201140930 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種夭綠胜 種可避免化學铲…=置及其製作方法，尤指-:二：免化于鍍之金屬層沈積於 之金屬片的天線裝置及其製作方法。4於》亥歸本祖 【先前技術】 塑料係大量地運用;^ |工$ σ 於成型，且可大量殼，其優勢在於易 多均係利用塑料戶^1例如’可攜式電子裝置的外殼大 也隨著電子產品的尺寸日益縮小，其外殼的厚度 大：在朔二：因此’為了提高塑料外殼的結構強度，目前 殼中嵌合有金屬片，以提升塑料外殼抵抗外 插rt ’中華民國專利公開號第2_7570號，其揭露 傳，置之防護外殼，該防護外殼中即‘ 公門真法二提向防護外殼的強度。除此之外，上述5 7 0號 :開專利中亦揭露在防護外殼中設有多個金屬片更可具 以下優點：（1)可用以做為裝飾性的特徵；（2)可用以 ，為功月b性特徵’例如金屬材質之按紐等，·換言之，上述 壯f片在、°構上會裸露於該防護外殼，以達成金屬光澤2 又牟性或操作介面之按鍵功能。 (ks，.一方面，雷射直接成型技術 aser-direct-structuring ’ LDS )已逐漸應用於塑料外殼上 ^線路的製作。雷射直接成型的製作流程係為；首先提供 射出模造之外殼，該外殼係利用一次射出成型將熱塑性 4/18 201140930 材料加以固化成型，接著，以雷射於該外殼的内壁面形成 活化區域，該活化區域會具有金屬化的活化核心，亦即， 該活化區域的活化核心可用以催化物理或化學反應；接下 來，利用一金屬化製程，例如化學鍍，將金屬形成於上述 之活化區域，以形成線路。 因此，當利用具有金屬片的塑料外殼進行上述雷射直 •接成型製程時，由於化學鑛中的金屬離子會在裸露於塑料 .外殼之金屬片的表面產生還原反應，致使裸露於塑料外殼 •之金屬月的表面上會沈積化學鍍之金屬層，而造成以下問 曰 s · ** 題· (1)化學鍍之金屬層與裸露於塑料外殼之金屬片的 表面之_著力不佳，故沈積之金屬層會由金屬片的表面 上剝離、脫落，而導致金屬顆粒、粉末會散佈在電子產品 的内部空間’該些金屬肺、粉末即可能會導致電子產品 内部的電路板之線路發生短路的情況。 ，化學鍍之金屬層與裸露於 附著力不佳，故化學鍍之金 的表面，導致金屬片失去裝201140930 VI. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a green shovel that avoids chemical shovel...=setting and its manufacturing method, especially -: two: the deposition of a metal layer on the plating The antenna device of the metal piece and the manufacturing method thereof. 4于于海归本祖 [Previous technology] Plastics are used in large quantities; ^ |Working $ σ is formed and can be a large number of shells, the advantage of which is that Yi Duo is using plastic households such as 'portable electronic devices The size of the outer casing is also shrinking with the size of the electronic product, and the thickness of the outer casing is large: in the second: therefore, in order to improve the structural strength of the plastic outer casing, the metal shell is fitted in the shell to enhance the plastic outer casing against the extrapolation of the rt 'China The Republic of China Patent Publication No. 2_7570 discloses a protective casing in which the strength of the protective casing is raised by the public door. In addition, the above-mentioned No. 570: Patent also discloses that the provision of a plurality of metal sheets in the protective casing has the following advantages: (1) can be used as a decorative feature; (2) can be used, For the function of the b-characteristics of the moon, for example, the button of the metal material, etc., in other words, the above-mentioned strong f piece will be exposed to the protective casing in the structure of the metal to achieve the metallic luster 2 or the function of the button of the operation interface. (ks, on the one hand, laser direct forming technology aser-direct-structuring ’ LDS) has been gradually applied to the production of plastic circuits. The laser direct molding process is first; firstly, an injection molded outer casing is provided, which is formed by curing the thermoplastic 4/18 201140930 material by one injection molding, and then forming an activation region by laser on the inner wall surface of the outer casing. The activation region will have a metalized activation core, that is, the activation core of the activation region can be used to catalyze a physical or chemical reaction; next, a metal formation process, such as electroless plating, is used to form a metal in the activated region. To form a line. Therefore, when the above-described laser direct-bonding forming process is performed using a plastic outer casing having a metal piece, since the metal ions in the chemical ore are subjected to a reduction reaction on the surface of the metal piece exposed to the plastic outer casing, the bare metal is exposed to the plastic outer casing. On the surface of the metal moon, a metal layer of electroless plating is deposited, causing the following problems: (1) The metal layer of the electroless plating and the surface of the metal piece exposed on the plastic case are not well-fed, so The deposited metal layer will be peeled off and peeled off from the surface of the metal sheet, and the metal particles and powder will be scattered in the internal space of the electronic product. The metal lungs and powder may cause short circuit of the circuit board inside the electronic product. Case. The metal layer of the electroless plating is barely exposed, so the surface of the gold plated by the electroless plating causes the metal piece to be lost.
(2)如上述（1 )之觀點 塑料外殼之金屬片的表面之間 屬層會形成皺摺、粗糙或剝離 飾性的功能。 本案發明人有鑑於上述習用的技術於實際施用時的 積累個人從事相關產業開發實務上多年之經驗， H九’終於提出—種設計合理且有效改善上述問題之 【發明内容】 本么月之主要目的’在於提供—種天線裝置及其製作 5/18 201140930 方法，其係利用電鍍之逆反應的概念，將外接電源之正極 連接至埋設而部分裸露於塑膠本體之金屬片，以加載正電 壓於S亥金屬片，故可避免進行金屬層之化學鍵時將金屬材 料沈積於上述金屬片之裸露部分上所造成的問題；換言 之，邛分裸露於該塑膠本體之金屬片不會沈積有化學鑛之 金屬層，故金屬片仍可保持其裝飾性，再者，本發明^可 解決先前技術所提及之剝離之金屬層所導致的電路短 問題。 為了達到上述目的，本發明係提供一種天線裝置，包 含：一塑膠本體，其上具有一天線圖案；一金屬片，其係 埋設於該塑膠本體以形成一殼體件，且該金屬片係部^ 路於遠塑膠本體；以及一金屬層，其係利用化學錢沈積於 該天線圖案以形成天線；其中，在該金屬層之化學錢沈積 時，部分裸露於該塑膠本體之該金屬片係連接於一電源之 正極，以載人正電壓於該金屬片，進而避免該 = 於該金屬片之表面。 蜀I冗積 本發明更提供一種天線裝置的製作方法，包含以 驟：步驟一：利用埋入_ (insertmolding)將—片 埋設於-塑膠本體，且使該金屬片部分裸露於該塑膠本 以形成-殼體件；步驟二：在該塑膠本體上成型㈣ 積金屬之天線圖案；以及步驟三：將該殼體件置人一: 金屬離子之化學鍍液巾，使金祕預原且沈積於該^ 圖案上，以成型一金屬層之天線；同時，提供—電、廿 將該電源之正極連接至部分裸露於該塑膠本體之談合屬 片’及將該電源之負極連接至餘化學巾 載入正㈣於該金屬片，進而避免金屬離子二電= 6/18 201140930 屬層沈積於該金屬片之表面。(2) From the viewpoint of the above (1), the surface layer of the metal sheet of the plastic case has a function of forming wrinkles, roughness, or peeling properties. In view of the above-mentioned techniques used in the actual application, the inventor of the present invention has accumulated many years of experience in the practice of related industry development. H9' finally proposed a design that is reasonable and effective in improving the above problems [invention content] The purpose is to provide an antenna device and its fabrication method 5/18 201140930, which uses the concept of reverse reaction of electroplating to connect the positive pole of the external power source to the metal piece buried in the plastic body to load a positive voltage on the S. The metal sheet is used to avoid the problem of depositing the metal material on the exposed portion of the metal sheet when the chemical bond of the metal layer is performed; in other words, the metal piece exposed to the plastic body does not deposit the metal of the chemical mineral. The metal sheet can still maintain its decorative property. Moreover, the present invention can solve the short circuit problem caused by the peeled metal layer mentioned in the prior art. In order to achieve the above object, the present invention provides an antenna device comprising: a plastic body having an antenna pattern thereon; a metal piece embedded in the plastic body to form a housing member, and the metal piece portion ^ Lu Yuyuan plastic body; and a metal layer deposited by the antenna pattern using the chemical money to form an antenna; wherein, when the chemical layer of the metal layer is deposited, the metal sheet is partially exposed to the plastic body In the positive pole of a power source, a positive voltage is applied to the metal piece, thereby avoiding the surface of the metal piece. The invention further provides a method for fabricating an antenna device, comprising the steps of: step 1: embedding a sheet into a plastic body by using an insert molding, and exposing the metal sheet portion to the plastic body Forming a housing member; Step 2: Forming (4) a metal pattern of the antenna on the plastic body; and Step 3: placing the housing member in one: a metal ion chemical plating liquid towel to make the gold secret pre-form and deposit Forming a metal layer antenna on the ^ pattern; at the same time, providing - electricity, 廿 connecting the positive electrode of the power source to a portion of the plastic body that is exposed on the plastic body and connecting the negative electrode of the power source to the remaining chemical towel Load positive (four) on the metal sheet, and then avoid metal ion two electricity = 6/18 201140930 genus layer deposited on the surface of the metal sheet.
