TWI593165B - 電子封裝件 - Google Patents

電子封裝件 Download PDF

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Publication number
TWI593165B
TWI593165B TW105103744A TW105103744A TWI593165B TW I593165 B TWI593165 B TW I593165B TW 105103744 A TW105103744 A TW 105103744A TW 105103744 A TW105103744 A TW 105103744A TW I593165 B TWI593165 B TW I593165B
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Taiwan
Prior art keywords
substrate
antenna structure
electronic package
electronic
encapsulation layer
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TW105103744A
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English (en)
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TW201729462A (zh
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邱志賢
陳嘉揚
盧盈維
張峻源
蔡明汎
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矽品精密工業股份有限公司
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Priority to TW105103744A priority Critical patent/TWI593165B/zh
Priority to CN201610114900.8A priority patent/CN107039405A/zh
Priority to US15/163,045 priority patent/US9999132B2/en
Application granted granted Critical
Publication of TWI593165B publication Critical patent/TWI593165B/zh
Publication of TW201729462A publication Critical patent/TW201729462A/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

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  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
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  • Details Of Aerials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

電子封裝件
本發明係有關一種電子封裝件，尤指一種具天線結構之電子封裝件。
隨著電子產業的蓬勃發展，目前無線通訊技術已廣泛應用於各式各樣的消費性電子產品以利接收或發送各種無線訊號。為了滿足消費性電子產品的外觀設計需求，無線通訊模組之製造與設計係朝輕、薄、短、小之需求作開發，其中，平面天線(Patch Antenna)因具有體積小、重量輕與製造容易等特性而廣泛利用在手機(cell phone)、個人數位助理(Personal Digital Assistant,PDA)等電子產品之無線通訊模組中。
第1圖係習知無線通訊模組之立體示意圖。如第1圖所示，該無線通訊模組1係包括：一封裝基板10、複數電子元件11、一天線結構12以及封裝膠體13。該封裝基板10係為電路板並呈矩形狀。該電子元件11係設於該封裝基板10上且電性連接該封裝基板10。該天線結構12係為平面型且具有一天線本體120與一導線121，該天線本體120藉由該導線121電性連接該電子元件11。該封裝膠體 13係覆蓋該電子元件11與該部分導線121。
前述之習知無線通訊模組1中，由於該天線結構12係為平面型，故基於該天線結構12與該電子元件11之間的電磁輻射特性及該天線結構12之體積限制，因而於製程中，該天線本體120難以與該電子元件11整合製作，亦即該封裝膠體13僅覆蓋該電子元件11，並未覆蓋該天線本體120，致使封裝製程之模具需對應該些電子元件11之佈設區域，而非對應該封裝基板10之尺寸，因而不利於封裝製程。
再者，因該天線結構12係為平面型，故需於該封裝基板10之表面上增加佈設區域(未形成封裝膠體13之區域)以形成該天線本體120，致使該封裝基板10之寬度難以縮減，因而難以縮小該無線通訊模組1的寬度，而使該無線通訊模組1無法達到微小化之需求。
因此，如何克服上述習知技術之種種問題，實已成目前亟欲解決的課題。
鑑於上述習知技術之種種缺失，本發明係揭露一種電子封裝件，係包括：一基板；至少一電子元件，係設於該基板上；以及至少一天線結構，係設於該基板上並具有一本體部與至少一支撐部，且該本體部係包含複數孔洞與分隔該些孔洞之框架，並藉由該支撐部架設於該基板上。
前述之電子封裝件中，該基板具有電性連接該電子元件之線路層。
前述之電子封裝件中，該天線結構電性連接該基板。
前述之電子封裝件中，該天線結構電性連接該電子元件。
前述之電子封裝件中，該天線結構之材質係為金屬。
前述之電子封裝件中，該些孔洞係呈陣列交錯排列。
前述之電子封裝件中，該孔洞之形狀係為圓形、封閉曲線形或多邊形。
前述之電子封裝件中，復包括形成於該基板上並覆蓋該電子元件之封裝層。其中，該框架外露於該封裝層，例如，該框架係凸出該封裝層或未凸出該封裝層。或者，該封裝層完全覆蓋該天線結構。
由上可知，本發明之電子封裝件中，係藉由藉由以立體式天線結構取代習知平面式天線結構，故該天線結構能架設於該電子元件所佈設之基板區域上，以使封裝製程之模具對應該基板之尺寸，而有利於封裝製程。
再者，因該天線結構架設於該電子元件所佈設之區域(即形成封裝層之區域)，因而無需於該基板之表面上增加佈設區域，故相較於習知技術，本發明之基板之寬度較短，因而有效縮減該電子封裝件的寬度，致使該電子封裝件達到微小化之需求。
1‧‧‧無線通訊模組
10‧‧‧封裝基板
11,21,21’‧‧‧電子元件
12,22,22’‧‧‧天線結構
120‧‧‧天線本體
121‧‧‧導線
13‧‧‧封裝膠體
2,2’,3,3’,4,4’‧‧‧電子封裝件
20‧‧‧基板
200‧‧‧線路層
220‧‧‧本體部
220a‧‧‧孔洞
220b,220b’,220b”‧‧‧框架
221‧‧‧支撐部
23‧‧‧封裝層
23a‧‧‧第一表面
23b‧‧‧第二表面
23c‧‧‧側面
