JPH05329981A - Single surface roughened treated copper foil having protective film - Google Patents
Single surface roughened treated copper foil having protective filmInfo
- Publication number
- JPH05329981A JPH05329981A JP14381292A JP14381292A JPH05329981A JP H05329981 A JPH05329981 A JP H05329981A JP 14381292 A JP14381292 A JP 14381292A JP 14381292 A JP14381292 A JP 14381292A JP H05329981 A JPH05329981 A JP H05329981A
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- Prior art keywords
- copper foil
- protective film
- foil
- film
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- Prior art date
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板用銅箔
に用いる保護フィルム付き片面粗化処理銅箔に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a one-side roughened copper foil with a protective film used for a copper foil for printed wiring boards.
【０００２】[0002]
【従来の技術】プリント配線板用銅張積層板は、複数枚
重ねたプリプレグの片面又は両面に、該プリプレグとの
密着性を高めるために片面を粗化処理した銅箔を重ね合
わせ、プレス成形して製造するのが一般的である。ま
た、プレス成形の工程では、銅箔の光沢面とプレスプレ
ートの間には何も介在させずにプレスしていた。2. Description of the Related Art A copper clad laminate for a printed wiring board is formed by press-molding one or both surfaces of a plurality of prepregs overlaid with a copper foil having one surface roughened to enhance adhesion with the prepregs. Is generally manufactured. Further, in the press-molding step, nothing was interposed between the shiny side of the copper foil and the press plate.
【０００３】しかしながら、プレス成形する際、銅箔の
光沢面に、銅箔を切断するときに発生した銅の切り屑
や、プリプレグの樹脂粉等の異物が付着していると、光
沢面が異物で傷付いたり、光沢面に異物が固着したりす
るという問題点があった。また、プレス成形後、プレス
プレートから銅張積層板を分離するとき、また得られた
銅張積層板どうしを重ね合せるときに、光沢面が擦ら
れ、傷を生じ易いという欠点があった。However, during press molding, if the copper chips generated when the copper foil is cut and foreign matter such as resin powder of the prepreg adhere to the glossy surface of the copper foil, the glossy surface becomes foreign matter. There were problems such as scratches and foreign matter sticking to the glossy surface. Further, when the copper-clad laminates are separated from the press plate after press-molding or when the obtained copper-clad laminates are superposed on each other, the glossy surface is rubbed and scratches are likely to occur.
【０００４】また、粗化処理銅箔の厚さが１８μm より
薄いと、プレス成形工程でのハンドリング特性が悪くな
るため、プリプレグと重ね合せるときに、粗化処理銅箔
にシワや折れが生じたり、また銅張積層板の生産効率が
著しく低下するという問題点があった。If the thickness of the roughened copper foil is less than 18 μm, the handling property in the press molding process is deteriorated, and when the roughened copper foil is superposed on the prepreg, wrinkles or creases may occur in the roughened copper foil. Further, there is a problem that the production efficiency of the copper clad laminate is significantly reduced.
【０００５】これらの傷、異物の固着、シワや折れは、
後に光沢面側に形成する回路の断線や短絡の原因にな
り、プリント配線板の回路幅が年々緻密になってきた昨
今では特に重大な問題になる。また、従来、片面粗化処
理銅箔は、該銅箔をそのままロ−ル状にしたものか、あ
るいはシ−ト状で供給されており、例えば、片面粗化処
理銅箔を切断、梱包又は運搬するときに、光沢面に傷が
付いたり、異物が付着するという前記と同様の問題点が
あった。These scratches, foreign matter sticking, wrinkles and breaks are caused by
This is a particularly serious problem in recent years when the circuit width of the printed wiring board becomes finer year by year, which later causes a disconnection or short circuit of a circuit formed on the glossy surface side. Further, conventionally, the one-sided roughened copper foil is provided in the form of a roll as it is or is supplied in the form of a sheet. For example, the one-sided roughened copper foil is cut, packaged or There was the same problem as described above that the glossy surface was scratched or foreign matter was attached during transportation.
