TWI602667B - Scoring wheel and its manufacturing method - Google Patents
Scoring wheel and its manufacturing method Download PDFInfo
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- TWI602667B TWI602667B TW102133765A TW102133765A TWI602667B TW I602667 B TWI602667 B TW I602667B TW 102133765 A TW102133765 A TW 102133765A TW 102133765 A TW102133765 A TW 102133765A TW I602667 B TWI602667 B TW I602667B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Description
本發明係關於用以對脆性材料基板壓接．轉動並進行刻劃之刻劃輪及其製造方法。 The present invention relates to crimping a substrate of a brittle material. Rotating and scoring the marking wheel and its manufacturing method.
習知的刻劃輪，如專利文獻1等所示般，係以超硬合金製或多結晶燒結鑽石(以下，稱為PCD)製之圓板作為基材。PCD圓板係使鑽石粒子與鈷(Co)等一起燒結而成者。刻劃輪，係從成為基材之圓板的兩側呈互相傾斜地削入圓周之邊緣，且於圓周面形成V字形之刀前端而形成者。將以如此方式形成之刻劃輪，以呈旋轉自如地軸裝於刻劃裝置之刻劃頭等，並以既定之負載按壓於脆性材料基板，使其沿脆性材料基板之面移動而藉此可一邊轉動一邊進行刻劃。 A conventional scribing wheel is a base plate made of a super hard alloy or a polycrystalline sintered diamond (hereinafter referred to as PCD) as a base material, as shown in Patent Document 1. The PCD circular plate is formed by sintering diamond particles together with cobalt (Co) or the like. The scribing wheel is formed by cutting the edge of the circumference obliquely from both sides of the circular plate which becomes the base material, and forming a V-shaped blade front end on the circumferential surface. The scribing wheel formed in such a manner is rotatably mounted on the scribing head of the scoring device, and is pressed against the brittle material substrate with a predetermined load to move along the surface of the brittle material substrate. Scratch while turning.
在專利文獻2中，揭示有為了使玻璃切斷用刀刃之壽命變長，而以鑽石被膜V字形狀之刀前端表面而成之玻璃切斷用刀刃。該玻璃切斷用刀刃，係在以與鑽石相容性佳之陶瓷所形成之刀前端表面被覆鑽石膜，對該鑽石膜進行表面研磨處理而加以整形。揭示有藉由使用如此般之玻璃切斷用刀刃，而可使刀刃之壽命變長，此外可以切斷面成為平滑之方式切斷高硬度玻璃。 Patent Document 2 discloses a glass cutting blade in which a front end surface of a diamond-shaped film has a V-shaped blade shape in order to increase the life of the glass cutting blade. This glass cutting blade is coated with a diamond film on the front end surface of a blade formed of a ceramic having good compatibility with diamonds, and the diamond film is subjected to surface polishing treatment and shaped. It is disclosed that the blade edge cutting blade can be used to shorten the life of the blade, and the high-hardness glass can be cut so that the cut surface becomes smooth.
專利文獻1：國際公開WO2003/51784號公報 Patent Document 1: International Publication WO2003/51784
專利文獻2：日本特開平04-224128號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 04-224128
以多結晶燒結鑽石(PCD)形成之習知的刻劃輪，由於係以鑽石粒子與結合材而構成，因此一旦對尤其是陶瓷等硬度高之脆性材料基板進行刻劃，則存在有磨耗激烈地進行、壽命較短之缺點。此外，由於近幾年玻璃之薄型化、大型化趨勢，使得對脆性材料基板進行刻劃、裂斷後之脆性材料基板之端面強度相當地要求。然而，在以PCD形成之習知的刻劃輪中，由於對應於素材所包含之鑽石粒子之大小，刀前端及稜線之粗度較粗，且亦難以藉由研磨而設成一定以下之粗度，因此存在有對脆性材料基板進行刻劃、裂斷後之脆性材料基板之端面強度降低之缺點。 A conventional scoring wheel formed of polycrystalline sintered diamond (PCD) is composed of diamond particles and a bonding material. Therefore, when a brittle material substrate having a high hardness such as ceramic is scribed, there is a strong wear. The shortcomings of the ground and short life. In addition, in recent years, the thickness of the glass has become thinner and larger, and the strength of the end surface of the brittle material substrate after the slashing and cracking of the brittle material substrate has been considerably required. However, in the conventional scoring wheel formed by PCD, the thickness of the front end of the blade and the ridge line are coarse due to the size of the diamond particles contained in the material, and it is also difficult to set the thickness of the blade to be coarse or not. Therefore, there is a disadvantage that the strength of the end surface of the brittle material substrate after the slashing of the brittle material substrate is reduced.
