TWI589058B - An antenna apparatus and manufacturing method thereof - Google Patents
An antenna apparatus and manufacturing method thereof Download PDFInfo
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- TWI589058B TWI589058B TW099114389A TW99114389A TWI589058B TW I589058 B TWI589058 B TW I589058B TW 099114389 A TW099114389 A TW 099114389A TW 99114389 A TW99114389 A TW 99114389A TW I589058 B TWI589058 B TW I589058B
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Description
本發明係有關於一種天線裝置及其製作方法，尤指一種可避免化學鍍之金屬層沈積於部分裸露於該塑膠本體之金屬片的天線裝置及其製作方法。The invention relates to an antenna device and a manufacturing method thereof, in particular to an antenna device capable of avoiding deposition of a metal layer of electroless plating on a metal piece partially exposed on the plastic body and a manufacturing method thereof.
塑料係大量地運用於電子產品之外殼，其優勢在於易於成型，且可大量生產。例如，可攜式電子裝置的外殼大多均係利用塑料所製造。Plastics are widely used in the outer casing of electronic products, and have the advantages of being easy to mold and mass-produced. For example, most of the housings of portable electronic devices are made of plastic.
然而，隨著電子產品的尺寸日益縮小，其外殼的厚度也隨著減小，因此，為了提高塑料外殼的結構強度，目前大多在塑料外殼中嵌合有金屬片，以提升塑料外殼抵抗外力衝擊之強度。However, as the size of electronic products is shrinking, the thickness of the outer casing is also reduced. Therefore, in order to improve the structural strength of the plastic outer casing, metal sheets are often embedded in the plastic outer casing to enhance the plastic outer casing against external impact. Strength.
例如，中華民國專利公開號第200917570號，其揭露一種無線傳輸裝置之防護外殼，該防護外殼中即包含多個金屬片，以提高防護外殼的強度。除此之外，上述570號公開專利中亦揭露在防護外殼中設有多個金屬片更可具有以下優點：(1)可用以做為裝飾性的特徵；(2)可用以做為功能性特徵，例如金屬材質之按鈕等；換言之，上述金屬片在結構上會裸露於該防護外殼，以達成金屬光澤之裝飾性或操作介面之按鍵功能。For example, the Republic of China Patent Publication No. 200917570 discloses a protective casing for a wireless transmission device, which includes a plurality of metal sheets to increase the strength of the protective casing. In addition, the above-mentioned publication No. 570 discloses that providing a plurality of metal sheets in the protective casing has the following advantages: (1) can be used as a decorative feature; (2) can be used as a function. Features, such as metal buttons, etc.; in other words, the metal sheet is structurally exposed to the protective casing to achieve a metallic luster decorative or operational interface button function.
再一方面，雷射直接成型技術(laser-direct-structuring，LDS)已逐漸應用於塑料外殼上之線路的製作。雷射直接成型的製作流程係為；首先提供一射出模造之外殼，該外殼係利用一次射出成型將熱塑性材料加以固化成型；接著，以雷射於該外殼的內壁面形成活化區域，該活化區域會具有金屬化的活化核心，亦即，該活化區域的活化核心可用以催化物理或化學反應；接下來，利用一金屬化製程，例如化學鍍，將金屬形成於上述之活化區域，以形成線路。On the other hand, laser-direct-structuring (LDS) has been gradually applied to the fabrication of circuits on plastic housings. The laser direct molding process is first; firstly, an injection molded outer casing is provided, which is formed by solidifying a thermoplastic material by one injection molding; then, an activation region is formed by laser exposure on the inner wall surface of the outer casing, and the activation region is formed. There will be a metallized activated core, that is, the activated core of the activated region can be used to catalyze a physical or chemical reaction; next, a metallization process, such as electroless plating, is used to form a metal in the activated region to form a line. .
因此，當利用具有金屬片的塑料外殼進行上述雷射直接成型製程時，由於化學鍍中的金屬離子會在裸露於塑料外殼之金屬片的表面產生還原反應，致使裸露於塑料外殼之金屬片的表面上會沈積化學鍍之金屬層，而造成以下問題：Therefore, when the above-described laser direct forming process is performed using a plastic case having a metal piece, since the metal ions in the electroless plating cause a reduction reaction on the surface of the metal piece exposed on the plastic case, the metal piece exposed to the plastic case is caused. Electroless plating of metal layers is deposited on the surface, causing the following problems:
(1)化學鍍之金屬層與裸露於塑料外殼之金屬片的表面之間附著力不佳，故沈積之金屬層會由金屬片的表面上剝離、脫落，而導致金屬顆粒、粉末會散佈在電子產品的內部空間，該些金屬顆粒、粉末即可能會導致電子產品內部的電路板之線路發生短路的情況。(1) The adhesion between the metal layer of the electroless plating and the surface of the metal piece exposed to the plastic outer casing is not good, so the deposited metal layer will be peeled off and peeled off from the surface of the metal piece, and the metal particles and powder will be scattered. The internal space of the electronic product, which may cause a short circuit of the circuit board inside the electronic product.