【０００６】[0006]
【発明が解決しようとする課題】本発明の目的は、片面
粗化処理銅箔を切断、梱包、運搬又はプリプレグとのプ
レス成形時に、光沢面に傷が付いたり異物が付着するの
を防止することができ、また、薄い粗化処理銅箔のハン
ドリング特性を向上させることができるので、粗化処理
銅箔にシワや折れが生じることがなく、得られる銅張積
層板の品質及び生産効率を向上させることができる保護
フィルム付き片面粗化処理銅箔を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to prevent a glossy surface from being scratched and foreign matter from adhering during cutting, packing, transportation or press molding with a prepreg of a one-side roughened copper foil. In addition, since the handling characteristics of the thin roughened copper foil can be improved, wrinkles and folds do not occur in the roughened copper foil, and the quality and production efficiency of the obtained copper-clad laminate can be improved. It is intended to provide a single-sided roughened copper foil with a protective film that can be improved.
【０００７】[0007]
【課題を解決するための手段】本発明は、プリント配線
板用片面粗化処理銅箔の光沢面に、金属箔又は融点が積
層温度以上の有機系フィルムが重ね合わされ、該銅箔と
金属箔又は有機系フィルムとが片縁又は両縁で連続又は
断続的に接着又は粘着された保護フィルム付き片面粗化
処理銅箔である。According to the present invention, a metal foil or an organic film having a melting point of not less than a lamination temperature is superposed on a glossy surface of a one-side roughened copper foil for a printed wiring board. Alternatively, the organic film is a one-side roughened copper foil with a protective film, which is continuously or intermittently adhered or adhered at one edge or both edges.
【０００８】以下、本発明を詳細に説明する。本発明に
用いる片面粗化処理銅箔としては、公知の片面粗化処理
銅箔を用いることができ、例えば、電解銅箔又は圧延銅
箔を、公知の硫酸酸性の硫酸銅浴中で陰極電解処理し、
一方の面に粗化粒子を付着させ、他の面は平滑な銅箔と
することができる。銅箔の表面粗さは、特に制限はない
が、一般的には、ＪＩＳ Ｂ０６０１に規定されたＲｚ
値で、粗化面が２．５〜１５μm であり、光沢面が０．
３〜２．５μm である。The present invention will be described in detail below. As the one-side roughened copper foil used in the present invention, a known one-side roughened copper foil can be used, for example, electrolytic copper foil or rolled copper foil, cathodic electrolysis in a known sulfuric acid copper sulfate bath. Process and
Roughening particles can be attached to one surface and the other surface can be a smooth copper foil. The surface roughness of the copper foil is not particularly limited, but it is generally Rz specified in JIS B0601.
The roughness value is 2.5 to 15 μm, and the gloss surface is 0.
It is 3 to 2.5 μm.
【０００９】本発明に用いる金属箔としては、電解銅
箔、圧延銅箔又はアルミ箔が好ましく、その厚さは特に
制限はないが、取り扱いの点から１８〜７０μm が好ま
しい。The metal foil used in the present invention is preferably an electrolytic copper foil, a rolled copper foil or an aluminum foil, and the thickness thereof is not particularly limited, but from the viewpoint of handling, it is preferably 18 to 70 μm.
【００１０】本発明に用いる有機系フィルムとしては、
融点が積層温度以上の有機系フィルムであれば特に制限
はないが、プレス成形が、一般的には、加熱温度１７０
℃以上、圧力１０kgf/cm2 以上、時間６０分以上の条件
で行われているので、銅箔の光沢面やプレスプレ−トに
フィルムの一部が融着するのを防止するためには、融点
が１７０℃以上の有機系フィルムを用いる必要がある。
中でも好ましい有機系フィルムは、融点が１７０℃以上
のポリアミド系樹脂フィルムであり、式：（−ＮＨ（Ｃ
Ｈ2 ）5 ＣＯ−）n で示される６ナイロンであり、さら
に好ましくは、式：（−ＮＨ（ＣＨ2 ）6 ＮＨＣＯ（Ｃ
Ｈ2 ）4 ＣＯ−）n で示される６，６ナイロンである。As the organic film used in the present invention,
There is no particular limitation as long as the melting point is an organic film having a lamination temperature or higher, but press molding is generally performed at a heating temperature of 170
Since it is performed under the conditions of ℃ or more, pressure of 10 kgf / cm 2 or more, and time of 60 minutes or more, in order to prevent a part of the film from being fused to the glossy surface of the copper foil or the press plate, the melting point is It is necessary to use an organic film having a temperature of 170 ° C. or higher.
