TWI604557B - Wafer catching equipment - Google Patents
Wafer catching equipment Download PDFInfo
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- TWI604557B TWI604557B TW106102505A TW106102505A TWI604557B TW I604557 B TWI604557 B TW I604557B TW 106102505 A TW106102505 A TW 106102505A TW 106102505 A TW106102505 A TW 106102505A TW I604557 B TWI604557 B TW I604557B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本發明涉及半導體製造技術領域，特別是涉及一種晶圓片架的取放片裝置。 The present invention relates to the field of semiconductor manufacturing technology, and in particular to a pick and place device for a wafer carrier.
傳統的半導體矽片片架在設備取放片的方法是將片架水平地放置於設備的裝載埠(Load Port)，使片架中的矽片也呈水平方向，設備的機械手臂控制葉片(Blade)伸入矽片間隙取片或放片，如果矽片沒有雙面拋光，一般取片方式為真空吸附式，如果矽片已做雙面拋光，取片方式為邊緣抓取式。邊緣抓取式一般在機械手臂的葉片上設有固定墊(Retaining Pad)與壓片(Presser)便於抓取，使得伸入矽片間隙的葉片總厚度約4~5mm。 The conventional semiconductor wafer carrier is placed on the device by placing the film holder horizontally on the load port of the device, so that the blade in the frame is also horizontal, and the mechanical arm of the device controls the blade ( Blade) extends into the gap of the cymbal to take or release the film. If the cymbal is not double-sided polished, the general method of taking the film is vacuum adsorption. If the cymbal has been double-sided polished, the splicing method is edge grabbing. The edge gripping type is generally provided with a retaining pad and a presser on the blade of the robot arm for easy grasping, so that the total thickness of the blade extending into the gap of the cymbal is about 4 to 5 mm.
這在國際半導體產業協會(SEMI)的標準下，即片架中矽片與矽片間隙(Pitch Size)為10mm，是不會產生問題的。但由於各矽片廠商廠內使用的片架未必都是10mm的間隙，處於其他考量，可能會使用間隙小於10mm，如7mm或5mm的片架，這時上述傳統方式取放片會產生問題。由於伸入矽片間隙的葉片總厚度約4~5mm，再加上矽片自重導致葉片產生一定的彎曲，葉片刮到矽片的可能性隨著片架中矽片與矽片間隙的縮小而加大。另外片架之間也有差異，一定程度上加大了刮片的風險。 This is not a problem under the standards of the International Semiconductor Industry Association (SEMI), that is, the blade and the Pitch Size of the film are 10 mm. However, since the racks used by the various chip manufacturers are not necessarily 10 mm gaps, other considerations may use a frame with a gap of less than 10 mm, such as 7 mm or 5 mm. At this time, the above-mentioned conventional method of picking and placing the film may cause problems. Since the total thickness of the blade extending into the gap of the cymbal is about 4~5mm, and the weight of the cymbal itself causes the blade to bend, the possibility of the blade scraping the cymbal is reduced with the gap between the cymbal and the cymbal in the frame. Increase. In addition, there are also differences between the shelves, which increases the risk of the blade to some extent.
因此，實有必要對傳統的矽片取放片方式進行改良，避免取 放片時造成的晶圓損傷。 Therefore, it is necessary to improve the traditional smashing and taking method to avoid taking Wafer damage caused by film placement.
鑒於以上所述現有技術，本發明的目的在於提供一種晶圓片架的取放片裝置，用於解決現有技術中從片架中取放片時易造成晶圓損傷等問題。 In view of the above-mentioned prior art, it is an object of the present invention to provide a pick-and-place device for a wafer carrier, which is used to solve the problems of wafer damage and the like in the prior art when the film is taken from the film rack.
