TWI539089B - Nano-sucker device and operation method thereof - Google Patents

Nano-sucker device and operation method thereof Download PDF

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TWI539089B
TWI539089B TW103112563A TW103112563A TWI539089B TW I539089 B TWI539089 B TW I539089B TW 103112563 A TW103112563 A TW 103112563A TW 103112563 A TW103112563 A TW 103112563A TW I539089 B TWI539089 B TW I539089B
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adsorption layer
nano
adsorbed
chuck
adsorption
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TW201538863A (en
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鍾宜璋
張琬宜
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國立高雄大學
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奈米吸盤裝置及其操作方法 Nano suction cup device and operation method thereof

本發明係關於一種奈米吸盤〔nano-sucker〕裝置及其操作方法;特別是關於一種無膠〔adhesive-free〕式奈米吸盤裝置及其操作方法。 The present invention relates to a nano-sucker device and a method of operating the same; and more particularly to an adhesive-free nano-sucker device and method of operation thereof.

舉例而言,習用奈米吸盤裝置及其製造方法,如中華民國專利公告第I263513號之〝具有吸盤式奈米孔洞的生醫植入物及製造方法〞發明專利,其揭示一種生醫植入物。該生醫植入物包含數個吸盤式奈米孔洞,而該生醫植入物之一部份或全部表面設置一吸盤式奈米孔洞結構。該吸盤式奈米孔洞結構為具有複數個具奈米尺寸之管狀物。 For example, a conventional nano-sucking device and a method of manufacturing the same, such as the Chinese medical patent publication No. I263513, having a suction-type nanohole, a biomedical implant and a manufacturing method, an invention patent, which discloses a biomedical implant Things. The biomedical implant comprises a plurality of suction cup type nanoholes, and a part of or all of the surface of the biomedical implant is provided with a suction cup type nanohole structure. The suction cup type nanohole structure has a plurality of tubes having a nanometer size.

承上,前述第I263513號之該管狀物的全部或部份呈現為採用以矩陣排列,且將各個該管狀物設置為一可供填入生物可吸收材料〔或藥物〕之孔洞。各個該孔洞之大小在實質上為介於10nm至100nm之間。另外,該生醫植入物可選自一純鈦片。 In the above, all or a part of the tubular material of the above-mentioned No. I263513 is presented in a matrix arrangement, and each of the tubular members is provided as a hole into which a bioabsorbable material (or drug) can be filled. Each of the holes has a size substantially between 10 nm and 100 nm. Additionally, the biomedical implant can be selected from a pure titanium sheet.

前述第I263513號之該生醫植入物之製造方法主要包含步驟:〔A〕、先將該生醫植入物施以陽極處理,使該生醫植入物之表面形成一氧化膜,且以一溶劑添加於陽極處理時之溶液內;〔B〕、再加以一外加電壓,使該生醫植入物之表面形成數個該管狀物,且該管狀物為具有該孔洞。 The method for manufacturing the biomedical implant of the above-mentioned No. I263513 mainly comprises the steps of: [A], first applying the biomedical implant to an anodizing treatment to form an oxide film on the surface of the biomedical implant, and A solvent is added to the solution during the anodic treatment; [B], and an applied voltage is applied to form a plurality of the tubes on the surface of the biomedical implant, and the tube has the pores.

承上,前述第I263513號於將該生醫植入物進 行陽極處理時,該溶劑可選擇為氫氟酸或硫酸。另外,於該生醫植入物加以該外加電壓時,該外加電壓可選擇為於50伏特以內。 According to the above, the aforementioned No. I263513 is for the biomedical implant In the case of anodizing, the solvent may be selected to be hydrofluoric acid or sulfuric acid. In addition, when the biomedical implant is subjected to the applied voltage, the applied voltage may be selected to be within 50 volts.

然而,第I263513號之該吸盤式奈米孔洞僅適 用於生醫植入用途,其並不適用於一般吸附重物,且該吸盤式奈米孔洞結構易遭受破壞。因此,習用奈米吸盤裝置及其製造方法必然存在進一步改良其結構及製造方法之需求。前述專利僅為本發明技術背景之參考及說明目前技術發展狀態而已,其並非用以限制本發明之範圍。 However, the suction cup type nano hole of No. I263513 is only suitable For biomedical implant applications, it is not suitable for general adsorption of heavy objects, and the suction cup type nanopore structure is susceptible to damage. Therefore, the conventional nano chuck device and its manufacturing method necessarily have a need to further improve the structure and manufacturing method. The foregoing patents are only for the purpose of reference to the present invention, and are not intended to limit the scope of the present invention.

有鑑於此,本發明為了滿足上述技術問題及需 求,其提供一種奈米吸盤裝置及其操作方法適用於操作吸附各種重物,其利用數個奈米空穴形成一吸附層,且該吸附面對應一按壓操作面,因此相對於習用奈米吸盤裝置及其製造方法可大幅提升其適用範圍。 In view of this, the present invention satisfies the above technical problems and needs The invention provides a nano suction cup device and an operation method thereof, which are suitable for operating and adsorbing various weights, which use a plurality of nanoholes to form an adsorption layer, and the adsorption surface corresponds to a pressing operation surface, and thus is relatively opposed to the conventional nanometer. The suction cup device and its manufacturing method can greatly enhance its application range.