Among them, a preferable organic film is a polyamide resin film having a melting point of 170 ° C. or higher, and has the formula: (-NH (C
H 2 ) 5 CO-) n is 6 nylon represented by the formula: (-NH (CH 2 ) 6 NHCO (C
H 2) is a 6,6 nylon represented by 4 CO-) n.
【００１１】有機系フィルムの厚さは特に制限はない
が、取り扱いの点から２０〜１００μm が好ましい。The thickness of the organic film is not particularly limited, but 20-100 μm is preferable from the viewpoint of handling.
【００１２】本発明の保護フィルム付き片面粗化処理銅
箔は、上記片面粗化処理銅箔及び金属箔又は有機系フィ
ルムの片縁又は両縁を、連続又は断続的に接着剤又は粘
着剤で接合して得ることができる。片縁又は両縁の接合
部分は、通常、プレス成形して銅張積層板にした後、例
えば光沢面に回路を形成する前に銅張積層板の四方の縁
を切断して製品サイズにする工程で除去される。The one-side roughened copper foil with a protective film of the present invention is one or both edges of the one-side roughened copper foil and the metal foil or the organic film, which are continuously or intermittently coated with an adhesive or a pressure-sensitive adhesive. Can be obtained by joining. The joint portion of one edge or both edges is usually press-formed into a copper clad laminate, and for example, the four edges of the copper clad laminate are cut into a product size before forming a circuit on a glossy surface. It is removed in the process.
【００１３】全面を接着剤又は粘着剤で保護フィルムを
接合した場合には、保護フィルムを片面粗化処理銅箔か
ら剥離した後に光沢面に接着剤又は粘着剤が残り、光沢
面を汚すばかりでなく、付着した接着剤又は粘着剤が、
後の回路形成時に悪影響をおよぼす場合があるので好ま
しくない。When the protective film is bonded to the entire surface with an adhesive or a pressure-sensitive adhesive, the adhesive or the pressure-sensitive adhesive remains on the glossy surface after peeling the protective film from the one-side roughened copper foil, and the glossy surface is simply soiled. Without the adhesive or pressure sensitive adhesive
It is not preferable because it may adversely affect the subsequent circuit formation.
【００１４】本発明に用いる接着剤又は粘着剤として
は、例えば、シアノアクリレ−ト系瞬間接着剤、嫌気性
接着剤、エポキシ系接着剤、両面粘着テ−プ等を挙げる
ことができ、これらを用いて接着又は粘着させる幅は、
特に制限はないが、５〜１５mmが好ましい。Examples of the adhesive or pressure-sensitive adhesive used in the present invention include cyanoacrylate instant adhesives, anaerobic adhesives, epoxy adhesives, double-sided adhesive tapes, and the like. The width of adhesion or sticking is
Although not particularly limited, it is preferably 5 to 15 mm.
【００１５】[0015]
【実施例】以下、実施例を示し、本発明をさらに具体的
に説明する。 実施例１ 片面粗化処理銅箔［厚さ３５μm 、古河サ−キットフォ
イル（株）製］を１１００mm幅にスリットしながら該銅
箔の光沢面側に、厚さ１８μm の電解銅箔（保護フィル
ム）を重ね合せ、嫌気性接着剤を用いて両縁を１０mm幅
で連続的に接着させながら巻き込んでロ−ル状の保護フ
ィルム付き片面粗化処理銅箔を作製した。EXAMPLES The present invention will be described more specifically below with reference to examples. Example 1 While slitting a one-side roughened copper foil [thickness: 35 μm, manufactured by Furukawa Sarkit Foil Co., Ltd.] into a width of 1100 mm, an electrolytic copper foil (protective film) with a thickness of 18 μm was formed on the shiny side of the copper foil. 1) was superposed on each other and was rolled up while continuously adhering both edges with a width of 10 mm using an anaerobic adhesive to prepare a roll-shaped protective film-attached single-sided roughened copper foil.
