TWI571388B - Component assembling method and device thereof using reusable adhesive films - Google Patents
Component assembling method and device thereof using reusable adhesive films Download PDFInfo
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本發明係關於一種以重複利用〔reusable〕黏膠片進行元件組裝方法及其裝置；特別是關於一種以重複利用無膠〔adhesive-free〕式黏膠片進行元件組裝方法及其裝置；更特別是關於一種以重複利用黏膠片進行製程元件〔例如：電子元件或光學元件〕組裝方法及其裝置。 BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a method and apparatus for assembling components by reusable adhesive film; and more particularly to a method and apparatus for assembling components by reusing an adhesive-free adhesive film; more particularly A method and apparatus for assembling a process component (for example, an electronic component or an optical component) by reusing a adhesive film.
一般而言，習用膠帶黏貼晶片或晶粒〔die〕技術揭示與許多國內或國外專利，例如：美國專利第6358606號之〝Pressure-sensitive adhesive double coated tape or sheet,non-substrate pressure-sensitive adhesive transfer tape or sheet and method for manufacturing the same〞發明專利、美國專利公開第20070120271號之〝Dicing and die bonding adhesive tape〞或第20070126129號之〝Die bonding adhesive tape〞專利申請案。 In general, conventional tape-adhesive wafer or die technology has been disclosed in many domestic or foreign patents, for example, US Patent No. 6,358,606 (Pressure-sensitive adhesive double coated tape or sheet, non-substrate pressure-sensitive adhesive). Transfer patent or sheet and method for manufacturing the same patent application, US Patent Publication No. 20070120271, Dicing and die bonding adhesive tape, or No. 20070126129, Die adhesive tape.
然而，習用晶片黏貼膠帶並非可重複黏貼及撕下的膠帶，其大多屬於化學濕式黏膠，且其隨著操作或使用環境的溫度變化、經重覆黏貼及撕下、受環境灰塵髒污、意外發生脫膠或受清洗製程的影響而降低其黏著強度，因而無法在撕下後重複使用而丟棄，即習用化學濕式膠帶並非可重覆黏貼及撕下產品。 However, the conventional wafer adhesive tape is not a re-stickable and tear-off adhesive tape, and most of them are chemical wet adhesives, and they are repeatedly attached and peeled off due to temperature changes in the operation or use environment, and are contaminated by environmental dust. In case of accidental degumming or being affected by the cleaning process, the adhesive strength is lowered, so that it cannot be discarded after being peeled off, that is, the conventional chemical wet tape is not re-stickable and tearing off the product.
另外，習用化學濕式膠帶在完成加工作業後仍需要撕除及清洗元件，以便進行下次元件重新黏貼加工作 業。然而，由於習用化學濕式膠帶不易自物品或元件進行撕除，因而其需要大量人工逐一進行撕除膠帶作業，且需要大量耗費撕除作業時間。況且，習用膠帶在撕除過程中容易發生殘膠，因此亦必須額外耗費大量人工清除其元件上的殘膠及其作業時間。 In addition, the conventional chemical wet tape still needs to tear off and clean the components after the completion of the processing operation, so as to carry out the next component re-adhesive work. industry. However, since the conventional chemical wet tape is not easily peeled off from articles or components, it requires a large amount of manual peeling of the tape, and it takes a lot of time to remove the tearing time. Moreover, the conventional adhesive tape is prone to residual glue during the tearing process, and therefore it is necessary to additionally consume a large amount of manual removal of the residual glue on the components and the operation time thereof.
為了避免上述耗費大量人工進行撕除及清除殘膠作業，必需採用具可多次重複黏貼及撕下結構的膠帶〔例如：微米或奈米吸盤式結構〕，以加速加工製程作業時間。簡言之，習用加工製程之元件〔例如：電子元件或光學元件〕黏貼組裝必然存在進一步提供其它可避免發生殘膠的多次重複黏貼及撕下結構及其操作方法之需求。關於習用奈米孔洞材料及技術，其揭示與許多國內或國外專利，於此併入參考。 In order to avoid the above-mentioned laborious manual removal and removal of the residual glue, it is necessary to use a tape (for example, a micron or nano suction cup structure) which can be repeatedly pasted and peeled off to accelerate the processing time. In short, the assembly of conventional processing components (for example, electronic components or optical components) inevitably requires further provision of other repeated adhesive and tear-off structures and methods of operation that avoid the occurrence of residual glue. Regarding conventional nanopore materials and techniques, it is disclosed with many domestic or foreign patents, which are incorporated herein by reference.
舉例而言，習用微米或奈米吸盤裝置及其製造方法，如中華民國專利公告第I263513號之〝具有吸盤式奈米孔洞的生醫植入物及製造方法〞發明專利，其揭示一種生醫植入物。該生醫植入物包含數個吸盤式奈米孔洞，而該生醫植入物之一部份或全部表面設置一吸盤式奈米孔洞結構。該吸盤式奈米孔洞結構為具有複數個具奈米尺寸之管狀物。 For example, a conventional micro or nano suction cup device and a method of manufacturing the same, such as a biomedical implant and a manufacturing method having a suction cup type nano hole, and a patent for the invention, which discloses a biomedical doctor, such as the Republic of China Patent Publication No. I263513 Implants. The biomedical implant comprises a plurality of suction cup type nanoholes, and a part of or all of the surface of the biomedical implant is provided with a suction cup type nanohole structure. The suction cup type nanohole structure has a plurality of tubes having a nanometer size.
承上，前述第I263513號之該管狀物的全部或部份呈現為採用以矩陣排列，且將各個該管狀物設置為一可供填入生物可吸收材料〔或藥物〕之孔洞。各個該孔洞之大小在實質上為介於10nm至100nm之間。另外，該生醫植入物可選自一純鈦片。 In the above, all or a part of the tubular material of the above-mentioned No. I263513 is presented in a matrix arrangement, and each of the tubular members is provided as a hole into which a bioabsorbable material (or drug) can be filled. Each of the holes has a size substantially between 10 nm and 100 nm. Additionally, the biomedical implant can be selected from a pure titanium sheet.
前述第I263513號之該生醫植入物之製造方法主要包含步驟：〔A〕先將該生醫植入物施以陽極處理，使該生醫植入物之表面形成一氧化膜，且以一溶劑添加於陽極處理時之溶液內；〔B〕再加以一外加電壓，使該生醫 植入物之表面形成數個該管狀物，且該管狀物為具有該孔洞。 The method for manufacturing the biomedical implant of the above-mentioned No. I263513 mainly comprises the steps of: [A] first applying the anodic treatment to the biomedical implant to form an oxide film on the surface of the biomedical implant, and a solvent is added to the solution during the anodizing treatment; [B] an additional voltage is applied to the biomedical doctor A plurality of the tubes are formed on the surface of the implant, and the tube has the holes.
承上，前述第I263513號於將該生醫植入物進行陽極處理時，該溶劑可選擇為氫氟酸或硫酸。另外，於該生醫植入物加以該外加電壓時，該外加電壓可選擇為於50伏特以內。 According to the above-mentioned No. I263513, when the biomedical implant is subjected to anodizing, the solvent may be selected from hydrofluoric acid or sulfuric acid. In addition, when the biomedical implant is subjected to the applied voltage, the applied voltage may be selected to be within 50 volts.
然而，第I263513號之該吸盤式奈米孔洞僅適用於生醫植入用途，其並不適用於一般吸附重物，且該吸盤式奈米孔洞結構易遭受破壞。況且，該吸盤式奈米孔洞在元件製造上需要形成一奈米級結構，因此其具有製程困難度增加的缺點。因此，習用微米或奈米吸盤裝置及其製造方法必然存在進一步改良其結構及製造方法之需求。前述專利僅為本發明技術背景之參考及說明目前技術發展狀態而已，其並非用以限制本發明之範圍。 However, the suction cup type nanohole of No. I263513 is only suitable for biomedical implant applications, and is not suitable for general adsorption of heavy objects, and the suction cup type nanopore structure is susceptible to damage. Moreover, the suction-type nanopore needs to form a nano-scale structure in the manufacture of components, so that it has the disadvantage of an increase in process difficulty. Therefore, the conventional micro or nano suction cup device and its manufacturing method necessarily have the need to further improve the structure and manufacturing method. The foregoing patents are only for the purpose of reference to the present invention, and are not intended to limit the scope of the present invention.
有鑑於此，本發明為了滿足上述技術問題及需求，其提供一種以重複利用黏膠片進行元件組裝方法及其裝置，其將一可重複利用黏膠片提供於一加工載具，而該可重複利用黏膠片具有至少一微細結構形成一吸附層，且利用該吸附層將一元件〔待加工元件〕吸附於該加工載具上，且在加工製程完成後將該元件自該可重複利用黏膠片進行剝離，以便下次重複使用該可重複利用黏膠片，因此相對於習用加工製程之元件黏貼組裝方法可大幅降低其黏貼及剝離製程困難度及節省其黏貼及剝離作業時間。 In view of the above, the present invention provides a method for assembling a component by reusing a adhesive film and a device thereof, which provide a reusable adhesive film to a processing carrier, and the reusable The adhesive film has at least one fine structure to form an adsorption layer, and the adsorption layer is used to adsorb a component (the component to be processed) onto the processing carrier, and the component is subjected to the reusable adhesive film after the processing process is completed. Stripping, so that the reusable adhesive film can be reused next time, so the component bonding method relative to the conventional processing process can greatly reduce the difficulty of adhesion and peeling process and save the adhesive and peeling operation time.
