TWI596978B - Heating equipment - Google Patents
Heating equipment Download PDFInfo
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- TWI596978B TWI596978B TW103104887A TW103104887A TWI596978B TW I596978 B TWI596978 B TW I596978B TW 103104887 A TW103104887 A TW 103104887A TW 103104887 A TW103104887 A TW 103104887A TW I596978 B TWI596978 B TW I596978B
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- plate body
- heating device
- heat generating
- heat
- generating plate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
Description
本發明係關於加熱裝置，更詳細來說係關於可進行具有指向性熱放射的加熱裝置。 The present invention relates to a heating device, and more particularly to a heating device that can perform directional heat radiation.
以往，係如下述專利文獻1所揭示般，使陶瓷加熱器的發熱面朝向被加熱物之後，於陶瓷加熱器的背面側設置熱反射體，來減輕來自陶瓷加熱器之背面側的熱輻射所伴隨的電力損失之技術已為所知。 Conventionally, as disclosed in Patent Document 1 below, after the heat generating surface of the ceramic heater is directed toward the object to be heated, a heat reflector is provided on the back side of the ceramic heater to reduce heat radiation from the back side of the ceramic heater. The accompanying techniques of power loss are known.
[先前技術文獻] [Previous Technical Literature]
[專利文獻] [Patent Literature]
[專利文獻1]日本特開2000-133416號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-133416
但是，使用上述加熱裝置時，會有在加熱後難以於短時間內開放爐並取出被加熱物的問題。本發明係 有鑑於上述情況而發明者，以提供一種不但省能源、且昇溫速度大並可在短時間冷卻之可縮短加熱冷卻循環的加熱裝置為目的。 However, when the above heating device is used, there is a problem that it is difficult to open the furnace and take out the object to be heated in a short time after heating. The invention is In view of the above circumstances, the inventors have aimed to provide a heating device which can reduce the heating and cooling cycle, which is not only energy-saving, but also has a high heating rate and can be cooled in a short time.
為了解決上述問題，請求項1所記載的加熱裝置，其要旨為具備：配置在前面側之用來放射熱的發熱板體、及從前述發熱板體的背面側與前述發熱板體分離配置的反射板體，前述發熱板體，係具備基板、及配設於其一面上的電阻加熱絲，前述反射板體，係配置成與前述發熱板體大致平行，且於前面側具有用來反射紅外線的反射面。 In order to solve the above-mentioned problem, the heating device according to the first aspect of the invention includes the heat generating plate body for radiating heat disposed on the front side, and the heat generating plate body disposed away from the back side of the heat generating plate body. In the reflector body, the heat generating plate body includes a substrate and a resistance heating wire disposed on one surface thereof, and the reflection plate body is disposed substantially parallel to the heat generating plate body and has a front side for reflecting infrared rays Reflective surface.
請求項2所記載的加熱裝置，係如請求項1所記載的加熱裝置，其要旨為，前述反射板體，具有：配置在前述發熱板體之側的前板部、位於比前述前板部更靠背面側而構成的後板部、及連接前述前板部及前述後板部的側壁部，前述側壁部，具有可將對前述發熱板體供給電力用的電源線予以配線的切口或貫通口。 The heating device according to claim 2, wherein the reflecting plate body has a front plate portion disposed on a side of the heat generating plate body and located at a front plate portion a rear plate portion formed on the back surface side and a side wall portion connecting the front plate portion and the rear plate portion, wherein the side wall portion has a slit or a through line through which a power supply wire for supplying electric power to the heat generating plate body can be wired mouth.
請求項3所記載的加熱裝置，係如請求項1或2所記載的加熱裝置，其要旨為，前述發熱板體和前述反射板體，係藉由磁力而維持互相分離的狀態。 The heating device according to claim 3 is the heating device according to claim 1 or 2, wherein the heat generating plate body and the reflecting plate body are maintained in a state of being separated from each other by a magnetic force.
請求項4所記載的加熱裝置，係如請求項1~3中任一項所記載的加熱裝置，其要旨為，前述反射板體，在其背面側具備與前述電阻加熱絲電性連接的連接端子。 The heating device according to any one of claims 1 to 3, wherein the reflector body has a connection electrically connected to the resistance heating wire on a back side thereof. Terminal.
請求項5所記載的加熱裝置，係如請求項4所記載的加熱裝置，其要旨為，前述連接端子，係配設於前述前板部。 The heating device according to claim 5 is the heating device according to claim 4, wherein the connection terminal is disposed in the front plate portion.
請求項6所記載的加熱裝置，係如請求項1~5中任一項所記載的加熱裝置，其要旨為具備：對前述發熱板體之前述電阻加熱絲供電用的供電用構造體，前述供電用構造體，具有第一構造部及第二構造部，前述供電用構造體，其前述第一構造部與前述第二構造部各自成為橋墩，而使整體成形為橋型的一個供電用構造體。 The heating device according to any one of claims 1 to 5, wherein the heating device according to any one of claims 1 to 5, further comprising: a power supply structure for supplying power to the resistance heating wire of the heat generating plate body, The power supply structure includes a first structure portion and a second structure portion, and each of the first structure portion and the second structure portion is a bridge pier, and the entire structure is formed into a bridge type power supply structure. body.
請求項7所記載的加熱裝置，係如請求項1~6中任一項所記載的加熱裝置，其要旨為具有：將分離前述發熱板體與前述反射板體之狀態予以維持的支柱，前述支柱，含有中介於前述發熱板體與前述反射板體之間的陶瓷製間隔件。 The heating device according to any one of claims 1 to 6, wherein the heating device according to any one of claims 1 to 6 has a support for maintaining a state in which the heat generating plate body and the reflecting plate body are separated. The pillar includes a ceramic spacer interposed between the heat generating plate body and the reflecting plate body.
請求項8所記載的加熱裝置，係如請求項1~7中任一項所記載的加熱裝置，其要旨為，該加熱裝置可於大氣壓下或減壓下利用。 The heating device according to any one of claims 1 to 7, wherein the heating device can be used under atmospheric pressure or under reduced pressure.
將具備基板及配設在其一面上之電阻加熱絲的發熱板體作為熱源使用，可藉此成為昇溫速度大並可在短時間冷卻，可縮短加熱冷卻循環的加熱裝置。且，藉由在與發熱板體分離配置之反射板體的前面側表面具有用來反射紅外線的反射面，可抑制來自發熱板體所放射的熱往 反射板體的背面側漏出，而可將熱放射往前面側集中，可成為省能源的加熱裝置。 A heat-generating plate body including a substrate and a resistance heating wire disposed on one surface thereof is used as a heat source, whereby a heating device having a large temperature increase rate and capable of being cooled in a short time and shortening the heating and cooling cycle can be obtained. Further, by having a reflecting surface for reflecting infrared rays on the front side surface of the reflecting plate body disposed separately from the heat generating plate body, heat radiated from the heat generating plate body can be suppressed The back side of the reflecting plate body leaks out, and the heat radiation can be concentrated toward the front side, which can be an energy-saving heating device.
反射板體，係具有：配置在發熱板體之側的前板部、位於比前板部更靠背面側而構成的後板部、及連接前板部及後板部的側壁部，當側壁部具有可將對發熱板體供給電力用的電源線予以配線的切口或貫通口時，可將對發熱板體進行供電用之電源線導出至反射板體的背面側。且，藉此可將加熱裝置彼此配置成互相靠於側方。 The reflector body has a front plate portion disposed on the side of the heat generating plate body, a rear plate portion configured to be located on the back surface side of the front plate portion, and a side wall portion connecting the front plate portion and the rear plate portion, and the side wall portion When the portion has a slit or a through hole through which a power supply line for supplying electric power to the heat generating plate body can be wired, the power supply line for supplying power to the heat generating plate body can be led to the back side of the reflecting plate body. Moreover, the heating devices can be arranged to be placed against each other on the side.
發熱板體與反射板體為藉由磁力而維持互相分離的狀態時，能防止從發熱板體對反射板體的熱傳導，而可有效地抑制反射板體之溫度上升。且，即使發熱板體與反射板體之因熱導致的歪曲相異，亦不會受到彼此歪曲的影響。 When the heat generating plate body and the reflecting plate body are kept separated from each other by the magnetic force, heat conduction from the heat generating plate body to the reflecting plate body can be prevented, and the temperature rise of the reflecting plate body can be effectively suppressed. Moreover, even if the heat-generating plate body and the reflecting plate body are different in distortion due to heat, they are not affected by the distortion of each other.
具備用來對發熱板體的電阻加熱絲供電的供電用構造體，供電用構造體，具有第一構造部和第二構造部，供電用構造體，其第一構造部與第二構造部各自成為橋墩，而使整體成形為橋型的一個供電用構造體時，可緩和因發熱板體的溫度變化(溫度上升及溫度下降)所致之歪曲的影響。 A power supply structure for supplying power to a resistance heating wire of a heat generating plate body, the power supply structure having a first structure portion and a second structure portion, and a power supply structure body, each of the first structure portion and the second structure portion When the bridge pier is formed into a bridge-type power supply structure, the influence of distortion due to temperature change (temperature rise and temperature drop) of the heat-generating plate body can be alleviated.
