TWI593496B - Adjustable swirl position auxiliary processing system and its operation method - Google Patents
Adjustable swirl position auxiliary processing system and its operation method Download PDFInfo
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Description
本發明係有關一種具有可調漩渦噴流位置之輔助加工系統及其操作方法，尤指一種兼具加工微屑被帶走使雷射光不被阻擋、漩渦噴流之排屑效果佳與可依需求調整渦流中心區之位置之具有可調漩渦噴流位置之輔助加工系統及其操作方法。 The invention relates to an auxiliary processing system with an adjustable vortex jet position and an operation method thereof, in particular to a method in which the processing micro-chips are taken away so that the laser light is not blocked, and the vortex jet has good chip removal effect and can be adjusted according to requirements. An auxiliary machining system with an adjustable vortex jet position at the location of the vortex central zone and its method of operation.
以雷射光對工件進行鑽孔加工之技術，早已行之有年，然而，雷射光對工件鑽孔熱熔過程會產生加工微屑；這些加工微屑容易遮蔽雷射光之照射，或是噴濺而附著在工件表面，極易造成加工積屑與粉塵等問題，進而影響加工效率，若工件是電路板，則這些加工微屑極易造成電路短路。 The technique of drilling a workpiece with laser light has been in progress for a long time. However, laser light will produce processing micro-chips during the hot-melting process of the workpiece; these processing micro-chips can easily block the irradiation of laser light or splash. When attached to the surface of the workpiece, it is easy to cause problems such as machining chips and dust, which in turn affects the processing efficiency. If the workpiece is a circuit board, these processing micro-chips are likely to cause a short circuit.
目前渦流輔助加工裝置(例如為中華民國發明專利第I361739號之雷射束處理機)，其渦流中心之正中心類似颱風眼，被吹起帶走之加工碎粒(加工屑)較少，而渦流中心外圍區域被吹起帶走之加工碎粒(加工屑)則較多。 At present, the eddy current auxiliary processing device (for example, the laser beam processing machine of the Republic of China invention patent No. I361739) has a positive center of the vortex center similar to the typhoon eye, and the processed granules (machiming chips) that are blown away are less, and The peripheral area of the vortex center is blown up and the processed granules (machiming chips) are more.
然而，習知裝置所產生之渦流中心位在正中心，但實際上進行雷射加工時有可能是對非中心之區域加工，此時，雷射光束較容易打至 被吹起帶走之加工碎粒(加工屑)，形成無效之加工。 However, the center of the eddy current generated by the conventional device is located at the center, but in reality, it is possible to process the non-center region during laser processing. At this time, the laser beam is easier to hit. The processed granules (machiming chips) that are blown away are formed into an ineffective process.
有鑑於此，必需研發出可解決上述習用缺點之技術。 In view of this, it is necessary to develop a technique that can solve the above disadvantages.
本發明之目的，在於提供一種具有可調漩渦噴流位置之輔助加工系統及其操作方法，其兼具加工微屑被帶走使雷射光不被阻擋、漩渦噴流之排屑效果佳與可依需求調整渦流中心區之位置等優點。特別是，本發明所欲解決之問題係在於現有漩渦輔助加工裝置之渦流中心位在正中心，但實務上進行雷射加工時有可能是對非中心之區域加工，此時，雷射光束較容易打至被吹起帶走之加工碎粒(加工屑)，形成無效之加工等問題。 The object of the present invention is to provide an auxiliary processing system with an adjustable vortex jet position and an operation method thereof, which have the advantages that the processed microchips are taken away so that the laser light is not blocked, and the vortex jet has good chip removal effect and can be adapted according to requirements. Adjust the position of the center of the eddy current and so on. In particular, the problem to be solved by the present invention is that the vortex center of the existing vortex assisted processing device is located at the center, but in practice, it is possible to process the non-center region during laser processing. It is easy to hit the processed granules (machining chips) that are blown away and take up problems such as ineffective processing.