【００１６】得られた保護フィルム付き片面粗化処理銅
箔をシ−ト状にカットし、保護フィルムがない面に、４
枚重ねしたガラスエポキシプリプレグ［ＥＩ−６７６５
（樹脂量４５％）、厚さ１８０μm 、住友ベ−クライト
（株）製］を重ね合せた後、さらにその上下をプレスプ
レ−トで挟み、１７０℃で１８０分間、加熱加圧成形し
た。The obtained one-side roughened copper foil with a protective film was cut into a sheet, and the surface without the protective film was coated with 4
Stacked glass epoxy prepreg [EI-6765
(Resin amount: 45%), thickness: 180 μm, manufactured by Sumitomo Bakelite Co., Ltd.], and the upper and lower sides thereof were further sandwiched by press plates, and heated and pressed at 170 ° C. for 180 minutes.
【００１７】次に、プレスプレ−トを取り外し、下記の
項目について評価した。結果を表１に示す。保護フィルムと光沢面の剥離容易性 片面粗化処理銅箔から保護フィルムを剥離したときに、
剥離抵抗がなく、容易に剥離できたものを○で表した。Next, the press plate was removed and the following items were evaluated. The results are shown in Table 1. Ease of peeling the protective film from the glossy surface When peeling the protective film from the one-side roughened copper foil,
Those that have no peeling resistance and can be easily peeled off are represented by ◯.
【００１８】光沢面の表面状態 保護フィルムを剥離した後、光沢面の傷や異物付着の有
無を電子顕微鏡（倍率：２０００倍）で観察した。After the protective film on the surface of the glossy surface was peeled off, the scratches on the glossy surface and the presence of foreign matter were observed with an electron microscope (magnification: 2000 times).
【００１９】光沢面の保護フィルム残渣 保護フィルムを剥離した後、光沢面の保護フィルム残渣
の有無を電子顕微鏡（倍率：２０００倍）で観察した。[0019] After peeling off the protective film residue protective film glossy surface, the presence of protective film residue glossy surface electron microscope was observed with (magnification 2000 times).
【００２０】実施例２ 電解銅箔に代えて、厚さ４０μm の圧延アルミ箔を保護
フィルムとして用いた他は、実施例１と同様にして保護
フィルム付き片面粗化処理銅箔を作製し、保護フィルム
の剥離容易性、光沢面の表面状態及び保護フィルム残渣
について評価した。結果を表１に示す。Example 2 In place of the electrolytic copper foil, a rolled aluminum foil having a thickness of 40 μm was used as a protective film, a single-side roughened copper foil with a protective film was prepared and protected in the same manner as in Example 1. The ease of peeling the film, the surface state of the glossy surface and the residue of the protective film were evaluated. The results are shown in Table 1.
【００２１】実施例３ 電解銅箔に代えて、厚さ２０μm の６ナイロンフィルム
（融点：２２０℃）を保護フィルムとして用いた他は、
実施例１と同様にして保護フィルム付き片面粗化処理銅
箔を作製し、保護フィルムの剥離容易性、光沢面の表面
状態及び保護フィルム残渣について評価した。結果を表
１に示す。Example 3 A 6-nylon film having a thickness of 20 μm (melting point: 220 ° C.) was used as a protective film instead of the electrolytic copper foil,
A single-sided roughened copper foil with a protective film was prepared in the same manner as in Example 1, and the peelability of the protective film, the surface state of the glossy surface and the protective film residue were evaluated. The results are shown in Table 1.
