CN110690152A - Large-size wafer bonding device - Google Patents
Large-size wafer bonding device Download PDFInfo
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- CN110690152A CN110690152A CN201910799369.6A CN201910799369A CN110690152A CN 110690152 A CN110690152 A CN 110690152A CN 201910799369 A CN201910799369 A CN 201910799369A CN 110690152 A CN110690152 A CN 110690152A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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Abstract
A large-sized wafer bonding apparatus includes: a supply unit; a relay unit adjacent to the supply unit; the first taking and placing unit is positioned between the relay unit and the supply unit; a receiving unit adjacent to the relay unit; the second picking and placing unit is positioned between the relay unit and the receiving unit; wherein, the supply unit is provided for at least one wafer; the receiving unit rotates a preset angle; the first picking and placing unit places the at least one wafer on the relay unit, and the relay unit rotates by the preset angle; the second picking and placing unit places the wafer in the receiving unit from the relay unit. The receiving unit and the relay unit rotate by the same preset angle, so that the directions of the wafers sequentially placed behind the receiving unit can be consistent.
Description
Technical Field
The invention relates to a large-size wafer bonding device, in particular to a wafer bonding device capable of improving speed and precision.
Background
The application and production of large-sized chips have been paid attention by various manufacturers, but the speed and precision of large-sized chips are often considered when transporting the large-sized chips between the machines of various processes. If manufacturers want to increase the transportation speed of large-sized chips, they face a decrease in precision. If manufacturers want to improve the accuracy, they may face a reduction in speed.
As described above, in the transportation of large-sized wafers, the accuracy is reduced when the speed is raised, and the speed is lost when the accuracy is raised. Therefore, how to transport large-sized wafers while increasing the precision and speed is a space that manufacturers can develop.
In summary, it is an object of the present invention to overcome the above-mentioned shortcomings of the prior art.
Disclosure of Invention
The invention aims to provide a large-size wafer bonding device.
In order to achieve the purpose, the invention adopts the technical scheme that:
a large-sized wafer bonding apparatus; comprises the following steps:
a supply unit;
a relay unit adjacent to the supply unit;
the first taking and placing unit is positioned between the relay unit and the supply unit;
a receiving unit adjacent to the relay unit; and
the second taking and placing unit is positioned between the relay unit and the receiving unit;
wherein, the supply unit is provided for at least one wafer; the receiving unit rotates a preset angle; the first taking and placing unit is used for placing at least one wafer on the relay unit, and the relay unit rotates by the preset angle; the second picking and placing unit is used for placing the wafer into the receiving unit through the relay unit.
The relevant content in the above technical solution is explained as follows:
1. in the above solution, the relay unit has a first relay module and a second relay module, the two relay modules are used for the first pick-and-place unit to place the wafer, and after the wafer reaches a predetermined number in the first relay module, the first relay module and the second relay module exchange positions, so that the first pick-and-place unit places the wafer in the second relay module.
2. In the above solution, the first relay module has a first relay stage and a first relay moving assembly, the first relay moving assembly is located below the first relay stage, the second relay module has a second relay stage and a second relay moving assembly, and the second relay stage is located above the second relay moving assembly.
3. In the above solution, a first vision unit is further provided, and the first vision unit is located above the supply unit.
4. In the above solution, there is a second vision unit, and the second vision unit is located above the relay unit.
5. In the above solution, there is a third visual unit, which is located above the engaging unit.
6. In the above scheme, the first pick-and-place unit has at least one first suction module.
7. In the above scheme, the first pick-and-place unit further has at least one second suction module.
8. In the above scheme, the first pick-and-place unit has a first rotating module and at least one first suction module, and the at least one first suction module is disposed on the first rotating module.
9. In the above scheme, the second pick-and-place unit has a rotating module and at least one suction module, and the at least one suction module is disposed on the rotating module.
10. In the above scheme, a turning unit is further provided, and the turning unit is located between the first taking and placing unit and the relay unit.
11. In the above solution, the bonding unit has a bonding stage and a receiving displacement module, and the receiving displacement module is disposed below the bonding stage.