為實現上述目的及其他相關目的，本發明提供一種晶圓片架的取放片裝置，所述晶圓片架設有固定間距的承載部，承載部承載多片平行豎立的晶圓，承載部的與該些晶圓相互垂直的上側設有一第一開口，該些晶圓透過所述第一開口被豎直地取出或放入，承載部中與所述第一開口相對的下側設有一第二開口，所述第二開口露出該些晶圓的邊緣；所述晶圓片架的取放片裝置包括：一固定器模組，所述固定器模組位於所述晶圓片架下方，設有依據所述固定間距平行放置的多個定位槽，所述多個定位槽的位置與所述晶圓片架中平行豎立的多片晶圓的位置相對應；一控制模組，所述控制模組控制所述固定器模組的每一個定位槽的上升和下降，使定位槽從原位上升，經過所述第二開口與對應的晶圓相卡合，並將對應的晶圓推送出所述第一開口，或使已上升的定位槽下降回原位；一機械手臂，所述機械手臂根據所述控制模組的控制抓取或放回被所述定位槽推送出所述第一開口的晶圓。 To achieve the above and other related objects, the present invention provides a wafer carrier pick-and-place device, the wafer carrier is provided with a fixed-pitch bearing portion, and the carrier portion carries a plurality of parallel-erected wafers, and the carrier portion a first opening is disposed on the upper side of the wafer perpendicular to the wafer, and the wafers are vertically taken out or placed through the first opening, and a lower side of the carrying portion opposite to the first opening is provided a second opening exposing an edge of the wafer; the pick and place device of the wafer rack includes: a holder module, the holder module is located below the wafer holder Providing a plurality of positioning grooves arranged in parallel according to the fixed spacing, the positions of the plurality of positioning grooves corresponding to positions of the plurality of wafers standing parallel in the wafer holder; a control module, the The control module controls the rise and fall of each of the positioning slots of the fixture module to raise the positioning slot from the home position, engage the corresponding wafer through the second opening, and push the corresponding wafer Out of the first opening, or to make the rise Grooves drop back into place; a robot, the transfer robot or replace control module according to the control slot is positioned to push the wafer out of the first opening.
如上所述，本發明的晶圓片架的取放片裝置，具有以下有益效果：本發明的晶圓片架的取放片裝置通過固定器模組將需要取出的晶圓從晶圓片架中推出，並可透過控制模組根據設定順序取片。這樣在取放片時機械手臂無阻擋，可避免傳統取放片時機械手臂在多片晶圓間隙之間進 行操作而造成的晶圓損傷，從而可提高生產良率。 As described above, the pick-and-place device of the wafer rack of the present invention has the following advantageous effects: the pick-and-place device of the wafer rack of the present invention removes the wafer to be taken out from the wafer rack through the fixture module. Introduced in the middle, and can be taken according to the set order through the control module. In this way, the robot arm is unobstructed when the tablet is taken and placed, and the mechanical arm can be prevented from entering between the plurality of wafer gaps when the conventional pick-and-place film is taken. The wafer damage caused by the operation can improve the production yield.
在實施過程中，可採用雙操作葉片(Blade)設計，在一個操作葉片將前一片晶圓放回前，另一個操作葉片先將後一片晶圓取片，從而可以提高設備產能。 In the implementation process, a dual operation blade (Blade) design can be adopted, and the other operation blade can take the latter wafer first before the operation blade returns the previous wafer, thereby increasing the equipment productivity.
1‧‧‧晶圓片架 1‧‧‧ wafer holder
101‧‧‧第一開口 101‧‧‧ first opening
102‧‧‧第二開口 102‧‧‧second opening
103‧‧‧晶圓 103‧‧‧ wafer
2‧‧‧固定器模組 2‧‧‧Retainer module
201‧‧‧定位槽 201‧‧‧ positioning slot
3‧‧‧控制模組 3‧‧‧Control Module
4‧‧‧機械手臂 4‧‧‧ Robotic arm
第1圖繪示本發明一實施例的晶圓片架的取放片裝置之示意圖。 FIG. 1 is a schematic view showing a pick-and-place device of a wafer rack according to an embodiment of the invention.