本發明具有以下有#I 部分裸露於該塑膠本體:該金：外供正電 離子進行㈣反料，錢齡㈣之金屬 案，而不會沈積於上述部分裸=體上之天線圖 U , ^ -T- J4. 刀裸路於該塑膠本體之哕全屈 學鍍所沈積之金;飾性&、樣亦可避免化 出之電路之㈣附著相題所衍生 為使能更進一步瞭解本發 閱以下有關本發明之詳細說明 内容’請參 供參考與說明用，並非用來針然而所附圖式僅提 非用來對本發明加以限制者。 【實施方式】 本發明提出一種天線裝 之金屬層沈積於埋 =本體：： 致的問題，例如化學錢所沈積:金屬 路^者f生不佳，而使金屬層脫落導致電路短 路或裝置内部污染的問題等等。 括以之第—具體實施例之天㈣置的製作方法包 將’在步驟一中，利用埋入模禱（insert molding) 1部分裰111埋，於一塑膠本體1 0，且使該金屬片1 第路於該塑膠本體1 〇以形成一殼體件1 (請配合 乐圖所示）。 背i在f具體實施例中，該殼體件1可為—行動通訊裝置之 ’例如行動電話背蓋，但不以上述為限，其係先利用 7/18 201140930 埋入模鑄將金屬片11埋設且裸露於塑膠本體1〇而成 变·為上述之行動電話背蓋；.換言之，利用埋入模鑄將金屬 片1 1牢固地嵌合於塑膠本體i 0中，而該金屬片丄1可 為不銹鋼或其他耐腐蝕金屬，以形成具有高強度、具裝飾 性、或具有電磁遮蔽效果之殼體件1。 另方面，為了使塑膠本體1〇可被雷身士戶斤改質，以 使塑膠本體10上成塑可供沈積金屬之天二：配合 第- A圖所示），該塑膠本體i 〇係為一種含金屬、金屬 催化物或其有機物之塑性材料，其可被雷射所改質而形成 聽區域，該活化輯具有金屬化的活化核心，因此，該活 化區域的活化核心會催化物理或化學反應。 接著，步驟二係在該塑膠本體丄〇上成型一可供沈積 金屬之天線圖案10 i (請配合第一 A圖所示）。具體而 言’本步驟係使用雷射將該塑膠本體丄〇之表面的一預定 區域改質形成-活化區域（即天線圖案i ◦丄），使下一步 驟之導電金屬㈣得以直接沈積且崎於該㈣本體丄〇 之活化區域上㈣成可接收訊號之天線。值得注意的是，該 天線圖案1Q1與該金屬片11係不相接觸，以避免後續 外加正電壓之步驟影響到化學鑛沈積金屬於天線圖案i 0 1上之反應。 接下來’請參考第一 B圖，並配合第四圖所示，步驟 ^系將該殼體件i置人-具有金屬離子之化學鐘液4 0 中，使金屬離子逛原且沈積於該天線 ^金屬層12之天線；同時，提供—電源3◦，並將= 正極連接至部分裸露於該塑膠本體1 0之該金屬 片1 1 ’及將該電源3 G之負極連接至位於化學鏟液4 〇 8/18 201140930 中之電極3 0 1，以載入正電壓於該金屬片1 1，進而避 免金屬離子所還原之該金屬層1 2沈積於該金屬片1 1 之表面0 藉此，本步驟係利用金屬沈積技術，例如化學鍍（亦 稱無電鍍’ electroless plating )，使導電金屬材料得以直接 沈積附著於該塑膠本體1 〇之天線圖案1 〇 1上，以形成 了接收況说之金屬層1 2之天線。例如’化學鑛液4 q可 至少包含有銅離子，故可沈積銅之金屬層i 2，以形成接 • 收訊號之天線；又例如，化學鍍液4 0可至少包含有鎳離 子，故可沈積鎳之金屬層1 2，以形成接收訊號之天線〜， 但不以上述為限。 丹一万面 〜丁取狀4υπ贫屬離子在進行還 原的過程中，亦會沈積在部分裸露於該塑膠本體丄〇之該 金屬片1 1的表面，故本發明係在化學鍍的過程中利用電 源3 0提供正電壓於部分裸露於該塑膠本體丄〇之該金 屬片1 1，使部分裸露於該塑膠本體i Y j 會產生電鍵之逆反應，具體而言，本發明將該=上 正極連接至部分裸露於該塑膠本體1〇之該金 i極電源3 0之負極連接至位於化學鑛液4 〇中之 ’Γ載入約〇.4V的正電壓至部分裸露於該塑 X-1 0之屬片1 1 ’使沈積在部分裸露於該塑膠 本-10之该金屬片i工進行一氧化反 積在部分《於„料體i Q之該W上 的金屬層12，里-、、晉店上 月丄丄表面上 該塑膠本體i 故可保持部分裸露於 所成型之金屬層! 2。如第四圖所示，本;== 9/18 201140930 3 0 2 —次性地裝配八個殼 端連接於電源3 〇之正極， 業。 體件1 ’並將支架3 0 2的末 藉此可進行批次化的量產作 囚此 之第一具體實施例係利用雷射直接成型 J (， StrUCtUring，LDS)製作一種天線裝置， ^之，該殼體件1係為—雷射直接成型〇之外殼， :。3湘埋人模铸方法所模製成型的塑膠本體1 〇 \ 1 ’並以雷射於該塑膠本體1 ◦上形成一活化區 積於01 )，再利用化學鍍方法將金屬材料沈 積方"亥活化區域而形成有一金屬層1 2之天線；再者，在 化予鍍的同時’利用外接電源3◦將正 U’以避免化學錄所沈積之金屬覆蓋於金屬片載丄二 面。 、 發明之第二具體實施例之天線裝置的製作方法則 W用雙色注塑（2 shotmolding，又稱雙料射出成型）將 天線圖案101成型於塑膠本體丄〇上，其包括以下步驟· 步驟一，同樣可利用埋入模鑄（insertm〇lding)將— 金屬片1 1埋設於-塑膠本體i 〇，且使該金屬片丄 分棵露於該_本體1Q以形成-殼體件1(請配合第L 圖所示）而與第—具體實施例不同之處在於’本步驟所 =出成型之塑材係為一種非導體之塑材，且其中不需含有 金屬組成’換言之，—般常見的卫業塑材均可應用於本步 ΓΟ - ^ 、另外，同於第一具體實施例，該殼體件丄可為一行 通汛裝置之背蓋，例如行動電話背蓋等。 接著，步驟二係在該塑膠本體i Q上成型一可供沈積 10/18 201140930 f屬之天線圖案10 1 (請配合第一A圖所示）。具體而 β本步称係利用雙色注塑（2 shot molding )方法將一導 電塑材成型於該塑膠本體2 〇上，以形成可供沈積金屬之 天線圖案1 〇 1 ;換言之，本步驟係利用雙色注塑將導電 I材成型在S亥塑膝本體1 〇之表面的預定區域，以形成天 線圖案1 〇 1，使下一步驟之導電金屬材料得以直接附著於 該塑膠本體1Q上之天線圖案101上以形成可接收訊號 之天線。 入另外，同於第一具體實施例，該天線圖案丄〇丄與該 金屬片1 1係不相接觸，以避免後續外加正電壓之步驟影 響到化學鍍沈積金屬於天線圖案丄〇 1上之反應。 二接下來，同樣參考第一 B圖與第四圖所示，步驟三係 將"亥了胧件1置入一具有金屬離子（如銅離子或鎳離子） 化本鍍液4 0中，使金屬離子還原且沈積於該天線圖案 1 〇 1上，以成型一金屬層1 2之天線；同時，提供一電 源3 0，並將该電源之正極連接至部分裸露於該塑膠本體 1 ?之該金屬片i i，及將該電源3 〇之負極連接至位於 ^匕^鍍液4 0中之電極3〇1，以載入正電麼於該金屬片 金屬’進1^避免金屬離子所還原之該金屬層1 2沈積於該 11之表面。因此，藉由步驟二所使用之導電塑 挪化學鑛液4 〇中之金屬離子可直接沈積附著於該塑膠 芦^◦之天線圖案1◦1上’以形成可接收訊號之金屬 二 之天線。再者，在化學鍍的過程中，利用電源3〇 Ί電壓於部分裸露於該塑膠本體10之該金屬片i • Ϊ部露於該塑膠本體1 〇之該金屬片1 1會產生 ' 史 μ使化學鑛所沈積在部分裸露於該塑膠本體 11/18 201140930 1 0之該金屬片1 i表面上的金屬層丄2，再次還原成離 子態’故可保持部分裸露於該塑膠本體i Q之該金屬片丄 1表面不會沈積有化學鍍所成型之金屬層1 2。 因此，本發明之第二具體實施例係利用雙色注塑（2 shotmolding)技術製作一種天線裝置，換言之，該殼體件 1包3利用埋入模鑄方法所模製成型的塑膠本體工〇 與金屬>5 1 1 ’並利用雙色注塑將另一導電塑材成型於該 塑膠本體1 〇上以形成天線圖案工〇丄；再利用化學^ 法將金屬材料沈積於該活化區域而形成有一金屬層丄2之 天線，再者’在化學錢的同日夺，利用外接電源3 〇將正 金屬片Η的表面。