TWI564090B - Film forming method and film forming apparatus - Google Patents
Film forming method and film forming apparatus Download PDFInfo
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- TWI564090B TWI564090B TW103140645A TW103140645A TWI564090B TW I564090 B TWI564090 B TW I564090B TW 103140645 A TW103140645 A TW 103140645A TW 103140645 A TW103140645 A TW 103140645A TW I564090 B TWI564090 B TW I564090B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
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Description
本發明係有關一種利用在基板塗佈液滴化的膜材料並使其硬化的方式來形成膜之方法、及膜形成裝置。 The present invention relates to a method of forming a film by coating and solidifying a film material which is dropletized on a substrate, and a film forming apparatus.
熟知有從噴嘴頭(噴墨頭)吐出液狀的薄膜材料，從而在基板的表面形成薄膜之技術(例如，專利文獻1)。薄膜材料方面，使用光硬化性樹脂(例如，紫外線硬化性樹脂)。利用對附著於基板上之薄膜材料照射硬化用的光之方式，使薄膜材料硬化而形成薄膜。 A technique of forming a film on the surface of a substrate by discharging a liquid film material from a nozzle head (inkjet head) is known (for example, Patent Document 1). As the film material, a photocurable resin (for example, an ultraviolet curable resin) is used. The film material is cured to form a film by irradiating the film material attached to the substrate with light for curing.
在專利文獻2所揭示的方法中，首先，藉由使液滴化之薄膜材料彈著於待形成薄膜之區域的邊緣，從而形成邊緣圖案。在形成邊緣圖案後，利用使薄膜材料彈著於待形成薄膜之區域的內側的方式，用液狀的薄膜材料覆蓋待形成薄膜之區域。之後，藉由對液狀的薄膜材料照射硬化用的光，從而使薄膜材料硬化。 In the method disclosed in Patent Document 2, first, an edge pattern is formed by causing a dropletized film material to be bounced on an edge of a region where a film is to be formed. After the edge pattern is formed, the area of the film to be formed is covered with a liquid film material in such a manner that the film material is bounced on the inner side of the area where the film is to be formed. Thereafter, the liquid film material is irradiated with light for curing to cure the film material.
邊緣圖案堤擋住液狀的薄膜材料的流動。在待形成薄膜之區域的內側，彈著於基板表面之薄膜材料存 橫方向上連續，從而形成表面平坦的液狀的被覆膜。當表面變得平坦後，由於薄膜材料硬化，從而能夠形成表面平坦的薄膜。 The edge pattern bank blocks the flow of the liquid film material. On the inner side of the area where the film is to be formed, the film material impinging on the surface of the substrate remains The film is continuous in the lateral direction to form a liquid coating film having a flat surface. When the surface becomes flat, since the film material is hardened, a film having a flat surface can be formed.
〔專利文獻1〕日本特許第3544543號公報 [Patent Document 1] Japanese Patent No. 3544543
〔專利文獻2〕國際公開第2013/011775號專利公報 [Patent Document 2] International Publication No. 2013/011775
大電流用的厚銅基板的銅膜厚度為50μm~2mm左右。為了形成厚銅基板的銅膜，需要使絕緣膜之厚度達到與銅膜厚度相同之程度。使用以往的噴嘴頭之薄膜形成方法中，若形成如此厚的膜，則膜的側面會傾斜，其斜面會變緩。本發明的目的在於提供一種即使增加膜厚，側面的傾斜亦不易變緩之膜形成方法、及膜形成裝置。 The thickness of the copper film of the thick copper substrate for large current is about 50 μm to 2 mm. In order to form a copper film of a thick copper substrate, it is necessary to make the thickness of the insulating film to the same extent as the thickness of the copper film. In the film forming method using the conventional nozzle head, when such a thick film is formed, the side surface of the film is inclined, and the inclined surface thereof becomes gentle. An object of the present invention is to provide a film forming method and a film forming apparatus which are less likely to be gentle in the inclination of the side surface even if the film thickness is increased.
