TWI607359B - Three-dimensional touch screen assembly - Google Patents

Three-dimensional touch screen assembly Download PDF

Info

Publication number
TWI607359B
TWI607359B TW105118008A TW105118008A TWI607359B TW I607359 B TWI607359 B TW I607359B TW 105118008 A TW105118008 A TW 105118008A TW 105118008 A TW105118008 A TW 105118008A TW I607359 B TWI607359 B TW I607359B
Authority
TW
Taiwan
Prior art keywords
touch
piezoelectric
pressure
signal
dimensional
Prior art date
Application number
TW105118008A
Other languages
Chinese (zh)
Other versions
TW201712505A (en
Inventor
周家麒
莊志成
黃俊榮
鄭太獅
Original Assignee
宸鴻科技(廈門)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宸鴻科技(廈門)有限公司 filed Critical 宸鴻科技(廈門)有限公司
Publication of TW201712505A publication Critical patent/TW201712505A/en
Application granted granted Critical
Publication of TWI607359B publication Critical patent/TWI607359B/en

Links

Description

三維觸控總成 3D touch assembly

本發明涉及觸控及壓感領域,且特別是有關於一種三維觸控總成。 The present invention relates to the field of touch and pressure sensing, and in particular to a three-dimensional touch assembly.

隨著科技的發展,觸控總成(touch screen assembly)已廣泛應用於各種消費電子設備,例如:智慧型手機、平板電腦、相機、電子書、MP3播放機等攜帶式電子產品,或是應用於操作控制設備的顯示幕幕。 With the development of technology, touch screen assembly has been widely used in a variety of consumer electronic devices, such as smart phones, tablets, cameras, e-books, MP3 players and other portable electronic products, or applications. The display screen of the operation control device.

現有的電子設備大都採用電容式觸控總成,電容式觸控總成是利用人體的電流感應來進行操作。以觸控面所在表面建立二維坐標系(X,Y),一般的電容式觸控總成在該平面內設置有X方向及Y方向的觸控電極,當手指觸摸在觸控電極所對應的觸控表面上時,由於人體電場,手指改變了觸控點處的電信號。電子設備內部通過對觸控點處電信號改變的精確計算,得出觸摸點在X方向以及Y方向上的座標位置,即確定觸控點的二維位置進而控制電子設備的顯示、跳轉等操作。 Most of the existing electronic devices use a capacitive touch assembly, and the capacitive touch assembly utilizes current sensing of the human body to operate. A two-dimensional coordinate system (X, Y) is established on the surface of the touch surface. The general capacitive touch assembly is provided with X-direction and Y-direction touch electrodes in the plane, and the finger touches the touch electrode. On the touch surface, the finger changes the electrical signal at the touch point due to the human body electric field. The electronic device internally calculates the coordinate position of the touch point in the X direction and the Y direction by accurately calculating the electrical signal change at the touch point, that is, determining the two-dimensional position of the touch point and controlling the display and jump operations of the electronic device. .

為了進一步拓展觸控總成的功能,目前已有部分觸控總成會加裝獨立的壓力感測器,所述壓力感測器包括多個 壓感單元,位於觸控點處的壓感單元感應來自垂直於觸控面(相當於Z軸方向)的按壓力會產生一定的形變從而引起壓感單元之電信號發生變化,對該電性號的偵測可以確定壓感單元所受到的壓力。通過壓力值的偵測可設計出匹配於不同壓力值下的設備功能,譬如不同力度下同一觸控點可匹配多種功能。即我們可以從觸控點(X,Y)和壓力(Z)所界定的三維角度去拓展設計。 In order to further expand the function of the touch assembly, some touch sensors are currently equipped with independent pressure sensors, and the pressure sensor includes a plurality of The pressure sensing unit, the pressure sensing unit located at the touch point, induces a certain deformation caused by the pressing force perpendicular to the touch surface (corresponding to the Z-axis direction), thereby causing a change in the electrical signal of the pressure sensing unit, and the electrical property is changed. The detection of the number can determine the pressure experienced by the pressure sensing unit. Through the detection of the pressure value, the function of the device matching different pressure values can be designed. For example, the same touch point can match multiple functions under different strengths. That is, we can expand the design from the three-dimensional angle defined by the touch point (X, Y) and pressure (Z).

然,前述具有壓力偵測功能的電子設備,由於其裝載壓力感測器,導致整體厚度增加,線路繁雜,制程複雜;也因此,如何發展出兼具觸控及壓力偵測的簡易型三維觸控偵測功能模組解決方案,是業界所需要的。 However, the aforementioned electronic device with pressure detection function increases the overall thickness due to the loading of the pressure sensor, the circuit is complicated, and the process is complicated; therefore, how to develop a simple three-dimensional touch with touch and pressure detection The control detection function module solution is required by the industry.

發明內容旨在提供本揭示內容的簡化摘要,以使閱讀者對本揭示內容具備基本的理解。此發明內容並非本揭示內容的完整概述,且其用意並非在指出本發明實施例的重要/關鍵元件或界定本發明的範圍。 SUMMARY OF THE INVENTION The Summary of the Disclosure is intended to provide a basic understanding of the present disclosure. This Summary is not an extensive overview of the disclosure, and is not intended to be an

本發明內容之一目的是在提供一種三維觸控總成,藉以克服目前三維觸控總成厚度增加,線路繁雜的問題。 One of the objectives of the present invention is to provide a three-dimensional touch assembly, thereby overcoming the problem that the thickness of the current three-dimensional touch assembly is increased and the line is complicated.

為達上述目的,本發明內容之一技術態樣係關於一種三維觸控總成,包括一複合觸控壓感層,所述複合觸控壓感層包括一柔性基材層以及分別設置在所述柔性基材層兩側的一第一觸控壓感層與一第二觸控壓感層,所述第一觸控壓感層上設置有多條第一方向觸控壓電電極,所述第二觸控壓感層 上設置有多條第二方向觸控壓電電極,所述多條第一方向觸控壓電電極與所述第二方向觸控壓電電極既偵測觸控信號,也偵測壓力信號。 To achieve the above objective, a technical aspect of the present invention relates to a three-dimensional touch assembly, including a composite touch pressure sensing layer, the composite touch pressure sensing layer including a flexible substrate layer and respectively disposed at the same a first touch pressure sensing layer and a second touch pressure sensing layer on the two sides of the flexible substrate layer, wherein the first touch pressure sensing layer is provided with a plurality of first direction touch piezoelectric electrodes, Second touch pressure sensitive layer A plurality of second-direction touch piezoelectric electrodes are disposed, and the plurality of first-direction touch piezoelectric electrodes and the second-direction touch piezoelectric electrodes detect both the touch signal and the pressure signal.

優選地,偵測所述觸控信號及偵測所述壓力信號系分時序進行,並分別採用互電容及自電容的方式偵測。 Preferably, detecting the touch signal and detecting the pressure signal are performed in time series, and detecting by using mutual capacitance and self capacitance.

優選地,所述三維觸控總成先偵測所述觸控信號以確定觸控點位置,再偵測觸控點位置處所對應的所述第一方向觸控壓電電極和/或所述第二方向觸控壓電電極處所產生的壓力信號以確定按壓力值大小。 Preferably, the three-dimensional touch assembly first detects the touch signal to determine a touch point position, and then detects the first direction touch piezoelectric electrode corresponding to the touch point position and/or the The second direction touches the pressure signal generated at the piezoelectric electrode to determine the pressing force value.

優選地,於偵測所述觸控信號時,所述多條第一方向觸控壓電電極與所述多條第二方向觸控壓電電極配合採用互電容的方式偵測所述觸控信號。 Preferably, when detecting the touch signal, the plurality of first-direction touch piezoelectric electrodes and the plurality of second-direction touch piezoelectric electrodes cooperate to detect the touch by mutual capacitance signal.