避免化予艘所沈積之金屬覆蓋於 制=所！ί，本發明依據上述第一與第二具體實施例的 ';作出一種天線裝置，其包括塑膠本體1 0、 ^屬片1 1及金屬層i 2 ’金屬片工工係埋設於該塑膠本 體1 0以形成-殼體件工，且該金屬片工工係部分裸露於 該塑膠本體1 〇，而塑膠本體i Q上具有—天線圖W 〇 1 ’金屬層1 2収_化學鐘沈積於該天線圖案Η ^以=成天線；其中當該金屬層i 2之化學鑛沈積時，部 /刀裸路於該_本體i 〇之該金屬片工連接於 ϋ之正極’以載入正電壓於該金屬片11，進而避免 该盘屬層1 2沈積於該金屬片丄丄之表面。 請參考第-圖，其顯示金屬片2工埋設於該塑膠本體 ^ 0以形成-殼體件！的立體圖。在―實施例_，該_ 件1可為-行動通訊裝置之背蓋，例如 = 該塑膠本體10包含—内表面102及_相^^ 12/18 201140930 面1 0 2之外表面1 〇 3，該金屬片工工係部分同時裸露 於該行動通訊裝置之背蓋的内表面丄〇 2與外表面工〇 =。然而，在一變化實施例中，該金屬片1 1可僅部分裸 露於該行動通訊裝置之背蓋的内表面i 〇 2，或是僅部分 裸露於該行動通訊裝置之背蓋的外表面1〇 3。 請參考第一 A圖，其顯示該塑膠本體i 〇上具有可供 沈積金屬之天線圖案101，具體而言，該天線圖案1〇 -1係由塑膠本體1 0之外表面1 〇 3連續地延伸至塑膠 •本體10之内表面102,而該天線圖案ιοί可利用前 文所过之运射直接成型技術（laser-direct-structuring，LDS ) 勺每射改貝步驟或雙色注塑（2 shot molding )技術所製 作，在此不予贅述；再者，該天線圖案1 0 1與該金屬片 1 1係不相接觸。 請參考第一 B圖，其顯示金屬層1 2係成型於該天線 圖案1 0 1上，以形成一接收/發送訊號之天線。金屬層1 2的結構係對應於該天線圖案1 0 1，且同樣由塑膠本體 -參1 〇之外表面1 0 3連續地延伸至塑膠本體1 〇之内表 面1 2 2 ;值得注意的是，由於在該金屬層丄2之化學鍍 沈積時，部分裸露於該塑膠本體10之該金屬片11係連 接於一電源3 〇之正極，以載入正電壓於該金屬片丄工， 因此，„卩分裸露於該塑膠本體1 〇之該金屬片 盔 金屬層1 2之沈積。 ’、'、 °月參考第二圖與第三圖，第二圖顯示本實施例之天線 ，置與電路板2◦、導電元件21組設在-起的分解圖；而 第二圖顯示上述之天線裝置與電路板2 〇、導電元件2工 組設在一起的組合圖’其中，天線裝置之塑膠本體丄〇包 13/18 201140930 含内表面1 〇 2及相對於該内表面丄0 2之外表面工〇 3，金屬層1 2係由塑膠本體1 〇之外表面丄〇 3連續地 =伸至塑膠本體i 〇之内表面1()2，導電元件21的兩 端係分別電性連接於位於塑膠本體丄〇之内表面1 〇 2的 金屬層1 2以及電路板2 〇上之線路2 〇1。藉此，該金屬 層1 2所接收之無線訊號則可利用導電元件2丄傳遞至該 電路板2 0上之線路2 G 1 ’反之亦然，以達到信號的接收 另方面，金屬片1 1係緊密的嵌合於該塑膠本體1 〇，以達到提升該殼體件i (即行動通訊裝置之背蓋）的 ，構強度'或增加裝飾性功用'或加強電磁遮蔽效果的功 能’然本發明所提出之製作方法可有效避免化學鑛之金屬 =積於金屬>；1 1 _L，讀決傳統餘將化學狀金屬沈 積於金屬片1 1上所造成的問題。 綜上所述，纟發明具有了列諸項優點： 、將外接電源之正極連接至埋設於㈣本體之金屬片， 正電a於該金屬片’故可避免進行金屬層之化 ^時將金屬材料沈積於金屬片上所造成的問題。藉 i、在ΐ用化學鍍的情況下，本發明仍可將金屬片嵌 設並裸露於塑膠本體，佶1 作用之功能。 U鳩«飾性功用或按鍵 稽可避免進行金屬層之化學鍍時將金屬材 ;積=2上，以解決先前技術所提及之剝離的 的電路短路問題，且使塑勝本體與 至屬片所組成之殼料具有較 以上所述料本發^較封行實關此偈限 14/18 2 201140930 本發明之專利範圍，故舉凡運用本發明說明書及圖示内容 所為之等效技術變化，均包含於本發明之範圍内。 【圖式簡單說明】 塑膠本體以形成 第一圖係顯示本發明之金屬片埋設於該 殼體件的立體示意圖。 第一 A圖係顯示本發明之塑膠本體上具有可供沈 之天線圖案的立體示意圖。 圖係顯示本發明之金屬層成型於該天線圖案上的立 肢不意圖0 ^圖係為本發明之天線裝置與電路板、導電元件組設在 起的分解示意圖。 =圖係為本發明之天線裝置與電路板、導電元件纪設在 —起的組合示意圖。 ^四圖係為本發日狀殼體件進行化學^示意圖，盆中電 源之正極係連接於金屬片。 '、 【主要元件符號說明】 1 殼體件 10 塑膠本體 10 1 天線圖案 10 2 内表面 11 金屬片 1 2 金屬層 10 3 外表面 一 ϋ 電路板 ^1 導電元件 2 0 1 線路 15/18 201140930 30 電源 301 電極 3 0 2 支架 40 化學鍍液 16/18The invention has the following #I part exposed to the plastic body: the gold: the external positive ion is carried out (4), the metal case of Qianling (4), and the antenna figure U which is not deposited on the above bare body ^ -T- J4. The bare hole of the knife is deposited on the plastic body. The decoration and the sample can also avoid the circuit. (4) The attached phase is derived to enable further understanding. The detailed description of the present invention is not to be construed as limiting the invention. [Embodiment] The present invention provides a problem that a metal layer of an antenna is deposited on a buried body: for example, a chemical money is deposited: a metal circuit is poor, and a metal layer is peeled off to cause a short circuit or an internal device. Pollution problems and so on. In the first step, the manufacturing method package of the day (fourth) of the specific embodiment will be buried in the first part of the plastic body 10 by using the insert molding 1 in the first step, and the metal piece is made. 1 The first path is to the plastic body 1 to form a housing member 1 (please refer to the music diagram). In the specific embodiment, the housing member 1 can be a mobile communication device, such as a mobile phone back cover, but not limited to the above, which is first embedded in a molded metal piece using 7/18 201140930. 