TWI613742B - Flexible circuit connection architecture with display interface and manufacturing method thereof - Google Patents
Flexible circuit connection architecture with display interface and manufacturing method thereof Download PDFInfo
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Description
本發明為有關一種軟性電路板,尤指一種具顯示介面的軟性電路連接架構與其製作方法。The invention relates to a flexible circuit board, in particular to a flexible circuit connection structure with a display interface and a manufacturing method thereof.
軟性電路板(Flexible Printed Circuit,FPC)又稱柔性印刷電路板、撓性線路板、軟板等,其以印刷方式在可撓性基材上做線路布置,並用以作為電子產品訊號的傳輸媒介,且具有重量輕、厚度薄、柔軟、可彎曲等特點,而廣泛的應用於手機、筆記本電腦、PDA、數位相機、液晶顯示屏等產品上。Flexible Printed Circuit (FPC), also known as flexible printed circuit board, flexible circuit board, flexible board, etc., is printed on a flexible substrate and used as a transmission medium for electronic product signals. The utility model has the advantages of light weight, thin thickness, softness and flexibility, and is widely used in mobile phones, notebook computers, PDAs, digital cameras, liquid crystal displays and the like.
其應用如美國專利第US8283567號之「Flexible printed circuit board and touch screen panel apparatus having the same」,其包含有一透明基板、複數個感測電極、一前側表面墊片單元、一非感測電極、一後側表面墊片單元以及一可撓式印刷電路板,該透明基板包含有一第一表面與一相對於該第一表面的第二表面,該些感測電極設置於該第一表面,該前側表面墊片單元係連接於該些感測電極,該非感測電極設置於該第二表面,該後側表面墊片單元連接於該非感測電極,該可撓式印刷電路板包含有一連接於該前側表面墊片單元的第一墊片單元,以及一連接於該後側表面墊片單元的第二墊片單元。A flexible printed circuit board and touch screen panel apparatus having the same, which includes a transparent substrate, a plurality of sensing electrodes, a front side surface pad unit, a non-sensing electrode, and a a rear surface spacer unit and a flexible printed circuit board, the transparent substrate includes a first surface and a second surface opposite to the first surface, the sensing electrodes are disposed on the first surface, the front side a surface pad unit is connected to the sensing electrodes, the non-sensing electrode is disposed on the second surface, the back side surface pad unit is connected to the non-sensing electrode, and the flexible printed circuit board includes a connection a first gasket unit of the front side surface gasket unit, and a second gasket unit connected to the rear side surface gasket unit.
雖然軟性電路板受到電子相關產業的大幅應用,然而,當其與其他電子元件連接時,如顯示面板、觸控面板、驅動電路板等,由於其可撓的結構特性,往往在連接處容易發生斷裂或電性連接不完全的情形,而使元件無法正常運作,因此,如何防止連接處之接點斷裂,為相關業者所努力之目標。Although flexible circuit boards are widely used in electronics-related industries, when they are connected to other electronic components, such as display panels, touch panels, and driver boards, they tend to occur at the joints due to their flexible structural characteristics. The fracture or electrical connection is incomplete, and the component is not working properly. Therefore, how to prevent the joint at the joint from breaking is the goal of the relevant industry.
本發明的主要目的,在於解決軟性電路板與其他元件連接的接點容易斷裂或電性連接不完全的問題。The main object of the present invention is to solve the problem that the contact between the flexible circuit board and other components is easily broken or the electrical connection is incomplete.