專利文獻2記載之玻璃切斷用刀刃，雖係對鑽石被膜進行研磨，但由於在鑽石膜不具導電性，而無法藉由通電進行成為研磨時之基準位置之零點檢測。因此於鑽石被膜之研磨時因作業者而導致研磨開始點之偏差較大。尤其是鑽石被膜之厚度較薄、且在進行數μm~10μm之研磨作業之情形，存在有其影響較大、加工時之作業性變不佳之問題點。 In the glass cutting blade described in Patent Document 2, the diamond film is polished. However, since the diamond film is not electrically conductive, the zero point of the reference position at the time of polishing cannot be detected by energization. Therefore, when the diamond film is polished, the deviation of the polishing start point is large due to the operator. In particular, in the case where the thickness of the diamond film is thin and the polishing operation is performed in the range of several μm to 10 μm, there is a problem that the influence is large and the workability at the time of processing becomes poor.
本發明係有鑑於如此般之問題點而完成者，目的在於提供一種可容易地進行鑽石膜之研磨或溝槽加工的刻劃輪及其製造方法。 The present invention has been made in view of such a problem, and an object thereof is to provide a scribing wheel which can easily perform grinding or groove processing of a diamond film, and a method of manufacturing the same.
為了解決該課題，本發明之刻劃輪，係沿著圓周部形成稜線、具有由該稜線與該稜線兩側之傾斜面所構成之刀前端的刻劃輪，並具有形成於基材與基材之刀前端表面之鑽石膜，該稜線係由鑽石膜形成，該鑽石膜係具有導電性。 In order to solve the problem, the scribing wheel of the present invention is a scribing wheel having a ridge line along a circumferential portion and a tip end of the blade formed by the ridge line and inclined surfaces on both sides of the ridge line, and has a base and a base formed thereon. The diamond film on the front end surface of the knives is formed by a diamond film which is electrically conductive.
此處，亦可具有以既定間隔形成於該鑽石膜之稜線部分之溝槽，且將其之間設成突起。 Here, it is also possible to have grooves formed at a predetermined interval in the ridge line portion of the diamond film, and to provide protrusions therebetween.
為了解決該課題，本發明之刻劃輪之製造方法，係為具有沿著圓板之圓周部由稜線與該稜線兩側之傾斜面構成之刀前端的刻劃輪之製造方法，於圓板之中心設置貫通孔，以該中心為旋轉軸，沿著圓周部形成刀前端部分而構成刻劃輪基材，於該刻劃輪基材之刀前端部分藉由化學氣相成長法一邊摻雜雜質、一邊形成鑽石膜。 In order to solve the problem, the method for manufacturing a scribe wheel according to the present invention is a method for manufacturing a scriber wheel having a knurled end formed by a ridge line and an inclined surface on both sides of the ridge line along a circumferential portion of the circular plate. The center is provided with a through hole, and the center is a rotating shaft, and a front end portion of the blade is formed along the circumferential portion to form a scribing wheel substrate, and the front end portion of the scribing wheel substrate is doped by a chemical vapor phase growth method. Impurities and a diamond film on one side.
此處，該雜質較佳為硼(B)。 Here, the impurity is preferably boron (B).
此處，亦可一邊於形成有該鑽石膜之刻劃輪與磨石之間供給電源、一邊對該鑽石膜進行研磨。 Here, the diamond film may be polished while supplying power between the scribing wheel and the grindstone on which the diamond film is formed.
