TWI566315B - Wafer mounted apparatus with high yield and method thereof - Google Patents
Wafer mounted apparatus with high yield and method thereof Download PDFInfo
- Publication number
- TWI566315B TWI566315B TW103140571A TW103140571A TWI566315B TW I566315 B TWI566315 B TW I566315B TW 103140571 A TW103140571 A TW 103140571A TW 103140571 A TW103140571 A TW 103140571A TW I566315 B TWI566315 B TW I566315B
- Authority
- TW
- Taiwan
- Prior art keywords
- workpiece
- unit
- workpieces
- wafer
- stage
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
一種高產出晶片固著裝置及其方法，尤指一種能夠同時頂出多個第一工件，並將多個第一工件同時壓合於一第二工件之方法及其裝置。 A high-yield wafer fixing device and method thereof, and more particularly to a method and apparatus for simultaneously ejecting a plurality of first workpieces and simultaneously pressing a plurality of first workpieces to a second workpiece.
頂出、吸取與壓合之步驟係常見於半導體製程中。頂出係利用頂針推頂一晶片(晶粒)，以使晶片與一膜體相互分離。吸取係利用一吸取頭將前述之被推頂的晶片移動至另一位置。壓合係利用一壓合頭將晶片壓合於一基板處。 The steps of ejector, suction and press are common in semiconductor processes. The ejector uses a thimble to push a wafer (grain) to separate the wafer from the film. The suction system uses a suction head to move the aforementioned pushed wafer to another position. The press-fit system presses the wafer to a substrate using a press-fit head.
然上述之頂針、吸取頭或壓合頭係設計僅能頂出一晶片或吸取一晶片，但對於講求效率的半導體產業而言，僅能頂出單一晶片之頂針、僅能吸取單一晶片之吸取頭或僅能壓合單一晶片之壓合頭，其產能係有限。特別是當因晶片厚度很薄或材質脆弱時，頂出需要很長的製程時間，或當晶片需要一定的壓合時間時，習知的方法不論機構的運作的速度如何提昇，生產效率依然低落，故需要有一全新的作業方式，來突破舊有方式的限制，有效提昇產能。 However, the thimble, the suction head or the press head is designed to only eject a wafer or suck a wafer, but for the efficiency-oriented semiconductor industry, only the ejector of a single wafer can be ejected, and only a single wafer can be sucked. The head or the press head that can only press a single wafer has a limited production capacity. Especially when the thickness of the wafer is very thin or the material is fragile, the ejection requires a long process time, or when the wafer requires a certain pressing time, the conventional method is still low in productivity regardless of the speed of operation of the mechanism. Therefore, it is necessary to have a new way of working to break through the limitations of the old methods and effectively increase production capacity.
有鑑於上述之課題，本發明之目的在於提供一種高產出晶片固著裝置及其方法，其係利用同時頂出至少二第一工件，並將該至少二第一工件同於壓合於一第二工件處，藉以達到提昇產能的效果。 In view of the above problems, an object of the present invention is to provide a high-yield wafer fixing device and a method thereof for simultaneously ejecting at least two first workpieces and pressing the at least two first workpieces together with one The second workpiece is used to achieve the effect of increasing production capacity.
為了達到上述之目的，本發明之技術手段在於提供一種高產 出晶片固著裝置，其包含有：一載台；一多吸放單元，其係位於該載台的上方；一調整台，其係相鄰於該載台；一承台，其係相鄰於該調整台；以及一多壓合單元，其係設於該承台的上方；其中，該載台係供至少二第一工件設置；該多吸放單元係吸取該至少二第一工件，並將該至少二第一工件放置於該調整台；該承台係供一第二工件設置；該多壓合單元係進行一旋轉運動，該多壓合單元係吸取位於該調整台之至少二第一工件，並將該至少二第一工件壓合於該第二工件。 In order to achieve the above object, the technical means of the present invention is to provide a high yield. a wafer fixing device comprising: a loading stage; a plurality of suction and discharge units located above the stage; an adjustment stage adjacent to the stage; a platform adjacent to the stage And the plurality of nip units are disposed above the pedestal; wherein the gantry is provided for at least two first workpieces; and the plurality of absorbing units absorbs the at least two first workpieces And placing the at least two first workpieces on the adjusting table; the cap is provided for a second workpiece; the multi-pressing unit performs a rotating motion, and the multi-pressing unit sucks at least two of the adjusting tables a first workpiece and pressing the at least two first workpieces to the second workpiece.
於一實施例中，高產出晶片固著裝置更具有一多頂出單元，多頂出單元係設於該載台的下方。 In one embodiment, the high-yield wafer fixture has a plurality of ejection units, and the plurality of ejection units are disposed below the stage.
本發明之技術手段在於提供一種高產出晶片固著方法，其包含有：一頂出單元係頂出位於一載台之至少二第一工件；一多吸放單元係吸取該至少二第一工件，並將該至少第一工件放置於一調整台；一多壓合單元係吸取位於該調整台之至少二第一工件，並將該至少二第一工件移動至一承台之第二工件的上方；該多壓合單元係將該至少二第一工件壓合於該第二工件。 The technical means of the present invention is to provide a high-yield wafer fixing method, comprising: an ejector unit ejector at least two first workpieces located on a stage; and a multi-absorption unit absorbing the at least two first a workpiece, and placing the at least first workpiece on an adjustment table; a plurality of pressing units sucking at least two first workpieces located on the adjustment table, and moving the at least two first workpieces to a second workpiece of a cap The plurality of pressing units press the at least two first workpieces to the second workpiece.
本發明之技術手段在於提供一種高產出晶片固著方法，其包含有：一多吸放單元係吸取位於一載台之至少二第一工件，並將該至少第一工件放置於一調整台；一多壓合單元係吸取位於該調整台之至少二第一工件，並將該至少二第一工件移動至一承台之第二工件的上方；該多壓合單元係將該至少二第一工件壓合於該第二工件。 The technical means of the present invention is to provide a high-yield wafer fixing method, comprising: a plurality of suction and discharge units sucking at least two first workpieces located on a stage, and placing the at least first workpiece on an adjustment stage a plurality of pressing units sucking at least two first workpieces located on the adjusting table, and moving the at least two first workpieces to a second workpiece of a cap; the multi-pressing unit is at least two A workpiece is pressed against the second workpiece.