第1圖係為習知無線通訊模組之立體示意圖；第2A圖係為本發明之電子封裝件之剖面示意圖；第2B圖係為第2A圖的局部立體圖； 第2C及2C’圖係為第2A圖之天線結構之不同實施例的立體圖；第2D圖係為第2A圖之立體示意圖；第2D’圖係為第2D圖之另一實施例；第3及3’圖係為第2A圖之其它實施例；以及第4及4’圖係為第2D圖之其它實施例。
以下藉由特定的具體實施例說明本發明之實施方式，熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。
須知，本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本發明可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本發明所能產生之功效及所能達成之目的下，均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時，本說明書中所引用之如“上”、“第一”、“第二”、及“一”等之用語，亦僅為便於敘述之明瞭，而非用以限定本發明可實施之範圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本發明可實施之範疇。
第2A至2D圖係為本發明之電子封裝件2之示意圖。如第2A至2D圖所示，所述之電子封裝件2係至少由一基板20、設於該基板20上之電子元件21,21’以及一天線結構 22所構成。
於本實施例中，該電子封裝件2係為系統級封裝(System in package，簡稱SiP)之無線通訊模組。
所述之基板20係為電路板或陶瓷板並呈矩形狀，如第2B圖所示，且該基板20之表面設有線路層200，而該基板20內部亦設有線路層(圖略)。應可理解地，有關基板之種類繁多，並不限於圖示者。
所述之電子元件21,21’係電性連接該基板20之線路層200，如第2B圖所示。於本實施例中，該電子元件21,21’係為主動元件、被動元件、或其二者之組合，其中，該主動元件係例如半導體晶片，該被動元件係例如電阻、電容及電感。例如，該電子元件21係以覆晶方式電性連接該線路層200；或者，該電子元件21’係以打線方式電性連接該線路層200。
所述之天線結構22係包含有一本體部220與至少一支撐部221，該支撐部221係為金屬柱並立設於該基板20上，且該本體部220藉由該些支撐部221架設於該基板20上，其中，該本體部220係由複數孔洞220a與分隔該些孔洞220a之框架220b所構成。
於本實施例中，於製作該電子封裝件2時，係先用金屬板或金屬框方式製作出所需之天線結構22之預製件，再將該預製件直接黏貼於該基板20上。具體地，該天線結構22可為封閉型，如第2C圖所示；或者，該天線結構22’可為非封閉型，如第2C’圖所示。
再者，該些孔洞220a係陣列交錯排列，如第2C及2C’圖所示，且該孔洞220a之形狀可為圓形、封閉曲線形或多邊形，並無特別限制。
又，該支撐部221可選擇設於該本體部220之邊緣的框架220b上(如第2C圖所示)或中間的框架220b上(如第2C’圖所示)，且可依需求形成一個支撐部221(如第2C圖所示)或複數個支撐部221(如第2C’圖所示)。
另外，該天線結構22藉由該支撐部221電性連接該基板20之線路層200，如第2A及3圖所示；或者，該天線結構22藉由該支撐部221電性連接該電子元件21’，如第3’圖所示。
另一方面，所述之電子封裝件2係可選擇性包括一封裝層23，如第2A及2D圖所示。因此，該電子封裝件2亦可省略該封裝層23之製作。
所述之封裝層23係形成於該基板20上並覆蓋該電子元件21與該支撐部221，且其具有相對之第一表面23a與第二表面23b，使該封裝層23以其第一表面23a結合該基板20。
於本實施例中，形成該封裝層23之材質係為絕緣材，例如，聚醯亞胺(polyimide，簡稱PI)、乾膜(dry film)、環氧樹脂(expoxy)或封裝膠體(molding compound)。
再者，該框架220b可選擇外露於該封裝層23之第二表面23b，如第2A及2D圖所示，亦即該框架220b係凸出該封裝層23之第二表面23b。
或者，該框架220b’,220b”亦可未凸出該封裝層23，如第3及3’圖所示之電子封裝件3,3’。具體地，如第3圖所示，該框架220b’之表面係齊平該封裝層23之第二表面23b；或如第3’圖所示，該框架220b”之表面係低於該封裝層23之第二表面23b。因此，於其它實施例中，於製作該天線結構22時，可先於該封裝層23之第二表面23b上形成複數凹槽及通孔，再使用濺射塗覆(sputter coating)、鍍覆(plating)、噴覆(spray)、印刷(printing)等塗佈方式形成金屬材於該凹槽與該通孔中，以令該凹槽之金屬材作為該框架220b’,220b”，該通孔之金屬材作為該支撐部221。應可理解地，亦可將塗佈方式與金屬板或金屬框方式結合製作該天線結構22。
又，於其它實施例中，如第4圖所示之電子封裝件4，該框架220b亦可以選擇外露於該封裝層23之側面23c，其中，該側面23c係鄰接該第一表面23a與第二表面23b。
另外，如第4’圖所示之電子封裝件4’，該封裝層23亦可完全覆蓋該天線結構22。
另一方面，應可理解地，於其它實施例中，該電子封裝件2’可包括複數個天線結構，如第2D’圖所示之兩個本體部220外露於該封裝層23。
綜上所述，本發明之電子封裝件2,2’,3,3’,4,4’中，係利用金屬板或金屬框摺疊成立體化天線結構22,22’或利用塗佈方式形成立體化天線結構22,22’，再將該框架220b,220b’,220b”設於該基板20與該些電子元件21,21’上 方，以於製程中，該天線結構22能與該些電子元件21,21’整合製作，亦即一同進行封裝，使該封裝層23能覆蓋該些電子元件21,21’與該天線結構22,22’，故封裝製程用之模具能對應該基板20之尺寸，因而有利於封裝製程。
再者，該封裝層23可用於固定該天線結構22,22’，使該框架220b,220b’,220b”位於固定高度而能確保天線穩定性，且利用該封裝層23之介電係數能縮小天線所需之電氣長度。
又，該框架220b,220b’,220b”設於該基板20上而呈立體式天線，因而可將該天線結構22佈設於與該些電子元件21,21’之相同之區域(即形成封裝層23之區域)，而無需於該基板20之表面上增加佈設區域，故相較於習知技術，本發明之基板20之寬度較短，因而能縮小該電子封裝件2,2’,3,3’,4,4’的寬度，而使該電子封裝件2,2’,3,3’,4,4’達到微小化之需求。
另外，該框架220b,220b’,220b”疊設於該基板20上，將於該框架220b,220b’,220b”與該基板20之間形成容置空間，故能利用該容置空間佈設其它電性結構或電子元件。
上述實施例係用以例示性說明本發明之原理及其功效，而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下，對上述實施例進行修改。因此本發明之權利保護範圍，應如後述之申請專利範圍所列。
2‧‧‧電子封裝件
20‧‧‧基板
200‧‧‧線路層
21‧‧‧電子元件
22‧‧‧天線結構
220‧‧‧本體部
220a‧‧‧孔洞
220b‧‧‧框架
221‧‧‧支撐部
23‧‧‧封裝層
23a‧‧‧第一表面
23b‧‧‧第二表面

