stacked on the inner surface 11 of the first glass substrate 10. The second glass substrate 30 includes an inner surface 31 and an outer surface 32 opposite to the inner surface 31. The second sensing electrode layer 25 The first adhesive layer 50 is attached between the first sensing electrode layer 20 and the second sensing electrode layer 25 on the inner surface 31 of the second glass substrate 30 . The inner surface 11 of the first glass substrate 10, the outer surface 12 of the first glass substrate 10, the inner surface 31 of the second glass substrate 30, and the outer surface 32 of the second glass substrate 30 are all curved surfaces.
由於第一玻璃基板10與第二玻璃基板30對於溫度的敏感度低，亦即不會因溫度變化而產生明顯的熱脹冷縮，因此，藉由第一玻璃基板10與第二玻璃基板30的使用，本實施例的彎曲的觸控面板1係能免於因溫度變化所衍生的分層剝離現象。且第一玻璃基板10與第二玻璃基板30本身即具有良好的表面強度，能有效抵抗外力而不易刮損，從而能於未設置額外的防刮保護層的狀態下達到有效保護第一感應電極層20與第二感應電極層25，使本實施例的彎曲的觸控面板1的觸控感應功能保持正常作用。Since the first glass substrate 10 and the second glass substrate 30 have low sensitivity to temperature, that is, no significant thermal expansion and contraction due to temperature changes, the first glass substrate 10 and the second glass substrate 30 are used. The use of the curved touch panel 1 of the present embodiment is free from the delamination phenomenon caused by temperature changes. Moreover, the first glass substrate 10 and the second glass substrate 30 have good surface strength, can effectively resist external forces and are not easily scratched, thereby effectively protecting the first sensing electrode without providing an additional scratch-resistant protective layer. The layer 20 and the second sensing electrode layer 25 maintain the normal function of the touch sensing function of the curved touch panel 1 of the present embodiment.
因此，本實施例的彎曲的觸控面板1兼具有良好溫度耐受性及良好表面耐磨性，故本實施例的彎曲的觸控面板1的使用壽命長。Therefore, the curved touch panel 1 of the present embodiment has good temperature resistance and good surface wear resistance, so the curved touch panel 1 of the present embodiment has a long service life.
實施例2 彎曲的觸控面板的製法及其製法Embodiment 2 Method for manufacturing curved touch panel and preparation method thereof
本實施例的彎曲的觸控面板的製法與實施例1大概相同，惟本實施例的彎曲的觸控面板的製法與實施例1相異之處如下：The method for manufacturing the curved touch panel of the present embodiment is substantially the same as that of the first embodiment. However, the method for manufacturing the curved touch panel of the present embodiment differs from that of the first embodiment as follows:
請參閱圖6所示，本實施例的彎曲的觸控面板1A的製法還包含有放置一第三玻璃基板70於該塑形面42上之步驟，其中，該第三玻璃基板70的形狀與該塑形面42相匹配，該第三玻璃基板70係與該頂面41相鄰接，該第三玻璃基板70具有一與該通道44軸向相通的貫孔73。進一步而言，該第三玻璃基板70具有一內表面71及一相反於該內表面71的外表面72，所述第三玻璃基板70的形狀與該塑形面42相匹配係指：該第三玻璃基板70的內表面71與外表面72的形狀與該塑形面42的形狀相同，即該第三玻璃基板70的內表面71與外表面72為曲面，且該第三玻璃基板70的軟化溫度高於該第一黏膠層50的軟化溫度；另，該貫孔73貫穿成型於該內表面71與外表面72之間。更進一步來說，該第三玻璃基板70的軟化溫度為300°C，且該第三玻璃基板70的厚度為100微米。Referring to FIG. 6 , the method for manufacturing the curved touch panel 1A of the present embodiment further includes the step of placing a third glass substrate 70 on the molding surface 42 , wherein the shape of the third glass substrate 70 is The shaping surface 42 is matched, and the third glass substrate 70 is adjacent to the top surface 41. The third glass substrate 70 has a through hole 73 axially communicating with the passage 44. Further, the third glass substrate 70 has an inner surface 71 and an outer surface 72 opposite to the inner surface 71. The shape of the third glass substrate 70 matches the shaped surface 42. The shapes of the inner surface 71 and the outer surface 72 of the three glass substrates 70 are the same as the shape of the shaping surface 42, that is, the inner surface 71 and the outer surface 72 of the third glass substrate 70 are curved, and the third glass substrate 70 is The softening temperature is higher than the softening temperature of the first adhesive layer 50; further, the through hole 73 is formed between the inner surface 71 and the outer surface 72. Furthermore, the softening temperature of the third glass substrate 70 is 300 ° C, and the thickness of the third glass substrate 70 is 100 μm.