綜合上述，本發明之高產出晶片固著裝置及其方法，其係同時頂出多個第一工件，並將所頂出的多個第一工件同時壓合於第 二工件處，藉以達到提昇產能的效果。為使多壓合單元的效率更高，多壓合單元可採用旋轉多群組的方式進行。 In summary, the high-yield wafer fixing device and method thereof of the present invention simultaneously eject a plurality of first workpieces and simultaneously press the plurality of first workpieces that are ejected simultaneously At the second workpiece, the effect of increasing production capacity can be achieved. In order to make the multi-compression unit more efficient, the multi-nip unit can be rotated in multiple groups.
載台的第一工件之所以必需由一頂出單元頂出，其係因在半導體製程中，第一工件常為晶片，其黏合在一藍膜上，藍膜黏在一鐡環上，鐡環則置放在載台上，故欲使晶片與藍膜分離，必需有一頂出行為方能達成。 The first workpiece of the stage must be ejected by an ejection unit. In the semiconductor process, the first workpiece is often a wafer, which is bonded to a blue film, and the blue film is adhered to a ring. The ring is placed on the stage, so in order to separate the wafer from the blue film, it is necessary to have an ejection behavior.
10‧‧‧載台 10‧‧‧ stage
100‧‧‧位移模組 100‧‧‧ displacement module
11‧‧‧多頂出單元 11‧‧‧Multiple ejection units
110‧‧‧頂針 110‧‧‧ thimble
111‧‧‧位移模組 111‧‧‧Displacement module
12‧‧‧多吸放單元 12‧‧‧Multiple suction unit
120‧‧‧位移模組 120‧‧‧displacement module
121‧‧‧吸取頭 121‧‧‧Sucking head
13‧‧‧調整台 13‧‧‧ adjustment station
130‧‧‧位移模組 130‧‧‧displacement module
131‧‧‧調整座 131‧‧‧ adjustment seat
14‧‧‧承台 14‧‧ ‧ cap
140‧‧‧位移模組 140‧‧‧displacement module
141‧‧‧加熱模組 141‧‧‧heating module
15‧‧‧多壓合單元 15‧‧‧Multiple press unit
150‧‧‧位移模組 150‧‧‧displacement module
151‧‧‧壓合頭 151‧‧‧Pressing head
152‧‧‧加熱模組 152‧‧‧heating module
16‧‧‧第一視覺定位模組 16‧‧‧First Vision Positioning Module
17‧‧‧第二視覺定位模組 17‧‧‧Second Visual Positioning Module
18‧‧‧第三視覺定位模組 18‧‧‧ Third Vision Positioning Module
19‧‧‧翻轉單元 19‧‧‧Flip unit
20‧‧‧第一工件 20‧‧‧First workpiece
21‧‧‧第二工件 21‧‧‧second workpiece
S1~S13‧‧‧步驟 S1~S13‧‧‧Steps
第1圖為本發明之一種高產出晶片固著裝置之第一實施例之示意圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic illustration of a first embodiment of a high throughput wafer fixture of the present invention.
第2圖為一調整台調整至少二第一工件之相對位置之示意圖。 Figure 2 is a schematic diagram showing the adjustment of the relative position of at least two first workpieces by an adjustment stage.
第3圖為一調整台調整至少二第一工件之相對位置之另一示意圖。 Figure 3 is another schematic view of an adjustment table adjusting the relative positions of at least two first workpieces.
第4圖為一多壓合單元進行一旋轉運動之示意圖。 Fig. 4 is a schematic view showing a rotary motion of a multi-nip unit.
第5圖為本發明之一種高產出晶片固著裝置之第二實施例之示意圖。 Figure 5 is a schematic illustration of a second embodiment of a high yield wafer fixture of the present invention.
第6圖為本發明之一種高產出晶片固著方法之第一實施例之流程示意圖。 Figure 6 is a flow chart showing the first embodiment of a high-output wafer fixing method of the present invention.
第7圖為本發明之一種高產出晶片固著方法之第二實施例之流程示意圖。 Figure 7 is a flow chart showing a second embodiment of a high-output wafer fixing method of the present invention.
第8圖為本發明之一種高產出晶片固著方法之第三實施例之流程示意圖。 Figure 8 is a flow chart showing a third embodiment of a high-output wafer fixing method of the present invention.
以下係藉由特定的具體實施例說明本發明之實施方式，所屬技術領域中具有通常知識者可由本說明書所揭示之內容，輕易地瞭解本發明之其他優點與功效。 The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily understand the other advantages and advantages of the present invention.
請配合參考第1圖所示，本發明係一種高產出晶片固著裝置之第一實施例，其具有一載台10、一多頂出單元11、一多吸放單元12、一調整台13、一承台14、一多壓合單元15、一第一視覺定位模組16、一第二視覺定位模組17與一第三視覺定位模組18。 Referring to FIG. 1 , the present invention is a first embodiment of a high-output wafer fixing device having a stage 10 , a multi-ejecting unit 11 , a multi-pick unit 12 , and an adjusting table. 13. A pedestal 14 , a multi-compression unit 15 , a first visual positioning module 16 , a second visual positioning module 17 and a third visual positioning module 18 .
載台10具有一位移模組100，以使載台10能夠進行一直線往 復運動(X軸向往復運動)、一橫向往復移動(Y軸向往復運動)或一旋轉運動。載台10係能夠供至少二第一工件20設置。該第一工件20為一基板、一晶圓、一晶片或一晶粒。 The stage 10 has a displacement module 100 to enable the stage 10 to be aligned Complex motion (X-axis reciprocating motion), a lateral reciprocating motion (Y-axis reciprocating motion) or a rotational motion. The stage 10 is capable of providing at least two first workpieces 20. The first workpiece 20 is a substrate, a wafer, a wafer or a die.