本發明之主要目的係提供一種以重複利用黏膠片進行元件組裝方法及其裝置，其將一可重複利用黏膠片提供於一加工載具上，而該可重複利用黏膠片具有至少一微細結構形成一吸附層，且利用該吸附層將一元件〔待加工元件〕吸附於該加工載具上，且在加工製程完成後將 該元件自該可重複利用黏膠片進行剝離，以便下次重複使用該可重複利用黏膠片，以達成重複利用及加速作業之目的。 SUMMARY OF THE INVENTION A primary object of the present invention is to provide a method of assembling a component by reusing a adhesive film and a device thereof, which provide a reusable adhesive film on a processing carrier, and the reusable adhesive film has at least one fine structure An adsorption layer, and the element (the element to be processed) is adsorbed on the processing carrier by the adsorption layer, and after the processing process is completed, The component is stripped from the reusable adhesive film for reuse of the reusable adhesive film for reuse and acceleration.
本發明之另一目的係提供一種以重複利用黏膠片進行元件組裝方法及其裝置，其將一可重複利用黏膠片提供一第一微細結構及一第二微細結構，以形成一第一吸附層及一第二吸附層，而該第一吸附層黏貼吸附於一加工載具，且該第二吸附層黏貼吸附一元件〔待加工元件〕，另在加工製程完成後將該可重複利用黏膠片自該加工載具及元件進行剝離，以便下次重複使用該可重複利用黏膠片，以達成重複利用及加速作業之目的。 Another object of the present invention is to provide a method for assembling a component by reusing a adhesive film and a device thereof, which provide a first microstructure and a second microstructure to a reusable adhesive film to form a first adsorption layer. And a second adsorption layer, wherein the first adsorption layer is adhered to a processing carrier, and the second adsorption layer is adhered to adsorb a component (a component to be processed), and the reusable adhesive film is further processed after the processing process is completed. Stripping from the processing carrier and components for the next repeated use of the reusable adhesive film for reuse and acceleration.
為了達成上述目的，本發明較佳實施例之以重複利用黏膠片進行元件組裝方法包含：將一可重複利用黏膠片提供於一加工載具上，而該可重複利用黏膠片具有至少一微細結構，且該微細結構形成一吸附層；利用該可重複利用黏膠片之吸附層將一待加工元件黏貼吸附於該加工載具上，以便將該待加工元件完成固定於該加工載具上；將該加工載具及待加工元件利用一加工製程進行加工作業；在該加工製程完成後將該待加工元件自該可重複利用黏膠片進行剝離，以便將該可重複利用黏膠片重複使用。 In order to achieve the above object, a method for assembling a component by reusing a adhesive film according to a preferred embodiment of the present invention includes: providing a reusable adhesive film on a processing carrier, wherein the reusable adhesive film has at least one fine structure And the fine structure forms an adsorption layer; the adsorption component of the reusable adhesive film is adhered to the processing carrier to fix the component to be processed to the processing carrier; The processing carrier and the component to be processed are processed by a processing process; after the processing is completed, the component to be processed is peeled off from the reusable adhesive film to reuse the reusable adhesive film.
本發明較佳實施例之該可重複利用黏膠片選自一單面微細結構黏膠片或一雙面微細結構黏膠片。 In the preferred embodiment of the invention, the reusable adhesive film is selected from a single-sided microstructured adhesive film or a double-sided microstructured adhesive film.
本發明較佳實施例之該待加工元件選自一半導體封裝元件、一發光二極體封裝元件、一光學鏡頭組件、一印刷電路板或一印刷電路軟板。 In the preferred embodiment of the present invention, the component to be processed is selected from a semiconductor package component, a light emitting diode package component, an optical lens component, a printed circuit board or a printed circuit board.
本發明較佳實施例之該可重複利用黏膠片由一光聚合高分子材料製成，且該光聚合高分子材料包含：一起始劑，其為光起始劑或熱起始劑；一架橋性單體；一單體材料，其為具疏水基體之單體或具親水基體之單體；及一寡聚體材料；其中該起始劑、架橋性單體、單體材料及寡聚體材料形成一光聚合高分子組成物。 In the preferred embodiment of the present invention, the reusable adhesive film is made of a photopolymerizable polymer material, and the photopolymerizable polymer material comprises: an initiator, which is a photoinitiator or a thermal initiator; a bridge a monomer; a monomer having a hydrophobic matrix or a monomer having a hydrophilic matrix; and an oligomeric material; wherein the initiator, bridging monomer, monomer material, and oligomer The material forms a photopolymerizable polymer composition.
本發明較佳實施例之該具疏水基體之單體可供該光聚合高分子組成物能緊密黏著於一基材表面上，而該架橋性單體之添加形成耐高溫的該光聚合高分子材料。 In the preferred embodiment of the present invention, the monomer having a hydrophobic matrix can be used to closely adhere the photopolymerizable polymer composition to the surface of a substrate, and the addition of the bridging monomer forms the photopolymerizable polymer having high temperature resistance. material.
為了達成上述目的，本發明較佳實施例之以重複利用黏膠片進行元件組裝裝置包含：一加工載具，其具有一預定位置；一可重複利用黏膠片，其設置於該加工載具之預定位置上，且該可重複利用黏膠片具有至少一微細結構，以形成一吸附層；及一待加工元件，其利用該吸附層進行黏貼吸附固定，以便將該待加工元件吸附固定於該加工載具上；其中在加工製程完成後，將該待加工元件自該可重複利用黏膠片進行剝離，以便下次重複使用該可重複利用黏膠片。 In order to achieve the above object, a component assembly apparatus for reusing a adhesive film according to a preferred embodiment of the present invention includes: a processing carrier having a predetermined position; and a reusable adhesive film disposed on the processing carrier. Positioned, and the reusable adhesive film has at least one fine structure to form an adsorption layer; and a component to be processed, which is adhered and fixed by the adsorption layer to adsorb and fix the component to be processed to the processing load And wherein the component to be processed is peeled off from the reusable adhesive film after the processing is completed, so that the reusable adhesive film is reused next time.
本發明另一較佳實施例之以重複利用黏膠片進行元件組裝裝置包含：一可重複利用黏膠片，其具有一第一微細結構及一第二微細結構，以形成一第一吸附層及一第二吸附層；一加工載具，其具有一預定位置，將該可重複利用黏膠片設置於該加工載具之預定位置上，且該第一吸 附層黏貼吸附於該加工載具之預定位置上；及一待加工元件，其利用該第二吸附層進行黏貼吸附固定，以便將該待加工元件吸附固定於該加工載具上；其中在加工製程完成後，將該待加工元件自該可重複利用黏膠片進行剝離，以便下次重複使用該可重複利用黏膠片。 In another preferred embodiment of the present invention, the component assembly apparatus for reusing the adhesive film comprises: a reusable adhesive film having a first microstructure and a second microstructure to form a first adsorption layer and a a second adsorption layer; a processing carrier having a predetermined position, the reusable adhesive film being disposed at a predetermined position of the processing carrier, and the first suction Adhesive adhesion is applied to a predetermined position of the processing carrier; and a component to be processed is adhered and fixed by the second adsorption layer to adsorb and fix the component to be processed on the processing carrier; After the process is completed, the component to be processed is peeled off from the reusable adhesive film to reuse the reusable adhesive film for the next time.
本發明較佳實施例之可重複利用黏膠片包含：一吸盤基板，其包含一第一表面及一第二表面；至少一微細結構，其設置於該吸盤基板之第一表面，以形成一吸附層；及一按壓操作面，其設置於該吸盤基板之第二表面，且該吸附層對應該按壓操作面，或該按壓操作面選擇預留設置於該吸附層；其中將該吸附層對應貼附於一待吸附表面，經由利用該按壓操作面進行按壓操作該吸附層，以擠壓排出該至少一微細結構內之氣體，以便該吸附層可吸附該待吸附表面。 The reusable adhesive film of the preferred embodiment of the present invention comprises: a chuck substrate comprising a first surface and a second surface; at least one microstructure disposed on the first surface of the chuck substrate to form an adsorption And a pressing operation surface disposed on the second surface of the chuck substrate, wherein the adsorption layer corresponds to pressing the operation surface, or the pressing operation surface is selected to be disposed on the adsorption layer; wherein the adsorption layer is correspondingly attached Attached to a surface to be adsorbed, the adsorption layer is pressed by using the pressing operation surface to squeeze out the gas in the at least one fine structure, so that the adsorption layer can adsorb the surface to be adsorbed.
本發明較佳實施例之該微細結構選自一凹凸結構部、一槽溝部、一凹穴部或一孔洞部。 In the preferred embodiment of the present invention, the microstructure is selected from a concave-convex structure portion, a groove portion, a recess portion or a hole portion.
本發明較佳實施例之該微細結構包含數個第一槽溝部及數個第二槽溝部，且該第一槽溝部及第二槽溝部相互交叉形成一交叉陣列。 In the preferred embodiment of the present invention, the microstructure includes a plurality of first groove portions and a plurality of second groove portions, and the first groove portion and the second groove portion intersect each other to form a cross array.
本發明較佳實施例之該微細結構具有數奈米尺寸至數百奈米尺寸或數微米。 The microstructure of the preferred embodiment of the invention has a size ranging from a few nanometers to a few hundred nanometers or a few microns.
本發明較佳實施例之該吸盤基板之第二表面利用一強力接著劑或一雙面泡棉膠層黏貼於該加工載具。 In a preferred embodiment of the invention, the second surface of the chuck substrate is adhered to the processing carrier by a strong adhesive or a double-sided foam layer.