優選地,於偵測所述壓力信號時,所述每一條第一方向觸控壓電電極與所述每一條第二方向觸控壓電電極各自採用自電容的方式偵測所述壓力信號。 Preferably, when detecting the pressure signal, each of the first direction touch piezoelectric electrodes and each of the second direction touch piezoelectric electrodes respectively detect the pressure signal by self-capacitance.

優選地,於偵測所述壓力信號時,位於所述柔性基材層兩側且位置對應的所述第一方向觸控壓電電極和所述第二方向觸控壓電電極分別偵測到的壓力信號疊加。 Preferably, when the pressure signal is detected, the first direction touch piezoelectric electrode and the second direction touch piezoelectric electrode located on opposite sides of the flexible substrate layer are respectively detected. The pressure signal is superimposed.

優選地,所述每一條第一方向觸控壓電電極與所述每一條二方向觸控壓電電極兩端設置有導電線,所述導電線直接連接至集成在一晶片上的一三維信號處理電路,或通過軟性電路板連接至所述三維信號處理電路。 Preferably, each of the first direction touch piezoelectric electrodes and each of the two-direction touch piezoelectric electrodes are provided with conductive lines, and the conductive lines are directly connected to a three-dimensional signal integrated on a wafer. The processing circuit is connected to the three-dimensional signal processing circuit via a flexible circuit board.

優選地,所述第一觸控壓感層和所述第二觸控壓感層為面電阻小於200歐姆/平方釐米的具有壓電特性的材料製成。 Preferably, the first touch pressure sensitive layer and the second touch pressure sensitive layer are made of a material having piezoelectric properties with a sheet resistance of less than 200 ohms/cm 2 .

優選地,所述第一觸控壓感層和所述第二觸控壓感層為納米銀線PVDF壓電膜經過圖案化處理形成。 Preferably, the first touch pressure sensitive layer and the second touch pressure sensitive layer are formed by patterning a nano silver wire PVDF piezoelectric film.

優選地,所述納米銀線PVDF壓電膜內部散佈有多條納米銀線,所述多條納米銀線之間相互搭接形成傳導網路。 Preferably, the nano silver wire PVDF piezoelectric film is internally dispersed with a plurality of nano silver wires, and the plurality of nano silver wires overlap each other to form a conductive network.

因此,根據本發明之技術內容,本發明實施例藉由提供一種三維觸控總成,其與現有技術相比,本發明揭示的三維觸控總至少具有如下優點: Therefore, in accordance with the technical content of the present invention, an embodiment of the present invention provides a three-dimensional touch assembly. Compared with the prior art, the three-dimensional touch disclosed in the present invention has at least the following advantages:

1.本發明中第一觸控壓感層和第二觸控壓感層為導電性較好的壓電材料製成,其同時具備觸控信號偵測和壓力信號偵測功能,如此可以大大降低兼具有觸控及壓感雙功能的三維觸控總成的厚度,且觸控信號與壓力信號採用同一組導電線匯出,其可以減少線路的排佈,避免了傳統搭載壓力功能的三維觸控總成所存在的線路繁雜的問題。 1. In the present invention, the first touch pressure sensing layer and the second touch pressure sensing layer are made of a piezoelectric material with good conductivity, and simultaneously have a touch signal detection and a pressure signal detection function, which can greatly The thickness of the three-dimensional touch assembly with both touch and pressure sensing functions is reduced, and the touch signal and the pressure signal are remitted by the same set of conductive lines, which can reduce the arrangement of the lines and avoid the traditional pressure function. The problem of complicated lines in the 3D touch assembly.

2.本發明中複合觸控壓感層結構為過柔性基材層兩側設置第一觸控壓感層和第二觸控壓感層,柔性基材層的設置可以使得複合觸控壓感層能夠靈敏響應於觸控操作產生一定的形變以提升具有壓電偵測的觸控總成的壓力信號偵測靈敏度。 2. The composite touch pressure sensing layer structure of the present invention has a first touch pressure sensitive layer and a second touch pressure sensitive layer disposed on both sides of the flexible substrate layer, and the flexible substrate layer can be set to make the composite touch pressure sense The layer is sensitive to a certain deformation in response to the touch operation to improve the pressure signal detection sensitivity of the touch detection assembly with piezoelectric detection.

3.本發明中採用的是互電容的偵測方式偵測觸控信號,採用自電容的方式偵測壓力信號,所述兩者響應於觸控 操作所產生的觸控信號與壓力信號變化均為電容量的改變,即兩者因觸控操作所引起的信號類型變化一致。由於兩者的信號類型變化的一致性,其能夠通過同一處理電路來實現信號的偵測,在本發明中通過一套硬體設備(集成在一晶片上的三維信號處理電路)就可以實現對觸控信號以及壓力信號的處理。生產廠商無需設計兩套獨立的硬體設備來對壓力信號和觸控信號進行處理。如此提高了電容式三維偵測模組的集成度,降低了硬體設備的成本。避免了現有搭載壓力功能的觸控總成所存在的多套硬體設備所帶來的硬體複雜,成本高等問題。 3. In the present invention, the mutual capacitance detection method is used to detect the touch signal, and the self-capacitance method is used to detect the pressure signal, and the two are responsive to the touch. The touch signal and the pressure signal generated by the operation are changes in capacitance, that is, the signal types of the two are consistent due to the touch operation. Due to the consistency of the signal types of the two, the signal processing can be realized by the same processing circuit. In the present invention, a set of hardware devices (a three-dimensional signal processing circuit integrated on a chip) can be realized. Handling of touch signals and pressure signals. Manufacturers do not need to design two separate hardware devices to handle pressure signals and touch signals. This improves the integration of the capacitive 3D detection module and reduces the cost of the hardware device. It avoids the hardware complexity and high cost caused by the multiple sets of hardware devices existing in the existing touch function assembly.

4.三維觸控總成分時序偵測觸控點位置以及按壓力值。最佳地,具有壓電偵測的觸控總成先偵測觸控點的位置,然後再偵測觸控點位置處所對應的觸控壓電電極所受到的按壓力值,在按壓力值的偵測過程中,三維信號處理電路無需對觸控壓電電極全部逐一偵測,如此一來,提高了偵測效率,降低了硬體損耗。 4. 3D touch total component timing detects the position of the touch point and the pressing value. Preferably, the touch detection assembly with piezoelectric detection first detects the position of the touch point, and then detects the pressing force value of the touch piezoelectric electrode corresponding to the position of the touch point, at the pressing value During the detection process, the three-dimensional signal processing circuit does not need to detect the touch piezoelectric electrodes one by one, thereby improving the detection efficiency and reducing the hardware loss.

5.在本發明中第一方向觸控壓電電極和第二方向觸控壓電電極可以優選為納米銀線PVDF壓電膜製成,由於其內散佈並嵌入了納米銀線,納米銀線在其內部形成傳導網路,故,其導電性非常好,而納米銀線PVDF壓電膜本身具有較好的壓電特性,因此第一方向觸控壓電電極和第二方向觸控壓電電極採用納米銀線PVDF壓電膜製作時,觸控信號和壓力信號的偵測效果均非常理想。 5. In the present invention, the first direction touch piezoelectric electrode and the second direction touch piezoelectric electrode may be preferably made of a nano silver wire PVDF piezoelectric film, and the nano silver wire is dispersed and embedded therein. The conductive network is formed inside, so the conductivity is very good, and the nano-silver PVDF piezoelectric film itself has good piezoelectric characteristics, so the first direction touch piezoelectric electrode and the second direction touch piezoelectric When the electrode is made of nano silver wire PVDF piezoelectric film, the detection effect of touch signal and pressure signal is very ideal.

在參閱下文實施方式後,本發明所屬技術領域中具有通常知識者當可輕易瞭解本發明之基本精神及其他發明 目的,以及本發明所採用之技術手段與實施態樣。 After referring to the embodiments below, those having ordinary skill in the art to which the present invention pertains can easily understand the basic spirit and other inventions of the present invention. The purpose and the technical means and implementation aspects of the present invention.

