TWI590914B - A chemical mechanical polishing dresser to adjust the height of the abrasive particles - Google Patents
A chemical mechanical polishing dresser to adjust the height of the abrasive particles Download PDFInfo
- Publication number
- TWI590914B TWI590914B TW105125283A TW105125283A TWI590914B TW I590914 B TWI590914 B TW I590914B TW 105125283 A TW105125283 A TW 105125283A TW 105125283 A TW105125283 A TW 105125283A TW I590914 B TWI590914 B TW I590914B
- Authority
- TW
- Taiwan
- Prior art keywords
- chemical mechanical
- mechanical polishing
- abrasive particles
- height
- materials
- Prior art date
Links
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
本發明為有關一種化學機械研磨修整器，尤指一種可調整研磨顆粒突出高度之化學機械研磨修整器。The invention relates to a chemical mechanical polishing dresser, in particular to a chemical mechanical polishing dresser capable of adjusting the protruding height of the abrasive particles.
於半導體晶圓製造過程之中，係廣泛使用化學機械研磨(Chemical mechanical polish，簡稱CMP)製程對晶圓進行研磨，令晶圓表面達平坦化。常見的化學機械研磨製程為使用一具有複數研磨顆粒的研磨墊(或拋光墊)對一晶圓表面進行研磨，且該些研磨顆粒係經過高度調整，使該研磨墊的修整精密度提高。In the semiconductor wafer manufacturing process, the wafer is polished using a chemical mechanical polish (CMP) process to planarize the surface of the wafer. A common CMP process is to grind a wafer surface using a polishing pad (or polishing pad) having a plurality of abrasive particles, and the abrasive particles are height adjusted to increase the precision of the polishing pad.
如中華民國發明專利公告第562719號，提出一種能個別調整一磨粒的修整盤，將每一顆獨立的磨粒分別以焊材焊在一根金屬桿的桿頂端面上。如果在桿頂端面上預設一凹槽，還可將該磨粒依其晶形以特定的方向固定後焊牢。由於該磨粒乃焊在金屬桿上，所以金屬盤並不需要加熱，因此其加工精度可以保持。這時將焊好的金屬桿分別***金屬盤的特定位置銷孔內就可控制磨粒的分佈。For example, in the Republic of China Invention Patent Publication No. 562719, a dressing disc capable of individually adjusting an abrasive grain is proposed, and each of the independent abrasive grains is respectively welded to the top end surface of a metal rod by a welding material. If a groove is preset on the top surface of the rod, the abrasive grain can be fixed in a specific direction according to its crystal shape and then welded. Since the abrasive grains are welded to the metal rod, the metal disk does not need to be heated, so the processing precision can be maintained. At this time, the welded metal rods are respectively inserted into the pin holes of the specific positions of the metal disc to control the distribution of the abrasive grains.
另可參中華民國發明專利公開第201532734號，提出一種高性能化學機械研磨修整器，包括一基板、一結合層以及複數個研磨顆粒，該結合層係設置於該基板上，該些研磨顆粒係藉由該結合層以直接固定於該基板上，或者，每一研磨顆粒係設置於一金屬固定座上，且該基板具有複數個凹槽或複數個貫穿孔，使該金屬固定座容置於該些凹槽或該些貫穿孔中，且該金屬固定座藉由該結合層以固定於該基板上，其中，該研磨顆粒係經由一表面加工處理，使該研磨顆粒具有特定之切削刃角、晶形結構、尖端高度、及尖端方向性，或者，該研磨顆粒係未經加工處理之研磨顆粒。In addition, the Chinese Patent Publication No. 201532734 discloses a high-performance chemical mechanical polishing dresser comprising a substrate, a bonding layer and a plurality of abrasive particles, the bonding layer being disposed on the substrate, the abrasive particles being The bonding layer is directly fixed on the substrate, or each of the abrasive particles is disposed on a metal fixing base, and the substrate has a plurality of grooves or a plurality of through holes, so that the metal fixing seat is placed The recesses or the through holes, and the metal fixing base is fixed to the substrate by the bonding layer, wherein the abrasive particles are processed through a surface to make the abrasive particles have a specific cutting edge angle The crystal structure, the tip height, and the tip orientation, or the abrasive particles are unprocessed abrasive particles.