1‧‧‧加熱裝置 1‧‧‧heating device
1a‧‧‧前面側 1a‧‧‧ front side
1b‧‧‧背面側 1b‧‧‧back side
10‧‧‧發熱板體 10‧‧‧heating plate
11‧‧‧基板 11‧‧‧Substrate
12‧‧‧電阻加熱絲 12‧‧‧Resistive heating wire
20‧‧‧反射板體 20‧‧‧Reflecting plate
21‧‧‧前板部 21‧‧‧ Front Board
22‧‧‧後板部 22‧‧‧ Rear Board
23‧‧‧側壁部 23‧‧‧ Side wall
24‧‧‧切口或貫通孔 24‧‧‧Incision or through hole
20a‧‧‧反射面 20a‧‧‧reflecting surface
25、26‧‧‧貫通孔 25, 26‧‧‧through holes
30‧‧‧支柱 30‧‧‧ pillar
31‧‧‧第一支柱 31‧‧‧First pillar
32‧‧‧第二支柱 32‧‧‧Second pillar
35‧‧‧治具(固定支柱的治具、螺柱) 35‧‧‧ fixtures (fixed pillar fixtures, studs)
35b‧‧‧螺柱的背面側固定孔 35b‧‧‧Side-side fixing hole for studs
36‧‧‧間隔件 36‧‧‧ spacers
36a‧‧‧間隔件的前面側固定孔 36a‧‧‧Front side fixing holes for spacers
36b‧‧‧間隔件的背面側固定孔 36b‧‧‧Removable part back side fixing hole
37‧‧‧支柱頭 37‧‧‧ pillar head
37a‧‧‧支柱頭的前面側固定孔 37a‧‧‧Front head fixing hole
381、382‧‧‧接合構件 381, 382‧‧‧ joint components
39‧‧‧貫通孔(用來使支柱插通的貫通孔) 39‧‧‧through holes (through holes for inserting posts)
41a及41b‧‧‧環狀磁鐵 41a and 41b‧‧‧ ring magnets
42a及42b‧‧‧鍔型磁鐵 42a and 42b‧‧‧锷 magnets
431、432及433‧‧‧螺帽側磁鐵 431, 432 and 433‧‧‧ nuts side magnets
441、442及443‧‧‧反射板體側磁鐵 441, 442 and 443‧‧‧reflector body magnets
45‧‧‧螺帽 45‧‧‧ nuts
49a及49b‧‧‧螺帽 49a and 49b‧‧‧ nuts
50‧‧‧供電用構造體 50‧‧‧Power supply structure
51‧‧‧第一構造部 51‧‧‧First Construction Department
52‧‧‧第二構造部 52‧‧‧Second Construction Department
55‧‧‧電源線 55‧‧‧Power cord
56‧‧‧連接端子 56‧‧‧Connecting terminal
圖1為說明關於實施例1之加熱裝置的說明圖。 Fig. 1 is an explanatory view for explaining a heating apparatus of the first embodiment.
圖2為說明發熱板體的說明圖。 Fig. 2 is an explanatory view for explaining a heat generating plate body.
圖3為說明關於實施例2之加熱裝置的說明圖。 Fig. 3 is an explanatory view for explaining a heating device of the second embodiment.
圖4為說明關於實施例3之加熱裝置的說明圖。 Fig. 4 is an explanatory view for explaining a heating apparatus of the third embodiment.
圖5為說明關於實施例3之加熱裝置之反射板體的說明圖。 Fig. 5 is an explanatory view for explaining a reflecting plate body of the heating device of the third embodiment.
圖6為說明關於實施例3之加熱裝置之利用型態的說明圖。 Fig. 6 is an explanatory view for explaining a utilization form of the heating device of the third embodiment.
圖7為說明關於實施例4之加熱裝置的說明圖，且為表示圖10之A-A’剖面的說明圖。 Fig. 7 is an explanatory view for explaining a heating apparatus of the fourth embodiment, and is an explanatory view showing a cross section taken along the line A-A' of Fig. 10.
圖8為說明關於實施例4之加熱裝置之磁鐵配置的說明圖。 Fig. 8 is an explanatory view for explaining a magnet arrangement of the heating device of the fourth embodiment.
圖9為說明關於實施例4之加熱裝置之磁鐵配置的說明圖。 Fig. 9 is an explanatory view for explaining a magnet arrangement of the heating device of the fourth embodiment.
圖10為說明關於實施例4之加熱裝置之磁鐵配置的說明圖。 Fig. 10 is an explanatory view for explaining a magnet arrangement of the heating device of the fourth embodiment.
圖11為說明供電用構造體之形狀的說明圖。 Fig. 11 is an explanatory view for explaining the shape of the power supply structure.
圖12為說明關於進一步其他型態之加熱裝置的說明圖。 Fig. 12 is an explanatory view for explaining a heating device of still other types.
圖13為說明支柱之構造之一例的說明圖。 Fig. 13 is an explanatory view showing an example of the structure of a pillar.
關於本實施型態1的加熱裝置(1)，具備：配置在前面側(1a)之放射熱的發熱板體(10)、及從發熱板體(10)的背面(1b)側與發熱板體(10)分離配置的反射板體(20)，發熱板體(10)，係具備基板(11)、及配設於其一面上的電阻加熱絲(12)，反射板體(20)，係配置成與發熱板體 (10)大致平行，且於前面(1a)側具有用來反射紅外線的反射面(20a)(參照圖1~圖10)。 The heating device (1) of the first embodiment includes a heat generating plate body (10) that radiates heat on the front side (1a), and a back surface (1b) side and a heat generating plate from the heat generating plate body (10). The body (10) is provided with a reflecting plate body (20), and the heat generating plate body (10) includes a substrate (11), a resistance heating wire (12) disposed on one surface thereof, and a reflecting plate body (20). System configured with a heating plate (10) It is substantially parallel, and has a reflecting surface (20a) for reflecting infrared rays on the front side (1a) side (see FIGS. 1 to 10).
關於本實施型態1之加熱裝置(1)可為以下型 態(參照圖4~圖5)：反射板體(20)具有：配置在發熱板體(10)之側的前板部(21)、位於比前板部(21)更靠背面(1b)側而構成的後板部(22)、及連接前板部(21)及後板部(22)的側壁部(23)，側壁部(23)，具有可將對發熱板體(10)供給電力用的電源線(55)予以配線的切口或貫通口(24)。 The heating device (1) of the first embodiment can be of the following type (Refer to FIG. 4 to FIG. 5): The reflector body (20) has a front plate portion (21) disposed on the side of the heat generating plate body (10) and a backrest surface (1b) than the front plate portion (21). a rear plate portion (22) formed on the side, and a side wall portion (23) connecting the front plate portion (21) and the rear plate portion (22), and the side wall portion (23) having a heat supply plate body (10) A power supply line (55) is provided with a slit or a through hole (24) for wiring.
關於本實施型態1之加熱裝置(1)可為以下型 態(參照圖7~圖10)：發熱板體(10)和反射板體(20)，係藉由磁力而維持互相分離的狀態。 The heating device (1) of the first embodiment can be of the following type State (see FIGS. 7 to 10): The heat generating plate body (10) and the reflecting plate body (20) are maintained in a state of being separated from each other by magnetic force.
關於本實施型態1之加熱裝置(1)可為以下型態(參照圖4及圖6)：反射板體(20)，在其背面(1b)側具備與電阻加熱絲(12)電性連接的連接端子(56)。 The heating device (1) of the first embodiment can be of the following type (see Figs. 4 and 6): the reflecting plate body (20) is provided with electric resistance heating wire (12) on the back side (1b) side thereof. Connected connection terminal (56).
關於本實施型態1之加熱裝置(1)可為以下型態(參照圖4及圖6)：連接端子(56)，係配設於前板部(21)。 The heating device (1) of the first embodiment can be of the following type (see FIGS. 4 and 6): the connection terminal (56) is disposed on the front plate portion (21).
關於本實施型態1之加熱裝置(1)可為以下型態(參照圖2及圖11)：具備對發熱板體(10)之電阻加熱絲(12)供電用的供電用構造體(50)，供電用構造體(50)，具有第一構造部(51)及第二構造部(52)，供電用構造體(50)，其第一構造部(51)與第二構造部(52)各自成為橋墩，而使整體成形為橋型的一個供電用構造體(50)。 The heating device (1) of the first embodiment can be of the following type (see FIGS. 2 and 11): a power supply structure for supplying power to the resistance heating wire (12) of the heat generating plate body (10) (50) The power supply structure (50) includes a first structure portion (51) and a second structure portion (52), a power supply structure (50), and a first structure portion (51) and a second structure portion (52). Each of them becomes a pier, and the whole is formed into a bridge type power supply structure (50).
關於本實施型態1之加熱裝置(1)可為以下型態(參照圖13)：具有將分離發熱板體(10)與反射板體 (20)之狀態予以維持的支柱(30)，支柱(30)，含有中介於發熱板體(10)與反射板體(20)之間的陶瓷製間隔件(36)。 The heating device (1) of the first embodiment can be of the following type (refer to FIG. 13): having a separate heating plate body (10) and a reflecting plate body The pillar (30) in which the state of (20) is maintained, and the pillar (30) contains a ceramic spacer (36) interposed between the heat generating plate body (10) and the reflecting plate body (20).
關於本實施型態1之加熱裝置(1)，為可於大氣壓下或減壓下利用的加熱裝置。 The heating device (1) of the first embodiment is a heating device that can be used under atmospheric pressure or under reduced pressure.
關於本實施型態1之加熱裝置(1)可為以下型態(參照圖7、圖8及圖10)：具有固定於發熱板體(10)並貫穿反射板體(20)且朝反射板體(20)的背面(1b)側突出的第一支柱(31)，第一支柱(31)，係具有被自身插通固定之相向的兩個鍔型磁鐵(42a及42b)，反射板體(20)，係具有內徑比第一支柱(31)之外徑還大且插通有第一支柱(31)的貫通孔(25)，反射板體(20)，係在成為貫通孔(25)之其周緣部的內外分別具備環狀磁鐵(41a及41b)，兩個環狀磁鐵(41a及41b)，係介在於兩個鍔型磁鐵(42a及42b)之間，並將各磁鐵的磁極配置成使環狀磁鐵(41a及41b)與鍔型磁鐵(42a及42b)各自磁性相斥而不會接觸。 The heating device (1) of the first embodiment can be of the following type (see FIGS. 7, 8, and 10): having a heat-generating plate body (10) and penetrating the reflecting plate body (20) toward the reflecting plate. a first pillar (31) protruding from a back surface (1b) side of the body (20), and a first pillar (31) having two 锷-shaped magnets (42a and 42b) which are inserted and fixed by themselves, and a reflector body (20) A through hole (25) having an inner diameter larger than an outer diameter of the first pillar (31) and having a first pillar (31) inserted therein, and the reflector body (20) is a through hole ( 25) The inner and outer portions of the peripheral portion thereof are respectively provided with annular magnets (41a and 41b), and the two annular magnets (41a and 41b) are interposed between the two bismuth-type magnets (42a and 42b), and the respective magnets are The magnetic poles are arranged such that the ring magnets (41a and 41b) and the neodymium magnets (42a and 42b) are magnetically repelled without contact.