12. In the above-mentioned solution, the bonding stage has a first area and a second area.
13. In the above solution, the bonding stage has a first area, a second area, a third area and a fourth area.
The working principle and the advantages of the invention are as follows:
the invention relates to a large-size wafer bonding device, which comprises: a supply unit; a relay unit adjacent to the supply unit; the first taking and placing unit is positioned between the relay unit and the supply unit; a receiving unit adjacent to the relay unit; the second picking and placing unit is positioned between the relay unit and the receiving unit; wherein, the supply unit is provided for at least one wafer; the receiving unit rotates a preset angle; the first picking and placing unit places the at least one wafer on the relay unit, and the relay unit rotates by the preset angle; the second picking and placing unit places the wafer in the receiving unit from the relay unit. The receiving unit and the relay unit rotate by the same preset angle, so that the directions of the wafers sequentially placed behind the receiving unit can be consistent.
Drawings
FIG. 1 is a schematic diagram of a first embodiment of the present invention;
FIG. 2 is a schematic top view of a first embodiment of the present invention;
FIG. 3 is a schematic view of at least one wafer being placed in a first relay module;
FIG. 4 is a schematic diagram of a first relay module adjusting the position of at least one wafer;
FIG. 5 is a schematic view of a second embodiment of the present invention;
FIG. 6 is a schematic top view of a second embodiment of the present invention;
FIG. 7 is a schematic view of a third embodiment of the present invention;
FIG. 8 is a schematic top view of a third embodiment of the present invention;
FIG. 9 is a further schematic top view of the third embodiment of the present invention;
fig. 10 is a schematic view of a fourth embodiment of the present invention.
In the above drawings: 10. a supply unit; 11. a relay unit; 110. a first relay module; 1100. a first relay stage; 1101. a first relay displacement assembly; 111. a second relay module; 1110. a second relay station; 1111. a second relay displacement assembly; 12. a first pick-and-place unit; 120. a first suction module; 13. a receiving unit; 130. receiving a carrier; 131. a displacement receiving module; 1300. a first region; 1301. a second region; 14. a second pick-and-place unit; 140. a rotation module; 141. a suction unit; 15. a first vision unit; 16. a second visual unit; 17. a third visual element; 20. a wafer; 30. a supply unit; 31. a relay unit; 310. a first relay module; 3100. a first relay stage; 3101. a first relay displacement assembly; 311. a second relay module; 3110. a second relay station; 3111. a second relay displacement assembly; 32. a first pick-and-place unit; 320. a first suction module; 321. a second suction module; 33. a receiving unit; 330. receiving a carrier; 3300. a first region; 3301. a second region; 331. a displacement receiving module; 34. a second pick-and-place unit; 340. a rotation module; 341. a suction unit; 35. a first vision unit; 36. a second visual unit; 37. a third visual element; 40. a wafer; 50. a supply unit; 51. a relay unit; 510. a first relay module; 5100. a first relay stage; 5101. a first relay mobile component; 511. a second relay module; 5110. a first relay stage; 5111. a second relay mobile component; 52. a first pick-and-place unit; 521. a first suction module; 53. a receiving unit; 530. receiving a carrier; 5300. a first region; 5301. a second region; 5302. a third region; 5303. a fourth region; 531. a displacement receiving module; 54. a second pick-and-place unit; 540. a rotation module; 541. a suction module; 55. a first vision unit; 56. a second visual unit; 57. a third visual element; 58. a turning unit; 60. a wafer; 70. a supply unit; 71. a relay unit; 710. a first relay module; 711. a second relay module; 72. a first pick-and-place unit; 720. a first rotation module; 721. a first suction module; 73. a receiving unit; 74. a second pick-and-place unit; 740. a rotation module; 741. a suction module; 75. a first vision unit; 76. a second visual unit; 77. a third visual element; 80. a wafer.
Detailed Description
The invention is further described with reference to the following figures and examples:
example (b): the present disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the disclosure may be shown and described, and which, when modified and varied by the techniques taught herein, can be made by those skilled in the art without departing from the spirit and scope of the disclosure.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms "a", "an", "the" and "the", as used herein, also include the plural forms.
