TWI595208B - Two-material vapor chamber and upper housing thereof - Google Patents
Two-material vapor chamber and upper housing thereof Download PDFInfo
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- TWI595208B TWI595208B TW105102848A TW105102848A TWI595208B TW I595208 B TWI595208 B TW I595208B TW 105102848 A TW105102848 A TW 105102848A TW 105102848 A TW105102848 A TW 105102848A TW I595208 B TWI595208 B TW I595208B
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Description
本發明係有關一種均溫板，尤指一種用於電子發熱源的雙材質均溫板及其上殼構件。 The invention relates to a temperature equalizing plate, in particular to a double material uniform temperature plate for an electronic heat source and an upper shell member thereof.
隨著電子元件的運算速度不斷提昇，其所產生的熱量亦越來越高，為了有效地解決此高發熱量的問題，業界已將具有良好導熱特性的均溫板(Vapor Chamber)進行廣泛性的使用，但是此等均溫板不論是其導熱效能、製作成本和製作容易度等皆存在有尚待加以改善的空間。 As the computing speed of electronic components continues to increase, the heat generated by them is becoming higher and higher. In order to effectively solve this problem of high heat generation, the Vapor Chamber with good thermal conductivity has been widely used in the industry. Use, but these homogenizing plates have room for improvement, such as their thermal conductivity, production cost and ease of fabrication.
習知的均溫板，主要包括一上殼體和一下殼體，其中上殼體和下殼體皆以銅材質所製，並在上殼體和下殼體的內部空間分別裝設有毛細組織，其後再將上殼體和下殼體對應焊合，再將工作流體填入上殼體和下殼體內部，最後施以除氣封口等製程而完成。 The conventional temperature equalizing plate mainly comprises an upper casing and a lower casing, wherein the upper casing and the lower casing are made of copper material, and the capillary is respectively installed in the inner spaces of the upper casing and the lower casing. The structure is followed by welding the upper casing and the lower casing correspondingly, filling the working fluid into the upper casing and the lower casing, and finally performing the process of degassing sealing and the like.
然而，習知的均溫板，雖然具有導熱效能，但在實際的使用上卻存在以下的問題點，由於上殼體和下殼體皆以銅材質所製，不僅造成整體的總重量笨重，且銅質的材料成本又是鋁質的材料成本多數倍以上，使其產品的造價一直無法被有效的降低，亟待加以改善者。 However, the conventional temperature equalizing plate, although having thermal conductivity, has the following problems in practical use. Since both the upper and lower casings are made of copper, not only the overall weight is bulky, Moreover, the cost of copper material is more than double the cost of aluminum material, so that the cost of its products has not been effectively reduced, and it needs to be improved.
本發明之一目的，在於提供一種雙材質均溫板及其上殼構件，其是可減輕整體的總重量及材料成本，並且能夠簡化上殼構件和銅質下殼體的封裝結合。 An object of the present invention is to provide a double-material temperature equalizing plate and an upper casing member thereof, which can reduce the overall weight and material cost, and can simplify the package bonding of the upper casing member and the copper lower casing.
為了達成上述之目的，本發明係提供一種雙材質均溫板，包括一上殼構件、一銅質下殼體及一工作流體，該上殼構件包括一鋁基板及多數鋁鰭片，該鋁基板具有一外表面和形成在該外表面背側的一內壁面，各該鋁鰭片自該外表面延伸且一體成型，在該內壁面披覆有一銅鍍層；該銅質下殼體對應該上殼構件封合，並於該上殼構件和該銅質下殼體之間圍設有一腔室；該工作流體填注在該腔室內。 In order to achieve the above object, the present invention provides a double-material temperature equalizing plate comprising an upper casing member, a copper lower casing and a working fluid, the upper casing member comprising an aluminum substrate and a plurality of aluminum fins, the aluminum The substrate has an outer surface and an inner wall surface formed on a back side of the outer surface, each of the aluminum fins extending from the outer surface and integrally formed, and the inner wall surface is covered with a copper plating layer; the copper lower shell corresponds to The upper casing member is sealed, and a chamber is enclosed between the upper casing member and the copper lower casing; the working fluid is filled in the chamber.
為了達成上述之目的，本發明係提供一種雙材質均溫板的上殼構件，其包括一鋁基板及多數鋁鰭片，該鋁基板具有一外表面和形成在該外表面背側的一內壁面，各該鋁鰭片自該外表面延伸且一體成型，在該內壁面披覆有一銅鍍層。 In order to achieve the above object, the present invention provides an upper casing member of a double-material temperature equalizing plate, comprising an aluminum substrate and a plurality of aluminum fins, the aluminum substrate having an outer surface and an inner side formed on the back side of the outer surface The wall surface, each of the aluminum fins extends from the outer surface and is integrally formed, and a copper plating layer is coated on the inner wall surface.
