TWI567911B - 具改良佈線結構之球柵陣列封裝結構及其基板 - Google Patents

具改良佈線結構之球柵陣列封裝結構及其基板 Download PDF

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TWI567911B
TWI567911B TW104144779A TW104144779A TWI567911B TW I567911 B TWI567911 B TW I567911B TW 104144779 A TW104144779 A TW 104144779A TW 104144779 A TW104144779 A TW 104144779A TW I567911 B TWI567911 B TW I567911B
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wafer
area
pads
substrate
grid array
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TW104144779A
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TW201724432A (zh
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莊詠程
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力成科技股份有限公司
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Priority to US15/385,320 priority patent/US9859187B2/en
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Description

具改良佈線結構之球柵陣列封裝結構及其基板
本發明係有關於半導體封裝構造，特別係有關於一種具改良佈線結構之球柵陣列(Ball Grid Array,BGA)封裝結構及其基板。
球柵陣列封裝結構為一種積體電路封裝技術，其封裝結構內部設置有晶片，並藉由形成於封裝結構基板底部之複數個錫球電性連接至印刷電路板(Printed circuit board,PCB)，球柵陣列封裝之導接墊形成於基板底部表面，以接合錫球。因此，球柵陣列封裝結構相較於傳統之雙列式封裝結構(Dual Inline package,DIP)能具有更多的外接接腳、較短的導線距離及較快的傳輸速度。
請參閱第1及2圖，習知球柵陣列封裝結構20具有一基板30、一晶片40及一封膠層50，該晶片40設置於該基板30之一上表面31，該封膠層50位於該基板30之該上表面31，用以密封該晶片40，該基板30之一下表面32設置有複數個導接墊33及一線路層34，複數個錫球35連接於該些導接墊33上，該線路層34與該導接墊33為同一層之金屬，用以進行信號的傳遞。
請再參閱第1及2圖，該晶片40之邊緣投影至該基板 30之該下表面32界定有一晶片投影區域32a，位於該晶片投影區域32a中容易受到熱應力的特定區域的最外層該些導接墊33外側的該線路層34於該封裝結構20進行熱負載之可靠度測試時會因熱應力集中的緣故，而產生有線路裂痕(crack)的問題，導致封裝結構的失效。
本發明的主要目的在於提供一種具改良佈線結構之球柵陣列封裝結構，藉由於外導接墊組外側之保護區設置有虛線點狀方式設置的保護墊或對應形狀的緩衝應力緩衝圖案，可避免線路層的剝離及封裝結構的失效。