(2)如上述(1)之觀點，化學鍍之金屬層與裸露於塑料外殼之金屬片的表面之間附著力不佳，故化學鍍之金屬層會形成皺摺、粗糙或剝離的表面，導致金屬片失去裝飾性的功能。(2) According to the above (1), the adhesion between the metal layer of the electroless plating and the surface of the metal piece exposed to the plastic outer casing is poor, so that the metal layer of the electroless plating may form a wrinkled, rough or peeled surface. The function of causing the metal piece to lose its decorative properties.
本案發明人有鑑於上述習用的技術於實際施用時的缺失，且積累個人從事相關產業開發實務上多年之經驗，精心研究，終於提出一種設計合理且有效改善上述問題之結構。The inventor of the present invention has made a structure that is reasonable in design and effective in improving the above problems, in view of the lack of the above-mentioned conventional technology in actual application, and accumulating the experience of individuals engaged in relevant industry development practice for many years.
本發明之主要目的，在於提供一種天線裝置及其製作方法，其係利用電鍍之逆反應的概念，將外接電源之正極連接至埋設而部分裸露於塑膠本體之金屬片，以加載正電壓於該金屬片，故可避免進行金屬層之化學鍍時將金屬材料沈積於上述金屬片之裸露部分上所造成的問題；換言之，部分裸露於該塑膠本體之金屬片不會沈積有化學鍍之金屬層，故金屬片仍可保持其裝飾性，再者，本發明亦可解決先前技術所提及之剝離之金屬層所導致的電路短路問題。The main object of the present invention is to provide an antenna device and a manufacturing method thereof, which use the concept of reverse reaction of electroplating to connect the positive electrode of the external power source to the metal piece buried in the plastic body to load a positive voltage on the metal. The sheet, so that the problem of depositing the metal material on the exposed portion of the metal sheet during the electroless plating of the metal layer can be avoided; in other words, the metal sheet partially exposed on the plastic body does not deposit the electroless metal layer. Therefore, the metal sheet can still maintain its decorative property. Moreover, the present invention can also solve the circuit short circuit problem caused by the peeled metal layer mentioned in the prior art.
為了達到上述目的，本發明係提供一種天線裝置，包含：一塑膠本體，其上具有一天線圖案；一金屬片，其係埋設於該塑膠本體以形成一殼體件，且該金屬片係部分裸露於該塑膠本體；以及一金屬層，其係利用化學鍍沈積於該天線圖案以形成天線；其中，在該金屬層之化學鍍沈積時，部分裸露於該塑膠本體之該金屬片係連接於一電源之正極，以載入正電壓於該金屬片，進而避免該金屬層沈積於該金屬片之表面。In order to achieve the above object, the present invention provides an antenna device comprising: a plastic body having an antenna pattern thereon; a metal sheet embedded in the plastic body to form a housing member, and the metal sheet portion Exposed to the plastic body; and a metal layer deposited on the antenna pattern by electroless plating to form an antenna; wherein, during electroless deposition of the metal layer, the metal sheet partially exposed to the plastic body is connected to A positive electrode of the power source is loaded with a positive voltage on the metal sheet to prevent the metal layer from being deposited on the surface of the metal sheet.
本發明更提供一種天線裝置的製作方法，包含以下步驟：步驟一：利用埋入模鑄(insert molding)將一金屬片埋設於一塑膠本體，且使該金屬片部分裸露於該塑膠本體以形成一殼體件；步驟二：在該塑膠本體上成型一可供沈積金屬之天線圖案；以及步驟三：將該殼體件置入一具有金屬離子之化學鍍液中，使金屬離子還原且沈積於該天線圖案上，以成型一金屬層之天線；同時，提供一電源，並將該電源之正極連接至部分裸露於該塑膠本體之該金屬片，及將該電源之負極連接至位於化學鍍液中之電極，以載入正電壓於該金屬片，進而避免金屬離子所還原之該金屬層沈積於該金屬片之表面。The present invention further provides a method for fabricating an antenna device, comprising the steps of: step 1: embedding a metal piece in a plastic body by insert molding, and exposing the metal piece to the plastic body to form a housing member; step 2: forming an antenna pattern for depositing metal on the plastic body; and step 3: placing the housing member in an electroless plating solution with metal ions to reduce and deposit metal ions Forming a metal layer antenna on the antenna pattern; at the same time, providing a power source, connecting the anode of the power source to the metal piece partially exposed to the plastic body, and connecting the negative electrode of the power source to the electroless plating The electrode in the liquid is loaded with a positive voltage on the metal sheet, thereby preventing the metal layer reduced by the metal ions from depositing on the surface of the metal sheet.