解決上述問題之技術手段係提供一種具有可調漩渦噴流位置之輔助加工系統及其操作方法，關於系統部分係包括：一工作容室，係具有一第一端、一第二端、一環形筒壁及一中心軸；該第一端係可透光，該第二端係用以朝向一待加工物而進行雷射加工，該環形筒壁具有至少一進氣區及至少一排氣區，該進、該排氣區分別設有複數個進氣孔及複數個排氣孔；一雷射產生部，係用以產生一雷射光束，該雷射光束係從該第一端打向該第二端，用以對該待加工物進行雷射加工；一漩渦噴流產生部，係具有複數個進氣管及複數個排氣管；該複數個進氣管係連通相對應之該複數個進氣孔，用以於該進氣區內產生一進氣漩渦；該複數個排氣管係連通相對應之該複數個排氣孔，用以在該排氣區內產生一排氣漩渦；藉此，進行雷射加工時產生之加工微屑將會被該進氣漩渦及 該排氣漩渦之噴流所移動，最終由其中至少一排氣管離開該工作容室；其特徵係在於：一進氣壓力控制部，係分別連通該複數個進氣管，用以控制該每一進氣管之進氣量；該複數個進氣管之數量係為N，其中，N係為≧4之正整數；當該進氣壓力控制部控制該複數個進氣管之氣壓均為一第一壓力時，該進氣區內所產生之進氣漩渦具有一渦流中心區，其係鄰近該中心軸處；當該進氣壓力控制部控制該任一進氣管之氣壓為一低於前述第一壓力之第二壓力時，該渦流中心區係朝該第二壓力之進氣管的方向偏移，達到調整漩渦噴流位置者。 The technical means for solving the above problems is to provide an auxiliary processing system with an adjustable vortex jet position and an operating method thereof. The system part comprises: a working chamber having a first end, a second end, and an annular tube a wall and a central shaft; the first end is permeable to light, and the second end is for performing laser processing toward a workpiece to be processed, the annular cylinder wall having at least one air inlet region and at least one venting region The inlet and the exhaust zone are respectively provided with a plurality of intake holes and a plurality of exhaust holes; a laser generating portion is configured to generate a laser beam, the laser beam is directed from the first end to the a second end for performing laser processing on the object to be processed; a vortex jet generating portion having a plurality of intake pipes and a plurality of exhaust pipes; the plurality of intake pipes being connected to the plurality of corresponding ones An intake hole for generating an intake vortex in the intake region; the plurality of exhaust pipes are connected to the corresponding plurality of exhaust holes for generating an exhaust vortex in the exhaust region; Thereby, the processing micro-chip generated during the laser processing will be the intake air. Vortex and The jet of the exhaust vortex moves, and finally at least one of the exhaust pipes leaves the working chamber; and the air pressure control unit is connected to the plurality of intake pipes to control the each The intake air amount of an intake pipe; the number of the plurality of intake pipes is N, wherein N is a positive integer of ≧4; when the intake pressure control unit controls the air pressure of the plurality of intake pipes At a first pressure, the intake vortex generated in the intake region has a vortex central region adjacent to the central axis; when the intake pressure control portion controls the pressure of the one of the intake manifolds to be low During the second pressure of the first pressure, the vortex central zone is offset toward the second pressure of the intake pipe to reach the vortex jet position.
關於操作方法部分係包括下列步驟：一．準備步驟；二．雷射加工步驟；三．渦流排屑步驟；與四．調整漩渦噴流步驟。 The section on the method of operation includes the following steps: Preparation steps; two. Laser processing steps; three. Eddy current chip removal step; and four. Adjust the vortex jet step.
本發明之上述目的與優點，不難從下述所選用實施例之詳細說明與附圖中，獲得深入瞭解。 The above objects and advantages of the present invention will be readily understood from the following detailed description of the preferred embodiments illustrated herein.
茲以下列實施例並配合圖式詳細說明本發明於後： The invention will be described in detail in the following examples in conjunction with the drawings:
10‧‧‧工作容室 10‧‧‧Working room
11‧‧‧第一端 11‧‧‧ first end
12‧‧‧第二端 12‧‧‧ second end
13‧‧‧環形筒壁 13‧‧‧ annular wall
13A‧‧‧進氣區 13A‧‧‧Intake zone
13B‧‧‧排氣區 13B‧‧‧Exhaust zone
131‧‧‧進氣孔 131‧‧‧Air intake
132‧‧‧排氣孔 132‧‧‧ venting holes
20‧‧‧雷射產生部 20‧‧ ‧ Laser Generation Department
21‧‧‧雷射光束 21‧‧‧Laser beam
30‧‧‧漩渦噴流產生部 30‧‧‧Vortex Jet Generation Department
31‧‧‧進氣管 31‧‧‧Intake pipe
32‧‧‧排氣管 32‧‧‧Exhaust pipe
40‧‧‧進氣壓力控制部 40‧‧‧Intake Pressure Control Department
41‧‧‧閥 41‧‧‧ valve
42‧‧‧控制器 42‧‧‧ Controller
81‧‧‧準備步驟 81‧‧‧Preparation steps
82‧‧‧雷射加工步驟 82‧‧ ‧ laser processing steps
83‧‧‧渦流排屑步驟 83‧‧‧ eddy current chip removal steps
84‧‧‧調整漩渦噴流步驟 84‧‧‧Adjusting the vortex jet step
90‧‧‧待加工物 90‧‧‧Processing
91‧‧‧加工微屑 91‧‧‧Processing microchips
X‧‧‧中心軸 X‧‧‧ central axis
A‧‧‧渦流中心區 A‧‧‧ vortex central area
P‧‧‧原始位置 P‧‧‧Original location
P1‧‧‧第一偏移位置 P1‧‧‧First offset position
P2‧‧‧第二偏移位置 P2‧‧‧second offset position
P3‧‧‧第三偏移位置 P3‧‧‧ third offset position
P4‧‧‧第四偏移位置 P4‧‧‧4th offset position
Z1‧‧‧第一位置 Z1‧‧‧ first position
Z2‧‧‧第二位置 Z2‧‧‧ second position
Z3‧‧‧第三位置 Z3‧‧‧ third position
Z4‧‧‧第四位置 Z4‧‧‧ fourth position
第一圖係本發明之示意圖 The first figure is a schematic view of the present invention
第二圖係第一圖之Ⅱ-Ⅱ剖視圖 The second figure is a cross-sectional view of II-II of the first figure.