此外，本案申請人所提出申請的中華民國發明專利申請第104117686號，提出一種化學機械研磨修整器，包含一基板以及複數研磨單元，該基板具有一水平頂面，該些研磨單元設於該基板之該水平頂面，包含一研磨單元基板、一研磨層以及一結合層，該研磨單元基板具有相對的一上表面和一下表面，該研磨層形成於該上表面並具有複數研磨尖端，該結合層形成於該下表面與該基板之間並於面向該下表面之一面形成一斜面。其中該些研磨單元更包含一墊設件，該墊設件設於該基板之該水平頂面並墊設於該下表面之一側，且該結合層形成於該下表面、該墊設件與該水平頂面之間並於面向該下表面之一面形成該斜面。In addition, the Chinese Patent Application No. 104117686, filed by the applicant of the present application, discloses a chemical mechanical polishing dresser comprising a substrate and a plurality of polishing units, the substrate having a horizontal top surface, the polishing units being disposed on the substrate The horizontal top surface comprises a polishing unit substrate, an abrasive layer and a bonding layer, the polishing unit substrate has an opposite upper surface and a lower surface, the polishing layer is formed on the upper surface and has a plurality of grinding tips, the bonding The layer is formed between the lower surface and the substrate and forms a slope on a surface facing the lower surface. The polishing unit further includes a pad member disposed on the horizontal top surface of the substrate and disposed on one side of the lower surface, and the bonding layer is formed on the lower surface, the pad member The slope is formed between the horizontal top surface and a surface facing the lower surface.
又可參中華民國發明專利公告第I228066號，提出一種研磨布用修整器，是在可旋轉的金屬台的表面形成有修整面之研磨布用修整器，其特徵為：在上述修整面，朝其周方向並排設置有複數個磨石顆粒群，在上述金屬台，設置有能調節全部或一部分的磨石顆粒群中以多數個磨石顆粒的前端所分別形成的基準面之上述修整面的高低差之調節機構。上述調節機構係由位在表面固著有磨石顆粒群，可上下滑動自如地嵌入到上述金屬台的表面所開口之凹部之基台、及設置在該基台的背面，螺合在從上述金屬台之凹部的底面貫穿到該金屬台的背面側之螺絲孔之調節用螺絲、及利用該調節用螺絲來調節固著在上述基台的磨石顆粒群之基準面的高度位置。In addition, it can be referred to the Chinese Patent Publication No. I228066, which proposes a dresser for a polishing cloth, which is a dressing device for a polishing cloth having a finishing surface formed on a surface of a rotatable metal table, characterized in that: on the above-mentioned finishing surface, a plurality of grindstone particles are arranged side by side in the circumferential direction, and the above-mentioned metal table is provided with the above-mentioned trimming surface of the reference surface formed by the front ends of the plurality of grindstone particles in the whole or a part of the grindstone particle group The adjustment mechanism of the height difference. The adjustment mechanism is a base on which a grindstone particle group is fixed on the surface, and is slidably and slidably fitted to a recess opened on a surface of the metal table, and is disposed on a back surface of the base, and is screwed from the above The bottom surface of the concave portion of the metal table penetrates the screw for adjusting the screw hole on the back side of the metal table, and the height of the reference surface of the group of the grindstone particles fixed to the base is adjusted by the adjusting screw.
於以上先前技術之中，中華民國發明專利公告第562719號係先將每一顆獨立的磨粒分別以焊材焊在一根金屬桿的桿頂端面上，再將該金屬桿***該金屬盤的孔內，並將金屬盤反扣在該平板上以用於調整該磨粒的頂點高度，待頂點高度調整完畢後，再透過黏結材料將該金屬桿黏固於該金屬盤上，然固定後的該磨粒即無法再次進行高度調整；中華民國公開第201532734號則將該些研磨顆粒或者將載有該研磨顆粒的該金屬固定座藉由該結合層直接固定於該基板上，此作法與前一個先前技術類似，固定後無法再對高度進行調整；而中華民國專利申請第104117686號係先透過該墊設件來調整該研磨尖端的高度，調整完畢後再於該基板的該水平頂面與該研磨單元基板的該下表面之間形成該結合層，用於將該研磨單元牢固於該基板上，此案也同樣有前述固定後無法再對高度進行調整的問題。In the above prior art, the Republic of China Invention Patent Bulletin No. 562719 first welds each individual abrasive grain to the top end surface of a metal rod by welding, and then inserts the metal rod into the metal disk. Inside the hole, and the metal plate is buckled on the plate for adjusting the height of the apex of the abrasive grain. After the height of the apex is adjusted, the metal rod is adhered to the metal plate through the bonding material, and then fixed. The latter abrasive grain cannot be height-adjusted again; in the Republic of China Publication No. 201532734, the abrasive particles or the metal fixing seat carrying the abrasive particles are directly fixed to the substrate by the bonding layer. Similar to the previous prior art, the height can no longer be adjusted after fixing; and the Republic of China Patent Application No. 104117686 first adjusts the height of the grinding tip through the pad, and then adjusts to the horizontal top of the substrate. Forming the bonding layer between the surface and the lower surface of the polishing unit substrate for fixing the polishing unit to the substrate, and the case is also capable of being height-adjustable after the fixing Line adjustment of the question.