10‧‧‧三維觸控總成 10‧‧‧3D touch assembly

10s‧‧‧複合觸控壓感層 10s‧‧‧Composite touch pressure layer

11‧‧‧上基板 11‧‧‧Upper substrate

12‧‧‧貼合層 12‧‧‧Fitting layer

17、17a‧‧‧第二觸控壓感層 17, 17a‧‧‧Second touch pressure layer

171、171a‧‧‧第二方向觸控壓電電極 171, 171a‧‧‧second direction touch piezoelectric electrode

18‧‧‧三維信號處理電路 18‧‧‧Three-dimensional signal processing circuit

15、15a‧‧‧第一觸控壓感層 15, 15a‧‧‧First touch pressure layer

151、151a‧‧‧第一方向觸控壓電電極 151, 151a‧‧‧ first direction touch piezoelectric electrode

16、16a‧‧‧柔性基材層 16, 16a‧‧‧Flexible substrate layer

800‧‧‧壓電膜 800‧‧‧Piezoelectric film

801‧‧‧納米銀線 801‧‧‧ nano silver wire

為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下:第1圖是本發明第一實施例三維觸控總成的層狀結構示意圖。 The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a layered structure of a three-dimensional touch assembly according to a first embodiment of the present invention. .

第2圖是本發明第一實施例三維觸控總成之第一觸控壓感層的平面結構示意圖。 FIG. 2 is a schematic plan view showing the first touch pressure sensing layer of the three-dimensional touch sensor assembly according to the first embodiment of the present invention.

第3圖是本發明第一實施例三維觸控總成之複合觸控壓感層的平面結構示意圖。 FIG. 3 is a plan view showing the planar structure of the composite touch pressure sensing layer of the three-dimensional touch assembly according to the first embodiment of the present invention.

第4圖是納米銀線PVDF壓電膜的平面結構示意圖。 Fig. 4 is a schematic plan view showing the structure of a nano-silver wire PVDF piezoelectric film.

第5圖是本發明第一實施例三維觸控總成之觸控信號與壓力信號偵測的時序圖。 FIG. 5 is a timing diagram of touch signal and pressure signal detection of the 3D touch assembly of the first embodiment of the present invention.

第6圖是本發明第二實施例三維觸控總成之第一觸控壓感層的平面結構示意圖。 FIG. 6 is a plan view showing the planar structure of the first touch pressure sensing layer of the 3D touch control assembly according to the second embodiment of the present invention.

第7圖是本發明第二實施例三維觸控總成之複合觸控壓感層的平面結構示意圖。 FIG. 7 is a plan view showing the planar structure of the composite touch pressure sensing layer of the three-dimensional touch assembly according to the second embodiment of the present invention.

根據慣常的作業方式,圖中各種特徵與元件並未依比例繪製,其繪製方式是為了以最佳的方式呈現與本發明相關的具體特徵與元件。此外,在不同圖式間,以相同或相似的元件符號來指稱相似的元件/部件。 The various features and elements in the figures are not drawn to scale, and are in the In addition, similar elements/components are referred to by the same or similar element symbols throughout the different drawings.

為了使本揭示內容的敘述更加詳盡與完備,下文針對了本發明的實施態樣與具體實施例提出了說明性的描述;但這並非實施或運用本發明具體實施例的唯一形式。實施方式中涵蓋了多個具體實施例的特徵以及用以建構與操作這些具體實施例的方法步驟與其順序。然而,亦可利用其他具體實施例來達成相同或均等的功能與步驟順序。 The description of the embodiments of the present invention is intended to be illustrative and not restrictive. The features of various specific embodiments, as well as the method steps and sequences thereof, are constructed and manipulated in the embodiments. However, other specific embodiments may be utilized to achieve the same or equivalent function and sequence of steps.

除非本說明書另有定義,此處所用的科學與技術詞彙之含義與本發明所屬技術領域中具有通常知識者所理解與慣用的意義相同。此外,在不和上下文衝突的情形下,本說明書所用的單數名詞涵蓋該名詞的複數型;而所用的複數名詞時亦涵蓋該名詞的單數型。 The scientific and technical terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the invention pertains, unless otherwise defined herein. In addition, the singular noun used in this specification covers the plural of the noun in the case of no conflict with the context; the plural noun of the noun is also included in the plural noun used.

另外,關於本文中所使用之「耦接」,可指二或多個元件相互直接作實體或電性接觸,或是相互間接作實體或電性接觸,亦可指二或多個元件相互操作或動作。 In addition, the term "coupled" as used herein may mean that two or more elements are in direct physical or electrical contact with each other, or indirectly in physical or electrical contact with each other, or that two or more elements are interoperable. Or action.

請參閱第1圖,本發明第一實施例三維觸控總成10包括一從上至下(本發明中,上下左右、頂部、底部等位置詞僅用於限定指定視圖上的相對位置,而非絕對位置)依次包括一上基板11,一貼合層12以及一複合觸控壓感層10s以及一三維信號處理電路18,所述複合觸控壓感層10s兼具觸控信號偵測與壓力信號偵測這兩種功能,觸控信號用於確定觸控操作者的觸控位置,壓力信號用於確定觸控操作之按壓力值大小。所述三維信號處理電路18設置在複合壓感層10s的下方,其位置不作限定。所述複合觸控壓感層10s與三維信號處理電路18 電性連接,而三維信號處理電路18得以透過訊號處理技巧計算觸控位置及相應位置的按壓力值大。 Referring to FIG. 1 , the 3D touch sensor assembly 10 of the first embodiment of the present invention includes a top-to-bottom (in the present invention, position words such as up, down, left, right, top, bottom, etc. are only used to define relative positions on a specified view, and The non-absolute position includes an upper substrate 11 , a bonding layer 12 , a composite touch sensing layer 10 s and a three-dimensional signal processing circuit 18 . The composite touch sensing layer 10 s has both touch signal detection and The pressure signal detects these two functions, the touch signal is used to determine the touch position of the touch operator, and the pressure signal is used to determine the pressing force value of the touch operation. The three-dimensional signal processing circuit 18 is disposed below the composite pressure sensitive layer 10s, and its position is not limited. The composite touch pressure sensitive layer 10s and the three-dimensional signal processing circuit 18 The electrical connection is made, and the three-dimensional signal processing circuit 18 can calculate the pressing position of the touch position and the corresponding position through the signal processing technique.

上基板11可以認定為電子設備的觸摸蓋板,所謂的蓋板包括一觸控操作面與一組件安裝面,其觸控操作面用於手指或觸控筆等進行觸控操作,元件安裝面則用於安裝觸控電極元件或顯示模組等。上基板111材質可以是PEEK(polyetheretherketone,聚醚醚酮),PI(Polyimide,聚醯亞胺),PET(polyethyleneterephthalate,聚對苯二甲酸乙二醇酯),PC(聚碳酸酯聚碳酸酯),PES(聚丁二酸乙二醇酯),PMMA(polymethylmethacrylate,聚甲基丙烯酸甲酯)及其任意兩者的複合物等材料,但不以此為限而可以使用軟性玻璃或薄化玻璃蓋板。 The upper substrate 11 can be regarded as a touch cover of the electronic device. The so-called cover plate includes a touch operation surface and a component mounting surface, and the touch operation surface is used for a touch operation by a finger or a stylus, and the component mounting surface It is used to mount touch electrode components or display modules. The material of the upper substrate 111 may be PEEK (polyetheretherketone), PI (Polyimide, polyethylene terephthalate), PET (polyethylene terephthalate), PC (polycarbonate polycarbonate). , PES (polyethylene glycol succinate), PMMA (polymethylmethacrylate), and any combination of the two, but not limited to, can use soft glass or thin glass Cover plate.

貼合層12可以選用OCA(光學透明膠,Optical Clear Adhesive)或LOCA(液態光學透明膠,Liquid Optical Clear Adhesive)。 The bonding layer 12 may be OCA (Optical Clear Adhesive) or LOCA (Liquid Optical Clear Adhesive).