又，本實施例的彎曲的觸控面板的製法還包含有於該待成型體60與該第三玻璃基板70的內表面71之間設置一第二黏膠層55之步驟。於本實施例中，該第二黏膠層55之軟化溫度為190°C，即該第一玻璃基板10的軟化溫度、該第二玻璃基板30的軟化溫度、該第三玻璃基板70的軟化溫度、該第一感應電極層20的熔點、該第二感應電極層25的熔點皆高於該第二黏膠層55的軟化溫度。又，於本實施例中，該第二黏膠層55與該第一黏膠層50為相同材質，但不以此為限。Moreover, the method for manufacturing the curved touch panel of the present embodiment further includes the step of disposing a second adhesive layer 55 between the body to be molded 60 and the inner surface 71 of the third glass substrate 70. In this embodiment, the softening temperature of the second adhesive layer 55 is 190 ° C, that is, the softening temperature of the first glass substrate 10, the softening temperature of the second glass substrate 30, and the softening of the third glass substrate 70. The temperature, the melting point of the first sensing electrode layer 20, and the melting point of the second sensing electrode layer 25 are both higher than the softening temperature of the second adhesive layer 55. Moreover, in the embodiment, the second adhesive layer 55 and the first adhesive layer 50 are made of the same material, but not limited thereto.
另外，於本實施例中，該第二黏膠層55係先塗佈成型於該第三玻璃基板70的內表面71上，但不以此為限。於其他實施例中，該第二黏膠層55亦可先塗佈成型於該第一玻璃基板10的外表面11上。In addition, in the embodiment, the second adhesive layer 55 is first formed on the inner surface 71 of the third glass substrate 70, but is not limited thereto. In other embodiments, the second adhesive layer 55 may also be first formed on the outer surface 11 of the first glass substrate 10.
然後，請參閱圖6所示，本實施例是將該待成型體60放置該塑形面42的頂側及該第三玻璃基板70的內表面72之外並令該真空袋65包覆該成型模具40、該第三玻璃基板70及該待成型體60。Then, as shown in FIG. 6 , in this embodiment, the body 60 to be molded is placed on the top side of the molding surface 42 and the inner surface 72 of the third glass substrate 70 and the vacuum bag 65 is covered. The molding die 40, the third glass substrate 70, and the body to be molded 60.
接下來，請參閱圖6及7所示，本實施例是以190°C的溫度令該第一黏膠層50及該第二黏膠層55軟化並以一抽氣幫浦經由該開口651及該開口651、該通道44與該貫孔73對該真空袋65內部及塑形空間45抽氣，以使該待成型體60彎曲而透過該第二黏膠層55及該第三強化玻璃貼附於該塑形面42上並使該真空袋65緊貼於該成型模具40及彎曲的待成型體60上。於該抽氣幫浦抽氣之過程中，該真空袋65會先受空氣壓力的作用而緊貼於該第二玻璃基板30的外表面32及成型模具40上，然後該抽氣幫浦會持續經由該通道44對塑形空間45抽氣並產生空氣壓力於該第一玻璃基板10與該第二玻璃基板30上，令該第一玻璃基板10與該第二玻璃基板30藉由本身的韌性對應該第三強化玻璃的內表面71彎曲，最後使得該待成型體60彎曲並經由該第三強化玻璃貼附於該塑形面42上。於本實施例中，當該待成型體60彎曲貼附於該成型模具40的塑形面42上時，該第一玻璃基板10的外表面12係經由該第二黏膠層55及該第三玻璃基板70與該成型模具40的塑形面42相貼靠。Next, referring to FIG. 6 and FIG. 7 , in the embodiment, the first adhesive layer 50 and the second adhesive layer 55 are softened by a temperature of 190 ° C, and the air is pumped through the opening 651. And the opening 651, the passage 44 and the through hole 73 are evacuated to the inside of the vacuum bag 65 and the shaping space 45, so that the body to be molded 60 is bent to pass through the second adhesive layer 55 and the third tempered glass. Attached to the molding surface 42 and the vacuum bag 65 is in close contact with the molding die 40 and the curved body to be molded 60. During the evacuation of the pumping pump, the vacuum bag 65 is first pressed against the outer surface 32 of the second glass substrate 30 and the molding die 40 by the air pressure, and then the pumping pump will be Continuously pumping the shaping space 45 through the passage 44 and generating air pressure on the first glass substrate 10 and the second glass substrate 30, so that the first glass substrate 10 and the second glass substrate 30 are The toughness corresponds to the inner surface 71 of the third tempered glass being bent, and finally the body to be molded 60 is bent and attached to the molding surface 42 via the third tempered glass. In this embodiment, when the body to be molded 60 is bent and attached to the molding surface 42 of the molding die 40, the outer surface 12 of the first glass substrate 10 passes through the second adhesive layer 55 and the first The three glass substrates 70 abut against the molding surface 42 of the molding die 40.