The terms "first," "second," and the like, as used herein, do not denote any order or importance, nor do they denote any order or importance, but rather are used to distinguish one element from another element or operation described in such technical terms.
As used herein, "connected" or "positioned" refers to two or more elements or devices being in direct physical contact with each other or in indirect physical contact with each other, and may also refer to two or more elements or devices being in operation or acting on each other.
As used herein, the terms "comprising," "including," "having," and the like are open-ended terms that mean including, but not limited to.
As used herein, the term (terms), unless otherwise indicated, shall generally have the ordinary meaning as commonly understood by one of ordinary skill in the art, in this written description and in the claims. Certain words used to describe the disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the disclosure.
The terms "front", "rear", "upper", "lower", "left" and "right" used herein are directional terms, and are used only for describing the positional relationship between the structures, and are not intended to limit the specific direction of the protective reaction and the practical implementation of the present invention.
Referring to fig. 1, a first embodiment of a large-sized wafer bonding apparatus according to the present invention includes a supplying unit 10, a relay unit 11, a first pick-and-place unit 12, a receiving unit 13, a second pick-and-place unit 14, a first vision unit 15, a second vision unit 16, and a third vision unit 17.
The supply unit 10 is provided for at least one wafer 20.
The relay unit 11 is adjacent to the supply unit 10. The relay unit 11 has a first relay module 110 and a second relay module 111. The first relay module 110 has a first relay carrier 1100 and a first relay displacement assembly 1101. The first relay displacement unit 1101 is disposed below the first relay stage 1100. The second relay module 111 has a second relay carrier 1110 and a second relay displacement component 1111. Second relay stage 1110 is disposed above second relay displacement assembly 1111. The first relay displacement unit 1101 rotates the first relay stage 1100 by a set angle. The second relay displacement unit 1111 rotates the second relay stage 1110 by a set angle. The set angle is 90 degrees or 180 degrees.
In addition, the first relay displacement assembly 1101 may further reciprocate the first relay stage 1100 in a lateral direction or a back-and-forth direction. The second relay displacement assembly 1111 can enable the second stage 1110 to reciprocate laterally or back and forth.
The first pick-and-place unit 12 is disposed between the supply unit 10 and the relay unit 11. In the present embodiment, the first pick-and-place unit 12 has at least one first suction module 120. The number of the first suction modules 120 may be single or several.
Referring to fig. 2, the receiving unit 13 is adjacent to the relay unit 11. The receiving unit 13 has a receiving carrier 130 and a receiving displacement module 131. The top end of the receiving carrier 130 is divided into a first area 1300 and a second area 1301. The receiving displacement module 131 is disposed at the bottom end of the receiving carrier 130. The receiving displacement module 131 rotates the receiving stage 130 by a set angle. The set angle is 90 degrees or 180 degrees.
The second pick-and-place unit 14 is disposed between the relay unit 11 and the receiving unit 13. The second receiving unit 14 has a rotating module 140 and at least two sucking modules 141.
The first vision unit 15 is provided above the supply unit 10. The second visual unit 16 is provided above the relay unit 11. The third visual unit 17 is provided above the receiving unit 13.
Referring to fig. 1 again, the first vision unit 15 captures image information of the chip 20 of the supply unit 10 and transmits the image information to the first pick-and-place unit 12.
The first pick-and-place unit 12 enables the first suction module 120 of the first pick-and-place unit 12 to suck the wafer 20 located in the supply unit 10 according to the image information of the first vision unit 15. If the first suction module 120 is single, the first suction module 120 sucks the single wafer 20 located at the supply unit 10. If there are a plurality of first suction modules 120, the first suction module 120 sucks a plurality of wafers 20 located in the supply unit 10. The first suction module 120 moves the wafer 20 to the relay unit 11.
The second vision unit 16 captures the image information of the chip 20 and the relay unit 11 located in the first capture module 120. The first sucking module 120 places the wafer 20 on the relay unit 11 according to the image information of the second vision unit 16.