本發明之主要目的係提供一種奈米吸盤裝置,其利用數個奈米空穴形成一吸附層,且該吸附層對應一按壓操作面,經由利用該按壓操作面進行按壓操作該吸附層,以達成吸附各種重物之目的。 The main object of the present invention is to provide a nano chuck device that uses a plurality of nanoholes to form an adsorption layer, and the adsorption layer corresponds to a pressing operation surface, and the adsorption layer is pressed by using the pressing operation surface to Achieve the purpose of adsorbing various heavy objects.

為了達成上述目的,本發明較佳實施例之奈米吸盤裝置包含:一吸盤基板,其包含一第一表面及一第二表面;數個奈米空穴,其排列設置於該吸盤基板之第一表面,以形成一吸附層;及一按壓操作面,其設置於該吸盤基板之第二表面,且該吸附層對應該按壓操作面,或該按壓操作面選擇預留設置於該吸附層;其中將該吸附層對應貼附於一待吸附表面,經 由利用該按壓操作面進行按壓操作該吸附層,以擠壓排出該奈米空穴內之氣體,以便該吸附層可吸附該待吸附表面。 In order to achieve the above object, a nano chuck device according to a preferred embodiment of the present invention comprises: a chuck substrate comprising a first surface and a second surface; and a plurality of nanoholes arranged in the chuck substrate a surface to form an adsorption layer; and a pressing operation surface disposed on the second surface of the chuck substrate, and the adsorption layer corresponds to pressing the operation surface, or the pressing operation surface is selected to be disposed on the adsorption layer; Wherein the adsorption layer is correspondingly attached to a surface to be adsorbed, The adsorption layer is pressed by the pressing operation surface to press and discharge the gas in the nanohole, so that the adsorption layer can adsorb the surface to be adsorbed.

本發明較佳實施例之該奈米空穴具有一吸附開口及一開口環緣。 In the preferred embodiment of the invention, the nanohole has an adsorption opening and a split rim.

本發明較佳實施例之該奈米空穴之間具有一隔牆。 In the preferred embodiment of the invention, the nanoholes have a partition wall therebetween.

本發明較佳實施例之該奈米空穴具有一半開放氣室。 The nanohole of the preferred embodiment of the invention has a half open cell.

本發明較佳實施例之該吸盤基板之第二表面利用一強力接著劑或一雙面泡棉膠層黏貼一掛勾、一掛環、一拉環、一支撐臂或一支撐架。 In a preferred embodiment of the present invention, the second surface of the chuck substrate is adhered to a hook, a loop, a tab, a support arm or a support frame by using a strong adhesive or a double-sided foam layer.

為了達成上述目的,本發明另一較佳實施例之奈米吸盤裝置包含:一吸盤基板,其包含一第一表面及一第二表面;數個奈米空穴,其排列設置於該吸盤基板之第一表面,以形成一吸附層;及一按壓操作墊片,其設置於該吸盤基板之第二表面,且該按壓操作墊片對應於該數個奈米空穴;其中將該吸附層對應貼附於一待吸附表面,經由利用該按壓操作墊片進行按壓操作該吸附層,以擠壓排出該奈米空穴內之氣體,以便該吸附層可吸附該待吸附表面。 In order to achieve the above object, a nano chuck device according to another preferred embodiment of the present invention comprises: a chuck substrate comprising a first surface and a second surface; and a plurality of nanoholes arranged on the chuck substrate a first surface to form an adsorption layer; and a pressing operation pad disposed on the second surface of the chuck substrate, wherein the pressing operation pad corresponds to the plurality of nanoholes; wherein the adsorption layer Correspondingly attached to a surface to be adsorbed, the adsorption layer is pressed by using the pressing operation gasket to squeeze out the gas in the nanohole, so that the adsorption layer can adsorb the surface to be adsorbed.

本發明較佳實施例之該按壓操作墊片選自一橡膠墊片或一彈性墊片。 In the preferred embodiment of the invention, the pressing operation gasket is selected from a rubber gasket or an elastic gasket.

本發明較佳實施例之該按壓操作墊片利用一強力接著劑或一雙面泡棉膠層黏貼於該吸盤基板之第二表面。 In the preferred embodiment of the present invention, the pressing operation pad is adhered to the second surface of the chuck substrate by a strong adhesive or a double-sided foam layer.

本發明較佳實施例之該按壓操作墊片具有一 邊緣,且該邊緣垂直對應於該數個奈米空穴之邊緣。 The pressing operation pad of the preferred embodiment of the present invention has a An edge, and the edge vertically corresponds to an edge of the plurality of nanoholes.

本發明之另一目的係提供一種奈米吸盤裝置 操作方法,其利用數個奈米空穴形成一吸附層,且該吸附層對應貼附於一待吸附表面,經由利用按壓操作該吸附層,以擠壓排出該奈米空穴內之氣體,以便該吸附層可吸附該待吸附表面,以達成吸附各種重物之目的。 Another object of the present invention is to provide a nano suction cup device An operation method, which uses a plurality of nanoholes to form an adsorption layer, and the adsorption layer is attached to a surface to be adsorbed, and the adsorption layer is pressed by pressing to squeeze out the gas in the nanopore. Therefore, the adsorption layer can adsorb the surface to be adsorbed to achieve the purpose of adsorbing various weights.