本發明較佳實施例之可重複利用黏膠片包含：一吸盤基板，其包含一第一表面及一第二表 面；至少一微細結構，其設置於該吸盤基板之第一表面，以形成一吸附層；及一按壓操作墊片，其設置於該吸盤基板之第二表面，且該按壓操作墊片對應於該微細結構；其中將該吸附層對應貼附於一待吸附表面，經由利用該按壓操作墊片進行按壓操作該吸附層，以擠壓排出該微細結構內之氣體，以便該吸附層可吸附該待吸附表面。 The reusable adhesive film of the preferred embodiment of the present invention comprises: a chuck substrate comprising a first surface and a second surface a surface; at least one fine structure disposed on the first surface of the chuck substrate to form an adsorption layer; and a pressing operation gasket disposed on the second surface of the chuck substrate, and the pressing operation gasket corresponds to The fine structure; wherein the adsorption layer is correspondingly attached to a surface to be adsorbed, and the adsorption layer is pressed by using the pressing operation gasket to squeeze out the gas in the fine structure, so that the adsorption layer can adsorb the The surface to be adsorbed.
本發明較佳實施例之該按壓操作墊片選自一橡膠墊片或一彈性墊片。 In the preferred embodiment of the invention, the pressing operation gasket is selected from a rubber gasket or an elastic gasket.
本發明較佳實施例之該按壓操作墊片利用一強力接著劑或一雙面泡棉膠層黏貼於該吸盤基板之第二表面。 In the preferred embodiment of the present invention, the pressing operation pad is adhered to the second surface of the chuck substrate by a strong adhesive or a double-sided foam layer.
本發明較佳實施例之該按壓操作墊片具有一邊緣，且該邊緣垂直對應於該微細結構之一邊緣。 In the preferred embodiment of the present invention, the pressing operation pad has an edge, and the edge vertically corresponds to one edge of the microstructure.
為了達成上述目的，本發明較佳實施例之可重複利用黏膠片操作方法包含：在進行吸附操作時，利用至少一微細結構形成一吸附層，且該吸附層對應於一待吸附表面；將該吸附層之至少一部分對應貼附於該待吸附表面；及利用按壓操作該吸附層之至少一部分，以擠壓排出該至少一微細結構內之至少一部分之氣體，以便該吸附層之至少一部分可吸附該待吸附表面。 In order to achieve the above object, a reusable adhesive film operation method according to a preferred embodiment of the present invention includes: forming an adsorption layer by using at least one fine structure during an adsorption operation, and the adsorption layer corresponds to a surface to be adsorbed; At least a portion of the adsorption layer is attached to the surface to be adsorbed; and at least a portion of the adsorption layer is operated by pressing to squeeze out at least a portion of the gas in the at least one fine structure so that at least a portion of the adsorption layer can be adsorbed The surface to be adsorbed.
本發明較佳實施例在進行脫離操作時，將該吸附層之至少一邊緣進行撥開，以便該吸附層之至少一部分可剝離該待吸附表面。 In a preferred embodiment of the present invention, at least one edge of the adsorption layer is removed during the detachment operation so that at least a portion of the adsorption layer can peel off the surface to be adsorbed.
為了達成上述目的，本發明較佳實施例之可重 複利用黏膠片製造方法：提供一成形模具，且該成形模具包含數個成形微結構；利用該成形模具之成形微結構對應形成至少一微細結構於一吸盤基板上；及將該成形模具及吸盤基板分離，以便將該吸盤基板脫離於該成形模具。 In order to achieve the above object, the preferred embodiment of the present invention is A method for manufacturing a viscous film: providing a forming die, wherein the forming die comprises a plurality of forming microstructures; forming a microstructure of the forming die correspondingly to form at least one fine structure on a chuck substrate; and forming the forming die and the suction cup The substrate is separated to detach the chuck substrate from the forming mold.
本發明較佳實施例先製備一吸盤基板胚後，再利用該成形模具之成形微結構直接成形圖案於該吸盤基板胚上，以便形成該微細結構於該吸盤基板上。 In the preferred embodiment of the present invention, after preparing a chuck substrate embryo, the forming microstructure of the forming mold is directly formed on the chuck substrate to form the microstructure on the chuck substrate.
本發明較佳實施例利用該成形模具之成形微結構以熱壓印、轉印或鑄模方式成形圖案於該吸盤基板胚上。 In a preferred embodiment of the present invention, the shaped microstructure of the forming mold is used to form a pattern on the chuck substrate by hot stamping, transfer or molding.
1‧‧‧可重複利用黏膠片 1‧‧‧Reusable adhesive film
1a‧‧‧單面微細結構黏膠片 1a‧‧‧Single-sided microstructured film
1b‧‧‧雙面微細結構黏膠片 1b‧‧‧Double-sided fine structure adhesive film
10‧‧‧吸盤基板 10‧‧‧Sucker substrate
10a‧‧‧基板 10a‧‧‧Substrate
11‧‧‧第一表面 11‧‧‧ first surface
12‧‧‧第二表面 12‧‧‧ second surface
100‧‧‧吸盤基板胚 100‧‧‧Sucker substrate embryo
2‧‧‧加工載具 2‧‧‧Processing Vehicles
20‧‧‧微細結構 20‧‧‧Microstructure
201‧‧‧第一微細結構 201‧‧‧First microstructure
202‧‧‧第二微細結構 202‧‧‧Second microstructure
20a‧‧‧微細結構 20a‧‧‧Microstructure
20b‧‧‧微細結構 20b‧‧‧Microstructure
20c‧‧‧微細結構 20c‧‧‧Microstructure
20d‧‧‧微細結構 20d‧‧‧Microstructure
30‧‧‧按壓操作墊片 30‧‧‧Press the operating gasket
400‧‧‧待加工元件 400‧‧‧Processing components
401‧‧‧CSP封裝元件 401‧‧‧CSP package components
402‧‧‧COB封裝元件 402‧‧‧COB package components
5‧‧‧成形模具 5‧‧‧Forming mould
51‧‧‧成形微結構 51‧‧‧Formed microstructure
A‧‧‧按壓操作面 A‧‧‧ Pressing the operating surface
B‧‧‧待吸附表面 B‧‧‧ surface to be adsorbed
第1圖：本發明較佳實施例之以重複利用黏膠片進行元件組裝裝置結合待加工元件之側視示意圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a side elevational view of a preferred embodiment of the present invention for reusing adhesive film for component assembly in combination with components to be processed.
第2圖：本發明較佳實施例之以重複利用黏膠片進行元件組裝方法之流程示意圖。 Fig. 2 is a flow chart showing the method of assembling components by reusing adhesive films in accordance with a preferred embodiment of the present invention.
第3A及3B圖：本發明較佳實施例之以重複利用黏膠片進行元件組裝裝置完成組裝CSP封裝元件及COB封裝元件於鏡頭組件之側視示意圖。 3A and 3B are schematic side views showing the assembly of the CSP package component and the COB package component on the lens assembly by reusing the adhesive film for the component assembly device in accordance with a preferred embodiment of the present invention.
第4圖：本發明較佳實施例之可重複利用黏膠片及其採用成形模具之立體示意圖。 Figure 4 is a perspective view of a reusable adhesive film and a forming mold thereof in accordance with a preferred embodiment of the present invention.
第5圖：本發明較佳實施例之可重複利用黏膠片製造方法之流程示意圖。 Figure 5 is a flow chart showing a method of manufacturing a reusable adhesive film in accordance with a preferred embodiment of the present invention.
第6(a)至6(f)圖：本發明較佳實施例之可重複利用黏膠片製造方法之示意圖。 6(a) to 6(f) are views showing a method of manufacturing a reusable adhesive film in accordance with a preferred embodiment of the present invention.
第7圖：本發明另一較佳實施例之可重複利用黏膠片之 立體示意圖。 Figure 7: Reusable adhesive film of another preferred embodiment of the present invention Stereoscopic view.
第8圖：本發明較佳實施例之可重複利用黏膠片在進行操作吸附時對應待加工元件之立體示意圖。 Figure 8 is a perspective view of the reusable adhesive film of the preferred embodiment of the present invention corresponding to the component to be processed when performing the operation adsorption.
第9圖：本發明較佳實施例之可重複利用黏膠片另一使用其操作方法之立體示意圖。 Figure 9 is a perspective view showing another embodiment of the reusable adhesive film of the preferred embodiment of the present invention.
第10(a)至10(d)圖：本發明較佳實施例之可重複利用黏膠片採用各種微細結構之正視示意圖。 10(a) to 10(d) are schematic front views showing various refineable adhesive films in accordance with a preferred embodiment of the present invention.
第11圖：本發明較佳實施例之以重複利用黏膠片進行元件組裝裝置採用單面微細結構黏膠片之側視示意圖。 Figure 11 is a side elevational view showing the use of a single-sided microstructured adhesive film by a reusable adhesive film for component assembly in accordance with a preferred embodiment of the present invention.
第12圖：本發明另一較佳實施例之以重複利用黏膠片進行元件組裝裝置採用雙面微細結構黏膠片之側視示意圖。 Fig. 12 is a side elevational view showing the use of a double-sided microstructured adhesive film by a reusable adhesive film for a component assembling apparatus according to another preferred embodiment of the present invention.
為了充分瞭解本發明，於下文將舉例較佳實施例並配合所附圖式作詳細說明，且其並非用以限定本發明。 In order to fully understand the present invention, the preferred embodiments of the present invention are described in detail below, and are not intended to limit the invention.