請一併參閱第1圖至第3圖,複合觸控壓感層10s包括一柔性基材層16以及分別設置在柔性基材層16兩側的一第一觸控壓感層15與一第二觸控壓感層17,所述第一觸控壓感層15與第二觸控壓感層17以柔性基材層16相對的兩側作為承載面。第一觸控壓感層15上設置有多條第一方向觸控壓電電極151,第二觸控壓感層17上設置有多條第二方向觸控壓電電極171,多條第一方向觸控壓電電極151與第二方向觸控壓電電極171既偵測觸控信號,也偵測壓力信號。 Referring to FIG. 1 to FIG. 3 together, the composite touch pressure sensitive layer 10s includes a flexible substrate layer 16 and a first touch pressure sensing layer 15 and a first layer respectively disposed on opposite sides of the flexible substrate layer 16. In the second touch pressure sensing layer 17 , the first touch pressure sensitive layer 15 and the second touch pressure sensitive layer 17 are opposite sides of the flexible substrate layer 16 as bearing surfaces. The first touch pressure sensing layer 15 is provided with a plurality of first direction touch piezoelectric electrodes 151, and the second touch pressure sensing layer 17 is provided with a plurality of second direction touch piezoelectric electrodes 171, a plurality of first The direction touch piezoelectric electrode 151 and the second direction touch piezoelectric electrode 171 detect both the touch signal and the pressure signal.

更具體地,偵測觸控信號及偵測壓力信號係分時序進行,並分別採用互電容及自電容的方式偵測。三維觸控總成10s先偵測觸控信號以對操作者在上基板11上的觸控操作進行觸控信號偵測以確定觸控操作所對應的位置,再偵測觸控點位置處所對應的第一方向觸控壓電電極151和/或第二方向觸控壓電電極171處所產生的壓力信號以確定按壓力值大小。 More specifically, the detection of the touch signal and the detection of the pressure signal are performed in time series, and are detected by mutual capacitance and self-capacitance respectively. The 3D touch sensor 10s first detects the touch signal to perform touch signal detection on the touch operation of the operator on the upper substrate 11 to determine the position corresponding to the touch operation, and then detects the position corresponding to the touch point. The first direction touches the pressure signal generated at the piezoelectric electrode 151 and/or the second direction touch piezoelectric electrode 171 to determine the pressing force value.

於偵測觸控信號時,多條第一方向觸控壓電電極151與多條第二方向觸控壓電電極171配合採用互電容的方式偵測觸控信號;又於偵測壓力信號時,每一條第一方向觸控壓電電極151與每一條第二方向觸控壓電電極171各自採用自電容的方式偵測所述壓力信號。 When detecting the touch signal, the plurality of first-direction touch piezoelectric electrodes 151 and the plurality of second-direction touch piezoelectric electrodes 171 cooperate with each other to detect the touch signals; and when detecting the pressure signals Each of the first direction touch piezoelectric electrodes 151 and each of the second direction touch piezoelectric electrodes 171 respectively detect the pressure signal by self-capacitance.

更進一步地,如第2圖和第3圖所示,所述第一觸控壓感層15包括多條沿第一方向(X方向)平行等間距排列的第一方向觸控壓電電極151,所述第二觸控壓感層17包括多條沿第二方向(Y方向)平行等間距排列的第二方向觸控壓電電極171,X方向正交於Y方向,即所述多條相互平行排列的第一方向觸控壓電電極151與多條相互平行排列的第二方向觸控壓電電極171正交。 Further, as shown in FIG. 2 and FIG. 3, the first touch pressure sensitive layer 15 includes a plurality of first direction touch piezoelectric electrodes 151 arranged in parallel in a first direction (X direction). The second touch pressure sensitive layer 17 includes a plurality of second direction touch piezoelectric electrodes 171 arranged in parallel in the second direction (Y direction), and the X direction is orthogonal to the Y direction, that is, the plurality of strips The first direction touch piezoelectric electrodes 151 arranged in parallel with each other are orthogonal to the plurality of second direction touch piezoelectric electrodes 171 arranged in parallel with each other.

第一觸控壓感層15上的每一第一方向觸控壓電電極151可通過兩導電線連接至一集成在一晶片上的三維信號處理電路18以形成封閉電性回路,俾利每一第一方向觸控壓電電極151執行自電容壓感偵測,第一觸控壓感層15上的多條導電線可選擇性地先透過該層對應的軟性電路板(圖中未示)進行訊號匯出,軟性電路板電性連接於三維信號處理電路18;同 樣地,第二觸控壓感層17的每一第二方向觸控壓電電極171亦可各自形成封閉電性回路以利自電容壓感偵測,並選擇性地使用軟性電路板通過該層對應的軟性電路板(圖未示)進行訊號匯出,軟性電路板電性連接於三維信號處理電路18。所述每一第一方向觸控壓電電極151和/或每一第二方向觸控壓電電極171之兩端的導電線兼具傳導觸控信號和壓力信號的功能。 Each of the first direction touch piezoelectric electrodes 151 on the first touch pressure sensing layer 15 can be connected to a three-dimensional signal processing circuit 18 integrated on a wafer through two conductive lines to form a closed electrical circuit. A first direction touch piezoelectric electrode 151 performs self-capacitance pressure sensing. The plurality of conductive lines on the first touch pressure sensing layer 15 can selectively pass through the corresponding flexible circuit board (not shown in the figure). The signal is remitted, and the flexible circuit board is electrically connected to the three-dimensional signal processing circuit 18; For example, each of the second direction touch piezoelectric electrodes 171 of the second touch pressure sensing layer 17 can also form a closed electrical loop to facilitate self-capacitance sensing, and selectively use the flexible circuit board to pass the The flexible circuit board (not shown) corresponding to the layer performs signal rendezvous, and the flexible circuit board is electrically connected to the three-dimensional signal processing circuit 18. Each of the first direction touch piezoelectric electrodes 151 and/or the conductive lines at both ends of each of the second direction touch piezoelectric electrodes 171 has a function of transmitting a touch signal and a pressure signal.

觸控操作者在上基板11的上表面進行觸控操作時,該觸控點處對應的一第一方向觸控壓電電極151或第二方向觸控壓電電極171,或一第一方向觸控壓電電極151和一第二方向觸控壓電電極171將同時受到壓力。 When the touch operator performs a touch operation on the upper surface of the upper substrate 11, the touch point corresponds to a first direction touch piezoelectric electrode 151 or the second direction touch piezoelectric electrode 171, or a first direction The touch piezoelectric electrode 151 and a second direction touch piezoelectric electrode 171 will be simultaneously subjected to pressure.

所述第一方向觸控壓電電極151和/或第二方向觸控壓電電極171導電性較佳,優選面電阻小於200歐姆/平方釐米的具有壓電特性的材料。第一方向觸控壓電電極151和第二方向觸控壓電電極171是在觸控操作下所產生的壓力而引起的變形、偏轉或剪切等應變性反應從而導致至少一個電性能發生改變的壓電材料。 The first direction touch piezoelectric electrode 151 and/or the second direction touch piezoelectric electrode 171 are preferably electrically conductive, and preferably have a piezoelectric property with a sheet resistance of less than 200 ohms/cm 2 . The first direction touch piezoelectric electrode 151 and the second direction touch piezoelectric electrode 171 are strain reactions such as deformation, deflection or shear caused by pressure generated under a touch operation, thereby causing at least one electrical property to change. Piezoelectric material.