第三圖係本發明之應用於雷射加工之示意圖 The third figure is a schematic diagram of the invention applied to laser processing
第四A圖係本發明之進氣漩渦之示意圖 Figure 4A is a schematic view of the intake vortex of the present invention
第四B圖係本發明之排氣漩渦之示意圖 Figure 4B is a schematic view of the exhaust vortex of the present invention
第五圖係本發明之加工微屑移動之示意圖 The fifth figure is a schematic diagram of the movement of the processed microchips of the present invention.
第六圖係本發明之漩渦中心區接近中心軸之示意圖 The sixth figure is a schematic view of the center of the vortex of the present invention close to the central axis
第七A、第七B、第七C與第七D圖係分別為本發明之漩渦中心區偏向左上角、左下角、右下角與右上角之示意圖 The seventh, seventh, seventh, seventh, and seventh D drawings are respectively the upper left corner, the lower left corner, the lower right corner, and the upper right corner of the vortex central area of the present invention.
第八A圖係對應第七A圖之漩渦中心區偏向左上角之照片 The eighth picture A corresponds to the photo of the center of the vortex in the seventh A picture, which is biased to the upper left corner.
第八B圖係對應第七B圖之漩渦中心區偏向左下角之照片 The eighth picture B corresponds to the photo of the center of the vortex in the seventh B picture, which is biased to the lower left corner.
第八C圖係對應第七C圖之漩渦中心區偏向右下角之照片 The eighth C picture corresponds to the photo of the center of the vortex in the seventh C picture, which is biased to the lower right corner.
第八D圖係對應第七D圖之漩渦中心區偏向右上角之照片 The eighth D picture corresponds to the photo of the center of the vortex in the seventh D picture, which is biased to the upper right corner.
第九A、第九B、第九C及第九D圖係分別為第五圖之加工微屑被漩渦由上而下移至四個不同位置之示意圖 The ninth, ninth, ninth, and ninthth and fourth ninth drawings are schematic diagrams in which the processing microchips of the fifth figure are moved from top to bottom by four vortices to four different positions.
第十A、第十B及第十C圖係分別為本發明之加工微屑排屑前由團狀慢慢拉長至不同長度之示意圖 The tenth, tenth, and tenth Cth drawings are respectively schematic diagrams of slowly elongating to different lengths of the dough before processing the microchips in the present invention.