此處，亦可於該鑽石膜進行放電加工，進一步地形成由稜線與斜面構成之刀前端。 Here, the diamond film may be subjected to electric discharge machining to further form a tip end of the blade formed by the ridge line and the inclined surface.
此處，亦可於該鑽石膜之稜線部分以既定間隔形成經切削而成之溝槽，且將其之間設成突起。 Here, the cut grooves may be formed at predetermined intervals in the ridge line portion of the diamond film, and protrusions may be formed therebetween.
此處，亦可一邊於該鑽石膜與磨石之間供給電源、一邊切削該溝槽。 Here, the groove may be cut while supplying power between the diamond film and the grindstone.
此處，亦可於該鑽石膜藉由放電加工形成該溝槽。 Here, the groove may be formed by electrical discharge machining on the diamond film.
根據具有如此特徵之本發明，於刻劃輪形成具有導電性之鑽石膜，且對刀前端之鑽石膜進行研磨。藉此利用於研磨時係具有導電性而可進行成為研削之基準之零點檢測、進行施有通電、加熱之滑動研磨、進行放電加工，且可容易地進行製造。此外，在請求項2、4之發明中，利用刻劃輪之刀前端係具有導電性而可容易地進行溝槽加工，且可實現於表面具有鑽石層之高浸透型之刻劃輪。 According to the invention having such characteristics, a diamond film having conductivity is formed on the scoring wheel, and the diamond film at the tip end of the blade is ground. In this way, it is possible to perform zero-point detection as a reference for grinding, perform sliding polishing by applying electric current and heating, and perform electric discharge machining, and can be easily manufactured. Further, in the inventions of claims 2 and 4, the front end of the blade using the scoring wheel is electrically conductive, the groove processing can be easily performed, and the scribing wheel having a high-permeation type having a diamond layer on the surface can be realized.
10、30‧‧‧刻劃輪 10, 30‧‧‧ marking wheel
11、31‧‧‧圓板 11, 31‧‧‧ round board
12、32‧‧‧貫通孔 12, 32‧‧‧through holes
13、33‧‧‧研磨面 13, 33‧‧‧ grinding surface
14、34‧‧‧鑽石膜 14, 34‧‧‧Diamond film
16‧‧‧圓周面 16‧‧‧Circular surface
25‧‧‧電源 25‧‧‧Power supply
35‧‧‧溝槽 35‧‧‧ trench
41‧‧‧研磨機馬達 41‧‧‧Milling machine motor
42‧‧‧磨石 42‧‧‧磨石
圖1A，係本發明之第1實施形態之刻劃輪的前視圖。 Fig. 1A is a front elevational view of a scribe wheel according to a first embodiment of the present invention.
圖1B，係第1實施形態之刻劃輪的側視圖。 Fig. 1B is a side view of the scribe wheel of the first embodiment.
圖2A，係第1實施形態之刀前端研磨前之稜線部分的放大剖面圖。 Fig. 2A is an enlarged cross-sectional view showing a ridge line portion before the tip end of the blade of the first embodiment is polished.
圖2B，係第1實施形態之研磨後之稜線部分的放大剖面圖。 Fig. 2B is an enlarged cross-sectional view showing a ridge line portion after polishing in the first embodiment.
圖3A，係本發明之第3實施形態之刻劃輪的前視圖。 Fig. 3A is a front elevational view of a scribe wheel of a third embodiment of the present invention.
圖3B，係第3實施形態之研磨後之稜線部分的放大剖面圖。 Fig. 3B is an enlarged cross-sectional view showing a ridge line portion after polishing in the third embodiment.
圖3C，係圖3A所示之圓形部分的放大圖。 Fig. 3C is an enlarged view of the circular portion shown in Fig. 3A.
圖4，係表示第3實施形態之溝槽加工之狀態的圖式。 Fig. 4 is a view showing a state of groove processing in the third embodiment.