本發明具有以下有益的效果：利用外接電源提供正電壓於部分裸露於該塑膠本體之該金屬片，使化學鍍之金屬離子進行還原反應時，僅沈積於該塑膠本體上之天線圖案，而不會沈積於上述部分裸露於該塑膠本體之該金屬片，故可保持該金屬片所提供之裝飾性態樣，亦可避免化學鍍所沈積之金屬層與金屬片之間的附著力問題所衍生出之電路短路等缺失。The invention has the following beneficial effects: using an external power source to provide a positive voltage to the metal piece partially exposed on the plastic body, so that when the metal ion of the electroless plating is subjected to a reduction reaction, only the antenna pattern deposited on the plastic body is The metal piece exposed on the plastic body is deposited on the metal body, so that the decorative state provided by the metal piece can be maintained, and the problem of adhesion between the metal layer and the metal piece deposited by electroless plating can be avoided. The short circuit of the circuit is missing.
為使能更進一步瞭解本發明之特徵及技術內容，請參閱以下有關本發明之詳細說明與附圖，然而所附圖式僅提供參考與說明用，並非用來對本發明加以限制者。For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.
本發明提出一種天線裝置及其製作方法，其可解決傳統製程將化學鍍之金屬層沈積於埋設於塑膠本體中之金屬片的裸露部分所導致的問題，例如化學鍍所沈積之金屬層與金屬片間的附著性不佳，而使金屬層脫落導致電路短路或裝置內部污染的問題等等。The invention provides an antenna device and a manufacturing method thereof, which can solve the problems caused by depositing a metal layer of electroless plating on a bare portion of a metal piece buried in a plastic body in a conventional process, such as metal layer and metal deposited by electroless plating. The adhesion between the sheets is not good, and the metal layer is peeled off to cause a short circuit of the circuit or a problem of internal contamination of the apparatus.
本發明之第一具體實施例之天線裝置的製作方法包括以下步驟：。A method of fabricating an antenna device according to a first embodiment of the present invention includes the following steps:
首先，在步驟一中，利用埋入模鑄(insert molding)將一金屬片11埋設於一塑膠本體10，且使該金屬片11部分裸露於該塑膠本體10以形成一殼體件1(請配合第一圖所示)。First, in step 1, a metal piece 11 is embedded in a plastic body 10 by insert molding, and the metal piece 11 is partially exposed to the plastic body 10 to form a case member 1 (please Match the first picture).
在本具體實施例中，該殼體件1可為一行動通訊裝置之背蓋，例如行動電話背蓋，但不以上述為限，其係先利用埋入模鑄將金屬片11埋設且裸露於塑膠本體10而成型為上述之行動電話背蓋；換言之，利用埋入模鑄將金屬片11牢固地嵌合於塑膠本體10中，而該金屬片11可為不銹鋼或其他耐腐蝕金屬，以形成具有高強度、具裝飾性、或具有電磁遮蔽效果之殼體件1。In this embodiment, the housing member 1 can be a back cover of a mobile communication device, such as a mobile phone back cover, but not limited to the above, which is to embed and expose the metal sheet 11 by embedding molding. Formed as the above-mentioned mobile phone back cover in the plastic body 10; in other words, the metal piece 11 is firmly fitted into the plastic body 10 by embedding molding, and the metal piece 11 may be stainless steel or other corrosion-resistant metal, A housing member 1 having high strength, decorative, or electromagnetic shielding effect is formed.
另一方面，為了使塑膠本體10可被雷射所改質，以使塑膠本體10上成型可供沈積金屬之天線圖案(請配合第一A圖所示)，該塑膠本體10係為一種含金屬、金屬催化物或其有機物之塑性材料，其可被雷射所改質而形成活化區域，該活化區域具有金屬化的活化核心，因此，該活化區域的活化核心會催化物理或化學反應。On the other hand, in order to make the plastic body 10 be modified by the laser to form the antenna pattern for depositing metal on the plastic body 10 (please cooperate with the first A), the plastic body 10 is a kind of A plastic material of a metal, a metal catalyst or an organic material thereof, which can be modified by a laser to form an activated region having a metalized activated core, whereby the activated core of the activated region catalyzes a physical or chemical reaction.
接著，步驟二係在該塑膠本體10上成型一可供沈積金屬之天線圖案101(請配合第一A圖所示)。具體而言，本步驟係使用雷射將該塑膠本體10之表面的一預定區域改質形成一活化區域(即天線圖案101)，使下一步驟之導電金屬材料得以直接沈積且附著於該塑膠本體10之活化區域上以形成可接收訊號之天線。值得注意的是，該天線圖案101與該金屬片11係不相接觸，以避免後續外加正電壓之步驟影響到化學鍍沈積金屬於天線圖案101上之反應。Next, in step 2, an antenna pattern 101 for depositing metal is formed on the plastic body 10 (please cooperate with the first A diagram). Specifically, in this step, a predetermined area of the surface of the plastic body 10 is modified by laser to form an active area (ie, the antenna pattern 101), so that the conductive metal material of the next step is directly deposited and attached to the plastic. An active area of the body 10 is formed to form an antenna that can receive signals. It should be noted that the antenna pattern 101 is not in contact with the metal sheet 11 to avoid the subsequent step of applying a positive voltage to affect the reaction of the electroless plating metal on the antenna pattern 101.