第十一圖係本發明之操作方法之流程圖 11 is a flow chart of the method of operation of the present invention
參閱第一及第二圖，本發明係為一種具有可調漩渦噴流位置之輔助加工系統及其操作方法，其裝置部分包括：一工作容室10，係具有一第一端11、一第二端12、一環形 筒壁13及一中心軸X(如第四A及第四B圖所示)；該第一端11係可透光，該第二端12係用以朝向一待加工物90而進行雷射加工，該環形筒壁13具有至少一進氣區13A及至少一排氣區13B，該進、該排氣區13A與13B分別設有複數個進氣孔131及複數個排氣孔132；一雷射產生部20，係用以產生一雷射光束21，該雷射光束21係從該第一端11打向該第二端12，用以對該待加工物90進行雷射加工(如第三圖所示)；一漩渦噴流產生部30，係具有複數個進氣管31及複數個排氣管32；該複數個進氣管31係連通相對應之該複數個進氣孔131，用以於該進氣區13A內產生一進氣漩渦(如第四A圖所示)；該複數個排氣管32係連通相對應之該複數個排氣孔132，用以在該排氣區13B內產生一排氣漩渦(如第四B圖所示)；藉此，進行雷射加工時產生之加工微屑91(參閱第五圖)將會被該進氣漩渦及該排氣漩渦之噴流所移動，最終由其中至少一排氣管32離開該工作容室10；其特徵係在於：一進氣壓力控制部40，係分別連通該複數個進氣管31，用以控制該每一進氣管31之進氣量；該複數個進氣管31之數量係為N，其中，N係為≧4之正整數；當該進氣壓力控制部40控制該複數個進氣管31之氣壓均為一第一壓力時，該進氣區13A內所產生之進氣漩渦具有一渦流中心區A， 其係鄰近該中心軸X處(如第六圖所示的原始位置P)；當該進氣壓力控制部40控制該任一進氣管31之氣壓為一低於前述第一壓力之第二壓力時，該渦流中心區A係朝該第二壓力之進氣管31的方向偏移(如第七A、第七B、第七C及第七D圖所示，分別移向一第一偏移位置P1、一第二偏移位置P2、一第三偏移位置P3及一第四偏移位置P4)，達到調整漩渦噴流位置者。 Referring to the first and second figures, the present invention is an auxiliary processing system having an adjustable vortex jet position and an operating method thereof. The device portion includes: a working chamber 10 having a first end 11 and a second End 12, a ring a cylindrical wall 13 and a central axis X (as shown in FIGS. 4A and 4B); the first end 11 is permeable to light, and the second end 12 is used for laser irradiation toward a workpiece 90 Processing, the annular cylinder wall 13 has at least one air inlet region 13A and at least one exhaust region 13B, and the inlet and outlet portions 13A and 13B are respectively provided with a plurality of air inlet holes 131 and a plurality of air outlet holes 132; The laser generating unit 20 is configured to generate a laser beam 21, and the laser beam 21 is driven from the first end 11 toward the second end 12 for performing laser processing on the object to be processed 90 (eg, The third vortex jet generating unit 30 has a plurality of intake pipes 31 and a plurality of exhaust pipes 32. The plurality of intake pipes 31 are connected to the corresponding plurality of intake holes 131. For generating an intake vortex in the intake region 13A (as shown in FIG. 4A); the plurality of exhaust pipes 32 are connected to the corresponding plurality of exhaust holes 132 for exhausting An exhaust vortex is generated in the region 13B (as shown in FIG. 4B); thereby, the processed microchip 91 (see FIG. 5) generated during the laser processing is to be vortexed by the intake vortex and the exhaust vortex Jet flow And finally, at least one of the exhaust pipes 32 leaves the working chamber 10; and is characterized in that: an intake pressure control portion 40 is connected to the plurality of intake pipes 31 for controlling each of the intake air The intake air amount of the tube 31; the number of the plurality of intake pipes 31 is N, wherein N is a positive integer of ≧4; when the intake pressure control unit 40 controls the air pressure of the plurality of intake pipes 31 When it is a first pressure, the intake vortex generated in the intake region 13A has a vortex center area A, It is adjacent to the central axis X (such as the original position P shown in FIG. 6); when the intake pressure control unit 40 controls the air pressure of any one of the intake pipes 31 to be lower than the first pressure first When the pressure is applied, the vortex central area A is offset toward the second pressure of the intake pipe 31 (as shown in the seventh, seventh, seventh, seventh, and seventh D, respectively, moving to a first The offset position P1, the second offset position P2, the third offset position P3, and the fourth offset position P4) are adjusted to the vortex jet position.
實務上，該工作容室10可為空心筒狀結構。 In practice, the working chamber 10 can be a hollow cylindrical structure.
該第一端11係設一透光之玻璃。 The first end 11 is provided with a light transmissive glass.
該第二端12係為待加工部，用以對該待加工物90進行雷射加工。 The second end 12 is a portion to be processed for performing laser processing on the workpiece 90.
該環形筒壁13內係為一工作空間。 The annular cylinder wall 13 is a working space.