圖1A係本發明之實施形態之刻劃輪的前視圖，圖1B係其側視圖。於製造刻劃輪時，例如，首先，如圖1A所示般，於超硬合金等之成為刻劃輪基材之圓板11之中央形成成為軸孔之貫通孔12。接著，將未圖示之馬達等之軸桿(shaft)與該貫通孔12連通，並一邊以貫通孔12之中心軸為旋轉軸12a使其旋轉，一邊對圓板11之整個圓周從圓板之表背兩側相對於旋轉軸12a傾斜地進行研磨，而如圖1B所示般，使稜線與稜線之兩側的傾斜面形成為垂直剖面V字形。以如此形成之V字形斜面作為研磨面13。 Fig. 1A is a front view of a scribe wheel of an embodiment of the present invention, and Fig. 1B is a side view thereof. When the scribing wheel is manufactured, for example, first, as shown in FIG. 1A, a through hole 12 serving as a shaft hole is formed in the center of the disc 11 which becomes a scribing wheel base material such as a cemented carbide. Then, a shaft such as a motor (not shown) is communicated with the through hole 12, and the entire circumference of the circular plate 11 is rotated from the circular plate by rotating the central axis of the through hole 12 as the rotating shaft 12a. Both sides of the front and back are polished obliquely with respect to the rotating shaft 12a, and as shown in Fig. 1B, the inclined faces on both sides of the ridge line and the ridge line are formed in a V-shaped vertical cross section. The V-shaped bevel thus formed is used as the polishing surface 13.
接著針對鑽石薄膜之形成，利用圖2A之刀前端之稜線部分之放大剖面圖進行說明。首先，預先將V字形之研磨面13設成粗面以使鑽石膜之附著變容易。接著，在將成為次微米(submicron)以下之粒徑之核的鑽石膜形成於斜面部分之後，藉由化學氣相成長反應使鑽石薄膜成長。如此於刻劃輪之V字形之斜面部分藉由化學氣相成長法(CVD法)，形成膜厚例 如20~30μm之鑽石膜14。 Next, the formation of the diamond film will be described using an enlarged cross-sectional view of the ridge line portion of the tip end of the blade of Fig. 2A. First, the V-shaped abrasive surface 13 is previously set to a rough surface to facilitate adhesion of the diamond film. Next, after the diamond film which is a core having a submicron particle diameter or less is formed on the slope portion, the diamond film is grown by a chemical vapor phase growth reaction. Thus, the V-shaped bevel portion of the scoring wheel is formed by a chemical vapor phase growth method (CVD method) to form a film thickness. Such as 20~30μm diamond film 14.
在本實施形態中，在利用化學氣相成長反應進行鑽石膜之成長時，摻雜硼等之雜質。藉此可使鑽石膜14成為具有導電性之膜。鑽石膜14之導電率係依存於摻雜量，而藉由使導電率變大，可使放電加工時之放電容易穩定、使放電加工條件值降低、使放電加工之效率提高等。 In the present embodiment, when the diamond film is grown by the chemical vapor growth reaction, impurities such as boron are doped. Thereby, the diamond film 14 can be made into a film having conductivity. The conductivity of the diamond film 14 depends on the doping amount, and by increasing the conductivity, the discharge during discharge machining can be easily stabilized, the value of the electric discharge machining condition can be lowered, and the efficiency of electric discharge machining can be improved.
之後，如下述般，至少對前端部分進行研磨以使前端變銳利。圖2B係表示該研磨後之狀態的部分放大剖面圖。於如此般研磨時，亦可成為較原本之鑽石膜14例如更為5°~10°鈍角。而且，使包含由研磨後之稜線構成之圓之面，相對於旋轉軸12a成為垂直。此處，進行研磨之區域亦可僅為於中央包含傾斜面之稜線的帶狀之部分。圖2B之寬度w之區域表示該前端部分、亦即稜線兩側之鑽石膜的研磨區域，例如將寬度w設成10~20μm。 Thereafter, at least the front end portion is ground to sharpen the front end as described below. Fig. 2B is a partially enlarged cross-sectional view showing the state after the polishing. When it is so polished, it may become an obtuse angle of, for example, 5 to 10 degrees from the original diamond film 14. Further, the surface including the circle formed by the polished ridge line is made perpendicular to the rotation shaft 12a. Here, the region to be polished may be only a strip-shaped portion including a ridge line of the inclined surface at the center. The area of the width w of Fig. 2B indicates the polishing area of the diamond film on both sides of the front end portion, that is, the ridge line, for example, the width w is set to 10 to 20 μm.