關於本實施型態1之加熱裝置(1)可為以下型態(參照圖7、圖9及圖10)：具有固定於發熱板體(10)並貫穿反射板體(20)且朝反射板體(20)的背面(1b)側突出的第二支柱(32)，第二支柱(32)，係具有螺合於自身的螺帽(45)，螺帽(45)，係於其外周具備均等地配置之至少三個的螺帽側磁鐵(431、432及433)，反射板體(20)，係具有內徑比第二支柱(32)之外徑還大且插通有第二支柱(32)的貫通孔(26)，反射板體(20)，係在成為貫通孔(26)之其周緣部的內外之至少其中一邊的表面上，具備配置成與至 少三個的螺帽側磁鐵(431、432及433)之磁力各自相斥的至少三個的反射板體側磁鐵(441、442及443)。 The heating device (1) of the first embodiment can be of the following type (see FIGS. 7, 9, and 10): having a heat-generating plate body (10) and penetrating the reflecting plate body (20) toward the reflecting plate. a second pillar (32) protruding from the back side (1b) side of the body (20), and a second pillar (32) having a nut (45) screwed to itself, and a nut (45) attached to the outer periphery thereof At least three nut side magnets (431, 432, and 433) are equally disposed, and the reflecting plate body (20) has an inner diameter larger than an outer diameter of the second pillar (32) and has a second pillar inserted therein (32) the through hole (26) and the reflecting plate body (20) are disposed on at least one of the inner and outer sides of the peripheral portion of the through hole (26). At least three reflector-side magnets (441, 442, and 443) each having a magnetic force of three fewer nut side magnets (431, 432, and 433) repel each other.
關於本實施型態1之加熱裝置(1)可為以下型 態：具有將分離發熱板體(10)與反射板體(20)之狀態予以維持的支柱(30)，支柱(30)，係貫穿反射板體(20)並朝反射板體(20)的背面(1b)側突出，反射板體(20)，係可沿著貫通自身的支柱(30)，朝前面(1a)側及背面(1b)側移動，藉此可改變發熱板體(10)與反射板體(20)的離間距離。 The heating device (1) of the first embodiment can be of the following type State: a pillar (30) for maintaining a state in which the heat generating plate body (10) and the reflecting plate body (20) are separated, and the pillar (30) penetrates the reflecting plate body (20) and faces the reflecting plate body (20). The back side (1b) side protrudes, and the reflecting plate body (20) is movable toward the front side (1a) side and the back side (1b) side along the pillar (30) penetrating itself, whereby the heat generating board body (10) can be changed. The distance from the reflector body (20).
關於本實施型態1之加熱裝置(1)可為以下型 態：具有將分離發熱板體(10)與反射板體(20)之狀態予以維持的支柱(30)，支柱(30)，係貫穿反射板體(20)並朝反射板體(20)的背面(1b)側突出，本加熱裝置(1)，係藉由突出於背面(1b)側的支柱(30)而固定其整體。 The heating device (1) of the first embodiment can be of the following type State: a pillar (30) for maintaining a state in which the heat generating plate body (10) and the reflecting plate body (20) are separated, and the pillar (30) penetrates the reflecting plate body (20) and faces the reflecting plate body (20). The back surface (1b) protrudes, and the heating device (1) is fixed to the entirety by a pillar (30) protruding from the back surface (1b) side.
[實施例] [Examples]
以下，使用圖式藉由實施例具體地說明本發明。 Hereinafter, the present invention will be specifically described by way of examples with reference to the drawings.
〈實施例1〉 <Example 1>
以下，針對關於實施例1之加熱裝置(參照圖1及圖2)進行說明。 Hereinafter, the heating device (see FIGS. 1 and 2) of the first embodiment will be described.
實施例1的加熱裝置(1)(參照圖1)，係具備發熱板體(10)及反射板體(20)。且該加熱裝置(1)，係成為朝向前面(1a)側放射熱的構造。 The heating device (1) (see Fig. 1) of the first embodiment includes a heat generating plate body (10) and a reflecting plate body (20). Further, the heating device (1) has a structure that radiates heat toward the front surface (1a) side.
上述發熱板體(10)(參照圖2)，在加熱裝置(1)中，係配置在其前面(1a)側並用來放射熱的部位。該發熱板體(10)，係具備基板(11)、及配設於其一面上的電阻加熱絲(12)。 The heat generating plate body (10) (see Fig. 2) is disposed on the front surface (1a) side of the heating device (1) to radiate heat. The heat generating plate body (10) includes a substrate (11) and a resistance heating wire (12) disposed on one surface thereof.
電阻加熱絲(12)，可配設在基板(11)的前面(1a)側及背面(1b)側之任一表面，但以基板(11)的背面(1b)側為佳。然後，對該電阻加熱絲(12)通電會使其發熱。 The resistance heating wire (12) may be disposed on either the front (1a) side or the back (1b) side of the substrate (11), but preferably on the back (1b) side of the substrate (11). Then, energizing the resistance heating wire (12) causes it to generate heat.
上述基板(11)可由各種材料所形成。亦即，例 如可舉出金屬及陶瓷。該等之中作為金屬可使用例如不鏽鋼，此外還可利用Cu(銅)、Al(鋁)及該等之合金等。該等之中又以不鏽鋼為佳。 The above substrate (11) can be formed of various materials. That is, an example For example, metals and ceramics can be cited. Among these, for example, stainless steel can be used as the metal, and Cu (copper), Al (aluminum), and the like can be used. Stainless steel is preferred among these.
在使用不鏽鋼的情況，其種類並無特別限制，以鐵氧體系不鏽鋼及/或奧氏體系不鏽鋼為佳。進一步於該等之不鏽鋼種之中，特別是以耐熱性及/或耐氧化性優異的品種為佳。亦即，例如在鐵氧體系不鏽鋼之中，亦以Cr為16~20%、Mo或Al為1.5~3.5%之範圍的品種為佳。另一方面，在奧氏體系不鏽鋼之中，亦以Ni為10~22%、Cr為16~26%、Mo為1~3%之範圍的品種為佳。更具體來說，可舉出SUS430、SUS436、SUS444、SUS316L等。該等可單獨使用一種亦可併用兩種以上。且，基板(11)的厚度並無特別限定，例如可為0.4~20mm，以0.6~5mm為佳。 In the case of using stainless steel, the type thereof is not particularly limited, and ferrite stainless steel and/or austenitic stainless steel are preferred. Further, among these stainless steel types, a variety excellent in heat resistance and/or oxidation resistance is preferable. That is, for example, in the ferrite stainless steel, it is preferable to use a variety of Cr of 16 to 20% and Mo or Al of 1.5 to 3.5%. On the other hand, among the austenitic stainless steels, it is preferable to use a variety of Ni of 10 to 22%, Cr of 16 to 26%, and Mo of 1 to 3%. More specifically, SUS430, SUS436, SUS444, SUS316L, etc. are mentioned. These may be used alone or in combination of two or more. Further, the thickness of the substrate (11) is not particularly limited, and may be, for example, 0.4 to 20 mm, preferably 0.6 to 5 mm.
且，基板(11)與電阻加熱絲(12)，通常施加有 絕緣(特別是當基板(11)為金屬的情況)。該絕緣可由各 種方式進行，通常係在基板(11)與電阻加熱絲(12)之間設置絕緣被膜來進行絕緣。作為此種絕緣被膜，可使用玻璃被膜。使用玻璃被膜時，特別是在使用不鏽鋼作為基板(11)的情況，就其熱膨脹平衡的觀點來看，以軟化點為600℃以上之結晶化玻璃及半結晶化玻璃較佳。具體而言，以SiO2-Al2O3-MO系玻璃為佳。唯，MO為鹼土類金屬的氧化物(MgO、CaO、BaO、SrO等)。玻璃被膜的厚度並無特別限定，以60~120μm為佳，以70~110μm較佳，以75~100μm更佳。此外，該玻璃被膜以不含鹼金屬之無鹼玻璃為佳。且，該玻璃被膜，以使用高紅外線反射率的玻璃為佳。 Further, the substrate (11) and the resistance heating wire (12) are usually insulated (especially when the substrate (11) is a metal). The insulation can be performed in various manners, and an insulating film is usually provided between the substrate (11) and the resistance heating wire (12) for insulation. As such an insulating film, a glass film can be used. When a glass film is used, in particular, when stainless steel is used as the substrate (11), crystallized glass and semi-crystallized glass having a softening point of 600 ° C or higher are preferable from the viewpoint of thermal expansion balance. Specifically, SiO 2 -Al 2 O 3 -MO-based glass is preferred. Only MO is an oxide of an alkaline earth metal (MgO, CaO, BaO, SrO, etc.). The thickness of the glass film is not particularly limited, and is preferably 60 to 120 μm, more preferably 70 to 110 μm, still more preferably 75 to 100 μm. Further, the glass film is preferably an alkali-free glass containing no alkali metal. Further, the glass film is preferably a glass using a high infrared reflectance.