該進氣區13A係設複數個；該排氣區13B係設複數個；該進氣區13A與該排氣區13B，係由下而上依序一圈一圈的間隔分佈於該環形筒壁13上。亦即，由下而上(從該第二端12朝該第一端11的方向)，一圈進氣區13A、一圈排氣區13B、一圈進氣區13A、、、、依此類推。 The air intake area 13A is provided in plurality; the exhaust area 13B is provided in plurality; the air intake area 13A and the exhaust area 13B are distributed in the annular tube at intervals of one turn and one turn from bottom to top. On the wall 13. That is, from bottom to top (from the second end 12 toward the first end 11), one turn of the intake zone 13A, one turn of the exhaust zone 13B, one turn of the intake zone 13A,,, and analogy.
該複數個進氣管31及該複數個排氣管32之方向係為該中心軸X之切線方向；而可分別於該環形筒壁13之工作空間內產生該進氣漩渦與該排氣旋渦之漩渦狀流動。 The plurality of intake pipes 31 and the plurality of exhaust pipes 32 are oriented in a tangential direction of the central axis X; and the intake vortex and the exhaust vortex may be generated in the working space of the annular tubular wall 13 respectively. The swirling flow.
該進氣壓力控制部40係包括：複數個閥41，係分別設相對應之該進氣管31上；用以控制 該進氣管31之氣壓，舉例來講，當該閥41之開啟幅度愈大，則該進氣管31之氣壓愈大，當該閥41之開啟幅度愈小，則該進氣管31之氣壓愈小；一控制器42，係電性連結該複數個閥41，而分別控制該複數個閥41之開啟幅度。 The intake pressure control unit 40 includes: a plurality of valves 41 respectively corresponding to the intake pipe 31; for controlling The air pressure of the intake pipe 31, for example, the greater the opening amplitude of the valve 41, the greater the air pressure of the intake pipe 31, and the smaller the opening amplitude of the valve 41, the intake pipe 31 The smaller the air pressure is, the controller 42 electrically connects the plurality of valves 41, and controls the opening amplitudes of the plurality of valves 41, respectively.
參閱第十一圖，關於本發明之操作方法部分，於開始後，可包括下列步驟：一．準備步驟81：預先準備一工作容室10、一雷射產生部20、一漩渦噴流產生部30與一進氣壓力控制部40；該工作容室10係具有一第一端11、一第二端12、一環形筒壁13及一中心軸X(如第四A及第四B圖所示)；該第一端11係可透光，該第二端12係用以朝向一待加工物90而進行雷射加工；該環形筒壁13具有至少一進氣區13A及至少一排氣區13B，該進氣區13A與該排氣區13B分別設有複數個進氣孔131及複數個排氣孔132；該漩渦噴流產生部30具有複數個進氣管31及複數個排氣管32，該複數個進氣管31之數量係為N，其中，N係為≧4之正整數；該複數個進氣管31係連通相對應之該複數個進氣孔131，該複數個排氣管32係連通相對應之該複數個排氣孔132；該進氣壓力控制部40分別連通該複數個進氣管31；二．雷射加工步驟82：控制該雷射產生部20產生一雷射光束21，該雷射光束21係從該第一端11打向該第二端12，而對該待加工物90進行雷射加工(如第二及第三圖所示)；三．渦流排屑步驟83：透過該複數個進氣管31朝相對應之該複數個進氣孔131供氣，而於該進氣區13A內產生一進氣漩渦(如第四A 圖所示)；並透過該複數個排氣管32朝相對應之該複數個排氣孔132吸氣，而於該排氣區13B內之產生一排氣漩渦(如第四B圖所示)；藉此，進行雷射加工時產生之加工微屑91(參閱第五圖)將會被該進氣漩渦及該排氣漩渦之噴流所移動，最終由其中至少一排氣管32離開該工作容室10；四．調整漩渦噴流步驟84：當該進氣壓力控制部40控制該複數個進氣管31之氣壓均為一第一壓力時，該進氣區13A內所產生之進氣漩渦具有一渦流中心區A，其係鄰近該中心軸X處(如第六圖所示的原始位置P)；當該進氣壓力控制部40控制該任一進氣管31之氣壓為一低於前述第一壓力之第二壓力時，該渦流中心區A係朝該第二壓力之進氣管31的方向偏移(如第七A、第七B、第七C及第七D圖所示，分別移向一第一偏移位置P1、一第二偏移位置P2、一第三偏移位置P3及一第四偏移位置P4)，達到調整漩渦噴流位置者，然後結束。 Referring to the eleventh figure, with regard to the operation method part of the present invention, after the start, the following steps may be included: Preparing step 81: preparing a working chamber 10, a laser generating portion 20, a vortex jet generating portion 30 and an intake pressure control portion 40; the working chamber 10 has a first end 11, a second The end 12, an annular wall 13 and a central axis X (as shown in the fourth and fourth B drawings); the first end 11 is permeable to light, and the second end 12 is for facing a workpiece And performing the laser processing; the annular cylinder wall 13 has at least one air inlet region 13A and at least one exhaust gas region 13B, and the air inlet region 13A and the exhaust gas region 13B are respectively provided with a plurality of air inlet holes 131 and a plurality of a vent hole 132; the vortex jet generation unit 30 has a plurality of intake pipes 31 and a plurality of exhaust pipes 32, the number of the plurality of