另中華民國發明專利公告第I228066雖揭示可透過旋轉該調節用螺絲而調整該磨石顆粒群的該高度差，然該調節機構部分外露於該金屬台外，因此於研磨過程中易使該磨石顆粒群或該調節機構從該金屬台上脫落，造成修整穩定性不佳的問題，且該調節機構係直接設置於該金屬台上，並無任何緩衝機構來緩衝研磨時所造成的衝擊力，易於研磨過程中造成該金屬台、該調節機構或該磨石顆粒群的毀損，另外，當要更換該些磨石顆粒群時，需連同該調節機構一併更換，使耗材成本相對提高。Further, the Republic of China Invention Patent Publication No. I228066 discloses that the height difference of the group of the grinding stone particles can be adjusted by rotating the adjusting screw, and the adjusting mechanism is partially exposed outside the metal table, so that the grinding is easy to be performed during the grinding process. The stone particle group or the adjusting mechanism is detached from the metal table, causing a problem of poor dressing stability, and the adjusting mechanism is directly disposed on the metal table, and there is no buffer mechanism to buffer the impact force caused by the grinding. In the process of being easy to grind, the metal table, the adjusting mechanism or the group of the grinding stone particles is damaged. In addition, when the group of the grinding stone particles is to be replaced, the adjusting mechanism is replaced together, so that the cost of the consumables is relatively increased.
綜上可知，傳統的化學機械研磨修整器，對於調整研磨顆粒突出高度之技術，仍有待改進。In summary, the traditional chemical mechanical polishing dresser has yet to be improved for the technique of adjusting the protruding height of the abrasive particles.
本發明的主要目的，在於解決習知化學機械研磨修整器對於研磨顆粒突出高度調整技術有待改進的問題。The main object of the present invention is to solve the problem that the conventional chemical mechanical polishing dresser needs to be improved for the abrasive grain protrusion height adjustment technique.
為達上述目的，本發明提供一種可調整研磨顆粒突出高度之化學機械研磨修整器，包括一基座、複數個研磨單元、複數個緩衝單元以及複數個調整單元，該基座具有一上表面以及複數個貫穿於該上表面的容置槽，該容置槽分別具有一鄰近該上表面的開口以及一遠離該上表面的螺紋壁，該研磨單元容置於該容置槽，包括一承載柱以及一設置於該承載柱上的研磨顆粒，該研磨顆粒具有一突出該開口的尖端以及一自該尖端朝該承載柱延伸的擴大部，該緩衝單元容置於該容置槽，包括一設置於該開口的彈性擋止件，該彈性擋止件具有一中空，該中空的內徑介於該尖端和該擴大部之間，該調整單元容置於該容置槽，包括一和該螺紋壁螺合並承載該承載柱以調整該尖端突出至遠離該開口的一突出高度的螺絲件。In order to achieve the above object, the present invention provides a chemical mechanical polishing dresser capable of adjusting the protruding height of an abrasive particle, comprising a base, a plurality of grinding units, a plurality of buffer units, and a plurality of adjusting units, the base having an upper surface and a plurality of accommodating grooves extending through the upper surface, the accommodating grooves respectively having an opening adjacent to the upper surface and a threaded wall away from the upper surface, the grinding unit being received in the accommodating groove, including a supporting column And an abrasive particle disposed on the support post, the abrasive particle has a tip protruding from the opening and an enlarged portion extending from the tip toward the support post, the buffer unit is received in the receiving groove, including a setting In the elastic stop of the opening, the elastic stop has a hollow, the hollow inner diameter is between the tip and the enlarged portion, and the adjusting unit is received in the receiving groove, including a thread and the thread The wall screw incorporates the load bearing post to adjust the screw member that protrudes from the tip to a protruding height away from the opening.
於一實施例中，該彈性擋止件為一橡膠O形環。In an embodiment, the elastic stop is a rubber O-ring.
於一實施例中，該緩衝單元更包括一設置於該承載柱與該調整單元之間的彈性緩衝件。In an embodiment, the buffer unit further includes an elastic buffer member disposed between the support post and the adjustment unit.
於一實施例中，該彈性緩衝件為一矽膠墊。In one embodiment, the elastic buffer member is a silicone pad.
於一實施例中，該基座更包括複數個擋止壁，該擋止壁凸設於該容置槽的該開口處且具有一小於該容置槽的一第一內徑的第二內徑。In one embodiment, the pedestal further includes a plurality of blocking walls protruding from the opening of the accommodating groove and having a second inner portion smaller than a first inner diameter of the accommodating groove path.
於一實施例中，該基座的材質擇自於不鏽鋼、金屬材料、塑膠材料及陶瓷材料所組成之群組。In one embodiment, the material of the pedestal is selected from the group consisting of stainless steel, metal materials, plastic materials, and ceramic materials.
於一實施例中，該承載柱的材質擇自於不鏽鋼、金屬材料、塑膠材料及陶瓷材料所組成之群組。In one embodiment, the material of the carrier column is selected from the group consisting of stainless steel, metal materials, plastic materials, and ceramic materials.
於一實施例中，該研磨單元更包括一形成於該承載柱與該研磨顆粒之間且將該研磨顆粒固定於該承載柱上的結合層。In one embodiment, the grinding unit further includes a bonding layer formed between the carrier column and the abrasive particles and fixing the abrasive particles to the carrier column.