第2圖繪示本發明一實施例的晶圓片架的剖示圖。 2 is a cross-sectional view showing a wafer carrier according to an embodiment of the present invention.
第3圖繪示本發明具有一組定位槽的固定器模組的定位槽與晶圓的對應關係示意圖。 FIG. 3 is a schematic diagram showing the correspondence between the positioning groove and the wafer of the fixture module having a plurality of positioning slots according to the present invention.
第4圖繪示本發明具有兩組定位槽的固定器模組的定位槽與晶圓的對應關係示意圖。 FIG. 4 is a schematic diagram showing the correspondence between the positioning groove and the wafer of the holder module having two sets of positioning grooves according to the present invention.
第5圖繪示本發明一實施例之進行單片晶圓的取放片的工作狀態示意圖。 FIG. 5 is a schematic view showing the working state of a pick-and-place wafer for a single wafer according to an embodiment of the invention.
第6圖繪示本發明一實施例之進行多片晶圓的取放片的工作狀態示意圖。 FIG. 6 is a schematic view showing an operation state of a plurality of wafer pick-and-place sheets according to an embodiment of the present invention.
以下透過特定的具體實施例說明本發明的實施方式，該發明所屬技術領域中具有通常知識者可由本說明書所揭露的內容輕易地瞭解本發明的其他優點與功效。本發明還可以透過另外不同的具體實施方式加以實施或應用，本說明書中的各項細節也可以基於不同觀點與應用，在沒有背離本發明的精神下進行各種修飾或改變。需說明的是，在不衝突的情況 下，以下實施例及實施例中的特徵可以相互組合。 The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily appreciate the other advantages and advantages of the present invention. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes may be made without departing from the spirit and scope of the invention. It should be noted that in the case of no conflict The features of the following embodiments and examples may be combined with each other.
需要說明的是，以下實施例中所提供的圖示僅以示意方式說明本發明的基本構想，遂圖式中僅顯示與本發明中有關的組件而非按照實際實施時的元件數目、形狀及尺寸繪製，其實際實施時各元件的型態、數量及比例可為一種隨意的改變，且其元件佈局型態也可能更為複雜。 It should be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present invention in a schematic manner, and only the components related to the present invention are shown in the drawings, rather than the number and shape of components in actual implementation. Dimensional drawing, the actual type of implementation of each component type, number and proportion can be a random change, and its component layout can be more complicated.
本發明實施例提供一種晶圓片架的取放片裝置，請參閱第1圖。所述的晶圓片架1設有數個固定間距的承載部，該些承載部分別平行豎直地承載複數片晶圓103，該晶圓片架1在與該些平行豎立的晶圓103相互垂直的上側設有一第一開口101，該些平行豎立的晶圓103透過所述第一開口101被豎直地取出或放入，該晶圓片架1在與所述第一開口101相對的下側設有第二開口102，所述第二開口102露出該些平行豎立的多片晶圓103的邊緣； 與所述晶圓片架1對應的取放片裝置包括以下部件：一固定器模組2，所述固定器模組2位於所述晶圓片架1的下方，固定器模組2依據所述固定間距平行地設置複數個定位槽201，所述複數個定位槽201的位置與所述晶圓片架1內平行豎立的晶圓103的位置相對應；一控制模組3，所述控制模組3控制所述固定器模組2的每一個定位槽201的上升和下降，使定位槽201從原位上升，接著通過所述第二開口102而與對應的晶圓103相卡合，並將對應的晶圓103推送出所述第一開口101，或者使已上升的定位槽201下降回原位；一機械手臂4，所述機械手臂4根據所述控制模組3的控制來抓取或放回被所述定位槽201推送出所述第一開口101的晶圓103。 The embodiment of the invention provides a pick-and-place device for a wafer carrier, please refer to FIG. The wafer rack 1 is provided with a plurality of fixed-pitch bearing portions, which respectively carry a plurality of wafers 103 vertically in parallel, and the wafer carrier 1 is in mutual with the parallel-standing wafers 103 A vertical opening 101 is disposed through the first opening 101, and the wafer holder 1 is vertically opposite to the first opening 101. a second opening 102 is disposed on the lower side, and the second opening 102 exposes edges of the plurality of parallel erected wafers 103; The pick-and-place device corresponding to the wafer carrier 1 comprises the following components: a holder