intake pipes 31 is N, wherein N is a positive integer of ≧4; The plurality of intake pipes 31 are connected to the corresponding plurality of intake holes 131, and the plurality of exhaust pipes 32 are connected to the corresponding plurality of exhaust holes 132; the intake pressure control unit 40 respectively communicates with the plurality of intake holes a plurality of intake pipes 31; two. Laser processing step 82: controlling the laser generating portion 20 to generate a laser beam 21, the laser beam 21 is directed from the first end 11 toward the second end 12, and the laser is to be processed 90 Processing (as shown in the second and third figures); The vortex chip evacuation step 83: supplying air through the plurality of intake pipes 31 to the corresponding plurality of intake holes 131, and generating an intake vortex in the intake region 13A (such as the fourth A And a plurality of exhaust pipes 32 are inhaled through the plurality of exhaust holes 132, and an exhaust vortex is generated in the exhaust region 13B (as shown in FIG. 4B). Thereby, the processing microchip 91 (refer to the fifth figure) generated during the laser processing will be moved by the air vortex and the jet of the exhaust vortex, and finally the at least one exhaust pipe 32 leaves the Working room 10; four. Adjusting the vortex jet flow step 84: when the intake pressure control unit 40 controls the air pressure of the plurality of intake pipes 31 to be a first pressure, the intake vortex generated in the intake region 13A has a vortex center area A , which is adjacent to the central axis X (such as the original position P shown in FIG. 6); when the intake pressure control unit 40 controls the pressure of the one of the intake pipes 31 to be lower than the first pressure At the time of two pressures, the vortex central area A is offset toward the direction of the second pressure of the intake pipe 31 (as shown in the seventh, seventh, seventh, seventh, and seventh D, respectively) An offset position P1, a second offset position P2, a third offset position P3, and a fourth offset position P4) are adjusted to the vortex jet position, and then ended.
更詳細的講，關於該渦流排屑步驟83，係由設於該環形筒壁13上，由下而上、依序概呈圈狀、間隔分佈的該複數個進氣區13A與該複數個排氣區13B之動作進行說明： More specifically, the vortex chip evacuation step 83 is provided by the plurality of air inlet regions 13A and the plurality of the air venting portions 13 disposed on the annular cylinder wall 13 from bottom to top, sequentially in a ring shape, and spaced apart. The action of the exhaust zone 13B is explained:
進氣部分：該每一進氣區13A皆由該複數個進氣管31朝相對應之該複數個進氣孔131進氣，且由於該複數個進氣管31之方向係為該中心軸X之切線方向；而可分別於該環形筒壁13之工作空間內產生進氣漩渦(如第四A圖所示)。 Intake portion: each of the intake regions 13A is intakeed by the plurality of intake pipes 31 toward the corresponding plurality of intake holes 131, and the direction of the plurality of intake pipes 31 is the central axis The tangential direction of X; and the intake vortex may be generated in the working space of the annular cylinder wall 13 (as shown in FIG. 4A).
排氣部分：該每一排氣區13B皆由該複數個排氣孔132朝相對應之該複數個排氣管32出氣，同樣由於該複數個進氣管31之方向係為該中心軸X之切線方向；而可分別於該環形筒壁13之工作空間內產生進 氣漩渦(如第四B圖所示)。 Exhaust portion: each of the exhaust regions 13B is exhausted by the plurality of exhaust holes 132 toward the corresponding plurality of exhaust pipes 32, and also because the direction of the plurality of intake pipes 31 is the central axis X The tangential direction; and can be generated separately in the working space of the annular cylinder wall 13 Air vortex (as shown in Figure B).