於一實施例中，該結合層的組成擇自於陶瓷材料、硬焊材料、電鍍材料、金屬材料及高分子材料所組成之群組。In one embodiment, the composition of the bonding layer is selected from the group consisting of ceramic materials, brazing materials, plating materials, metal materials, and polymer materials.
於一實施例中，該突出高度為介於10μm至500μm之間。In an embodiment, the protruding height is between 10 μm and 500 μm.
於一實施例中，該調整單元遠離該承載柱的一端具有一卡槽，該卡槽的形狀擇自於六角狀、一字狀及十字狀所組成之群組。In one embodiment, the adjusting unit has a card slot at one end away from the carrying post, and the card slot is shaped from a group consisting of a hexagon, a shape, and a cross.
於一實施例中，該承載柱設置於該容置槽內，且該研磨顆粒受該彈性擋止件的阻擋而部分突出於該容置槽外。In one embodiment, the carrier post is disposed in the accommodating groove, and the abrasive particles are partially blocked from the accommodating groove by the elastic stopper.
於一實施例中，該突出高度小於該研磨顆粒的一高度。In one embodiment, the protruding height is less than a height of the abrasive particles.
綜上所述，本發明相較於習知技藝可達到之功效在於，本發明係利用該調整單元來調整該研磨顆粒的該尖端突出於該開口的該突出高度，於使用過程中，當部分或特定的該研磨顆粒群磨耗到一定程度，可藉由該調整單元調整該突出高度，以提供高度補償，維持修整器的效能；其次，縱使在生產完成後、使用過程中或是依據不同的應用需求，皆可彈性地調整該突出高度，且因設置有該彈性擋止件，該研磨單元以及該調整單元係受該彈性擋止件的阻擋，當於修整過程中，該研磨單元以及該調整單元將不易脫落，使修整時的穩定性提高；另因設置該緩衝單元於該容置槽中，當該研磨顆粒接觸待修整工件時，可以提供緩衝效果以降低損壞率。又，由於該研磨單元與該調整單元係以獨立方式設置，故當特定的該研磨單元磨耗或損壞時，只要單獨更換該研磨單元即可，大幅降低成本。In summary, the present invention achieves an effect comparable to the prior art in that the present invention utilizes the adjustment unit to adjust the protruding height of the tip of the abrasive particle protruding from the opening, during use, when the portion Or the specific abrasive particle group is worn to a certain extent, and the protruding height can be adjusted by the adjusting unit to provide height compensation to maintain the performance of the dresser; secondly, even after the production is completed, during use, or according to different The application height can flexibly adjust the protruding height, and the polishing unit and the adjusting unit are blocked by the elastic blocking member due to the provision of the elastic stopping member, and the polishing unit and the polishing unit during the trimming process The adjusting unit will not be easily detached, so that the stability during trimming is improved; and because the buffer unit is disposed in the accommodating groove, when the abrasive particles contact the workpiece to be trimmed, a buffering effect can be provided to reduce the damage rate. Moreover, since the polishing unit and the adjustment unit are disposed in an independent manner, when the specific polishing unit is worn or damaged, the polishing unit can be separately replaced, thereby greatly reducing the cost.
有關本發明的詳細說明及技術內容，現就配合圖式說明如下：The detailed description and technical content of the present invention will now be described as follows:
請搭配參閱『圖1』至『圖3』所示，分別為本發明一實施例中該化學機械研磨修整器俯視示意圖、『圖1』的A-A方向剖面示意圖以及本發明一實施例的結構分解示意圖，本發明為一種可調整研磨顆粒突出高度之化學機械研磨修整器，包括一基座10、複數個研磨單元20、複數個緩衝單元30以及複數個調整單元40，該基座10具有一上表面101、複數個容置槽102以及複數個擋止壁103，該容置槽102貫穿於該上表面101且具有一第一內徑，分別包括一鄰近該上表面101的開口1021以及一遠離該上表面101的螺紋壁1022，該擋止壁103凸設於該容置槽102的該開口1021處且具有一小於該第一內徑的第二內徑，於本發明之一實施例中，該基座10的材質為不鏽鋼、金屬材料、塑膠材料、陶瓷材料或上述組合。Please refer to FIG. 1 to FIG. 3 for a schematic plan view of the chemical mechanical polishing dresser, a cross-sectional view of the AA direction of FIG. 1 and a structural decomposition of an embodiment of the present invention. The present invention is a chemical mechanical polishing dresser capable of adjusting the protruding height of the abrasive particles, comprising a base 10, a plurality of grinding units 20, a plurality of buffer units 30, and a plurality of adjusting units 40 having an upper portion The surface 101, the plurality of accommodating grooves 102, and the plurality of blocking walls 103, the accommodating groove 102 penetrates the upper surface 101 and has a first inner diameter, respectively including an opening 1021 adjacent to the upper surface 101 and a distance a threaded wall 1022 of the upper surface 101, the blocking wall 103 is protruded from the opening 1021 of the receiving groove 102 and has a second inner diameter smaller than the first inner diameter. In an embodiment of the invention The base 10 is made of stainless steel, a metal material, a plastic material, a ceramic material or a combination thereof.