之後，請參閱圖7至圖8所示，使該軟化的第一黏膠層50及該軟化的第二黏膠層55冷卻固化，並移除真空袋65及成型模具40後，即獲得本實施例的彎曲的觸控面板1A。After that, referring to FIG. 7 to FIG. 8 , after the softened first adhesive layer 50 and the softened second adhesive layer 55 are cooled and solidified, and the vacuum bag 65 and the molding die 40 are removed, the present invention is obtained. The curved touch panel 1A of the embodiment.
請參閱圖7至圖8所示，由上述彎曲的觸控面板1A的製法所製得的本實施例的彎曲的觸控面板1A包含有一第一玻璃基板10、一第一感應電極層20、一第二玻璃基板30、一第二感應電極層25、一第一黏膠層50、一第三玻璃基板70及一第二黏膠層55，該第一玻璃基板10包含有一內表面11及一相反於該內表面11的外表面12，該第一感應電極層20疊設於該第一玻璃基板10的內表面11上，該第二玻璃基板30包含有一內表面31及一相反於該內表面31的外表面32，該第二感應電極層25疊設於該第二玻璃基板30的內表面31上，該第一黏膠層50貼附於該第一感應電極層20與該第二感應電極層25之間。該第三玻璃基板70包含有一內表面71、一相反於該內表面71的外表面72及一貫穿成形於該內表面71與外表面72之間的貫孔73，該第二黏膠層55貼附於該第三玻璃基板70的內表面71與該第一玻璃基板10的外表面12之間。其中，該第一玻璃基板10的內表面11、該第一玻璃基板10的外表面12、該第二玻璃基板30的內表面31、該第二玻璃基板30的外表面32、該第三玻璃基板70的內表面71及該第三玻璃基板70的外表面72皆為曲面。Referring to FIG. 7 to FIG. 8 , the curved touch panel 1A of the present embodiment, which is manufactured by the method of manufacturing the curved touch panel 1A, includes a first glass substrate 10 and a first sensing electrode layer 20 . a second glass substrate 30, a second sensing electrode layer 25, a first adhesive layer 50, a third glass substrate 70, and a second adhesive layer 55. The first glass substrate 10 includes an inner surface 11 and a first sensing electrode layer 20 is disposed on the inner surface 11 of the first glass substrate 10 opposite to the outer surface 12 of the inner surface 11. The second glass substrate 30 includes an inner surface 31 and a opposite The outer surface 32 of the inner surface 31, the second sensing electrode layer 25 is stacked on the inner surface 31 of the second glass substrate 30, and the first adhesive layer 50 is attached to the first sensing electrode layer 20 and the first surface Between the two sensing electrode layers 25. The third glass substrate 70 includes an inner surface 71, an outer surface 72 opposite to the inner surface 71, and a through hole 73 formed through the inner surface 71 and the outer surface 72. The second adhesive layer 55 Attached between the inner surface 71 of the third glass substrate 70 and the outer surface 12 of the first glass substrate 10. The inner surface 11 of the first glass substrate 10, the outer surface 12 of the first glass substrate 10, the inner surface 31 of the second glass substrate 30, the outer surface 32 of the second glass substrate 30, and the third glass Both the inner surface 71 of the substrate 70 and the outer surface 72 of the third glass substrate 70 are curved.