接下來，請參考第一B圖，並配合第四圖所示，步驟三係將該殼體件1置入一具有金屬離子之化學鍍液40中，使金屬離子還原且沈積於該天線圖案101上，以成型一金屬層12之天線；同時，提供一電源30，並將該電源之正極連接至部分裸露於該塑膠本體10之該金屬片11，及將該電源30之負極連接至位於化學鍍液40中之電極301，以載入正電壓於該金屬片11，進而避免金屬離子所還原之該金屬層12沈積於該金屬片11之表面。Next, please refer to the first B diagram, and in conjunction with the fourth figure, in the third step, the housing member 1 is placed in an electroless plating solution 40 having metal ions, and the metal ions are reduced and deposited on the antenna pattern. 101, to form an antenna of a metal layer 12; at the same time, a power source 30 is provided, and the anode of the power source is connected to the metal sheet 11 partially exposed to the plastic body 10, and the cathode of the power source 30 is connected to the anode The electrode 301 in the electroless plating solution 40 is loaded with a positive voltage on the metal sheet 11, thereby preventing the metal layer 12 reduced by the metal ions from being deposited on the surface of the metal sheet 11.
藉此，本步驟係利用金屬沈積技術，例如化學鍍(亦稱無電鍍，electroless plating)，使導電金屬材料得以直接沈積附著於該塑膠本體10之天線圖案101上，以形成可接收訊號之金屬層12之天線。例如，化學鍍液40可至少包含有銅離子，故可沈積銅之金屬層12，以形成接收訊號之天線；又例如，化學鍍液40可至少包含有鎳離子，故可沈積鎳之金屬層12，以形成接收訊號之天線，但不以上述為限。Therefore, in this step, the metal deposition technique, such as electroless plating, is used to deposit the conductive metal material directly on the antenna pattern 101 of the plastic body 10 to form a metal capable of receiving signals. The antenna of layer 12. For example, the electroless plating solution 40 may contain at least copper ions, so that the copper metal layer 12 may be deposited to form an antenna for receiving signals; for example, the electroless plating solution 40 may contain at least nickel ions, so that a metal layer of nickel may be deposited. 12, to form an antenna for receiving signals, but not limited to the above.
再一方面，由於化學鍍液40中之金屬離子在進行還原的過程中，亦會沈積在部分裸露於該塑膠本體10之該金屬片11的表面，故本發明係在化學鍍的過程中利用電源30提供正電壓於部分裸露於該塑膠本體10之該金屬片11，使部分裸露於該塑膠本體10之該金屬片11會產生電鍍之逆反應，具體而言，本發明將該電源30之正極連接至部分裸露於該塑膠本體10之該金屬片11，及將該電源30之負極連接至位於化學鍍液40中之電極301，以載入約0.4V的正電壓至部分裸露於該塑膠本體10之該金屬片11，使沈積在部分裸露於該塑膠本體10之該金屬片11進行一氧化反應，使化學鍍所沈積在部分裸露於該塑膠本體10之該金屬片11表面上的金屬層12，再次還原成離子態，故可保持部分裸露於該塑膠本體10之該金屬片11表面不會沈積有化學鍍所成型之金屬層12。如第四圖所示，本發明可利用支架302一次性地裝配八個殼體件1，並將支架302的末端連接於電源30之正極，藉此可進行批次化的量產作業。On the other hand, since the metal ions in the electroless plating solution 40 are deposited on the surface of the metal sheet 11 partially exposed on the plastic body 10 during the reduction process, the present invention is utilized in the electroless plating process. The power source 30 provides a positive voltage to the metal sheet 11 partially exposed to the plastic body 10, so that the metal sheet 11 exposed to the plastic body 10 may generate a reverse reaction of electroplating. Specifically, the anode of the power source 30 of the present invention is Connecting to the metal piece 11 exposed to the plastic body 10, and connecting the negative electrode of the power source 30 to the electrode 301 located in the electroless plating solution 40 to load a positive voltage of about 0.4V to partially expose the plastic body. The metal sheet 11 of 10 is subjected to an oxidation reaction of the metal sheet 11 deposited on the plastic body 10 to deposit a metal layer partially deposited on the surface of the metal sheet 11 of the plastic body 10. 12, again reduced to an ionic state, so that the metal layer 12 formed by electroless plating is not deposited on the surface of the metal sheet 11 partially exposed to the plastic body 10. As shown in the fourth figure, the present invention can assemble eight housing members 1 at a time using the bracket 302, and connect the ends of the brackets 302 to the positive poles of the power source 30, thereby enabling batch production operations.