Claims (10)

  1. 一種電子封裝件，係包括：一基板；至少一電子元件，係設於該基板上；至少一天線結構，係設於該基板上並具有一本體部與至少一支撐部，且該本體部係由複數孔洞與分隔該些孔洞之框架所構成，並藉由該支撐部架設於該基板上；以及封裝層，形成於該基板上並覆蓋該電子元件與該天線結構之支撐部，且該本體部外露於該封裝層。
  2. 如申請專利範圍第1項所述之電子封裝件，其中，該基板具有電性連接該電子元件之線路層。
  3. 如申請專利範圍第1項所述之電子封裝件，其中，該天線結構電性連接該基板。
  4. 如申請專利範圍第1項所述之電子封裝件，其中，該天線結構電性連接該電子元件。
  5. 如申請專利範圍第1項所述之電子封裝件，其中，該天線結構之材質係為金屬。
  6. 如申請專利範圍第1項所述之電子封裝件，其中，該些孔洞係呈陣列交錯排列。
  7. 如申請專利範圍第1項所述之電子封裝件，其中，該孔洞之形狀係為圓形、封閉曲線形或多邊形。
  8. 如申請專利範圍第1項所述之電子封裝件，其中，該框架外露於該封裝層。
  9. 如申請專利範圍第8項所述之電子封裝件，其中，該框架係凸出該封裝層。
  10. 如申請專利範圍第8項所述之電子封裝件，其中，該框架係未凸出該封裝層。
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