為了達成上述目的,本發明較佳實施例之奈米吸盤裝置操作方法包含:在進行吸附操作時,利用數個奈米空穴形成一吸附層,且該吸附層對應於一待吸附表面;將該吸附層之至少一部分對應貼附於該待吸附表面;及利用按壓操作該吸附層之至少一部分,以擠壓排出該奈米空穴內之至少一部分之氣體,以便該吸附層之至少一部分可吸附該待吸附表面。 In order to achieve the above object, a method for operating a nano chuck device according to a preferred embodiment of the present invention comprises: forming an adsorption layer by using a plurality of nanoholes during an adsorption operation, and the adsorption layer corresponds to a surface to be adsorbed; At least a portion of the adsorption layer is attached to the surface to be adsorbed; and at least a portion of the adsorption layer is operated by pressing to squeeze out at least a portion of the gas within the nanohole, so that at least a portion of the adsorption layer can be Adsorb the surface to be adsorbed.

本發明較佳實施例在進行脫離操作時,將該吸附層之至少一邊緣進行撥開,以便該吸附層之至少一部分可剝離該待吸附表面。 In a preferred embodiment of the present invention, at least one edge of the adsorption layer is removed during the detachment operation so that at least a portion of the adsorption layer can peel off the surface to be adsorbed.

1‧‧‧奈米吸盤裝置 1‧‧‧Nylon suction cup device

10‧‧‧吸盤基板 10‧‧‧Sucker substrate

11‧‧‧第一表面 11‧‧‧ first surface

12‧‧‧第二表面 12‧‧‧ second surface

100‧‧‧待吸附物件 100‧‧‧objects to be adsorbed

20‧‧‧吸附層 20‧‧‧Adsorption layer

21‧‧‧奈米空穴 21‧‧‧Nami Hole

30‧‧‧按壓操作墊片 30‧‧‧Press the operating gasket

A‧‧‧按壓操作面 A‧‧‧ Pressing the operating surface

B‧‧‧待吸附表面 B‧‧‧ surface to be adsorbed

第1圖:本發明第一較佳實施例之奈米吸盤裝置之側視示意圖。 Figure 1 is a side elevational view of a nano suction cup device in accordance with a first preferred embodiment of the present invention.

第2圖:本發明第二較佳實施例之奈米吸盤裝置之側視示意圖。 Figure 2 is a side elevational view of a nano suction cup device in accordance with a second preferred embodiment of the present invention.

第3圖:本發明第一較佳實施例之奈米吸盤裝置在進行操作吸附時對應待吸附物件之側視示意圖。 Figure 3 is a side elevational view of the nano suction cup device of the first preferred embodiment of the present invention corresponding to the object to be adsorbed during operation of the adsorption.

第4圖:本發明第一較佳實施例之奈米吸盤裝置對應貼附於待吸附物件之側視示意圖。 Fig. 4 is a side elevational view showing the nano suction cup device of the first preferred embodiment of the present invention attached to the object to be adsorbed.

第5圖:本發明第一較佳實施例之奈米吸盤裝置完成貼 附於待吸附物件之側視示意圖。 Figure 5: The nano suction cup device of the first preferred embodiment of the present invention is completed A side view attached to the object to be adsorbed.

第6圖:本發明第一較佳實施例之奈米吸盤裝置另一使用其操作方法之側視示意圖。 Fig. 6 is a side elevational view showing another operation of the nano chucking device of the first preferred embodiment of the present invention.

為了充分瞭解本發明,於下文將舉例較佳實施例並配合所附圖式作詳細說明,且其並非用以限定本發明。 In order to fully understand the present invention, the preferred embodiments of the present invention are described in detail below, and are not intended to limit the invention.

本發明較佳實施例之奈米吸盤裝置及其操作方法適合吸附於各種物件,例如:各種光學玻璃、各種半導體晶圓或其它需吸附作業的物件,但其並非用以限制本發明之應用範圍。另外,本發明較佳實施例之奈米吸盤裝置及其操作方法適合組裝應用於各種自動化或非自動化生產作業裝置,例如:各種機械手臂裝置、各種自動或非自動運輸裝置或各種夾持作業裝置,但其並非用以限制本發明之應用範圍。 The nano suction cup device and the operation method thereof according to the preferred embodiment of the present invention are suitable for being adsorbed to various objects, such as various optical glass, various semiconductor wafers or other objects to be adsorbed, but it is not intended to limit the application range of the present invention. . In addition, the nano suction cup device and the operation method thereof according to the preferred embodiment of the present invention are suitable for assembly and application to various automatic or non-automatic production operation devices, such as various mechanical arm devices, various automatic or non-automatic transportation devices or various clamping operation devices. However, it is not intended to limit the scope of application of the present invention.