因此，本發明之第一具體實施例係利用雷射直接成型技術(laser-direct-structuring，LDS)製作一種天線裝置，換言之，該殼體件1係為一雷射直接成型(LDS)之外殼，其包含一利用埋入模鑄方法所模製成型的塑膠本體10與金屬片11，並以雷射於該塑膠本體10上形成一活化區域(即天線圖案101)，再利用化學鍍方法將金屬材料沈積於該活化區域而形成有一金屬層12之天線；再者，在化學鍍的同時，利用外接電源30將正電壓加載於金屬片11，以避免化學鍍所沈積之金屬覆蓋於金屬片11的表面。Therefore, the first embodiment of the present invention utilizes laser-direct-structuring (LDS) to fabricate an antenna device. In other words, the housing member 1 is a laser direct molding (LDS) housing. The utility model comprises a plastic body 10 and a metal sheet 11 molded by a buried molding method, and an active region (ie, an antenna pattern 101) is formed on the plastic body 10 by laser, and then an electroless plating method is used. Depositing a metal material in the active region to form an antenna having a metal layer 12; further, while electroless plating, a positive voltage is applied to the metal sheet 11 by the external power source 30 to prevent the metal deposited by the electroless plating from covering the metal. The surface of the sheet 11.
本發明之第二具體實施例之天線裝置的製作方法則係利用雙色注塑(2 shot molding，又稱雙料射出成型)將天線圖案101成型於塑膠本體10上，其包括以下步驟：步驟一，同樣可利用埋入模鑄(insert molding)將一金屬片11埋設於一塑膠本體10，且使該金屬片11部分裸露於該塑膠本體10以形成一殼體件1(請配合第一圖所示)，而與第一具體實施例不同之處在於，本步驟所射出成型之塑材係為一種非導體之塑材，且其中不需含有金屬組成，換言之，一般常見的工業塑材均可應用於本步驟中。The antenna device of the second embodiment of the present invention is formed by molding the antenna pattern 101 on the plastic body 10 by two-shot molding (two-shot molding), which includes the following steps: Step 1, the same A metal piece 11 can be embedded in a plastic body 10 by insert molding, and the metal piece 11 is partially exposed to the plastic body 10 to form a casing member 1 (please cooperate with the first figure). The difference from the first embodiment is that the plastic material formed by the step is a non-conductor plastic material, and the metal composition is not required, in other words, the common industrial plastic material can be applied. In this step.
另外，同於第一具體實施例，該殼體件1可為一行動通訊裝置之背蓋，例如行動電話背蓋等。In addition, as in the first embodiment, the housing member 1 can be a back cover of a mobile communication device, such as a mobile phone back cover or the like.
接著，步驟二係在該塑膠本體10上成型一可供沈積金屬之天線圖案101(請配合第一A圖所示)。具體而言，本步驟係利用雙色注塑(2 shot molding)方法將一導電塑材成型於該塑膠本體10上，以形成可供沈積金屬之天線圖案101；換言之，本步驟係利用雙色注塑將導電塑材成型在該塑膠本體10之表面的預定區域，以形成天線圖案101，使下一步驟之導電金屬材料得以直接附著於該塑膠本體10上之天線圖案101上以形成可接收訊號之天線。Next, in step 2, an antenna pattern 101 for depositing metal is formed on the plastic body 10 (please cooperate with the first A diagram). Specifically, in this step, a conductive plastic material is formed on the plastic body 10 by a two-shot molding method to form an antenna pattern 101 for depositing metal; in other words, this step utilizes two-color injection molding to conduct electricity. The plastic material is formed on a predetermined area of the surface of the plastic body 10 to form the antenna pattern 101, so that the conductive metal material of the next step is directly attached to the antenna pattern 101 on the plastic body 10 to form an antenna capable of receiving signals.
另外，同於第一具體實施例，該天線圖案101與該金屬片11係不相接觸，以避免後續外加正電壓之步驟影響到化學鍍沈積金屬於天線圖案101上之反應。In addition, as in the first embodiment, the antenna pattern 101 is not in contact with the metal sheet 11 to prevent the subsequent step of applying a positive voltage to affect the reaction of the electroless plating metal on the antenna pattern 101.
