TWI600353B

TWI600353B - Circuit board cutting method

Info

Publication number: TWI600353B
Application number: TW105115678A
Authority: TW
Inventors: shu-min Lu
Priority date: 2016-05-20
Filing date: 2016-05-20
Publication date: 2017-09-21
Also published as: TW201742519A

Description

電路板分板裁磨方法 Circuit board board cutting method

本發明「電路板分板裁磨方法」，涉及一種電路板壓合製程中，用以將複數相對小面積電路板由一相對大面積之電路板中進行分板切割，或再對各緣邊執行裁磨之技術領域。 The invention relates to a circuit board dividing method for cutting a circuit board, which relates to a circuit board pressing process for cutting a plurality of relatively small-area circuit boards by a relatively large-area circuit board, or for each edge Perform the technical field of cutting.

現有高密度印刷電路板在壓合製程中，因部份電路板產品的實際尺寸並不大，廠商為了提高產能、減少浪費、降低成本，都會在一相對大面積的銅箔2中同時安排有複數塊相對小面積的電路板21(如第三圖、第四圖)。經壓合完成後，再以人工方式就該些小面積的電路板21進行裁切分離，以取得小面積的電路板21。習知人工裁切分離方式存在速度慢及成本高等缺點，且人工裁切萬一發生失誤，很有可能切到該小面積電路板21，衍生不良率低的問題。 In the current high-density printed circuit board, the actual size of some of the circuit board products is not large. In order to increase the production capacity, reduce waste, and reduce the cost, the manufacturer will arrange the copper foil 2 in a relatively large area at the same time. A plurality of relatively small-area circuit boards 21 (such as the third and fourth figures). After the pressing is completed, the small-area circuit boards 21 are manually cut and separated to obtain a small-area circuit board 21. Conventional manual cutting and separating methods have the disadvantages of slow speed and high cost, and in the event of manual cutting, it is very likely that the small-area circuit board 21 is cut, and the defect rate is low.

值此微利時代，惟有降低人力之使用，方能創造利潤。發明人特以研創成本案，期能藉本案之提出，俾改進現有人力方式之缺失，期使電路板之分板裁磨製程能符合實際需求。 In this era of meager profit, only by reducing the use of manpower can we create profits. The inventor specially researched and created the cost case, and can use the proposal of this case to improve the lack of the existing manpower method, so that the board cutting process of the circuit board can meet the actual needs.

為改善習知以人工方式裁切分離電路板之方式存有速度慢、成本高、不良率低等缺失，本發明「電路板分板裁磨方法」，其主要目的在於：提出一種新方法，其利用機具全自動進行電路板之裁切。藉此，能獲致速度快、成本低，也不會有因人為疏失造成電路板被不慎切壞等困擾。 In order to improve the conventional method of manually cutting a separate circuit board, there are shortcomings such as slow speed, high cost, and low defect rate. The main purpose of the "circuit board cutting method" is to propose a new method. It uses the machine to fully automate the cutting of the board. In this way, the speed can be achieved, the cost is low, and there is no trouble that the circuit board is inadvertently cut due to human error.

為達上述目的，本發明具體之內容為：該種電路板分板裁磨方法，其步驟主要包括：多片壓板、尺寸取得、檢測定位以及裁切分板，且更能依需要透過靶位判讀以利進行磨邊，最後完成分板裁磨製程。 In order to achieve the above object, the specific content of the present invention is as follows: the method for cutting the board by the board, the steps of which mainly include: multi-plate pressing plate, size obtaining, detecting positioning and cutting the dividing board, and more capable of transmitting the target position as needed. Interpretation to facilitate the edging, and finally complete the board cutting process.

所述該多片壓板，係指在一相對大面積的銅箔中，同時安排有複數塊相對小面積的電路板，藉以進行壓板工序。該排列方法至少包括日字形、田字形、複數塊並列、連續日字形或連續田字形。 The plurality of platens refers to a circuit board in which a plurality of relatively small areas are arranged in a relatively large area of copper foil, thereby performing a plate pressing process. The arranging method includes at least a Japanese character, a field shape, a plurality of blocks, a continuous Japanese character or a continuous field shape.