module 2, the holder module 2 is located below the wafer holder 1, and the holder module 2 is The plurality of positioning slots 201 are disposed in parallel with the fixed pitch, and the positions of the plurality of positioning slots 201 correspond to the positions of the wafers 103 standing upright in the wafer holder 1; a control module 3, the control The module 3 controls the rise and fall of each of the positioning slots 201 of the holder module 2 to raise the positioning slot 201 from the home position, and then engages with the corresponding wafer 103 through the second opening 102. And pushing the corresponding wafer 103 out of the first opening 101, or lowering the raised positioning slot 201 back to the original position; a robot arm 4, the robot arm 4 is grasped according to the control of the control module 3 The wafer 103 pushed out of the first opening 101 by the positioning groove 201 is taken or replaced.
需要說明的是，滿足上述晶圓片架1的結構要求的各種晶圓 片架應當均可使用本發明提供的取放片裝置進行晶圓的取放。本實施例所述的晶圓片架1可以是各種外部結構不同的晶圓片架，也可以具有其他結構和部件，本發明對此不作限制。所述的固定間距可以小於等於10mm，或其他適合的尺寸。不同的晶圓片架承載晶圓時可以設有不同的固定間距，採用本發明裝置取放片時，取放片裝置的多個定位槽的間距可以依據不同的晶圓片架進行調整，與需要取放片的晶圓片架採用的固定間距保持一致。 It should be noted that various wafers satisfying the structural requirements of the wafer rack 1 described above are required. The rack should be capable of picking up and dropping the wafer using the pick and place apparatus provided by the present invention. The wafer carrier 1 of the present embodiment may be a plurality of wafer holders having different external structures, and may have other structures and components, which are not limited by the present invention. The fixed spacing can be less than or equal to 10 mm, or other suitable dimensions. Different wafer racks can be provided with different fixed spacings when carrying wafers. When the device of the present invention is used for picking and placing sheets, the spacing of the plurality of positioning slots of the pick and place device can be adjusted according to different wafer racks, and The wafer holders that need to be placed and placed have a uniform spacing that is consistent.
為了詳細說明本發明的技術內容，第2圖提供了一種晶圓片架1的剖示圖。如第2圖所示，晶圓103卡合於晶圓片架1中，晶圓片架1的上側以及相對的下側分別設有一第一開口101以及一第二開口102，所述第一開口101的最大寬度大於所述第二開口102的最大寬度。第二開口102僅露出晶圓103的部分邊緣。所述固定器模組2設置於第二開口102的下方。所述固定器模組2中定位槽201的數量可以與晶圓片架1可放置的晶圓數量一致，每個定位槽201之間的間隙與片架中晶圓間隙一致，每個定位槽201剛好處於每片晶圓的下方，每個定位槽201可以單獨上下移動。 In order to explain the technical content of the present invention in detail, FIG. 2 provides a cross-sectional view of the wafer carrier 1. As shown in FIG. 2, the wafer 103 is engaged in the wafer carrier 1. The upper side and the opposite lower side of the wafer carrier 1 are respectively provided with a first opening 101 and a second opening 102. The maximum width of the opening 101 is greater than the maximum width of the second opening 102. The second opening 102 exposes only a portion of the edge of the wafer 103. The holder module 2 is disposed below the second opening 102. The number of the positioning slots 201 in the holder module 2 can be the same as the number of wafers that can be placed on the wafer rack 1. The gap between each positioning slot 201 is consistent with the wafer gap in the rack, and each positioning slot 201 is just below each wafer, and each positioning slot 201 can be moved up and down individually.