第2圖和第3圖中僅以4條第一方向觸控壓電電極151與4條第二方向觸控壓電電極171為例來進行示意說明,實際上,數量不作限制。所述第一方向觸控壓電電極151與第二方向觸控壓電電極171的設置位置互補,從上基板11的正面的疊加效果來看,相當於用單層材料同時實現了觸控壓電電極(包括第一方向觸控壓電電極151和第二方向觸控壓電電極171)的配置。在本實施例中,所述X方向與Y方向正交,但X和Y方向的夾角角度不作限定。 In the second and third figures, only the four first-direction touch piezoelectric electrodes 151 and the four second-direction touch piezoelectric electrodes 171 are taken as an example for illustration. In fact, the number is not limited. The first direction touch piezoelectric electrode 151 and the second direction touch piezoelectric electrode 171 are disposed at complementary positions, and the superposition effect of the front surface of the upper substrate 11 is equivalent to realizing the touch pressure by using a single layer of material. The configuration of the electric electrode (including the first direction touch piezoelectric electrode 151 and the second direction touch piezoelectric electrode 171). In the present embodiment, the X direction is orthogonal to the Y direction, but the angle between the X and Y directions is not limited.

第2圖及第3圖中僅以串聯式菱形條狀的第一方向觸控壓電電極151和第二方向觸控壓電電極171為例來進行說明,實際上,其形狀可以是串聯的三角形、串聯的圓形、矩形,波浪形等其他形狀,其未加以限定。 In the second and third figures, only the first-direction touch piezoelectric electrode 151 and the second-direction touch piezoelectric electrode 171 in the form of a series of rhombic strips are taken as an example. In fact, the shape may be serially connected. Other shapes such as a triangle, a series of circles, a rectangle, a wave shape, and the like are not limited.

請再參閱第4圖,作為一種最佳實施例,所述第一觸控壓感層15和第二觸控壓感層17採用納米銀線PVDF(Polyvinylidene Fluoride,聚偏氟乙稀)壓電膜800圖案化後製成(圖案化結果可如第2圖及第6圖所示),即所述納米銀線PVDF壓電膜800為PVDF材料製成薄膜,所述PVDF材料中摻雜了多條納米銀線801。多條納米銀線801散佈並內嵌于納米銀線PVDF壓電膜800中,且相互搭接形成一個傳導網路以提高納米銀線PVDF壓電膜800的導電性。所謂納米銀線801(silver nano wires,簡稱SNW)是指橫向尺寸在10-450nm,縱向尺寸在10-300um範圍內的一種銀的形態。銀在一般狀態下為銀白色金屬,且為不透明材料,導電性極佳。 Referring to FIG. 4 again, as a preferred embodiment, the first touch pressure sensing layer 15 and the second touch pressure sensing layer 17 are made of nano silver wire PVDF (Polyvinylidene Fluoride) piezoelectric. The film 800 is patterned and patterned (the patterning result can be as shown in FIGS. 2 and 6), that is, the nano silver wire PVDF piezoelectric film 800 is made of a PVDF material, and the PVDF material is doped. A plurality of nano silver wires 801. A plurality of nano silver wires 801 are interspersed and embedded in the nano silver wire PVDF piezoelectric film 800 and overlap each other to form a conductive network to improve the conductivity of the nano silver wire PVDF piezoelectric film 800. The so-called silver nano wires (SNW) refer to a form of silver having a lateral dimension of 10-450 nm and a longitudinal dimension of 10-300 um. Silver is a silver-white metal in a normal state, and is an opaque material, and has excellent electrical conductivity.

於其他實施例中,觸控壓電電極的壓電材料可以是納米級的氧化銦錫(Indium Tin Oxide,ITO)、氧化錫銻(Antimony Doped Tin Oxide,ATO)、氧化鋅(ZnO)以及氧化鈦鋯、氧化銦鋅(IndiumZinc Oxide,IZO)、氧化鋅鋁(Aluminum Zinc Oxide,AZO)等類似金屬氧化物,石英、鈦酸鋇或鋯鈦酸鉛(PZT)及壓電陶瓷等中的一種或多種等具有壓電材料。其還可以是分散在絕緣、透明、可變形的基質中的銦錫氧化物(ITO)、摻銻的氧化錫(ATO)、摻鋁的氧化鋅(AZO)或其它透明導電氧化物的粒子,所述基質可包括聚 合物材料,例如是共聚物或三元共聚物的任一種,並未加以局限。 In other embodiments, the piezoelectric material of the touch piezoelectric electrode may be nano-scale Indium Tin Oxide (ITO), Antimony Doped Tin Oxide (ATO), zinc oxide (ZnO), and oxidation. Titanium zirconium, indium zinc oxide (IZO), aluminum oxide (Aluminium Zinc Oxide, AZO) and other similar metal oxides, quartz, barium titanate or lead zirconate titanate (PZT) and piezoelectric ceramics Or a variety of materials having piezoelectric materials. It may also be indium tin oxide (ITO), antimony-doped tin oxide (ATO), aluminum-doped zinc oxide (AZO) or other transparent conductive oxide particles dispersed in an insulating, transparent, deformable matrix. The substrate may comprise a poly The composite material, such as any of a copolymer or a terpolymer, is not limited.

於觸控壓感層尺寸上,第一觸控壓感層15和第二觸控壓感層17厚度約為10nm~5μm,優選為20nm~1μm,更優為20nm~100nm。優選透光率在90%以上。 The thickness of the first touch pressure sensitive layer 15 and the second touch pressure sensitive layer 17 is about 10 nm to 5 μm, preferably 20 nm to 1 μm, and more preferably 20 nm to 100 nm. Preferably, the light transmittance is 90% or more.

所述柔性基材層16為柔性材質,較佳地,厚度小於500μm,更佳地,厚度小於200μm。柔性基材層16材質可以是聚合物膜,所述聚合物膜諸如包括聚對苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、聚甲基丙烯酸甲酯(PMMA)或聚碳酸酯的膜,薄玻璃片(例如,100μm厚或更薄)或鈉鈣矽玻璃。跟進一步優選為透明柔性材質,透光率在80%以上(優選透光率在90%以上)。 The flexible substrate layer 16 is a flexible material, preferably having a thickness of less than 500 μm, and more preferably a thickness of less than 200 μm. The material of the flexible substrate layer 16 may be a polymer film such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polymethyl methacrylate. (PMMA) or a film of polycarbonate, a thin glass sheet (for example, 100 μm thick or thinner) or a soda lime glass. Further preferably, it is a transparent flexible material, and the light transmittance is 80% or more (preferably, the light transmittance is 90% or more).

在本發明中,三維信號處理電路18集成於一晶片上,其至少用於處理觸控信號及壓力信號(即互電容訊號及自電容信號)。為了清楚說明偵測觸控信號及壓力信號系分時序進行的,請參閱第5圖,It1和It2分別代表對依序兩相鄰觸控壓力電極(例如兩第一方向觸控壓電電極151)偵測觸控信號之時序,所述Ifa_1與Ifa_2代表對依序兩相鄰第一觸控壓感層15上二不同的第一方向觸控壓電電極151之壓力信號偵測時序,Ifb_1與Ifb_2代表對依序兩相鄰第二觸控壓感層17上二不同的第二方向觸控壓電電極171之壓力信號偵測時序。因第一方向觸控壓電電極151和第二方向觸控壓電電極171兼具觸控信號和壓力信號偵測功能,故,所述觸控信號與壓力信號偵測 分時序進行,即觸控信號與壓力信號偵測時段彼此分開進行,該分開進行的方式包括至少兩種: In the present invention, the three-dimensional signal processing circuit 18 is integrated on a wafer for processing at least touch signals and pressure signals (ie, mutual capacitance signals and self-capacitance signals). In order to clearly illustrate the timing of detecting the touch signal and the pressure signal, please refer to FIG. 5, and It1 and It2 respectively represent two adjacent touch pressure electrodes (for example, two first-direction touch piezoelectric electrodes 151). Detecting the timing of the touch signal, the Ifa_1 and Ifa_2 represent the pressure signal detection timing of the first different first-direction touch piezoelectric electrodes 151 on the two adjacent first touch pressure sensing layers 15, and Ifb_1 And Ifb_2 represents a pressure signal detection timing of the second different touch piezoelectric electrodes 171 on the two adjacent second touch pressure sensing layers 17 . Since the first direction touch piezoelectric electrode 151 and the second direction touch piezoelectric electrode 171 have both a touch signal and a pressure signal detection function, the touch signal and the pressure signal detection are performed. The timing is performed, that is, the touch signal and the pressure signal detection period are performed separately from each other, and the manner of performing the separation includes at least two types:

一、觸控信號與壓力信號偵測獨立進行;即信號處理電路18在分開的時段裡通過逐一掃描第一方向觸控壓電電極151和第二方向觸控壓電電極171以分別偵測觸控信號與壓力信號。觸控信號與壓力信號的偵測彼此相互獨立分時序進行。 1. The touch signal and the pressure signal are detected independently; that is, the signal processing circuit 18 scans the first direction touch piezoelectric electrode 151 and the second direction touch piezoelectric electrode 171 one by one in separate periods to respectively detect the touch. Control signal and pressure signal. The detection of the touch signal and the pressure signal are performed independently of each other in time series.