此外，於電阻加熱絲(12)的表面，可設置抗氧 化被膜。亦即，例如將電阻加熱絲(12)設在基板(11)之背面(1b)側的情形，係將抗氧化被膜設在電阻加熱絲(12)的背面(1b)側。作為此種抗氧化被膜，可直接利用前述之絕緣被膜。亦即，可直接適用前述之玻璃被膜。 In addition, on the surface of the resistance heating wire (12), anti-oxidation can be set Chemical film. That is, for example, when the resistance heating wire (12) is provided on the back surface (1b) side of the substrate (11), the oxidation resistant film is provided on the back surface (1b) side of the electric resistance heating wire (12). As such an antioxidant film, the above-mentioned insulating film can be used as it is. That is, the aforementioned glass film can be directly applied.
電阻加熱絲(12)，只要為藉由通電而發熱者即 可，構成電阻加熱絲(12)之導電材料的種類並無特別限定。作為導電材料，例如可利用：銀、銅、金、鉑、鈀，銠，鎢及鉬等。該等可單獨使用一種亦可併用兩種以上。 為併用兩種以上時可使用合金。更具體而言，可利用銀-鈀合金、銀-鉑合金、鉑-銠合金、銀、銅及金等。 The resistance heating wire (12) is only required to be heated by energization. The type of the conductive material constituting the resistance heating wire (12) is not particularly limited. As the conductive material, for example, silver, copper, gold, platinum, palladium, rhodium, tungsten, molybdenum or the like can be used. These may be used alone or in combination of two or more. An alloy may be used in combination of two or more. More specifically, a silver-palladium alloy, a silver-platinum alloy, a platinum-rhodium alloy, silver, copper, gold, or the like can be used.
且，構成電阻加熱絲(12)的導電材料，例如以 電阻溫度係數(0~1000℃內)為500~4400ppm/℃之導 電材料為佳。該電阻溫度係數(0~1000℃內)係以500~4000ppm/℃較佳，為500~3800ppm/℃更佳。特別是以Ag或Ag-Pd作為導電材料的情況，係以電阻溫度係數(0~600℃內)為500~4000ppm/℃的導電材料為佳，為500~3800ppm/℃更佳。另一方面，以Mo及/或W作為導電材料的情況，係以電阻溫度係數(0~1000℃內)為2000~4000ppm/℃的導電材料為佳，為3000~4000ppm/℃更佳。此外，電阻加熱絲(12)的線粗，以面積電阻率的觀點來看以3~20μm為佳，以5~17μm為較佳，以8~12μm為更佳。且，電阻加熱絲(12)，可因應必要而適當使各部位的導電材料、線寬及線粗等成為不同。 And a conductive material constituting the resistance heating wire (12), for example, The temperature coefficient of resistance (within 0~1000 °C) is 500~4400ppm/°C. Electrical materials are preferred. The temperature coefficient of resistance (within 0 to 1000 ° C) is preferably 500 to 4000 ppm / ° C, more preferably 500 to 3800 ppm / ° C. In particular, when Ag or Ag-Pd is used as the conductive material, a conductive material having a temperature coefficient of resistance (within 0 to 600 ° C) of 500 to 4000 ppm/° C is preferable, and more preferably 500 to 3800 ppm/° C. On the other hand, in the case where Mo and/or W is used as the conductive material, a conductive material having a temperature coefficient of resistance (within 0 to 1000 ° C) of 2,000 to 4,000 ppm/° C is preferable, and more preferably 3,000 to 4,000 ppm/° C. Further, the wire of the electric resistance heating wire (12) is preferably 3 to 20 μm from the viewpoint of area resistivity, preferably 5 to 17 μm, more preferably 8 to 12 μm. Further, the resistance heating wire (12) may appropriately have different conductive materials, line widths, and line thicknesses in each portion as necessary.
此外，加熱裝置(1)，係具備對發熱板體(10) 之電阻加熱絲(12)供電用的供電用構造體(50)。供電用構造體(50)的構造並無特別限定，以構成為具有第一構造部(51)及第二構造部(52)，並使第一構造部(51)與第二構造部(52)各自成為橋墩，而使整體成形為橋型的一個供電用構造體之供電用構造體(50)(參照圖10)為佳。 In addition, the heating device (1) is provided with a heating plate body (10) The power supply structure (50) for supplying power to the resistance heating wire (12). The structure of the power supply structure (50) is not particularly limited, and is configured to include the first structure portion (51) and the second structure portion (52), and to configure the first structure portion (51) and the second structure portion (52). It is preferable that the power supply structure (50) (see FIG. 10) which is a bridge structure and which is integrally formed into a bridge type.
上述反射板體(20)，係從發熱板體(10)的背面 側(1b)與發熱板體(10)分離配置的部位。反射板體(20)，係配置成與發熱板體(10)大致平行，且於前面側(1a)具有用來反射紅外線的反射面(20a)。 The reflecting plate body (20) is from the back of the heat generating plate body (10) The side (1b) is separated from the heat generating plate body (10). The reflecting plate body (20) is disposed substantially parallel to the heat generating plate body (10), and has a reflecting surface (20a) for reflecting infrared rays on the front side (1a).
因此，藉由對發熱板體(10)所具備之電阻加熱絲(12)通電，而使電阻加熱絲(12)發熱時，熱的一部分會從前面(1a)側放射。且，熱的其他部份會朝發熱板體(10)的背面 (1b)側放射。朝該發熱板體(10)的背面(1b)側放射的熱，係作為紅外線而被反射面(20a)所反射，並朝向加熱裝置(1)的前面(1a)側放射。藉此，能夠從發熱板體(10)所放射的熱之中，減少朝背面(1b)側脫離的熱量，可有效率地利用加熱裝置(1)。且，藉由減少朝背面(1b)側脫離的熱量，可減少加熱裝置(1)所消費的能量。 Therefore, when the resistance heating wire (12) provided in the heat generating plate body (10) is energized and the resistance heating wire (12) is heated, a part of the heat is radiated from the front side (1a) side. And the other part of the heat will face the back of the heating plate (10) (1b) Side radiation. The heat radiated toward the back surface (1b) side of the heat generating plate body (10) is reflected by the reflecting surface (20a) as infrared rays, and is radiated toward the front surface (1a) side of the heating device (1). Thereby, heat which is detached toward the back surface (1b) side can be reduced from the heat radiated from the heat generating plate body (10), and the heating device (1) can be utilized efficiently. Moreover, by reducing the amount of heat that is detached toward the back side (1b) side, the energy consumed by the heating device (1) can be reduced.
反射板體(20)可由各種材料所形成，例如可使 用金屬、陶瓷、玻璃等。其中以加工自由度較高的觀點來看以金屬為佳。且，所使用的金屬種類並無特別限制，可使用不鏽鋼，此外還可利用Cu(銅)、Al(鋁)及該等之合金等。 The reflecting plate body (20) may be formed of various materials, for example, Use metal, ceramic, glass, etc. Among them, metal is preferred from the viewpoint of high degree of freedom in processing. Further, the type of metal to be used is not particularly limited, and stainless steel can be used, and Cu (copper), Al (aluminum), and the like can be used.
且，反射面(20a)可由各種材料所形成。例如 可利用：Au(金)、Ag(銀)、Al(鋁)、Cr(鉻)、Ni(鎳)、Sn(錫)及Mg(鎂)等。具體來說，可利用：銀(銀鏡面)、鋁經電解研磨的表面、玻璃鏡面(鋁合金面)、鋁、金、鉻、鎳、錫、碳酸鎂等表面來作為反射面(20a)。其中又以包含銀、金、鋁的反射面(20a)為佳。該等之反射面(20a)為由上述各材料所構成之單體的表面亦可，為由該等材料所成之被膜的表面亦可。作為被膜，可舉出電鍍、塗膜印刷之燒結面、濺鍍蒸鍍表面等。 Moreover, the reflecting surface (20a) can be formed of various materials. E.g Available: Au (gold), Ag (silver), Al (aluminum), Cr (chromium), Ni (nickel), Sn (tin), and Mg (magnesium). Specifically, a silver (silver mirror) surface, an aluminum electrolytically polished surface, a glass mirror surface (aluminum alloy surface), aluminum, gold, chromium, nickel, tin, magnesium carbonate or the like can be used as the reflecting surface (20a). Among them, a reflecting surface (20a) containing silver, gold, and aluminum is preferred. The reflecting surface (20a) may be a surface of a single body composed of the above materials, and may be a surface of a film formed of the materials. Examples of the film include a sintered surface for plating, film printing, and a sputtering vapor deposition surface.
且，發熱板體(10)與反射板體(20)，係藉由支 柱(30)連接並固定。支柱(30)係插通於固定配設在發熱板體(10)之背面(1b)側之大致四個角落的治具(35)。該支柱(30)通常為螺絲構造，並螺合固定於治具(35)內。 Moreover, the heating plate body (10) and the reflecting plate body (20) are supported by The column (30) is connected and fixed. The pillars (30) are inserted into the jig (35) fixed to substantially four corners of the back surface (1b) side of the heat generating plate body (10). The post (30) is usually of a screw construction and is screwed and fixed in the jig (35).
此外，反射板體(20)，在該大致四個角落之對 應各個支柱(30)的位置具有貫通孔(39)。支柱(30)，係插通於反射板體(20)的貫通孔(39)，且因應必要可在支柱(30)的上端側使用螺帽等來固定反射板體(20)。 In addition, the reflector body (20) is in the pair of substantially four corners A through hole (39) is provided at the position of each of the pillars (30). The pillar (30) is inserted into the through hole (39) of the reflector body (20), and if necessary, the reflector body (20) can be fixed by using a nut or the like on the upper end side of the pillar (30).