本發明較佳實施例之可重複利用黏膠片、其製造方法及其操作方法適合吸附於各種待加工元件，例如：各種光學玻璃、各種半導體晶圓或其它需吸附作業的待加工元件，但其並非用以限制本發明之應用範圍。另外，本發明較佳實施例之可重複利用黏膠片及其操作方法適合組裝應用於各種自動化或非自動化生產作業裝置，例如：各種自動或半自動組裝生產作業裝置、各種手動或非自動組裝生產作業裝置、各種機械手臂裝置、各種自動或非自動運輸裝置或各種夾持作業裝置，但其並非用以限制本發明之應用範圍。 The reusable adhesive film of the preferred embodiment of the present invention, the manufacturing method thereof and the operation method thereof are suitable for being adsorbed to various components to be processed, for example, various optical glass, various semiconductor wafers or other components to be processed to be adsorbed, but It is not intended to limit the scope of application of the present invention. In addition, the reusable adhesive film and the operation method thereof according to the preferred embodiment of the present invention are suitable for assembly and application to various automatic or non-automated production operation devices, for example, various automatic or semi-automatic assembly production operations, various manual or non-automatic assembly production operations. Devices, various robotic arm devices, various automatic or non-automatic transport devices, or various gripping devices, but are not intended to limit the scope of application of the present invention.
第1圖揭示本發明較佳實施例之以重複利用黏膠片進行元件組裝裝置結合待加工元件之側視示意圖。請參照第1圖所示，本發明較佳實施例之元件組裝裝置包含一可重複利用黏膠片1、一加工載具2及一待加工元件 400，且該可重複利用黏膠片1位於該加工載具2及待加工元件400之間。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a side elevational view showing the preferred embodiment of the present invention in which a component assembly apparatus is used in combination with a component to be processed by reusing a adhesive film. Referring to FIG. 1 , a component assembly apparatus according to a preferred embodiment of the present invention includes a reusable adhesive film 1 , a processing carrier 2 , and a component to be processed. 400, and the reusable adhesive film 1 is located between the processing carrier 2 and the component to be processed 400.
請再參照第1圖所示，本發明較佳實施例之該可重複利用黏膠片1包含一起始劑〔initiator〕、一架橋性單體〔cross-linking monomer〕、一單體材料〔monomer〕及一寡聚體材料〔oligomer〕。該起始劑、架橋性單體、單體材料及寡聚體材料形成一光聚合高分子組成物。 Referring to FIG. 1 again, the reusable adhesive film 1 of the preferred embodiment of the present invention comprises an initiator, a cross-linking monomer, and a monomer. And an oligomeric material [oligomer]. The initiator, the bridging monomer, the monomer material, and the oligomer material form a photopolymerizable polymer composition.
該起始劑選自一光起始劑〔photo initiator〕或一熱起始劑，以形成一光固型材料或一熱固型材料。該架橋性單體之添加形成耐高溫的該光聚合高分子組成物〔材料〕。該單體材料選自具疏水基體之單體或具親水基體之單體。本發明較佳實施例之該具疏水基體之單體可供該光聚合高分子組成物能緊密黏著於一基材表面上。 The initiator is selected from a photo initiator or a thermal initiator to form a photo-curable material or a thermoset material. The addition of the bridging monomer forms a photopolymerizable polymer composition [material] which is resistant to high temperatures. The monomer material is selected from a monomer having a hydrophobic matrix or a monomer having a hydrophilic matrix. The monomer having a hydrophobic matrix in the preferred embodiment of the present invention allows the photopolymerizable polymer composition to be closely adhered to a surface of a substrate.
舉例而言，該光起始劑選自Irgacure起始劑系列或二苯甲酮〔BP，benzophenone〕系列，且該光起始劑之比例介於1至20重量百分比。該單體材料選自丙烯酸系列、二丙二醇甲醚丙烯酸酯或丙二醇甲醚丙烯酸酯之同分異構物〔isomer〕系列，且該單體材料之比例介於10至80重量百分比。該寡聚體材料選自丙烯酸酯系列或環氧改質丙烯酸酯系列，且該寡聚體材料之比例介於20至85重量百分比。 For example, the photoinitiator is selected from the Irgacure starter series or the benzophenone series, and the photoinitiator ratio is from 1 to 20 weight percent. The monomer material is selected from the series of isomers of acrylic acid series, dipropylene glycol methyl ether acrylate or propylene glycol methyl ether acrylate, and the ratio of the monomer material is from 10 to 80% by weight. The oligomer material is selected from the acrylate series or the epoxy modified acrylate series, and the ratio of the oligomer material is between 20 and 85 weight percent.
本發明另一較佳實施例可選擇該具疏水基體之單體為具各種長度碳鏈之柔軟醚基壓克力化合物，且該碳鏈之碳數為1至12個。舉例而言，該單體之疏水性質大多為隨著碳鏈長度增加而增加疏水性質〔即不溶於水〕。當n=1時，最後面的十字碳鏈，即能產生相當的疏水性質，因此該單體自n=1至n=12，且n=1的該單體十分容易取得。 In another preferred embodiment of the present invention, the monomer having the hydrophobic matrix may be a soft ether-based acryl compound having carbon chains of various lengths, and the carbon chain has a carbon number of 1 to 12. For example, the hydrophobic nature of the monomer is mostly an increase in hydrophobic properties as the length of the carbon chain increases (ie, is insoluble in water). When n=1, the last cross carbon chain can produce quite hydrophobic properties, so the monomer is very easy to obtain from n=1 to n=12, and n=1.
第2圖揭示本發明較佳實施例之以重複利用黏膠片進行元件組裝方法之流程示意圖，其對應於第1圖之 元件組裝裝置。請參照第1及2圖所示，本發明較佳實施例之元件組裝方法包含步驟S1：將該可重複利用黏膠片1以適當方式〔例如：膠黏或直接黏貼〕提供於該加工載具2上。該加工載具2具有一預定位置，而該可重複利用黏膠片1設置於該加工載具2之預定位置上，且該可重複利用黏膠片1可輕易拆下後再重複使用。 2 is a schematic flow chart showing a method of assembling a component by reusing a adhesive film according to a preferred embodiment of the present invention, which corresponds to FIG. Component assembly device. Referring to Figures 1 and 2, the component assembly method of the preferred embodiment of the present invention comprises the step S1 of providing the reusable adhesive film 1 in an appropriate manner (e.g., adhesive or direct bonding) to the processing carrier. 2 on. The processing carrier 2 has a predetermined position, and the reusable adhesive film 1 is disposed at a predetermined position of the processing carrier 2, and the reusable adhesive film 1 can be easily removed and reused.
請再參照第1及2圖所示，舉例而言，該可重複利用黏膠片1具有至少一微細結構，且該微細結構形成一吸附層。該可重複利用黏膠片1選自一單面微細結構黏膠片、一雙面微細結構黏膠片或其它結構黏膠片。另外，該單面微細結構黏膠片需要採用膠黏或其它方式固定於該加工載具2上，而該雙面微細結構黏膠片則可直接黏貼於該加工載具2上。 Referring again to FIGS. 1 and 2, for example, the reusable adhesive film 1 has at least one fine structure, and the fine structure forms an adsorption layer. The reusable adhesive film 1 is selected from a single-sided microstructured adhesive film, a double-sided microstructured adhesive film or other structural adhesive film. In addition, the single-sided microstructured adhesive film needs to be fixed to the processing carrier 2 by adhesive or other means, and the double-sided fine structure adhesive film can be directly adhered to the processing carrier 2.
請再參照第1及2圖所示，本發明較佳實施例之元件組裝方法包含步驟S2：利用該可重複利用黏膠片1之吸附層將該待加工元件400黏貼吸附於該加工載具2上，以便將該待加工元件400完成固定於該加工載具上，但該待加工元件400仍以手動方式可輕易拆下。 Referring to FIGS. 1 and 2, the component assembly method of the preferred embodiment of the present invention includes the step S2 of: adhering the component to be processed 400 to the processing carrier 2 by using the adsorption layer of the reusable adhesive film 1. In order to complete the fixing of the component to be processed 400 on the processing carrier, the component to be processed 400 can still be easily removed manually.
請再參照第1及2圖所示，舉例而言，該待加工元件400選自一半導體封裝元件、一發光二極體封裝元件、一光學鏡頭組件、一印刷電路板、一印刷電路軟板或其它電子元件。該待加工元件400亦可選自半成品〔例如：CLCC(Ceramic Lead-Frame Chip Carrier)、PLCC(Plastic Lead-Frame Chip Carrier)或CSP(Chip Scale Package)〕、裸晶〔例如：COB(Chip On Board)、COF(Chip On FPC)、COS(Chip On Substrate)、凹穴式COB(Cavity COB)或覆晶(Flip-Chip)〕或半成品封裝元件〔例如：量子薄膜元件(Quantum Film)、CCD(Charge Coupled Device)或互補式金屬-氧化物-半導體元件(CMOS)〕。 Referring to FIGS. 1 and 2 , for example, the component to be processed 400 is selected from a semiconductor package component, a light emitting diode package component, an optical lens component, a printed circuit board, and a printed circuit board. Or other electronic components. The component to be processed 400 may also be selected from semi-finished products (for example, CLCC (Ceramic Lead-Frame Chip Carrier), PLCC (Plastic Lead-Frame Chip Carrier) or CSP (Chip Scale Package)), bare crystal (for example: COB (Chip On) Board), COF (Chip On FPC), COS (Chip On Substrate), Cavity COB or Flip-Chip or semi-finished package components (eg Quantum Film, CCD) (Charge Coupled Device) or Complementary Metal-Oxide-Semiconductor Element (CMOS).