第1圖揭示本發明第一較佳實施例之奈米吸盤裝置之側視示意圖,其僅以適當縮小比例尺寸及形狀表示奈米吸盤裝置之技術特徵。請參照第1圖所示,本發明第一較佳實施例之奈米吸盤裝置1包含一吸盤基板10、一吸附層20、數個奈米空穴21及一按壓操作面A。該奈米吸盤裝置1形成一片狀體、一塊狀體、一圓盤狀體或其它各種形狀體,或可選擇省略設置該吸盤基板10,且該吸附層20、奈米空穴21及按壓操作面A適當配置於該吸盤基板10上,以形成該奈米吸盤裝置1。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side elevational view showing a nano chuck device according to a first preferred embodiment of the present invention, which shows the technical features of the nano chuck device only in an appropriately reduced scale and shape. Referring to FIG. 1, a nano chuck device 1 according to a first preferred embodiment of the present invention comprises a chuck substrate 10, an adsorption layer 20, a plurality of nanoholes 21, and a pressing operation surface A. The nano chuck device 1 is formed into a sheet body, a block body, a disc body or other various shapes, or alternatively, the chuck substrate 10 may be omitted, and the adsorption layer 20, the nanohole 21 and The pressing operation surface A is appropriately disposed on the chuck substrate 10 to form the nano chuck device 1.

請再參照第1圖所示,舉例而言,該吸盤基板10選自一片狀體或具類似形狀之片體,且該片狀體具有一預定厚度及一預定體積。該吸盤基板10包含一第一表面11及一第二表面12,且該第一表面11及第二表面12分別位於該吸盤基板10之兩側。 Referring again to FIG. 1, for example, the chuck substrate 10 is selected from a sheet-like body or a sheet having a similar shape, and the sheet-like body has a predetermined thickness and a predetermined volume. The chuck substrate 10 includes a first surface 11 and a second surface 12, and the first surface 11 and the second surface 12 are respectively located on opposite sides of the chuck substrate 10.

請再參照第1圖所示,舉例而言,該數個奈米 空穴21排列設置於該吸盤基板10之第一表面11,以形成該吸附層20。如此,該吸附層20具有一吸附表面〔未標示,即該吸附層20之正面〕及一結合表面〔未標示,即該吸附層20之背面〕。若未省略設置該吸盤基板10時,將該吸附層20之結合表面固定設置於該吸盤基板10之第一表面11上,而將該吸附層20之吸附表面朝向該吸盤基板10之第一表面11之另一方向設置。 Please refer to Figure 1, for example, the number of nanometers. The holes 21 are arranged on the first surface 11 of the chuck substrate 10 to form the adsorption layer 20. Thus, the adsorption layer 20 has an adsorption surface (not shown, that is, the front surface of the adsorption layer 20) and a bonding surface (not shown, that is, the back surface of the adsorption layer 20). If the chuck substrate 10 is not omitted, the bonding surface of the adsorption layer 20 is fixedly disposed on the first surface 11 of the chuck substrate 10, and the adsorption surface of the adsorption layer 20 faces the first surface of the chuck substrate 10. 11 is set in the other direction.

請再參照第1圖之斷面所示,舉例而言,每個 該奈米空穴21具有一吸附開口及一開口環緣,以便經由該吸附開口及開口環緣連通至該奈米空穴21之內部,如此該奈米空穴21可提供通入或排放適量氣體。另外,該吸附開口之直徑較佳大於該開口環緣之直徑,但其並非用以限制本發明之範圍。 Please refer to the section of Figure 1 again, for example, each The nanohole 21 has an adsorption opening and a opening rim to communicate with the inside of the nanohole 21 via the adsorption opening and the opening rim, so that the nanohole 21 can provide an appropriate amount of opening or discharging gas. In addition, the diameter of the adsorption opening is preferably larger than the diameter of the opening ring, but it is not intended to limit the scope of the invention.

請再參照第1圖之斷面所示,舉例而言,每個 該奈米空穴21之間具有一隔牆〔例如:環牆〕,且該隔牆以適當間距〔隔牆厚度〕分隔每個該奈米空穴21之間,以提升該奈米空穴21之結構強度,如此該奈米空穴21可承受適當的機械性及彈性變形而不產生破壞其結構,但其並非用以限制本發明之範圍。 Please refer to the section of Figure 1 again, for example, each The nanoholes 21 have a partition wall (for example, a ring wall), and the partition wall separates each of the nanoholes 21 at an appropriate spacing [wall thickness] to lift the nanoholes. The structural strength of 21 is such that the nanohole 21 can withstand appropriate mechanical and elastic deformation without damaging its structure, but it is not intended to limit the scope of the invention.

請再參照第1圖之斷面所示,舉例而言,每個 該奈米空穴21具有一半開放氣室,而該半開放氣室可產生適當彈性變形,且該半開放氣室可容置適量氣體及適當種類氣體〔例如:空氣、氮氣或其它惰性氣體〕。如此,該奈米空穴21之內部體積可藉由其適當機械性及彈性變形之壓縮方式〔或恢復原形方式〕提供操作低壓吸附物體〔或釋放物體〕之功能。 Please refer to the section of Figure 1 again, for example, each The nanohole 21 has a half open air chamber, and the semi-open air chamber can generate appropriate elastic deformation, and the semi-open air chamber can accommodate an appropriate amount of gas and a suitable kind of gas (for example, air, nitrogen or other inert gas). . Thus, the inner volume of the nanohole 21 can be provided by operating a low pressure adsorption object (or releasing an object) by its appropriate mechanical and elastic deformation compression mode (or restoration of the original shape).