本加熱裝置(1)，特別是在減壓下利用的情 況，可顯著地發揮此構造所造成的效果。亦即，相較於大氣壓下，熱在減壓下的對流傳導較小。因此，相較於大氣壓下，可更顯著地進行控制紅外線所致之熱控制。例如，反射板體(20)藉由具有反射面(20a)而減輕朝其背面(1b)側之熱放射的作用，於減壓下可得到更進一步的效果。亦即，可有效地抑制朝反射板體(20)之背面(1b)側的熱散離(未被利用於加熱被加熱物之熱的損失)。 The heating device (1), especially under reduced pressure In this case, the effect of this configuration can be significantly exerted. That is, the convective conduction of heat under reduced pressure is small compared to atmospheric pressure. Therefore, the thermal control by the infrared ray can be more significantly performed than at atmospheric pressure. For example, the reflecting plate body (20) has a function of reducing the heat radiation toward the back surface (1b) side by having the reflecting surface (20a), and further effects can be obtained under reduced pressure. That is, heat dissipation to the side of the back surface (1b) of the reflecting plate body (20) (which is not utilized for heat loss by heating the object to be heated) can be effectively suppressed.
〈實施例2〉 <Example 2>
以下，針對關於實施例2的加熱裝置(參照圖3)進行說明，但是關於與上述實施例1之加熱裝置大致相同的構成部位，係標記相同的符號並省略其詳細說明。 In the following, the heating device (see FIG. 3) of the second embodiment will be described. However, the same components as those of the heating device of the first embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted.
實施例2的加熱裝置(1)(參照圖3)，其支柱(30)的位置與實施例1的加熱裝置(1)有所不同。實施例1的加熱裝置(1)中，係構成為在大致四個角落具備共四根的支柱(30)，相較之下，實施例2的加熱裝置(1)，係在發熱板體(10)的中央附近具備兩根支柱(30)。相較於以支柱支撐四角的構造(實施例1)，支撐發熱板體(10)之中央附近的構造(實施例2)在發熱板體(10)因加熱而反曲的 時候，可緩和其應力。亦即，在支撐發熱板體(10)之中央附近的構造(實施例2)中，可有效地解放藉由固定在反射板體(20)而於發熱板體(10)自身所積蓄之歪曲。尤其，發熱板體(10)係在基板(11)的一面側具備電阻加熱絲(12)。 此外，可具備前述之絕緣被膜及抗氧化被膜等。因此，發熱板體(10)會有內外比熱相異的情況，相較於反射板體(20)，發熱板體(10)因昇溫導致之歪曲較大。因此，支撐發熱板體(10)之中央附近的構造(實施例2)，對於解放發熱板體(10)的歪曲為有效。 In the heating device (1) of the second embodiment (see Fig. 3), the position of the pillar (30) is different from that of the heating device (1) of the first embodiment. In the heating device (1) of the first embodiment, four pillars (30) are provided in substantially four corners, and the heating device (1) of the second embodiment is attached to the heat generating panel ( There are two pillars (30) near the center of 10). Compared with the structure in which the four corners are supported by the pillars (Example 1), the structure near the center of the supporting heat-generating plate body (10) (Example 2) is recurved by the heating plate body (10) due to heating. At the time, the stress can be alleviated. That is, in the structure (Example 2) in the vicinity of the center of the supporting heat generating plate body (10), the distortion accumulated by the heat generating plate body (10) itself fixed to the reflecting plate body (20) can be effectively liberated. . In particular, the heat generating plate body (10) is provided with a resistance heating wire (12) on one surface side of the substrate (11). Further, the insulating film, the oxidation resistant film, and the like described above may be provided. Therefore, the heat generating plate body (10) may be different from the heat inside and outside, and the heat generating plate body (10) has a large distortion due to the temperature rise as compared with the reflecting plate body (20). Therefore, the structure (Example 2) supporting the vicinity of the center of the heat generating plate body (10) is effective for smashing the heat generating plate body (10).
在實施例2中，支柱(30)以四根以下為佳，亦 可為三根，亦可為兩根，亦可為一根。且，在實施例2中，支柱(30)係配置在發熱板體(10)之重心位置起算的既定距離內較佳。此外，將發熱板體(10)全體面積作為100%時，支柱(30)係配置在相當於95%以下(較佳為60~80%，更佳為15~60%)之面積的中央圓內較佳。 In the second embodiment, the pillars (30) are preferably four or less, and It can be three, two or one. Further, in the second embodiment, it is preferable that the pillars (30) are disposed within a predetermined distance from the center of gravity of the heat generating plate body (10). Further, when the entire area of the heat generating plate body (10) is 100%, the pillars (30) are arranged in a central circle having an area corresponding to 95% or less (preferably 60 to 80%, more preferably 15 to 60%). It is better inside.
此外，支柱(30)對發熱板體(10)之接地面積(治具35的底面積)的合計量，在將發熱板體(10)全體面積作為100%時，以2%以下(較佳為0.2~1%，更佳為0.3~0.7%)較佳。 Further, the total amount of the ground contact area (the bottom area of the jig 35) of the pillar (30) to the heat generating plate body (10) is 2% or less when the total area of the heat generating plate body (10) is 100% (preferably). It is preferably 0.2 to 1%, more preferably 0.3 to 0.7%.
且，在圖3的型態中，兩根的支柱(30)對發熱板體(10)之接地面積的合計量以大致0.5%較佳(圖1的型態為大致1%較佳)。且，兩根的支柱(30)，在將發熱板體(10)全體面積作為100%時，以配置在相當於大致20%之面積的中央圓內較佳。 Further, in the form of Fig. 3, the total amount of the ground contact areas of the two pillars (30) to the heat generating plate body (10) is preferably about 0.5% (the shape of Fig. 1 is preferably about 1%). Further, when the total area of the heat generating plate body (10) is 100%, the two pillars (30) are preferably arranged in a center circle having an area corresponding to approximately 20%.
〈實施例3〉 <Example 3>
以下，針對關於實施例3的加熱裝置進行說明，但是關於與上述實施例1及2之加熱裝置大致相同的構成部位，係標記相同的符號並省略其詳細說明。 In the following, the heating device of the third embodiment will be described. However, the same components as those of the heating devices of the first and second embodiments are denoted by the same reference numerals, and the detailed description thereof will be omitted.
實施例3的加熱裝置(1)(參照圖4)，其反 射板體(20)(參照圖5)的構造與實施例1的加熱裝置(1)有所不同。 The heating device (1) of the third embodiment (refer to FIG. 4) is reversed The structure of the plate body (20) (refer to FIG. 5) is different from that of the heating device (1) of the first embodiment.
亦即，實施例3之加熱裝置(1)的反射板體(20)(參照圖5)，係具有：配置在發熱板體(10)之側的前板部(21)、位於比前板部(21)更靠背面(1b)側而構成的後板部(22)、及連接前板部(21)及後板部(22)的側壁部(23)。此外，於側壁部(23)具有可將對發板體(10)供給電力用的電源線(55)(參照圖4)予以配線的切口或貫通口(24)。此外，於實施例3的加熱裝置(1)中，反射板體(20)在其背面(1b)側具備與電阻加熱絲(12)電性連接的連接端子(56)。更具體而言，連接端子(56)係配設於前板部(21)。然後，電阻加熱絲(12)係透過設在發熱板體(10)的供電用構造體(50)而藉由電源線(55)與連接端子(56)電性連接。 That is, the reflecting plate body (20) (see Fig. 5) of the heating device (1) of the third embodiment has a front plate portion (21) disposed on the side of the heat generating plate body (10), and is located at a front plate The rear plate portion (22) formed on the side of the backrest surface (1b) and the side wall portion (23) connecting the front plate portion (21) and the rear plate portion (22). Further, the side wall portion (23) has a slit or a through hole (24) through which a power source wire (55) (see FIG. 4) for supplying electric power to the hair plate body (10) can be wired. Further, in the heating device (1) of the third embodiment, the reflecting plate body (20) is provided with a connection terminal (56) electrically connected to the resistance heating wire (12) on the side of the back surface (1b). More specifically, the connection terminal (56) is disposed on the front plate portion (21). Then, the resistance heating wire (12) is electrically connected to the connection terminal (56) through the power supply line (55) through the power supply structure (50) provided in the heat generating plate body (10).
且，前板部(21)與後板部(22)，可在例如5~60mm(較佳為10~30mm，更佳為15~20mm)的範圍分離。 Further, the front plate portion (21) and the rear plate portion (22) may be separated in a range of, for example, 5 to 60 mm (preferably 10 to 30 mm, more preferably 15 to 20 mm).
如上述般，將電源線(55)往反射板體(20)之背面(1b)側導出的情形，係如圖6所示般，可將加熱裝置(1)彼此組合配置。亦即，可組合加熱裝置(1)來得到所希望 的發熱面積。 As described above, when the power supply line (55) is led to the back side (1b) side of the reflecting plate body (20), as shown in Fig. 6, the heating devices (1) can be arranged in combination with each other. That is, the heating device (1) can be combined to obtain the desired The area of the heat.
此外，反射板體(20)，在側壁部(23)具備切口或貫通孔(24)，因此在發熱板體(10)的背面(1b)側之與發熱板體(10)平行的面不具有開口部。藉此，可防止紅外線朝反射板體(20)的背面(1b)側脫離，可有效率地進行紅外線反射。亦即，可成為熱效率良好且省能源的加熱裝置(1)。 Further, since the reflecting plate body (20) is provided with the slit or the through hole (24) in the side wall portion (23), the surface parallel to the heat generating plate body (10) on the back surface (1b) side of the heat generating plate body (10) is not It has an opening. Thereby, it is possible to prevent the infrared rays from being detached toward the back surface (1b) side of the reflection plate body (20), and it is possible to efficiently perform infrared reflection. That is, it can be a heating device (1) which is thermally efficient and energy-saving.