二、先偵測觸控信號以確定觸控點位置,再偵測壓力信號以確定按壓力值大小;三維信號處理電路18逐一掃描第一方向觸控壓電電極151和第二方向觸控壓電電極171以優先偵測觸控信號並對觸控信號進行處理後確定觸控點的位置,觸控點位置處所對應的第一方向觸控壓電電極151和/或第二方向觸控壓電電極171必定會受到按壓力產生壓力信號,由於觸控點位置已經確定,故,三維信號處理電路18隨即對觸控點位置處的第一方向觸控壓電電極151和第二方向觸控壓電電極171進行壓力信號的偵測即可。這樣可以節約程式的執行時間,以最快速度獲得觸控點位置及按壓力值的大小。 Secondly, detecting the touch signal to determine the position of the touch point, and then detecting the pressure signal to determine the pressing value; the three-dimensional signal processing circuit 18 scans the first direction touch piezoelectric electrode 151 and the second direction touch pressure one by one The electric electrode 171 determines the position of the touch point by preferentially detecting the touch signal and processing the touch signal, and the first direction touch piezoelectric electrode 151 and/or the second direction touch pressure corresponding to the touch point position The electric electrode 171 is surely subjected to the pressure generating pressure signal. Since the position of the touch point has been determined, the three-dimensional signal processing circuit 18 then touches the piezoelectric electrode 151 and the second direction touch to the first direction at the position of the touch point. The piezoelectric electrode 171 can detect the pressure signal. This saves the execution time of the program and obtains the position of the touch point and the pressure value at the fastest speed.

三維觸控總成10對觸控信號採用互電容方式偵測,對壓力信號採用自電容的方式偵測,所述互電容方式偵測觸控信號具體為:所述觸控單元由第一方向觸控壓電電極151與第二方向觸控壓電電極171所界定,其具有電容效應,即第一方向觸控壓電電極151與第二方向觸控壓電電極171之間形成電容,第一方向觸控壓電電極151相當於電容的上極板,所述第二方向觸控壓電電極171相當於電容的下極板,當用戶手 指或觸控筆等在上基板11上進行觸控操作時,影響了觸控點處對應的觸控單元上下極板之間的耦合,從而改變了這兩個極板之間的電容量。所述電容量的改變形成觸控信號傳遞至三維信號處理電路18。 The three-dimensional touch control assembly 10 detects the touch signal by mutual capacitance, and the pressure signal is detected by self-capacitance. The mutual-capacitance detection of the touch signal is specifically: the touch unit is in the first direction. The touch piezoelectric electrode 151 and the second-direction touch piezoelectric electrode 171 are defined, and have a capacitive effect, that is, a capacitance is formed between the first-direction touch piezoelectric electrode 151 and the second-direction touch piezoelectric electrode 171. The one-direction touch piezoelectric electrode 151 is equivalent to the upper plate of the capacitor, and the second-direction touch piezoelectric electrode 171 is equivalent to the lower plate of the capacitor, when the user hands When the touch operation is performed on the upper substrate 11 by the finger or the stylus pen, the coupling between the upper and lower plates of the corresponding touch unit at the touch point is affected, thereby changing the capacitance between the two plates. The change in capacitance forms a touch signal to the three-dimensional signal processing circuit 18.

又于壓力信號偵測時,所述自電容方式偵測壓力信號具體為:每一第一方向觸控壓電電極151與第二方向觸控壓電電極171兩端設置有導電線,所述二導電線和三維信號處理電路18及第一方向觸控壓電電極151或第二方向觸控壓電電極171構成閉合回路以偵測壓力信號。 In the case of the pressure signal detection, the self-capacitance mode detecting the pressure signal is specifically: each of the first direction touch piezoelectric electrode 151 and the second direction touch piezoelectric electrode 171 are provided with conductive lines at both ends thereof, The two conductive lines and the three-dimensional signal processing circuit 18 and the first direction touch piezoelectric electrode 151 or the second direction touch piezoelectric electrode 171 form a closed loop to detect the pressure signal.

在壓力信號偵測上,所述第一觸控壓感層15和第二觸控壓感層17相互獨立,但三維信號處理電路18對第一觸控壓感層15和第二觸控壓感層17所偵測到的壓力信號的處理方式能體現壓力信號疊加有益效果。 In the detection of the pressure signal, the first touch pressure sensitive layer 15 and the second touch pressure sensitive layer 17 are independent of each other, but the three-dimensional signal processing circuit 18 applies the first touch pressure sensitive layer 15 and the second touch pressure. The processing method of the pressure signal detected by the sensing layer 17 can reflect the beneficial effect of the pressure signal superposition.

由上述本發明實施方式可知,與現有技術相比,本發明揭示的三維觸控總成10至少具有如下優點: It can be seen from the above embodiments of the present invention that the three-dimensional touch control assembly 10 disclosed in the present invention has at least the following advantages compared with the prior art:

1.本發明中第一觸控壓感層15和第二觸控壓感層17為導電性較好的壓電材料製成,其同時具備觸控信號偵測和壓力信號偵測功能,如此可以大大降低三維觸控總成10的厚度,且觸控信號與壓力信號採用同一組導電線匯出,其可以減少線路的排佈,避免了傳統三維觸控總成所存在的線路繁雜的問題。 1. In the present invention, the first touch pressure sensitive layer 15 and the second touch pressure sensitive layer 17 are made of a piezoelectric material having good conductivity, and simultaneously have a touch signal detection and a pressure signal detection function. The thickness of the three-dimensional touch control assembly 10 can be greatly reduced, and the touch signal and the pressure signal are sent out by the same set of conductive lines, which can reduce the arrangement of the lines and avoid the complicated circuit of the traditional three-dimensional touch assembly. .

2.本發明中複合觸控壓感層10s結構為過柔性基材層16兩側設置第一觸控壓感層15和第二觸控壓感層17,柔性基材層16的設置可以使得複合觸控壓感層10s能夠靈敏響應 於觸控操作產生一定的形變以提升三維觸控總成10的壓力信號偵測靈敏度。 2. The composite touch-sensitive layer 10s of the present invention has a first touch-sensitive layer 15 and a second touch-sensitive layer 17 disposed on both sides of the flexible substrate layer 16. The flexible substrate layer 16 can be disposed. Composite touch pressure sensitive layer 10s can respond sensitively The touch operation generates a certain deformation to improve the pressure signal detection sensitivity of the three-dimensional touch assembly 10.