本發明還具有以下功效，利用銅鍍層的疏水性佳的特性，進而能夠達成內部工作流體的良好循環效果。藉由鎳鍍層的設置，可提昇銅鍍層吸附在內壁面的附著力。由於流體停滯結構能夠破壞水分子的內聚力，因此冷凝而附著在流體停滯結構的各水分子是不產生聚集流動，如此可使各水分子可全面性地的滴落於下殼體的受熱部上。 The present invention also has the following effects, and utilizes the excellent hydrophobic property of the copper plating layer, thereby achieving a good circulation effect of the internal working fluid. By the arrangement of the nickel plating layer, the adhesion of the copper plating layer to the inner wall surface can be improved. Since the fluid stagnant structure can damage the cohesive force of the water molecules, the water molecules that are condensed and adhere to the fluid stagnant structure do not generate aggregate flow, so that the water molecules can be completely dripped on the heat receiving portion of the lower casing. .
10‧‧‧上殼構件 10‧‧‧Upper casing components
11‧‧‧鋁基板 11‧‧‧Aluminum substrate
111‧‧‧外表面 111‧‧‧ outer surface
112‧‧‧內壁面 112‧‧‧ inner wall
113‧‧‧流體停滯結構 113‧‧‧ Fluid stagnation structure
114‧‧‧上結合段 114‧‧‧Upper joint
12‧‧‧鋁鰭片 12‧‧‧Aluminum fins
13‧‧‧銅鍍層 13‧‧‧copper plating
14‧‧‧鎳鍍層 14‧‧‧ Nickel plating
20‧‧‧銅質下殼體 20‧‧‧Bronze lower casing
21‧‧‧底板 21‧‧‧floor
22‧‧‧下圍板 22‧‧‧Down board
23‧‧‧下結合段 23‧‧‧Under the junction
30‧‧‧工作流體 30‧‧‧Working fluid
40‧‧‧毛細組織 40‧‧‧Muscle tissue
A‧‧‧腔室 A‧‧‧室
圖1係本發明之上殼構件剖視圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view showing a top member of the present invention.
圖2係圖1之銅鍍層披覆於上殼構件剖視圖。 2 is a cross-sectional view showing the copper plating layer of FIG. 1 coated on the upper casing member.
圖3係本發明雙材質均溫板分解剖視圖。 Figure 3 is an exploded cross-sectional view of the double-material isothermal plate of the present invention.
圖4係本發明雙材質均溫板組合剖視圖。 Figure 4 is a cross-sectional view showing the combination of the two-material temperature equalizing plate of the present invention.
圖5係本發明雙材質均溫板組合外觀圖。 Fig. 5 is a perspective view showing the combination of the double material uniform temperature plate of the present invention.
圖6係本發明雙材質均溫板使用狀態局部放大剖視圖。 Fig. 6 is a partially enlarged cross-sectional view showing the state of use of the double-material temperature equalizing plate of the present invention.
圖7係本發明之上殼構件另一實施例剖視圖。 Figure 7 is a cross-sectional view showing another embodiment of the upper casing member of the present invention.
有關本發明之詳細說明及技術內容，配合圖式說明如下，然而所附圖式僅提供參考與說明用，並非用來對本發明加以限制者。 The detailed description and technical content of the present invention are set forth in the accompanying drawings.
請參閱圖1至圖5所示，本發明提供一種雙材質均溫板及其上殼構件，其中雙材質均溫板(Vapor Chamber)主要包括一上殼構件10、一銅質下殼體20及一工作流體30。 Referring to FIG. 1 to FIG. 5 , the present invention provides a double-material temperature equalizing plate and an upper casing member thereof, wherein the Vapor Chamber mainly includes an upper casing member 10 and a copper lower casing 20 . And a working fluid 30.
上殼構件10為鋁或其合金所製成，其主要包括一鋁基板11及多數鋁鰭片12，鋁基板11大致呈一矩形體，其具有一外表面111和形成在外表面111背側的一內壁面112，在內壁面112可以電鍍方式披覆一銅鍍層13。各鋁鰭片12自外表面111延伸且一體成型，其中各鋁鰭片12可以擠製或剷削等加工方式來間隔形成。 The upper case member 10 is made of aluminum or an alloy thereof, and mainly includes an aluminum substrate 11 and a plurality of aluminum fins 12. The aluminum substrate 11 has a substantially rectangular shape and has an outer surface 111 and a back surface formed on the outer surface 111. An inner wall surface 112, the inner wall surface 112 can be plated with a copper plating layer 13. Each of the aluminum fins 12 extends from the outer surface 111 and is integrally formed, wherein each of the aluminum fins 12 can be formed at intervals by processing such as extrusion or shovel.