11 embedded and exposed to the plastic body 1 〇 change to the above-mentioned mobile phone back cover; in other words, the metal piece 1 1 is firmly fitted into the plastic body i 0 by the embedded molding, and the metal piece 丄1 may be stainless steel or other corrosion resistant metal to form a housing member 1 having high strength, decorative, or electromagnetic shielding. On the other hand, in order to make the plastic body 1 〇 can be modified by the scorpion, so that the plastic body 10 can be plasticized for deposition of metal on the second day: in conjunction with the figure -A, the plastic body i A plastic material comprising a metal, a metal catalyst or an organic material thereof, which can be modified by a laser to form an auditory region having a metallized activated core, whereby the activated core of the activated region catalyzes physical or chemical reaction. Next, in the second step, an antenna pattern 10 i for depositing metal is formed on the plastic body ( (please cooperate with the first A diagram). Specifically, this step uses a laser to modify a predetermined region of the surface of the plastic body to form an active region (ie, an antenna pattern i ◦丄), so that the conductive metal (four) of the next step can be directly deposited and On the active area of the (4) body, (4) an antenna capable of receiving signals. It should be noted that the antenna pattern 1Q1 is not in contact with the metal piece 11 to prevent the subsequent step of applying a positive voltage to affect the reaction of the chemically deposited metal on the antenna pattern i 0 1 . Next, please refer to the first B diagram, and in conjunction with the fourth figure, the step ^ is to place the housing member i into the chemical clock solution 40 with metal ions, so that the metal ions are deposited and deposited on the Antenna ^The antenna of the metal layer 12; at the same time, the power supply is provided, and the positive electrode is connected to the metal piece 1 1 ' which is partially exposed to the plastic body 10 and the negative electrode of the power supply 3 G is connected to the chemical shovel The electrode 3 0 1 in the liquid 4 18 8/18 201140930 is loaded with a positive voltage on the metal piece 1 1 to prevent the metal layer 12 reduced by the metal ions from being deposited on the surface 0 of the metal piece 1 1 This step utilizes a metal deposition technique, such as electroless plating (also known as electroless plating), so that the conductive metal material can be directly deposited and attached to the antenna pattern 1 〇1 of the plastic body 1 to form a receiving state. The antenna of the metal layer 1 2 . For example, 'chemical mineral liquid 4 q can contain at least copper ions, so copper metal layer i 2 can be deposited to form an antenna for receiving and receiving signals; for example, electroless plating solution 40 can contain at least nickel ions, so A metal layer 12 of nickel is deposited to form an antenna ~ for receiving signals, but is not limited to the above. In the process of reduction, the surface of the metal sheet 11 exposed to the plastic body is also deposited on the surface of the metal sheet 11 which is exposed to the plastic body, so the present invention is in the process of electroless plating. Using the power supply 30 to provide a positive voltage to the portion of the metal piece 1 1 exposed to the plastic body 使, such that the portion exposed to the plastic body i Y j will generate a reverse reaction of the electric bond. Specifically, the present invention The negative electrode connected to the gold i-pole power source 30 partially exposed to the plastic body 1 is connected to a positive voltage of about 4 volts in the chemical mineral liquid 4 至 to partially exposed to the plastic X-1 0 is a piece 1 1 'the deposition of a portion of the metal piece that is exposed to the plastic body -10, and the metal layer 12 on the W of the material i Q, The plastic body i on the surface of the Jin shop last month can keep part of the exposed metal layer! 