該研磨單元20容置於該容置槽102，分別包括一承載柱21以及一設置於該承載柱21上的研磨顆粒22，該研磨顆粒22具有一突出該開口1021的尖端221以及一自該尖端221朝該承載柱21延伸的擴大部222，該研磨顆粒22可選用人造鑽石、天然鑽石、多晶鑽石或立方氮化硼。於本發明一實施例中，該承載柱21的材質可為不鏽鋼、金屬材料、塑膠材料、陶瓷材料或上述組合。於本實施例中，該研磨單元20更包括一結合層23，形成於該承載柱21與該研磨顆粒22之間且將該研磨顆粒22固定於該承載柱21上，該結合層23的材料可為陶瓷材料、硬焊材料、電鍍材料、金屬材料或高分子材料，其中，該硬焊材料可為鐵、鈷、鎳、鉻、錳、矽、鋁、硼、碳之金屬或合金，於一實施例中，該硬焊材料可採用Nicrobraz LM之合金，其成分為7 wt.%的Cr，3.1 wt.%的B，4.5 wt.%的Si，3.0 wt.%的Fe，0.06 wt%的C，其餘為Ni；該高分子材料可為環氧樹脂、聚脂樹脂、聚丙烯酸樹脂或酚醛樹脂。於本發明中，該基座10以及該承載柱21較佳地為不鏽鋼材料，但本發明並不以此為限，使用者可依需求而變化。The grinding unit 20 is received in the accommodating groove 102, and includes a bearing column 21 and an abrasive particle 22 disposed on the bearing column 21. The abrasive particle 22 has a tip 221 protruding from the opening 1021 and a The tip 221 extends toward the enlarged portion 222 of the carrier post 21, and the abrasive particles 22 may be made of synthetic diamond, natural diamond, polycrystalline diamond or cubic boron nitride. In an embodiment of the invention, the material of the supporting post 21 may be stainless steel, metal material, plastic material, ceramic material or the combination thereof. In this embodiment, the polishing unit 20 further includes a bonding layer 23 formed between the carrier column 21 and the abrasive particles 22 and fixed to the carrier column 21, the material of the bonding layer 23. It may be a ceramic material, a brazing material, a plating material, a metal material or a polymer material, wherein the brazing material may be iron, cobalt, nickel, chromium, manganese, lanthanum, aluminum, boron, carbon metal or alloy, In one embodiment, the brazing material may be a Nicrobraz LM alloy having a composition of 7 wt.% Cr, 3.1 wt.% B, 4.5 wt.% Si, 3.0 wt.% Fe, 0.06 wt%. C, the rest is Ni; the polymer material may be epoxy resin, polyester resin, polyacrylic resin or phenolic resin. In the present invention, the base 10 and the support post 21 are preferably made of stainless steel, but the invention is not limited thereto, and the user can change according to requirements.
該緩衝單元30容置於該容置槽102，包括一設置於該開口1021的彈性擋止件31，該彈性擋止件31具有一中空，該中空的內徑介於該尖端221和該擴大部222之間。於本實施例中，該研磨單元20的該研磨顆粒22穿設於該彈性擋止件31的該中空，以使該彈性擋止件31受該擋止壁103壓制而固定於該承載柱21和該擋止壁103之間。有關該彈性擋止件31的設置方式，本發明並不以前述為限，舉例來說，於另一實施例中，可於該容置槽102靠近該開口1021的位置設置一凹槽，使該彈性擋止件31的一外環部固設於該凹槽內；於另一實施例中，可透過一黏著劑將該彈性擋止件31的該外環部黏合於該容置槽102靠近該開口1021的位置。此外，於本實施例中，該緩衝單元30更包括一彈性緩衝件32，設置於該承載柱21與該調整單元40之間，其中該彈性擋止件31可為一橡膠O形環(O-ring)，該彈性緩衝件32可為一矽膠墊。The buffer unit 30 is received in the accommodating groove 102, and includes a resilient stop member 31 disposed on the opening 1021. The elastic stop member 31 has a hollow shape, and the hollow inner diameter is between the tip end 221 and the enlarged portion. Between the sections 222. In the present embodiment, the abrasive particles 22 of the polishing unit 20 are disposed in the hollow of the elastic stopper 31 so that the elastic stopper 31 is pressed by the stopper wall 103 and fixed to the bearing post 21 . And the stop wall 103. The present invention is not limited to the above, and in another embodiment, a groove may be disposed at a position of the receiving groove 102 near the opening 1021. An outer ring portion of the elastic stop member 31 is fixed in the groove. In another embodiment, the outer ring portion of the elastic stop member 31 is adhered to the receiving groove 102 through an adhesive. Close to the position of the opening 1021. In addition, in the embodiment, the buffer unit 30 further includes an elastic buffering member 32 disposed between the supporting post 21 and the adjusting unit 40, wherein the elastic blocking member 31 can be a rubber O-ring (O -ring), the elastic buffer member 32 can be a rubber pad.