接下來，同樣參考第一B圖與第四圖所示，步驟三係將該殼體件1置入一具有金屬離子(如銅離子或鎳離子)之化學鍍液40中，使金屬離子還原且沈積於該天線圖案101上，以成型一金屬層12之天線；同時，提供一電源30，並將該電源之正極連接至部分裸露於該塑膠本體10之該金屬片11，及將該電源30之負極連接至位於化學鍍液40中之電極301，以載入正電壓於該金屬片11，進而避免金屬離子所還原之該金屬層12沈積於該金屬片11之表面。因此，藉由步驟二所使用之導電塑材，化學鍍液40中之金屬離子可直接沈積附著於該塑膠本體10之天線圖案101上，以形成可接收訊號之金屬層12之天線。再者，在化學鍍的過程中，利用電源30提供正電壓於部分裸露於該塑膠本體10之該金屬片11，使部分裸露於該塑膠本體10之該金屬片11會產生電鍍之逆反應，使化學鍍所沈積在部分裸露於該塑膠本體10之該金屬片11表面上的金屬層12，再次還原成離子態，故可保持部分裸露於該塑膠本體10之該金屬片11表面不會沈積有化學鍍所成型之金屬層12。Next, referring also to the first B and fourth figures, the third step is to place the case member 1 into an electroless plating solution 40 having a metal ion (such as copper ion or nickel ion) to reduce the metal ion. And depositing on the antenna pattern 101 to form an antenna of the metal layer 12; at the same time, providing a power source 30, connecting the anode of the power source to the metal sheet 11 partially exposed to the plastic body 10, and the power source The negative electrode of 30 is connected to the electrode 301 located in the electroless plating solution 40 to load a positive voltage on the metal piece 11, thereby preventing the metal layer 12 reduced by the metal ions from being deposited on the surface of the metal piece 11. Therefore, by using the conductive plastic material used in the second step, the metal ions in the electroless plating solution 40 can be directly deposited on the antenna pattern 101 of the plastic body 10 to form an antenna of the metal layer 12 capable of receiving the signal. In addition, in the process of electroless plating, the power source 30 is used to provide a positive voltage to the metal sheet 11 partially exposed to the plastic body 10, so that the metal sheet 11 exposed to the plastic body 10 may cause a reverse reaction of electroplating. The metal layer 12 deposited on the surface of the metal piece 11 exposed to the plastic body 10 is further reduced to an ionic state, so that the surface of the metal piece 11 exposed to the plastic body 10 is not deposited. The metal layer 12 is formed by electroless plating.
因此，本發明之第二具體實施例係利用雙色注塑(2 shot molding)技術製作一種天線裝置，換言之，該殼體件1包含一利用埋入模鑄方法所模製成型的塑膠本體10與金屬片11，並利用雙色注塑將另一導電塑材成型於該塑膠本體10上以形成天線圖案101；再利用化學鍍方法將金屬材料沈積於該活化區域而形成有一金屬層12之天線；再者，在化學鍍的同時，利用外接電源30將正電壓加載於金屬片11，以避免化學鍍所沈積之金屬覆蓋於金屬片11的表面。Therefore, the second embodiment of the present invention utilizes a two-shot molding technique to fabricate an antenna device. In other words, the housing member 1 includes a plastic body 10 molded by a buried molding method. a metal sheet 11 and molding another conductive plastic material on the plastic body 10 by two-color injection molding to form an antenna pattern 101; and then depositing a metal material in the active region by an electroless plating method to form an antenna having a metal layer 12; At the same time as the electroless plating, a positive voltage is applied to the metal piece 11 by the external power source 30 to prevent the metal deposited by the electroless plating from covering the surface of the metal piece 11.
綜上所述，本發明依據上述第一與第二具體實施例的製作方法，製作出一種天線裝置，其包括塑膠本體10、金屬片11及金屬層12，金屬片11係埋設於該塑膠本體10以形成一殼體件1，且該金屬片11係部分裸露於該塑膠本體10，而塑膠本體10上具有一天線圖案101，金屬層12則是利用化學鍍沈積於該天線圖案101上以形成天線；其中當該金屬層12之化學鍍沈積時，部分裸露於該塑膠本體10之該金屬片11係連接於一電源30之正極，以載入正電壓於該金屬片11，進而避免該金屬層12沈積於該金屬片11之表面。In summary, the present invention provides an antenna device according to the manufacturing method of the first and second embodiments, which includes a plastic body 10, a metal sheet 11 and a metal layer 12, and the metal sheet 11 is embedded in the plastic body. 10, a housing member 1 is formed, and the metal sheet 11 is partially exposed to the plastic body 10, and the plastic body 10 has an antenna pattern 101 thereon, and the metal layer 12 is deposited on the antenna pattern 101 by electroless plating. Forming an antenna; wherein when the metal layer 12 is deposited by electroless plating, the metal piece 11 partially exposed to the plastic body 10 is connected to the anode of a power source 30 to load a positive voltage on the metal piece 11, thereby avoiding A metal layer 12 is deposited on the surface of the metal sheet 11.
請參考第一圖，其顯示金屬片11埋設於該塑膠本體10以形成一殼體件1的立體圖。在一實施例中，該殼體件1可為一行動通訊裝置之背蓋，例如行動電話背蓋，而該塑膠本體10包含一內表面102及一相對於該內表面102之外表面103，該金屬片11係部分同時裸露於該行動通訊裝置之背蓋的內表面102與外表面103。然而，在一變化實施例中，該金屬片11可僅部分裸露於該行動通訊裝置之背蓋的內表面102，或是僅部分裸露於該行動通訊裝置之背蓋的外表面103。Please refer to the first figure, which shows a perspective view of the metal piece 11 embedded in the plastic body 10 to form a casing member 1. In an embodiment, the housing member 1 can be a back cover of a mobile communication device, such as a mobile phone back cover, and the plastic body 10 includes an inner surface 102 and an outer surface 103 opposite to the inner surface 102. The metal sheet 11 is partially exposed at the same time to the inner surface 102 and the outer surface 103 of the back cover of the mobile communication device. However, in a variant embodiment, the metal sheet 11 may be only partially exposed to the inner surface 102 of the back cover of the mobile communication device or only partially exposed to the outer surface 103 of the back cover of the mobile communication device.