相較於實施例1，本實施例的彎曲的觸控面板1A還包含有所述第三玻璃基板70。所述第三玻璃基板70係可作為該第一玻璃基板10的保護層，進一步避免外力損壞的第一玻璃基板10，確保第一感應電極層的完整及正常工作，進而提升本實施例的彎曲的觸控面板1A的使用壽命。Compared with the first embodiment, the curved touch panel 1A of the present embodiment further includes the third glass substrate 70. The third glass substrate 70 can serve as a protective layer of the first glass substrate 10, further avoiding the first glass substrate 10 damaged by external force, ensuring the integrity and normal operation of the first sensing electrode layer, thereby improving the bending of the embodiment. The life of the touch panel 1A.
基於上述，本創作的彎曲的觸控面板1、1A係同時具有良好溫度耐受性、良好表面耐磨性及長使用壽命長之優點。Based on the above, the curved touch panel 1, 1A of the present invention has the advantages of good temperature resistance, good surface abrasion resistance and long service life.
1、1A‧‧‧彎曲的觸控面板1, 1A‧‧‧ curved touch panel
10‧‧‧第一玻璃基板10‧‧‧First glass substrate
11‧‧‧內表面11‧‧‧ inner surface
12‧‧‧外表面12‧‧‧ outer surface
20‧‧‧第一感應電極層20‧‧‧First sensing electrode layer
25‧‧‧第二感應電極層25‧‧‧Second sensing electrode layer
30‧‧‧第二玻璃基板30‧‧‧Second glass substrate
31‧‧‧內表面31‧‧‧ inner surface
32‧‧‧外表面32‧‧‧ outer surface
40‧‧‧成型模具40‧‧‧Molding mould
41‧‧‧頂面41‧‧‧ top surface
42‧‧‧塑形面42‧‧‧Shaping surface
43‧‧‧底面43‧‧‧ bottom
44‧‧‧通道44‧‧‧ channel
45‧‧‧塑形空間45‧‧‧Shaping space
50‧‧‧第一黏膠層50‧‧‧First adhesive layer
55‧‧‧第二黏膠層55‧‧‧Second adhesive layer
60‧‧‧待成型體60‧‧‧Forms to be molded
65‧‧‧真空袋65‧‧‧vacuum bag
651‧‧‧開口651‧‧‧ openings
70‧‧‧第三玻璃基板70‧‧‧ Third glass substrate
71‧‧‧內表面71‧‧‧ inner surface
72‧‧‧外表面72‧‧‧ outer surface
73‧‧‧貫孔73‧‧‧through holes
80‧‧‧彎曲的觸控面板80‧‧‧Bent touch panel
81‧‧‧PET基板81‧‧‧PET substrate
82‧‧‧感應電極層82‧‧‧Induction electrode layer
83‧‧‧黏著層83‧‧‧Adhesive layer
圖1為本創作之實施例1的彎曲的觸控面板的製法之令該第一感應電極層與該第二感應電極層相貼合之步驟的第一示意圖； 圖2為本創作之實施例1的彎曲的觸控面板的製法之令該第一感應電極層與該第二感應電極層相貼合之步驟的第二示意圖； 圖3為本創作之實施例1的彎曲的觸控面板的製法之將該待成型體放置於該成型模具的塑形面的頂側並令一真空袋包覆該成型模具及該待成型體之步驟的示意圖； 圖4為本創作之實施例1的彎曲的觸控面板的製法之軟化該第一黏膠層並以一抽氣幫浦抽氣，以使該待成型體彎曲貼附於該成型模具的塑形面上並使該真空袋緊貼於該成型模具及彎曲的待成型體上之步驟的示意圖； 圖5為本創作之實施例1的彎曲的觸控面板的側視剖面示意圖； 圖6為本創作之實施例2的彎曲的觸控面板的製法之將該待成型體放置於該成型模具的塑形面的頂側並令一真空袋包覆該成型模具及該待成型體之步驟的示意圖； 圖7為本創作之實施例2的彎曲的觸控面板的製法之軟化該第一黏膠層並以一抽氣幫浦抽氣，以使該待成型體彎曲貼附於該成型模具的塑形面上並使該真空袋緊貼於該成型模具及彎曲的待成型體上之步驟的示意圖； 圖8為本創作之實施例2的彎曲的觸控面板的側視剖面示意圖； 圖9為現有技術之一彎曲的觸控面板的製法的令該等感應電極層相貼合之步驟的示意圖；以及 圖10為現有技術之一彎曲的觸控面板的側視剖面示意圖。1 is a first schematic view showing a step of fabricating a curved touch panel according to a first embodiment of the present invention, in which the first sensing electrode layer and the second sensing electrode layer are bonded; FIG. 2 is an embodiment of the present invention. A second schematic diagram of the step of bonding the first sensing electrode layer to the second sensing electrode layer in the method of manufacturing the curved touch panel; FIG. 3 is a curved touch panel of the first embodiment of the present invention. The schematic diagram of the step of placing the body to be molded on the top side of the molding surface of the molding die and wrapping a vacuum bag to cover the molding die and the body to be molded; FIG. 4 is a bending of the first embodiment of the present invention. The method of manufacturing the touch panel softens the first adhesive layer and evacuates with a pumping pump, so that the body to be molded is bent and attached to the molding surface of the molding die and the vacuum bag is closely