多頂出單元11係設於載台10的下方，多頂出單元11具有至少二頂針110，多頂出單元11更具有一位移模組111，以使多頂出單元11能夠相對於載台10呈一縱向往復運動(Z軸向往復運動)、一直線往復運動或一橫向往復運動。頂針110係能夠頂出至少二位於載台10之第一工件20。然頂針110可以依需要頂出的第一工件20數量，以控制單針或多針同步頂出。 The multi-ejection unit 11 is disposed under the stage 10, and the multi-ejecting unit 11 has at least two ejector pins 110. The multi-ejecting unit 11 further has a displacement module 111 to enable the multi-ejecting unit 11 to be opposite to the stage. 10 is in a longitudinal reciprocating motion (Z-axis reciprocating motion), a linear reciprocating motion or a lateral reciprocating motion. The thimble 110 is capable of ejecting at least two first workpieces 20 located on the stage 10. However, the ejector pin 110 can be ejector of the number of the first workpieces 20 as needed to control the single needle or multiple needles to simultaneously eject.
多吸放單元12係設於載台10的上方，多吸放單元12具有一位移模組120，以使多吸放單元12能夠進行一縱向往復移動、一直線往復運動或一橫向往復運動。多吸放單元12具有至少二吸取頭121，多吸放單元12係耦接一真空模組，以提供一負壓吸力或一正壓推力給吸取頭121，而使各吸取頭121能夠吸放至少二第一工件20。 The plurality of suction and discharge units 12 are disposed above the stage 10. The plurality of suction and discharge units 12 have a displacement module 120 to enable the plurality of suction and discharge units 12 to perform a longitudinal reciprocating movement, a linear reciprocating motion or a lateral reciprocating motion. The plurality of suction and discharge units 12 have at least two suction heads 121 coupled to a vacuum module to provide a vacuum suction force or a positive pressure thrust force to the suction head 121, so that the suction heads 121 can be sucked and discharged. At least two first workpieces 20.
調整台13係相鄰於載台10，調整台13具有一位移模組130，以使調整台13能夠進行一縱向往復運動、一直線往復運動或一橫向往復運動，調整台13具有至少二調整座131，各調整座131係能夠進行一直線往復運動或一橫向往復運動。調整座13的功能在於調整其上方的第一工件20的位置，以使二個以上的第一工件20之間的距離符合要置於於第二工作21上的距離，並使位置更加精準。 The adjustment table 13 is adjacent to the stage 10, and the adjustment table 13 has a displacement module 130 for enabling the adjustment table 13 to perform a longitudinal reciprocating motion, a linear reciprocating motion or a lateral reciprocating motion, and the adjustment table 13 has at least two adjustment seats. 131. Each of the adjustment seats 131 is capable of performing a linear reciprocating motion or a lateral reciprocating motion. The function of the adjustment seat 13 is to adjust the position of the first workpiece 20 above it so that the distance between the two or more first workpieces 20 conforms to the distance to be placed on the second work 21, and makes the position more precise.
承台14係相鄰於調整台13，承台14係供至少一第二工件21設置，該第二工件21為一基板、一膜體、一晶圓、一晶片或一晶粒。承台14具有一位移模組140，以使承台14能夠進行一直線往復運動、一橫向往復運動或一旋轉運動。該承台14具有一加熱模組141，該加熱模組141係用於加熱第二工件21，以使第一工件20易於壓合第二工件21。 The susceptor 14 is adjacent to the adjustment table 13. The pedestal 14 is provided for at least one second workpiece 21, which is a substrate, a film body, a wafer, a wafer or a die. The cap 14 has a displacement module 140 to enable the cap 14 to perform a linear reciprocating motion, a lateral reciprocating motion or a rotational motion. The susceptor 14 has a heating module 141 for heating the second workpiece 21 to facilitate the first workpiece 20 to be pressed against the second workpiece 21.
多壓合單元15係設於承台14的上方，多壓合單元15具有一位移模組150，以使多壓合單元15能夠進行一縱向往復運動、一 橫向往復運動、一旋轉運動或一直線往復運動。多壓合單元15具有至少二壓合頭151，多壓合單元15係耦接一真空模組，以提供一負壓吸力或一正壓推力給壓合頭151，以使各壓合頭151係能夠吸取至少二第一工件20，並將至少二第一工件20壓合於第一工件21。多壓合單元15亦能夠安裝2個以上於位移模組150上，，亦可以旋轉方式將多壓合單元15循序旋轉輪流壓合，以提昇效率。各壓合頭151具有一加熱模組152，以於加熱第一工件20。多壓合單元15亦能夠為至少兩組的設計。 The multiple press unit 15 is disposed above the platform 14 , and the multiple press unit 15 has a displacement module 150 to enable the multiple press unit 15 to perform a longitudinal reciprocating motion. Transverse reciprocating motion, a rotary motion or a linear reciprocating motion. The multiple press unit 15 has at least two press-fit heads 151 coupled to a vacuum module to provide a vacuum suction force or a positive pressure thrust force to the press-fit heads 151 so that the press-fit heads 151 At least two first workpieces 20 can be sucked and at least two first workpieces 20 can be pressed against the first workpiece 21. The multiple press unit 15 can also be mounted on the displacement module 150. The multi-pressure unit 15 can also be rotated in a rotating manner to increase the efficiency. Each of the pressing heads 151 has a heating module 152 for heating the first workpiece 20. The multiple press unit 15 can also be of at least two sets of designs.
第一視覺定位模組16係位於多吸放單元12的上方。第一視覺定位模組16係擷取載台10、第一工件20之影像資訊做為定位使用，該影像資訊為下述之第一影像資訊。 The first visual positioning module 16 is located above the multiple suction and discharge unit 12. The first visual positioning module 16 captures the image information of the loading platform 10 and the first workpiece 20 for positioning, and the image information is the first image information described below.
第二視覺定位模組17係位於調整台13的上方。第二影像定位模組17係擷取調整台13與第一工件20之影像資訊，該影像資訊為下述之第二影像資訊。 The second visual positioning module 17 is located above the adjustment table 13. The second image positioning module 17 captures the image information of the adjustment table 13 and the first workpiece 20, and the image information is the second image information described below.
第三視覺定位模組18係位於承台14與多壓合單元15的上方。第三視覺定位模組18係擷取各壓合頭151、第一工件20、第二工件21與承台14之影像資訊，該影像資訊為下述之第三影像資訊。第三視覺定位模組18能夠更進一步擷取第一工件20未面對第三視覺定位模組18的一面之影像，或者第三視覺定位模組18能夠透過具有第一工件之壓合頭，以擷取第一工作20、第二工件21或承台14之影像。 The third visual positioning module 18 is located above the cap 14 and the multi-nip unit 15 . The third visual positioning module 18 captures image information of each of the pressing head 151, the first workpiece 20, the second workpiece 21, and the platform 14, and the image information is the third image information described below. The third visual positioning module 18 can further capture an image of a side of the first workpiece 20 that does not face the third visual positioning module 18, or the third visual positioning module 18 can pass the pressing head having the first workpiece. The image of the first work 20, the second workpiece 21 or the cap 14 is captured.
請配合參考第5圖所示，本發明之一種高產出晶片固著裝置之第二實施例，於本實施例中，載台10、多頂出單元11、多吸放單元12、調整台13、承台14、多壓合單元15、第一視覺定位模組16、第二視覺定位模組17與第三視覺定位模組18係如上述之第一實施例，故元件符號係沿用上一實施例，故不再此贅述，特先陳述。 Referring to FIG. 5, a second embodiment of a high-output wafer fixing device of the present invention, in this embodiment, the stage 10, the multi-ejecting unit 11, the multi-suction unit 12, and the adjusting table 13. The cap 14, the multiple press unit 15, the first visual positioning module 16, the second visual positioning module 17, and the third visual positioning module 18 are as in the first embodiment described above, so that the component symbol is used. An embodiment is not described here, but is stated first.
於本實施例中，一翻轉單元19係設於調整台13與多壓合單元15之間，而因於本實施例中新增翻轉單元19，故調整台13的設置位置會低於載台10。翻轉單元19係耦接一耦接一真空模組， 以提供一負壓吸力或一正壓推力給翻轉單元19，而使翻轉單元19能夠吸取位於調整台13之至少二第一工件20，並將該至少二第一工件20轉動一角度，而使各壓合頭151能夠吸取被轉動一角度之第一工件20。 In this embodiment, an inverting unit 19 is disposed between the adjusting table 13 and the multi-nip unit 15, and since the inverting unit 19 is added in the embodiment, the setting position of the adjusting table 13 is lower than the stage. 10. The inverting unit 19 is coupled to a vacuum module. To provide a negative pressure suction or a positive pressure to the reversing unit 19, so that the reversing unit 19 can suck at least two first workpieces 20 located on the adjustment table 13, and rotate the at least two first workpieces 20 by an angle, thereby Each of the press heads 151 is capable of sucking the first workpiece 20 that is rotated by an angle.
於本實施例中，該第二影像資訊更進一步具有翻轉單元19之影像資訊。 In this embodiment, the second image information further has image information of the inverting unit 19.
請配合參考第6圖所示，本發明係一種高產出晶片固著方法之第一實施例，其步驟包含有：S1，載台10的頂端設置有多個第一工件20，若第一工件20為一晶片或一晶粒，其黏合在一藍膜上，藍膜黏在一鐡環上，鐡環則置放在載台10上，故欲使晶片與藍膜分離，必需有一頂出行為方能達成。第一視覺定位模組16係擷取位於載台10之第一工件20的一第一影像資訊，並將該第一影像資訊之運算結果傳送給載台10，以調整精確位置，再下命令傳送給多頂出單元11。多頂出單元11依據該命令，朝向載台10的方向移動，以將頂出至少二第一工件20。待頂出至少二第一工件20後，多頂出單元11係回復至最初位置，以待再次頂出至少二第一工件20。 Referring to FIG. 6 , the present invention is a first embodiment of a high-output wafer fixing method, the steps of which include: S1, the top end of the stage 10 is provided with a plurality of first workpieces 20, if the first The workpiece 20 is a wafer or a die bonded to a blue film, the blue film is adhered to a ring, and the ring is placed on the stage 10. Therefore, in order to separate the wafer from the blue film, it is necessary to have a top. The behavior can be achieved. The first visual positioning module 16 captures a first image information of the first workpiece 20 located on the stage 10, and transmits the operation result of the first image information to the stage 10 to adjust the precise position, and then presses the command. It is transmitted to the multi-out unit 11. The multi-ejection unit 11 moves toward the stage 10 in accordance with the command to eject at least two first workpieces 20. After the at least two first workpieces 20 are to be ejected, the multi-ejecting unit 11 is returned to the initial position, so that at least two first workpieces 20 are to be ejected again.
S2，多吸放單元12係接收該第一影像資訊，並依據該第一影像資訊，而朝向載台10方向移動，多吸放單元12係吸取上述之被頂出之至少二第一工件20，待吸取至少二第一工件20後。並朝向調整台13方向移動，而將至少二第一工件20放置於調整台13之調整座131。第二視覺定位模組17係擷取調整座上的第二影像資訊，並將該第二影像資訊傳送給調整台13。 S2, the multi-pickup unit 12 receives the first image information, and moves toward the stage 10 according to the first image information, and the plurality of suction and discharge units 12 absorbs at least two first workpieces 20 that are ejected. After at least two first workpieces 20 are to be sucked. And moving toward the adjustment table 13 and placing at least two first workpieces 20 on the adjustment seat 131 of the adjustment table 13. The second visual positioning module 17 captures the second image information on the adjustment seat and transmits the second image information to the adjustment station 13.
待多吸放單元12將至少二第一工件20放置於調整台13後，多吸放單元12係回復至最初位置，以待再次吸取位於載台10之至少二第一工件20。 After the plurality of suction and discharge units 12 have placed at least two first workpieces 20 on the adjustment table 13, the plurality of suction and discharge units 12 are returned to the initial position to be sucked again to at least two first workpieces 20 located on the stage 10.
S3，請配合參考第3圖與第4圖所示，調整台13亦接收該第二影像資訊，並使至少二調整座131相對移動，以調整位於至少二調整座131之第一工件20的位置。並使其上的二個以上第一工件20的間隔距離，可以調整為第二工件21上的第一工件20的間 距。 S3, please refer to FIG. 3 and FIG. 4, the adjustment table 13 also receives the second image information, and the at least two adjustment seats 131 are relatively moved to adjust the first workpiece 20 located in the at least two adjustment seats 131. position. And the distance between the two or more first workpieces 20 on the second workpiece 21 can be adjusted to be between the first workpieces 20 on the second workpiece 21. distance.
S4，請再配合參考第1圖所示，若為本發明之高產出晶片固著裝置之第一實施例，調整台13係朝向多壓合單元15的方向移動，多壓合單元15亦接收該第二影像資訊，以使多壓合單元15朝向調整台13方向移動，壓合頭151係吸取位於調整座131之至少二第一工件20。具有至少二第一工件20之壓合頭151係移動至承台14的上方。 S4, please refer to FIG. 1 again. If the first embodiment of the high-output wafer fixing device of the present invention is used, the adjusting table 13 is moved toward the multi-nip unit 15, and the multi-pressure unit 15 is also The second image information is received to move the multi-nip unit 15 toward the adjustment table 13 , and the pressing head 151 sucks at least two first workpieces 20 located on the adjustment base 131 . The press head 151 having at least two first workpieces 20 is moved above the cap 14.
調整台13係回復至最初位置，以待吸放單元12再次將第一工件20放置於調整台13。 The adjustment stage 13 is returned to the original position until the suction unit 12 again places the first workpiece 20 on the adjustment stage 13.
請配合參考第5圖所示，若為本發明之高產出晶片固著裝置之第二實施例，調整台13係朝向翻轉單元19移動。翻轉單元19係接收該第二影像資訊，並轉動至調整台13的方向，翻轉單元19係吸取位於調整台13之至少二第一工件20，並將至少二第一工件20轉動一角度。多壓合單元15朝向翻轉單元19移動，以吸取位於翻轉單元19之第一工件20。具有至少二第一工件20之壓合頭151係移動至承台14的上方。 Referring to FIG. 5, in the second embodiment of the high-yield wafer fixing device of the present invention, the adjustment table 13 is moved toward the reversing unit 19. The inverting unit 19 receives the second image information and rotates to the direction of the adjustment table 13. The inverting unit 19 sucks at least two first workpieces 20 located on the adjustment table 13 and rotates at least two first workpieces 20 by an angle. The multi-nip unit 15 is moved toward the reversing unit 19 to suck the first workpiece 20 located at the reversing unit 19. The press head 151 having at least two first workpieces 20 is moved above the cap 14.
S5，第三視覺定位模組18係擷取位於壓合頭151之第一工件20、第二工件21與承台14之影像資訊，該影像資訊為一第三影像資訊，壓合單元15係接受該第三影像資訊，以使壓合頭151能夠將至少二第一工件20壓合於第二工件21。於將第一工件20壓合於第二工件21前，承台14亦接收第三影像資訊，以調整承台14相對於具有第一工件20之壓合頭151的位置。待壓合完畢後，壓合單元15與承台14係回復至最初位置，或移至下一個工作位置，以待再次壓合程序。 S5, the third visual positioning module 18 captures image information of the first workpiece 20, the second workpiece 21 and the platform 14 of the pressing head 151, the image information is a third image information, and the pressing unit 15 is The third image information is accepted such that the press head 151 can press at least two first workpieces 20 to the second workpiece 21. Before the first workpiece 20 is pressed against the second workpiece 21, the platform 14 also receives the third image information to adjust the position of the cap 14 relative to the press head 151 having the first workpiece 20. After the pressing is completed, the pressing unit 15 and the cap 14 are returned to the original position or moved to the next working position to be pressed again.
請配合參考第7圖所示，本發明係一種高產出晶片固著方法之第二實施例，其步驟包含有： Referring to FIG. 7, the present invention is a second embodiment of a high-output wafer fixing method, the steps of which include:
S6，載台10的頂端設置有多個第一工件20，第一視覺定位模組16係擷取位於載台10之第一工件20的一第一影像資訊，並將該第一影像資訊之運算結果傳送給載台10，以調整精確位置，再下命令傳送給多吸放單元12。若第一工件20未黏合在一藍膜上， 則無須使用頂出單元11。 S6, the top of the stage 10 is provided with a plurality of first workpieces 20, and the first visual positioning module 16 captures a first image information of the first workpiece 20 of the stage 10, and the first image information is The result of the operation is transmitted to the stage 10 to adjust the precise position, and then the command is transmitted to the multi-absorption unit 12. If the first workpiece 20 is not bonded to a blue film, It is not necessary to use the ejector unit 11.
多吸放單元12係接收該第一影像資訊，並依據該第一影像資訊，而朝向載台10方向移動，多吸放單元12係吸取上述之至少二第一工件20，待吸取至少二第一工件20後。並朝向調整台13方向移動，而將至少二第一工件20放置於調整台13之調整座131。第二視覺定位模組17係擷取調整座上的第二影像資訊，並將該第二影像資訊傳送給調整台13。 The plurality of suction and discharge units 12 receive the first image information, and move toward the stage 10 according to the first image information, and the plurality of suction and discharge units 12 absorb at least two of the first workpieces 20 to be sucked at least two After a workpiece 20. And moving toward the adjustment table 13 and placing at least two first workpieces 20 on the adjustment seat 131 of the adjustment table 13. The second visual positioning module 17 captures the second image information on the adjustment seat and transmits the second image information to the adjustment station 13.
待多吸放單元12將至少二第一工件20放置於調整台13後，多吸放單元12係回復至最初位置，以待再次吸取位於載台10之至少二第一工件20。 After the plurality of suction and discharge units 12 have placed at least two first workpieces 20 on the adjustment table 13, the plurality of suction and discharge units 12 are returned to the initial position to be sucked again to at least two first workpieces 20 located on the stage 10.
S7，請配合參考第3圖與第4圖所示，調整台13亦接收該第二影像資訊，並使至少二調整座131相對移動，以調整位於至少二調整座131之第一工件20的位置。並使其上的二個以上第一工件20的間隔距離，可以調整為第二工件21上的第一工件20的間距。 S7, please refer to FIG. 3 and FIG. 4, the adjustment table 13 also receives the second image information, and the at least two adjustment seats 131 are relatively moved to adjust the first workpiece 20 located in the at least two adjustment seats 131. position. The distance between the two or more first workpieces 20 on the second workpiece 21 can be adjusted to the pitch of the first workpiece 20 on the second workpiece 21.
S8，請再配合參考第1圖所示，若為本發明之高產出晶片固著裝置之第一實施例，調整台13係朝向多壓合單元15的方向移動，多壓合單元15亦接收該第二影像資訊，以使多壓合單元15朝向調整台13方向移動，壓合頭151係吸取位於調整座131之至少二第一工件20。具有至少二第一工件20之壓合頭151係移動至承台14的上方。 S8, please refer to FIG. 1 again. In the first embodiment of the high-output wafer fixing device of the present invention, the adjusting table 13 is moved toward the multi-nip unit 15, and the multi-pressure unit 15 is also The second image information is received to move the multi-nip unit 15 toward the adjustment table 13 , and the pressing head 151 sucks at least two first workpieces 20 located on the adjustment base 131 . The press head 151 having at least two first workpieces 20 is moved above the cap 14.
調整台13係回復至最初位置，以待吸放單元12再次將第一工件20放置於調整台13。 The adjustment stage 13 is returned to the original position until the suction unit 12 again places the first workpiece 20 on the adjustment stage 13.
請配合參考第5圖所示，若為本發明之高產出晶片固著裝置之第二實施例，調整台13係朝向翻轉單元19移動。翻轉單元19係接收該第二影像資訊，並轉動至調整台13的方向，翻轉單元19係吸取位於調整台13之至少二第一工件20，並將至少二第一工件20轉動一角度。多壓合單元15朝向翻轉單元19移動，以吸取位於翻轉單元19之第一工件20。具有至少二第一工件20之壓合頭151係移動至承台14的上方；或者具有至少二第一工件20之壓合 頭151係轉動至承台14的上方。 Referring to FIG. 5, in the second embodiment of the high-yield wafer fixing device of the present invention, the adjustment table 13 is moved toward the reversing unit 19. The inverting unit 19 receives the second image information and rotates to the direction of the adjustment table 13. The inverting unit 19 sucks at least two first workpieces 20 located on the adjustment table 13 and rotates at least two first workpieces 20 by an angle. The multi-nip unit 15 is moved toward the reversing unit 19 to suck the first workpiece 20 located at the reversing unit 19. The press head 151 having at least two first workpieces 20 is moved above the cap 14 or has at least two presses of the first workpiece 20 The head 151 is rotated above the platform 14.
S9，第三視覺定位模組18係擷取位於壓合頭151之第一工件20、第二工件21與承台14之影像資訊，該影像資訊為一第三影像資訊，壓合單元15係接受該第三影像資訊，以使壓合頭151能夠將至少二第一工件20壓合於第二工件21。於將第一工件20壓合於第二工件21前，承台14亦接收第三影像資訊，以調整承台14相對於具有第一工件20之壓合頭151的位置。待壓合完畢後，壓合單元15與承台14係回復至最初位置，或移至下一個工作位置，以待再次壓合程序。 S9, the third visual positioning module 18 captures image information of the first workpiece 20, the second workpiece 21 and the platform 14 at the pressing head 151. The image information is a third image information, and the pressing unit 15 is The third image information is accepted such that the press head 151 can press at least two first workpieces 20 to the second workpiece 21. Before the first workpiece 20 is pressed against the second workpiece 21, the platform 14 also receives the third image information to adjust the position of the cap 14 relative to the press head 151 having the first workpiece 20. After the pressing is completed, the pressing unit 15 and the cap 14 are returned to the original position or moved to the next working position to be pressed again.
請配合參考第8圖所示，本發明係一種高產出晶片固著方法之第三實施例，其步驟包含有： S10，多吸放單元12係朝向載台10方向移動，多吸放單元12係吸取上述之至少二第一工件20，待吸取至少二第一工件20後。並朝向調整台13方向移動，而將至少二第一工件20放置於調整台13之調整座131。於本實施例中，其係可採用上述之S1與S2或S6之步驟。 Referring to FIG. 8, the present invention is a third embodiment of a high-output wafer fixing method, the steps of which include: S10, the plurality of suction and discharge units 12 are moved toward the stage 10, and the plurality of suction and discharge units 12 suck the at least two first workpieces 20, and at least two first workpieces 20 are to be sucked. And moving toward the adjustment table 13 and placing at least two first workpieces 20 on the adjustment seat 131 of the adjustment table 13. In the present embodiment, the steps of S1 and S2 or S6 described above may be employed.
S11，至少二調整座131相對移動，以調整位於至少二調整座131之第一工件20的位置。並使其上的二個以上第一工件20的間隔距離，可以調整為第二工件21上的第一工件20的間距。 S11, at least two adjustment seats 131 are relatively moved to adjust the position of the first workpiece 20 located at the at least two adjustment seats 131. The distance between the two or more first workpieces 20 on the second workpiece 21 can be adjusted to the pitch of the first workpiece 20 on the second workpiece 21.
S12，如第4圖所示，多壓合單元15以一旋轉運動方式朝向調整台13方向移動，壓合頭151係吸取位於調整座131之至少二第一工件20。具有至少二第一工件20之壓合頭151係以一旋轉運動方式移動至承台14的上方。於本步驟中，其係可採用上述之S8或S4之步驟。 S12, as shown in FIG. 4, the multi-nip unit 15 moves toward the adjustment table 13 in a rotational motion manner, and the pressure-bonding head 151 sucks at least two first workpieces 20 located on the adjustment base 131. The press head 151 having at least two first workpieces 20 is moved to a position above the cap 14 in a rotational motion. In this step, the steps of S8 or S4 described above may be employed.
多壓合單元15係能夠以一旋轉運動方式移動，該旋轉運動方式係能夠使多個壓合頭151能夠依序作業。進而提升壓合之效率。 The multiple press unit 15 is movable in a rotational motion mode that enables the plurality of press heads 151 to be sequentially operated. In turn, the efficiency of pressing is improved.
S13，壓合頭151能夠將至少二第一工件20壓合於第二工件21。於本步驟中，其係能夠採用上述之S9或S5之步驟。 S13, the pressing head 151 can press at least two first workpieces 20 to the second workpiece 21. In this step, it is possible to adopt the steps of S9 or S5 described above.
上述之第一影像資訊、第二影像資訊與第三影像資訊係用於提昇定位的精準性。 The first image information, the second image information and the third image information are used to improve the accuracy of positioning.