該調整單元40容置於該容置槽102的底部，包括一螺絲件41，該螺絲件41和該螺紋壁1022螺合並承載該承載柱21以調整該尖端221突出至遠離該上表面101的一突出高度，其中該突出高度為介於10μm至500μm之間，該突出高度小於該研磨顆粒22的一高度。於本實施例中，該螺絲件41遠離該承載柱21的一端具有一卡槽，該卡槽的形狀可為六角狀、一字狀或十字狀，藉此使用者可利用工具***該卡槽而轉動該螺絲件41。The adjusting unit 40 is received at the bottom of the receiving slot 102 and includes a screw member 41. The screw member 41 and the threaded wall 1022 are screwed together to carry the carrying post 21 to adjust the tip 221 to protrude away from the upper surface 101. A protruding height, wherein the protruding height is between 10 μm and 500 μm, the protruding height being less than a height of the abrasive particles 22. In this embodiment, the screw member 41 has a card slot at one end away from the support post 21, and the slot can be hexagonal, flat or cross-shaped, so that the user can insert the slot by using a tool. The screw member 41 is rotated.
請搭配參閱『圖4』及『圖5』所示，分別為本發明一實施例中該研磨顆粒具有該第一突出高度的示意圖以及本發明一實施例中該研磨顆粒具有該第二突出高度的示意圖，在組裝完成後，可將該螺絲件41往該開口1021的方向移動，推動該承載柱21向上，使該研磨顆粒22的該尖端221穿過該彈性擋止件31，其中，該研磨顆粒22將受該彈性擋止件31的阻擋而部分突出一第一突出高度h1於該容置槽102外，如『圖4』所示；欲再調整該突出高度時，讓該螺絲件41往該開口1021的方向進一步移動，使該彈性擋止件31和該彈性緩衝件32的厚度壓縮，而令該尖端221於該上表面101突出一第二突出高度h2，如『圖5』所示。於實際應用，可由一荷重控制來決定每一個該研磨顆粒22的該尖端221於該上表面101所突出的該突出高度，例如控制該調整單元40的鎖合磅數。Referring to FIG. 4 and FIG. 5, respectively, the abrasive particles have the first protruding height in an embodiment of the invention, and the abrasive particles have the second protruding height in an embodiment of the invention. After the assembly is completed, the screw member 41 can be moved toward the opening 1021 to push the carrier column 21 upward, so that the tip end 221 of the abrasive particle 22 passes through the elastic stopper 31. The abrasive particles 22 are partially blocked by the elastic stopper 31 and protruded from the accommodating groove 102 by a first protruding height h1 as shown in FIG. 4; when the protruding height is to be adjusted, the screw member is allowed to be adjusted. 41 further moving in the direction of the opening 1021 to compress the thickness of the elastic stop member 31 and the elastic buffering member 32, so that the tip end 221 protrudes from the upper surface 101 by a second protruding height h2, as shown in FIG. Shown. In practical applications, the protrusion height of the tip end 221 of each of the abrasive particles 22 protruding from the upper surface 101 can be determined by a load control, for example, controlling the locking pounds of the adjustment unit 40.
請搭配參閱『圖6』及『圖7』所示，分別為本發明一實施例中該研磨顆粒磨耗後的示意圖以及本發明一實施例中補償磨耗後該研磨顆粒高度的示意圖，於研磨過程中該些研磨顆粒22會有磨耗的產生，以『圖4』之實施例作為基礎，部分的該研磨顆粒22的該尖端221於該上表面101所突出的該第一突出高度h1被磨耗至一第三突出高度h3，該第三突出高度h3小於該第一突出高度h1，如『圖6』所示。此時修整效率將因該些研磨顆粒22具有突出高度差異而受影響，藉由控制該螺絲件41以調整該尖端221的該突出高度，使磨耗較多的該些研磨顆粒22的該尖端221的該第三突出高度h3再次調整至該第一突出高度h1，如『圖7』所示。Please refer to FIG. 6 and FIG. 7 for a schematic view of the abrasive particles after abrasion according to an embodiment of the present invention and a schematic diagram of the height of the abrasive particles after compensation for wear in an embodiment of the present invention. The abrasive particles 22 have wear due to the embodiment of FIG. 4, and the first protruding height h1 of the tip end 221 of the abrasive particle 22 protruding from the upper surface 101 is worn to a third protruding height h3, the third protruding height h3 is smaller than the first protruding height h1, as shown in FIG. At this time, the trimming efficiency will be affected by the difference in the protruding height of the abrasive particles 22. By controlling the screw member 41 to adjust the protruding height of the tip 221, the tip 221 of the abrasive particles 22 which is more worn is made. The third protruding height h3 is adjusted again to the first protruding height h1 as shown in FIG.