於研磨時，使磨石旋轉，對具有鑽石膜之刻劃輪之刀前端進行研磨。此時，於刻劃輪與磨石之間連接電源。然後，一邊使磨石以一定速度旋轉同時刻劃輪10亦沿著該旋轉軸12a旋轉，一邊使往磨石之距離接近。由於鑽石膜14與直線磨石20在接觸時進行通電，因此可藉由通電而檢測刻劃輪10與磨石20已接觸。將該接觸時設成成為研磨開始點之零點，從此處對鑽石膜進行研磨至適當之厚度。此外，藉由進行通電，除了因接觸時之摩擦阻力導致發熱外，亦藉由鑽石膜具有適度之電阻力產生焦耳熱而加熱鑽石膜14。因此亦可使鑽石膜14之研磨更高能率地進行。當結束一面之研磨時，對另一面亦同樣地進行研磨。如此般利用鑽石膜具有通電性而於磨石與成為加工對象之刻劃輪使電流流通，藉由於研磨中進行通電而可 有效率地進行研磨作業。 At the time of grinding, the grindstone is rotated, and the tip end of the knurling wheel having the diamond film is ground. At this time, a power source is connected between the scoring wheel and the grindstone. Then, while the grindstone is rotated at a constant speed while the scoring wheel 10 is also rotated along the rotating shaft 12a, the distance to the grindstone is made close. Since the diamond film 14 is energized at the time of contact with the linear grindstone 20, it can be detected that the scoring wheel 10 and the grindstone 20 are in contact by energization. The contact is set to the zero point of the polishing start point, from which the diamond film is polished to an appropriate thickness. Further, by energization, in addition to heat generation due to frictional resistance upon contact, the diamond film 14 is heated by the Joule heat generated by the diamond film having a moderate electrical resistance. Therefore, the grinding of the diamond film 14 can also be carried out at a higher energy rate. When the polishing of one side is completed, the other surface is also polished in the same manner. In this way, the diamond film is electrically conductive, and the grindstone and the scribing wheel that is the object of processing are used to circulate a current, and the electric current can be supplied by the grinding. The grinding operation is carried out efficiently.
接著，針對本發明之第2實施形態進行說明。該實施形態與第1實施形態係刀前端之傾斜面之加工方法有所不同。由於鑽石膜14具有導電性，因此不僅可藉由機械研磨亦可藉由放電加工而加工傾斜面，形成銳利之稜線。於放電加工中，亦可利用藉由使已通電之線(wire)沿鑽石膜移動而加工成所欲之形狀的線放電加工。此外，除此之外，亦可使用雕型放電加工(Die-sinking Electrical Discharge Machining)。於雕型放電加工中，可利用具備有供加工之具有凸狀之刀前端之反轉形狀的模具之治具電極，按壓於旋轉體而藉此加工刀前端。在進行如此般之線放電加工或雕型放電加工後，為了去除因放電加工產生之變質層，較佳為進一步地進行利用磨石之精加工研磨。 Next, a second embodiment of the present invention will be described. This embodiment differs from the first embodiment in the method of processing the inclined surface of the tip end of the blade. Since the diamond film 14 is electrically conductive, the inclined surface can be processed not only by mechanical polishing but also by electrical discharge machining to form a sharp ridge line. In the electrical discharge machining, wire electrical discharge machining can be performed by processing a wire that has been energized along the diamond film to be processed into a desired shape. Further, in addition to this, Die-sinking Electrical Discharge Machining can also be used. In the eagle-type electric discharge machining, the tip end of the knives can be processed by pressing the jig electrode with a mold having a reversed shape of the tip end of the knives for processing. After such a wire electric discharge machining or a sculpt electric discharge machining, in order to remove the deteriorated layer generated by the electric discharge machining, it is preferable to further perform the finishing polishing using the grindstone.