【００２２】実施例４ 電解銅箔に代えて、厚さ２５μm の６，６ナイロンフィ
ルム（融点：２３０℃）を保護フィルムとして用いた他
は、実施例１と同様にして保護フィルム付き片面粗化処
理銅箔を作製し、保護フィルムの剥離容易性、光沢面の
表面状態及び保護フィルム残渣について評価した。結果
を表１に示す。Example 4 One-side roughening with a protective film was performed in the same manner as in Example 1 except that a 25 μm thick 6,6 nylon film (melting point: 230 ° C.) was used as the protective film instead of the electrolytic copper foil. A treated copper foil was prepared, and the peelability of the protective film, the surface state of the glossy surface and the protective film residue were evaluated. The results are shown in Table 1.
【００２３】実施例５ 片面粗化処理銅箔を６００mm幅にスリットし、電解銅箔
に代えて、厚さ３５μm の圧延銅箔を保護フィルムとし
て用いた他は、実施例１と同様にして保護フィルム付き
片面粗化処理銅箔を作製し、保護フィルムの剥離容易
性、光沢面の表面状態及び保護フィルム残渣について評
価した。結果を表１に示す。Example 5 Protection was carried out in the same manner as in Example 1 except that a one-side roughened copper foil was slit to a width of 600 mm and a rolled copper foil having a thickness of 35 μm was used as a protective film instead of the electrolytic copper foil. A one-side roughened copper foil with a film was prepared, and the ease of peeling the protective film, the surface state of the glossy surface and the protective film residue were evaluated. The results are shown in Table 1.
【００２４】比較例１ 保護フィルムを設けずに実施例１と同様にして片面粗化
処理銅箔をプリプレグと重ね合せた後、加熱加圧成形
し、光沢面の傷や異物付着の有無を電子顕微鏡（倍率：
２０００倍）で観察し、光沢面の表面状態を評価した。
結果を表１に示す。COMPARATIVE EXAMPLE 1 A single-sided roughened copper foil was superposed on a prepreg in the same manner as in Example 1 without providing a protective film, and then heat and pressure molding was carried out to check whether the glossy surface was scratched or foreign matter was attached. Microscope (magnification:
The surface condition of the glossy surface was evaluated by observing at 2000 times.
The results are shown in Table 1.
【００２５】[0025]
【表１】 [Table 1]
【００２６】[0026]
【発明の効果】本発明の保護フィルム付き片面粗化処理
銅箔は、次の効果を奏する。 (1) 片面粗化処理銅箔に保護フィルムを備えているの
で、該銅箔の切断、梱包及び運搬時又はプリプレグとの
プレス成形時に、光沢面への傷、シワ、折れ及び異物の
付着を防止することができる。 (2) 片面粗化処理銅箔の厚さが、１８μm より薄い銅箔
であっても、保護フィルムが、支持体として機能するの
で、片面粗化処理銅箔のハンドリング特性を向上させる
ことができる。EFFECTS OF THE INVENTION The one-side roughened copper foil with a protective film of the present invention has the following effects. (1) Since the one-sided roughened copper foil is provided with a protective film, scratches, wrinkles, folds and adhesion of foreign matter on the glossy surface can be achieved during cutting, packaging and transportation of the copper foil or press molding with a prepreg. Can be prevented. (2) Even if the thickness of the one-side roughened copper foil is thinner than 18 μm, the protective film functions as a support, so that the handling characteristics of the one-side roughened copper foil can be improved. ..
【００２７】(3) プレス成形後、光沢面が保護フィルム
で被覆されているので、例えば、銅張積層板どうしを重
ね合せても、光沢面に擦れ傷等が生じない。 (4) プレス成形後、保護フィルムを銅張積層板から剥離
したときに、光沢面に保護フィルム残渣がない。(3) Since the glossy surface is covered with the protective film after the press molding, for example, even if the copper clad laminates are stacked, the glossy surface is not scratched or the like. (4) When the protective film is peeled off from the copper clad laminate after press molding, there is no protective film residue on the glossy surface.