綜上所述，由於該調整單元可調整該研磨顆粒的該尖端突出於該開口的該突出高度，於使用過程中，當部分或特定的該研磨顆粒群磨耗到一定程度，可藉由該調整單元調整該突出高度，以提供高度補償，維持修整器的功能；且縱使在生產完成後、使用過程中或是依據不同的應用需求，皆可彈性地調整該突出高度，且因設置有該彈性擋止件，該研磨單元以及該調整單元係受該彈性擋止件的阻擋，當於修整過程中，該研磨單元以及該調整單元將不易脫落，使修整時的穩定性提高，另因設置該緩衝單元於該容置槽中，當該研磨顆粒接觸待修整工件時，可以提供緩衝效果以降低損壞率，且該緩衝單元使該研磨單元穩固地保持在該容置槽內，可防止該研磨單元研磨時產生一自轉效應而脫落，另一方面，該緩衝單元更提供該調整單元對該研磨單元推進時的緩衝效果，以使該研磨單元具有微調的功效。又，由於該研磨單元與該調整單元係以獨立方式設置，故當特定的該研磨單元磨耗或損率時，只要單獨更換該研磨單元即可，大幅降低耗材成本。In summary, since the adjusting unit can adjust the protruding height of the tip of the abrasive particle to the opening, during the use, when a part or a specific group of the abrasive particles is worn to a certain extent, the adjustment can be adopted. The unit adjusts the protruding height to provide height compensation to maintain the function of the trimmer; and even if the production is completed, during use, or according to different application requirements, the protruding height can be flexibly adjusted, and the elasticity is set a stopper, the grinding unit and the adjusting unit are blocked by the elastic stopper, and during the trimming process, the grinding unit and the adjusting unit are not easy to fall off, thereby improving stability during trimming, and The buffer unit is disposed in the accommodating groove, and when the abrasive particles contact the workpiece to be trimmed, a buffering effect may be provided to reduce the damage rate, and the buffer unit securely holds the grinding unit in the accommodating groove to prevent the grinding When the unit is ground, a self-rotation effect is generated and falls off. On the other hand, the buffer unit further provides buffering when the adjusting unit advances the grinding unit. Fruit, so that the polishing unit has a trimming effect. Moreover, since the polishing unit and the adjustment unit are disposed independently, when the polishing unit is worn or damaged at a specific rate, the polishing unit can be separately replaced, thereby greatly reducing the cost of consumables.
以上已將本發明做一詳細說明，惟以上所述者，僅爲本發明的一較佳實施例而已，當不能限定本發明實施的範圍。即凡依本發明申請範圍所作的均等變化與修飾等，皆應仍屬本發明的專利涵蓋範圍內。The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.
10‧‧‧基座10‧‧‧ Pedestal
101‧‧‧上表面101‧‧‧ upper surface
102‧‧‧容置槽102‧‧‧ accommodating slots
103‧‧‧擋止壁103‧‧‧stop wall
1021‧‧‧開口1021‧‧‧ openings
1022‧‧‧螺紋壁1022‧‧‧Threaded wall
20‧‧‧研磨單元20‧‧‧grinding unit
21‧‧‧承載柱21‧‧‧Loading column
22‧‧‧研磨顆粒22‧‧‧Abrasive particles
221‧‧‧尖端221‧‧‧ tip
222‧‧‧擴大部222‧‧‧Expanding Department
23‧‧‧結合層23‧‧‧Combination layer
30‧‧‧緩衝單元30‧‧‧buffer unit
31‧‧‧彈性擋止件31‧‧‧Flexible stop
32‧‧‧彈性緩衝件32‧‧‧Elastic cushioning parts
40‧‧‧調整單元40‧‧‧Adjustment unit
41‧‧‧螺絲件41‧‧‧Screws
h1‧‧‧第一突出高度H1‧‧‧first protruding height
h2‧‧‧第二突出高度H2‧‧‧second protruding height
h3‧‧‧第三突出高度H3‧‧‧third protruding height
『圖1』，為本發明一實施例中，該化學機械研磨修整器俯視示意圖。 『圖2』，為『圖1』的A-A方向剖面示意圖。 『圖3』，為本發明一實施例的結構分解示意圖。 『圖4』，為本發明一實施例中，該研磨顆粒具有該第一突出高度的示意圖。 『圖5』，為本發明一實施例中，該研磨顆粒具有該第二突出高度的示意圖。 『圖6』，為本發明一實施例中，該研磨顆粒磨耗後的示意圖。 『圖7』，為本發明一實施例中，補償磨耗後該研磨顆粒高度的示意圖。FIG. 1 is a schematic plan view of the chemical mechanical polishing conditioner according to an embodiment of the present invention. "Fig. 2" is a schematic cross-sectional view of the A-A direction of Fig. 1. FIG. 3 is a schematic exploded view of an embodiment of the present invention. FIG. 4 is a schematic view showing the first protruding height of the abrasive particles according to an embodiment of the present invention. FIG. 5 is a schematic view showing the second protruding height of the abrasive particles according to an embodiment of the invention. FIG. 6 is a schematic view showing the abrasive particles after abrasion according to an embodiment of the present invention. FIG. 7 is a schematic view of the height of the abrasive particles after the abrasion in an embodiment of the present invention.