藉由如此般進行研磨或放電加工，可使有助於鑽石膜刻劃之刀前端部分之稜線之粗細變細。因此一旦使用該刻劃輪對脆性材料基板、例如陶瓷基板進行刻劃、分斷，則可獲得能使脆性材料基板之切斷面之端面精度提高、隨之亦使端面強度提高的效果。 By performing the polishing or electric discharge machining in this manner, the thickness of the ridge line of the tip end portion of the blade which contributes to the diamond film scoring can be made thin. Therefore, when the brittle material substrate, for example, the ceramic substrate is scored and divided by using the scribing wheel, the end surface precision of the cut surface of the brittle material substrate can be improved, and the end surface strength can be improved.
接著，針對本發明之第3實施形態進行說明。於日本國專利第3074143號提及有於刻劃輪之圓周面隔著既定間隔形成多個溝槽、且將其之間設成突起而成為高浸透型之刻劃輪。本發明亦可適用於如此般之刻劃輪。圖3A係該實施形態之刻劃輪的前視圖，圖3B係前端之稜線部分的放大剖面圖，圖3C係於圖3A以一點鏈線表示之圓形部分的放大圖。於製造刻劃輪時，首先，如圖3A所示般，於超硬合金、或陶瓷製等之成為刻劃輪基材之圓板31之中央形成成為軸孔之貫通孔32。接著，將馬達等之旋轉軸 與該貫通孔32連通，並一邊使其旋轉，一邊對圓板31之整個圓周從兩側進行研磨而形成V字形。以如此形成之V字形斜面作為研磨面33。亦於該情形與第1實施形態同樣地，於刻劃輪之刀前端部分藉由CVD法鍍敷鑽石膜34，且以上述之方法進行研磨。 Next, a third embodiment of the present invention will be described. Japanese Patent No. 3074143 discloses a scribing wheel having a high-permeation type in which a plurality of grooves are formed at a predetermined interval on a circumferential surface of a scribing wheel and a projection is formed therebetween. The invention can also be applied to such a rowing wheel. Fig. 3A is a front view of the scribing wheel of the embodiment, Fig. 3B is an enlarged cross-sectional view of a ridge line portion of the front end, and Fig. 3C is an enlarged view of a circular portion indicated by a one-dot chain line in Fig. 3A. When manufacturing the scribing wheel, first, as shown in FIG. 3A, a through hole 32 serving as a shaft hole is formed in the center of the disc 31 which is a scribing wheel base material such as a superhard alloy or a ceramic. Next, the rotation axis of the motor, etc. The through hole 32 communicates with the through hole 32, and the entire circumference of the circular plate 31 is polished from both sides to form a V shape. The V-shaped bevel thus formed is used as the polishing surface 33. Also in this case, as in the first embodiment, the diamond film 34 is plated by the CVD method at the tip end portion of the knurling wheel, and is polished by the above method.
接著，當將鑽石膜34設成20μm時，則如圖3C所示般，於鑽石膜34之厚度之範圍內形成溝槽35。圖4係表示形成溝槽35之狀態的圖式。如圖4所示，將圓板狀之磨石42安裝於研磨機馬達41之軸並使其旋轉。該磨石之圓周面形成V字狀，而藉由該磨石於刻劃輪10之圓周部形成溝槽35。於該情形，如圖4所示般，從電源25對刻劃輪10與圓板狀之磨石42之間進行通電，藉由檢測出零點，而可確實地控制溝槽之深度。進一步地，藉由通電時之加熱可促進研削加工。如此於形成1個溝槽後，使刻劃輪旋轉既定角度而固定，進一步地使研磨機馬達41旋轉並使磨石42接近而形成溝槽。如此於刻劃輪之全周以一定之間距形成溝槽。如此，在製造高浸透型之刻劃輪之情形，可使溝槽之深度均一。刻劃輪之溝槽之深度，例如根據脆性材料基板之厚度而為0.5~10μm左右。 Next, when the diamond film 34 is set to 20 μm, the groove 35 is formed in the range of the thickness of the diamond film 34 as shown in Fig. 3C. FIG. 4 is a view showing a state in which the grooves 35 are formed. As shown in FIG. 4, a disk-shaped grindstone 42 is attached to the shaft of the grinder motor 41 and rotated. The circumferential surface of the grindstone is formed in a V shape, and the groove 35 is formed on the circumferential portion of the scoring wheel 10 by the grindstone. In this case, as shown in FIG. 4, the power source 25 energizes between the scribing wheel 10 and the disc-shaped grindstone 42, and by detecting the zero point, the depth of the groove can be surely controlled. Further, the grinding process can be promoted by heating at the time of energization. After forming one groove as described above, the scribing wheel is rotated by a predetermined angle to be fixed, and the grinder motor 41 is further rotated to bring the grindstone 42 close to form a groove. Thus, grooves are formed at a certain distance from the entire circumference of the scoring wheel. Thus, in the case of manufacturing a high-impregnation type of marking wheel, the depth of the groove can be made uniform. The depth of the groove of the scoring wheel is, for example, about 0.5 to 10 μm depending on the thickness of the brittle material substrate.