請再參照第1及2圖所示，本發明較佳實施例之元件組裝方法包含步驟S3：將該加工載具2及待加工元件400利用一加工製程或一加工機台進行加工作業，其中該加工製程包含元件堆疊組裝製程、塗佈加工製程、加熱製程、清洗製程或其它加工製程。 Referring to FIGS. 1 and 2 again, the component assembly method of the preferred embodiment of the present invention includes the step S3: the processing carrier 2 and the component to be processed 400 are processed by a processing process or a processing machine, wherein The processing process includes a component stack assembly process, a coating process, a heating process, a cleaning process, or other processing processes.
請再參照第1及2圖所示，本發明較佳實施例之元件組裝方法包含步驟S4：在加工製程完成後將該待加工元件400自該可重複利用黏膠片1進行剝離，且不留下殘膠，以便將該可重複利用黏膠片1重複使用。另外，該可重複利用黏膠片1亦可自該加工載具2進行剝離拆卸，且不留下殘膠。 Referring to FIGS. 1 and 2 again, the component assembly method of the preferred embodiment of the present invention includes the step S4: the component to be processed 400 is peeled off from the reusable adhesive film 1 after the processing is completed, and is not left. The residual glue is used to reuse the reusable adhesive film 1. In addition, the reusable adhesive film 1 can also be peeled off from the processing carrier 2 without leaving residual glue.
第3A圖揭示本發明較佳實施例之以重複利用黏膠片進行元件組裝裝置完成組裝CSP封裝元件於鏡頭組件之側視示意圖。請參照第3A圖所示，本發明較佳實施例之元件組裝裝置用以將一CSP封裝元件401組裝於鏡頭組件內，且該可重複利用黏膠片1以手動方式進行拆卸後可重複使用。 FIG. 3A is a side elevational view showing the assembly of the CSP package component to the lens assembly by reusing the adhesive film for the component assembly apparatus in accordance with a preferred embodiment of the present invention. Referring to FIG. 3A, the component assembly apparatus of the preferred embodiment of the present invention is used to assemble a CSP package component 401 into the lens assembly, and the reusable adhesive film 1 can be repeatedly used after being manually removed.
第3B圖揭示本發明較佳實施例之以重複利用黏膠片進行另一元件組裝裝置完成組裝COB封裝元件於鏡頭組件之側視示意圖，其對應於第3A圖。請參照第3B圖所示，本發明較佳實施例之元件組裝裝置用以將一COB封裝元件402組裝於鏡頭組件內，且該可重複利用黏膠片1以手動方式進行拆卸後可重複使用。 FIG. 3B is a side elevational view showing the assembly of the COB package component to the lens assembly by reusing the adhesive film for another component assembly apparatus according to a preferred embodiment of the present invention, which corresponds to FIG. 3A. Referring to FIG. 3B, the component assembly apparatus of the preferred embodiment of the present invention is used to assemble a COB package component 402 into the lens assembly, and the reusable adhesive film 1 can be repeatedly used after being manually removed.
第4圖揭示本發明較佳實施例之可重複利用黏膠片及其採用成形模具之立體示意圖，其包含兩個部分為圖式上半部及圖式下半部，其僅以適當縮小比例尺寸及形狀表示可重複利用黏膠片及其採用成形模具之技術特徵。請參照第4圖之上半部所示，本發明較佳實施例之可重複利用黏膠片1包含一吸盤基板10、一微細結構20及一按 壓操作面A，且該微細結構20選擇設置於該吸盤基板10之適當位置〔例如：外表面，其包含上表面、下表面、環側表面或其它表面〕，以便進行吸附各種重物之操作。 Figure 4 is a perspective view showing a reusable adhesive film and a forming die thereof according to a preferred embodiment of the present invention, which comprises two parts, a top half of the figure and a lower half of the figure, which are only appropriately reduced in size. And the shape represents the technical characteristics of the reusable adhesive film and its use of a forming mold. Referring to the upper half of FIG. 4, the reusable adhesive film 1 of the preferred embodiment of the present invention comprises a chuck substrate 10, a microstructure 20 and a button. The operation surface A is pressed, and the microstructure 20 is selectively disposed at an appropriate position of the chuck substrate 10 (for example, an outer surface including an upper surface, a lower surface, a ring side surface, or other surface) for performing operations of adsorbing various weights. .
請再參照第4圖之上半部所示，舉例而言，該可重複利用黏膠片1具有一預定厚度及一預定體積，而該可重複利用黏膠片1可選擇由該吸盤基板10形成一片狀體、一塊狀體、一圓盤狀體或其它各種形狀體，且該微細結構20及按壓操作面A適當配置於該吸盤基板10上，以形成該可重複利用黏膠片1。 Referring again to the upper half of FIG. 4, for example, the reusable adhesive film 1 has a predetermined thickness and a predetermined volume, and the reusable adhesive film 1 can be selectively formed by the chuck substrate 10. A sheet-like body, a block-shaped body, a disk-shaped body or other various shapes, and the fine structure 20 and the pressing operation surface A are appropriately disposed on the chuck substrate 10 to form the reusable adhesive sheet 1.
請再參照第4圖之上半部所示，舉例而言，該吸盤基板10包含一第一表面11及一第二表面12，而將該第一表面11選擇設置為該可重複利用黏膠片1之一預定吸附表面，且該第一表面11及第二表面12分別位於該吸盤基板10之兩側。 Referring to the upper half of FIG. 4 again, for example, the chuck substrate 10 includes a first surface 11 and a second surface 12, and the first surface 11 is selectively disposed as the reusable adhesive film. One of the first adsorption surfaces is predetermined, and the first surface 11 and the second surface 12 are respectively located on both sides of the chuck substrate 10.
請再參照第4圖之上半部所示，舉例而言，該微細結構20為微米或奈米級結構，其排列〔例如：相等間距並排、向特定方向傾斜排列、相互交叉排列或其它排列方式〕設置於該可重複利用黏膠片1之預定吸附表面上，且該微細結構20用以進行吸附各種重物之操作。在結構選擇設計上，該微細結構20具有一特定微細結構部，例如：其選自一凹凸結構部〔concave-convex structure〕、一槽溝部〔groove portion〕、一凹穴部〔recessed portion〕或一孔洞部〔hole portion〕。 Referring again to the upper half of FIG. 4, for example, the microstructure 20 is of a micron or nano-scale structure, and its arrangement is exemplified by equal spacing, side by side, oblique alignment in a specific direction, cross arrangement or other arrangement. The method is disposed on a predetermined adsorption surface of the reusable adhesive film 1, and the microstructure 20 is used for performing operations of adsorbing various weights. In the structural selection design, the microstructure 20 has a specific microstructure portion, for example, selected from a concave-convex structure, a groove portion, a recessed portion, or a hole portion.
請再參照第4圖之上半部所示，舉例而言，該微細結構20之數個槽溝〔未標示〕排列設置於該吸盤基板10之第一表面11，以形成一吸附層〔或一吸附操作層〕。如此，該吸盤基板10具有一吸附表面〔未標示，即該吸附層之正面〕及一結合表面〔未標示，即該吸附層之背面〕，且該結合表面可選擇結合固定於其它元件表面。 Referring to the upper half of FIG. 4 again, for example, a plurality of grooves [not shown] of the microstructure 20 are arranged on the first surface 11 of the chuck substrate 10 to form an adsorption layer [or An adsorption operation layer]. Thus, the chuck substrate 10 has an adsorption surface (not shown, that is, the front surface of the adsorption layer) and a bonding surface (not shown, that is, the back surface of the adsorption layer), and the bonding surface can be selectively bonded and fixed to other component surfaces.
請參照第4圖之下半部所示，本發明較佳實施例選擇採用一成形模具5，且該成形模具5可選擇適當材質進行製造。舉例而言，該成形模具5包含數個成形微結構51，且該數個成形微結構51構成一特定圖案，其對應於該可重複利用黏膠片1之微細結構20，如第4圖之上半部所示。 Referring to the lower half of Fig. 4, a preferred embodiment of the present invention selects a forming die 5, and the forming die 5 can be manufactured by selecting a suitable material. For example, the forming mold 5 includes a plurality of forming microstructures 51, and the plurality of forming microstructures 51 constitute a specific pattern corresponding to the microstructure 20 of the reusable adhesive film 1, as shown in FIG. Shown in half.
第5圖揭示本發明較佳實施例之可重複利用黏膠片製造方法之流程示意圖，其包含四個主要步驟S1至S4，但其並非用以限定本發明之步驟順序，在不脫離本發明範圍之下，可適當變更本發明較佳實施例之步驟順序。請參照第4圖之下半部及第5圖所示，本發明較佳實施例之可重複利用黏膠片製造方法包含步驟S1：首先，提供或製備該成形模具5，且該成形模具5至少包含一個或數個該成形微結構51。 5 is a flow chart showing a method for manufacturing a reusable adhesive film according to a preferred embodiment of the present invention, which comprises four main steps S1 to S4, but is not intended to limit the order of steps of the present invention without departing from the scope of the present invention. In the following, the order of steps of the preferred embodiment of the present invention can be appropriately changed. Referring to the lower half of FIG. 4 and FIG. 5, the reusable adhesive film manufacturing method of the preferred embodiment of the present invention comprises the step S1: first, the forming mold 5 is provided or prepared, and the forming mold 5 is at least One or several of the shaped microstructures 51 are included.
請再參照第4及5圖所示，本發明較佳實施例之可重複利用黏膠片製造方法包含步驟S2：接著，利用該成形模具5之成形微結構51以適當技術手段對應形成一個或數個該微細結構20於該可重複利用黏膠片1上。本發明較佳實施例之該可重複利用黏膠片1可選擇採用適當技術手段陸續揭示於第6(b)圖之製造方法。 Referring to Figures 4 and 5, the reproducible adhesive film manufacturing method of the preferred embodiment of the present invention comprises the step S2: the forming microstructures 51 of the forming mold 5 are then used to form one or several corresponding technical means. The microstructure 20 is on the reusable adhesive film 1. The reusable adhesive film 1 of the preferred embodiment of the present invention can be selectively disclosed in the manufacturing method of Fig. 6(b) by a suitable technique.