為達上述目的,本發明提供一種具顯示介面的軟性電路連接架構,包含有一透明可撓基板、一透明導電層、一液晶層、一圖樣化金屬導電層、一運算處理元件以及一電源供應件,該透明導電層設置於該透明可撓基板之一側,並包含有一顯示部以及一相鄰於該顯示部的圖樣化電路連接部,該液晶層設置於該透明導電層遠離該透明可撓基板之一側並對應於該顯示部,該圖樣化金屬導電層設置於該透明導電層遠離該透明可撓基板之一側且形狀對應於該圖樣化電路連接部,該運算處理元件電性連接該圖樣化金屬導電層,該電源供應件與該圖樣化金屬導電層電性連接。To achieve the above objective, the present invention provides a flexible circuit connection structure with a display interface, comprising a transparent flexible substrate, a transparent conductive layer, a liquid crystal layer, a patterned metal conductive layer, an arithmetic processing component, and a power supply member. The transparent conductive layer is disposed on one side of the transparent flexible substrate, and includes a display portion and a patterned circuit connecting portion adjacent to the display portion, the liquid crystal layer is disposed on the transparent conductive layer away from the transparent flexible One side of the substrate and corresponding to the display portion, the patterned metal conductive layer is disposed on a side of the transparent conductive layer away from the transparent flexible substrate and has a shape corresponding to the patterned circuit connection portion, and the operation processing element is electrically connected The patterned metal conductive layer is electrically connected to the patterned metal conductive layer.
為達上述目的,本發明更提供一種具顯示介面的軟性電路連接架構的製作方法,包含有以下步驟:To achieve the above objective, the present invention further provides a method for fabricating a flexible circuit connection architecture with a display interface, comprising the following steps:
S1:依序形成一透明導電層與一金屬導電層於一透明可撓基板之上,該透明導電層包含有一顯示部以及一相鄰於該顯示部的電路連接部;S1: sequentially forming a transparent conductive layer and a metal conductive layer on a transparent flexible substrate, the transparent conductive layer comprising a display portion and a circuit connecting portion adjacent to the display portion;
S2:對位於該顯示部上的該金屬導電層進行蝕刻以露出該顯示部,並對該電路連接部以及位於該電路連接部上的該金屬導電層進行蝕刻,使該電路連接部與該金屬導電層分別形成一圖樣化電路連接部以及一圖樣化金屬導電層;以及S2: etching the metal conductive layer on the display portion to expose the display portion, and etching the circuit connection portion and the metal conductive layer on the circuit connection portion to make the circuit connection portion and the metal The conductive layers respectively form a patterned circuit connection portion and a patterned metal conductive layer;
S3:形成一液晶層於該顯示部上,並將一運算處理元件以及一電源供應件電性連接於該圖樣化金屬導電層;S3: forming a liquid crystal layer on the display portion, and electrically connecting an arithmetic processing component and a power supply member to the patterned metal conductive layer;
綜上所述,藉由將該透明導電層直接形成於該透明可撓基板上,以及該圖樣化金屬導電層直接形成於該透明導電層之上,使其本身之間的附著力較強,且不會有接點的產生,因此,可以防止本發明於彎折時,該圖樣化金屬導電層或該透明導電層斷裂而使元件無法使用的問題。In summary, the transparent conductive layer is directly formed on the transparent flexible substrate, and the patterned metal conductive layer is directly formed on the transparent conductive layer, so that the adhesion between the transparent conductive layer is strong. Moreover, there is no occurrence of a contact, and therefore, the problem that the patterned metal conductive layer or the transparent conductive layer is broken and the component cannot be used when the invention is bent can be prevented.