因由下而上的每一圈進氣漩渦，都會被上面相鄰的排氣游渦帶動而朝上流動，藉此，帶動該環形筒壁13內的加工微屑91，從該第二端12朝該第一端11的方向，概呈漩渦狀移動(如第九A、第九B、第九C及第九D圖所示，該加工微屑91從一第一位置Z1依序呈漩渦狀移動至一第二位置Z2、一第三位置Z3及一第四位置Z4，當然，前述四個位置只是舉例而已，實際上在漩渦狀移動過程中，其移動位置是不固定的)。 Each of the intake vortices from bottom to top is driven upward by the adjacent exhaust vortex, thereby driving the processed microchips 91 in the annular cylinder wall 13 from the second end 12 In the direction toward the first end 11, there is a vortex movement (as shown in the ninth, ninth, ninth, and ninthth and ninth Dth views), the processed microchips 91 are sequentially swirled from a first position Z1. The shape moves to a second position Z2, a third position Z3, and a fourth position Z4. Of course, the foregoing four positions are only examples, and in fact, the moving position is not fixed during the spiral movement.
最後，從該其中至少一個排氣孔132朝相對應之該排氣管32排出，特別是，在排屑時，由於氣流吸引，原本概呈團狀的加工微屑91，會慢慢變長，如第十A、第十B至第十C圖所示，從短形慢慢變成長形，最後完全排出。 Finally, at least one of the exhaust holes 132 is discharged toward the corresponding exhaust pipe 32. In particular, during the chip evacuation, the originally processed dough-like chips 91 gradually become longer due to the airflow attraction. As shown in the tenth A, tenth, and tenthth Cth, the shape is gradually changed from a short shape to an elongated shape, and finally discharged completely.
關於調整漩渦噴流步驟84：雷射加工過程中產生的加工微屑91，可能由於某因素，而於該環形筒壁13之工作空間內偏向某一區域(以第七A圖之方向為例，假設偏向左上角的區域)，非鄰近該中心軸X處之進氣漩渦所能導出；此時可由該進氣壓力控制部40調整相對應之該閥41，控制左上角之該進氣管31的氣壓降低為第二氣壓，則左上角之該進氣管31位置低於其餘該複數個進氣管31之第一氣壓，使該渦流中心區A從原本的原始位置P(如第六圖所示)朝左上角移動至第一偏移位置P1(如第七A圖所示)，而可提高偏向此區域之加工微屑91的導引排屑作用。 Regarding the adjustment of the vortex jet step 84: the processing microchips 91 generated during the laser processing may be biased to a certain area in the working space of the annular cylinder wall 13 due to a certain factor (take the direction of the seventh A diagram as an example, Assuming that the region is biased to the upper left corner, the intake vortex that is not adjacent to the central axis X can be derived; at this time, the corresponding valve 41 can be adjusted by the intake pressure control unit 40 to control the intake pipe 31 in the upper left corner. The air pressure is lowered to the second air pressure, and the position of the intake pipe 31 in the upper left corner is lower than the first air pressure of the remaining plurality of intake pipes 31, so that the vortex central area A is from the original original position P (as shown in the sixth figure). The upper left corner is moved to the first offset position P1 (as shown in FIG. 7A), and the guiding chip evacuation effect of the processed microchips 91 biased toward the region can be improved.
舉例來講，如第七A、第七B、第七C及第七D圖所示，當依序控制左上、左下、右下與右上之該閥41關閉100ms時，可分別使該渦流中心區A在0.25s、0.35s、0.45s與0.55s時，分別偏移至該第一偏移位 置P1(偏移至左上方)、該第二偏移位置P2(偏移至左下方)、該第三偏移位置P3(偏移至右下方)與該第四偏移位置P4(偏移至右上方)。 For example, as shown in the seventh A, seventh B, seventh C, and seventh D diagrams, when the valve 41 of the upper left, lower left, lower right, and upper right is sequentially controlled to be closed for 100 ms, the vortex center can be respectively made. Area A is offset to the first offset position at 0.25s, 0.35s, 0.45s, and 0.55s, respectively. P1 (offset to the upper left), the second offset position P2 (offset to the lower left), the third offset position P3 (offset to the lower right), and the fourth offset position P4 (offset) To the top right).
換言之，可以利用將特定之該進氣管31變成OFF，來達到控制控制渦流中心區A之偏移。 In other words, the offset of the control vortex center area A can be achieved by turning the specific intake pipe 31 OFF.
同理，若將前述之OFF改成降壓為1/2，也會有類似之偏移情形，只是偏移量較小。當然，也可降壓為原有1/3或其他程度，而達到能控制渦流中心區A之精確偏移位置。 Similarly, if the above OFF is changed to a buck of 1/2, there will be a similar offset situation, but the offset is small. Of course, it is also possible to reduce the pressure to the original 1/3 or other degree, and to achieve the precise offset position of the central portion A of the eddy current.