如上所述之本發明之高產出晶片固著方法之各實施例，其步驟能夠為：多頂出單元11依據該命令，朝向載台10的方向移動，以將頂出至少二第一工件20。待頂出至少二第一工件20後，多頂出單元11係回復至最初位置，以待再次頂出至少二第一工件20。此步驟亦能夠省略。 The embodiments of the high-yield wafer fixing method of the present invention as described above may be such that the multi-ejection unit 11 moves toward the stage 10 according to the command to push out at least two first workpieces. 20. After the at least two first workpieces 20 are to be ejected, the multi-ejecting unit 11 is returned to the initial position, so that at least two first workpieces 20 are to be ejected again. This step can also be omitted.
若省略上述之頂出步驟，多吸放單元12係吸取位於載台10之至少二第一工件20，待吸取至少二第一工件20後。並朝向調整台13方向移動，而將至少二第一工件20放置於調整台13之調整座131。 If the above-mentioned ejection step is omitted, the multiple suction and discharge unit 12 sucks at least two first workpieces 20 located on the stage 10 after the at least two first workpieces 20 are to be sucked. And moving toward the adjustment table 13 and placing at least two first workpieces 20 on the adjustment seat 131 of the adjustment table 13.
至少二調整座131相對移動，以調整位於至少二調整座131之第一工件20的位置。並使其上的二個以上第一工件20的間隔距離，可以調整為第二工件21上的第一工件20的間距。 At least two adjustment seats 131 are relatively moved to adjust the position of the first workpiece 20 located at the at least two adjustment seats 131. The distance between the two or more first workpieces 20 on the second workpiece 21 can be adjusted to the pitch of the first workpiece 20 on the second workpiece 21.
多壓合單元15以一旋轉運動方式朝向調整台13方向移動，壓合頭151係吸取位於調整座131之至少二第一工件20。具有至少二第一工件20之壓合頭151係以一旋轉運動方式移動至承台14的上方。多壓合單元15更能進一步進行一縱向往復移動、一直線往復運動或一橫向往復運動。該縱向往復移動、該直線往復運動或該橫向往復運動係為一選擇性運動。 The multiple press unit 15 moves in a rotational motion toward the adjustment table 13 , and the press head 151 sucks at least two first workpieces 20 located on the adjustment base 131 . The press head 151 having at least two first workpieces 20 is moved to a position above the cap 14 in a rotational motion. The multiple nip unit 15 is further capable of further performing a longitudinal reciprocating movement, a linear reciprocating motion or a lateral reciprocating motion. The longitudinal reciprocating movement, the linear reciprocating motion or the lateral reciprocating motion is a selective movement.
另外，翻轉單元19係吸取位於調整台13之至少二第一工件20，並將至少二第一工件20轉動一角度。多壓合單元15以一旋轉運動方式移動朝向翻轉單元19移動，以吸取位於翻轉單元19之第一工件20。具有至少二第一工件20之壓合頭151係以一旋轉運動方式移動至移動至承台14的上方。 In addition, the inverting unit 19 sucks at least two first workpieces 20 located on the adjustment table 13 and rotates at least two first workpieces 20 by an angle. The multiple nip unit 15 moves in a rotational movement toward the reversing unit 19 to suck the first workpiece 20 at the reversing unit 19. The press head 151 having at least two first workpieces 20 is moved in a rotational motion to move above the cap 14.
壓合頭151將至少二第一工件20壓合於第二工件21，於壓合前，上述之加熱模組141、152係分別加熱第二工件21與第一工件20，加熱後的第一工件20與第二工件21係更易於壓合。 The pressing head 151 presses at least two first workpieces 20 to the second workpiece 21. Before the pressing, the heating modules 141 and 152 respectively heat the second workpiece 21 and the first workpiece 20, and the first after heating. The workpiece 20 and the second workpiece 21 are more easily pressed.
綜合上述，本發明係利用多頂出單元，以頂出至少二位於載台之第一工件，再利用多吸放單元取放該至少第一工件，並利用多壓合單元將至少二第一工件壓合於位於承台之第二工件處。 In summary, the present invention utilizes a multi-ejecting unit to eject at least two first workpieces on the stage, and then pick up and release the at least first workpiece by using multiple suction units, and use at least two first units with multiple compression units. The workpiece is pressed against a second workpiece located on the cap.
藉由增加頂出位於載台之第一工件的數量，以及將多個第一工件同時壓合於第二工件處，而達到提昇產能的效果。 The effect of increasing the productivity is achieved by increasing the number of ejection of the first workpiece located on the stage and simultaneously pressing the plurality of first workpieces to the second workpiece.
以上所述之具體實施例，僅係用於例釋本發明之特點及功效，而非用於限定本發明之可實施範疇，於未脫離本發明上揭之精神與技術範疇下，任何運用本發明所揭示內容而完成之等效改變及修飾，均仍應為下述之申請專利範圍所涵蓋。 The specific embodiments described above are only used to exemplify the features and functions of the present invention, and are not intended to limit the scope of the present invention, and may be used without departing from the spirit and scope of the invention. Equivalent changes and modifications made to the disclosure of the invention are still covered by the scope of the following claims.