請再參照第4及5圖所示，本發明較佳實施例之可重複利用黏膠片製造方法包含步驟S3：接著，先提供或製備一吸盤基板胚〔如第6(b)圖所示〕後，再利用該成形模具5之成形微結構51直接壓印方式或其它方式成形圖案於該吸盤基板胚上，以便形成該微細結構20於該吸盤基板10上。 Referring to Figures 4 and 5 again, the reusable adhesive film manufacturing method of the preferred embodiment of the present invention comprises the step S3: Next, a chuck substrate embryo is provided or prepared (as shown in Fig. 6(b)] Thereafter, the forming microstructure 51 of the forming mold 5 is directly embossed or otherwise formed on the chuck substrate to form the microstructure 20 on the chuck substrate 10.
請再參照第4及5圖所示，本發明較佳實施例之可重複利用黏膠片製造方法包含步驟S4：接著，在完成形成該微細結構20後，將該成形模具5之成形微結構51 及可重複利用黏膠片1之微細結構20之間以適當技術手段進行相互分離〔或剝離〕，以便將該可重複利用黏膠片1之吸盤成品脫離於該成形模具5。 Referring to Figures 4 and 5, the reproducible adhesive film manufacturing method of the preferred embodiment of the present invention comprises the step S4: Next, after the formation of the microstructure 20, the forming microstructure of the forming mold 5 is 51. And the fine structure 20 of the reusable adhesive film 1 is separated from each other (or peeled off) by a suitable technical means to detach the finished suction cup of the reusable adhesive film 1 from the forming mold 5.
第6(a)至6(f)圖揭示本發明較佳實施例之可重複利用黏膠片製造方法之一系列製造步驟之示意圖，其對應於第4圖之可重複利用黏膠片及第5圖之可重複利用黏膠片製造方法。請參照第4、5及6(a)圖所示，本發明較佳實施例之可重複利用黏膠片製造方法包含步驟S1：首先，提供或製備該成形模具5，且該成形模具5包含數個該成形微結構51。 6(a) to 6(f) are views showing a series of manufacturing steps of a reusable adhesive film manufacturing method according to a preferred embodiment of the present invention, which corresponds to the reusable adhesive film of Fig. 4 and Fig. 5 Reusable adhesive film manufacturing methods. Referring to Figures 4, 5 and 6(a), the reusable adhesive film manufacturing method of the preferred embodiment of the present invention comprises the step S1: first, the forming mold 5 is provided or prepared, and the forming mold 5 comprises The shaped microstructures 51.
請再參照第4、5及6(b)圖所示，本發明較佳實施例之可重複利用黏膠片製造方法包含步驟S2：接著，利用該成形模具5之成形微結構51以適當技術手段對應形成一個或數個該微細結構20於該可重複利用黏膠片1上。舉例而言，本發明較佳實施例之可重複利用黏膠片製造方法選擇包含步驟S3：先提供或製備一吸盤基板胚100〔例如：光阻劑或其它類似可擠壓流動材料〕後，再利用該成形模具5之成形微結構51以適當壓力直接對應壓印成形圖案於該吸盤基板胚100之上表面〔或選擇其它表面〕上，以便形成該微細結構20於該可重複利用黏膠片1上。舉例而言，將該吸盤基板胚100選擇提供於一作業承載平台〔未繪示〕上。 Referring to Figures 4, 5 and 6(b), the reproducible adhesive film manufacturing method of the preferred embodiment of the present invention comprises the step S2: then, using the forming microstructure 51 of the forming mold 5 by appropriate technical means Correspondingly, one or several of the microstructures 20 are formed on the reusable adhesive film 1. For example, the reusable adhesive film manufacturing method of the preferred embodiment of the present invention includes the step S3: first providing or preparing a chuck substrate 100 (for example, a photoresist or other similar extrudable flow material), and then The forming microstructure 51 of the forming mold 5 is directly corresponding to the embossing forming pattern on the upper surface of the chuck substrate 100 (or other surface) by appropriate pressure to form the microstructure 20 on the reusable adhesive film 1 on. For example, the chuck substrate 100 is selectively provided on a work bearing platform (not shown).
請再參照第4、5及6(c)圖所示，本發明較佳實施例之步驟S3：舉例而言，利用該成形模具5之成形微結構51以熱壓印〔thermal imprinting〕成形方式〔如第6(c)圖之向下箭頭所示〕成形圖案〔負型圖案〕於該吸盤基板胚100之上表面上，即機械性押出〔mechanical extrusion〕方式一體形成該微細結構20。此時，該吸盤基板胚100之膠體材料被擠壓流動至該成形微結構51之縫隙內。或者， 本發明另一較佳實施例可選擇轉印〔transfer printing〕成形、鑄模〔molding〕成形或其它成形方式成形圖案於該吸盤基板胚100之上表面上。 Referring again to FIGS. 4, 5 and 6(c), step S3 of the preferred embodiment of the present invention: for example, the forming microstructure of the forming mold 5 is formed by thermal imprinting. The negative pattern 20 is integrally formed on the upper surface of the chuck substrate 100, that is, in a mechanical extrusion manner, as shown by the downward arrow in Fig. 6(c). At this time, the colloidal material of the chuck substrate 100 is squeezed and flows into the slit of the forming microstructure 51. or, Another preferred embodiment of the present invention may select a transfer printing forming, molding molding or other forming forming pattern on the upper surface of the chuck substrate 100.
請再參照第4、5及6(d)圖所示，舉例而言，本發明較佳實施例之可重複利用黏膠片製造方法選擇該吸盤基板胚100採用一光硬化樹脂材料或其它適當材料，且選擇以曝光〔exposure〕方式加工硬化成形該吸盤基板10及微細結構20，如第6(e)及6(f)圖所示。 Referring to FIGS. 4, 5 and 6(d), for example, the reusable adhesive film manufacturing method of the preferred embodiment of the present invention selects the chuck substrate 100 to use a light-curing resin material or other suitable material. Further, the chuck substrate 10 and the fine structure 20 are selectively formed by an exposure method, as shown in Figs. 6(e) and 6(f).
請再參照第4、5、6(e)及6(f)圖所示，本發明較佳實施例之可重複利用黏膠片製造方法包含步驟S4：接著，在完成押出形成該微細結構20後，將該成形模具5之成形微結構51及可重複利用黏膠片1之微細結構20之間以適當技術手段進行相互分離〔或剝離〕，以便將該可重複利用黏膠片1之吸盤成品脫離於該成形模具5，如第6(e)圖所示。 Referring to FIGS. 4, 5, 6(e) and 6(f), the reproducible adhesive film manufacturing method of the preferred embodiment of the present invention comprises the step S4: then, after the extrusion is completed to form the microstructure 20 Separating (or peeling) the formed microstructure 51 of the forming mold 5 and the fine structure 20 of the reusable adhesive film 1 by appropriate technical means to separate the finished product of the reusable adhesive film 1 from the suction cup This molding die 5 is as shown in Fig. 6(e).
請再參照第4圖之上半部所示，舉例而言，每個該微細結構20之槽溝具有一吸附開口，以便經由該吸附開口連通至該微細結構20之內部，如此該微細結構20可提供通入或排放適量氣體。該微細結構20之槽溝以適當間距〔隔牆厚度〕分隔每個該槽溝之間，以提升該微細結構20之結構強度，如此該微細結構20可承受適當的機械性及彈性變形而不產生破壞其結構，但其並非用以限制本發明之範圍。 Referring again to the upper half of FIG. 4, for example, the groove of each of the microstructures 20 has an adsorption opening for communicating to the inside of the microstructure 20 via the adsorption opening, such that the microstructure 20 It can provide access or discharge an appropriate amount of gas. The grooves of the microstructure 20 are separated between each of the grooves at an appropriate spacing [wall thickness] to enhance the structural strength of the microstructure 20, so that the microstructure 20 can withstand appropriate mechanical and elastic deformation without The structure is destroyed, but it is not intended to limit the scope of the invention.
請再參照第4圖之上半部所示，舉例而言，每個該微細結構20之槽溝具有一半開放氣室，而該半開放氣室可產生適當彈性變形，且該半開放氣室可容置適量氣體及適當種類氣體〔例如：空氣、氮氣或其它惰性氣體〕。如此，該微細結構20之槽溝內部體積可藉由其適當機械性及彈性變形之壓縮方式〔或恢復原形方式〕提供操作低壓 吸附物體〔或釋放物體〕之功能。 Referring again to the upper half of FIG. 4, for example, each of the fine structures 20 has a half open air chamber, and the semi-open air chamber can generate appropriate elastic deformation, and the semi-open air chamber A suitable amount of gas and a suitable type of gas (for example, air, nitrogen or other inert gas) can be accommodated. Thus, the internal volume of the groove of the microstructure 20 can be operated by a suitable mechanical and elastic deformation compression mode (or restoration mode). The function of absorbing an object [or releasing an object].
請再參照第4圖之上半部所示，舉例而言，該按壓操作面A設置於該吸盤基板10之第二表面12，且該吸附層對應該按壓操作面A，但其並非用以限制本發明之範圍。或，本發明另一較佳實施例之該按壓操作面A選擇預留設置於該吸附層之適當位置〔例如：該吸附層之背面〔即該吸盤基板10之結合表面〕或其它適當位置〕。 Referring to the upper half of FIG. 4 again, for example, the pressing operation surface A is disposed on the second surface 12 of the chuck substrate 10, and the adsorption layer corresponds to the pressing operation surface A, but it is not used. Limit the scope of the invention. Or, in another preferred embodiment of the present invention, the pressing operation surface A is selected to be disposed at an appropriate position of the adsorption layer (for example, the back surface of the adsorption layer (ie, the bonding surface of the chuck substrate 10) or other suitable position] .