attached to the FIG. 5 is a side cross-sectional view of the curved touch panel of the first embodiment of the present invention; FIG. 6 is a curved touch of the second embodiment of the present invention; Forming the panel to place the body to be molded on the molding die A schematic view of the top side of the shape and a step of coating the molding die and the body to be molded by a vacuum bag; FIG. 7 is a method for manufacturing the curved touch panel of the second embodiment of the present invention to soften the first adhesive layer And a schematic diagram of the step of pumping the air to the molding surface of the molding die and attaching the vacuum bag to the molding die and the curved body to be molded FIG. 8 is a side cross-sectional view of the curved touch panel of the second embodiment of the present invention; FIG. 9 is a schematic view showing the steps of fabricating the curved touch panel in the prior art to make the sensing electrode layers adhere to each other; And FIG. 10 is a side cross-sectional view of a curved touch panel of one of the prior art.
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|---|---|---|---|---|
| CN111627338A (en) * | 2020-06-28 | 2020-09-04 | 武汉天马微电子有限公司 | Profiling module, manufacturing method of curved surface display screen and laminating system of curved surface display screen |
| CN111857449A (en) * | 2020-07-30 | 2020-10-30 | 汕头超声显示器技术有限公司 | Bent capacitive touch screen and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140253824A1 (en) * | 2013-03-08 | 2014-09-11 | Nanchang O-Film Tech Co., Ltd. | Touch panel and manufacturing method thereof |
| TW201506733A (en) * | 2013-08-09 | 2015-02-16 | Shih Hua Technology Ltd | A method for making touch module with curved surface |
| US20150145824A1 (en) * | 2013-11-22 | 2015-05-28 | Lg Innotek Co., Ltd. | Touch window and touch device including the same |
| US20150324045A1 (en) * | 2014-05-08 | 2015-11-12 | Innolux Corporation | Curved touch display device and method for forming the same |
-
2017
- 2017-05-08 TW TW106115133A patent/TWI619056B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140253824A1 (en) * | 2013-03-08 | 2014-09-11 | Nanchang O-Film Tech Co., Ltd. | Touch panel and manufacturing method thereof |
| TW201506733A (en) * | 2013-08-09 | 2015-02-16 | Shih Hua Technology Ltd | A method for making touch module with curved surface |
| US20150145824A1 (en) * | 2013-11-22 | 2015-05-28 | Lg Innotek Co., Ltd. | Touch window and touch device including the same |
| US20150324045A1 (en) * | 2014-05-08 | 2015-11-12 | Innolux Corporation | Curved touch display device and method for forming the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111627338A (en) * | 2020-06-28 | 2020-09-04 | 武汉天马微电子有限公司 | Profiling module, manufacturing method of curved surface display screen and laminating system of curved surface display screen |
| CN111627338B (en) * | 2020-06-28 | 2021-09-21 | 武汉天马微电子有限公司 | Profiling module, manufacturing method of curved surface display screen and laminating system of curved surface display screen |
| CN111857449A (en) * | 2020-07-30 | 2020-10-30 | 汕头超声显示器技术有限公司 | Bent capacitive touch screen and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201843568A (en) | 2018-12-16 |
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