For example, the first suction module 120 places the wafer 20 on the first relay module 110 of the relay unit 11. Or the first suction module 120 places the wafer 20 in the second relay module 111.
If the first sucking module 120 first places the wafer 20 on the first relay module 110 and the number of wafers 20 of the first relay module 110 reaches a predetermined number, the first relay module 110 and the second relay module 111 exchange positions so that the first sucking module 120 can place the wafer 20 on the second relay module 111.
Or the first sucking module 120 first places the wafer 20 on the second relay module 111, and the number of the wafers 20 in the second relay module 111 reaches a predetermined number, the positions of the first relay module 110 and the second relay module 111 are exchanged, so that the first sucking module 120 can place the wafer 20 on the first relay module 110.
Referring to fig. 3 and 4, if the first relay module 110 is taken as an example, the second vision unit 16 captures image information of the wafer 20 located in the first relay module 110, and if the image information shows that the wafer 20 is not located at the default position of the first relay stage 1100, the first relay displacement assembly 1101 may cause the first relay stage 1100 to move back and forth in a lateral direction or a front-back direction, so as to move the wafer 20 to the default position. Similarly, the second vision unit 16 captures image information of the wafer 20 located on the second relay module 111, and if the image information shows that the wafer 20 is not placed at the default position of the second relay stage 1110, the second relay displacement assembly 1111 can make the second relay stage 1110 move back and forth in a lateral direction or a front-back direction, so as to make the wafer 20 move to the default position.
In another embodiment, referring to fig. 2 and fig. 3, the second vision unit 16 first captures the image information of the first relay carrier 1100 and transmits the image information to the first pick-and-place unit 12, so that the first suction module 120 sucking the wafer 20 can correct the default position of the first suction module relative to the first relay carrier 1100, so that the first relay carrier 1100 can accurately place the wafer 30 at the default position.
The second vision unit 16 captures image information of the chip 20 of the relay unit 11 and the suction module 141 of the second pick-and-place unit 14. The second pick-and-place unit 14 enables the suction module 141 to suck the wafer 20 located in the relay unit 11 according to the image information of the second vision unit 16.
The rotation module 140 moves the suction module 141 having the wafer 20 sucked thereto to the first area 1300 of the receiving unit 13. The rotation module 140 also moves the suction module 141 which has not sucked the wafer to the relay unit 11, so that the suction module 141 sucks the wafer 20 located in the relay unit 11.
The third vision unit 17 captures the image information of the receiving unit 13 and the chip 20 located in the suction module 141. The second pick-and-place unit 14 places the wafer 20 in the first area 1300 according to the image information of the third vision unit 17.
Alternatively, the second pick-and-place unit 14 may place the wafer 20 in the first area 1300 or the second area 1301 according to the image information of the third vision unit 17, which may be set according to the actual situation, and is not limited to the embodiment.
As described above, if the second pick-and-place unit 14 first picks up the wafer 20 located in the first relay module 110, the first pick-and-place unit 12 places the wafer 20 located in the supply unit 10 in the second relay module 111.
After the second pick-and-place unit 14 cannot take the wafer 20 from the first relay module 110, the first relay module 110 and the second relay module 111 exchange positions, so that the second pick-and-place unit 14 takes the wafer 20 located in the second relay module 111, and the first pick-and-place unit 12 places the wafer 20 located in the supply unit 10 in the first relay module 110.
Similarly, if the second pick-and-place unit 14 first picks up the wafer 20 located in the second relay module 111, the first pick-and-place unit 12 places the wafer 20 located in the supply unit 10 in the first relay module 110.
After the second pick-and-place unit 14 cannot take the wafer 20 off from the second relay module 111, the first relay module 110 and the second relay module 111 exchange positions, and the above-mentioned operations of picking and placing the wafer 20 are performed.
When the number of the wafers 1300 in the first area 1300 reaches a predetermined number, the receiving displacement module 131 rotates the receiving carrier 130 by a set angle, so that the second pick-and-place unit 14 can place the wafer 20 in the second area 1301. In the present embodiment, the set angle is 180 degrees.