進一步，在內壁面112可以機械加工等方式來全面性成形出一流體停滯結構113，其中的機械加工可為噴砂或壓花，而流體停滯結構113即是由多數凹凸點所構成的一粗糙面，其表面粗度值介於Ra0.01~10(mm)之間，其中表 面粗度值以Ra0.05~3(mm)為優選，此表面粗度值小於Ra0.01(mm)時，並無法有效的防止內部的工作流體30於冷凝後的流動和匯聚，另當表面粗度值大於Ra10(mm)以上時，因為總體的高度太高因而不適用於電子元件的使用需求。又，在流體停滯結構113的外周圍區域形成有一上結合段114，前述銅鍍層披覆在上結合段114上，藉以提昇焊接性。 Further, the inner wall surface 112 can be integrally formed into a fluid stagnation structure 113 by mechanical processing or the like, wherein the machining can be sand blasting or embossing, and the fluid stagnation structure 113 is a rough surface composed of a plurality of concave and convex points. , the surface roughness value is between Ra0.01~10 (mm), wherein the table The surface roughness value is preferably 0.05 to 3 (mm). When the surface roughness value is less than Ra0.01 (mm), the internal working fluid 30 cannot be effectively prevented from flowing and converging after condensation. When the surface roughness value is more than Ra10 (mm) or more, since the overall height is too high, it is not suitable for the use of electronic components. Further, an upper bonding portion 114 is formed in the outer peripheral portion of the fluid stagnant structure 113, and the copper plating layer is coated on the upper bonding portion 114 to improve the solderability.
銅質下殼體20為銅或其合金所製成，其包含一底板21、自底板21周緣朝著上方彎折延伸的一下圍板22及自下圍板22周緣朝著橫向彎折延伸的一下結合段23。銅質下殼體20是對應於前述上殼構件10封合，並於上殼構件10和銅質下殼體20之間圍設有一腔室A；結合時在上結合段114和下結合段23的表面塗覆焊接劑並且相互疊接，經過加溫後而使令上殼構件10和銅質下殼體20密封結合。 The copper lower casing 20 is made of copper or an alloy thereof, and comprises a bottom plate 21, a lower shroud 22 extending from the periphery of the bottom plate 21 toward the upper side, and a laterally bent extending from the periphery of the lower shroud 22. Combine section 23 below. The lower copper shell 20 is sealed corresponding to the upper shell member 10, and a chamber A is disposed between the upper shell member 10 and the copper lower shell 20; the upper joint portion 114 and the lower joint portion 23 are combined. The surface is coated with a solder and laminated to each other, and after heating, the upper case member 10 and the copper lower case 20 are sealingly bonded.
工作流體30可為純水等液體，透過一輸液除氣管(圖未示出)將工作流體30填入腔室A內，並進行除氣、封口等加工步驟，進而完成一雙材質均溫板的製作。其中利用在鋁基板11的內壁面112披覆銅鍍層13，由於銅鍍層13的疏水性(Hydrophobicity)優於鋁質內壁面112，因此以水作為工作流體30即能夠達成良好的內部循環效果。 The working fluid 30 can be a liquid such as pure water, and the working fluid 30 is filled into the chamber A through an infusion degassing tube (not shown), and the processing steps such as degassing and sealing are performed, thereby completing a pair of material temperature equalizing plates. Production. In the case where the copper plating layer 13 is coated on the inner wall surface 112 of the aluminum substrate 11, since the water repellency of the copper plating layer 13 is superior to that of the aluminum inner wall surface 112, a good internal circulation effect can be achieved with water as the working fluid 30.
此外，本發明的均溫板更包括一毛細組織40，其可為一金屬編織網、多孔性金屬粉末燒結物或纖維束，此毛細組織40是佈設在銅質下殼體20的底板21上方。 In addition, the temperature equalizing plate of the present invention further includes a capillary structure 40, which may be a metal woven mesh, a porous metal powder sinter or a fiber bundle, the capillary structure 40 being disposed above the bottom plate 21 of the copper lower casing 20. .