〈實施例4〉 <Example 4>
以下，針對關於實施例4的加熱裝置進行說明，但是關於與上述實施例1~3之加熱裝置大致相同的構成部位，係標記相同的符號並省略其詳細說明。 In the following, the heating device of the fourth embodiment will be described. However, the same components as those of the heating devices of the above-described first to third embodiments are denoted by the same reference numerals, and detailed description thereof will be omitted.
實施例4的加熱裝置(1)(參照圖7~10)與實施例1的加熱裝置(1)的不同點為，其反射板體(20)係透過磁力排斥部而維持對發熱板體(10)的位置。 The heating device (1) of the fourth embodiment (see FIGS. 7 to 10) is different from the heating device (1) of the first embodiment in that the reflecting plate body (20) is passed through the magnetic repulsion portion to maintain the heat generating plate body ( 10) The location.
亦即，實施例4的加熱裝置(1)，具有固定於發熱板體(10)且貫穿反射板體(20)並朝反射板體(20)之背面(1b)側突出的第一支柱(31)。然後，第一支柱(31)係具有被自身插通固定之相對的兩個鍔型磁鐵(42a及42b)。且，鍔型磁鐵(42a)係相對於鍔型磁鐵(42b)而位於前面(1a)側(參照圖7及圖8)。 That is, the heating device (1) of the fourth embodiment has a first pillar that is fixed to the heat generating plate body (10) and penetrates the reflecting plate body (20) and protrudes toward the back surface (1b) side of the reflecting plate body (20) ( 31). Then, the first pillar (31) has two opposing 锷-shaped magnets (42a and 42b) that are inserted and fixed by themselves. Further, the 锷-shaped magnet (42a) is located on the front side (1a) side with respect to the 锷-type magnet (42b) (see FIGS. 7 and 8).
此外，反射板體(20)係具有內徑比第一支柱(31)之外徑還大的貫通孔(25)。然後第一支柱(31)係插通於貫通孔(25)(參照圖7及圖8)。 Further, the reflecting plate body (20) has a through hole (25) having an inner diameter larger than the outer diameter of the first pillar (31). Then, the first pillar (31) is inserted into the through hole (25) (see FIGS. 7 and 8).
且，反射板體(20)，係在成為貫通孔(25)之其周緣部 的內外分別具備環狀磁鐵(41a及41b)。且，環狀磁鐵(41a)係相對於環狀磁鐵(41b)而位於前面(1a)側(參照圖7及圖8)。 Further, the reflecting plate body (20) is formed on the peripheral portion of the through hole (25). The inner and outer portions are respectively provided with ring magnets (41a and 41b). Further, the ring magnet (41a) is located on the front side (1a) side with respect to the ring magnet (41b) (see FIGS. 7 and 8).
此外，兩個環狀磁鐵(41a及41b)，係配置成 介在於兩個鍔型磁鐵(42a及42b)之間。然後，將各磁鐵的磁極配置成使鍔型磁鐵(42a及42b)與環狀磁鐵(41a及41b)各自磁性相斥而不會接觸。 In addition, the two ring magnets (41a and 41b) are configured to Between the two 锷-type magnets (42a and 42b). Then, the magnetic poles of the respective magnets are arranged such that the neodymium magnets (42a and 42b) and the ring magnets (41a and 41b) are magnetically repelled without contact.
亦即，例如將鍔型磁鐵(42b)的前面(1a)側設為N極，進一步，將環狀磁鐵(41b)的背面(1b)側設為N極。且，將環狀磁鐵(41a)的前面(1a)側設為N極，進一步，將鍔型磁鐵(42a)的背面(1b)側設為N極。藉由進行上述的磁極配置，可使反射板體(20)藉由互相的磁力排斥而不會接觸第一支柱(31)，並維持著從發熱板體(10)浮上的狀態。亦即，將來自發熱板體(10)之透過第一支柱(31)所傳導的熱予以遮斷，可有效地抑制反射板體(20)的溫度上升。 In other words, for example, the front side (1a) side of the 锷-shaped magnet (42b) is set to the N pole, and the back side (1b) side of the annular magnet (41b) is set to the N pole. Further, the front side (1a) side of the ring magnet (41a) is set to the N pole, and the back side (1b) side of the 锷 type magnet (42a) is set to the N pole. By performing the above-described magnetic pole arrangement, the reflecting plate body (20) can be repelled by mutual magnetic force without contacting the first pillar (31), and the state of floating from the heat generating plate body (10) can be maintained. That is, the heat transmitted from the heat generating plate body (10) through the first leg (31) is blocked, and the temperature rise of the reflecting plate body (20) can be effectively suppressed.
且，當然也能將鍔型磁鐵(42b)的前面(1a)側 設為S極，進一步，將環狀磁鐵(41b)的背面(1b)側設為S極。且，將環狀磁鐵(41a)的前面(1a)側設為S極，進一步，將鍔型磁鐵(42a)的背面(1b)側設為S極。此種磁極配置亦可獲得上述效果。 And, of course, the front side (1a) side of the 锷-type magnet (42b) can also be used. The S pole is set, and the back side (1b) side of the ring magnet (41b) is set to the S pole. Further, the front side (1a) side of the ring magnet (41a) is referred to as an S pole, and the back side (1b) side of the 锷 type magnet (42a) is referred to as an S pole. Such a magnetic pole configuration can also achieve the above effects.
且，如圖7及圖8所示般，鍔型磁鐵(42b)係 在該背面(1b)側，被第一支柱(31)所插通且藉由螺合的螺帽(49b)所固定。同樣地，鍔型磁鐵(42a)係在該前面(1a)側，被第一支柱(31)所插通且藉由螺合的螺帽(49a)所固 定。 Further, as shown in FIGS. 7 and 8, the 锷-type magnet (42b) is On the side of the back surface (1b), it is inserted by the first pillar (31) and fixed by a screw nut (49b). Similarly, the 锷-type magnet (42a) is attached to the front (1a) side, inserted by the first struts (31) and secured by a screwed nut (49a). set.
此外，環狀磁鐵(41a)及環狀磁鐵(41b)，可由各種方法固定，可接著固定在反射板體(20)之貫通孔(25)的周緣部。此時，可使用例如耐熱水泥、硬釬焊等。 Further, the ring magnet (41a) and the ring magnet (41b) can be fixed by various methods, and can be fixed to the peripheral portion of the through hole (25) of the reflector body (20). At this time, for example, heat resistant cement, brazing, or the like can be used.
且，作為上述磁力排斥部，包含：上述兩個的鍔型磁鐵(42a及42b)、及上述兩個的環狀磁鐵(41a及41b)。 Further, the magnetic repulsion portion includes the above two neodymium magnets (42a and 42b) and the above two annular magnets (41a and 41b).
另一方面，實施例4之加熱裝置(1)，具有固 定於發熱板體(10)且貫穿反射板體(20)並朝反射板體(20)之背面側突出的第二支柱(32)。然後，第二支柱(32)具有螺合於自身的螺帽(45)(參照圖7及圖9)。 On the other hand, the heating device (1) of the embodiment 4 has a solid A second pillar (32) that is defined by the heat generating plate body (10) and that penetrates the reflecting plate body (20) and protrudes toward the back side of the reflecting plate body (20). Then, the second pillar (32) has a nut (45) screwed to itself (refer to FIGS. 7 and 9).
此外，螺帽(45)，係於其外周具備均等地配置之至少三個的螺帽側磁鐵(431、432及433)(參照圖7及圖9)。 Further, the nut (45) is provided with at least three nut side magnets (431, 432, and 433) that are evenly disposed on the outer circumference (see FIGS. 7 and 9).
然後，反射板體(20)，係具有內徑比第二支柱(32)之外徑還大且插通有第二支柱(32)的貫通孔(26)(參照圖7及圖9)。 Then, the reflector body (20) has a through hole (26) having an inner diameter larger than the outer diameter of the second pillar (32) and having the second pillar (32) inserted therein (see FIGS. 7 and 9).
此外，反射板體(20)，係在成為貫通孔(26)之 其周緣部的內外之至少其中一邊的表面上，具備配置成與至少三個的螺帽側磁鐵(431、432及433)之磁力各自相斥之至少三個的反射板體側磁鐵(441、442及443)(參照圖7及圖9)。 Further, the reflecting plate body (20) is formed as a through hole (26). The surface of at least one of the inner and outer sides of the peripheral portion includes at least three reflective plate-side magnets (441, each of which is disposed to repel each other with magnetic forces of at least three nut-side magnets (431, 432, and 433). 442 and 443) (refer to Figures 7 and 9).
且，作為上述磁力排斥部，包含：至少三個的螺帽側磁鐵(431、432及433)、及至少三個的反射板體側磁鐵(441、442及443)。 Further, the magnetic repulsion portion includes at least three nut side magnets (431, 432, and 433) and at least three reflecting plate side magnets (441, 442, and 443).
亦即，例如在螺帽側磁鐵(431、432及433)的 端面之中，將對應於反射板體側磁鐵(441、442及443)的端面設為N極，進一步，在反射板體側磁鐵(441、442及443)的端面之中，將對應於螺帽側磁鐵(431、432及433)的端面設為N極。藉由進行上述的磁極配置，可使反射板體(20)藉由互相的磁力排斥而不會接觸第二支柱(32)，並維持著從發熱板體(10)浮上的狀態。亦即，將來自發熱板體(10)之透過第二支柱(32)所傳導的熱予以遮斷，可有效地抑制反射板體(20)的溫度上升。 That is, for example, on the nut side magnets (431, 432, and 433) Among the end faces, the end faces corresponding to the reflector body side magnets (441, 442, and 443) are N poles, and further, the end faces of the reflector body side magnets (441, 442, and 443) correspond to the snails. The end faces of the cap side magnets (431, 432, and 433) are N poles. By performing the above-described magnetic pole arrangement, the reflecting plate body (20) can be repelled by mutual magnetic force without contacting the second pillar (32), and the state of floating from the heat generating plate body (10) can be maintained. That is, the heat transmitted from the heat generating plate body (10) through the second leg (32) is blocked, and the temperature rise of the reflecting plate body (20) can be effectively suppressed.