After the receiving stage 130 rotates to the predetermined angle, if the first relay module 110 is adjacent to the receiving stage 130. The second relay module 111 is adjacent to the supply unit 10. The first relay stage 1100 rotates to a predetermined angle. As previously mentioned, the set angle is 180 degrees. The purpose of the rotation is to align the orientation of the wafer 20 in the first region 1300 and the second region 1301.
The first suction module 120 places the wafer 20 from the supply unit 10 to the second relay module 111. After the wafer 20 of the first relay module 110 has been moved to the receiving stage 130, the first relay stage 1100 of the first relay module 110 rotates back to the state before rotation, and the positions of the first relay module 110 and the second relay module 111 are exchanged, and the second relay stage 1110 of the second relay module 111 rotates to a predetermined angle, so that the second pick-and-place unit 14 can place the wafer 20 in the second area 1301 from the second relay stage 1110 of the second relay module 111.
Referring to fig. 5 and fig. 6, a second embodiment of a large-sized wafer bonding apparatus according to the present invention is shown, which includes a supplying unit 30, a relay unit 31, a first pick-and-place unit 32, a receiving unit 33, a second pick-and-place unit 34, a first vision unit 35, a second vision unit 36 and a third vision unit 37.
The supply unit 30 is provided for at least one wafer 40. The reversing unit 31 is adjacent to the supplying unit 30.
The relay unit 31 is adjacent to the supply unit 30. The relay unit 31 has a first relay module 310 and a second relay module 311. The first relay module 310 has a first relay stage 3100 and a first relay moving element 3101. First relay stage 3100 is located at first relay moving unit 3101. The second relay module 311 has a second relay stage 3110 and a second relay displacement assembly 3111. The second relay displacement unit 3111 is located below the second relay stage 3110.
The first pick-and-place unit 32 is disposed between the supply unit 30 and the relay unit 31. The first pick-and-place unit 32 has a first suction module 320 and a second suction module 321. The first suction module 320 and the second suction module 321 alternately move between the supply unit 30 and the relay unit 31 to alternately place the wafer 40 from the supply unit 30 to the relay unit 31.
The receiving unit 33 is adjacent to the relay unit 31. The receiving unit 33 has a receiving stage 330 and a receiving displacement module 331. The receiving carrier 330 is divided into a first region 3300 and a second region 3301. The receiving displacement module 331 is disposed below the receiving stage 330.
The second pick-and-place unit 34 is disposed between the receiving unit 33 and the relay unit 31. The second pick-and-place unit 34 has a rotating module 340 and at least two sucking modules 341. At least two suction modules 341 are disposed on the rotating module 340.
The first vision unit 35 is located above the supply unit 30. The second vision unit 36 is located above the relay unit 31. The third visual unit 37 is located above the receiving unit 33.
Referring to fig. 5 and 6, the first vision unit 35 captures image information of the wafer 40 located in the supply unit 30 and transmits the image information to the first pick-and-place unit 32. The first sucking module 320 and the second sucking module 321 alternately suck the wafer 40 in the supply unit 30 according to the image information.
The second vision unit 36 captures the image information of the relay unit 31 and transmits the image information to the first pick-and-place unit 32 and the second pick-and-place unit 34.
For example, if the first relay module 310 is adjacent to the supply unit 30, the first pick-and-place unit 32 first places the wafer 30 on the first relay module 310. Assuming that the second relay module 311 is adjacent to the supply unit 30, the first pick-and-place unit 32 places the wafer 30 on the second relay module 311.
In the embodiment, the first pick-and-place unit 33 sequentially places the wafer 40 on the first relay unit 310 by the first sucking module 330 and the second sucking module 331 according to the image information of the second vision unit 37.
When the number of wafers 310 of the first relay unit 310 reaches a predetermined number, the first relay module 310 and the second relay module 311 exchange positions.