有關本發明的詳細說明及技術內容,現就配合圖式說明如下:The detailed description and technical content of the present invention will now be described as follows:
請參閱「圖1A」、「圖1B」及「圖2」所示,本發明為一種具顯示介面的軟性電路連接架構,包含有一透明可撓基板10、一透明導電層20、一液晶層30、一圖樣化金屬導電層41、一運算處理元件60以及一電源供應件70,該透明可撓基板10的材質可以為聚醯亞胺(Polyimide,簡稱PI)、聚對苯二甲酸乙二酯(Polyethylene terephthalate,簡稱PET)、聚碳酸酯(Polycarbonate,簡稱PC)、三醋酸纖維素(Triacetyl cellulose,簡稱TAC)、環烯烴共聚物(Cyclic Olefin Copolymer,簡稱COC、Cyclic Olefin Polymer,簡稱COP)、聚萘二甲酸乙二醇酯(Polyethylene naphthalate,簡稱PEN)、玻璃或其組合,而該透明導電層20設置於該透明可撓基板10之一側,並包含有一顯示部21以及一相鄰於該顯示部21的圖樣化電路連接部23,其材質可以為氧化銦錫、氧化鋅、氟化錫氧化物、鋁鋅氧化物、鋅鎵氧化物及其組合等金屬氧化物。Referring to FIG. 1A, FIG. 1B and FIG. 2, the present invention is a flexible circuit connection structure with a display interface, comprising a transparent flexible substrate 10, a transparent conductive layer 20, and a liquid crystal layer 30. a patterned metal conductive layer 41, an arithmetic processing element 60, and a power supply member 70. The transparent flexible substrate 10 may be made of polyimide (PI) or polyethylene terephthalate. (Polyethylene terephthalate, abbreviated as PET), polycarbonate (Polycarbonate, PC for short), Triacetyl cellulose (TAC), Cyclic Olefin Copolymer (COC, Cyclic Olefin Polymer, COP for short) Polyethylene naphthalate (PEN), glass or a combination thereof, and the transparent conductive layer 20 is disposed on one side of the transparent flexible substrate 10 and includes a display portion 21 and an adjacent portion The patterning circuit connecting portion 23 of the display portion 21 may be made of a metal oxide such as indium tin oxide, zinc oxide, tin oxide oxide, aluminum zinc oxide, zinc gallium oxide, or a combination thereof.
該液晶層30設置於該透明導電層20遠離該透明可撓基板10之一側並對應於該顯示部21,該圖樣化金屬導電層41設置於該透明導電層20遠離該透明可撓基板10之一側且形狀對應於該圖樣化電路連接部23,其材質可以為銅等導電金屬,該運算處理元件60電性連接於該圖樣化金屬導電層41,而該電源供應件70則與該圖樣化金屬導電層41電性連接以提供所需之電力。藉此,直接形成該透明導電層20於該透明可撓基板10上與直接形成該圖樣化金屬導電層41於該透明導電層20之上,可以不產生接點,進而防止於彎折時,該圖樣化金屬導電層41或該透明導電層20斷裂而使元件無法使用的問題。The liquid crystal layer 30 is disposed on a side of the transparent conductive layer 20 away from the transparent flexible substrate 10 and corresponds to the display portion 21 . The patterned metal conductive layer 41 is disposed on the transparent conductive layer 20 away from the transparent flexible substrate 10 . One of the side and shape corresponds to the patterning circuit connecting portion 23, and the material thereof may be a conductive metal such as copper, and the arithmetic processing element 60 is electrically connected to the patterned metal conductive layer 41, and the power supply member 70 is The patterned metal conductive layer 41 is electrically connected to provide the required power. Thereby, the transparent conductive layer 20 is directly formed on the transparent flexible substrate 10 and the patterned metal conductive layer 41 is directly formed on the transparent conductive layer 20, and no contact can be formed, thereby preventing the bending. The patterned metal conductive layer 41 or the transparent conductive layer 20 is broken to make the component unusable.
於本實施例中,該液晶層30具有複數個液晶31,且該些液晶31各具有一黑色顯示部312與一白色顯示部311,而於實際組裝時,更會於該液晶層30遠離該透明可撓基板10設置一電極層(圖未示),藉以與該透明導電層20產生相對應的電場,使該些液晶31於對應位置進行翻轉,當操作時,該電源供應件70提供該電力,使該運算處理元件60進行運作,進而傳遞一訊號,該透明導電層20與該電極層接收該訊號後產生相對應的電場,進而使該些液晶31於對應位置進行翻轉,而可呈現出相對應於該訊號的數字或符號等等。In this embodiment, the liquid crystal layer 30 has a plurality of liquid crystals 31, and each of the liquid crystals 31 has a black display portion 312 and a white display portion 311, and in actual assembly, the liquid crystal layer 30 is further away from the The transparent flexible substrate 10 is provided with an electrode layer (not shown), thereby generating an electric field corresponding to the transparent conductive layer 20, so that the liquid crystals 31 are turned over at corresponding positions. When operating, the power supply member 70 provides the same. Power, the operation processing component 60 is operated to transmit a signal, and the transparent conductive layer 20 and the electrode layer receive the signal to generate a corresponding electric field, thereby causing the liquid crystals 31 to be flipped at corresponding positions. A number or symbol corresponding to the signal, and so on.