2. As shown in the fourth figure, this; == 9/18 201140930 3 0 2 - sub-assembly The eight shell ends are connected to the positive pole of the power supply 3, the body part 1 'and the end of the bracket 3 0 2 The first specific embodiment of mass production is to make an antenna device by laser direct molding J (, StrUCtUring, LDS). The housing member 1 is laser-formed directly. The outer casing, the plastic body 1 molded by the method of casting the human mold is 1 〇 \ 1 'and a laser is formed on the plastic body 1 to form an activation zone (01), and then electroless plating is used. The metal material is deposited in the "Activating region" to form an antenna with a metal layer 12; further, while the plating is being applied, 'using an external power source 3◦ will be positive U' to prevent the metal deposited by the chemical recording from covering the metal. The method of fabricating the antenna device of the second embodiment of the invention is to form the antenna pattern 101 on the plastic body 用 by two-shot molding (two shotmolding), which includes the following Step 1 Step 1 Similarly, the metal sheet 1 1 may be embedded in the plastic body i 利用 by insert molding, and the metal sheet may be exposed to the body 1Q to form a shell. Item 1 (please match the picture shown in Figure L) The difference from the first embodiment is that the plastic material formed by the step is a non-conductor plastic material, and the metal composition does not need to be contained. In other words, the common sanitary plastic material can be applied. In the present step - ^ , and in addition to the first embodiment, the housing member can be a back cover of a row of overnight devices, such as a mobile phone back cover, etc. Next, step 2 is attached to the plastic body i Q Forming a 10/18 201140930 f antenna pattern 10 1 (please match the first A picture). Specifically, the β step is a two-shot molding method to form a conductive plastic material. On the plastic body 2 ,, to form an antenna pattern 1 〇1 for depositing metal; in other words, this step is to form a conductive I material in a predetermined area on the surface of the S-shaped knee body by two-color injection molding to form a predetermined area. The antenna pattern 1 〇1 enables the conductive metal material of the next step to be directly attached to the antenna pattern 101 on the plastic body 1Q to form an antenna capable of receiving signals. In addition, as in the first embodiment, the antenna pattern 不 is not in contact with the metal sheet 11 to prevent the subsequent step of applying a positive voltage to affect the electroless plating of the metal on the antenna pattern 丄〇1. reaction. Secondly, referring also to the first B and the fourth figure, the third step is to place the "1" into a plating solution 40 with a metal ion (such as copper ion or nickel ion). Reducing metal ions and depositing on the antenna pattern 1 〇1 to form an antenna of the metal layer 12; at the same time, providing a power source 30, and connecting the anode of the power source to a portion exposed to the plastic body 1 The metal piece ii, and the negative electrode of the power source 3 连接 is connected to the electrode 3〇1 located in the plating solution 40, to load the positive electrode, and the metal metal of the metal piece is prevented from being reduced by the metal ion. The metal layer 12 is deposited on the surface of the 11. Therefore, the metal ions in the conductive plastic slag 4 used in the second step can be directly deposited on the antenna pattern 1 ◦ 1 of the plastic ruthenium to form an antenna for receiving the signal. Furthermore, in the electroless plating process, the metal sheet i exposed to