3.本發明中採用的是互電容的偵測方式偵測觸控信號,採用自電容的方式偵測壓力信號,所述兩者響應於觸控操作所產生的觸控信號與壓力信號變化均為電容量的改變,即兩者因觸控操作所引起的信號類型變化一致。由於兩者的信號類型變化的一致性,其能夠通過同一處理電路來實現信號的偵測,在本發明中通過一套硬體設備(集成在一晶片上的三維信號處理電路18)就可以實現對觸控信號以及壓力信號的處理。生產廠商無需設計兩套獨立的硬體設備來對壓力信號和觸控信號進行處理。如此提高了電容式三維偵測模組10的集成度,降低了硬體設備的成本。避免了現有具有壓電偵測的觸控總成所存在的多套硬體設備所帶來的硬體複雜,成本高等問題。 3. In the present invention, a mutual capacitance detection method is used to detect a touch signal, and a self-capacitance method is used to detect a pressure signal, and both of the two touch signals and pressure signals are generated in response to a touch operation. The change in capacitance is the same as the change in the type of signal caused by the touch operation. Due to the consistency of the signal types of the two, it is possible to realize signal detection through the same processing circuit, which can be realized in the present invention by a set of hardware devices (three-dimensional signal processing circuit 18 integrated on a wafer) Processing of touch signals and pressure signals. Manufacturers do not need to design two separate hardware devices to handle pressure signals and touch signals. This improves the integration of the capacitive 3D detection module 10 and reduces the cost of the hardware device. The hardware complexity and high cost caused by the multiple sets of hardware devices existing in the existing touch detection assembly with piezoelectric detection are avoided.

4.三維偵測模組10分時序偵測觸控點位置以及按壓力值。最佳地,三維偵測模組10先偵測觸控點的位置,然後再偵測觸控點位置處所對應的觸控壓電電極所受到的按壓力值,在按壓力值的偵測過程中,三維信號處理電路18無需對觸控壓電電極全部逐一偵測,如此一來,提高了偵測效率,降低了硬體損耗。 4. The 3D detection module 10 detects the position of the touch point and the pressing value according to the timing. Preferably, the three-dimensional detection module 10 first detects the position of the touch point, and then detects the pressing force value of the touch piezoelectric electrode corresponding to the position of the touch point, and detects the pressing value. The three-dimensional signal processing circuit 18 does not need to detect the touch piezoelectric electrodes one by one, thereby improving the detection efficiency and reducing the hardware loss.

5.在本發明中第一方向觸控壓電電極151和第二方向觸控壓電電極171可以優選為納米銀線PVDF壓電膜800製成,由於其內散佈並嵌入了納米銀線,納米銀線在其內部形成傳導網路,故,其導電性非常好,而納米銀線PVDF壓電膜800本身具有較好的壓電特性,因此第一方向觸控壓電電極 151和第二方向觸控壓電電極171採用納米銀線PVDF壓電膜800製作時,觸控信號和壓力信號的偵測效果均非常理想。 5. In the present invention, the first direction touch piezoelectric electrode 151 and the second direction touch piezoelectric electrode 171 may be preferably made of a nano silver wire PVDF piezoelectric film 800, because the nano silver wire is dispersed and embedded therein. The nano silver wire forms a conductive network inside, so the conductivity is very good, and the nano silver wire PVDF piezoelectric film 800 itself has good piezoelectric characteristics, so the first direction touch piezoelectric electrode When the 151 and the second direction touch piezoelectric electrodes 171 are fabricated by using the nano silver wire PVDF piezoelectric film 800, the detection effects of the touch signal and the pressure signal are very satisfactory.

請參閱第6圖和第7圖,本發明第二實施例具有壓電偵測的觸控總成(未標號)與第一實施例的不同之處僅在於:所述複合觸控壓感層10a包括一柔性基材層16a,該柔性基材層16a相對的兩側分別設置一第一觸控壓感層15a和一第二觸控壓感層17a。所述第一觸控壓感層15a和第二觸控壓感層17a上分別設置有多條沿第一方向(X方向)平行等間距排列的第一方向觸控壓電電極151a和多條沿第二方向(Y方向)平行等間距排列的第二方向觸控壓電電極171a,所述第一方向觸控壓電電極151a和第二方向觸控壓電電極171a為矩形長條狀。 Referring to FIG. 6 and FIG. 7 , the touch sensing assembly (not labeled) having piezoelectric detection according to the second embodiment of the present invention is different from the first embodiment only in that: the composite touch pressure sensing layer 10a includes a flexible substrate layer 16a. A first touch-sensitive layer 15a and a second touch-sensitive layer 17a are disposed on opposite sides of the flexible substrate layer 16a. The first touch pressure sensitive layer 15a and the second touch pressure sensitive layer 17a are respectively provided with a plurality of first direction touch piezoelectric electrodes 151a and a plurality of strips arranged in parallel in the first direction (X direction). The second direction touch piezoelectric electrodes 171a are arranged in parallel in the second direction (Y direction), and the first direction touch piezoelectric electrodes 151a and the second direction touch piezoelectric electrodes 171a have a rectangular strip shape.

雖然上文實施方式中揭露了本發明的具體實施例,然其並非用以限定本發明,本發明所屬技術領域中具有通常知識者,在不悖離本發明之原理與精神的情形下,當可對其進行各種更動與修飾,因此本發明之保護範圍當以附隨申請專利範圍所界定者為準。 Although the embodiments of the present invention are disclosed in the above embodiments, the present invention is not intended to limit the invention, and the present invention may be practiced without departing from the spirit and scope of the invention. Various changes and modifications may be made thereto, and the scope of the invention is defined by the scope of the appended claims.

10‧‧‧三維觸控總成 10‧‧‧3D touch assembly

10s‧‧‧複合觸控壓感層 10s‧‧‧Composite touch pressure layer

11‧‧‧上基板 11‧‧‧Upper substrate

12‧‧‧貼合層 12‧‧‧Fitting layer

15‧‧‧第一觸控壓感層 15‧‧‧First touch pressure sensitive layer

16‧‧‧柔性基材層 16‧‧‧Flexible substrate layer

17‧‧‧第二觸控壓感層 17‧‧‧Second touch pressure layer

18‧‧‧三維信號處理電路 18‧‧‧Three-dimensional signal processing circuit

Claims (10)