續搭配參閱「圖3」與「圖4A」至「圖4D」所示,為本實施例的製作流程,於此其中,各元件之材質如前所述,在此則不另行贅述。本實施例的製作步驟如下:Continuing with the reference to FIG. 3 and FIG. 4A to FIG. 4D, the manufacturing process of the present embodiment is as follows. The material of each component is as described above, and will not be further described herein. The manufacturing steps of this embodiment are as follows:
S1:如「圖4A」與「圖4B」所示,形成一透明導電層20於一透明可撓基板10之上,接著再形成一金屬導電層40於該透明導電層20之上,該透明導電層20包含有一顯示部21以及一相鄰於該顯示部21的電路連接部22,需特別說明的是,該金屬導電層40可為銅,該透明導電層20為氧化銦錫,而於本實施例中,係直接將銅形成於氧化銦錫之上,亦即,並未經過任何緩衝材料的設置,直接將該金屬導電層40形成於該透明導電層20上。S1: As shown in FIG. 4A and FIG. 4B, a transparent conductive layer 20 is formed on a transparent flexible substrate 10, and then a metal conductive layer 40 is formed on the transparent conductive layer 20. The conductive layer 20 includes a display portion 21 and a circuit connecting portion 22 adjacent to the display portion 21. Specifically, the metal conductive layer 40 may be copper, and the transparent conductive layer 20 is indium tin oxide. In this embodiment, copper is directly formed on the indium tin oxide, that is, the metal conductive layer 40 is directly formed on the transparent conductive layer 20 without any buffer material.
S2:如「圖4C」所示,先對位於該顯示部21上的該金屬導電層40進行蝕刻使該顯示部21露出,接著,再對該電路連接部22以及位於該電路連接部22上的該金屬導電層40進行蝕刻,使該電路連接部22與該金屬導電層40分別形成一圖樣化電路連接部23以及一圖樣化金屬導電層41,且該圖樣化電路連接部23與該圖樣化金屬導電層41之形狀相對應,透過該圖樣化金屬導電層41增加電路延伸至顯示部21之外時的導電性,避免因為電路連接部22之材質為透明導電材質而影響電性傳導的電阻值過大的問題。S2: First, the metal conductive layer 40 on the display portion 21 is etched to expose the display portion 21, and then the circuit connecting portion 22 and the circuit connecting portion 22 are disposed as shown in FIG. 4C. The metal conductive layer 40 is etched to form a patterned circuit connecting portion 23 and a patterned metal conductive layer 41, and the patterned circuit connecting portion 23 and the pattern are respectively formed by the circuit connecting portion 22 and the metal conductive layer 40. Corresponding to the shape of the metal conductive layer 41, the patterned metal conductive layer 41 increases the conductivity when the circuit extends outside the display portion 21, thereby preventing the electrical conduction of the circuit connecting portion 22 from being transparent conductive material. The problem of excessive resistance is too large.
S3:如「圖4D」所示,形成一液晶層30於該顯示部21上,該液晶層30具有複數個液晶31,且該些液晶31各具有一黑色顯示部312與一白色顯示部311,並將一運算處理元件60以及一電源供應件70(示於圖1A)電性連接於該圖樣化金屬導電層41。S3: As shown in FIG. 4D, a liquid crystal layer 30 is formed on the display portion 21. The liquid crystal layer 30 has a plurality of liquid crystals 31, and each of the liquid crystals 31 has a black display portion 312 and a white display portion 311. An arithmetic processing component 60 and a power supply member 70 (shown in FIG. 1A) are electrically connected to the patterned metal conductive layer 41.