【００２８】(5) 保護フィルムを、片縁又は両縁だけで
接着又は粘着させているので、光沢面に接着剤又は粘着
剤がほとんど残らない。 (6) よって、特にプリント配線板用銅張積層板の製造工
程において、その生産効率を向上させることができ、か
つ得られる銅張積層板の光沢面の品質を向上させること
ができる。(5) Since the protective film is adhered or adhered only on one edge or both edges, almost no adhesive or adhesive remains on the glossy surface. (6) Therefore, particularly in the manufacturing process of the copper clad laminate for printed wiring boards, the production efficiency can be improved, and the quality of the glossy surface of the obtained copper clad laminate can be improved.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 東 圭二 東京都千代田区内幸町１丁目２番２号 住 友ベークライト株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Keiji Higashi 1-2-2 Uchisaiwaicho, Chiyoda-ku, Tokyo Sumitomo Bakelite Co., Ltd.
Claims (2)
沢面に、金属箔又は融点が積層温度以上の有機系フィル
ムが重ね合わされ、該銅箔と金属箔又は有機系フィルム
とが片縁又は両縁で連続又は断続的に接着又は粘着され
た保護フィルム付き片面粗化処理銅箔。1. A metal foil or an organic film having a melting point equal to or higher than a lamination temperature is superposed on a glossy surface of a one-side roughened copper foil for a printed wiring board, and the copper foil and the metal foil or the organic film have one edge. Alternatively, a single-sided roughened copper foil with a protective film, which is continuously or intermittently adhered or adhered at both edges.
箔であり、有機系フィルムが融点１７０℃以上のポリア
ミド系樹脂フィルムである請求項１記載の保護フィルム
付き片面粗化処理銅箔。2. The one-side roughened copper foil with a protective film according to claim 1, wherein the metal foil is an electrolytic copper foil, a rolled copper foil or an aluminum foil, and the organic film is a polyamide resin film having a melting point of 170 ° C. or higher. ..
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14381292A JPH05329981A (en) | 1992-06-04 | 1992-06-04 | Single surface roughened treated copper foil having protective film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14381292A JPH05329981A (en) | 1992-06-04 | 1992-06-04 | Single surface roughened treated copper foil having protective film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05329981A true JPH05329981A (en) | 1993-12-14 |
Family
ID=15347546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14381292A Pending JPH05329981A (en) | 1992-06-04 | 1992-06-04 | Single surface roughened treated copper foil having protective film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05329981A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016067422A1 (en) * | 2014-10-30 | 2016-05-06 | 三井金属鉱業株式会社 | Copper foil with carrier and method of manufacturing printed wiring board by using same |
| WO2021084911A1 (en) * | 2019-10-29 | 2021-05-06 | 東レエンジニアリング株式会社 | Film forming device |
| CN114940006A (en) * | 2022-05-07 | 2022-08-26 | 湖南柳鑫电子新材料有限公司 | Copper foil carrier manufacturing method and copper foil carrier |
-
1992
- 1992-06-04 JP JP14381292A patent/JPH05329981A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016067422A1 (en) * | 2014-10-30 | 2016-05-06 | 三井金属鉱業株式会社 | Copper foil with carrier and method of manufacturing printed wiring board by using same |
| CN106715118A (en) * | 2014-10-30 | 2017-05-24 | 三井金属矿业株式会社 | Copper foil with carrier and method of manufacturing printed wiring board by using same |
| KR20170080535A (en) * | 2014-10-30 | 2017-07-10 | 미쓰이금속광업주식회사 | Copper foil with carrier and method of manufacturing printed wiring board by using same |
| JPWO2016067422A1 (en) * | 2014-10-30 | 2017-08-03 | 三井金属鉱業株式会社 | Copper foil with carrier and method for producing printed wiring board using the same |
| WO2021084911A1 (en) * | 2019-10-29 | 2021-05-06 | 東レエンジニアリング株式会社 | Film forming device |
| JP2021070837A (en) * | 2019-10-29 | 2021-05-06 | 東レエンジニアリング株式会社 | Film deposition apparatus |
| CN114940006A (en) * | 2022-05-07 | 2022-08-26 | 湖南柳鑫电子新材料有限公司 | Copper foil carrier manufacturing method and copper foil carrier |
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