The second pick-and-place unit 34 is used for enabling the suction module 341 to suck the wafer 40 of the first relay module 310 of the relay unit 31 according to the image information of the second vision unit 36. The rotating module 340 rotates the suction module 341 sucking the wafer 40 so that the suction module 341 is positioned above the receiving unit 33. Meanwhile, another suction module 341 which does not suck the wafer 40 is rotated above the first relay module 310 of the relay unit 31 by the rotation module 340, so that the suction module 341 sucks the wafer 40 located at the first relay module 310 of the relay unit 31.
The third vision unit 37 captures the image information of the suction module 341 sucking the chip 40 and the receiving unit 33. The image information is transmitted to the second pick-and-place unit 34. The second pick-and-place unit 34 enables the suction module 341 to place the wafer 40 in the first region 3300 of the receiving unit 33 according to the image information of the third vision unit 37.
For example, referring to fig. 6, if the second pick-and-place unit 34 places the wafers 40 in the first area 3300, when the number of the wafers 40 in the first area 3300 reaches a predetermined number or is in a saturated state, the receiving displacement module 331 rotates the receiving carrier 330 by a predetermined angle, where the predetermined angle is 180 degrees. The purpose of rotating the receiving stage 330 is to enable the second pick-and-place unit 34 to place the wafer 40 in the second area 3301.
When the receiving stage 330 rotates 180 degrees, if the second relay module 311 is adjacent to the receiving unit 33. The second relay stage 3111 rotates the second relay stage 3110 by 180 degrees.
If the first relay module 310 is adjacent to the receiving unit 33. First relay displacement assembly 3101 rotates first relay stage 3100 by 180 degrees.
As described above, when the second relay stage 3111 has rotated by the same predetermined angle as the receiving stage 330, the direction of the wafer 40 positioned on the second relay stage 3111 coincides with the direction of the wafer 40 positioned on the receiving stage 330. Whereby the orientation of wafer 40 in second region 3301 can be aligned with the orientation of wafer 40 in first region 3300 when wafer 40 is placed in second region 3301.
Referring to fig. 7 and 8, a third embodiment of a large-sized wafer bonding apparatus according to the present invention is shown, which includes a supplying unit 50, a relay unit 51, a first pick-and-place unit 52, a receiving unit 53, a second pick-and-place unit 54, a first vision unit 55, a second vision unit 56, a third vision unit 57, and a turning unit 58.
The supply unit 50 is provided for at least one wafer 60.
The relay unit 51 is adjacent to the supply unit 50. The relay unit 51 has a first relay module 510 and a second relay module 511. The first relay module 510 has a first relay carrier 5100 and a first relay mobile assembly 5101. The first relay stage 5100 is provided above the first relay moving assembly 5101. The second relay module 511 has a second relay carrier 5110 and a second relay moving assembly 5111. The second relay moving assembly 5111 is located below the second relay stage 5110.
The first pick-and-place unit 52 is located between the relay unit 51 and the supply unit 50. The first pick-and-place unit 52 has at least one first suction module 520.
The receiving unit 53 is adjacent to the relay unit 51. The receiving unit 53 has a receiving stage 530 and a receiving displacement module 531. The receiving carrier 530 is divided into a first area 5300, a second area 5301, a third area 5302, and a fourth area 5303. The receiving shift module 531 is disposed below the receiving stage 530.
The second pick-and-place unit 54 is located between the relay unit 51 and the receiving unit 53. The second pick-and-place unit 54 has a rotating module 540 and at least one sucking module 541. The suction module 541 is provided at the rotation module 540.
The first vision unit 55 is located above the supply unit 50. The second visual unit 56 is provided above the relay unit 51. The third visual unit 57 is provided above the receiving unit 53.
The flipping unit 58 is located between the first pick-and-place unit 52 and the relay unit 51.
Referring to fig. 7 and 8, the first vision unit 55 captures image information of the wafer 60 located in the supply unit 50 and transmits the image information to the first pick-and-place unit 52. The first sucking module 520 sucks the wafer 60 located in the supply unit 50 according to the image information. The first suction module 520 moves the wafer 60 from the supply unit 50 to the flipping unit 58.
The flipping unit 58 receives the wafer 60 and flips the wafer 60 by an angle. If the first relay module 510 is adjacent to the flipping unit 58, the flipping unit 58 places the wafer 60 on the first relay module 510. If the second relay module 511 is adjacent to the flipping unit 58, the flipping unit 58 places the wafer 60 on the second relay module 511.
In the present embodiment, the first relay module 510 is adjacent to the flipping unit 58. The flipping unit 58 places the flipped wafer 60 on the first relay module 510. After the predetermined number of wafers 60 to be positioned at the first relay module 510 has been reached, the first relay module 510 and the second relay module 511 exchange positions so that the flipping unit 58 places the wafers 60 at the second relay module 511.
Referring to fig. 8 again, the second relay module 511 is adjacent to the receiving unit 53. The second vision unit 56 captures the image information of the chip 60 and the suction module 541 located in the second relay module 511, and transmits the image information to the second pick-and-place unit 541, so that the suction module 541 sucks the chip 60 located in the second relay module 511.
The rotation module 540 rotates the suction module 541 having sucked the wafer 60 to above the receiving stage 530.
The third vision unit 57 captures the image information of the receiving stage 530 and the wafer 60 located in the suction module 541, and transmits the image information to the second pick-and-place unit 54.
The second pick-and-place unit 54 places the wafer 60 on any one of the regions of the receiving stage 530, such as the first region 5300, the second region 5301, the third region 5302, or the fourth region 5303, according to the image information.
Referring to fig. 9, if the number of the wafers 60 placed in any one of the areas reaches a predetermined number, the receiving carrier 530 is rotated by the receiving displacement module 531 by a predetermined angle, which may be 90 degrees.
As shown in fig. 9, the second relay module 511 rotates by a predetermined angle as the receiving stage 530. The second pick-and-place unit 54 moves the wafer 60 from the second relay module 511 to the receiving unit 53.
In one embodiment, for example, the second pick-and-place unit 54 first places the wafer 60 in the first region 5300. After the receiving turntable 530 rotates to a predetermined angle, the second pick-and-place unit 54 may place the wafer 60 in at least any one of the second area 5301, the third area 5302, or the fourth area 5303.
In another embodiment, the second pick-and-place unit 54 first places the wafer 60 in the second area 5301 or the third area 5302, and after the receiving turntable 530 rotates to a predetermined angle, the second pick-and-place unit 54 can place the wafer 60 in at least one of the first area 5300 or the fourth area 5303.
Referring to fig. 10, a fourth embodiment of a large-scale wafer bonding apparatus according to the present invention is shown, which includes a supplying unit 70, a relay unit 71, a first pick-and-place unit 72, a receiving unit 73, a second pick-and-place unit 74, a first vision unit 75, a second vision unit 76, a third vision unit 77 and a turning unit 78.
In the present embodiment, the supply unit 70, the relay unit 71, the first pick-and-place unit 72, the receiving unit 73, the second pick-and-place unit 74, the first vision unit 75, the second vision unit 76, the third vision unit 77 and the turning unit 78 are arranged as in the third embodiment, and therefore, the description thereof is omitted for brevity.
In the present embodiment, the first pick-and-place unit 72 has a first rotating module 720 and at least one first suction module 721. The first suction module 721 is located at the first rotation module 720.
As shown in fig. 10, the first suction module 721 of the first pick-and-place unit 72 sucks the wafer 80 located at the supply unit 70. The first pick-and-place unit 72 places the wafer 80 on the flipping unit 78.
The flipping unit 78 is used to flip the wafer 80 and place the wafer 80 on the relay unit 71, and if the first relay module 710 is adjacent to the flipping unit 78, the flipping unit 78 places the wafer 80 on the first relay unit 710. If the second relay module 711 is adjacent to the flipping unit 78, the flipping unit 78 places the wafer 80 on the second relay module 711.
As shown in fig. 10, the flipping unit 78 places the wafer 80 in the first relay module 710. After the predetermined number of wafers 80 of the first relay module 710 has been reached, the first relay module 710 exchanges positions with the second relay module 711 so that the flipping unit 78 places the wafer 80 in the second relay module 711.