10‧‧‧載台 10‧‧‧ stage
100‧‧‧位移模組 100‧‧‧ displacement module
11‧‧‧多頂出單元 11‧‧‧Multiple ejection units
110‧‧‧頂針 110‧‧‧ thimble
111‧‧‧位移模組 111‧‧‧Displacement module
12‧‧‧多吸放單元 12‧‧‧Multiple suction unit
120‧‧‧位移模組 120‧‧‧displacement module
121‧‧‧吸取頭 121‧‧‧Sucking head
13‧‧‧調整台 13‧‧‧ adjustment station
130‧‧‧位移模組 130‧‧‧displacement module
131‧‧‧調整座 131‧‧‧ adjustment seat
14‧‧‧承台 14‧‧ ‧ cap
140‧‧‧位移模組 140‧‧‧displacement module
141‧‧‧加熱模組 141‧‧‧heating module
15‧‧‧多壓合單元 15‧‧‧Multiple press unit
150‧‧‧位移模組 150‧‧‧displacement module
151‧‧‧壓合頭 151‧‧‧Pressing head
152‧‧‧加熱模組 152‧‧‧heating module
16‧‧‧第一視覺定位模組 16‧‧‧First Vision Positioning Module
17‧‧‧第二視覺定位模組 17‧‧‧Second Visual Positioning Module
18‧‧‧第三視覺定位模組 18‧‧‧ Third Vision Positioning Module
20‧‧‧第一工件 20‧‧‧First workpiece
21‧‧‧第二工件 21‧‧‧second workpiece
Claims (19)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103140571A TWI566315B (en) | 2014-11-24 | 2014-11-24 | Wafer mounted apparatus with high yield and method thereof |
| CN201510720176.9A CN105225990B (en) | 2014-11-24 | 2015-10-30 | wafer fixing device and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103140571A TWI566315B (en) | 2014-11-24 | 2014-11-24 | Wafer mounted apparatus with high yield and method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201620060A TW201620060A (en) | 2016-06-01 |
| TWI566315B true TWI566315B (en) | 2017-01-11 |
Family
ID=54994855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103140571A TWI566315B (en) | 2014-11-24 | 2014-11-24 | Wafer mounted apparatus with high yield and method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105225990B (en) |
| TW (1) | TWI566315B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109037420B (en) * | 2018-07-02 | 2021-01-08 | 惠州雷通光电器件有限公司 | Flip chip die bonding device and method |
| CN109664188B (en) * | 2018-12-14 | 2020-05-22 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer loading and unloading device |
| TWI703668B (en) * | 2019-08-13 | 2020-09-01 | 均華精密工業股份有限公司 | Large size wafer bonding apparatus |
| CN110690152A (en) * | 2019-08-28 | 2020-01-14 | 苏州均华精密机械有限公司 | Large-size wafer bonding device |
| TWI722801B (en) * | 2020-02-21 | 2021-03-21 | 均華精密工業股份有限公司 | Die bonder |
| CN113299577A (en) * | 2020-02-21 | 2021-08-24 | 均华精密工业股份有限公司 | Die bonder |
| TWI780424B (en) * | 2020-04-07 | 2022-10-11 | 均華精密工業股份有限公司 | Improving accuracy and speed of bonding apparatus |
| TWI786447B (en) * | 2020-10-15 | 2022-12-11 | 均華精密工業股份有限公司 | Producing apparatus and pre-bonding device |
| TWI798595B (en) * | 2020-10-22 | 2023-04-11 | 均華精密工業股份有限公司 | Die bonding device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM314429U (en) * | 2006-12-15 | 2007-06-21 | Powertech Technology Inc | Structure of disengaging aparatus for pickup semiconductor chips |
| TWM482158U (en) * | 2013-08-29 | 2014-07-11 | Gallant Micro Machining Co Ltd | Apparatus for mounting semiconductor dies |
| TW201442128A (en) * | 2013-04-26 | 2014-11-01 | Gallant Micro Machining Co Ltd | Die bonding device with top/bottom view |
| TWM501642U (en) * | 2014-11-24 | 2015-05-21 | Gallant Micro Machining Co Ltd | High yield fixing device of chip |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101360585B1 (en) * | 2012-07-23 | 2014-02-10 | 우리에이텍(주) | Die pick-up control method, die pick-up device using the same, and die bonder including the same |
| CN103594400B (en) * | 2013-11-29 | 2016-02-17 | 如皋市大昌电子有限公司 | A kind of axial diode chip automation chip filling production system |
-
2014
- 2014-11-24 TW TW103140571A patent/TWI566315B/en active
-
2015
- 2015-10-30 CN CN201510720176.9A patent/CN105225990B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM314429U (en) * | 2006-12-15 | 2007-06-21 | Powertech Technology Inc | Structure of disengaging aparatus for pickup semiconductor chips |
| TW201442128A (en) * | 2013-04-26 | 2014-11-01 | Gallant Micro Machining Co Ltd | Die bonding device with top/bottom view |
| TWM482158U (en) * | 2013-08-29 | 2014-07-11 | Gallant Micro Machining Co Ltd | Apparatus for mounting semiconductor dies |
| TWM501642U (en) * | 2014-11-24 | 2015-05-21 | Gallant Micro Machining Co Ltd | High yield fixing device of chip |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201620060A (en) | 2016-06-01 |
| CN105225990A (en) | 2016-01-06 |
| CN105225990B (en) | 2019-01-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI566315B (en) | Wafer mounted apparatus with high yield and method thereof | |
| CN108780762B (en) | Electronic component mounting apparatus | |
| CN108701620B (en) | Electronic component processing unit | |
| TWM501642U (en) | High yield fixing device of chip | |
| CN107248501B (en) | Relay type rapid sheet taking and loading device and sheet loading machine adopting same | |
| CN107248500B (en) | Crystal taking and fixing device and crystal fixing machine adopting same | |
| CN109473376B (en) | Cutting device and method for transporting semiconductor package | |
| CN111063628A (en) | Chip bonding device | |
| JP2020072125A (en) | Electronic component pick-up device and mounting device | |
| JP2011009424A (en) | Holding table assembly and method of manufacturing holding table | |
| JP2011009423A (en) | Holding table assembly and method of manufacturing holding table | |
| JP2017135232A (en) | Dividing jig and dividing method for wafer | |
| JP3497078B2 (en) | Die bonder | |
| JP2006108193A (en) | Pickup device and pickup method | |
| JP7071839B2 (en) | Bonding equipment | |
| JP2012186505A (en) | Component supply device | |
| CN217405387U (en) | Efficient full-automatic chip transport turnover equipment | |
| JP4466377B2 (en) | Component mounting device, component mounting method, component reversing device, and component reversing method | |
| TWI579951B (en) | Turn-over device of semiconductor element and testing apparatus thereof | |
| TWI780424B (en) | Improving accuracy and speed of bonding apparatus | |
| TW202203334A (en) | Article manufacturing device, article manufacturing method, program, and recording medium | |
| WO2021026957A1 (en) | High-precision large panel-level micro-assembly device | |
| CN220372620U (en) | Automatic metal part machining equipment | |
| JP2020009917A (en) | Workpiece drying method and cutting device | |
| JP2011177854A (en) | Suction device and droplet discharge device |