本發明之一種具改良佈線結構之球柵陣列封裝結構包含一晶片及一基板，該晶片具有複數個邊緣，該基板包含一上表面、一下表面、一第一導接墊組、一線路層及複數個保護墊，該晶片設置於該上表面，該下表面具有一由該晶片的該些邊緣縱向投影至該下表面所界定的晶片投影區域以及一包圍該晶片投影區域之外圍區域，該第一導接墊組位於該下表面之該晶片投影區域內，該第一導接墊組包含至少一鄰近該外圍區域之外導接墊，其中該晶片投影區域在位於該外導接墊兩側分別定義為一保護區及一導線設置區，該保護區位於該導線設置區及該外圍區域之間，該些保護墊如「…」虛線點狀方式設置於鄰近該外導接墊之該保護區，並且該些保護墊未與該線路層連接。
本發明的目的及解決其技術問題還可採用以下技術 措施進一步實現。
在前述之球柵陣列封裝結構中，該些保護墊係以一防銲層完全覆蓋。
在前述之球柵陣列封裝結構中，該些保護墊與該外導接墊之間具有一第一間隙係小於或等於150μm，該些保護墊之間具有一第二間隙，該第二間隙係不大於第一間隙。
在前述之球柵陣列封裝結構中，該線路層距離至該外導接墊的最小間隙係可小於該第一間隙。
在前述之球柵陣列封裝結構中，該基板另包含一第二導接墊組，位於該下表面之該外圍區域。
在前述之球柵陣列封裝結構中，該些保護墊係如衛星形態半弧狀圍繞該外導接墊。
本發明藉由於該保護區設置虛線點狀之該些保護墊平均分散該保護區的熱應力，以避免熱應力集中於該保護區而產生線路裂痕，可有效地提升製程之良率。
10‧‧‧具改良佈線結構之球柵陣列封裝結構
11‧‧‧晶片
12‧‧‧邊緣
13‧‧‧黏晶膠層
20‧‧‧球柵陣列封裝結構
30‧‧‧基板
31‧‧‧上表面
32‧‧‧下表面
32a‧‧‧晶片投影區域
33‧‧‧導接墊
34‧‧‧線路層
35‧‧‧錫球
40‧‧‧晶片
50‧‧‧封膠層
60‧‧‧錫球
70‧‧‧電路板
100‧‧‧基板
110‧‧‧上表面
120‧‧‧下表面
121‧‧‧晶片投影區域
121a‧‧‧保護區
121b‧‧‧導線設置區
122‧‧‧外圍區域
130‧‧‧第一導接墊組
131‧‧‧外導接墊
132‧‧‧內導接墊
140‧‧‧線路層
150‧‧‧保護墊
160‧‧‧第二導接墊組
200‧‧‧封膠層
300‧‧‧防銲層
S1‧‧‧第一間隙
S2‧‧‧第二間隙
D1、D2‧‧‧直徑
第1圖：習知球柵陣列封裝結構結合於電路板上的剖視圖。
第2圖：沿第1圖之A-A剖線之剖視圖。
第3圖：依據本發明之第一實施例，一種具改良佈線結構之球柵陣列封裝結構透過錫球結合於電路板上的剖視圖。
第4圖：沿第3圖之B-B剖線之剖視圖。
第5圖：依據本發明之第二實施例，一種具改良佈線結構之球柵陣列封裝結構之剖視圖。
第6圖：依據本發明之第三實施例，一種具改良佈線結構之球柵陣列封裝結構之剖視圖。
以下將配合所附圖示詳細說明本發明之實施例，然應注意的是，該些圖示均為簡化之示意圖，僅以示意方法來說明本發明之基本架構或實施方法，故僅顯示與本案有關之元件與組合關係，圖中所顯示之元件並非以實際實施之數目、形狀、尺寸做等比例繪製，某些尺寸比例與其他相關尺寸比例或已誇張或是簡化處理，以提供更清楚的描述。實際實施之數目、形狀及尺寸比例為一種選置性之設計，詳細之元件佈局可能更為複雜。
請參閱第3圖，為本發明之第一實施例，一種具改良佈線結構之球柵陣列封裝結構10透過複數個錫球60結合於一電路板70上的剖視圖，該球柵陣列封裝結構10主要包含一晶片11及一基板100，更具體地可包含一封膠層200，該晶片11具有複數個邊緣12，且該晶片11設置於該基板100之一上表面110，該封膠層200覆蓋於該基板100之該上表面110，以密封該晶片11。其中該晶片11可選自於矽、碳化矽、砷化鎵…等合適之半導體材料，其主動面設有積體電路，該基板100係可為一IC載板，該封膠層200可選自於樹脂、合成聚合物…等合適之絕緣材料，如模封環氧化合物(EMC)，且該晶片11係利用覆晶製程(Flip-chip)或打線製程 (Wire-bonding)製程達到與該基板100電性連接，該晶片11與該基板100之間的固定可利用一黏晶膠層13黏接。