且，當然也能在螺帽側磁鐵(431、432及433) 的端面之中，將對應於反射板體側磁鐵(441、442及443)的端面設為S極，進一步，在反射板體側磁鐵(441、442及443)的端面之中，將對應於螺帽側磁鐵(431、432及433)的端面設為S極。此種磁極配置亦可獲得上述效果。 And, of course, can also be on the nut side magnets (431, 432, and 433) Among the end faces, the end faces corresponding to the reflector body side magnets (441, 442, and 443) are S poles, and further, the end faces of the reflector body side magnets (441, 442, and 443) correspond to The end faces of the nut side magnets (431, 432, and 433) are set to the S pole. Such a magnetic pole configuration can also achieve the above effects.
且，螺帽側磁鐵(431、432及433)可各自接著固定在螺帽(45)的側面。此時，可利用例如耐熱水泥、硬釬焊等。同樣地，反射板體側磁鐵(441、442及443)可各自接著固定在反射板體(20)之背面(1b)的表面。此時，可利用例如耐熱水泥、硬釬焊等。 Further, the nut side magnets (431, 432, and 433) may be respectively fixed to the side faces of the nut (45). At this time, for example, heat resistant cement, brazing, or the like can be utilized. Similarly, the reflector body side magnets (441, 442, and 443) may be respectively fixed to the surface of the back surface (1b) of the reflector body (20). At this time, for example, heat resistant cement, brazing, or the like can be utilized.
此外，如前述般，利用圖8所示之磁鐵及該 配置，可使發熱板體(10)與反射板體(20)分離成兩者間沒有熱傳導部位。進一步，利用圖9所示之磁鐵及該配置，可固定發熱板體(10)與反射板體(20)的位置。亦即，可藉由圖8所示之磁鐵及該配置，來固定發熱板體(10)與反射 板體(20)之間在Z軸方向的位置關係。此外，可藉由圖9所示之磁鐵及該配置，來固定發熱板體(10)與反射板體(20)之間在X軸及Y軸方向的位置關係。如上述般，將圖8所示之磁鐵及該配置、及圖9所示之磁鐵及該配置，予以各自併用較佳。且，在併用該等的情況，係如圖10所示般，互相在對角分別配置兩個較佳。 Further, as described above, the magnet shown in FIG. 8 and the magnet are used. The arrangement can separate the heating plate body (10) from the reflecting plate body (20) so that there is no heat conduction portion therebetween. Further, the position of the heat generating plate body (10) and the reflecting plate body (20) can be fixed by the magnet shown in Fig. 9 and the arrangement. That is, the heat generating plate body (10) and the reflection can be fixed by the magnet shown in FIG. 8 and the configuration. The positional relationship between the plates (20) in the Z-axis direction. Further, the positional relationship between the heat generating plate body (10) and the reflecting plate body (20) in the X-axis and Y-axis directions can be fixed by the magnet shown in Fig. 9 and the arrangement. As described above, the magnet shown in Fig. 8 and the arrangement, the magnet shown in Fig. 9, and the arrangement are preferably used in combination. Further, in the case where these are used in combination, as shown in Fig. 10, it is preferable to arrange two diagonally opposite each other.
且，本發明並不限定於上述實施例，可為因 應目的、用途而在本發明的範圍內進行各種變更的實施例。 Moreover, the present invention is not limited to the above embodiment, and may be a cause Various modifications are possible within the scope of the invention in accordance with the purpose and the application.
亦即，於實施例1~4中，可具有用來將發熱 板體(10)與反射板體(20)維持成分離狀態的支柱(30)。此時，支柱(30)可為含有介在於發熱板體(10)與反射板體(20)之間的陶瓷製間隔件(36)之型態(參照圖13)。藉由將陶瓷製之間隔件(36)介於其中，可抑制熱傳導速度。亦即，與僅由金屬來構成支柱(30)的情況相比，可抑制從發熱板體(10)透過支柱(30)對反射板體(20)所傳導之熱傳導的速度。換言之，可說是使發熱板體(10)與反射板體(20)之間成為熱絕緣。 That is, in Examples 1 to 4, it may have a function for heating The plate body (10) and the reflecting plate body (20) are maintained in a separated state (30). At this time, the pillar (30) may be in the form of a ceramic spacer (36) interposed between the heat generating plate body (10) and the reflecting plate body (20) (see FIG. 13). The heat transfer rate can be suppressed by interposing a ceramic spacer (36) therein. That is, the speed of heat conduction from the heat generating plate body (10) to the reflecting plate body (20) through the pillars (30) can be suppressed as compared with the case where the pillars (30) are formed only of metal. In other words, it can be said that the heat generating plate body (10) and the reflecting plate body (20) are thermally insulated.
且，為含有間隔件(36)之型態時，圖13所示 之支柱(30)，可具備：固定於發熱板體(10)之基板(11)上的治具(35、螺柱)、介在於發熱板體(10)與反射板體(20)之間的陶瓷製間隔件(36)、支柱頭(37)、進一步還有用來將該等治具(35)、間隔件(36)及支柱頭(37)分別予以連接的接合構件(381及382)。 Moreover, when it is in the form of a spacer (36), as shown in FIG. The pillar (30) may include: a fixture (35, stud) fixed to the substrate (11) of the heat generating plate body (10), and between the heat generating plate body (10) and the reflecting plate body (20) Ceramic spacer (36), strut head (37), and further joint members (381 and 382) for connecting the jig (35), the spacer (36) and the strut head (37), respectively .
此外，圖13所示之治具(35)，可具備：能與 接合構件(381)接合的背面(1b)側固定孔(35a)。且，間隔件(36)，可具備：能與接合構件(381)接合的前面(1a)側固定孔(36a)、及能與接合構件(382)接合的背面(1b)側固定孔(36b)。此外，支柱頭(37)，可具備：能與接合構件(382)接合的前面(1a)側固定孔(37a)。 In addition, the jig (35) shown in FIG. 13 can have: The back surface (1b) side fixing hole (35a) to which the joining member (381) is joined. Further, the spacer (36) may include a front side (1a) side fixing hole (36a) engageable with the joining member (381), and a back side (1b) side fixing hole (36b) engageable with the joining member (382). ). Further, the strut head (37) may include a front (1a) side fixing hole (37a) engageable with the joint member (382).
如上述構造的支柱(30)，藉由將接合構件 (381)接合於固定孔(35b)及固定孔(36a)，可接合治具(35)及間隔件(36)。且，藉由將接合構件(382)接合於固定孔(36b)及固定孔(37a)，可接合間隔件(36)及支柱頭(37)。然後藉由該接合，可得到發熱板體(10)與反射板體(20)之間的電性絕緣。 a strut (30) constructed as described above, by joining members (381) is joined to the fixing hole (35b) and the fixing hole (36a) to engage the jig (35) and the spacer (36). Further, the spacer (36) and the pillar head (37) can be joined by joining the joint member (382) to the fixing hole (36b) and the fixing hole (37a). Then, by this bonding, electrical insulation between the heat generating plate body (10) and the reflecting plate body (20) can be obtained.
此外，可於反射板體(20)設置貫通孔(39)。然後，於貫通孔(39)內，在接合構件(382)插通之後，將反射板體(20)介在於間隔件(36)與支柱頭(37)之間，並在此狀態下，可將間隔件(36)、接合構件(382)、及支柱頭(37)予以接合。藉此，可藉由支柱(30)將反射板體(20)以上述絕緣的狀態固定。 Further, a through hole (39) may be provided in the reflecting plate body (20). Then, in the through hole (39), after the joining member (382) is inserted, the reflecting plate body (20) is interposed between the spacer (36) and the strut head (37), and in this state, The spacer (36), the joint member (382), and the strut head (37) are joined. Thereby, the reflector body (20) can be fixed in the above-described insulated state by the support post (30).
且，上述各固定孔(35b、36a、36b、37a)與接合構件(381、382)之間的接合可由各種方式進行。亦即，例如可藉由設置螺紋構造而分別予以螺合。此外，亦可在各固定孔與接合構件嵌合之後使用接著劑進行接著固定。此外，可藉由例如硬釬焊來予以接合。該等之接合型態，可單獨使用一種亦可併用兩種以上。 Further, the joining between the respective fixing holes (35b, 36a, 36b, 37a) and the joining members (381, 382) can be performed in various manners. That is, for example, it can be screwed separately by providing a thread structure. Further, it is also possible to perform subsequent fixing using an adhesive after the fixing holes are fitted to the joint member. Further, it can be joined by, for example, brazing. These joining types may be used alone or in combination of two or more.
此外，接合構件亦可對各固定孔為事先固定完畢的型態。具體來說，例如可將接合構件(381)事先固定於固定孔(35b)，並將此作為可將接合構件(381)對固定孔(36a)接合的型態來利用。同樣地，可將接合構件(382)事先固定於固定孔(36b)，並將此作為可將接合構件(382)對固定孔(37a)接合的型態來利用。 Further, the joint member may be in a form in which each of the fixing holes is fixed in advance. Specifically, for example, the joint member (381) can be fixed to the fixing hole (35b) in advance, and this can be utilized as a form in which the joint member (381) can be joined to the fixing hole (36a). Similarly, the joint member (382) can be fixed to the fixing hole (36b) in advance, and this can be utilized as a form in which the joint member (382) can be joined to the fixing hole (37a).