續搭配參閱「圖5」與「圖6」所示,為本發明的應用實施例,接續於上述步驟S3之後,更包含有以下步驟:Referring to FIG. 5 and FIG. 6 , the application embodiment of the present invention, after the step S3 described above, further includes the following steps:
S4:形成一保護件91於該透明可撓基板10遠離該透明導電層20之一側,並使該保護件91之一顯示視窗93對應於該顯示部21。而實際組裝時,亦可以於相對該保護件91的位置額外設置另一個保護件(圖未示),即將本發明設置於該保護件91與另一個保護件之間,而可以更進一步的保護本發明。S4: A protective member 91 is formed on one side of the transparent flexible substrate 10 away from the transparent conductive layer 20, and a display window 93 of the protective member 91 corresponds to the display portion 21. In actual assembly, another protection member (not shown) may be additionally disposed at a position relative to the protection member 91, that is, the present invention is disposed between the protection member 91 and another protection member, and can be further protected. this invention.
此外,如「圖6」所示,該保護件91更可以包含有一用以容置該透明可撓基板10的凹槽92,如此一來,可以減少本應用實施例的厚度。In addition, as shown in FIG. 6, the protective member 91 further includes a recess 92 for receiving the transparent flexible substrate 10, so that the thickness of the embodiment of the application can be reduced.
而若設置於該液晶層30遠離該為了保護該透明可撓基板10之一側的部件亦為透明的,該顯示視窗93亦可以設置於另一個保護件上且對應於該顯示部21,本發明可以應用於電子紙、***等領域。需特別說明的是,應用於***上且當於網路上進行刷卡時,該液晶層30會顯示出一組號碼,除了一般輸入密碼之外,持卡人須輸入該號碼於相關裝置之上,才可以刷卡成功,提高刷卡的安全性。The display window 93 can also be disposed on another protection member and corresponding to the display portion 21, if the liquid crystal layer 30 is disposed away from the side of the transparent flexible substrate 10 to be transparent. The invention can be applied to fields such as electronic paper, credit cards, and the like. It should be specially noted that when applied to a credit card and when swiping on the network, the liquid crystal layer 30 displays a set of numbers. In addition to the general input of the password, the cardholder must input the number on the relevant device. It is only possible to swipe the card successfully and improve the security of the card.
綜上所述,由於本發明具有以下特點:In summary, the present invention has the following characteristics:
一、 藉由直接形成該透明導電層與該圖樣化金屬導電層,避免於顯示元件與軟性電路板之間產生電性接點進而防止於彎折時,該圖樣化金屬導電層或該透明導電層斷裂而使元件無法使用的問題,並可應用於電子紙、***等領域。1. Forming the metal conductive layer or the transparent conductive layer by directly forming the transparent conductive layer and the patterned metal conductive layer to avoid electrical contact between the display element and the flexible circuit board to prevent bending The problem that the layer is broken and the component is unusable, and can be applied to fields such as electronic paper and credit cards.
二、 藉由該保護件的設置,可以更進一步保護本發明,如防止水氣侵蝕等等,提高使用上的壽命。Second, by the arrangement of the protection member, the present invention can be further protected, such as preventing moisture erosion and the like, and improving the service life.
三、 藉由該凹槽的設置,可以容納該透明可撓基板,以減少厚度。3. The transparent flexible substrate can be accommodated by the arrangement of the groove to reduce the thickness.
因此本發明極具進步性及符合申請發明專利的要件,爰依法提出申請,祈 鈞局早日賜准專利,實感德便。Therefore, the present invention is highly progressive and conforms to the requirements of the invention patent application, and the application is filed according to law, and the praying office grants the patent as soon as possible.