作為本發明的優選方案之一，所述固定器模組2可以包括一組定位槽201，如第3圖所示，其中每一個定位槽201分別與所述晶圓片架1中平行豎立的每一片晶圓103相對應。 As one of the preferred embodiments of the present invention, the holder module 2 may include a plurality of positioning slots 201, as shown in FIG. 3, wherein each of the positioning slots 201 is respectively erected in parallel with the wafer holder 1. Each wafer 103 corresponds to each other.
作為本發明的另一優選方案，所述固定器模組2可以包括兩組定位槽201，如第4圖所示，其中每兩個定位槽201分別與所述晶圓片架1中平行豎立的每一片晶圓103相對應。優選地，同一片晶圓103相對應的兩個定位槽201之間距為10mm，以方便機械手臂4的操作葉片(Blade)前端可以順利取到晶圓103。 As another preferred embodiment of the present invention, the holder module 2 may include two sets of positioning grooves 201, as shown in FIG. 4, wherein each of the two positioning grooves 201 is respectively erected in parallel with the wafer holder 1. Each wafer 103 corresponds to each. Preferably, the distance between the two positioning slots 201 corresponding to the same wafer 103 is 10 mm, so that the front end of the operating blade of the robot arm 4 can be smoothly taken to the wafer 103.
本實施例中，所述定位槽201可以為V型槽，其中槽深為1cm至3cm，例如2cm。定位槽201的寬度可以根據實際需要設定，例如每片晶圓103對應一個定位槽201時，定位槽201可以略寬一些，而每片晶圓103對應兩個定位槽201時，每個定位槽201的寬度可以略窄。定位槽201寬度的設定應當使所述定位槽201能通過第二開口102，從而可將晶圓103推出。 In this embodiment, the positioning groove 201 may be a V-shaped groove, wherein the groove depth is 1 cm to 3 cm, for example, 2 cm. The width of the positioning slot 201 can be set according to actual needs. For example, when each wafer 103 corresponds to one positioning slot 201, the positioning slot 201 can be slightly wider, and each wafer 103 corresponds to two positioning slots 201, each positioning slot. The width of 201 can be slightly narrower. The width of the positioning groove 201 should be set such that the positioning groove 201 can pass through the second opening 102, so that the wafer 103 can be pushed out.
優選地，所述控制模組3對於所述晶圓片架1中平行豎立的多片晶圓103設置位置編號(Slot ID)，根據所述位置編號邋控制對應的定位槽201上升或下降，並且控制所述機械手臂4以根據所述位置編號抓取或放回對應的晶圓103。進一步可選擇地，所述控制模組3根據設定的晶圓處理順序來控制對應的定位槽201上升或下降。進一步可選擇地，所述控制模組3根據設定的晶圓處理順序來控制所述機械手臂4依次地抓取或放回對應晶圓103。 Preferably, the control module 3 sets a slot number (Slot ID) for the plurality of wafers 103 that are erected in parallel in the wafer carrier 1, and controls the corresponding positioning slot 201 to rise or fall according to the position number ,. And the robot arm 4 is controlled to grab or replace the corresponding wafer 103 according to the position number. Further, the control module 3 controls the corresponding positioning slot 201 to rise or fall according to the set wafer processing sequence. Further, the control module 3 controls the robot arm 4 to sequentially grab or replace the corresponding wafer 103 according to the set wafer processing order.
本實施例中，所述機械手臂4透過操作葉片進行晶圓的抓取，優選地，所述機械手臂4可以包括兩個操作葉片。兩個操作葉片輪流地取放可以提高工作效率，例如，在一個操作葉片將前一片晶圓放回前，另一個操作葉片先將後一片晶圓取片，從而可以提高設備產能。 In this embodiment, the robot arm 4 performs wafer grasping by operating the blade. Preferably, the robot arm 4 may include two operating blades. The two operating blades take turns to improve work efficiency. For example, before one operating blade returns the previous wafer, the other operating blade takes the next wafer first, thereby increasing equipment throughput.