所述該尺寸取得，係指就該壓板後之電路板，進行尺寸取得工序，其可以利用預設之外部緣邊尺寸，或是以靶位確認尺寸；該尺寸取得包括採人工輸入方式或設備自動偵測後輸入。 The dimension acquisition refers to a dimension acquisition process for the circuit board after the pressure plate, which can be determined by using a preset outer edge size or by a target position; the size acquisition includes manual input mode or equipment. Input after automatic detection.

所述該檢測定位，係以一檢測裝置進行，該檢測裝置可以是X-RAY設備；利用該X-RAY執行緣邊或靶位之定位，能得知各相對小面積電路板的緣邊位置。 The detecting and positioning is performed by a detecting device, which may be an X-RAY device; by using the X-RAY to perform positioning of the edge or the target position, the edge position of each relatively small area circuit board can be known. .

所述該裁切分板，係指當得知各相對小面積電路板的緣邊位置後，由一台或一台以上的裁切裝置進行裁切分板；該裁切裝置至少可以執行橫方向之裁切及縱方向之裁切，該裁切裝置至少包括以裁刀方式、滾剪方式或 V-CUT方式執行裁切工序。 The cutting sub-board refers to cutting the sub-board by one or more cutting devices when the edge position of each relatively small-area circuit board is known; the cutting device can perform at least horizontal The cutting of the direction and the cutting of the longitudinal direction, the cutting device includes at least a cutting method, a rolling method or The cutting process is performed in the V-CUT mode.

所述該靶位判讀，係指完成分板後之各相對小面積電路板，利用內部原先即已預設、可供X-RAY設備讀取之靶位，進行外形尺寸判讀或方向辨識；若方向有誤或正反面有誤，將其轉正。 The target position interpretation refers to each relatively small-area circuit board after the completion of the splitting, and the internal size is determined by the target position that can be read by the X-RAY device, and the shape size interpretation or direction identification is performed; The direction is wrong or the front and back are wrong, turn it back.

所述該進行磨邊，係指就該相對小面積電路板，利用一磨邊裝置進行各緣邊的精密裁磨；該磨邊裝置可以同時就該電路板的其中兩相對緣邊進行裁磨，配合一旋轉裝置藉以將該電路板轉向90度，以利進行另兩相對緣邊的裁磨。 The edging refers to the precise cutting of the rims by using an edging device for the relatively small-area circuit board; the edging device can simultaneously cut the two opposite edges of the circuit board With a rotating device, the circuit board is turned 90 degrees to facilitate the cutting of the other two opposite edges.

前述該檢測定位步驟完成後，得再多增加一雷射打靶位記號之工序；如此，於前述該靶位判讀步驟，亦可將該X-RAY設備改成CCD雷射讀取設備，藉以讀取該雷射靶位記號，亦可獲致相同之目的。 After the foregoing detecting and positioning step is completed, a step of adding a laser target mark is further added; thus, in the foregoing target reading step, the X-RAY device can also be changed into a CCD laser reading device, thereby reading Taking the laser target mark can also achieve the same purpose.

11‧‧‧多片壓板 11‧‧‧Multiple platens

12‧‧‧尺寸取得 12‧‧‧ Size acquisition

13‧‧‧檢測定位 13‧‧‧Detection and positioning

131‧‧‧雷射打靶位記號 131‧‧‧Laser target mark

14‧‧‧裁切分板 14‧‧‧ cutting board

15‧‧‧靶位判讀 15‧‧‧ Target interpretation

16‧‧‧進行磨邊 16‧‧‧ edging

17‧‧‧完成 17‧‧‧Completed

2‧‧‧銅箔 2‧‧‧ copper foil

21‧‧‧電路板 21‧‧‧ boards

211‧‧‧靶位 211‧‧‧ target

第一圖：係為本發明之方法流程圖。 The first figure is a flow chart of the method of the present invention.

第二圖：係為本發明之另一方法流程圖。 Second Figure: is a flow chart of another method of the present invention.

第三圖：係於一銅箔中設置複數小面積電路板之示意圖。 The third figure is a schematic diagram of setting up a plurality of small-area circuit boards in a copper foil.

第四圖：係於一銅箔中設置複數小面積電路板之另一示意圖。 Figure 4: Another schematic diagram of a plurality of small-area circuit boards in a copper foil.