一種三維觸控總成,包括:一複合觸控壓感層,包括:一柔性基材層;一第一觸控壓感層,該第一觸控壓感層上設置多條第一方向觸控壓電電極;以及一第二觸控壓感層,該第二觸控壓感層上設置多條第二方向觸控壓電電極,其中該第一觸控壓感層與該第二觸控壓感層分別設置在該柔性基材層兩側,該些第一方向觸控壓電電極與該些第二方向觸控壓電電極以分時序方式偵測觸控信號且偵測壓力信號。 A three-dimensional touch assembly includes: a composite touch pressure sensing layer comprising: a flexible substrate layer; a first touch pressure sensing layer, wherein the first touch pressure sensing layer is provided with a plurality of first direction touches And controlling a piezoelectric electrode; and a second touch pressure sensing layer, wherein the second touch pressure sensing layer is provided with a plurality of second direction touch piezoelectric electrodes, wherein the first touch pressure sensing layer and the second touch The control pressure sensing layers are respectively disposed on two sides of the flexible substrate layer, and the first direction touch piezoelectric electrodes and the second direction touch piezoelectric electrodes detect the touch signals in a time-series manner and detect the pressure signals. . 如請求項1所述之三維觸控總成,其中偵測該觸控信號及偵測該壓力信號係分別採用互電容及自電容的方式偵測。 The three-dimensional touch control assembly of claim 1, wherein detecting the touch signal and detecting the pressure signal are respectively detected by mutual capacitance and self-capacitance. 如請求項2所述之三維觸控總成,其中該三維觸控總成偵測該觸控信號以確定一觸控點位置,且該三維觸控總成偵測該觸控點位置處所對應的該第一方向觸控壓電電極和/或該第二方向觸控壓電電極處所產生的壓力信號以確定按壓力值大小。 The three-dimensional touch assembly of claim 2, wherein the three-dimensional touch assembly detects the touch signal to determine a touch point position, and the three-dimensional touch assembly detects the position of the touch point The pressure signal generated by the first direction touch piezoelectric electrode and/or the second direction touch piezoelectric electrode determines the pressing force value. 如請求項2所述之三維觸控總成,其中於偵測該觸控信號時,該些第一方向觸控壓電電極與該些第二方向觸控壓電電極配合採用互電容的方式偵測該觸控信號。 The three-dimensional touch control assembly of claim 2, wherein when the touch signal is detected, the first direction touch piezoelectric electrodes and the second direction touch piezoelectric electrodes cooperate with each other by mutual capacitance Detecting the touch signal. 如請求項2所述之三維觸控總成,其中於偵測該壓力信號時,該些第一方向觸控壓電電極的每一者和/或該些第二方向觸控壓電電極的每一者各自採用自電容的方式偵測該壓力信號。 The three-dimensional touch control assembly of claim 2, wherein each of the first direction touch piezoelectric electrodes and/or the second direction touch piezoelectric electrodes are detected when the pressure signal is detected Each of them uses a self-capacitance method to detect the pressure signal. 如請求項1所述之三維觸控總成,其中於偵測該壓力信號時,將位於該柔性基材層兩側且位置對應的該第一方向觸控壓電電極和該第二方向觸控壓電電極分別偵測到的壓力信號疊加。 The three-dimensional touch control assembly of claim 1, wherein the first direction touch piezoelectric electrode and the second direction touch corresponding to the two sides of the flexible substrate layer are detected when the pressure signal is detected The pressure signals detected by the piezoelectric electrodes are superimposed. 如請求項1所述之三維觸控總成,其中該些第一方向觸控壓電電極的每一者與該些二方向觸控壓電電極的每一者兩端設置一導電線,該導電線直接連接至一集成在一晶片上的一三維信號處理電路,或通過一軟性電路板連接至該三維信號處理電路。 The three-dimensional touch control assembly of claim 1, wherein each of the first-direction touch piezoelectric electrodes and each of the two-direction touch piezoelectric electrodes are provided with a conductive line. The conductive lines are directly connected to a three-dimensional signal processing circuit integrated on a wafer or connected to the three-dimensional signal processing circuit via a flexible circuit board. 如請求項1所述之三維觸控總成,其中該第一觸控壓感層和該第二觸控壓感層由面電阻小於200歐姆/平方釐米的具有壓電特性的材料製成。 The three-dimensional touch assembly of claim 1, wherein the first touch pressure sensitive layer and the second touch pressure sensitive layer are made of a piezoelectric material having a sheet resistance of less than 200 ohms/cm 2 . 如請求項1所述之三維觸控總成,其中該第一觸控壓感層和該第二觸控壓感層由納米銀線PVDF壓電膜經過圖案化處理形成。 The three-dimensional touch sensor assembly of claim 1, wherein the first touch pressure sensitive layer and the second touch pressure sensitive layer are formed by patterning a nano silver wire PVDF piezoelectric film. 如請求項9所述之三維觸控總成,其中該納米銀線PVDF壓電膜內部散佈有多條納米銀線,該些納米銀線之間相互搭接形成傳導網路。 The three-dimensional touch assembly of claim 9, wherein the nano silver wire PVDF piezoelectric film is internally dispersed with a plurality of nano silver wires, and the nano silver wires overlap each other to form a conductive network.
TW105118008A 2015-09-30 2016-06-07 Three-dimensional touch screen assembly TWI607359B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510638679.1A CN106557211B (en) 2015-09-30 2015-09-30 Three-dimensional touch assembly

Publications (2)

Publication Number Publication Date
TW201712505A TW201712505A (en) 2017-04-01
TWI607359B true TWI607359B (en) 2017-12-01

Family

ID=57849453

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105208594U TWM530433U (en) 2015-09-30 2016-06-07 Three-dimensional touch screen assembly
TW105118008A TWI607359B (en) 2015-09-30 2016-06-07 Three-dimensional touch screen assembly

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW105208594U TWM530433U (en) 2015-09-30 2016-06-07 Three-dimensional touch screen assembly

Country Status (2)

Country Link
CN (1) CN106557211B (en)
TW (2) TWM530433U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106557211B (en) * 2015-09-30 2024-01-23 宸鸿科技(厦门)有限公司 Three-dimensional touch assembly

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201205404A (en) * 2010-07-16 2012-02-01 Elan Microelectronics Corp Three-dimensional touch sensor and application thereof
CN103019449A (en) * 2012-12-24 2013-04-03 江苏物联网研究发展中心 Three-dimensional multi-point type touch screen based on pressure sensor
TWI448935B (en) * 2011-05-20 2014-08-11 Nat Univ Tsing Hua 3-d touch sensor and 3-d touch panel
TW201516806A (en) * 2013-10-16 2015-05-01 Acer Inc Three-dimension touch apparatus
TWM530433U (en) * 2015-09-30 2016-10-11 宸鴻科技(廈門)有限公司 Three-dimensional touch screen assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2928472B3 (en) * 2008-03-04 2010-04-02 Young Fast Optoelectronics Co DUPLEX TOUCH PANEL
CN202189339U (en) * 2011-05-28 2012-04-11 宸鸿科技(厦门)有限公司 Touch-point detector
CN102929422B (en) * 2011-08-10 2017-04-12 谱瑞科技股份有限公司 Force sensing capacitive hybrid touch sensor
CN104423740B (en) * 2013-08-30 2018-07-13 唐山东唐电气股份有限公司 Method for sensing based on capacitive touch device
US10459614B2 (en) * 2013-12-04 2019-10-29 Hideep Inc. System and method for controlling object motion based on touch

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201205404A (en) * 2010-07-16 2012-02-01 Elan Microelectronics Corp Three-dimensional touch sensor and application thereof
TWI448935B (en) * 2011-05-20 2014-08-11 Nat Univ Tsing Hua 3-d touch sensor and 3-d touch panel
CN103019449A (en) * 2012-12-24 2013-04-03 江苏物联网研究发展中心 Three-dimensional multi-point type touch screen based on pressure sensor
TW201516806A (en) * 2013-10-16 2015-05-01 Acer Inc Three-dimension touch apparatus
TWM530433U (en) * 2015-09-30 2016-10-11 宸鴻科技(廈門)有限公司 Three-dimensional touch screen assembly

Also Published As

Publication number Publication date
TWM530433U (en) 2016-10-11
TW201712505A (en) 2017-04-01
CN106557211B (en) 2024-01-23
CN106557211A (en) 2017-04-05

Similar Documents

Publication Publication Date Title
TWI526885B (en) Touch panel and electronic machine with push detection function
JP5897055B2 (en) Pressure sensor and touch panel
US9395836B2 (en) System and method for reducing borders of a touch sensor
WO2017045382A1 (en) Touchscreen and pressure touch control detection method thereof
WO2016065800A1 (en) Touch screen and manufacturing method therefor, and display panel
US20170357346A1 (en) Touch screen and pressure touch detection method
US20120206401A1 (en) Hybrid touch panel device
US20140209444A1 (en) Touch panel
US20130141118A1 (en) Capacitive Coupling of Bond Pads
US9753595B2 (en) Touch screen panel
JP5806684B2 (en) Coordinate input device
WO2016045240A1 (en) Touch display panel, manufacturing method for same, driving method therefor, and touch display device
TWI579756B (en) Three-dimensional input module
US9201530B2 (en) Touch panel having conductive particle layer
KR20130109288A (en) Touch panel and method of the same
US8921727B2 (en) Double-layer electrode device
TWI776832B (en) Touch sensor and display device including the same
CN206115404U (en) Touch display device
TWI607359B (en) Three-dimensional touch screen assembly
EP3167261B1 (en) Human-machine interface with graphene-pyroelectric materials
KR20130107682A (en) Touch panel
TW201435678A (en) Touch sensor with cover lens
CN102339182A (en) Single layer indium tin oxide (ITO) wiring structure
JP2014146138A (en) Touch panel
WO2017107201A1 (en) 3d touch screen and touch membrane structure