請參閱第3及4圖，該晶片11的該些邊緣12縱向投影至該基板100之一下表面120係界定有一晶片投影區域121以及一包圍該晶片投影區域121之外圍區域122。該晶片投影區域121之尺寸係可相當於該晶片11的表面覆蓋區尺寸。請參閱第4圖，在本實施例中，一第一導接墊組130位於該下表面120之該晶片投影區域121內，該第一導接墊組130包含複數個鄰近該外圍區域122之外導接墊131及複數個被該些外導接墊131圍繞的內導接墊132。一第二導接墊組160位於該下表面120之該外圍區域122，該第二導接墊組160可包含複數個鄰近該晶片投影區域121之角隅導接墊，該第一導接墊組130之導接墊及該第二導接墊組160之導接墊顯露於一防銲層300之個別開口，以分別與該些銲球60連接。該防銲層300形成於該基板100之該下表面120。在第4圖中，容易受到熱應力的特定區域的球墊係為最外圍的該些外導接墊131，該些外導接墊131、該些內導接墊132與該第二導接墊組160之導接墊實質上為屬於同一層之金屬墊結構。
請參閱第4圖，該晶片投影區域121在位於該外導接墊131兩側分別定義為一保護區121a及一導線設置區121b，該保護區121a位於該導線設置區121b及該外圍區域122之間，故該導線設置區121b係可相對遠離該晶片投影區域121之邊緣。一線路層140設置於該導線設置區121b，該線路層140用以進行信號的傳遞或功 率的輸送。一應力緩衝圖案設置於鄰近該外導接墊131之該保護區121a，在本實施例中，該應力緩衝圖案係包含複數個保護墊150，並以如「…」虛線點狀方式排列。該些保護墊150可未與該線路層140連接，例如該些保護墊150為非導接用之虛設墊(Dummy pad)，該些保護墊150係可被該防銲層300完全覆蓋。具體地，該第一導接墊組130、該線路層140與該些保護墊150由同一金屬層所形成，藉由該些保護墊150的設置可避免熱應力集中於該保護區121a，而可避免該保護區121a產生線路裂痕，以大幅提升製程良率。較佳的，該些保護墊150係如衛星形態半弧狀圍繞該外導接墊131，以均勻地分散該保護區121a的熱應力。
請參閱第4圖，該些保護墊150與該外導接墊131之間具有一第一間隙S1，由該些保護墊150至該外導接墊131之該第一間隙S1係小於或等於150μm。而該些保護墊150之間的一第二間隙S2係不大於該第一間隙S1，以使該些保護墊150發揮最佳的保護效果。在本實施例中，該些保護墊150之該直徑D1係小於各該外導接墊131之一直徑D2。該線路層140距離至該外導接墊131的最小間隙係可以小於該第一間隙S1，也不會有銅走線裂痕的發生問題。故該線路層140之銅走線在不連接該外導接墊131的情況下，盡可能地接近該外導接墊131，以符合線路密集的需求。來自該外導接墊131之熱負載應力可以往該等保護墊150分散，不會有線路裂痕的問題。
因此，本發明提供之一種具改良佈線結構之球柵陣 列封裝結構係藉由於外導接墊組外側之保護區設置有虛線點狀方式設置的保護墊或對應形狀的緩衝應力緩衝圖案，可避免線路層的剝離及封裝結構的失效。
請參閱第5圖，為本發明之第二實施例，其與第一實施例的差異在於該第二導接墊組160並未局限地設置於鄰近該晶片投影區域121之角隅，而是佈滿整個該外圍區域122，相同地，在本實施例中亦藉由於該保護區121a中設置有未與該線路層140連接之複數個保護墊150，可有效避免該保護區121a產生線路裂痕。
請參閱第6圖，其為本發明之第三實施例，其與第一實施例的差異在於不具有該第二導接墊組160，且該第一導接墊組130相較於第一實施例及第二實施例較為內縮，使得該些外導接墊131與該外圍區域122之間的間隙較大，但相同地，在本實施例中亦藉由於該保護區121a中設置有未與該線路層140連接之複數個保護墊150，以避免該保護區121a產生線路裂痕。
本發明藉由於該保護區121a設置虛線點狀排列之該些保護墊150平均分散該保護區121a的熱應力，以避免熱應力集中於該保護區121a而產生線路裂痕，可有效地提升製程之良率。
以上所揭露的僅為本發明較佳實施例而已，當然不能以此來限定本發明之權利範圍，因此依本發明權利要求所作的等同變化，仍屬本發明所涵蓋的範圍。