茲謹就本發明「電路板分板裁磨方法」之結構組成，及其所產生之功效，配合圖式，舉一本案之較佳實施例詳細說明如下。 In view of the structural composition of the "circuit board cutting method" of the present invention, and the effects thereof, with the drawings, the best example of the case is The details of the application are as follows.

首請參閱第一圖所示，本案電路板分板裁磨方法，其步驟主要依序包括：進行多片壓板11、執行尺寸取得12、檢測定位13以及裁切分板14；且，更能依需要透過靶位判讀15以利進行磨邊16，最後完成17分板裁磨製程。其中，該多片壓板11，係指在一相對大面積的銅箔2(請配合第三圖)中，同時安排有複數塊相對小面積的電路板21，藉以進行壓板工序；該排列方法至少包括日字形、田字形、複數塊並列、連續日字形或連續田字形；該尺寸取得12步驟，係指就該壓板後之電路板，進行尺寸取得工序，其可以利用預設之外部緣邊尺寸，或是以靶位確認尺寸，該尺寸取得包括採人工輸入方式或設備自動偵測後輸入；該檢測定位13，係以一檢測裝置進行，該檢測裝置可以是X-RAY設備；利用該X-RAY執行緣邊或靶位之定位，能得知各相對小面積電路板21的緣邊位置；該裁切分板14，係指當得知各相對小面積電路板21的緣邊位置後，由一台或一台以上的裁切裝置進行裁切分板；該裁切裝置至少可以執行橫方向之裁切及縱方向之裁切，該裁切裝置至少包括以裁刀方式、滾剪方式或V-CUT方式執行裁切工序；該靶位判讀15，係指完成分板後之各相對小面積電路板21，利用內部原先即已預設、可供X-RAY設備讀取之靶位211，進行外形尺寸判讀或方向辨識；若方向有誤或正反面有誤，將其轉正；該進行磨邊16，係指就該相對小面積電路板21，利用一磨邊裝置進行各緣邊的精密裁磨；該磨邊裝置可以同時就該小面積電路板21的其中一邊或兩相對緣邊進行裁磨，配合一旋轉裝置藉以將該電路板轉向 90度，以利進行其它緣邊的裁磨；各緣邊經裁磨後，即完成17加工。 Referring to the first figure, the circuit board dividing method of the present invention mainly includes: performing a plurality of pressing plates 11, performing size obtaining 12, detecting positioning 13 and cutting the dividing plate 14; and, more preferably, If necessary, the target position is interpreted 15 to facilitate the edging 16 and finally the 17-segment cutting process is completed. Wherein, the plurality of platens 11 refers to a relatively large area of the copper foil 2 (please cooperate with the third figure), and a plurality of relatively small areas of the circuit board 21 are arranged at the same time, thereby performing a pressing process; the arrangement method is at least The utility model comprises a Japanese character shape, a field shape, a plurality of blocks juxtaposed, a continuous Japanese character shape or a continuous field shape; the size obtaining 12 steps refers to performing a size obtaining process on the circuit board after the pressing plate, and the preset outer edge size can be utilized Or confirming the size with the target position, the size is obtained by inputting the manual input method or automatically detecting the device; the detecting position 13 is performed by a detecting device, which may be an X-RAY device; using the X - RAY performs the positioning of the rim or the target position, and can know the position of the edge of each relatively small area circuit board 21; the cutting sub-board 14 means that the position of the edge of each relatively small-area circuit board 21 is known. Cutting the dividing board by one or more cutting devices; the cutting device can perform at least the cutting in the transverse direction and the cutting in the longitudinal direction, and the cutting device comprises at least the cutting method and the rolling shear Mode or V-CUT side The cutting process is performed; the target position interpretation 15 refers to each relatively small-area circuit board 21 after the completion of the splitting, and the externally-prepared target position 211 that is preset for reading by the X-RAY device is used for the external dimensions. Interpretation or direction identification; if the direction is wrong or the front and back are wrong, turn it back; the edging 16 means that the relatively small area of the circuit board 21, using an edging device for precision cutting of each edge; The edging device can simultaneously cut one side or two opposite edges of the small-area circuit board 21, and cooperate with a rotating device to turn the circuit board 90 degrees, in order to facilitate the cutting of other edges; after the edges are cut, the 17 processing is completed.