且，於實施例1~4中，可具有用來將發熱板 體(10)與反射板體(20)維持成分離狀態的支柱(30)。此時，支柱(30)可貫穿反射板體(20)並朝反射板體(20)的背面(1b)側突出。然後，反射板體(20)，係可沿著貫通自身的支柱(30)，朝前面(1a)側及背面(1b)側移動，可藉此成為使發熱板體(10)與反射板體(20)之離間距離可改變的加熱裝置(1)。 Moreover, in the embodiments 1 to 4, it may have a heating plate The body (10) and the reflector body (20) are maintained in a separated state (30). At this time, the pillar (30) can penetrate the reflection plate body (20) and protrude toward the back surface (1b) side of the reflection plate body (20). Then, the reflecting plate body (20) is movable toward the front surface (1a) side and the back surface (1b) side along the pillar (30) penetrating itself, whereby the heat generating plate body (10) and the reflecting plate body can be formed. (20) A heating device (1) whose distance from the distance can be changed.
如上述般，發熱板體(10)與反射板體(20)之離間距離可改變的加熱裝置(1)，在排列配置加熱裝置之際(參照圖6)，可獨立地調節各加熱器(1)的離間距離。藉此可確實地保持絕緣並提高配線的整線自由度。 As described above, the heating device (1) in which the distance between the heating plate body (10) and the reflecting plate body (20) can be changed can be independently adjusted when the heating device is arranged (see FIG. 6). 1) The distance between the two. Thereby, the insulation can be surely maintained and the degree of freedom of the entire line of the wiring can be improved.
且，在排列配置加熱器之際(參照圖6)，在個別調節各加熱裝置(1)的離間距離之際，紅外線的反射率會有因各加熱裝置(1)而變化的情況。在此情況時，藉由控制對各加熱裝置(1)之發熱板體(10)的通電，可保持發熱板體(10)之前面(1a)側之熱放射量的平衡。 Further, when the heaters are arranged and arranged (see FIG. 6), when the distance between the respective heating devices (1) is individually adjusted, the reflectance of the infrared rays may be changed by the respective heating devices (1). In this case, by controlling the energization of the heat generating plate body (10) of each heating device (1), the balance of the amount of heat radiation on the front surface (1a) side of the heat generating plate body (10) can be maintained.
此外，於實施例1~4中，可具有用來將發熱 板體(10)與反射板體(20)維持成分離狀態的支柱(30)。此 時，支柱(30)可貫穿反射板體(20)並朝反射板體(20)的背面(1b)側突出。然後，本加熱裝置(1)，可成為藉由突出於背面(1b)側的支柱(30)而固定其整體的加熱裝置(1)。 In addition, in Examples 1 to 4, it may have a function for heating The plate body (10) and the reflecting plate body (20) are maintained in a separated state (30). this At this time, the pillar (30) can penetrate the reflection plate body (20) and protrude toward the back surface (1b) side of the reflection plate body (20). Then, the heating device (1) can be a heating device (1) that is fixed to the entirety by a pillar (30) protruding from the back surface (1b) side.
如上述般，藉由突出於背面(1b)側的支柱(30)而固定其整體加熱裝置(1)，係藉由支柱(30)的散熱，來減輕從發熱板體(10)對反射板體(20)的熱傳導量，可減少反射板體(20)對其背面(1b)側放射的熱量。亦即，可抑制反射板體(20)之背面(1b)側的溫度上升。 As described above, the entire heating device (1) is fixed by the pillars (30) protruding from the back surface (1b) side, and the heat radiating from the pillars (30) is used to reduce the reflection plate from the heat generating plate body (10). The heat transfer amount of the body (20) can reduce the amount of heat radiated from the reflective plate body (20) on the back side (1b) side thereof. That is, the temperature rise on the side of the back surface (1b) of the reflecting plate body (20) can be suppressed.
且，於本加熱裝置中，發熱板體(10)的電阻加 熱絲(12)可配設在基板(11)的前面(1a)側(即熱放射側)，亦可配設在基板(11)的背面(1b)側。作為電阻加熱絲(12)配設在基板(11)之背面(1b)側的型態，可舉出圖1、圖3、圖4、圖6、圖7及圖13。另一方面，作為電阻加熱絲配設在基板(11)之前面(1a)側的型態，可舉出圖12。在該圖12所示之型態中，沒有必要從外部透過連接端子(56)(參照圖4)對電阻加熱絲(12)供給電力。亦即，在圖12所示之型態中，可直接對供電用構造體(50)供給來自外部的電力而使電阻加熱絲(12)發熱。因此，可成為更簡便的構造。 Moreover, in the heating device, the resistance of the heating plate body (10) is added The hot wire (12) may be disposed on the front side (1a) side of the substrate (11) (i.e., on the heat radiation side), or may be disposed on the back side (1b) side of the substrate (11). Examples of the shape in which the resistance heating wire (12) is disposed on the back surface (1b) side of the substrate (11) include Figs. 1, 3, 4, 6, 7, and 13. On the other hand, as a shape in which the resistance heating wire is disposed on the front surface (1a) side of the substrate (11), FIG. 12 is exemplified. In the configuration shown in Fig. 12, it is not necessary to supply electric power to the resistance heating wire (12) through the connection terminal (56) (see Fig. 4) from the outside. That is, in the configuration shown in Fig. 12, electric power from the outside can be directly supplied to the power supply structure (50), and the electric resistance heating wire (12) can be heated. Therefore, it can be a simpler structure.
[產業上的可利用性] [Industrial availability]
本發明的加熱裝置，可作為用來加熱被加熱物的技術而廣泛地利用。具體而言，可適合地利用於：半導體製造過程所使用的乾燥爐、半導體製造過程所使用的熱處理爐、平板顯示器製造過程所使用的乾燥爐、及平板 顯示器製造過程所使用的熱處理爐等。此外，在減壓(大致真空)的條件下，於重複昇溫及降溫的用途上為有用。 The heating device of the present invention can be widely used as a technique for heating an object to be heated. Specifically, it can be suitably used for: a drying furnace used in a semiconductor manufacturing process, a heat treatment furnace used in a semiconductor manufacturing process, a drying furnace used in a flat panel display manufacturing process, and a flat plate A heat treatment furnace used in the manufacturing process of the display. In addition, it is useful for repeated use of temperature rise and temperature reduction under reduced pressure (substantially vacuum) conditions.
1‧‧‧加熱裝置 1‧‧‧heating device
1a‧‧‧前面側 1a‧‧‧ front side
1b‧‧‧背面側 1b‧‧‧back side
10‧‧‧發熱板體 10‧‧‧heating plate
11‧‧‧基板 11‧‧‧Substrate
12‧‧‧電阻加熱絲 12‧‧‧Resistive heating wire
20‧‧‧反射板體 20‧‧‧Reflecting plate
20a‧‧‧反射面 20a‧‧‧reflecting surface
30‧‧‧支柱 30‧‧‧ pillar
35‧‧‧治具(固定支柱的治具、螺柱) 35‧‧‧ fixtures (fixed pillar fixtures, studs)
39‧‧‧貫通孔(用來使支柱插通的貫通孔) 39‧‧‧through holes (through holes for inserting posts)
50‧‧‧供電用構造體 50‧‧‧Power supply structure
Claims (7)
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| CN (1) | CN104380839B (en) |
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| TWI633805B (en) * | 2017-10-26 | 2018-08-21 | 財團法人工業技術研究院 | Heating film structure |
| CN110125509A (en) * | 2019-04-10 | 2019-08-16 | 浙江登新科技有限公司 | Heating structure in reflow machine |
| KR102588854B1 (en) * | 2020-02-13 | 2023-10-16 | 주식회사 아모그린텍 | Power module and manufacturing method thereof |
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| JP2004172143A (en) * | 2004-03-08 | 2004-06-17 | Ibiden Co Ltd | Hot plate unit |
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| JPS6365987U (en) * | 1986-10-20 | 1988-04-30 | ||
| JP2617064B2 (en) * | 1992-07-28 | 1997-06-04 | 日本碍子株式会社 | Semiconductor wafer heating apparatus and method of manufacturing the same |
| JP3336272B2 (en) | 1998-10-29 | 2002-10-21 | 京セラ株式会社 | Plate heating device |
| JP3798721B2 (en) * | 2002-03-29 | 2006-07-19 | 東芝セラミックス株式会社 | Reflector for heat treatment of semiconductor and method of manufacturing reflector for heat treatment of semiconductor |
| US7147359B2 (en) * | 2004-06-25 | 2006-12-12 | Applied Materials, Inc. | Lamp assembly having flexibly positioned rigid plug |
| JP5524560B2 (en) * | 2009-10-01 | 2014-06-18 | 株式会社ブリヂストン | Heater unit reflector and heater unit provided with the reflector |
| KR101146587B1 (en) | 2011-08-29 | 2012-05-18 | 강성철 | Heat radiating apparatus and heating apparatus having the same |
-
2014
- 2014-02-07 KR KR1020147036090A patent/KR102037081B1/en active IP Right Grant
- 2014-02-07 JP JP2015501390A patent/JP6322186B2/en active Active
- 2014-02-07 WO PCT/JP2014/052966 patent/WO2014129331A1/en active Application Filing
- 2014-02-07 CN CN201480001580.4A patent/CN104380839B/en active Active
- 2014-02-14 TW TW103104887A patent/TWI596978B/en active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004172143A (en) * | 2004-03-08 | 2004-06-17 | Ibiden Co Ltd | Hot plate unit |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014129331A1 (en) | 2014-08-28 |
| CN104380839A (en) | 2015-02-25 |
| JPWO2014129331A1 (en) | 2017-02-02 |
| JP6322186B2 (en) | 2018-05-09 |
| KR20150121647A (en) | 2015-10-29 |
| TW201505477A (en) | 2015-02-01 |
| CN104380839B (en) | 2016-12-28 |
| KR102037081B1 (en) | 2019-10-29 |
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