請再參照第4圖之上半部所示，舉例而言，將該微細結構20對應貼附於任何待吸附表面〔未繪示於第4圖〕上，經由利用該按壓操作面A進行按壓操作該微細結構20，以擠壓排出該微細結構20內之適量氣體，以便該微細結構20可吸附在該待吸附表面上。反之，若將適量氣體適當送入至該微細結構20之內部時，可將該微細結構20脫離於該待吸附表面。 Referring to the upper half of FIG. 4 again, for example, the microstructure 20 is attached to any surface to be adsorbed (not shown in FIG. 4), and is pressed by using the pressing operation surface A. The microstructure 20 is operated to squeeze an appropriate amount of gas discharged into the microstructure 20 so that the microstructure 20 can be adsorbed on the surface to be adsorbed. On the other hand, if an appropriate amount of gas is appropriately fed into the inside of the fine structure 20, the fine structure 20 can be detached from the surface to be adsorbed.
請再參照第4圖之上半部所示，舉例而言，依各種不同使用需求，將該吸盤基板10之第二表面12利用一強力接著劑或一雙面泡棉膠層〔未繪示〕黏貼一掛勾、一掛環、一拉環、一支撐臂或一支撐架〔未繪示〕，但其並非用以限制本發明之範圍。 Referring to the upper half of FIG. 4 again, for example, the second surface 12 of the chuck substrate 10 is made of a strong adhesive or a double-sided foam layer according to various needs of use (not shown). Applying a hook, a loop, a tab, a support arm or a support frame (not shown), but it is not intended to limit the scope of the present invention.
第7圖揭示本發明另一較佳實施例之可重複利用黏膠片之立體示意圖，其對應於第4圖之可重複利用黏膠片。請參照第7圖所示，相對的本發明另一較佳實施例之可重複利用黏膠片1包含一吸盤基板10、一微細結構20及一按壓操作墊片30，其結構及形狀可對應參考於第4圖之可重複利用黏膠片，於此不予贅述。該微細結構20具有數奈米尺寸至數百奈米尺寸或數微米，如第7圖所標示之槽溝之高度、寬度及間距。 Fig. 7 is a perspective view showing a reusable adhesive film according to another preferred embodiment of the present invention, which corresponds to the reusable adhesive film of Fig. 4. Referring to FIG. 7 , a reusable adhesive film 1 according to another preferred embodiment of the present invention comprises a chuck substrate 10 , a microstructure 20 and a pressing operation pad 30 , and the structure and shape thereof can be referenced. The adhesive film can be reused in Fig. 4 and will not be described here. The microstructure 20 has a size ranging from a few nanometers to hundreds of nanometers or a few micrometers, as indicated by the height, width and spacing of the grooves indicated in FIG.
請再參照第7圖所示，舉例而言，該按壓操作墊片30選自一片狀體或具類似形狀之片體，且該片狀體具 有一預定厚度及一預定體積。該按壓操作墊片30包含一第一墊片表面及一第二墊片表面，且該第一墊片表面及第二墊片表面分別位於該按壓操作墊片30之兩側。 Referring to FIG. 7 again, for example, the pressing operation pad 30 is selected from a sheet or a similarly shaped sheet, and the sheet body has There is a predetermined thickness and a predetermined volume. The pressing operation pad 30 includes a first gasket surface and a second gasket surface, and the first gasket surface and the second gasket surface are respectively located on opposite sides of the pressing operation gasket 30.
請再參照第7圖所示，舉例而言，該按壓操作墊片30選自選自一橡膠墊片、一彈性墊片或其它類似墊片。另外，該按壓操作墊片30有一邊緣〔如第7圖之兩條虛線所示〕，且該邊緣垂直對應於該微細結構20之邊緣。該按壓操作墊片30之第一墊片表面貼接於該吸盤基板10之第二表面12，以便該按壓操作墊片30對該微細結構20提供一預負載〔preload〕。 Referring again to FIG. 7, for example, the pressing operation pad 30 is selected from the group consisting of a rubber gasket, an elastic gasket or the like. Further, the pressing operation pad 30 has an edge (shown by two broken lines in Fig. 7), and the edge vertically corresponds to the edge of the microstructure 20. The first gasket surface of the pressing operation gasket 30 is attached to the second surface 12 of the chuck substrate 10, so that the pressing operation gasket 30 provides a preload to the microstructure 20.
請再參照第7圖所示，舉例而言，該按壓操作墊片30利用一強力接著劑或一雙面泡棉膠層〔未繪示〕黏貼於該吸盤基板10之第二表面12。另外，依各種不同使用需求，將該按壓操作墊片30之第二墊片表面利用一強力接著劑或一雙面泡棉膠層〔未繪示〕黏貼一掛勾、一掛環、一拉環、一支撐臂或一支撐架〔未繪示〕。 Referring to FIG. 7 again, for example, the pressing operation pad 30 is adhered to the second surface 12 of the chuck substrate 10 by using a strong adhesive or a double-sided foam layer (not shown). In addition, according to various different use requirements, the second gasket surface of the pressing operation gasket 30 is adhered by a strong adhesive or a double-sided foam rubber layer (not shown), a hook, a loop, and a pull. a ring, a support arm or a support frame (not shown).
第8圖揭示本發明較佳實施例之可重複利用黏膠片在進行操作吸附時對應待加工元件之立體示意圖，其對應於第4圖之可重複利用黏膠片。請參照第8圖所示，本發明較佳實施例之可重複利用黏膠片操作方法包含步驟：首先，在進行吸附操作時，利用該微細結構20所形成該吸附層之吸附表面對應於一待加工元件400之一待吸附表面B。 Figure 8 is a perspective view showing the reusable adhesive film of the preferred embodiment of the present invention corresponding to the component to be processed when performing the operation adsorption, which corresponds to the reusable adhesive film of Figure 4. Referring to FIG. 8, the reusable adhesive film operation method of the preferred embodiment of the present invention comprises the steps of: firstly, when the adsorption operation is performed, the adsorption surface of the adsorption layer formed by the fine structure 20 corresponds to a waiting One of the processing elements 400 is to be adsorbed to the surface B.
請再參照第8圖所示，本發明較佳實施例之可重複利用黏膠片操作方法包含步驟：接著，將該微細結構20之吸附層之全部〔或至少一部分〕槽溝對應貼附於該待吸附表面B，並施加適當壓力於該按壓操作面A，如第8圖之向下大箭頭所示。 Referring to FIG. 8, the reusable adhesive film operation method of the preferred embodiment of the present invention comprises the steps of: subsequently attaching all (or at least a part of) the groove of the adsorption layer of the microstructure 20 to the groove. The surface B is to be adsorbed, and an appropriate pressure is applied to the pressing operation surface A as indicated by the downward large arrow in Fig. 8.
請再參照第8圖所示，本發明較佳實施例之可 重複利用黏膠片操作方法包含步驟：接著，利用按壓操作該微細結構20之吸附層之全部〔或至少一部分〕槽溝，以擠壓排出該全部〔或至少一部分〕槽溝之至少一部分之氣體，以便該微細結構20之吸附層之全部〔或至少一部分〕槽溝可吸附該待吸附表面B。此時，舉例而言，本發明較佳實施例之該可重複利用黏膠片1在垂直吊起該待加工元件400時，該可重複利用黏膠片1可提供適當吸力於該待吸附表面B上。 Referring to FIG. 8 again, the preferred embodiment of the present invention can The method of reusing the adhesive film comprises the steps of: subsequently pressing all (or at least a portion of) the grooves of the adsorption layer of the microstructure 20 to press and expel at least a portion of the gas of the entire [or at least a portion of the grooves, Therefore, all (or at least a part of) the grooves of the adsorption layer of the microstructure 20 can adsorb the surface B to be adsorbed. At this time, for example, when the reusable adhesive film 1 of the preferred embodiment of the present invention vertically lifts the component to be processed 400, the reusable adhesive film 1 can provide a proper suction force on the surface B to be adsorbed. .
請再參照第8圖所示，本發明較佳實施例之可重複利用黏膠片操作方法包含步驟：最後，在進行脫離操作時，將該吸盤基板10或微細結構20之吸附層之至少一邊緣〔右側緣〕或其它側緣位置〔例如：左側緣〕進行撥開，以便該微細結構20之吸附層之至少一部分槽溝可開始剝離該待吸附表面B，且接著該微細結構20之吸附層之其它槽溝逐漸向上方向剝離於該待吸附表面B，直至該微細結構20之吸附層之全部槽溝完全剝離於該待吸附表面B，如第8圖之向上小斜箭頭所示。 Referring to FIG. 8, the reusable adhesive film operation method of the preferred embodiment of the present invention comprises the steps of: finally, at least one edge of the adsorption layer of the chuck substrate 10 or the microstructure 20 during the detachment operation. [right edge] or other side edge position (for example, left edge) is opened so that at least a part of the groove of the adsorption layer of the microstructure 20 can start to peel off the surface to be adsorbed B, and then the adsorption layer of the microstructure 20 The other grooves are gradually peeled off from the surface to be adsorbed B until the entire groove of the adsorption layer of the microstructure 20 is completely peeled off from the surface B to be adsorbed, as indicated by the upward oblique arrow in FIG.
如第8圖所示，本發明較佳實施例之可重複利用黏膠片操作方法包含三個主要步驟，但其並非用以限定本發明之步驟順序，在不脫離本發明範圍之下，可適當變更〔或省略〕本發明較佳實施例之步驟順序。 As shown in Fig. 8, the reusable adhesive film operation method of the preferred embodiment of the present invention comprises three main steps, but it is not intended to limit the order of steps of the present invention, and may be appropriately selected without departing from the scope of the present invention. The order of the steps of the preferred embodiment of the invention is changed [or omitted].
第9圖揭示本發明較佳實施例之可重複利用黏膠片另一使用其操作方法之立體示意圖，其對應於第8圖。請參照第9圖所示，本發明較佳實施例之該可重複利用黏膠片1在側向吊起該待加工元件400進行加工作業〔例如：清洗作業〕時，該可重複利用黏膠片1可提供側向負重〔shear force〕於該待吸附表面B上，如第9圖之向上箭頭所示。 Fig. 9 is a perspective view showing another operation method of a reusable adhesive film according to a preferred embodiment of the present invention, which corresponds to Fig. 8. Referring to FIG. 9, in the preferred embodiment of the present invention, the reusable adhesive film 1 is used to perform the processing operation (for example, cleaning operation) when the component to be processed 400 is laterally lifted, and the reusable adhesive film 1 is used. A lateral load can be provided on the surface B to be adsorbed, as indicated by the upward arrow in FIG.
請再參照第9圖所示，本發明較佳實施例之可 重複利用黏膠片操作方法包含步驟：最後，在進行脫離操作時，將該微細結構20〔如第4圖所示〕之吸附層之至少一邊緣〔底側緣〕或其它側緣位置〔例如：上側緣〕進行撥開，以便該微細結構20之吸附層之至少一部分槽溝可開始剝離該待吸附表面B，且接著該微細結構20之吸附層之其它槽溝逐漸向右剝離於該待吸附表面B，直至該微細結構20之吸附層完全剝離於該待吸附表面B，如第9圖之向右小箭頭所示。 Referring to FIG. 9 again, the preferred embodiment of the present invention can The method of reusing the adhesive film comprises the steps of: finally, at least one edge (bottom side edge) or other side edge position of the adsorption layer of the microstructure 20 (as shown in FIG. 4) when performing the detachment operation (for example: The upper edge edge is disengaged so that at least a part of the groove of the adsorption layer of the microstructure 20 can start to peel off the surface B to be adsorbed, and then the other grooves of the adsorption layer of the microstructure 20 are gradually peeled to the right to be adsorbed. The surface B until the adsorption layer of the microstructure 20 is completely peeled off from the surface B to be adsorbed, as indicated by the small arrow to the right in FIG.
第10(a)至10(d)圖揭示本發明較佳實施例之可重複利用黏膠片採用一系列各種微細結構之正視示意圖，其對應於第4圖之可重複利用黏膠片。請參照第10(a)圖所示，本發明較佳實施例之可重複利用黏膠片採用一微細結構20a具有數個傾斜槽溝，且該數個傾斜槽溝選擇以等間距或不等間距方式相互平行延伸於該可重複利用黏膠片1之第一表面11上。 Figures 10(a) through 10(d) show a front view of a series of various fine structures for a reusable adhesive film in accordance with a preferred embodiment of the present invention, corresponding to the reusable adhesive film of Figure 4. Referring to FIG. 10(a), the reusable adhesive film of the preferred embodiment of the present invention adopts a fine structure 20a having a plurality of inclined grooves, and the plurality of inclined grooves are selected at equal or unequal intervals. The manners extend parallel to each other on the first surface 11 of the reusable adhesive film 1.
請參照第10(b)圖所示，本發明較佳實施例之可重複利用黏膠片採用一微細結構20b包含數個圓形凸點部或數個圓形凹穴部，且該數個圓形凸點部或數個圓形凹穴部以規則等距或逐漸規則變化不等距方式排列形成一圓凸點陣列或一圓形凹穴陣列於該可重複利用黏膠片1之第一表面11上。 Referring to FIG. 10(b), the reusable adhesive film of the preferred embodiment of the present invention adopts a microstructure 20b comprising a plurality of circular bump portions or a plurality of circular recess portions, and the plurality of circles The convex portion or the plurality of circular concave portions are arranged in a unequal manner in a regular equidistant or gradually regular manner to form an array of circular bumps or a circular array of holes on the first surface 11 of the reusable adhesive film 1 on.
請參照第10(c)圖所示，本發明較佳實施例之可重複利用黏膠片採用一微細結構20c包含數個橢圓凸點部或數個橢圓凹穴部，且該數個橢圓凸點部或數個橢圓凹穴部以規則等距或逐漸規則變化不等距方式排列形成一橢圓凸點陣列或一橢圓凹穴陣列於該可重複利用黏膠片1之第一表面11上。 Referring to FIG. 10(c), the reusable adhesive film of the preferred embodiment of the present invention adopts a microstructure 20c comprising a plurality of elliptical bumps or a plurality of elliptical pockets, and the plurality of elliptical bumps The portion or the plurality of elliptical pocket portions are arranged in a unequal manner in a regular equidistant or gradually regular manner to form an array of elliptical bumps or an array of elliptical pockets on the first surface 11 of the reusable adhesive film 1.
請參照第10(d)圖所示，本發明較佳實施例之可重複利用黏膠片採用一微細結構20d包含數個第一槽溝 部及數個第二槽溝部，且該第一槽溝部及第二槽溝部相互交叉形成一交叉陣列於該可重複利用黏膠片1之第一表面11上。 Referring to FIG. 10(d), the reusable adhesive film of the preferred embodiment of the present invention adopts a microstructure 20d comprising a plurality of first grooves. And a plurality of second groove portions, wherein the first groove portion and the second groove portion intersect each other to form a cross array on the first surface 11 of the reusable adhesive film 1.
第11圖揭示本發明較佳實施例之以重複利用黏膠片進行元件組裝裝置採用單面微細結構黏膠片之側視示意圖。請參照第11圖所示，本發明較佳實施例之該可重複利用黏膠片1為一單面微細結構黏膠片1a。該單面微細結構黏膠片1a包含一基板10a及一第一微細結構201，且該第一微細結構201位於該基板10a之一側。 Figure 11 is a side elevational view showing the use of a single-sided microstructured adhesive film by a repetitive adhesive film for component assembly in accordance with a preferred embodiment of the present invention. Referring to Fig. 11, the reusable adhesive film 1 of the preferred embodiment of the present invention is a single-sided microstructured adhesive film 1a. The single-sided microstructured adhesive film 1a includes a substrate 10a and a first microstructure 201, and the first microstructure 201 is located on one side of the substrate 10a.
第12圖揭示本發明另一較佳實施例之以重複利用黏膠片進行元件組裝裝置採用雙面微細結構黏膠片之側視示意圖，其對應於第11圖。請參照第12圖所示，本發明另一較佳實施例之該可重複利用黏膠片1為一雙面微細結構黏膠片1b。該單面微細結構黏膠片1a包含一基板10a、一第一微細結構201及一第二微細結構202，且該第一微細結構201及第二微細結構202分別位於該基板10a之兩側。 Fig. 12 is a side elevational view showing the use of a double-sided microstructured adhesive film by a repetitive adhesive film for a component assembling apparatus according to another preferred embodiment of the present invention, which corresponds to Fig. 11. Referring to Fig. 12, in another preferred embodiment of the present invention, the reusable adhesive film 1 is a double-sided microstructured adhesive film 1b. The single-sided microstructured adhesive film 1a includes a substrate 10a, a first microstructure 201 and a second microstructure 202, and the first microstructure 201 and the second microstructure 202 are respectively located on opposite sides of the substrate 10a.
前述較佳實施例僅舉例說明本發明及其技術特徵，該實施例之技術仍可適當進行各種實質等效修飾及/或替換方式予以實施；因此，本發明之權利範圍須視後附申請專利範圍所界定之範圍為準。本案著作權限制使用於中華民國專利申請用途。 The foregoing preferred embodiments are merely illustrative of the invention and the technical features thereof, and the techniques of the embodiments can be carried out with various substantial equivalent modifications and/or alternatives; therefore, the scope of the invention is subject to the appended claims. The scope defined by the scope shall prevail. The copyright limitation of this case is used for the purpose of patent application in the Republic of China.
1‧‧‧可重複利用黏膠片 1‧‧‧Reusable adhesive film
2‧‧‧加工載具 2‧‧‧Processing Vehicles
400‧‧‧待加工元件 400‧‧‧Processing components
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| TW104138289A TWI571388B (en) | 2015-11-19 | 2015-11-19 | Component assembling method and device thereof using reusable adhesive films |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI255290B (en) * | 1999-06-14 | 2006-05-21 | Nitto Denko Corp | Re-release type adhesive and re-release type adhesive sheet |
| TW200932503A (en) * | 2008-01-30 | 2009-08-01 | Kai Nan High School Of Commerce And Industry | Plastic body with adhesive surface and manufacturing method thereof |
| TWM511498U (en) * | 2015-05-29 | 2015-11-01 | Sen-Hao Wu | Reusable adhesive patch |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI255290B (en) * | 1999-06-14 | 2006-05-21 | Nitto Denko Corp | Re-release type adhesive and re-release type adhesive sheet |
| TW200932503A (en) * | 2008-01-30 | 2009-08-01 | Kai Nan High School Of Commerce And Industry | Plastic body with adhesive surface and manufacturing method thereof |
| TWM511498U (en) * | 2015-05-29 | 2015-11-01 | Sen-Hao Wu | Reusable adhesive patch |
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