更進一步，可由相對應之該排氣管32壓力提高(如第八A、第八B、第八C與第八D圖所示，係分別為對應該第一偏移位置P1、該第二偏移位置P2、該第三偏移位置P3與該第四偏移位置P4之相關偵測照片)，輔助確認渦流中心區A之偏移位置。 Further, the pressure can be increased by the corresponding exhaust pipe 32 (as shown in the eighth A, eighth B, eighth C, and eighth D drawings, respectively, corresponding to the first offset position P1, the second The offset position P2, the third offset position P3 and the fourth offset position P4 are related to the detection photos, and the auxiliary position of the eddy current center area A is confirmed.
當然，前述之偏移位置只是舉例說明，若同時對其中兩個或是三個該閥41作減壓，則可再使該渦流中心區A偏移至不同的位置，此簡易之調整變換不脫本案保護之範疇。 Of course, the foregoing offset position is only an example. If two or three of the valves 41 are decompressed at the same time, the eddy current center area A can be further shifted to different positions, and the simple adjustment is not changed. Remove the scope of protection of this case.
本發明之優點及功效係如下所述： The advantages and functions of the present invention are as follows:
[1]加工微屑被帶走使得雷射光不會被阻擋。傳統之雷射加工微屑容易殘留於雷射光之路徑中，會阻擋雷射光對工件之照射，影響雷射加工之效能。反觀本案可快速將雷射加工產生之加工微屑先偏離(渦流排屑偏離雷射之直線照射)雷射光之路徑，再以螺旋而上之方式被快速帶走，使得雷射光不會被阻擋。 [1] The processed microchips are taken away so that the laser light is not blocked. Conventional laser processing micro-chips are likely to remain in the path of the laser light, which will block the irradiation of the laser light to the workpiece and affect the performance of the laser processing. In contrast, this case can quickly deviate the processing micro-chips generated by laser processing (the eddy currents are off-line from the laser), and then quickly take away the spiral light, so that the laser light will not be blocked. .
[2]漩渦噴流之排屑效果佳。由於漩渦噴流之漩渦狀之流動速度極高，加上本案之複數個進氣管及複數個排氣管設計，可以高速之漩 渦噴流，快速的將雷射加工之微屑帶走，排屑速度極快，整體而言排屑效果極佳。 [2] The vortex jet has good chip removal effect. Due to the extremely high flow velocity of the vortex jet, plus the multiple intake pipes and multiple exhaust pipes in this case, it can be swirled at high speed. The vortex jet quickly removes the micro-chips from the laser processing, and the chip removal speed is extremely fast, and the overall chip removal effect is excellent.
[3]可依需求調整渦流中心區之位置。本發明可依需求，透過該進氣壓力控制部，控制不同位置之閥(例如全關、開啟1/2…)，而調整相對應之進氣管之氣壓(例如完全減壓、1/2減壓)，使渦流中心區偏向低氣壓處。故，可依需求調整渦流中心區之位置。 [3] The position of the vortex central zone can be adjusted as required. According to the invention, the intake pressure control unit can control the valves at different positions (for example, fully closed, open 1/2...), and adjust the air pressure of the corresponding intake pipe (for example, full pressure reduction, 1/2) Decompression), the vortex center area is biased to a low pressure. Therefore, the position of the vortex central zone can be adjusted as required.
以上僅是藉由較佳實施例詳細說明本發明，對於該實施例所做的任何簡單修改與變化，皆不脫離本發明之精神與範圍。 The present invention has been described in detail with reference to the preferred embodiments of the present invention, without departing from the spirit and scope of the invention.
10‧‧‧工作容室 10‧‧‧Working room
11‧‧‧第一端 11‧‧‧ first end
12‧‧‧第二端 12‧‧‧ second end
13‧‧‧環形筒壁 13‧‧‧ annular wall
131‧‧‧進氣孔 131‧‧‧Air intake
132‧‧‧排氣孔 132‧‧‧ venting holes
20‧‧‧雷射產生部 20‧‧ ‧ Laser Generation Department
21‧‧‧雷射光束 21‧‧‧Laser beam
30‧‧‧漩渦噴流產生部 30‧‧‧Vortex Jet Generation Department
31‧‧‧進氣管 31‧‧‧Intake pipe
32‧‧‧排氣管 32‧‧‧Exhaust pipe
40‧‧‧進氣壓力控制部 40‧‧‧Intake Pressure Control Department
41‧‧‧閥 41‧‧‧ valve
42‧‧‧控制器 42‧‧‧ Controller
90‧‧‧待加工物 90‧‧‧Processing
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| TW498008B (en) * | 2000-08-22 | 2002-08-11 | Nippon Electric Co | Laser correction method and apparatus |
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