參閱圖6所示，使用時是以銅質下殼體20的底板21做為受熱部，將底板21直接熱接觸於一電子發熱源(圖未示出)，其在運算時將產生熱量，此等熱量會傳遞給底板21和液態的工作流體30，液態的工作流體30受熱後將產 生蒸發而生成為氣態的工作流體30，由於鋁基板11透過各鋁鰭片12的熱散逸作用，前述氣態的工作流體30在朝向鋁基板11的內壁面112方向流動時，將附著在流體停滯結構113的銅鍍層13上，並令前述的氣態的工作流體30在接觸到各流體停滯結構113的銅鍍層13後分佈冷凝為多數水分子，由於流體停滯結構113能夠破壞水分子的內聚力，因此能夠令附著在流體停滯結構113的各水分子不產生聚集流動，如此可使各水分子可全面性地且均勻的滴落在下殼體的受熱部(即底板21)上。 Referring to FIG. 6, the bottom plate 21 of the copper lower casing 20 is used as a heat receiving portion, and the bottom plate 21 is directly in thermal contact with an electronic heat source (not shown), which generates heat during calculation. This heat is transferred to the bottom plate 21 and the liquid working fluid 30, and the liquid working fluid 30 is heated and will be produced. The working fluid 30 which is vaporized to form a gaseous state, due to the heat dissipation effect of the aluminum substrate 11 through the respective aluminum fins 12, the gaseous working fluid 30 will adhere to the fluid when it flows toward the inner wall surface 112 of the aluminum substrate 11. The copper plating layer 13 of the structure 113 is disposed, and the gaseous working fluid 30 is distributed and condensed into a plurality of water molecules after contacting the copper plating layer 13 of each fluid stagnant structure 113. Since the fluid stagnant structure 113 can destroy the cohesion of the water molecules, It is possible to prevent the respective water molecules attached to the fluid stagnant structure 113 from generating an aggregate flow, so that each water molecule can be uniformly and uniformly dripped on the heat receiving portion (i.e., the bottom plate 21) of the lower casing.
參閱圖7所示，本發明的上殼構件10除了可如上述實施例外，其更包括一鎳鍍層14，此鎳鍍層14是介於內壁面112和銅鍍層13之間，藉以提昇銅鍍層13吸附在內壁面112的附著力。 Referring to FIG. 7, the upper casing member 10 of the present invention may include, in addition to the above-described embodiment, a nickel plating layer 14 between the inner wall surface 112 and the copper plating layer 13 to enhance the adsorption of the copper plating layer 13. Adhesion on the inner wall surface 112.
綜上所述，本發明之雙材質均溫板及其上殼構件，確可達到預期之使用目的，而解決習知之缺失，又因極具新穎性及進步性，完全符合發明專利申請要件，爰依專利法提出申請，敬請詳查並賜准本案專利，以保障發明人之權利。 In summary, the double-material temperature-equalizing plate and the upper-shell member thereof of the present invention can achieve the intended use purpose, and solve the lack of conventional knowledge, and because of the novelty and the progressiveness, fully meet the requirements of the invention patent application. To file an application in accordance with the Patent Law, please check and grant the patent in this case to protect the rights of the inventor.
10‧‧‧上殼構件 10‧‧‧Upper casing components
11‧‧‧鋁基板 11‧‧‧Aluminum substrate
111‧‧‧外表面 111‧‧‧ outer surface
112‧‧‧內壁面 112‧‧‧ inner wall
113‧‧‧流體停滯結構 113‧‧‧ Fluid stagnation structure
114‧‧‧上結合段 114‧‧‧Upper joint
12‧‧‧鋁鰭片 12‧‧‧Aluminum fins
13‧‧‧銅鍍層 13‧‧‧copper plating
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105102848A TWI595208B (en) | 2016-01-29 | 2016-01-29 | Two-material vapor chamber and upper housing thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105102848A TWI595208B (en) | 2016-01-29 | 2016-01-29 | Two-material vapor chamber and upper housing thereof |
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| Publication Number | Publication Date |
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| TW201727179A TW201727179A (en) | 2017-08-01 |
| TWI595208B true TWI595208B (en) | 2017-08-11 |
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| CN110296624A (en) * | 2019-06-11 | 2019-10-01 | 深圳兴奇宏科技有限公司 | Runner type two-phase flow radiator |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002022378A (en) * | 2000-07-06 | 2002-01-23 | Showa Denko Kk | Heat pipe |
| TW201116794A (en) * | 2009-11-10 | 2011-05-16 | Pegatron Corp | Vapor chamber and manufacturing method thereof |
| CN201926356U (en) * | 2010-12-21 | 2011-08-10 | 深圳市万景华科技有限公司 | Uniform-temperature plate |
| TWM414812U (en) * | 2011-06-17 | 2011-10-21 | Univ Nat Taipei Technology | Vapor chamber |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002022378A (en) * | 2000-07-06 | 2002-01-23 | Showa Denko Kk | Heat pipe |
| TW201116794A (en) * | 2009-11-10 | 2011-05-16 | Pegatron Corp | Vapor chamber and manufacturing method thereof |
| CN201926356U (en) * | 2010-12-21 | 2011-08-10 | 深圳市万景华科技有限公司 | Uniform-temperature plate |
| TWM414812U (en) * | 2011-06-17 | 2011-10-21 | Univ Nat Taipei Technology | Vapor chamber |
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