請參考第一A圖，其顯示該塑膠本體10上具有可供沈積金屬之天線圖案101，具體而言，該天線圖案101係由塑膠本體10之外表面103連續地延伸至塑膠本體10之內表面102，而該天線圖案101可利用前文所述之雷射直接成型技術(laser-direct-structuring，LDS)的雷射改質步驟或雙色注塑(2 shot molding)技術所製作，在此不予贅述；再者，該天線圖案101與該金屬片11係不相接觸。Referring to FIG. 1A, the plastic body 10 has an antenna pattern 101 for depositing metal. Specifically, the antenna pattern 101 extends continuously from the outer surface 103 of the plastic body 10 to the plastic body 10. The surface 102, and the antenna pattern 101 can be fabricated by a laser-direct-structuring (LDS) laser modification step or a two-shot molding technique as described above. Further, the antenna pattern 101 is not in contact with the metal piece 11 .
請參考第一B圖，其顯示金屬層12係成型於該天線圖案101上，以形成一接收/發送訊號之天線。金屬層12的結構係對應於該天線圖案101，且同樣由塑膠本體10之外表面103連續地延伸至塑膠本體10之內表面102；值得注意的是，由於在該金屬層12之化學鍍沈積時，部分裸露於該塑膠本體10之該金屬片11係連接於一電源30之正極，以載入正電壓於該金屬片11，因此，部分裸露於該塑膠本體10之該金屬片11上並無金屬層12之沈積。Please refer to FIG. B, which shows that the metal layer 12 is formed on the antenna pattern 101 to form an antenna for receiving/transmitting signals. The structure of the metal layer 12 corresponds to the antenna pattern 101, and also extends continuously from the outer surface 103 of the plastic body 10 to the inner surface 102 of the plastic body 10; notably, due to electroless deposition on the metal layer 12. The metal sheet 11 partially exposed to the plastic body 10 is connected to the anode of a power source 30 to load a positive voltage on the metal sheet 11, and thus is partially exposed on the metal sheet 11 of the plastic body 10 and Deposition of the metal free layer 12.
請參考第二圖與第三圖，第二圖顯示本實施例之天線裝置與電路板20、導電元件21組設在一起的分解圖；而第三圖顯示上述之天線裝置與電路板20、導電元件21組設在一起的組合圖，其中，天線裝置之塑膠本體10包含內表面102及相對於該內表面102之外表面103，金屬層12係由塑膠本體10之外表面103連續地延伸至塑膠本體10之內表面102，導電元件21的兩端係分別電性連接於位於塑膠本體10之內表面102的金屬層12以及電路板20上之線路201。藉此，該金屬層12所接收之無線訊號則可利用導電元件21傳遞至該電路板20上之線路201，反之亦然，以達到信號的接收/傳送。Please refer to the second and third figures. The second figure shows an exploded view of the antenna device of the embodiment and the circuit board 20 and the conductive element 21; and the third figure shows the antenna device and the circuit board 20, The combination of the conductive elements 21 is assembled. The plastic body 10 of the antenna device includes an inner surface 102 and an outer surface 103 opposite to the inner surface 102. The metal layer 12 is continuously extended from the outer surface 103 of the plastic body 10. To the inner surface 102 of the plastic body 10, the two ends of the conductive member 21 are electrically connected to the metal layer 12 on the inner surface 102 of the plastic body 10 and the line 201 on the circuit board 20. Thereby, the wireless signal received by the metal layer 12 can be transferred to the line 201 on the circuit board 20 by the conductive element 21, and vice versa, to achieve signal reception/transmission.
另一方面，金屬片11係緊密的嵌合於該塑膠本體10，以達到提升該殼體件1(即行動通訊裝置之背蓋)的結構強度、或增加裝飾性功用、或加強電磁遮蔽效果的功能，然本發明所提出之製作方法可有效避免化學鍍之金屬沈積於金屬片11上，以解決傳統製程將化學鍍之金屬沈積於金屬片11上所造成的問題。On the other hand, the metal sheet 11 is tightly fitted to the plastic body 10 to improve the structural strength of the housing member 1 (ie, the back cover of the mobile communication device), or to increase the decorative function or enhance the electromagnetic shielding effect. The function of the present invention can effectively prevent the electroless plating metal from being deposited on the metal sheet 11 to solve the problem caused by the conventional process of depositing the electroless metal on the metal sheet 11.