the plastic body 10 is partially exposed by the voltage of the power source 3, and the metal sheet 1 1 exposed on the plastic body 1 is generated. The metal layer 丄2 deposited on the surface of the metal piece 1 i exposed on the plastic body 11/18 201140930 1 0 is further reduced to an ionic state, so that the portion is barely exposed to the plastic body i Q The surface of the metal sheet 1 is not deposited with the metal layer 12 formed by electroless plating. Therefore, the second embodiment of the present invention utilizes a two-shot molding technique to fabricate an antenna device, in other words, the housing member 1 package 3 is molded by a die-casting method. Metal > 5 1 1 ' and another conductive plastic material is formed on the plastic body 1 by two-color injection molding to form an antenna pattern process; and a metal material is deposited on the activated region by a chemical method to form a metal The antenna of the layer 丄2, and then the 'the same day in the chemical money, using the external power supply 3 〇 will be the surface of the metal sheet. Avoid the metal deposited on the ship to cover the system! According to the first and second embodiments of the present invention, there is provided an antenna device including a plastic body 10, a genus film 1 1 and a metal layer i 2 'a metal sheet engineering system embedded in the plastic body 10 is formed to form a housing, and the metal sheet is partially exposed to the plastic body 1 〇, and the plastic body i Q has an antenna pattern W 〇 1 'metal layer 1 2 _ chemical clock deposited on The antenna pattern Η ^ is = an antenna; wherein when the metal layer i 2 is deposited by a chemical deposit, the portion of the metal plate is connected to the positive electrode of the 本体 body i 以 to load a positive voltage In the metal sheet 11, the disc layer 12 is further prevented from being deposited on the surface of the metal sheet. Please refer to the figure - which shows that the metal piece 2 is buried in the plastic body ^ 0 to form a - housing part! Stereogram. In the embodiment, the _ piece 1 may be a back cover of the mobile communication device, for example, the plastic body 10 includes an inner surface 102 and a _ phase ^^ 12/18 201140930 face 1 0 2 outer surface 1 〇 3 The sheet metal work part is exposed at the same time to the inner surface 丄〇2 and the outer surface of the back cover of the mobile communication device. However, in a variant embodiment, the metal sheet 11 may be only partially exposed to the inner surface i 〇 2 of the back cover of the mobile communication device, or only partially exposed to the outer surface of the back cover of the mobile communication device 1 〇 3. Please refer to FIG. 1A, which shows that the plastic body i 具有 has an antenna pattern 101 for depositing metal. Specifically, the antenna pattern 1〇-1 is continuously formed by the outer surface 1 〇3 of the plastic body 10 Extending to the inner surface 102 of the plastic body 10, and the antenna pattern ιοί can utilize the laser-direct-structuring (LDS) scooping method or the two-shot molding (2 shot molding). The technology is not described here; further, the antenna pattern 1 0 1 is not in contact with the metal piece 11 . Please refer to FIG. B, which shows that a metal layer 12 is formed on the antenna pattern 110 to form an antenna for receiving/transmitting signals. The structure of the metal layer 12 corresponds to the antenna pattern 110, and also extends continuously from the outer surface of the plastic body-parameter 1 to the inner surface of the plastic body 1 11 2 2 ; The metal piece 11 exposed to the plastic body 10 is connected to the positive electrode of a power source 3 to load a positive voltage to the metal piece, so that, due to the electroless plating deposition of the metal layer 丄2, „ 卩 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸The board 2◦, the conductive element 21 is assembled in an exploded view; and the second figure shows the combination diagram of the above antenna device and the circuit board 2 导电, the conductive element 2 working group, wherein the plastic body of the antenna device The bag 13/18 201140930 includes an inner surface 1 〇 2 and an outer surface workpiece 3 with respect to the inner surface 丄 0 2 , and the metal layer 12 2 is continuously extended from the outer surface 丄〇 3 of the plastic body 1 The inner surface of the plastic body i is 1 () 2, and the two ends of the conductive member 21 are electrically connected The metal layer 12 on the inner surface of the plastic body 12 and the circuit 2 〇1 on the circuit board 2 。1, whereby the wireless signal received by the metal layer 12 can be transmitted by using the conductive element 2丄To the circuit 2 G 1 ' on the circuit board 20 and vice versa, to achieve signal reception, the metal sheet 11 is tightly fitted to the plastic body 1 以 to lift the housing member i ( That is, the back cover of the mobile communication device, the strength of the structure or the function of increasing the decorative function or enhancing the electromagnetic shielding effect. However, the manufacturing method proposed by the invention can effectively avoid the metal of the chemical mine = accumulated in the metal > 1 _L, read the problem caused by the deposition of chemical metal on the metal sheet 1 . In summary, the invention has several advantages: Connect the anode of the external power supply to the buried body (4) The metal sheet, positively charged to the metal sheet, can avoid the problem caused by depositing the metal material on the metal sheet when the metal layer is removed. By the way, in the case of electroless plating, the present invention can still Metal sheet embedded and exposed to the plastic body佶1 function of function. U鸠« decorative function or button can avoid the metal plating when the metal layer is electroplated; product = 2 to solve the short circuit problem of the stripping mentioned in the prior art, and The shell material composed of the plastic body and the genus sheet has the above-mentioned materials and is relatively closed. The limit of the patent is 14/18 2 201140930, and the specification and the content of the invention are used. The equivalent technical changes are included in the scope of the present invention. [Simplified description of the drawings] The plastic body is shown in the first figure to show a three-dimensional schematic view of the metal piece of the present invention embedded in the casing member. The utility model shows a stereoscopic diagram of a plastic body of the present invention having a pattern of antennas that can be used for sinking. The figure shows that the metal layer of the present invention is formed on the antenna pattern. The figure is an exploded view of the antenna device, the circuit board, and the conductive elements of the present invention. The figure is a combination diagram of the antenna device, the circuit board, and the conductive elements of the present invention. ^ Four diagrams are chemical diagrams of the hair-shaped housing parts of the hair piece, and the positive electrode of the power source in the basin is connected to the metal piece. ', [Main component symbol description] 1 Housing member 10 Plastic body 10 1 Antenna pattern 10 2 Inner surface 11 Metal sheet 1 2 Metal layer 10 3 External surface ϋ Circuit board ^1 Conductive element 2 0 1 Line 15/18 201140930 30 Power supply 301 Electrode 3 0 2 Bracket 40 Electroless plating solution 16/18