具體而言，所述的晶圓可以是未生產積體電路的單晶矽片，如拋光片、外延片、退火片等，也可以是已生產積體電路的晶圓片，或其他需進行半導體加工製造的片狀材料。所述晶圓的尺寸可以是300mm以及300mm以下的尺寸，或者其他適合的尺寸，本發明對此不作限制。 Specifically, the wafer may be a single crystal chip which does not produce an integrated circuit, such as a polishing pad, an epitaxial wafer, an annealed sheet, etc., or may be a wafer in which an integrated circuit has been produced, or other needs to be performed. Sheet material produced by semiconductor processing. The size of the wafer may be 300 mm or less, or other suitable size, which is not limited in the present invention.
下面詳細描述本實施例的晶圓片架的取放片裝置的操作方法： 將所述的晶圓片架豎直地放置在所述固定器模組上方，第一開口朝上，第二開口朝下，晶圓片架內平行豎立的多片晶圓的位置與所述固定器模組的多個定位槽的位置相對影。 The operation method of the pick-and-place device of the wafer carrier of the present embodiment will be described in detail below: Positioning the wafer holder vertically above the holder module with the first opening facing upward and the second opening facing downward, and the positions of the plurality of wafers standing parallel in the wafer holder and the The positions of the plurality of positioning slots of the holder module are relatively opposite.
所述晶圓片架中的每片晶圓預設有位置編號，根據實際之需要在所述控制模組中設置需要處理的晶圓及處理順序。例如，可以透過控制台在控制模組中設定需要取片處理的晶圓的位置編號(Slot ID)，然後控制模組根據設定的晶圓的位置編號(Slot ID)，控制對應晶圓下方的定位槽上升，晶圓片架中需要處理的晶圓剛好落入對應的定位槽內，定位槽持續上升，將需要處理的晶圓推送出來。定位槽上升的高度根據實際情況需要而定，可上升到定位槽高於晶圓片架的第一開口或其他合適的高度。 Each wafer in the wafer rack is pre-positioned with a position number, and the wafers to be processed and the processing sequence are set in the control module according to actual needs. For example, the position number (Slot ID) of the wafer to be taken by the chip processing can be set in the control module through the console, and then the control module controls the bottom of the corresponding wafer according to the set position number (Slot ID) of the wafer. As the positioning groove rises, the wafer to be processed in the wafer rack just falls into the corresponding positioning groove, and the positioning groove continues to rise, pushing the wafer to be processed. The height at which the positioning groove rises may be determined according to actual needs, and may rise to a position where the positioning groove is higher than the first opening of the wafer holder or other suitable height.
取片、放片透過機械手臂完成，具體而言，所述機械手臂透過操作葉片進行晶圓的抓取，操作葉片按處理順序豎直地的從升起的定位槽中取片，晶圓處理完成後，操作葉片豎直地的將晶圓放回對應的定位槽，承載該晶圓的定位槽下降，使該晶圓回到晶圓片架的原位置，對應的定位槽下降回原位置。 The taking and releasing of the film are performed by a robot arm. Specifically, the mechanical arm grasps the wafer by operating the blade, and the operating blade is vertically taken from the raised positioning groove in the processing order, and the wafer is processed. After the completion, the operating blade vertically returns the wafer to the corresponding positioning groove, and the positioning groove carrying the wafer is lowered, so that the wafer returns to the original position of the wafer holder, and the corresponding positioning groove is lowered back to the original position. .
其中，控制模組根據具體情況可以設置不同的處理常式。例如，可以根據處理順序一次一片的將晶圓推送出來處理，每片晶圓處理完並被放回後，即每片晶圓取放片結束後，再將下一片需要處理的晶圓推送出來取放片，工作狀態如第5圖所示；也可以將需要處理的多片晶圓同時推送出來，然後根據處理順序依次進行處理，工作狀態如第6圖所示，此種方式中，機械手臂可以包括兩個操作葉片，在一個操作葉片將前一片晶圓放回前，另一個操作葉片先將後一片晶圓取片，以提高取放片的工作效率。 The control module can set different processing routines according to specific conditions. For example, the wafers can be pushed out one at a time according to the processing order, and after each wafer is processed and put back, that is, after each wafer is taken and released, the next wafer to be processed is pushed out. Take and place the film, the working state is as shown in Figure 5; the multiple wafers to be processed can also be pushed out at the same time, and then processed according to the processing order, the working state is as shown in Fig. 6, in this way, the machine The arm can include two operating blades. Before one operating blade returns the previous wafer, the other operating blade first picks up the next wafer to improve the efficiency of the pick and place.
利用本實施例的晶圓取放片裝置進行取放片，在取片時第一片晶圓的至少其中一面是處於無阻擋狀態的，即並不存在任何“間距”問題，因此可以順利取片，避免了葉片刮擦的風險，放片後固定器模組將該晶圓送回晶圓片架內，因此下一片晶圓也不存在任何“間距”問題。 The wafer pick-and-place chip device of the embodiment is used for picking and placing the film. At least one of the first wafers is in an unblocked state when the film is taken, that is, there is no problem of "pitch", so the smooth take-up can be taken. The film avoids the risk of blade scratching. After the film is released, the holder module sends the wafer back to the wafer carrier, so there is no "pitch" problem in the next wafer.
綜上所述，本發明的晶圓片架的取放片裝置透過固定器模組將需要取出的晶圓從晶圓片架中推出，並可透過控制模組根據設定順序取片。這樣在取放片時機械手臂無阻擋，可避免傳統取放片時機械手臂在多片晶圓間隙之間進行操作而造成的晶圓損傷，從而可提高生產良率。實施過程中可採用雙葉片設計，當一個操作葉片將前一片晶圓放回前，另一個操作葉片先將後一片晶圓取片，從而可以提高設備產能。所以，本發明有效克服了現有技術中的種種缺點而具高度產業利用價值。 In summary, the wafer pick-and-place device of the present invention pushes the wafer to be taken out from the wafer rack through the fixture module, and can take the film according to the set order through the control module. In this way, the robot arm is unobstructed when the tablet is taken and placed, which can avoid wafer damage caused by the operation of the robot arm between the multiple wafer gaps during the conventional pick and place, thereby improving the production yield. The double-blade design can be used in the implementation process. When one operating blade returns the previous wafer, the other operating blade takes the next wafer first, which can increase the equipment capacity. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.
上述實施例僅例示性說明本發明的原理及其功效，而非用於限制本發明。任何熟悉此技術的人士皆可在不違背本發明的精神及範疇下，對上述實施例進行修飾或改變。因此，舉凡所屬技術領域中具有通常知識者在未脫離本發明所揭示的精神與技術思想下所完成的一切等效修飾或改變，仍應由本發明的申請專利範圍所涵蓋。 The above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Modifications or variations of the above-described embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and scope of the invention are still covered by the scope of the invention.
1‧‧‧晶圓片架 1‧‧‧ wafer holder
101‧‧‧第一開口 101‧‧‧ first opening
102‧‧‧第二開口 102‧‧‧second opening
103‧‧‧晶圓 103‧‧‧ wafer
2‧‧‧固定器模組 2‧‧‧Retainer module
201‧‧‧定位槽 201‧‧‧ positioning slot
3‧‧‧控制模組 3‧‧‧Control Module
4‧‧‧機械手臂 4‧‧‧ Robotic arm
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| TW201810498A (en) | 2018-03-16 |
| CN107658258A (en) | 2018-02-02 |
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