綜上所述，本發明具有下列諸項優點：In summary, the present invention has the following advantages:
1、將外接電源之正極連接至埋設於塑膠本體之金屬片，以加載正電壓於該金屬片，故可避免進行金屬層之化學鍍時將金屬材料沈積於金屬片上所造成的問題。藉此，在應用化學鍍的情況下，本發明仍可將金屬片嵌設並裸露於塑膠本體，使其可維持裝飾性功用或按鍵作用之功能。1. The positive electrode of the external power source is connected to the metal piece embedded in the plastic body to load a positive voltage on the metal piece, so that the problem caused by depositing the metal material on the metal piece during the electroless plating of the metal layer can be avoided. Thereby, in the case of applying electroless plating, the present invention can still embed and expose the metal piece to the plastic body, so that it can maintain the function of decorative function or button action.
2、另外，本發明可避免進行金屬層之化學鍍時將金屬材料沈積於金屬片上，以解決先前技術所提及之剝離的沈積金屬層所導致的電路短路問題，且使塑膠本體與金屬片所組成之殼體件具有較佳的結構強度。2. In addition, the present invention can prevent the metal material from being deposited on the metal sheet during the electroless plating of the metal layer to solve the short circuit problem caused by the peeled deposited metal layer mentioned in the prior art, and the plastic body and the metal piece The formed housing member has a preferred structural strength.
以上所述僅為本發明之較佳可行實施例，非因此侷限本發明之專利範圍，故舉凡運用本發明說明書及圖示內容所為之等效技術變化，均包含於本發明之範圍內。The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the equivalents of the present invention are intended to be included within the scope of the present invention.
1．．．殼體件1. . . Housing part
10．．．塑膠本體10. . . Plastic body
101．．．天線圖案101. . . Antenna pattern
102．．．內表面102. . . The inner surface
103．．．外表面103. . . The outer surface
11．．．金屬片11. . . Metal sheets
12．．．金屬層12. . . Metal layer
20．．．電路板20. . . Circuit board
201．．．線路201. . . line
21．．．導電元件twenty one. . . Conductive component
30．．．電源30. . . power supply
301．．．電極301. . . electrode
302．．．支架302. . . support
40．．．化學鍍液40. . . Chemical plating solution
第一圖係顯示本發明之金屬片埋設於該塑膠本體以形成殼體件的立體示意圖。The first figure shows a perspective view of a metal piece of the present invention embedded in the plastic body to form a housing member.
第一A圖係顯示本發明之塑膠本體上具有可供沈積金屬之天線圖案的立體示意圖。The first A is a perspective view showing an antenna pattern on the plastic body of the present invention having a metal depositable.
第一B圖係顯示本發明之金屬層成型於該天線圖案上的立體示意圖。The first B diagram shows a perspective view of the metal layer of the present invention formed on the antenna pattern.
第二圖係為本發明之天線裝置與電路板、導電元件組設在一起的分解示意圖。The second figure is an exploded schematic view of the antenna device of the present invention, together with a circuit board and a conductive component group.
第三圖係為本發明之天線裝置與電路板、導電元件組設在一起的組合示意圖。The third figure is a combination diagram of the antenna device, the circuit board and the conductive component group of the present invention.
第四圖係為本發明之殼體件進行化學鍍之示意圖，其中電源之正極係連接於金屬片。The fourth figure is a schematic view of the electroless plating of the casing member of the present invention, wherein the positive electrode of the power source is connected to the metal piece.
1．．．殼體件1. . . Housing part
10．．．塑膠本體10. . . Plastic body
11．．．金屬片11. . . Metal sheets
30．．．電源30. . . power supply
301．．．電極301. . . electrode
302．．．支架302. . . support
40．．．化學鍍液40. . . Chemical plating solution
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099114389A TWI589058B (en) | 2010-05-05 | 2010-05-05 | An antenna apparatus and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099114389A TWI589058B (en) | 2010-05-05 | 2010-05-05 | An antenna apparatus and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201140930A TW201140930A (en) | 2011-11-16 |
| TWI589058B true TWI589058B (en) | 2017-06-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099114389A TWI589058B (en) | 2010-05-05 | 2010-05-05 | An antenna apparatus and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI589058B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200603709A (en) * | 2004-01-09 | 2006-01-16 | Framatome Connectors Int | PCMCIA electronic housing equipped with an antenna and process for manufacturing thereof |
| TW200617188A (en) * | 2004-11-23 | 2006-06-01 | Tennmax Inc | Film antenna and method for manufacturing thereof |
| TW200729895A (en) * | 2006-01-17 | 2007-08-01 | Chant Sincere Co Ltd | Casing of wireless communication product having embedded antenna |
-
2010
- 2010-05-05 TW TW099114389A patent/TWI589058B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200603709A (en) * | 2004-01-09 | 2006-01-16 | Framatome Connectors Int | PCMCIA electronic housing equipped with an antenna and process for manufacturing thereof |
| TW200617188A (en) * | 2004-11-23 | 2006-06-01 | Tennmax Inc | Film antenna and method for manufacturing thereof |
| TW200729895A (en) * | 2006-01-17 | 2007-08-01 | Chant Sincere Co Ltd | Casing of wireless communication product having embedded antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201140930A (en) | 2011-11-16 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |