TWI577249B - A copper foil with a carrier and a manufacturing method using the printed wiring board - Google Patents

A copper foil with a carrier and a manufacturing method using the printed wiring board Download PDF

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Publication number
TWI577249B
TWI577249B TW104126547A TW104126547A TWI577249B TW I577249 B TWI577249 B TW I577249B TW 104126547 A TW104126547 A TW 104126547A TW 104126547 A TW104126547 A TW 104126547A TW I577249 B TWI577249 B TW I577249B
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Taiwan
Prior art keywords
layer
carrier
copper foil
protective layer
bonding
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TW104126547A
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Chinese (zh)
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TW201625080A (en
Inventor
Hiroto Iida
Ayumu Tateoka
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Mitsui Mining & Smelting Co
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Publication of TW201625080A publication Critical patent/TW201625080A/en
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Publication of TWI577249B publication Critical patent/TWI577249B/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Description

附載體之銅箔及使用此之印刷配線板之製造方法 Copper foil with carrier and manufacturing method using printed wiring board using the same

本發明係關於附載體之銅箔及使用此之印刷配線板之製造方法。 The present invention relates to a copper foil with a carrier and a method of manufacturing a printed wiring board using the same.

近年來，為了提高印刷配線板之安裝密度而進行小型化，更廣泛地進行印刷配線板之多層化。如此之多層印刷配線板以輕量化或小型化為目的被利用在行動用電子機器為多。而且，該多層印刷配線板要求更減少層間絕緣層之厚度，及作為配線板的更進一步的輕量化。 In recent years, in order to increase the mounting density of printed wiring boards, miniaturization has been carried out, and multilayering of printed wiring boards has been more widely performed. Such a multilayer printed wiring board is used in many mobile electronic devices for the purpose of weight reduction or miniaturization. Further, the multilayer printed wiring board is required to further reduce the thickness of the interlayer insulating layer and to further reduce the weight of the wiring board.

作為滿足如此要求的技術，提案有於在極薄金屬層上直接形成配線層之後，進行多層化之印刷配線板之工法，就以其一而言，採用使用無芯增建法之製造方法。而且，在該無芯增建法中，提案使用支撐基板和多層配線板之剝離使用附載體箔之銅箔。例如，在專利文獻1(國際公開第2012/133638號)揭示有多層配線板之製造方法，其係使用至少具有銅箔層/剝離層/耐熱金屬層/載體箔之4層之附載體箔之銅箔，取得在該附載體箔之銅箔之載體箔表面貼上絕緣層構成材(無芯支撐體)之支撐基 板，在該支撐基板之附載體箔之銅箔的銅箔層之表面形成增建配線層而成為附增建配線層之支撐基板，取得以剝離層分離此而取得多層疊層板，對該多層疊層板施予必要之加工而取得多層印刷配線板。 As a technique for satisfying such a demand, there has been proposed a method of forming a printed wiring board by multilayering a wiring layer directly on an extremely thin metal layer, and a manufacturing method using a coreless addition method is employed. Further, in the coreless reinforcement method, it is proposed to use a copper foil with a carrier foil for peeling off the support substrate and the multilayer wiring board. For example, Patent Document 1 (International Publication No. 2012/133638) discloses a method of manufacturing a multilayer wiring board using a carrier foil having at least four layers of a copper foil layer/release layer/heat resistant metal layer/carrier foil. a copper foil obtained by attaching an insulating layer constituent material (coreless support) to the surface of the carrier foil of the copper foil with the carrier foil The board is formed with a build-up wiring layer on the surface of the copper foil layer of the copper foil with the carrier foil of the support substrate to form a support substrate with an additional wiring layer, and is obtained by separating the peeling layer to obtain a multilayer laminated board. The multilayer laminated board is subjected to necessary processing to obtain a multilayer printed wiring board.

在使用無芯增建法之多層印刷配線板之製造中，有異物附著於銅箔層上之情形。尤其，於無芯支撐體疊層於載體箔之表面時，有由於無芯支撐體(預浸體等)所引起之樹脂粉等之異物附著在銅箔層上之情形。於在附著有如此之異物的銅箔層上形成電路之時，有電路產生斷線或短路等之缺陷，可能引起良率下降。在此，提案不會受到異物之附著的影響的附載體箔之銅箔。例如，在日本專利文獻2(特開2012-094840號公報)中揭示有依序疊層第1載體金屬箔、第2載體金屬箔及基底金屬箔之多層金屬箔，即使在第1載體金屬箔之表面附著樹脂粉等之異物，藉由在與第2載體金屬箔之間剝離第1載體金屬箔，可以形成無異物影響之第2載體金屬箔之表面。第1載體金屬箔和第2載體金屬箔之間經剝離層可物理性剝離地被接合。 In the manufacture of a multilayer printed wiring board using the coreless build-up method, foreign matter adheres to the copper foil layer. In particular, when the coreless support is laminated on the surface of the carrier foil, foreign matter such as resin powder due to the coreless support (prepreg or the like) adheres to the copper foil layer. When a circuit is formed on a copper foil layer to which such a foreign matter is attached, there is a defect that the circuit is broken or short-circuited, which may cause a drop in yield. Here, the proposal is not a copper foil with a carrier foil which is affected by the adhesion of foreign matter. For example, Japanese Laid-Open Patent Publication No. 2012-094840 discloses a multilayer metal foil in which a first carrier metal foil, a second carrier metal foil, and a base metal foil are laminated in this order, even in the first carrier metal foil. A foreign matter such as a resin powder adheres to the surface, and the surface of the second carrier metal foil which is free from foreign matter can be formed by peeling the first carrier metal foil from the second carrier metal foil. The first carrier metal foil and the second carrier metal foil are bonded to each other via a release layer.

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Document]

〔專利文獻1〕國際公開第2012/133638號 [Patent Document 1] International Publication No. 2012/133638

〔專利文獻2〕日本特開2012-094840號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2012-094840

〔發明之概要〕 [Summary of the Invention]

本發明者此次得到下述見解：在附載體之銅箔之極薄銅層上設置保護層，且該保護層在至少一處的接合部被接合於極薄銅層，在除此之外的區域不接合於極薄銅層，依此可以防止在印刷配線板之製造(例如無芯工法等)異物附著於極薄銅層表面，並且可以防止在保護層剝離時極薄銅層之刮傷或粗化面之壓潰。再者，也取得下述見解：若僅切除與保護層之接合部時，能夠以剝離強度零而剝離保護層，因在保護層之剝離後之極薄銅層表面也不殘留殘渣，故後續之加工成為容易。 The present inventors have obtained the following findings: a protective layer is provided on an extremely thin copper layer of a copper foil with a carrier, and the protective layer is bonded to an extremely thin copper layer at a joint portion of at least one portion, in addition to The area is not bonded to the extremely thin copper layer, thereby preventing foreign matter from adhering to the surface of the extremely thin copper layer in the manufacture of the printed wiring board (for example, coreless method, etc.), and preventing the scratching of the extremely thin copper layer when the protective layer is peeled off. Injury or roughening of the face. Further, the following findings have been found: When only the joint portion with the protective layer is cut off, the protective layer can be peeled off with a peel strength of zero, and no residue remains on the surface of the extremely thin copper layer after peeling of the protective layer. Processing becomes easy.

因此，本發明之目的係提供一種附載體之銅箔，其係可以防止在印刷配線板之製造(例如無芯工法等)異物附著於極薄銅層表面，並且防止在保護層剝離時極薄銅層之刮痕或粗化面之壓潰，而且在保護層剝離後之極薄銅層表面不會殘留殘渣。 Accordingly, it is an object of the present invention to provide a copper foil with a carrier which prevents foreign matter from adhering to the surface of an extremely thin copper layer in the manufacture of a printed wiring board (for example, a coreless method, etc.) and prevents the thinning of the protective layer when it is peeled off. The scratch of the copper layer or the roughening surface is crushed, and no residue remains on the surface of the extremely thin copper layer after the protective layer is peeled off.

若藉由本發明之一態樣時，提供一種附載體之銅箔，其係依序具備有載體層、剝離層及極薄銅層的附載體之銅箔，其中上述附載體之銅箔在上述極薄銅層上又具備保護層，上述保護層在至少一處的保護層接合部被接合於上述極薄銅層，在上述保護層接合部以外的區域不被接合於上述極薄銅層。 According to one aspect of the present invention, there is provided a copper foil with a carrier, which is provided with a copper foil with a carrier layer, a release layer and an ultra-thin copper layer, wherein the copper foil with the carrier is in the above The ultra-thin copper layer further includes a protective layer, and the protective layer is bonded to the ultra-thin copper layer at at least one of the protective layer joint portions, and is not bonded to the ultra-thin copper layer in a region other than the protective layer joint portion.

若藉由本發明之其他態樣時，則提供一種印 刷配線板之製造方法，包含：(a)將本發明之上述態樣之附載體之銅箔疊層在無芯支撐體之單面或雙面而形成疊層體之工程；(b)切除包含上述保護層接合部之相當於上述附載體之銅箔之外圍附近之區域的部分之工程；(c)從上述附載體之銅箔剝離上述保護層而使上述極薄銅層露出之工程；(d)在上述極薄銅層上形成增建配線層而製作附增建配線層之疊層體之工程；(f)以上述剝離層使附上述增建配線層之疊層體分離而取得包含上述增建配線層之多層配線板之工程；及(g)對上述多層配線板進行加工而取得印刷配線板之工程。 Providing a print if by other aspects of the invention A method for manufacturing a brushed wiring board, comprising: (a) a process of laminating a copper foil with a carrier of the above aspect of the present invention on one side or both sides of a coreless support to form a laminate; (b) cutting off a process comprising a portion of the protective layer joint portion corresponding to a region in the vicinity of a periphery of the copper foil with the carrier; (c) a process of peeling off the protective layer from the copper foil with the carrier to expose the extremely thin copper layer; (d) forming a build-up wiring layer on the ultra-thin copper layer to form a laminate having an additional wiring layer; (f) separating the laminate having the additional wiring layer by the peeling layer A project of a multilayer wiring board including the above-mentioned additional wiring layer; and (g) a process of processing the multilayer wiring board to obtain a printed wiring board.

10‧‧‧附載體之銅箔 10‧‧‧With copper foil with carrier

12‧‧‧載體層 12‧‧‧ Carrier layer

14‧‧‧剝離層 14‧‧‧ peeling layer

16‧‧‧極薄銅層 16‧‧‧very thin copper layer

18‧‧‧保護層 18‧‧‧Protective layer

20‧‧‧保護層接合部 20‧‧‧Protective joints

22‧‧‧保護層非接合區域 22‧‧‧Protected non-joined area

24‧‧‧載體層接合部 24‧‧‧ Carrier layer joint

26‧‧‧載體層非接合區域 26‧‧‧ Carrier layer non-joining area

28‧‧‧無芯支撐體 28‧‧‧ Coreless support

30‧‧‧第一配線層 30‧‧‧First wiring layer

32‧‧‧絕緣層 32‧‧‧Insulation

34‧‧‧第二配線層 34‧‧‧Second wiring layer

36‧‧‧增建配線層 36‧‧‧Additional wiring layer

38‧‧‧多層印刷配線板 38‧‧‧Multilayer printed wiring board

40‧‧‧多層印刷配線板 40‧‧‧Multilayer printed wiring board

100‧‧‧接合對象物 100‧‧‧Material objects

102‧‧‧硬壁 102‧‧‧ hard wall

104‧‧‧超音波發送端子 104‧‧‧Ultrasonic transmitting terminal

11‧‧‧無保護層的附載體之銅箔 11‧‧‧Unprotected copper foil with carrier

圖1為表示本發明之附載體銅箔之一例的模式斜視圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic perspective view showing an example of a copper foil with a carrier of the present invention.

圖2為表示本發明之附載體銅箔之其他一例的模式剖面圖。 Fig. 2 is a schematic cross-sectional view showing another example of the copper foil with a carrier of the present invention.

圖3為表示本發明之附載體銅箔之其他一例的模式剖面圖。 Fig. 3 is a schematic cross-sectional view showing another example of the copper foil with a carrier of the present invention.

圖4為用以說明超音波接合之概念圖。 Fig. 4 is a conceptual diagram for explaining ultrasonic bonding.

圖5為表示本發明之附載體銅箔之一例之製造方法的 工程圖。 Figure 5 is a view showing a method of manufacturing a copper foil with a carrier of the present invention; Drawings.

圖6為表示本發明之印刷配線板之製造方法之一例的工程圖。 Fig. 6 is a view showing an example of a method of manufacturing a printed wiring board of the present invention.

圖7為表示本發明之印刷配線板之製造方法之一例的工程圖，表示圖6所示之工程之後續工程之圖示。 Fig. 7 is a view showing an example of a method of manufacturing a printed wiring board according to the present invention, and shows an illustration of a subsequent process of the project shown in Fig. 6.

圖8為用以說明本發明之附載體之銅箔及印刷配線板之製造方法之一態樣的工程圖。 Fig. 8 is a view showing an aspect of a method for producing a copper foil and a printed wiring board with a carrier according to the present invention.

附載體之銅箔 Copper foil with carrier

圖1表示本發明之附載體之銅箔之一例的模式斜視圖。圖1所示之附載體之銅箔10依序具備載體層12、剝離層14及極薄銅層16。該附載體之銅箔10在極薄銅層16上又具備保護層18。藉由具有保護層18，可以有效地防止在載體層12表面疊層無芯支撐體之時異物附著於極薄銅層16表面(典型上來自無芯支撐體(預浸體等)之樹脂粉。尤其，進行無芯支撐體之疊層工程的環境為來自預浸體等之飛散物多的清淨度低的環境，而且由於緩衝構件之摩擦容易產生靜電，並且在沖壓盤之周邊配置有油壓汽缸或油壓泵的環境。因此，無芯支撐體之疊層工程產生樹脂粉或汽缸潤滑劑等之異物，容易附著在極薄銅層表面，即是極薄銅層表面容易被汙染之工程。當在極薄銅層16表面存在如此之異物(尤其係有機系之異物)時，於 在其極薄銅層上進行電路形成之時，異物附著之處的電鍍不充分，會產生電路斷線等之缺陷之外，在不需要之處形成圖案電鍍用的開口，也產生電路之短絡(短路)等的缺陷。即使在如此之狀況下，因藉由使用本發明之附載體之銅箔，異物附著至極薄銅層16藉由保護層18被阻止，故可以在無異物之極薄銅層16上形成電路。其結果，難以產生因異物所引起之電路之斷線或短路等之缺陷，可以提升印刷配線板之良率。而且，保護層18在至少一處之保護層接合部20被接合於極薄銅層16，在保護層接合部20以外之區域22被接合於極薄銅層16。如此一來，保護層18僅在保護層接合部20局部性地接合於極薄銅層16而形成保護層非接合區域22，可以一面在所需最低限之接合區域(保護層接合部20)確實地將保護層18固定於極薄銅層16而防止剝離，一面極力除排在除此之外的保護層非接合區域22使極薄銅層16之表面狀態惡化之主要原因。例如，在保護層非接合區域22中因極薄銅層16與保護層18不密接，故可以防止保護層18在剝離時產生的極薄銅層16之刮傷或粗化面之壓潰。再者，在保護層非接合區域22中極薄銅層16和保護層18之間因不存在供給剝離層等之剝離強度的中間層，故若僅切除保護層接合部20時，能夠從極薄銅層16以剝離強度零剝離保護層18。因此，因在保護層剝離後之極薄銅層表面上不殘留(上述中間層等)之殘渣，故容易進行後續加工。如此一來，若藉由本發明時，可以提供一種附載體之銅箔，其係可以防 止在印刷配線板之製造(例如無芯工法等)異物附著於極薄銅層表面，並且防止在保護層剝離時極薄銅層之刮痕或粗化面之壓潰，而且在保護層剝離後之極薄銅層表面不會殘留殘渣。 Fig. 1 is a schematic perspective view showing an example of a copper foil with a carrier of the present invention. The copper foil 10 with a carrier shown in FIG. 1 is provided with a carrier layer 12, a peeling layer 14, and an ultra-thin copper layer 16, in this order. The carrier-attached copper foil 10 is further provided with a protective layer 18 on the ultra-thin copper layer 16. By having the protective layer 18, it is possible to effectively prevent foreign matter from adhering to the surface of the extremely thin copper layer 16 (typically from the coreless support (prepreg, etc.) when the coreless support is laminated on the surface of the carrier layer 12 In particular, the environment in which the coreless support is laminated is a low-purity environment from a prepreg or the like, and static electricity is easily generated by friction of the cushion member, and oil is disposed around the punching disk. The environment of the cylinder or the hydraulic pump. Therefore, the laminated work of the coreless support produces foreign matter such as resin powder or cylinder lubricant, which is easy to adhere to the surface of the extremely thin copper layer, that is, the surface of the extremely thin copper layer is easily contaminated. Engineering. When there is such a foreign matter on the surface of the extremely thin copper layer 16 (especially an organic foreign matter), When the circuit is formed on the extremely thin copper layer, the plating at the place where the foreign matter adheres is insufficient, and defects such as circuit breakage may occur, and an opening for pattern plating may be formed where it is unnecessary, and a short circuit of the circuit may also be generated. Defects such as (short circuit). Even in such a situation, by using the copper foil with the carrier of the present invention, foreign matter adheres to the ultra-thin copper layer 16 by the protective layer 18, so that an electric circuit can be formed on the ultra-thin copper layer 16 having no foreign matter. As a result, it is difficult to cause defects such as disconnection or short circuit of the circuit due to foreign matter, and the yield of the printed wiring board can be improved. Further, the protective layer 18 is bonded to the ultra-thin copper layer 16 at at least one of the protective layer bonding portions 20, and is bonded to the ultra-thin copper layer 16 at a region 22 other than the protective layer bonding portion 20. As a result, the protective layer 18 is locally bonded to the ultra-thin copper layer 16 only at the protective layer bonding portion 20 to form the protective layer non-bonding region 22, and may be at the minimum required bonding region (protective layer bonding portion 20). The protective layer 18 is surely fixed to the ultra-thin copper layer 16 to prevent peeling, and the main reason for the deterioration of the surface condition of the ultra-thin copper layer 16 by the protective layer non-bonding region 22 is excluded. For example, in the protective layer non-joining region 22, since the ultra-thin copper layer 16 and the protective layer 18 are not in close contact, it is possible to prevent the scratch of the ultra-thin copper layer 16 which is generated during the peeling of the protective layer 18 or the crushing of the roughened surface. Further, since there is no intermediate layer for supplying the peeling strength of the peeling layer or the like between the ultra-thin copper layer 16 and the protective layer 18 in the protective layer non-joining region 22, if only the protective layer bonding portion 20 is cut, the pole can be removed from the pole. The thin copper layer 16 peels off the protective layer 18 with a peel strength of zero. Therefore, since the residue (the intermediate layer or the like) remains on the surface of the ultra-thin copper layer after the protective layer is peeled off, subsequent processing is easy. In this way, according to the present invention, a copper foil with a carrier can be provided, which can prevent In the manufacture of a printed wiring board (for example, a coreless method), foreign matter adheres to the surface of the extremely thin copper layer, and the scratch of the extremely thin copper layer or the crushing of the roughened surface when the protective layer is peeled off is prevented, and the protective layer is peeled off. No residue remains on the surface of the extremely thin copper layer.

載體層12係用以支撐極薄銅層而提升其處理性之層(典型上為箔)。作為載體層之例而言，可舉出鋁箔、銅箔、不鏽鋼(SUS)箔、在表面進行金屬塗佈之樹脂薄膜等，優選為銅箔。銅箔即使為壓延銅箔及電解銅箔中之任一者亦可。載體層之厚度典型上為250μm以下，優選為12μm~200μm。 The carrier layer 12 is a layer (typically a foil) used to support an extremely thin copper layer to enhance its handleability. Examples of the carrier layer include an aluminum foil, a copper foil, a stainless steel (SUS) foil, a resin film coated with a metal on the surface, and the like, and a copper foil is preferable. The copper foil may be either a rolled copper foil or an electrolytic copper foil. The thickness of the carrier layer is typically 250 μm or less, preferably 12 μm to 200 μm.

剝離層14係具有使載體箔之撕開強度減弱，擔保該強度之安定性，並且抑制在高溫進行沖壓成形時，在載體箔和銅箔之間引起的互相擴散之功能的層。一般剝離層係被形成在載體箔之一方之表面，但是即使被形成在兩面亦可。剝離層即使為有機剝離層及無機剝離層中之任一者亦可。作為有機剝離層所使用之有機成分之例，可舉出含氮有機化合物、含硫磺有機化合物、酸羧等。作為含氮有機化合物之例，可舉出***化合物、咪唑化合物等，其中以***化合物之剝離性容易安定之點為優選。作為***化合物之例，可舉出1,2,3-苯並***、羧基苯並***、N'，N'-雙(苯並***基甲基)尿素、1H-1,2,4-***和3-氨基-1H-1,2,4-***等。作為含硫磺有機化合物之例，可舉出巰基苯、硫氰尿酸、2-苯並咪唑硫醇等。作為酸羧之例，可以舉出單酸羧、二酸羧等。另外，作為無機剝離 層所使用之無機成分之例，可舉出Ni、Mo、Co、Cr、Fe、Ti、W、P、Zn、鉻酸鹽處理膜等。並且，剝離層之形成若藉由使含有剝離層成分溶液接觸於載體箔之至少一方，使剝離層成分固定於載體箔之表面等來進行即可。於使載體箔接觸於含有剝離層成分溶液之時，該接觸若藉由浸漬於含有剝離層成分溶液、噴霧含有剝離層成分溶液、流下含有剝離層成分溶液等來進行即可。其他，亦可採用藉由蒸鍍或濺鍍等所產生的氣相等對剝離層成分進行被膜形成之方法。再者，剝離層成分朝載體箔表面之固定若藉由含有剝離層成分溶液之乾燥、含有剝離層成分溶液中之剝離層成分之電沉積來進行即可。剝離層之厚度典型上為1nm~1μm，優選為5nm~500nm。並且，剝離層14和載體箔之剝離強度為7gf/cm~50gf/cm為優選，較優選為10gf/cm~40gf/cm，更優選為15gf/cm~30gf/cm。 The release layer 14 has a function of weakening the tear strength of the carrier foil, ensuring the stability of the strength, and suppressing the function of interdiffusion between the carrier foil and the copper foil at the time of press forming at a high temperature. A general peeling layer is formed on the surface of one side of the carrier foil, but it may be formed on both sides. The release layer may be any of an organic release layer and an inorganic release layer. Examples of the organic component used in the organic release layer include a nitrogen-containing organic compound, a sulfur-containing organic compound, an acid carboxyl group, and the like. Examples of the nitrogen-containing organic compound include a triazole compound and an imidazole compound, and among them, a point where the releasability of the triazole compound is easily stabilized is preferable. Examples of the triazole compound include 1,2,3-benzotriazole, carboxybenzotriazole, N', N'-bis(benzotriazolylmethyl)urea, and 1H-1,2. , 4-triazole and 3-amino-1H-1,2,4-triazole and the like. Examples of the sulfur-containing organic compound include mercaptobenzene, thiocyanuric acid, 2-benzimidazolethiol, and the like. Examples of the acid carboxyl group include a monocarboxylic acid carboxyl group and a dicarboxylic acid carboxyl group. In addition, as inorganic stripping Examples of the inorganic component used in the layer include Ni, Mo, Co, Cr, Fe, Ti, W, P, Zn, and a chromate-treated film. Further, the formation of the release layer may be carried out by bringing the release layer component solution into contact with at least one of the carrier foils, and fixing the release layer component to the surface of the carrier foil or the like. When the carrier foil is brought into contact with the solution containing the release layer component, the contact may be carried out by immersing in the solution containing the release layer component, spraying the solution containing the release layer component, and flowing the solution containing the release layer component. Alternatively, a method of forming a film of a peeling layer component by a vapor phase or the like generated by vapor deposition or sputtering may be employed. Further, the adhesion of the release layer component to the surface of the carrier foil may be carried out by electrodeposition of the release layer component containing the release layer component solution and the release layer component in the release layer component solution. The thickness of the release layer is typically from 1 nm to 1 μm, preferably from 5 nm to 500 nm. Further, the peeling strength of the release layer 14 and the carrier foil is preferably from 7 gf/cm to 50 gf/cm, more preferably from 10 gf/cm to 40 gf/cm, still more preferably from 15 gf/cm to 30 gf/cm.

極薄銅層16即使為附載體極薄銅箔所採用之眾知的構成即可，並不特別限定。例如，極薄銅層16即使為藉由無電解鍍銅法及電解鍍銅法等之濕式成膜法、濺鍍及化學蒸鍍等之乾式成膜法或係該些組合來形成亦可。極薄銅層16之優選厚度為0.05μm~7μm，較優選為0.075μm~5μm，更優選為0.09μm~4μm。極薄銅層16以在保護層側之表面具備有粗面而構成為優選。藉由設成粗面，可以提升印刷配線板製造時之金屬層和樹脂層之密接性。以依據粗面之JIS B 0601(2001)而測量之算術平均粗度Ra為50nm以上為優選，較優選為50~1000nm，更 優選為80~800nm。粗化表面因具有脆弱之微細構造，故具有些微接觸容易損傷之性質，但是本發明之附載體之銅箔由於在保護層非接合區域22中極薄銅層16與保護層18密接，故可以防止保護層18剝離時極薄銅層16之粗面壓潰。如此一來可以一面維持理想的粗面之形態，一面防止異物附著於極薄銅層16表面。 The ultra-thin copper layer 16 is not particularly limited as long as it is a well-known structure used for attaching a carrier ultra-thin copper foil. For example, the ultra-thin copper layer 16 may be formed by a dry film formation method such as an electroless copper plating method or an electrolytic copper plating method, a dry film formation method such as sputtering or chemical vapor deposition, or a combination thereof. . The thickness of the ultra-thin copper layer 16 is preferably 0.05 μm to 7 μm, more preferably 0.075 μm to 5 μm, still more preferably 0.09 μm to 4 μm. The ultra-thin copper layer 16 is preferably formed by providing a rough surface on the surface of the protective layer side. By providing a rough surface, the adhesion between the metal layer and the resin layer at the time of manufacture of the printed wiring board can be improved. The arithmetic mean roughness Ra measured in accordance with JIS B 0601 (2001) of the rough surface is preferably 50 nm or more, more preferably 50 to 1000 nm, and more preferably It is preferably 80 to 800 nm. Since the roughened surface has a fragile fine structure, it has some properties that the microcontact is easily damaged. However, since the copper foil with the carrier of the present invention is in close contact with the protective layer 18 in the non-bonding region 22 of the protective layer, The rough surface of the extremely thin copper layer 16 is prevented from being crushed when the protective layer 18 is peeled off. In this way, it is possible to prevent the foreign matter from adhering to the surface of the ultra-thin copper layer 16 while maintaining the desired rough surface.

即使依照期望，在剝離層14和載體層12及/或極薄銅層16之間設置其他功能層亦可。作為如此之其他的功能層之例，可舉出輔助金屬層。輔助金屬層以由鎳及/或鈷為優選。藉由在載體層12之表面側及/或極薄銅層16之表面側形成如此之輔助金屬層，可以抑制於高溫或長時間之熱間沖壓成形時在載體層12和極薄銅層16之間引起的互相擴散，並擔保載體層之撕開強度之安定性。輔助金屬層之厚度以設為0.001~3μm。 Other functional layers may be provided between the release layer 14 and the carrier layer 12 and/or the ultra-thin copper layer 16 as desired. As an example of such other functional layers, an auxiliary metal layer can be mentioned. The auxiliary metal layer is preferably made of nickel and/or cobalt. By forming such an auxiliary metal layer on the surface side of the carrier layer 12 and/or the surface side of the ultra-thin copper layer 16, it is possible to suppress the carrier layer 12 and the ultra-thin copper layer 16 during high-temperature or long-time hot stamping. The mutual diffusion between the two causes the stability of the tear strength of the carrier layer. The thickness of the auxiliary metal layer is set to 0.001 to 3 μm.

保護層18若為可覆蓋極薄銅層16之表面而阻止異物附著者即可，並不特別限定，但是以金屬箔或樹脂薄膜之處理性良好之點為優選，以金屬箔更優選。即使在金屬箔或樹脂薄膜之表面施予帶電防止處理亦可。再者，理想上係在保護層18之表面不塗佈用以確保保護層非接合區域22之接著劑。於保護層18為金屬箔之時，作為金屬箔之例，可舉出鋁箔、鐵箔、不鏽鋼(SUS)箔、鈦箔及銅箔，但是從保護層18剝離時之處理性之點來看以比重較構成極薄銅層16之銅低的金屬箔之鋁箔、鐵箔、不鏽鋼(SUS)箔及鈦箔為優選。更優選係從不傷及 極薄銅層16之表面之點來看以彈性率較構成極薄銅層16之銅低的金屬箔的鋁箔為特佳。保護層18之優選厚度為10~300μm，較優選為12~200μm，更優選為15~100μm。 The protective layer 18 is not particularly limited as long as it can cover the surface of the ultra-thin copper layer 16 and prevents foreign matter from adhering thereto. However, it is preferable that the metal foil or the resin film is reasonably good, and the metal foil is more preferable. Even if the surface of the metal foil or the resin film is subjected to the charging prevention treatment. Further, it is desirable that the surface of the protective layer 18 is not coated with an adhesive for ensuring the non-bonding region 22 of the protective layer. When the protective layer 18 is a metal foil, examples of the metal foil include aluminum foil, iron foil, stainless steel (SUS) foil, titanium foil, and copper foil. However, when the protective layer 18 is peeled off, it is rational. Aluminum foil, iron foil, stainless steel (SUS) foil, and titanium foil having a metal foil having a lower specific gravity than copper constituting the ultra-thin copper layer 16 are preferable. More preferably, it never hurts From the point of view of the surface of the ultra-thin copper layer 16, it is particularly preferable that the aluminum foil having a lower modulus of elasticity than the metal foil constituting the ultra-thin copper layer 16 is used. The protective layer 18 preferably has a thickness of 10 to 300 μm, more preferably 12 to 200 μm, still more preferably 15 to 100 μm.

再者，為了防止藉由與接觸之極薄銅層16之表面的摩擦而傷及極薄銅層16之表面，使保護層18之至少與極薄銅層16相向之側的表面，平滑成不會產生處理所致之滑溜的程度為理想。具體而言，保護層18之表面依據JIS B 0601(2001)而測量之算術平均粗度Ra為400nm以下為優選，較優選為20~350nm，更優選為30~320nm。並且，保護層18之不與極薄銅層16相向之側之表面雖然也在上述算術平均粗度之範圍，但是以防止附載體之銅箔捆包時之摩擦所致的異物產生之點為優選。 Further, in order to prevent the surface of the ultra-thin copper layer 16 from being damaged by friction with the surface of the extremely thin copper layer 16 that is in contact with it, the surface of the protective layer 18 facing at least the side opposite to the ultra-thin copper layer 16 is smoothed. It is ideal that the degree of slippage caused by the treatment does not occur. Specifically, the arithmetic mean roughness Ra measured on the surface of the protective layer 18 in accordance with JIS B 0601 (2001) is preferably 400 nm or less, more preferably 20 to 350 nm, still more preferably 30 to 320 nm. Further, although the surface of the protective layer 18 on the side opposite to the ultra-thin copper layer 16 is also in the range of the arithmetic mean roughness described above, the point of preventing foreign matter generated by the friction when the copper foil with the carrier is bundled is Preferably.

保護層18在至少一處之保護層接合部20被接合於極薄銅層16，在保護層接合部20以外之保護層非接合區域22被接合於極薄銅層16。保護層接合部20因於印刷配線板製造時被切除，故以盡量確保寬廣的保護層非接合區域22而可以使可能形成增建配線層之區域最大化之方式，在附載體之銅箔之外圍附近設置期待之形狀，理想上設置成線狀及/或點狀為佳。藉由將保護層接合部20設置成線狀及/或點狀，可以盡量在接近外圍之位置，以最低限之接合面積，將保護層18接合在極薄銅層16。保護層接合部20係為了防止保護層18從單側向上捲曲，以被設置在構成附載體之銅箔10之外圍之相對的至少兩 邊之附近為優選，即使設置在三邊至四邊之附近亦可。於被設置在四邊附近之時，即使四邊附近之線狀至點狀之保護層接合部20全體被形成呈現出框狀或格子圖案之概略形狀亦可。並且，在上述各邊上，即使以連續之線狀設置亦可，即使在邊上之任意的座標上設置成點狀亦可。構成附載體之銅箔之外圍附近至構成外周之邊的附近，優選為從極薄銅層之外緣起0~50mm內側之區域，較優選為從外緣起1~45mm內側之區域，更優選為從外緣起3~40mm內側之區域。即是，如圖2所示般，保護層接合部20即使被形成在極薄銅層之外緣本身亦可，即使如圖1及3所示般保護層接合部20被形成在從極薄銅層之外緣起特定距離內側之區域亦可。再者，以將保護層接合部20設置成線狀之時的接合寬度以0.05~10mm為優選，較優選為0.1~8mm，更優選為0.2~6mm。 The protective layer 18 is bonded to the ultra-thin copper layer 16 at at least one of the protective layer bonding portions 20, and the protective layer non-bonding region 22 outside the protective layer bonding portion 20 is bonded to the ultra-thin copper layer 16. Since the protective layer bonding portion 20 is cut off during the manufacture of the printed wiring board, the wide protective layer non-bonding region 22 can be ensured as much as possible, and the area where the additional wiring layer can be formed can be maximized, in the copper foil with the carrier. The desired shape is set in the vicinity of the periphery, and it is preferable to set it in a line shape and/or a dot shape. By providing the protective layer bonding portion 20 in a line shape and/or a dot shape, the protective layer 18 can be bonded to the ultra-thin copper layer 16 with a minimum bonding area as close as possible to the periphery. The protective layer bonding portion 20 is for preventing the protective layer 18 from being curled upward from one side to be disposed at least two opposite sides of the copper foil 10 constituting the attached carrier. It is preferable to be near the sides, even if it is arranged in the vicinity of three sides to four sides. When it is provided in the vicinity of the four sides, the entire protective layer joint portion 20 in the form of a line to a dot in the vicinity of the four sides may be formed into a general shape in which a frame shape or a lattice pattern is formed. Further, each of the sides may be provided in a continuous line shape, and may be provided in a dot shape on any of the sides. The vicinity of the periphery of the copper foil constituting the carrier to the side constituting the outer periphery is preferably a region of 0 to 50 mm from the outer edge of the ultra-thin copper layer, and more preferably a region of 1 to 45 mm from the outer edge, and more preferably The area inside the 3~40mm from the outer edge. That is, as shown in FIG. 2, even if the protective layer joint portion 20 is formed on the outer edge of the ultra-thin copper layer, even if the protective layer joint portion 20 is formed at a very thin level as shown in FIGS. The outer edge of the copper layer may also be an area inside the specific distance. In addition, the joint width when the protective layer joint portion 20 is formed in a linear shape is preferably 0.05 to 10 mm, more preferably 0.1 to 8 mm, still more preferably 0.2 to 6 mm.

保護層接合部20中之接合若藉由可以接合成保護層18和極薄銅層16不容易剝離之方法來進行即可不用特別限定，但是以藉由從超音波接合、雷射接合、接縫接合及接著劑塗佈所構成之群組中選擇出之至少任一種來進行為優選，在可以一面施加荷重一面確實且有效率地溶接之點上以超音波接合為特優選。超音波接合(也稱為超音波溶接)係如圖4示意性表示般，在硬壁102和超音波發送端子(喇叭)104之間夾持以兩種以上之材料所構成之接合對象物100，一面對超音波發送端子104施加荷重L(壓力)一面將超音波振動傳達至接合對象物100。此 時，藉由在超音波振幅之最大點局部地高達至數百℃~千℃之高溫，使得接合界面被合金化，而實現接合。超音波接合所使用之諸條件並不特別限定，以超音波頻率為5~100KHz為優選，較優選為10~80KHz。輸出為100~5000W為優選，較優選為200~4000W。荷重(加壓力)以0.05~500MPa為優選，較優選為0.5~300MPa，更優選為1~100MPa。再者，藉由以高頻率進行超音波接合，接合效果變高。因此，對接合部以外造成的損傷變小之點來看，以高頻率且高搬運速度(即是，短傳達時間)進行超音波接合為有利。但是，於接合對象大(厚)之時，需要大加壓力和長傳達時間。再者，為了使大加壓力之端子振動，需要大輸出。因此，以一面審酌該些要因，一面決定適當條件為佳。 The bonding in the protective layer bonding portion 20 can be carried out by a method in which the protective layer 18 and the ultra-thin copper layer 16 can be easily peeled off without being particularly limited, but by ultrasonic bonding, laser bonding, and bonding. It is preferable to carry out at least one selected from the group consisting of seam bonding and adhesive application, and it is particularly preferable to ultrasonically bond at a point where the load can be surely and efficiently melted while applying a load. Ultrasonic bonding (also referred to as ultrasonic welding) is a bonding object 100 composed of two or more kinds of materials sandwiched between the hard wall 102 and the ultrasonic transmission terminal (horn) 104 as schematically shown in FIG. The ultrasonic vibration is transmitted to the bonding target object 100 while applying a load L (pressure) to the ultrasonic transmission terminal 104. this At this time, the joint is alloyed by the high temperature locally at the maximum point of the ultrasonic amplitude to achieve bonding. The conditions used for the ultrasonic bonding are not particularly limited, and the ultrasonic frequency is preferably 5 to 100 kHz, more preferably 10 to 80 kHz. The output is preferably from 100 to 5000 W, more preferably from 200 to 4000 W. The load (pressure) is preferably 0.05 to 500 MPa, more preferably 0.5 to 300 MPa, still more preferably 1 to 100 MPa. Furthermore, by performing ultrasonic bonding at a high frequency, the bonding effect becomes high. Therefore, it is advantageous to perform ultrasonic bonding at a high frequency and a high conveyance speed (that is, a short conveyance time) in view of the fact that the damage caused by the joint portion is small. However, when the joint object is large (thick), a large pressing force and a long conveying time are required. Furthermore, in order to vibrate the terminal of the large pressing force, a large output is required. Therefore, it is better to decide the appropriate conditions while considering these factors.

載體層12係以在至少一處的載體層接合部24，較載體層接合部24以外之區域26(載體層非接合區域26)難剝離之方式，被接合於極薄銅層16為佳。藉由設置該載體層接合部24，可以防止藥液滲入增建配線形成時之載體層12和極薄銅層16之間。當容許於增建配線形成時如此之藥液滲入時，則有促進附載體箔之銅箔剝落之虞，導致製造良率下降。此點，可以藉由設置載體層接合部24，迴避或降低如此之問題。尤其，在以往進行以膠帶等遮蔽附載體之銅箔的端面以防止藥液滲入，但是藉由設置載體層接合部24，可以不用如此之繁雜的遮蔽，可以謀求製造工程之簡化。但是，即使併用本態樣之載體 層接合部24和遮蔽當然亦可。 The carrier layer 12 is preferably bonded to the ultra-thin copper layer 16 such that the carrier layer bonding portion 24 at least one portion is less likely to be peeled off from the region 26 other than the carrier layer bonding portion 24 (the carrier layer non-bonding region 26). By providing the carrier layer joint portion 24, it is possible to prevent the chemical solution from penetrating between the carrier layer 12 and the ultra-thin copper layer 16 at the time of formation of the build-up wiring. When such a chemical solution is allowed to permeate when the additional wiring is formed, there is a possibility that the copper foil with the carrier foil is peeled off, resulting in a decrease in manufacturing yield. At this point, such a problem can be avoided or reduced by providing the carrier layer joint portion 24. In particular, the end surface of the copper foil with the carrier is shielded by a tape or the like to prevent the penetration of the chemical solution. However, by providing the carrier layer joint portion 24, it is possible to eliminate the complicated shielding and to simplify the manufacturing process. However, even if the carrier of this aspect is used together The layer joints 24 and the shields are of course also possible.

如圖1~3所示般，載體層接合部24之至少一部分不與保護層接合部20重疊，並且以被設置在較以保護層接合部20所包圍之區域22內側之區域為佳。如此一來，因可以一面殘留位於上述內側之區域的載體層接合部24之至少一部分，一面切除保護層接合部20，故即使在保護層接合部20及保護層18被除去之狀態下，亦可以確實地取得因載體層接合部24所致之藥劑滲入防止效果。 As shown in FIGS. 1 to 3, at least a portion of the carrier layer joint portion 24 does not overlap the protective layer joint portion 20, and is preferably provided in a region inside the region 22 surrounded by the protective layer joint portion 20. In this manner, since at least a part of the carrier layer joint portion 24 located in the inner region is left, the protective layer joint portion 20 is cut off, so that even when the protective layer joint portion 20 and the protective layer 18 are removed, The effect of preventing penetration of the drug by the carrier layer joint portion 24 can be surely obtained.

載體層接合部24係在構成附載體之銅箔10之外圍之相對的兩邊或四邊之附近被設置成長條狀為佳。藉由成為如此之構成，可以確實地防止載體層12和極薄銅層16之剝離，並且可以防止或抑制藥液侵入至載體層12和極薄銅層16。因此，載體層接合部24係以在四邊之附近設置成長條狀，較僅有構成上述外周之相對的兩邊為優選，更優選係以藉由四邊之附近被設置成長條狀之四根載體層接合部24彼此相接或相交而形成框狀或格子圖案為佳。若藉由如此之構成時，可以更確實地防止藥液侵入至載體層12和極薄銅層16。在此，關於載體層接合部24，構成附載體之銅箔之外圍的邊之附近，以較藉由保護層接合部20所包圍之區域22更內側之區域為佳，優選為從極薄銅層之外緣起1~50mm內側之區域，較優選為從外緣起2~40mm內側之區域，更優選為從外緣起3~30mm內側之區域。再者，以將載體層接合部24設置成長 條狀之時的接合寬度以0.05~10mm為優選，較優選為0.1~8mm，更優選為0.2~6mm。 It is preferable that the carrier layer joint portion 24 is formed in a strip shape in the vicinity of the opposite sides or four sides of the outer periphery of the copper foil 10 constituting the carrier. By such a configuration, peeling of the carrier layer 12 and the ultra-thin copper layer 16 can be surely prevented, and the intrusion of the chemical solution into the carrier layer 12 and the ultra-thin copper layer 16 can be prevented or suppressed. Therefore, the carrier layer joint portion 24 is preferably formed in a strip shape in the vicinity of the four sides, and is preferably formed on only two sides constituting the outer circumference. More preferably, four carrier layers are provided in a strip shape by the vicinity of the four sides. It is preferable that the joint portions 24 are in contact with each other or intersect each other to form a frame shape or a lattice pattern. According to this configuration, it is possible to more reliably prevent the intrusion of the chemical solution into the carrier layer 12 and the ultra-thin copper layer 16. Here, as for the carrier layer joint portion 24, the vicinity of the side of the outer periphery of the copper foil constituting the carrier is preferably the inner side of the region 22 surrounded by the protective layer joint portion 20, preferably from the extremely thin copper. The area on the inner side of the layer from 1 to 50 mm is more preferably an inner side of 2 to 40 mm from the outer edge, and more preferably an inner side of the outer edge of 3 to 30 mm. Furthermore, the carrier layer joint portion 24 is set to grow. The joint width at the time of the strip shape is preferably 0.05 to 10 mm, more preferably 0.1 to 8 mm, still more preferably 0.2 to 6 mm.

載體層接合部24中之接合若藉由可以確實接合成載體層12和極薄銅層16之方法來進行即可不用特別限定，但是以藉由從超音波接合、雷射接合、接縫接合所構成之群組中選擇出之至少任一種來進行為優選，在可以一面施加荷重一面確實且有效率地溶接之點上以超音波接合為特優選。針對超音波接合之詳細如同上述。 The bonding in the carrier layer bonding portion 24 is not particularly limited as long as it can be surely bonded to the carrier layer 12 and the ultra-thin copper layer 16, but by ultrasonic bonding, laser bonding, and seam bonding. It is preferable to carry out at least one of the selected groups, and it is particularly preferable to perform ultrasonic bonding at a point where the load can be surely and efficiently melted while applying a load. The details for ultrasonic bonding are as described above.

如圖2及圖3所示般，保護層接合部20即使重疊於載體層接合部24之一部分亦可。該型態係於例如藉由超音波接合、雷射接合、接縫接合等之接合形成保護層接合部20之時，可同時實現之構成。即是，若藉由該些接合手法時，藉由適當設定整合條件，可以同時實現保護層18和極薄銅層16之接合(即是，保護層接合部20之形成)和載體層12和極薄銅層16之接合(即是，載體層接合部24之形成)。此時，因成為不使用接著劑之接合，故有不用考慮接著劑之滲入區域即可之優點。再者，藉由保護層接合部20與載體層接合部24一體化，有即使附載體之銅箔彎曲，或繁雜處理，載體層12也難以從一體品剝離的處理耐性優良的優點。 As shown in FIGS. 2 and 3, the protective layer joint portion 20 may be overlapped with one portion of the carrier layer joint portion 24. This configuration can be realized at the same time when the protective layer bonding portion 20 is formed by, for example, bonding by ultrasonic bonding, laser bonding, seam bonding, or the like. That is, when the bonding method is employed, the bonding of the protective layer 18 and the ultra-thin copper layer 16 (that is, the formation of the protective layer bonding portion 20) and the carrier layer 12 can be simultaneously achieved by appropriately setting the integration conditions. The bonding of the very thin copper layer 16 (i.e., the formation of the carrier layer bonding portion 24). In this case, since the bonding is not performed using the adhesive, there is an advantage that the penetration region of the adhesive is not considered. Further, by integrating the protective layer bonding portion 20 and the carrier layer bonding portion 24, there is an advantage that the carrier layer 12 is difficult to be peeled off from the integrated product even if the copper foil with the carrier is bent or complicated.

圖5表示不僅保護層接合部20，也具有載體層接合部24之附載體之銅箔10之較佳製造方法之一例。在圖5所示之製造方法中，如圖5(A)所示般，準備無保護層的附載體之銅箔11，對此，如圖5(B)所示般， 使用超音波接合等之接合手法，以在外緣四邊之附近設置成長條狀之四根載體層接合部24彼此相交而形成框狀或格子狀之區域之方式，將載體層12接合於極薄銅層16。接著，如圖5(C)所示般，在形成有載體層接合部24之無保護層的附載體之銅箔11上載置保護層18。最後，如圖5(D)所示般，以使用超音波接合等之接合手法，保護層接合部20被設置在構成附載體之銅箔10之外圍之相對的至少兩邊之附近之方式，將保護層18接合於極薄銅層16為佳。此時，載體層接合部24之至少一部分不與保護層接合部20重疊，並且以被設置在較以保護層接合部20所包圍之區域22內側之區域為優選。如此一來，因可以一面殘留位於上述內側之區域的載體層接合部24之至少一部分，一面切除保護層接合部20，故即使在保護層接合部20及保護層18被除去之狀態下，亦可以確實地取得因載體層接合部24所致之藥劑滲入防止效果。並且，以在保護層接合部20之正下方也實現載體層12和極薄銅層16之接合而構成載體層接合部24之一部分為優選，該構成可以在藉由超音波接合之接合手段而形成保護層接合部20之時同時形成。 Fig. 5 shows an example of a preferred method of manufacturing the copper foil 10 with the carrier layer of the carrier layer joint portion 24, not only the protective layer joint portion 20. In the manufacturing method shown in FIG. 5, as shown in FIG. 5(A), a copper foil 11 with a carrier having no protective layer is prepared, and as shown in FIG. 5(B), The carrier layer 12 is bonded to the ultra-thin copper by a bonding method such as ultrasonic bonding, in which four carrier layer bonding portions 24 having a strip shape are formed in the vicinity of four sides of the outer edge to form a frame-like or lattice-like region. Layer 16. Next, as shown in FIG. 5(C), the protective layer 18 is placed on the copper foil 11 with the carrier having the unprotected layer of the carrier layer bonding portion 24. Finally, as shown in FIG. 5(D), the protective layer bonding portion 20 is provided in the vicinity of at least two sides of the opposite sides of the copper foil 10 constituting the carrier by a bonding method using ultrasonic bonding or the like. It is preferred that the protective layer 18 is bonded to the very thin copper layer 16. At this time, at least a part of the carrier layer joint portion 24 does not overlap the protective layer joint portion 20, and is preferably provided in a region inside the region 22 surrounded by the protective layer joint portion 20. In this manner, since at least a part of the carrier layer joint portion 24 located in the inner region is left, the protective layer joint portion 20 is cut off, so that even when the protective layer joint portion 20 and the protective layer 18 are removed, The effect of preventing penetration of the drug by the carrier layer joint portion 24 can be surely obtained. Further, it is preferable to form a portion of the carrier layer bonding portion 24 by bonding the carrier layer 12 and the ultra-thin copper layer 16 directly under the protective layer bonding portion 20, and this configuration can be performed by means of ultrasonic bonding. The protective layer joint portion 20 is formed at the same time.

圖8表示對從滾筒抽出之無保護層的附載體之銅箔11而藉由超音波接合進行載體層接合部24之形成及保護層18之接合(即是保護層接合部20之形成)之工程之一例。首先，如圖8(A)所示般，對從滾筒抽出之無保護層的附載體之銅箔11藉由超音波接合以相對於搬 運方向成為平行及垂直方向之長條狀(即是格子狀)之方式，形成載體層接合部24。接著，如圖8(B)所示般，保護層18(例如，鋁箔)被載置在極薄銅層16上，在長條狀附載體之銅箔之兩端附近，藉由超音波接合以直線狀之方式形成保護層接合部20。如此一來，在被形成在箔寬度方向之載體層接合部24之中央，切斷設置有保護層18之長條狀之附載體之銅箔，取得如圖8(C)所示般之片狀之附載體之銅箔10。在該片狀之附載體之銅箔10，於構成其外圍之四邊之附近，以與該些邊平行且框狀之方式，形成載體層接合部24，並且在其框狀之載體層接合部24之外側的相對之兩邊附近形成有保護層接合部20。如此一來，使用保護層18在相對之兩邊之附近被接合的附載體之銅箔，疊層無芯支撐體(無圖示)之後，如圖8(D)所示般，在以載體層接合部24所包圍之區域之外側，切斷包含保護層接合部20之區域。如此一來，一面在外圍附近以框狀方式殘留有助於防止增建配線層形成時藥液滲入之載體層接合部24，一面剝離保護層18，而成為適合於如圖8(E)所示之增建配線層之形成的型態。並且，載體層接合部24包含載體層和極薄銅層之接合部不僅一邊而係被形成複數邊並列之形狀。 Fig. 8 shows the formation of the carrier layer joint portion 24 and the bonding of the protective layer 18 (i.e., the formation of the protective layer joint portion 20) by ultrasonic bonding of the copper foil 11 with a carrier having no protective layer extracted from the drum. An example of a project. First, as shown in Fig. 8(A), the copper foil 11 with the unprotected layer of the unprotected layer taken out from the drum is ultrasonically joined to move relative to the carrier. The carrier layer joint portion 24 is formed in such a manner that the transport direction is a strip shape (that is, a lattice shape) in parallel and in the vertical direction. Next, as shown in FIG. 8(B), a protective layer 18 (for example, an aluminum foil) is placed on the ultra-thin copper layer 16 by ultrasonic bonding in the vicinity of both ends of the elongated copper foil with the carrier. The protective layer joint portion 20 is formed in a straight line. In this manner, in the center of the carrier layer joint portion 24 formed in the width direction of the foil, the long copper foil with the protective layer 18 is cut, and the sheet as shown in Fig. 8(C) is obtained. A copper foil 10 with a carrier attached thereto. In the sheet-like copper foil 10 with a carrier, in the vicinity of the four sides constituting the periphery thereof, the carrier layer joint portion 24 is formed in a manner parallel to the sides and in a frame shape, and the carrier layer joint portion in the frame shape is formed. A protective layer joint portion 20 is formed in the vicinity of the opposite sides of the outer side of the outer surface. In this manner, after the copper foil with the carrier in which the protective layer 18 is bonded in the vicinity of the opposite sides, the coreless support (not shown) is laminated, as shown in FIG. 8(D), the carrier layer is used. On the outer side of the region surrounded by the joint portion 24, the region including the protective layer joint portion 20 is cut. In this manner, the protective layer 18 is peeled off in a frame-like manner in the vicinity of the periphery to prevent the carrier layer joint portion 24 from entering the chemical layer during the formation of the additional wiring layer, and is suitable as shown in FIG. 8(E). The type of formation of the additional wiring layer is shown. Further, the carrier layer joint portion 24 includes a joint portion of the carrier layer and the ultra-thin copper layer in a shape in which not only one side but also a plurality of sides are formed.

印刷配線板之製造方法 Printed wiring board manufacturing method

可以使用上述本發明之使用附載體之銅箔而較佳地製造出印刷配線板。若藉由本發明之較佳態樣時，印刷配線 板之製造係可以藉由下述來進行：(a)在無芯支撐體之單面或兩面疊層本發明之附載體之銅箔，(b)切除包含保護層接合部之相當於附載體之銅箔之外圍附近之區域的部分，(c)從附載體之銅箔剝離保護層而使極薄銅層露出，(d)在極薄銅層上形成增建配線層，(f)在剝離層分離所取得之附增建配線層之疊層體，(g)對所取得之多層配線板進行加工。如上述般，藉由使用本發明之附載體之銅箔，可以利用防止在無芯支撐體之疊層時異物附著於極薄銅層表面，並且防止在保護層剝離時極薄銅層之刮痕或粗化面之壓潰，而且在保護層剝離後之極薄銅層表面不會殘留殘渣之手法，製造出印刷配線板。 The printed wiring board can be preferably manufactured by using the above-described copper foil of the present invention using a carrier. Printed wiring when using the preferred aspect of the invention The manufacture of the board can be carried out by (a) laminating the copper foil of the present invention on one or both sides of the coreless support, and (b) cutting off the equivalent carrier containing the joint of the protective layer. a portion of the region near the periphery of the copper foil, (c) peeling off the protective layer from the copper foil with the carrier to expose the ultra-thin copper layer, (d) forming an additional wiring layer on the extremely thin copper layer, (f) The laminate of the additional wiring layer obtained by the separation layer is separated, and (g) the obtained multilayer wiring board is processed. As described above, by using the copper foil with a carrier of the present invention, it is possible to prevent foreign matter from adhering to the surface of the extremely thin copper layer when laminating the coreless support, and to prevent scratching of the extremely thin copper layer when the protective layer is peeled off. A printed wiring board is produced by crushing a roughened or roughened surface and leaving no residue on the surface of the extremely thin copper layer after the protective layer is peeled off.

以下，一面參考圖6及7一面針對各工程進行說明。並且，圖6及圖7所示之態樣，為了簡化說明，描繪出以在無芯支撐體28之單面設置附載體之銅箔10而形成增建配線層36，但是以在無芯支撐體28之兩面設置附載體之銅箔10而對該兩面形成增建配線層36為理想。 Hereinafter, each project will be described with reference to FIGS. 6 and 7. 6 and 7, in order to simplify the description, the copper foil 10 with a carrier provided on one side of the coreless support 28 is formed to form the additional wiring layer 36, but in the coreless support. It is preferable that the copper foil 10 with a carrier is provided on both sides of the body 28, and the additional wiring layer 36 is formed on both surfaces.

(a)疊層體之形成 (a) Formation of laminate

在該工程(a)中，如圖6(A)所示般，在無芯支撐體28之單面或兩面疊層本發明之上述態樣所產生的附載體之銅箔10而形成疊層體。該疊層若在通常之印刷配線板製造製程中依照銅箔和預浸物等之疊層所採用之眾知條件及方法而執行即可。無芯支撐體28典型上為樹脂，以包含絕緣性樹脂而構成為優選。無芯支撐體28係以預浸 物及/或樹脂片為優選，較優選為預浸物。預浸物指使合成樹脂浸漬在合成樹脂板、玻璃板、玻璃織布、玻璃不織布、紙等之基材的複合材料之總稱。作為浸漬於預浸物之絕緣性樹脂之較佳例，可舉出環氧樹脂、氰酸酯樹脂、雙馬來醯亞胺三嗪樹脂(BT樹脂)、聚苯醚樹脂、酚樹脂等。再者，作為構成樹脂片之絕緣性樹脂之例，可舉出環氧樹脂、聚醯亞胺樹脂、聚酯樹脂等之絕緣樹脂。再者，從提升絕緣性之等之觀點來看即使無芯支撐體28含有由二氧化矽、氧化鋁等之各種無機粒子所構成之填料粒子等亦可。無心支撐體28之厚度並不特別限定，以3~1000μm為優選，較優選為5~400μm，更優選為10~200μm。 In the process (a), as shown in Fig. 6(A), the copper foil 10 with a carrier produced by the above aspect of the invention is laminated on one side or both sides of the coreless support 28 to form a laminate. body. This laminate may be carried out in accordance with known conditions and methods employed in the lamination of a copper foil, a prepreg or the like in a usual printed wiring board manufacturing process. The coreless support 28 is typically a resin, and is preferably composed of an insulating resin. Coreless support 28 is prepreg A substance and/or a resin sheet is preferred, and a prepreg is more preferred. The prepreg refers to a general term for a composite material in which a synthetic resin is immersed in a substrate of a synthetic resin sheet, a glass plate, a glass woven fabric, a glass nonwoven fabric, a paper or the like. Preferable examples of the insulating resin immersed in the prepreg include an epoxy resin, a cyanate resin, a bismaleimide triazine resin (BT resin), a polyphenylene ether resin, and a phenol resin. In addition, examples of the insulating resin constituting the resin sheet include an insulating resin such as an epoxy resin, a polyimide resin, or a polyester resin. In addition, the coreless support body 28 may contain filler particles composed of various inorganic particles such as cerium oxide or alumina, from the viewpoint of improving the insulating properties. The thickness of the centerless support 28 is not particularly limited, and is preferably 3 to 1000 μm, more preferably 5 to 400 μm, still more preferably 10 to 200 μm.

(b)保護層接合部之切除 (b) Removal of the joint of the protective layer

在該工程(b)中，切除包含保護層接合部20之相當於附載體之銅箔10之外圍附近之區域的部分。此時，如圖6(A)之虛線所示般，以在由保護層接合部20所包圍之區域之內側，並且在(存在之時)載體層接合部24之外側切斷為佳。如此一來，因(存在之時)殘留載體層接合部24，並且僅除去確保保護層18和極薄銅層16之保護層接合部20，故可邊確保期待之功能並且極容易剝離保護層18。 In the item (b), the portion including the region of the protective layer joint portion 20 corresponding to the vicinity of the periphery of the copper foil 10 with the carrier is cut. At this time, as shown by the broken line in FIG. 6(A), it is preferable to cut the outer side of the region surrounded by the protective layer joint portion 20 and the outer side of the carrier layer joint portion 24 (when present). In this way, since the carrier layer bonding portion 24 is left (when present) and only the protective layer bonding portion 20 that secures the protective layer 18 and the ultra-thin copper layer 16 is removed, the desired function can be ensured and the protective layer can be easily peeled off. 18.

(c)保護層之剝離 (c) Stripping of the protective layer

在該工程(c)中，如圖6(B)所示般，從附載體之銅箔10剝離保護層18而使極薄銅層16露出。此時，因在保護層18早已不存在保護層接合部20，故可以極容易剝離保護層18。保護層18成為非接觸於極薄銅層16就即使並非如此也接近於非接觸之狀態，而且在其中間也不存在供給剝離層等之剝離強度的中間層，故保護層18可從極薄銅層16以剝離強度零而剝離(即是，也不產生剝離時之電阻)，也可以防止刮傷產生。因此，因在保護層18剝離後之極薄銅層16表面上不殘留(上述中間層等)之殘渣，故容易進行後續加工。 In the project (c), as shown in FIG. 6(B), the protective layer 18 is peeled off from the copper foil 10 with a carrier to expose the ultra-thin copper layer 16. At this time, since the protective layer bonding portion 20 is not already present in the protective layer 18, the protective layer 18 can be peeled off extremely easily. When the protective layer 18 is not in contact with the ultra-thin copper layer 16, even if it is not so close to the non-contact state, and there is no intermediate layer in which the peeling strength of the peeling layer or the like is supplied therebetween, the protective layer 18 can be extremely thin. The copper layer 16 is peeled off with a peel strength of zero (that is, the resistance at the time of peeling does not occur), and scratching can also be prevented. Therefore, since the residue (the intermediate layer or the like) remains on the surface of the ultra-thin copper layer 16 after the protective layer 18 is peeled off, subsequent processing is easy.

(d)形成增建配線層 (d) Formation of additional wiring layers

在該工程(d)中，在極薄銅層16上形成增建配線層36而製作附增建配線層之疊層體。例如，如圖6(C)及圖7(D)所示般，在極薄銅層16上依序形成第一配線層30、絕緣層32及第二配線層34而成為增建配線層36。第一配線層30係以圖案電鍍法而被形成。針對第二配線層34之後的增建層的形成方法之方法並不特別限定，可使用減去法、MSAP(改良型半加成製程)法、SAP(半加成)法、全加成法等。例如，同時藉由沖壓加工對樹脂層及銅箔所代表之金屬箔進行貼合之時，可以與通孔形成及面板電鍍等之層間導通手段之形成做組合，對該面板電鍍層及金屬箔進行蝕刻加工而形成配線圖案。再者，藉由對沖壓或層壓加工僅將樹脂層而貼合於極薄銅層16之表 面時，也可以藉由半加成法在其表面形成配線圖案。任一者皆係於附載體之銅箔具有載體層接合部24時，可以防止藥液滲入增建配線形成時之載體層12和極薄銅層16之間。當容許增建配線形成時藥液滲入時，促進附載體箔之銅箔的剝落，會有牽連增建層之剝離產生或第一配線層30之脫落等之虞，而導致製造良率下降，藉由具有載體層接合部24，可以迴避或降低如此之問題。 In the process (d), the build-up wiring layer 36 is formed on the ultra-thin copper layer 16 to form a laminate with an additional wiring layer. For example, as shown in FIG. 6(C) and FIG. 7(D), the first wiring layer 30, the insulating layer 32, and the second wiring layer 34 are sequentially formed on the ultra-thin copper layer 16 to form the additional wiring layer 36. . The first wiring layer 30 is formed by pattern plating. The method for forming the additive layer after the second wiring layer 34 is not particularly limited, and a subtractive method, an MSAP (modified semi-additive process) method, an SAP (semi-additive) method, and a full additive method can be used. Wait. For example, when the metal foil represented by the resin layer and the copper foil is bonded by press working, it can be combined with the formation of interlayer conduction means such as via formation and panel plating, and the panel plating layer and the metal foil Etching is performed to form a wiring pattern. Furthermore, by bonding only the resin layer to the surface of the ultra-thin copper layer 16 by stamping or lamination processing In the case of a surface, a wiring pattern can also be formed on the surface thereof by a semi-additive method. Either when the copper foil with a carrier has the carrier layer joint portion 24, it is possible to prevent the chemical solution from penetrating between the carrier layer 12 and the ultra-thin copper layer 16 when the build-up wiring is formed. When the chemical liquid is allowed to permeate when the build-up wiring is allowed to be formed, the peeling of the copper foil with the carrier foil is promoted, and the peeling of the build-up layer or the peeling of the first wiring layer 30 may be impeded, resulting in a decrease in the manufacturing yield. By having the carrier layer joint portion 24, such a problem can be avoided or reduced.

因應所需重覆上述工程，取得附增建配線層之疊層體。在該工程中，形成交互疊層配置包含樹脂層和配線圖案之配線層的增建配線層，而取得附增建配線層之疊層體為佳。該工程之重覆若進行至形成期待之層數之增建配線層即可。在該階段中，即使因應所需，在外層面形成阻焊劑，或柱體等之安裝用之凸塊等亦可。再者，增建配線層之最外層面即使在之後的多層配線板之加工工程(g)形成外層配線圖案亦可。 In order to repeat the above work as needed, a laminate with an additional wiring layer is obtained. In this process, it is preferable to form an additional wiring layer in which a wiring layer including a resin layer and a wiring pattern is alternately laminated, and a laminate having an additional wiring layer is obtained. The repetition of the project may be carried out until the additional wiring layer forming the desired number of layers is formed. At this stage, a solder resist or a bump for mounting a column or the like may be formed on the outer layer even if necessary. Furthermore, the outermost layer of the additional wiring layer may be formed by forming the outer layer wiring pattern even in the subsequent processing of the multilayer wiring board (g).

如圖6(C)所示般，工程(d)係以包含在極薄銅層之表面直接形成配線(第一配線層30)之工程為佳。例如，在形成增建配線層36之最初階段，極薄銅層16之表面，使用抗電鍍劑等，在被覆進行配線形成之部分以外而形成配線形成之部分上事先形成由銅等所構成之配線圖案並予以使用亦可。再者，即使在進行配線形成之部位事先形成由金、錫、鎳等所構成之配線圖案並予以使用亦可。如此一來，可以取得已經組裝一面側之外層配線圖案之狀態的附增建配線層之疊層體。 As shown in Fig. 6(C), the process (d) is preferably a process in which wiring (first wiring layer 30) is directly formed on the surface of the ultra-thin copper layer. For example, in the initial stage of forming the build-up wiring layer 36, the surface of the ultra-thin copper layer 16 is formed of copper or the like in advance on the portion where the wiring is formed except for the portion where the wiring is formed by using an electroplating inhibitor or the like. Wiring patterns can also be used. In addition, a wiring pattern made of gold, tin, nickel, or the like may be formed in advance in a portion where wiring is formed and used. In this way, it is possible to obtain a laminate of the additional wiring layer in a state in which the one-side wiring pattern is assembled.

(e)任意工程(載體層接合部之切除) (e) Arbitrary engineering (cutting of the carrier layer joint)

該工程(e)係於附載體之銅箔10具有載體層接合部24之時在工程(d)和工程(f)之間被進行的切除載體層接合部24之任意工程。作為進行該工程(e)之前提，係以其載體層接合部24之至少一部分不與保護層接合部20重疊，並且被設置在較以保護層接合部20所包圍之區域更內側之區域，在工程(b)中被切除之部分較載體層接合部24更外側之部分為要件。因此，在該工程(e)中，在較載體層接合部24更內側之位置，切斷附增建配線層之疊層體，依此切除相當於附載體之銅箔之外圍附近之區域的部分。如此一來，從附增建配線層之疊層體切除包含載體層接合部24之不需要的區域，使附載體之銅箔10之載體層非接合區域26之剖面露出。如此一來，在後續之工程(e)中，容易使極薄銅層16從載體層12分離。在該態樣中，因載體層接合部24被切除，故以在工程(d)中的增建層配線層36之形成在較載體層接合部24更內側之區域被進行為佳。 This item (e) is an arbitrary process of cutting the carrier layer joint portion 24 which is performed between the works (d) and (f) when the copper foil 10 with a carrier has the carrier layer joint portion 24. As described earlier in the case of carrying out the work (e), at least a part of the carrier layer joint portion 24 does not overlap with the protective layer joint portion 20, and is disposed in a region further inside the region surrounded by the protective layer joint portion 20, The portion excised in the item (b) is more than the portion outside the carrier layer joint portion 24 as a requirement. Therefore, in the item (e), the laminate of the additional wiring layer is cut at a position further inside than the carrier layer bonding portion 24, and the region corresponding to the periphery of the copper foil corresponding to the carrier is cut away. section. As a result, the unnecessary region including the carrier layer bonding portion 24 is cut out from the laminate with the additional wiring layer, and the cross section of the carrier layer non-bonding region 26 of the copper foil 10 with the carrier is exposed. As a result, in the subsequent work (e), the extremely thin copper layer 16 is easily separated from the carrier layer 12. In this aspect, since the carrier layer joint portion 24 is cut off, it is preferable that the formation of the build-up layer wiring layer 36 in the process (d) is performed on the inner side of the carrier layer joint portion 24.

(f)附增建配線層之疊層體之分離 (f) Separation of laminates with additional wiring layers

在該工程(f)中，如圖7(E)所示般，在剝離層14分離附增建配線層之疊層體而取得包含增建配線層36之多層配線板38。在極薄銅層16和剝離層14之界面的分離，可以藉由撕開極薄銅層16及/或載體層12而進行。 In the process (f), as shown in FIG. 7(E), the laminate of the additional wiring layer is separated from the peeling layer 14, and the multilayer wiring board 38 including the build-up wiring layer 36 is obtained. The separation at the interface between the ultra-thin copper layer 16 and the release layer 14 can be performed by tearing the ultra-thin copper layer 16 and/or the carrier layer 12.

(g)多層配線板之加工 (g) Processing of multilayer wiring boards

在該工程(g)中，對多層配線板38進行加工而取得印刷配線板40。在該工程中，使用藉由上述分離工程所取得之多層配線板38，加工成期待之多層印刷配線板。從多層配線板38加工至多層印刷配線板40之方法採用眾知之各種方法即可。例如，可以對位於多層配線板38之外層的極薄銅層16進行蝕刻而形成外層電路配線，取得多層印刷配線板。再者，將位於多層配線板38之外層的極薄銅層16完全蝕刻除去，在如此之狀態下，亦可以當作多層印刷配線板40而予以使用。並且，將位於多層配線板38之外層的極薄銅層16完全蝕刻除去，亦可以在露出之樹脂層之表面，以導電性糊膏直接形成電路形狀或以半加成法等直接形成外層電路等之方法使成為多層印刷配線板。並且，藉由將位於多層配線板38之外層的極薄銅層16完全蝕刻除去，並且對第一配線層30進行軟蝕刻，依此取得形成有凹部之第一配線層30，亦可將此當作安裝用之焊墊。 In the process (g), the multilayer wiring board 38 is processed to obtain the printed wiring board 40. In this project, the multilayer printed wiring board 38 is processed into a desired multilayer printed wiring board using the multilayer wiring board 38 obtained by the above separation process. The method of processing from the multilayer wiring board 38 to the multilayer printed wiring board 40 can be carried out by various methods known in the art. For example, the ultra-thin copper layer 16 located on the outer layer of the multilayer wiring board 38 can be etched to form an outer layer circuit wiring, and a multilayer printed wiring board can be obtained. Further, the ultra-thin copper layer 16 located on the outer layer of the multilayer wiring board 38 is completely etched away, and in this state, it can also be used as the multilayer printed wiring board 40. Further, the ultra-thin copper layer 16 located on the outer layer of the multilayer wiring board 38 is completely etched away, or the surface of the exposed resin layer may be directly formed into a circuit shape by a conductive paste or directly formed into an outer layer circuit by a semi-additive method or the like. The method is such that it becomes a multilayer printed wiring board. Further, the ultra-thin copper layer 16 located outside the multilayer wiring board 38 is completely etched away, and the first wiring layer 30 is soft-etched, whereby the first wiring layer 30 in which the concave portion is formed is obtained, and this may be used. Used as a solder pad for installation.

10‧‧‧附載體之銅箔 10‧‧‧With copper foil with carrier

12‧‧‧載體層 12‧‧‧ Carrier layer

14‧‧‧剝離層 14‧‧‧ peeling layer

16‧‧‧極薄銅層 16‧‧‧very thin copper layer

18‧‧‧保護層 18‧‧‧Protective layer

20‧‧‧保護層接合部 20‧‧‧Protective joints

22‧‧‧保護層非接合區域 22‧‧‧Protected non-joined area

24‧‧‧載體層接合部 24‧‧‧ Carrier layer joint

26‧‧‧載體層非接合區域 26‧‧‧ Carrier layer non-joining area

Claims (16)

一種附載體之銅箔，其係依序具備有載體層、剝離層及極薄銅層的附載體之銅箔，其特徵在於：上述附載體之銅箔在上述極薄銅層上又具備保護層，上述保護層在至少一處的保護層接合部被接合於上述極薄銅層，在上述保護層接合部以外的區域不被接合於上述極薄銅層。 A copper foil with a carrier, which is provided with a copper foil with a carrier layer, a release layer and an ultra-thin copper layer, and is characterized in that the copper foil with the carrier is protected on the ultra-thin copper layer. In the layer, the protective layer is bonded to the ultra-thin copper layer at at least one of the protective layer bonding portions, and the region other than the protective layer bonding portion is not bonded to the ultra-thin copper layer. 如請求項1所記載之附載體之銅箔，其中上述保護層接合部以線狀及/或點狀被設置在上述附載體之銅箔之外圍附近。 The copper foil with a carrier as described in claim 1, wherein the protective layer joint portion is provided in a line shape and/or a dot shape in the vicinity of a periphery of the copper foil with the carrier. 如請求項2所記載之附載體之銅箔，其中上述保護層接合部被設置在構成上述附載體之銅箔外圍之相對的至少兩邊之附近。 The copper foil with a carrier as described in claim 2, wherein the protective layer joint portion is provided in the vicinity of at least two opposite sides of the outer periphery of the copper foil constituting the carrier. 如請求項1~3中之任一項所記載之附載體之銅箔，其中上述載體層在至少一處的載體層接合部，以較該載體層接合部以外之區域難剝離之方式被接合於上述極薄銅層而構成。 The copper foil with a carrier according to any one of claims 1 to 3, wherein the carrier layer is joined at a carrier layer joint portion of at least one portion in such a manner that it is difficult to peel off from a region other than the joint portion of the carrier layer. It is composed of the above-mentioned extremely thin copper layer. 如請求項4所記載之附載體之銅箔，其中上述載體層接合部之至少一部分不與上述保護層接合部重疊，並且被設置在較以上述保護層接合部所包圍之區域更內側的區域上。 The copper foil with a carrier as described in claim 4, wherein at least a part of the carrier layer joint portion does not overlap with the protective layer joint portion, and is disposed on an inner side of a region surrounded by the joint portion of the protective layer. on. 如請求項5所記載之附載體之銅箔，其中上述載體層接合部在構成上述附載體之銅箔外圍之相 對的兩邊或四邊之附近被設置成長條狀。 The copper foil with a carrier as recited in claim 5, wherein the carrier layer joint portion is on a periphery of the copper foil constituting the carrier The sides of the pair are placed in a strip shape near the sides. 如請求項1~3中之任一項所記載之附載體之銅箔，其中上述極薄銅層係在上述保護層側具備粗面而構成。 The copper foil with a carrier according to any one of claims 1 to 3, wherein the ultra-thin copper layer has a rough surface on the side of the protective layer. 如請求項7所記載之附載體之銅箔，其中上述粗面之算術平均粗度Ra為50nm以上。 The copper foil with a carrier as described in claim 7, wherein the rough surface has an arithmetic mean roughness Ra of 50 nm or more. 如請求項1~3中之任一項所記載之附載體之銅箔，其中上述保護層為金屬箔或樹脂薄膜。 The copper foil with a carrier according to any one of claims 1 to 3, wherein the protective layer is a metal foil or a resin film. 如請求項4所記載之附載體之銅箔，其中上述保護層接合部與上述載體層接合部之一部分重疊。 The copper foil with a carrier as described in claim 4, wherein the protective layer joint portion partially overlaps one of the carrier layer joint portions. 如請求項1~3中之任一項所記載之附載體之銅箔，其中上述保護層接合部中之接合係藉由從由超音波接合、雷射接合、接縫接合及接著劑接合所構成之群組中選擇出之至少任一種而進行。 The copper foil with a carrier according to any one of claims 1 to 3, wherein the bonding in the bonding layer of the protective layer is performed by ultrasonic bonding, laser bonding, seam bonding, and adhesive bonding. It is carried out by selecting at least one of the constituent groups. 如請求項4所記載之附載體之銅箔，其中上述載體層接合部中之接合係藉由從由超音波接合、雷射接合、接縫接合所構成之群組中選擇出之至少任一種而進行。 The copper foil with a carrier as described in claim 4, wherein the bonding in the carrier layer bonding portion is selected from at least one selected from the group consisting of ultrasonic bonding, laser bonding, and seam bonding. And proceed. 一種印刷配線板之製造方法，包含：(a)將請求項1~12中之任一項所記載之附載體之銅箔疊層在無芯支撐體之單面或雙面而形成疊層體之工 程；(b)切除包含上述保護層接合部之相當於上述附載體之銅箔之外圍附近之區域的部分之工程；(c)從上述附載體之銅箔剝離上述保護層而使上述極薄銅層露出之工程；(d)在上述極薄銅層上形成增建配線層而製作附增建配線層之疊層體之工程；(f)以上述剝離層使附上述增建配線層之疊層體分離而取得包含上述增建配線層之多層配線板之工程；及(g)加工上述多層配線板而取得印刷配線板之工程。 A method for producing a printed wiring board, comprising: (a) laminating a copper foil with a carrier according to any one of claims 1 to 12 on one side or both sides of a coreless support to form a laminate Work (b) cutting out a portion including a portion of the protective layer joint portion corresponding to a region near the periphery of the copper foil with the carrier; (c) peeling off the protective layer from the copper foil with the carrier to make the above-mentioned extremely thin (b) a process of forming an additional wiring layer on the ultra-thin copper layer to form a laminate with an additional wiring layer; (f) attaching the additional wiring layer to the peeling layer The process of separating the laminate to obtain the multilayer wiring board including the above-mentioned additional wiring layer; and (g) processing the multilayer wiring board to obtain a printed wiring board. 如請求項13所記載之印刷配線板之製造方法，其中上述工程(d)包含在上述極薄銅層之表面直接形成配線之工程。 The method of manufacturing a printed wiring board according to claim 13, wherein the item (d) includes a process of directly forming a wiring on a surface of the ultra-thin copper layer. 如請求項13或14所記載之印刷配線板之製造方法，其中上述附載體之銅箔為如請求項5~13中之任一項所記載之附載體之銅箔，在上述工程(b)中被切除之部分為較上述載體層接合部更外側之部分，並且在上述工程(d)和工程(f)之間，又具有在較上述載體層接合部更內側之位置切斷上述附增建配線層之疊層體，藉此切除相當於上述附載體之銅箔之外圍附近之區域 的部分之工程(e)。 The method of manufacturing a printed wiring board according to claim 13 or claim 14, wherein the copper foil with the carrier is a copper foil with a carrier as recited in any one of claims 5 to 13, in the above project (b) The portion to be cut out is a portion outside the joint portion of the carrier layer, and between the above-mentioned works (d) and (f), the above-mentioned additional portion is cut at a position further inside than the joint portion of the carrier layer. Forming a laminate of wiring layers, thereby cutting an area near the periphery of the copper foil corresponding to the carrier Part of the project (e). 如請求項15所記載之印刷配線板之製造方法，其中上述工程(d)中之增建配線層之形成係在較上述載體層接合部更內側之區域被進行。 The method of manufacturing a printed wiring board according to claim 15, wherein the formation of the build-up wiring layer in the item (d) is performed in a region further inside the joint portion of the carrier layer.
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