10‧‧‧具改良佈線結構之球柵陣列封裝結構
121‧‧‧晶片投影區域
121a‧‧‧保護區
121b‧‧‧導線設置區
122‧‧‧外圍區域
130‧‧‧第一導接墊組
131‧‧‧外導接墊
132‧‧‧內導接墊
140‧‧‧線路層
150‧‧‧保護墊
160‧‧‧第二導接墊組
S1‧‧‧第一間隙
S2‧‧‧第二間隙
D1、D2‧‧‧直徑

Claims (10)

  1. 一種具改良佈線結構之球柵陣列封裝結構，包含：一晶片，具有複數個邊緣；以及一基板，包含：一上表面，該晶片設置於該上表面；一下表面，具有一由該晶片的該些邊緣縱向投影至該下表面所界定的晶片投影區域以及一包圍該晶片投影區域之外圍區域；一第一導接墊組，位於該下表面之該晶片投影區域內，該第一導接墊組包含至少一鄰近該外圍區域之外導接墊，其中該晶片投影區域在位於該外導接墊兩側分別定義為一保護區及一導線設置區，該保護區位於該導線設置區及該外圍區域之間；一線路層，設置於該導線設置區；以及複數個保護墊，虛線點狀方式設置於鄰近該外導接墊之該保護區，並且該些保護墊未與該線路層連接。
  2. 如申請專利範圍第1項所述之具改良佈線結構之球柵陣列封裝結構，其中該些保護墊係以一防銲層完全覆蓋。
  3. 如申請專利範圍第1或2項所述之具改良佈線結構之球柵陣列封裝結構，其中該些保護墊與該外導接墊之間具有一第一間隙，係小於或等於150μm，該些保護墊之間具有一第二間隙，該第二間隙係不大於該第一間隙。
  4. 如申請專利範圍第3項所述之具改良佈線結構之球柵陣列封裝結構，其中該線路層距離至該外導接墊的最小間隙係小於 該第一間隙。
  5. 如申請專利範圍第1或2項所述之具改良佈線結構之球柵陣列封裝結構，其中該基板另包含一第二導接墊組，位於該下表面之該外圍區域。
  6. 如申請專利範圍第1或2項所述之具改良佈線結構之球柵陣列封裝結構，其中該些保護墊係如衛星形態半弧狀圍繞該外導接墊。
  7. 一種具改良佈線結構之球柵陣列封裝結構之基板，用以結合一具有複數個邊緣的晶片，該基板包含：一上表面，該晶片設置於該上表面；一下表面，具有一由該晶片的該些邊緣縱向投影至該下表面所界定的晶片投影區域以及一包圍該晶片投影區域之外圍區域；一第一導接墊組，位於該下表面之該晶片投影區域內，該第一導接墊組包含至少一鄰近該外圍區域之外導接墊，其中該晶片投影區域在位於該外導接墊兩側分別定義為一保護區及一導線設置區，該保護區位於該導線設置區及該外圍區域之間；一線路層，設置於該導線設置區；以及複數個保護墊，虛線點狀方式設置於鄰近該外導接墊之該保護區，並且該些保護墊未與該線路層連接。
  8. 如申請專利範圍第7項所述之具改良佈線結構之球柵陣列基板結構之基板，其中該些保護墊係以一防銲層完全覆蓋。
  9. 如申請專利範圍第7或8項所述之具改良佈線結構之球柵陣列 基板結構之基板，其中該些保護墊與該外導接墊之間具有一第一間隙，係小於或等於150μm，該些保護墊之間具有一第二間隙，該第二間隙係不大於第一間隙。
  10. 一種具改良佈線結構之球柵陣列封裝結構，包含：一晶片，具有複數個邊緣；以及一基板，包含：一上表面，該晶片設置於該上表面；一下表面，具有一由該晶片的該些邊緣縱向投影至該下表面所界定的晶片投影區域以及一包圍該晶片投影區域之外圍區域；一第一導接墊組，位於該下表面之該晶片投影區域內，該第一導接墊組包含至少一鄰近該外圍區域之外導接墊，其中該晶片投影區域在位於該外導接墊兩側分別定義為一保護區及一導線設置區，該保護區位於該導線設置區及該外圍區域之間；一線路層，設置於該導線設置區；以及一應力緩衝圖案，其圖案構成選自於複數個保護墊、複數個孔與複數個網孔之其中之一，虛線點狀方式設置於鄰近該外導接墊之該保護區，並且該應力緩衝圖案未與該線路層連接，其中該第一導接墊組、該線路層與該應力緩衝圖案由同一金屬層所形成。
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