以上已將本發明做一詳細說明,惟以上所述者,僅爲本發明的一較佳實施例而已,當不能限定本發明實施的範圍。即凡依本發明申請範圍所作的均等變化與修飾等,皆應仍屬本發明的專利涵蓋範圍內。The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.
10:透明可撓基板 20:透明導電層 21:顯示部 22:電路連接部 23:圖樣化電路連接部 30:液晶層 31:液晶 311:白色顯示部 312:黑色顯示部 40:金屬導電層 41:圖樣化金屬導電層 60:運算處理元件 70:電源供應件 80:輔助可撓基板 91:保護件 92:凹槽 93:顯示視窗 S1~S4:步驟10: transparent flexible substrate 20: transparent conductive layer 21: display portion 22: circuit connection portion 23: patterning circuit connection portion 30: liquid crystal layer 31: liquid crystal 311: white display portion 312: black display portion 40: metal conductive layer 41 : patterned metal conductive layer 60: arithmetic processing element 70: power supply member 80: auxiliary flexible substrate 91: protective member 92: groove 93: display window S1 ~ S4: steps
圖1A,為本發明一較佳實施例的俯視示意圖。 圖1B,為本發明圖1A之A-A剖面示意圖。 圖2,為本發明一較佳實施例的功能方塊示意圖。 圖3,為本發明一較佳實施例的流程示意圖。 圖4A至4D,為本發明一較佳實施例的製作流程結構示意圖。 圖5,為本發明一較佳實施例的第一應用示意圖。 圖6,為本發明一較佳實施例的第二應用示意圖。1A is a top plan view of a preferred embodiment of the present invention. Figure 1B is a cross-sectional view of the A-A of Figure 1A of the present invention. 2 is a functional block diagram of a preferred embodiment of the present invention. FIG. 3 is a schematic flow chart of a preferred embodiment of the present invention. 4A to 4D are schematic diagrams showing the structure of a manufacturing process according to a preferred embodiment of the present invention. FIG. 5 is a schematic diagram of a first application according to a preferred embodiment of the present invention. FIG. 6 is a schematic diagram of a second application of a preferred embodiment of the present invention.
10:透明可撓基板 20:透明導電層 21:顯示部 23:圖樣化電路連接部 30:液晶層 31:液晶 311:白色顯示部 312:黑色顯示部 41:圖樣化金屬導電層 60:運算處理元件10: transparent flexible substrate 20: transparent conductive layer 21: display portion 23: patterning circuit connecting portion 30: liquid crystal layer 31: liquid crystal 311: white display portion 312: black display portion 41: patterned metal conductive layer 60: arithmetic processing element
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW476122B (en) * | 2000-12-29 | 2002-02-11 | Ind Tech Res Inst | Assembling method of non-transparent flat display panel |
TW518756B (en) * | 2000-11-22 | 2003-01-21 | Conexant Systems Inc | Method for fabricating a self-aligned emitter in a bipolar transistor |
TW201013866A (en) * | 2008-09-30 | 2010-04-01 | Shih-Chi Chen | Flip board package and the forming method thereof |
US8283567B2 (en) * | 2010-09-07 | 2012-10-09 | Samsung Display Co., Ltd. | Flexible printed circuit board and touch screen panel apparatus having the same |
-
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW518756B (en) * | 2000-11-22 | 2003-01-21 | Conexant Systems Inc | Method for fabricating a self-aligned emitter in a bipolar transistor |
TW476122B (en) * | 2000-12-29 | 2002-02-11 | Ind Tech Res Inst | Assembling method of non-transparent flat display panel |
TW201013866A (en) * | 2008-09-30 | 2010-04-01 | Shih-Chi Chen | Flip board package and the forming method thereof |
US8283567B2 (en) * | 2010-09-07 | 2012-10-09 | Samsung Display Co., Ltd. | Flexible printed circuit board and touch screen panel apparatus having the same |
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