除了研磨外，亦可藉由對鑽石膜進行放電加工形成溝槽、或藉由雷射加工形成溝槽。 In addition to the grinding, the grooves may be formed by electrical discharge machining of the diamond film or by laser processing.
此外，除此之外，亦可預先於刻劃輪基材之V字形之刀前端部形成溝槽，於該刻劃輪基材藉由CVD法鍍敷鑽石膜、進行研磨而藉此構成刻劃輪。 Further, in addition to this, a groove may be formed in advance in the front end portion of the V-shaped blade of the scribing wheel substrate, and the diamond substrate may be plated by the CVD method and ground by the etched wheel substrate. Rowing.
本發明之刻劃輪，係提供耐磨耗性、耐剝離性較高且能夠切出端面強度高之脆性材料基板之刻劃輪，且可適合使用於刻劃裝置。 The scribing wheel of the present invention provides a scribing wheel having a high abrasion resistance and peeling resistance and capable of cutting a brittle material substrate having a high end face strength, and is suitable for use in a scoring apparatus.
13‧‧‧研磨面 13‧‧‧Grinding surface
14‧‧‧鑽石膜 14‧‧‧Diamond film
w‧‧‧寬度 w‧‧‧Width
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| JP2009234874A (en) * | 2008-03-28 | 2009-10-15 | Shiba Giken:Kk | Cutter wheel and method for manufacturing the same |
| JP2009280421A (en) * | 2008-05-20 | 2009-12-03 | Sadao Takeuchi | Tool with high strength diamond film |
| JP2010516481A (en) * | 2007-01-19 | 2010-05-20 | ダッチ ダイアモンド テクノロジー ビーブイ | Cutting disc for forming scribe lines |
| JP2012011475A (en) * | 2010-06-29 | 2012-01-19 | Tokyo Univ Of Science | Diamond-coated tool, and method for manufacturing the same |
| CN102441942A (en) * | 2010-10-08 | 2012-05-09 | 三星钻石工业股份有限公司 | Scribing wheel |
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| JP2010516481A (en) * | 2007-01-19 | 2010-05-20 | ダッチ ダイアモンド テクノロジー ビーブイ | Cutting disc for forming scribe lines |
| JP2009234874A (en) * | 2008-03-28 | 2009-10-15 | Shiba Giken:Kk | Cutter wheel and method for manufacturing the same |
| JP2009280421A (en) * | 2008-05-20 | 2009-12-03 | Sadao Takeuchi | Tool with high strength diamond film |
| JP2012011475A (en) * | 2010-06-29 | 2012-01-19 | Tokyo Univ Of Science | Diamond-coated tool, and method for manufacturing the same |
| CN102441942A (en) * | 2010-10-08 | 2012-05-09 | 三星钻石工业股份有限公司 | Scribing wheel |
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| CN103833211B (en) | 2018-11-23 |
| TW201420297A (en) | 2014-06-01 |
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| CN103833211A (en) | 2014-06-04 |
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| KR101779056B1 (en) | 2017-09-18 |
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