請再參照第1圖之所示,舉例而言,該按壓操 作面A設置於該吸盤基板10之第二表面12,且該吸附層對應該按壓操作面A,但其並非用以限制本發明之範圍。 或,本發明另一較佳實施例之該按壓操作面A選擇預留設置於該吸附層20之適當位置〔例如:該吸附層20之背面〔即該吸附層20之結合表面〕或其它適當位置〕。 Please refer to the figure shown in Figure 1, for example, the pressing operation The face A is disposed on the second surface 12 of the chuck substrate 10, and the adsorbing layer corresponds to the pressing of the operating surface A, but it is not intended to limit the scope of the present invention. Or, according to another preferred embodiment of the present invention, the pressing operation surface A is selected to be disposed at an appropriate position of the adsorption layer 20 (for example, the back surface of the adsorption layer 20 (ie, the bonding surface of the adsorption layer 20) or other suitable position〕.

請再參照第1圖之所示,舉例而言,將該吸附 層20對應貼附於任何待吸附表面〔未繪示於第1圖〕上,經由利用該按壓操作面A進行按壓操作該吸附層20,以擠壓排出該奈米空穴21內之適量氣體,以便該吸附層20可吸附在該待吸附表面上。反之,若將適量氣體適當送入至該奈米空穴21之內部時,可將該吸附層20脫離於該待吸附表面。 Please refer to the figure shown in Figure 1, for example, the adsorption The layer 20 is attached to any surface to be adsorbed (not shown in FIG. 1 ), and the adsorption layer 20 is pressed by the pressing operation surface A to squeeze out an appropriate amount of gas in the nanopore 21 . So that the adsorption layer 20 can be adsorbed on the surface to be adsorbed. On the other hand, when an appropriate amount of gas is appropriately fed into the inside of the nanohole 21, the adsorption layer 20 can be detached from the surface to be adsorbed.

請再參照第1圖之所示,舉例而言,依各種不 同使用需求,將該吸盤基板10之第二表面12利用一強力接著劑或一雙面泡棉膠層〔未繪示〕黏貼一掛勾、一掛環、一拉環、一支撐臂或一支撐架〔未繪示〕,但其並非用以限制本發明之範圍。 Please refer to the figure shown in Figure 1, for example, according to various The second surface 12 of the chuck substrate 10 is adhered to a hook, a loop, a tab, a support arm or a second surface by using a strong adhesive or a double-sided foam layer (not shown). The support frame (not shown) is not intended to limit the scope of the invention.

第2圖揭示本發明第二較佳實施例之奈米吸盤 裝置之側視示意圖,其對應於第1圖之奈米吸盤裝置。請參照第2圖所示,相對於第一實施例,本發明第二較佳實施例之奈米吸盤裝置1包含一吸盤基板10、一吸附層20、數個奈米空穴21及一按壓操作墊片30,其結構及形狀可對應參考於第一較佳實施例,於此不予贅述。 Figure 2 is a view showing a nano suction cup according to a second preferred embodiment of the present invention. A side view of the device corresponding to the nanosucking device of Figure 1. Referring to FIG. 2, a nano chuck device 1 according to a second preferred embodiment of the present invention includes a chuck substrate 10, an adsorption layer 20, a plurality of nanoholes 21, and a press. The structure and shape of the operation pad 30 can be correspondingly referred to in the first preferred embodiment, and details are not described herein.

請再參照第2圖所示,舉例而言,該按壓操作墊片30選自一片狀體或具類似形狀之片體,且該片狀體具有一預定厚度及一預定體積。該按壓操作墊片30包含一第一墊片表面及一第二墊片表面,且該第一墊片表面及第二墊片表面分別位於該按壓操作墊片30之兩側。 Referring to FIG. 2 again, for example, the pressing operation pad 30 is selected from a sheet-like body or a sheet having a similar shape, and the sheet-like body has a predetermined thickness and a predetermined volume. The pressing operation pad 30 includes a first gasket surface and a second gasket surface, and the first gasket surface and the second gasket surface are respectively located on opposite sides of the pressing operation gasket 30.

請再參照第2圖所示,舉例而言,該按壓操作墊片30選自選自一橡膠墊片、一彈性墊片或其它類似墊片。另外,該按壓操作墊片30按壓操作墊片具有一邊緣 〔如第2圖之兩條虛線所示〕,且該邊緣垂直對應於該數個奈米空穴21之邊緣。該按壓操作墊片30之第一墊片表面貼接於該吸盤基板10之第二表面12,以便該按壓操作墊片30對該數個奈米空穴21提供一預負載〔preload〕。 Referring again to FIG. 2, for example, the pressing operation pad 30 is selected from the group consisting of a rubber gasket, an elastic gasket or the like. In addition, the pressing operation pad 30 presses the operation pad to have an edge [As indicated by the two broken lines in Fig. 2], the edge corresponds vertically to the edges of the plurality of nanoholes 21. The first gasket surface of the pressing operation pad 30 is attached to the second surface 12 of the chuck substrate 10, so that the pressing operation gasket 30 provides a preload to the plurality of nanoholes 21.