前述方式，係以X-RAY設備讀取肉眼不可見的靶位211之位置，因應實際不同需要，本案亦可在檢測定位13步驟完成後，再多增加一雷射打靶位記號131之工序，以便在該小面積電路板21上設置有肉眼可見的雷射記號；如此，於靶位判讀15步驟，亦將原本的該X-RAY設備改成CCD雷射讀取設備，藉此，相同能讀取該雷射靶位記號，以獲致相同之判讀目的。 In the foregoing manner, the position of the target position 211 which is invisible to the naked eye is read by the X-RAY device. In view of the actual different needs, the present method may further increase the process of the laser target position mark 131 after the step of detecting and positioning 13 is completed. So that a laser mark visible to the naked eye is disposed on the small-area circuit board 21; thus, the original X-RAY device is also changed into a CCD laser reading device in the target position reading step 15, whereby the same energy can be The laser target mark is read to achieve the same interpretation purpose.

綜上所述，本發明「電路板分板裁磨方法」，依現行專利法規定，未有不能取得專利之情事。本案在產業上確實得以利用，於申請前未曾見於刊物或公開使用，且非為公眾所知悉之技術。再者，本案有效解決先前技術中長期存在的問題並達成相關使用者與消費者長期的需求，得佐證本發明並非能輕易完成。本案完全符合專利法規定之「產業利用性」、「新穎性」與「進步性」等要件，爰依法提請專利，懇請鈞局詳查，並儘早為准予專利之審定，以保護申請人之智慧財產權，俾勵創新。 In summary, the "circuit board cutting method" of the present invention, according to the current patent law, has not been patentable. The case was indeed exploited in the industry and was not seen in the publication or publicly used before the application, and is not a technology known to the public. Furthermore, the present invention effectively solves the long-standing problems in the prior art and achieves long-term needs of related users and consumers, and it is corroborated that the present invention is not easily accomplished. The case is in full compliance with the requirements of "industry useability", "novelty" and "progressiveness" as stipulated in the Patent Law. The patents are submitted in accordance with the law, and the Bureau is invited to conduct a detailed investigation and to approve the patent as soon as possible to protect the wisdom of the applicant. Property rights, encourage innovation.

本發明雖藉由前述實施例來描述，但仍可變化其形態與細節，於不脫離本發明之精神而達成，並由熟悉此項技藝之人士可了解。前述本案之較佳實施例，僅係藉本案原理可以具體實施的方式之一，但並不以此為限制，應依後附之申請專利範圍所界定為準。 The present invention has been described by way of example only, and it is to be understood by those skilled in the art. The preferred embodiment of the present invention is only one of the ways in which the present invention can be implemented in a specific manner, but is not limited thereto, and should be defined in the scope of the appended patent application.

11‧‧‧多片壓板 11‧‧‧Multiple platens

12‧‧‧尺寸取得 12‧‧‧ Size acquisition

13‧‧‧檢測定位 13‧‧‧Detection and positioning

14‧‧‧裁切分板 14‧‧‧ cutting board

15‧‧‧靶位判讀 15‧‧‧ Target interpretation

16‧‧‧進行磨邊 16‧‧‧ edging

17‧‧‧完成 17‧‧‧Completed

Claims

一種電路板分板裁磨方法，依序包括下述步驟：多片壓板步驟，在一相對大面積的銅箔中，同時安排有複數塊相對小面積電路板，藉以進行壓板工序；尺寸取得步驟，就該壓板後之電路板，進行尺寸取得工序；檢測定位步驟，係以一檢測裝置進行，該檢測裝置能得知各相對小面積電路板的緣邊位置或靶位其中任一者；裁切分板步驟，由一台或一台以上的裁切裝置進行裁切分板，以令該各相對小面積電路板分離；靶位判讀步驟，該完成分離後之各相對小面積電路板，利用內部原先即已預設、可供設備讀取之靶位，進行外形尺寸判讀或方向辨識；當方向有誤或正反面有誤，將其轉正；進行磨邊步驟，係指就該相對小面積電路板，利用一磨邊裝置進行各緣邊的精密裁磨。 A circuit board dividing and cutting method comprises the following steps: a plurality of plate pressing steps, in a relatively large area of copper foil, a plurality of relatively small-area circuit boards are arranged at the same time, thereby performing a pressing process; a size obtaining step And performing a size obtaining process on the circuit board after the pressing plate; the detecting and positioning step is performed by a detecting device, and the detecting device can know any one of a rim position or a target position of each relatively small-area circuit board; In the step of dividing the board, the cutting board is cut by one or more cutting devices to separate the relatively small area boards; the target position reading step, the relatively small area boards after the separation is completed, Use the target position that has been preset in the internal and can be read by the device to perform the shape size interpretation or direction identification; when the direction is wrong or the front and back are wrong, turn it back; the edge grinding step is relatively small. The area circuit board uses a edging device to precisely cut the edges.

如申請專利範圍第1項所述電路板分板裁磨方法，其中該相對小面積的電路板於相對大面積銅箔中的排列方法至少包括日字形、田字形、複數塊並列、連續日字形或連續田字形其中任一者。 The method for cutting a board according to the first aspect of the invention, wherein the method for arranging the relatively small area of the circuit board in the relatively large area copper foil comprises at least a Japanese character, a field shape, a plurality of blocks juxtaposed, and a continuous Japanese character shape. Or continuous field shape.

如申請專利範圍第1項所述電路板分板裁磨方法，其中該尺寸取得步驟，係利用預設之外部緣邊尺寸，或是以靶位確認尺寸；該尺寸取得包括採人工輸入方式或設備自動偵測後輸入。 The method for cutting a board according to the first aspect of the invention, wherein the step of obtaining the size is by using a preset outer rim size or by confirming the size with a target position; the size obtaining comprises manual input or The device is automatically detected and input.

如申請專利範圍第1項所述電路板分板裁磨方法，其中該裁切裝置，至少包括執行橫方向之裁切及縱方向之裁切。 The method for cutting a circuit board according to the first aspect of the patent application, wherein The cutting device includes at least cutting in the horizontal direction and cutting in the longitudinal direction.

如申請專利範圍第1項所述電路板分板裁磨方法，其中該裁切裝置，至少包括以裁刀方式、滾剪方式或V-CUT方式其中任一者執行裁切工序。 The method for cutting a circuit board according to the first aspect of the invention, wherein the cutting device comprises at least one of a cutting method, a rolling method or a V-CUT method.

如申請專利範圍第1項所述電路板分板裁磨方法，其中該磨邊裝置，係同時就該相對小面積電路板的其中兩相對緣邊進行裁磨，配合一旋轉裝置藉以將該電路板轉向90度，以利進行另兩相對緣邊的裁磨。 The method for cutting a circuit board according to the first aspect of the invention, wherein the edging device simultaneously cuts two opposite edges of the relatively small area circuit board, and cooperates with a rotating device to the circuit The plate is turned 90 degrees to facilitate the cutting of the other two opposite edges.

如申請專利範圍第1項所述電路板分板裁磨方法，其中該磨邊裝置，係就該相對小面積電路板的其中任一緣邊進行裁磨，配合一旋轉裝置藉以將該電路板轉向90度，以利依序進行其它緣邊的裁磨。 The method for cutting a circuit board according to claim 1, wherein the edging device cuts one of the edges of the relatively small area circuit board, and cooperates with the rotating device to replace the circuit board Turn to 90 degrees, in order to carry out the cutting of other edges.

如申請專利範圍第1項所述電路板分板裁磨方法，其中該檢測定位步驟完成後，增加一雷射打靶位記號之工序，藉以於該小面積電路板上設置雷射記號。 The method for cutting a circuit board according to claim 1, wherein after the detecting and positioning step is completed, a process of marking a laser target is added, so that a laser mark is disposed on the small-area circuit board.

如申請專利範圍第1項所述電路板分板裁磨方法，其中該檢測定位步驟完成後，多增加一雷射打靶位記號之工序，藉以於該小面積電路板上設置雷射記號，且該靶位判讀步驟係利用一CCD雷射讀取設備讀取該雷射記號。 The method for cutting a board according to the first aspect of the invention, wherein after the detecting and positioning step is completed, a step of adding a laser target is added, so that a laser mark is set on the small-area circuit board, and The target interpretation step reads the laser mark using a CCD laser reading device.