10‧‧‧基座 10‧‧‧ Pedestal
101‧‧‧上表面 101‧‧‧ upper surface
102‧‧‧容置槽 102‧‧‧ accommodating slots
103‧‧‧擋止壁 103‧‧‧stop wall
1021‧‧‧開口 1021‧‧‧ openings
1022‧‧‧螺紋壁 1022‧‧‧Threaded wall
20‧‧‧研磨單元 20‧‧‧grinding unit
21‧‧‧承載柱 21‧‧‧Loading column
22‧‧‧研磨顆粒 22‧‧‧Abrasive particles
221‧‧‧尖端 221‧‧‧ tip
222‧‧‧擴大部 222‧‧‧Expanding Department
23‧‧‧結合層 23‧‧‧Combination layer
30‧‧‧緩衝單元 30‧‧‧buffer unit
31‧‧‧彈性擋止件 31‧‧‧Flexible stop
32‧‧‧彈性緩衝件 32‧‧‧Elastic cushioning parts
40‧‧‧調整單元 40‧‧‧Adjustment unit
41‧‧‧螺絲件 41‧‧‧Screws
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105125283A TWI590914B (en) | 2016-08-09 | 2016-08-09 | A chemical mechanical polishing dresser to adjust the height of the abrasive particles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105125283A TWI590914B (en) | 2016-08-09 | 2016-08-09 | A chemical mechanical polishing dresser to adjust the height of the abrasive particles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI590914B true TWI590914B (en) | 2017-07-11 |
| TW201805118A TW201805118A (en) | 2018-02-16 |
Family
ID=60048571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105125283A TWI590914B (en) | 2016-08-09 | 2016-08-09 | A chemical mechanical polishing dresser to adjust the height of the abrasive particles |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI590914B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107469990A (en) * | 2017-09-30 | 2017-12-15 | 犹银俊 | Multi-functional grinding rod and lapping device |
| CN109514434A (en) * | 2018-12-25 | 2019-03-26 | 上海致领半导体科技发展有限公司 | A kind of polishing pad trimmer of adjustable polishing pad face type |
-
2016
- 2016-08-09 TW TW105125283A patent/TWI590914B/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107469990A (en) * | 2017-09-30 | 2017-12-15 | 犹银俊 | Multi-functional grinding rod and lapping device |
| CN109514434A (en) * | 2018-12-25 | 2019-03-26 | 上海致领半导体科技发展有限公司 | A kind of polishing pad trimmer of adjustable polishing pad face type |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201805118A (en) | 2018-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8298048B2 (en) | CMP pad dresser with oriented particles and associated methods | |
| TWI228066B (en) | Abrasive cloth dresser and method for dressing an abrasive cloth with the same | |
| JP4965071B2 (en) | Abrasive tools for grinding electronic components | |
| JP6408600B2 (en) | Electric sharpener for ceramic and metal blades | |
| JP2007044823A (en) | Cmp pad conditioner in semiconductor planarization cmp process (chemical-mechanical polishing) | |
| TWI580524B (en) | Chemical mechanical polishing conditioner with high performance and method for manufacturing the same | |
| TWI590914B (en) | A chemical mechanical polishing dresser to adjust the height of the abrasive particles | |
| JP2007044824A (en) | Cmp pad conditioner in semiconductor planarization cmp process | |
| TWM481093U (en) | Chemical mechanical polishing trimmer with adjustable tip height | |
| TWM513087U (en) | Flattened combinational chemical mechanical polishing dresser | |
| KR101906224B1 (en) | Griding device for exchanging giriding element | |
| TWI383860B (en) | Modular dresser | |
| JP2000301468A (en) | Grinding wheel for grinding and grinding wheel for vertical line grinding | |
| JP2005224892A (en) | Polishing method | |
| TW562719B (en) | Conditioning pad allowing individual tuning of particles | |
| US20060068691A1 (en) | Abrading tools with individually controllable grit and method of making the same | |
| KR100552912B1 (en) | Diamond tools | |
| TWI621502B (en) | Double chemical mechanical polishing trimming system and method thereof | |
| KR20080062660A (en) | Wheel used for polishing edge part of semiconductor wafer | |
| KR101877138B1 (en) | Assembly type polishing pad | |
| KR200400193Y1 (en) | Use diamond Wheel paper of grinder | |
| TWI306048B (en) | ||
| JPS63216676A (en) | Abrasive grain body | |
| TW586988B (en) | Retaining ring for chemical-mechanical polishing | |
| TW202009101A (en) | Polishing pad dresser and chemical mechanical planarization method capable of prolonging CMP consumable service life to reduce cost, accelerate CMP efficiency, and increase production capacity |