請再參照第2圖所示,舉例而言,該按壓操作墊片30利用一強力接著劑或一雙面泡棉膠層〔未繪示〕黏貼於該吸盤基板10之第二表面12。另外,依各種不同使用需求,將該按壓操作墊片30之第二墊片表面利用一強力接著劑或一雙面泡棉膠層〔未繪示〕黏貼一掛勾、一掛環、一拉環、一支撐臂或一支撐架〔未繪示〕。 Referring to FIG. 2 again, for example, the pressing operation pad 30 is adhered to the second surface 12 of the chuck substrate 10 by a strong adhesive or a double-sided foam layer (not shown). In addition, according to various different use requirements, the second gasket surface of the pressing operation gasket 30 is adhered by a strong adhesive or a double-sided foam rubber layer (not shown), a hook, a loop, and a pull. a ring, a support arm or a support frame (not shown).

第3圖揭示本發明第一較佳實施例之奈米吸盤裝置在進行操作吸附時對應待吸附物件之側視示意圖,其對應於第1圖之奈米吸盤裝置。請參照第3圖所示,本發明第一較佳實施例之奈米吸盤裝置操作方法包含步驟S1:首先,在進行吸附操作時,利用該數個奈米空穴21所形成該吸附層20之吸附表面對應於一待吸附物件100之一待吸附表面B。 Fig. 3 is a side elevational view showing the nano suction cup device of the first preferred embodiment of the present invention corresponding to the object to be adsorbed when performing the operation adsorption, which corresponds to the nano suction cup device of Fig. 1. Referring to FIG. 3, a method for operating a nano chuck device according to a first preferred embodiment of the present invention includes the step S1: first, when the adsorption operation is performed, the adsorption layer 20 is formed by using the plurality of nanoholes 21. The adsorption surface corresponds to one of the surfaces B to be adsorbed to be adsorbed.

第4圖揭示本發明第一較佳實施例之奈米吸盤裝置對應貼附於待吸附物件之側視示意圖,其對應於第1及3圖之奈米吸盤裝置。請參照第4圖所示,本發明第一較佳實施例之奈米吸盤裝置操作方法包含步驟S2:接著,將該吸附層20之該全部〔或至少一部分〕奈米空穴21對應貼附於該待吸附表面B,並施加適當壓力〔例如:300g重正向力〕於該按壓操作面A,如第4圖之向下大箭頭所示。 Fig. 4 is a side elevational view showing the nano suction cup device of the first preferred embodiment of the present invention corresponding to the object to be adsorbed, which corresponds to the nano suction cup device of Figs. Referring to FIG. 4, a method for operating a nano chuck device according to a first preferred embodiment of the present invention includes the step S2: subsequently, the entire [or at least a portion of] the nanoholes 21 of the adsorption layer 20 are attached. The surface B to be adsorbed is applied with an appropriate pressure (for example, a positive force of 300 g) on the pressing operation surface A as indicated by the downward large arrow in FIG.

第5圖揭示本發明第一較佳實施例之奈米吸盤裝置完成貼附於待吸附物件之側視示意圖,其對應於第1、3及4圖之奈米吸盤裝置。請參照第5圖所示,本發明較佳實施例之奈米吸盤裝置操作方法包含步驟S3:接著,利 用按壓操作該吸附層20之該全部〔或至少一部分〕奈米空穴21,以擠壓排出該全部〔或至少一部分〕奈米空穴內21之至少一部分之氣體,以便該吸附層20之該全部〔或至少一部分〕奈米空穴21可吸附該待吸附表面B。此時,舉例而言,本發明第一較佳實施例之該奈米吸盤裝置1在垂直吊起該待吸附物件100時,該奈米吸盤裝置1可提供75.2牛頓吸力於每平方公分之該待吸附表面B上,如第5圖之向上大箭頭所示。 Fig. 5 is a side elevational view showing the nano chucking device of the first preferred embodiment of the present invention attached to the object to be adsorbed, corresponding to the nano chucking device of Figs. 1, 3 and 4. Referring to FIG. 5, a method for operating a nano chuck device according to a preferred embodiment of the present invention includes the step S3: The entire [or at least a portion of] of the nanoholes 21 of the adsorption layer 20 are pressed to press out a gas that discharges at least a portion of the entire [or at least a portion of the nanoholes 21 so that the adsorption layer 20 The entire [or at least a portion of] of the nanoholes 21 can adsorb the surface B to be adsorbed. At this time, for example, when the nano chuck device 1 of the first preferred embodiment of the present invention vertically lifts the object to be adsorbed 100, the nano chuck device 1 can provide 75.2 Newtons of suction per square centimeter. On the surface B to be adsorbed, as indicated by the upward arrow in Fig. 5.