As shown in fig. 10, the second relay module 711 is adjacent to the receiving unit 73. The suction module 741 of the second pick-and-place unit 74 sucks the wafer 80 located at the second relay module 711. The rotation module 740 moves the suction module 741 having the wafer 80 above the receiving unit 73 so that the suction module 741 places the wafer 80 on the receiving unit 80.
In summary, the receiving unit is divided into several areas, and then the chip is placed in any one of the several areas. If the wafers in the placing area are saturated or reach the default number, the receiving unit rotates a predetermined angle, and after the wafers are placed in the relay unit, the relay unit rotates the same angle as the receiving unit, so that the placing angles of all the wafers can be consistent when the wafers are placed in the receiving unit. The receiving unit and the relay unit rotate by the same angle in sequence, so that the wafers placed in sequence can be consistent, the conveying speed of the wafers is increased, and the accuracy is improved.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (14)
1. A large-sized wafer bonding apparatus; the method is characterized in that:
comprises the following steps:
a supply unit;
a relay unit adjacent to the supply unit;
the first taking and placing unit is positioned between the relay unit and the supply unit;
a receiving unit adjacent to the relay unit; and
the second taking and placing unit is positioned between the relay unit and the receiving unit;
wherein, the supply unit is provided for at least one wafer; the receiving unit rotates a preset angle; the first taking and placing unit is used for placing at least one wafer on the relay unit, and the relay unit rotates by the preset angle; the second picking and placing unit is used for placing the wafer into the receiving unit through the relay unit.
2. The wafer bonding apparatus according to claim 1, wherein: the relay unit is provided with a first relay module and a second relay module, the first relay module and the second relay module are used for the first picking and placing unit to place the wafer, and after the wafer reaches a preset number in the first relay module, the first relay module and the second relay module exchange positions so that the first picking and placing unit places the wafer in the second relay module.
3. The wafer bonding apparatus according to claim 2, wherein: the first relay module is provided with a first relay carrying platform and a first relay moving assembly, the first relay moving assembly is positioned below the first relay carrying platform, the second relay module is provided with a second relay carrying platform and a second relay moving assembly, and the second relay carrying platform is positioned above the second relay moving assembly.
4. The wafer bonding apparatus according to claim 1, wherein: further, a first vision unit is positioned above the supply unit.
5. The wafer bonding apparatus according to claim 1, wherein: and a second vision unit located above the relay unit.
6. The wafer bonding apparatus according to claim 1, wherein: and a third visual unit located above the engaging unit.
7. The wafer bonding apparatus according to claim 1, wherein: the first picking and placing unit is provided with at least one first suction module.
8. The wafer bonding apparatus according to claim 7, wherein: the first pick-and-place unit further comprises at least one second suction module.
9. The wafer bonding apparatus according to claim 1, wherein: the first taking and placing unit is provided with a first rotating module and at least one first sucking module, and the at least one first sucking module is arranged on the first rotating module.
10. The wafer bonding apparatus according to claim 1, wherein: the second taking and placing unit is provided with a rotating module and at least one sucking module, and the at least one sucking module is arranged on the rotating module.
11. The wafer bonding apparatus according to claim 1, wherein: and the overturning unit is positioned between the first taking and placing unit and the relay unit.
12. The wafer bonding apparatus according to claim 1, wherein: the joint unit is provided with a joint carrying platform and a receiving displacement module, and the receiving displacement module is arranged below the joint carrying platform.
13. The wafer bonding apparatus according to claim 12, wherein: the bonding carrier has a first area and a second area.
14. The wafer bonding apparatus according to claim 12, wherein: the bonding carrier has a first area, a second area, a third area and a fourth area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910799369.6A CN110690152A (en) | 2019-08-28 | 2019-08-28 | Large-size wafer bonding device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910799369.6A CN110690152A (en) | 2019-08-28 | 2019-08-28 | Large-size wafer bonding device |
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| CN110690152A true CN110690152A (en) | 2020-01-14 |
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Application publication date: 20200114 |