請再參照第5圖所示,本發明較佳實施例之奈 米吸盤裝置操作方法包含步驟:最後,在進行脫離操作時,將該吸附層20之至少一邊緣〔左側緣〕進行撥開,以便該吸附層20之該至少一部分奈米空穴21可開始剝離該待吸附表面B,且接著該吸附層20之其它該奈米空穴21逐漸向右方向剝離於該待吸附表面B,直至該吸附層20完全剝離於該待吸附表面B,如第5圖之向上小斜箭頭所示。 Referring again to FIG. 5, the preferred embodiment of the present invention The operation method of the rice sucker device comprises the steps of: finally, at least one edge [left edge] of the adsorption layer 20 is removed during the detachment operation, so that at least a portion of the nanoholes 21 of the adsorption layer 20 can be peeled off. The surface B to be adsorbed, and then the other nanoholes 21 of the adsorption layer 20 are gradually peeled off to the surface B to be adsorbed until the adsorption layer 20 is completely peeled off from the surface B to be adsorbed, as shown in FIG. The upward slanted arrow is shown.

如第3至5圖所示,本發明第一較佳實施例之 奈米吸盤裝置操作方法包含三個主要步驟S1至S3,但其並非用以限定本發明之步驟順序,在不脫離本發明範圍之下,可適當變更〔或省略〕本發明較佳實施例之步驟順序。另外,本發明第一較佳實施例之奈米吸盤裝置操作方法適用於第二較佳實施例。 As shown in Figures 3 to 5, the first preferred embodiment of the present invention The method of operating the nano-sucking device comprises three main steps S1 to S3, but it is not intended to limit the order of the steps of the present invention, and the preferred embodiment of the present invention may be appropriately changed (or omitted) without departing from the scope of the present invention. Step sequence. Further, the method of operating the nano chuck device of the first preferred embodiment of the present invention is applicable to the second preferred embodiment.

第6圖揭示本發明第一較佳實施例之奈米吸盤 裝置另一使用其操作方法之側視示意圖,其對應於第5圖。請參照第6圖所示,本發明第一較佳實施例之該奈米吸盤裝置1在側向吊起該待吸附物件100時,該奈米吸盤裝置1可提供側向負重〔shear force〕7.52公斤/每平方公分於該待吸附表面B上。 Figure 6 is a view showing a nano suction cup according to a first preferred embodiment of the present invention. Another schematic view of the device using its method of operation, which corresponds to Figure 5. Referring to FIG. 6, when the nano chuck device 1 of the first preferred embodiment of the present invention lifts the object to be adsorbed 100 laterally, the nano chuck device 1 can provide a lateral load. 7.52 kg / cm 2 is on the surface B to be adsorbed.

請參照第6圖所示,本發明較佳實施例之奈米 吸盤裝置操作方法包含步驟:最後,在進行脫離操作時, 將該吸附層20之至少一邊緣〔底側緣〕進行撥開,以便該吸附層20之該至少一部分奈米空穴21可開始剝離該待吸附表面B,且接著該吸附層20之其它該奈米空穴21逐漸向上剝離於該待吸附表面B,直至該吸附層20完全剝離於該待吸附表面B,如第6圖之向左小箭頭所示。 Please refer to FIG. 6 for a preferred embodiment of the nanometer of the present invention. The suction cup device operation method comprises the steps of: finally, when performing the detachment operation, Splitting at least one edge (bottom side edge) of the adsorption layer 20 so that at least a portion of the nanoholes 21 of the adsorption layer 20 can begin to peel off the surface to be adsorbed B, and then the other of the adsorption layer 20 The nanohole 21 is gradually peeled off upward to the surface B to be adsorbed until the adsorption layer 20 is completely peeled off from the surface B to be adsorbed, as indicated by the small left arrow in FIG.

前述較佳實施例僅舉例說明本發明及其技術特徵,該實施例之技術仍可適當進行各種實質等效修飾及/或替換方式予以實施;因此,本發明之權利範圍須視後附申請專利範圍所界定之範圍為準。本案著作權限制使用於中華民國專利申請用途。 The foregoing preferred embodiments are merely illustrative of the invention and the technical features thereof, and the techniques of the embodiments can be carried out with various substantial equivalent modifications and/or alternatives; therefore, the scope of the invention is subject to the appended claims. The scope defined by the scope shall prevail. The copyright limitation of this case is used for the purpose of patent application in the Republic of China.

1‧‧‧奈米吸盤裝置 1‧‧‧Nylon suction cup device

10‧‧‧吸盤基板 10‧‧‧Sucker substrate

11‧‧‧第一表面 11‧‧‧ first surface

12‧‧‧第二表面 12‧‧‧ second surface

20‧‧‧吸附層 20‧‧‧Adsorption layer

21‧‧‧奈米空穴 21‧‧‧Nami Hole

A‧‧‧按壓操作面 A‧‧‧ Pressing the operating surface

Claims (10)

一種奈米吸盤裝置,其包含:數個空穴,其排列設置形成一吸附層;及一按壓操作面,其預留設置於該吸附層,且該吸附層對應該按壓操作面;其中將該吸附層對應貼附於一待吸附表面,經由利用該按壓操作面進行按壓操作該吸附層,以擠壓排出該空穴內之氣體,以便該吸附層可吸附該待吸附表面。 A nano chuck device comprising: a plurality of holes arranged to form an adsorption layer; and a pressing operation surface disposed in the adsorption layer, wherein the adsorption layer corresponds to pressing the operation surface; The adsorption layer is attached to a surface to be adsorbed, and the adsorption layer is pressed by using the pressing operation surface to squeeze out the gas in the cavity, so that the adsorption layer can adsorb the surface to be adsorbed. 依申請專利範圍第1項所述之奈米吸盤裝置,另包含一吸盤基板,該吸盤基板包含一第一表面及一第二表面,而該數個空穴排列設置於該吸盤基板之第一表面,且該吸盤基板之第二表面利用一強力接著劑或一雙面泡棉膠層黏貼一掛勾、一掛環、一拉環、一支撐臂或一支撐架。 The nano chuck device according to claim 1, further comprising a chuck substrate, the chuck substrate comprising a first surface and a second surface, wherein the plurality of holes are arranged in the first of the chuck substrate a surface, and the second surface of the chuck substrate is adhered by a strong adhesive or a double-sided foam layer to a hook, a loop, a tab, a support arm or a support frame. 一種奈米吸盤裝置,其包含:一吸盤基板,其包含一第一表面及一第二表面;數個空穴,其排列設置於該吸盤基板之第一表面,以形成一吸附層;及一按壓操作墊片,其設置於該吸盤基板之第二表面,且該按壓操作墊片對應於該數個空穴;其中將該吸附層對應貼附於一待吸附表面,經由利用該按壓操作墊片進行按壓操作該吸附層,以擠壓排出該空穴內之氣體,以便該吸附層可吸附該待吸附表面。 A nano chuck device comprising: a chuck substrate comprising a first surface and a second surface; a plurality of holes arranged on the first surface of the chuck substrate to form an adsorption layer; Pressing the operation pad, which is disposed on the second surface of the chuck substrate, and the pressing operation pad corresponds to the plurality of holes; wherein the adsorption layer is correspondingly attached to a surface to be adsorbed, by using the pressing operation pad The sheet is pressed to operate the adsorption layer to squeeze out the gas in the cavity so that the adsorption layer can adsorb the surface to be adsorbed. 依申請專利範圍第1或3項所述之奈米吸盤裝置,其中該空穴具有一吸附開口及一開口環緣。 The nano chuck device of claim 1 or 3, wherein the cavity has an adsorption opening and a split rim. 依申請專利範圍第1或3項所述之奈米吸盤裝置,其中該空穴之間具有一隔牆。 The nano chuck device of claim 1 or 3, wherein the cavity has a partition wall therebetween. 依申請專利範圍第1或3項所述之奈米吸盤裝置,其中該空穴具有一半開放氣室。 The nanosucking device of claim 1 or 3, wherein the cavity has a half open air chamber. 依申請專利範圍第3項所述之奈米吸盤裝置,其中該按壓操作墊片選自一橡膠墊片或一彈性墊片。 The nano-sucking device of claim 3, wherein the pressing operation gasket is selected from a rubber gasket or an elastic gasket. 依申請專利範圍第3項所述之奈米吸盤裝置,其中該按壓操作墊片具有一邊緣,且該邊緣垂直對應於該數個空穴之邊緣。 The nano-sucking device of claim 3, wherein the pressing operation pad has an edge, and the edge vertically corresponds to an edge of the plurality of holes. 一種奈米吸盤裝置操作方法,其包含:在進行吸附操作時,利用數個空穴形成一吸附層,且該吸附層對應於一待吸附表面;將該吸附層之至少一部分對應貼附於該待吸附表面;及利用按壓操作該吸附層之至少一部分,以擠壓排出該空穴內之至少一部分之氣體,以便該吸附層之至少一部分可吸附該待吸附表面。 A method for operating a nano chuck device, comprising: forming an adsorption layer by using a plurality of holes during an adsorption operation, wherein the adsorption layer corresponds to a surface to be adsorbed; at least a portion of the adsorption layer is correspondingly attached to the a surface to be adsorbed; and at least a portion of the adsorption layer is pressed to press to expel at least a portion of the gas within the cavity such that at least a portion of the adsorption layer can adsorb the surface to be adsorbed. 依申請專利範圍第9項所述之奈米吸盤裝置操作方法,其中在進行脫離操作時,將該吸附層之至少一邊緣進行撥開,以便該吸附層之至少一部分可剝離該待吸附表面。 The method of operating a nano-suction device according to claim 9, wherein at least one edge of the adsorption layer is removed when the detaching operation is performed, so that at least a portion of the adsorption layer can peel off the surface to be adsorbed.
TW103112563A 2014-04-03 2014-04-03 Nano-sucker device and operation method thereof TWI539089B (en)

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TWI831036B (en) * 2021-08-05 2024-02-01 國立高雄大學 Reusable adhesion device having a complex structure and method thereof

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TWI678477B (en) * 2018-05-31 2019-12-01 國立臺灣科技大學 Variable surface adsorption force element and manufacturing method thereof

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TWI831036B (en) * 2021-08-05 2024-02-01 國立高雄大學 Reusable adhesion device having a complex structure and method thereof

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