根據本發明之一觀點，提供一種一種膜形成方法，具有：形成製程，沿著基板的表面之待塗佈膜材料的被塗佈區域的邊緣，使膜材料液滴化後進行塗佈並使其硬化，從而先形成外緣部，之後，藉由在比前述外緣部更靠內側， 使前述膜材料液滴化後進行塗佈並使其硬化來形成內側部，由此形成利用前述外緣部及前述內側部所構成且上表面凹陷之單元層；以及堆積製程，在前述單元層之上進一步堆積分別由前述外緣部及前述內側部構成之其他單元層，且維持最上層的單元層的上表面呈凹陷形狀。 According to an aspect of the present invention, there is provided a film forming method comprising: forming a process, coating an edge of a coated region of a film material to be coated along a surface of a substrate, and coating the film material after droplet formation It hardens to form the outer edge portion first, and then, on the inner side than the outer edge portion, The film material is dropletized, coated, and cured to form an inner portion, thereby forming a unit layer formed by the outer edge portion and the inner portion and having an upper surface recessed; and a stacking process in the unit layer Further, the other unit layers each composed of the outer edge portion and the inner portion are further stacked, and the upper surface of the unit layer that maintains the uppermost layer has a concave shape.
根據本發明的另一觀點，提供一種膜形成裝置，具有：載物台，係保持基板；噴嘴頭，係與保持在前述載物台之前述基板對向，具有把光硬化性膜材料予以液滴化後吐出到前述基板的表面之複數個噴嘴孔；光源，係對塗佈於前述基板之前述膜材料照射硬化用的光；移動機構，係使前述基板相對於前述噴嘴頭及前述光源做相對移動；以及控制裝置，係控制前述噴嘴頭及前述移動機構；前述控制裝置控制前述噴嘴頭及前述移動機構，沿著前述基板的表面的被塗佈區域的邊緣，使前述膜材料液滴化後進行塗佈並使其硬化，來先形成外緣部，之後，藉由在比前述外緣部更靠內側，把前述膜材料予以液滴化後進行塗佈並使其硬化來形成內側部，由此來形成利用前述外緣部及前述內側部所構成且上表面凹陷之單元層， 在前述單元層之上，進一步堆積分別利用前述外緣部及內側部所構成之其他單元層，且維持最上層的單元層的上表面呈凹陷形狀。 According to another aspect of the present invention, a film forming apparatus includes: a carrier that holds a substrate; and a nozzle head that is opposed to the substrate held by the stage and has a liquid curable film material a plurality of nozzle holes that are discharged onto the surface of the substrate after the dropletization; a light source that irradiates the film material coated on the substrate with light for curing; and a moving mechanism that causes the substrate to be opposed to the nozzle head and the light source a relative movement; and a control device that controls the nozzle head and the moving mechanism; the control device controls the nozzle head and the moving mechanism to dropletize the film material along an edge of a coated region on a surface of the substrate After coating and hardening, the outer edge portion is formed first, and then the film material is dropletized on the inner side than the outer edge portion, and then coated and hardened to form the inner portion. Thereby, a unit layer formed by the outer edge portion and the inner portion and having an upper surface recessed is formed, On the unit layer, another unit layer formed by the outer edge portion and the inner portion is further deposited, and the upper surface of the unit layer that maintains the uppermost layer has a concave shape.
在形成外緣部之後形成內側部，由此形成內側部時被塗佈之膜材料不會流出外緣部的外側。由於單元層的上表面凹陷，在單元層之上形成外緣部時，能夠減少向外側流出之膜材料的量。由此，即使增加膜厚，亦能夠抑制膜的側面變緩。 The inner portion is formed after the outer edge portion is formed, whereby the film material to be coated does not flow out of the outer side portion of the outer edge portion when the inner portion is formed. Since the upper surface of the unit layer is recessed, when the outer edge portion is formed on the unit layer, the amount of the film material flowing out to the outside can be reduced. Thereby, even if the film thickness is increased, the side surface of the film can be suppressed from becoming gentle.
10‧‧‧基台 10‧‧‧Abutment
11‧‧‧移動機構 11‧‧‧Mobile agencies
12‧‧‧載物台 12‧‧‧stage
20‧‧‧噴嘴頭 20‧‧‧Nozzle head
21‧‧‧噴嘴單元 21‧‧‧Nozzle unit
22‧‧‧基底板 22‧‧‧Base plate
23‧‧‧噴嘴孔 23‧‧‧Nozzle hole
24‧‧‧硬化用光源 24‧‧‧ Hardening light source
30‧‧‧控制裝置 30‧‧‧Control device
50‧‧‧基板 50‧‧‧Substrate
52‧‧‧被塗佈區域 52‧‧‧coated area
53‧‧‧像素 53‧‧‧ pixels
53a‧‧‧形成外緣部時的塗佈對象的像素 53a‧‧‧Pixels to be coated when forming the outer edge
53b‧‧‧形成內側部時的塗佈對象的像素 53b‧‧‧Pixels to be coated when the inner part is formed
55‧‧‧外緣部 55‧‧‧The outer edge
55a‧‧‧外緣部的一部分 Part of the outer edge of 55a‧‧
56‧‧‧內側部 56‧‧‧ inside part
56a‧‧‧內側部的一部分 Part of the inner part of 56a‧‧
57‧‧‧單元層 57‧‧‧Unit level
58‧‧‧平坦化層 58‧‧‧Destivation layer
60‧‧‧膜 60‧‧‧ film
61‧‧‧膜材料 61‧‧‧membrane material
63‧‧‧配置厚銅之區域 63‧‧‧A zone with thick copper
64‧‧‧厚銅 64‧‧‧ thick copper
〔圖1〕圖1為實施例之膜形成裝置的概略圖。 Fig. 1 is a schematic view showing a film forming apparatus of an embodiment.
〔圖2〕圖2A為包含實施例之膜形成裝置的噴嘴頭之噴嘴單元的立體圖；圖2B為噴嘴單元的仰視圖。 2] Fig. 2A is a perspective view of a nozzle unit including a nozzle head of the film forming apparatus of the embodiment; and Fig. 2B is a bottom view of the nozzle unit.
〔圖3〕圖3為實施例之膜形成裝置的載物台及噴嘴單元的俯視圖。 Fig. 3 is a plan view showing a stage and a nozzle unit of the film forming apparatus of the embodiment.
〔圖4〕圖4A為表示形成膜時待塗佈膜材料之區域(被塗佈區域)的平面形狀的一部分之俯視圖；圖4B為表示定義被塗佈區域的形狀之圖像資料的一部分之圖。 4] FIG. 4A is a plan view showing a part of a planar shape of a region (coated region) of a film material to be coated when a film is formed; and FIG. 4B is a view showing a part of image data defining a shape of a coated region. Figure.
〔圖5〕圖5A為表示形成外緣部時，成為塗佈膜材料對象之像素之圖；圖5B~圖5D為形成外緣部之製程的中途階段、及形成後的基板及外緣部的剖視圖。 [ Fig. 5] Fig. 5A is a view showing a pixel to be coated with a coating material when forming an outer edge portion; and Figs. 5B to 5D are a middle stage of a process for forming an outer edge portion, and a substrate and an outer edge portion after formation Cutaway view.
〔圖6〕圖6A為表示形成內側部時，成為塗佈膜材料對象之像素之圖；圖6B~圖6C為形成內側部之製程的中途階段、及形成後的基板、外緣部及內側部的剖視圖。 6A is a view showing a pixel to be coated with a coating material when forming an inner portion; and FIGS. 6B to 6C are a middle stage of a process for forming an inner portion, and a substrate, an outer edge portion, and an inner side after formation. Sectional view of the section.
〔圖7〕圖7A~圖7D為形成膜之製程的中途階段、及形成後的基板及膜的剖視圖。 7A to 7D are cross-sectional views showing a middle stage of a process for forming a film and a substrate and a film after formation.
〔圖8〕圖8A~圖8F為用於說明實施例之膜形成方法的效果，也就是膜形成的中途階段之基板及膜的剖視圖。 [Fig. 8] Figs. 8A to 8F are cross-sectional views for explaining the effects of the film forming method of the embodiment, that is, the substrate and the film in the middle of film formation.
〔圖9〕圖9A及圖9B為用於說明製造厚銅基板之方法，也就是製造中途階段之厚銅基板的剖視圖。 [Fig. 9] Figs. 9A and 9B are cross-sectional views for explaining a method of manufacturing a thick copper substrate, that is, a thick copper substrate in the middle of manufacture.
於圖1，表示實施例之膜形成裝置的概略圖。在基台10之上介隔著移動機構11支撐載物台12。定義x軸及y軸朝向水平方向，z軸朝向垂直往上方之xyz直角坐標系。移動機構11藉由控制裝置30被控制，使載物台12移動在x方向及y方向。 Fig. 1 is a schematic view showing a film forming apparatus of an embodiment. The stage 12 is supported on the base 10 via a moving mechanism 11. Define the x-axis and y-axis toward the horizontal direction, and the z-axis toward the vertical upward xyz rectangular coordinate system. The moving mechanism 11 is controlled by the control device 30 to move the stage 12 in the x direction and the y direction.
在載物台12的上表面(保持面)上保持有待形成膜之基板50。基板50係例如藉由真空夾盤被固定在載物台12。在載物台12的上方，噴嘴頭20支撐成可以升降。噴嘴頭20具有與基板50對向之複數個噴嘴孔。從各噴嘴孔朝向基板50的表面吐出被液滴化之光硬化性(例如紫外線硬化性)的膜材料。藉由控制裝置30控制薄膜材料的吐出。 A substrate 50 on which a film is to be formed is held on the upper surface (holding surface) of the stage 12. The substrate 50 is fixed to the stage 12 by, for example, a vacuum chuck. Above the stage 12, the nozzle head 20 is supported to be movable up and down. The nozzle head 20 has a plurality of nozzle holes that face the substrate 50. A film material that is droplet-formed by photocurability (for example, ultraviolet curability) is discharged from the nozzle holes toward the surface of the substrate 50. The discharge of the film material is controlled by the control device 30.
在圖1表示了使噴嘴頭20相對於基台10靜止，並使基板50移動之例；但亦可以使基板50相對於基台10靜止，並使噴嘴頭20移動。如此，亦可以構成為，使基板50及噴嘴頭20中其中一方相對於另一方做相對移動。 FIG. 1 shows an example in which the nozzle head 20 is stationary with respect to the base 10 and the substrate 50 is moved. However, the substrate 50 may be stationary with respect to the base 10 and the nozzle head 20 may be moved. In this manner, one of the substrate 50 and the nozzle head 20 may be relatively moved relative to the other.
於圖2A表示包括噴嘴頭20之噴嘴單元21的立體圖。在基底板22沿y方向排列安裝有複數個、例如2個噴嘴頭20。每個噴嘴頭20具有沿x方向排列之複數個噴嘴孔23。在y方向相鄰之2個噴嘴頭20之間、及比兩端的噴嘴頭20更靠外側分別安裝有硬化用光源24。硬化用光源24對塗佈於基板50(圖1)之膜材料照射硬化用的光(例如，紫外線)。 A perspective view of the nozzle unit 21 including the nozzle head 20 is shown in Fig. 2A. A plurality of, for example, two nozzle heads 20 are mounted on the base plate 22 in the y direction. Each nozzle head 20 has a plurality of nozzle holes 23 arranged in the x direction. A curing light source 24 is attached to each of the two nozzle heads 20 adjacent in the y direction and to the outside of the nozzle heads 20 at both ends. The curing light source 24 irradiates the film material applied to the substrate 50 (FIG. 1) with light (for example, ultraviolet light) for curing.
於圖2B，表示出噴嘴單元21的仰視圖。2個噴嘴頭20沿y方向排列配置。在2個噴嘴頭20之間、及比最外側的噴嘴頭20更靠外側分別配置有硬化用光源24。每個噴嘴頭20的噴嘴孔23沿x方向交錯排列。若著眼於1個噴嘴頭20，則作為其中一例，在x方向上以相當於300dpi之間距配置有噴嘴孔23。其中一個噴嘴頭20相對於另一個噴嘴頭20配置為沿x方向錯開半個噴嘴間距。因此，2個噴嘴頭20的噴嘴孔23全部在x方向上以相當於600dpi之間距配置。 In Fig. 2B, a bottom view of the nozzle unit 21 is shown. The two nozzle heads 20 are arranged side by side in the y direction. The curing light source 24 is disposed between the two nozzle heads 20 and outside the outermost nozzle head 20. The nozzle holes 23 of each nozzle head 20 are staggered in the x direction. When one nozzle head 20 is focused on, as an example, the nozzle hole 23 is disposed in the x direction at a distance of 300 dpi. One of the nozzle heads 20 is configured relative to the other nozzle head 20 to be offset by a half nozzle pitch in the x direction. Therefore, the nozzle holes 23 of the two nozzle heads 20 are all arranged at an interval of 600 dpi in the x direction.
圖3中示出載物台12、基板50及噴嘴單元21的俯視圖。載物台12的保持面上保持有基板50。基板50的上方支撐有噴嘴單元21。噴嘴單元21的基底板22 安裝有噴嘴頭20及硬化用光源24。利用由控制裝置30控制移動機構11的方式，使載物台12向x方向及y方向移動。 FIG. 3 shows a plan view of the stage 12, the substrate 50, and the nozzle unit 21. The substrate 50 is held on the holding surface of the stage 12. A nozzle unit 21 is supported above the substrate 50. Base plate 22 of nozzle unit 21 The nozzle head 20 and the curing light source 24 are mounted. The stage 12 is moved in the x direction and the y direction by the control device 30 controlling the moving mechanism 11.
控制裝置30中記憶有定義待形成膜的平面形狀之圖像資料。圖像資料例如包括二維排列之複數個像素。控制裝置30依據該圖像資料來控制從噴嘴頭20吐出膜材料的時機。 The image data defining the planar shape of the film to be formed is stored in the control device 30. The image data includes, for example, a plurality of pixels arranged in two dimensions. The control device 30 controls the timing of discharging the film material from the nozzle head 20 in accordance with the image data.
藉由使基板50向y方向移動之同時，從噴嘴孔23(圖2B)使膜材料液滴化後吐出，能夠在x方向上以600dpi的解析度將膜材料塗佈於基板50。塗佈於基板50之膜材料藉由從位於基板50的移動方向的前方之硬化用光源24發射之光而硬化。將使基板50向y方向移動之同時，從噴嘴孔23使膜材料液滴化後吐出之處理稱為「基板的掃描」。藉由使基板50沿x方向錯開相當於600dpi之間隔的1/4而進行4次基板的掃描，能夠在x方向上以2400dpi的解析度將膜材料塗佈於基板50。4次基板的掃描中，可以進行單向掃描，亦可以進行往復掃描。 By moving the substrate 50 in the y direction, the film material is dropletized from the nozzle holes 23 (FIG. 2B) and discharged, and the film material can be applied to the substrate 50 at a resolution of 600 dpi in the x direction. The film material applied to the substrate 50 is hardened by light emitted from the curing light source 24 located in front of the moving direction of the substrate 50. The process of ejecting the film material from the nozzle holes 23 after the substrate 50 is moved in the y direction is referred to as "scanning of the substrate". By scanning the substrate four times in the x direction by 1/4 of the interval of 600 dpi in the x direction, the film material can be applied to the substrate 50 at a resolution of 2400 dpi in the x direction. Scanning of the fourth substrate In one-way scanning, one-way scanning can also be performed, and reciprocal scanning can also be performed.
將能夠藉由4次基板的掃描塗佈膜材料之區域作為1個路徑(通路)。1個路徑的x方向的寬度比基板50的x方向的尺寸窄時，藉由將基板50的表面劃分為複數個路徑，能夠將膜材料塗佈於基板50的整個區域。 The region where the film material can be applied by scanning the substrate four times is used as one path (passage). When the width of the x-direction of one path is narrower than the dimension of the substrate 50 in the x direction, the film material can be applied to the entire region of the substrate 50 by dividing the surface of the substrate 50 into a plurality of paths.
待形成膜所要求之解析度為600dpi時，能夠以1次基板的掃描完成1個路徑的處理。並且，若使用具有相當於2400dpi之噴嘴間距之噴嘴頭20，則能夠以1次 基板的掃描完成1個路徑的處理。 When the resolution required for forming a film is 600 dpi, the processing of one path can be completed by scanning one substrate. Moreover, if the nozzle head 20 having a nozzle pitch equivalent to 2400 dpi is used, it can be used once. The scanning of the substrate completes the processing of one path.
於圖4A表示形成膜時待塗佈膜材料之區域(被塗佈區域)的平面形狀的一部分。在基板50的表面，劃定有朝y方向延伸之複數個被塗佈區域52。藉由將膜材料塗佈於該被塗佈區域52並使其硬化，從而形成膜。另外，被塗佈區域52可以是朝x方向延伸之條紋狀的形狀，或相對於x方向及y方向朝傾斜方向延伸之條紋狀的形狀，或沿著曲線之條紋狀的形狀，或不定形。 Fig. 4A shows a part of the planar shape of the region (coated region) of the film material to be coated when the film is formed. On the surface of the substrate 50, a plurality of coated regions 52 extending in the y direction are defined. The film is formed by applying a film material to the coated region 52 and hardening it. Further, the coated region 52 may have a stripe shape extending in the x direction, a stripe shape extending in the oblique direction with respect to the x direction and the y direction, or a stripe shape along a curve, or an amorphous shape. .
於圖4B表示出定義被塗佈區域52之圖像資料之一例。該圖像資料利用二維(x方向及y方向)排列之複數個像素53所構成。複數個像素53劃分為塗佈膜材料對象的像素，及非塗佈膜材料對象的像素。圖4B中，塗佈膜材料對象的像素53帶有陰影線。藉由圖4B的帶有陰影線之像素53的集合，定義被塗佈區域52。 An example of image data defining the coated region 52 is shown in Fig. 4B. The image data is composed of a plurality of pixels 53 arranged in two dimensions (x direction and y direction). The plurality of pixels 53 are divided into pixels of a coating film material object and pixels of a non-coated film material object. In Fig. 4B, the pixels 53 of the coated film material object are hatched. The coated area 52 is defined by the set of hatched pixels 53 of Figure 4B.
參閱圖5A~圖7D，對實施例之膜形成方法進行說明。實施例之膜形成方法中，藉由堆積具有相同平面形狀之單元層，形成厚度為50μm~2mm左右的膜。該厚度屬於所謂「厚膜」之範圍。在單元層的各形成製程中，首先形成外緣部，之後形成內側部。圖5A~圖6C係表示形成1個單元層之製程，其中圖5A~圖5D係表示形成外緣部之製程，圖6A~圖6C係表示形成內側部之製程。圖7A~圖7D係表示形成第2層以後的單元層之製程。 A film forming method of the embodiment will be described with reference to Figs. 5A to 7D. In the film formation method of the embodiment, a film having a thickness of 50 μm to 2 mm is formed by stacking unit layers having the same planar shape. This thickness falls within the scope of the so-called "thick film". In each formation process of the unit layer, the outer edge portion is first formed, and then the inner portion is formed. 5A to 6C show a process of forming one unit layer, wherein FIGS. 5A to 5D show a process of forming an outer edge portion, and FIGS. 6A to 6C show processes for forming an inner portion. 7A to 7D show processes for forming a cell layer after the second layer.
於圖5A表示形成外緣部時成為塗佈膜材料對象之像素53a。圖5A中，塗佈對象的像素53a帶有陰影 線。形成外緣部時，可選擇沿著被塗佈區域52的邊緣之一排的像素53a作為塗佈對象。另外，亦可以選擇相鄰之多排的像素53作為塗佈對象。 Fig. 5A shows a pixel 53a which is a target of a coating film material when the outer edge portion is formed. In FIG. 5A, the pixel 53a of the coated object is shaded. line. When the outer edge portion is formed, the pixel 53a along one of the edges of the coated region 52 may be selected as a coating target. Alternatively, a plurality of adjacent rows of pixels 53 may be selected as a coating target.
如圖5B所示，藉由掃描基板50，將膜材料塗佈於圖5A所示之塗佈對象的像素53a並使其硬化。由此，形成外緣部的下層的一部分55a。依據噴嘴孔23(圖2B)的間距及塗佈對象的像素53a的間距來決定基板50的掃描次數。 As shown in FIG. 5B, by scanning the substrate 50, the film material is applied to the pixel 53a of the application target shown in FIG. 5A and hardened. Thereby, a part 55a of the lower layer of the outer edge portion is formed. The number of scans of the substrate 50 is determined in accordance with the pitch of the nozzle holes 23 (Fig. 2B) and the pitch of the pixels 53a to be coated.
如圖5C所示，在外緣部的一部分55a之上，藉由進一步塗佈膜材料並使其硬化，從而使外緣部的一部分55a變高。圖5B所示之掃描基板50時的塗佈對象的像素53a與圖5C所示之掃描基板50時的塗佈對象的像素53a相同。亦即，在外緣部的一部分55a的正上方重新塗佈膜材料。 As shown in FIG. 5C, a portion of the outer edge portion 55a is made higher by coating the film material and hardening it on a portion 55a of the outer edge portion. The pixel 53a to be coated when the substrate 50 is scanned as shown in FIG. 5B is the same as the pixel 53a to be coated when the substrate 50 is scanned as shown in FIG. 5C. That is, the film material is recoated directly above the portion 55a of the outer edge portion.
如圖5D所示，藉由進一步重複掃描基板50而使外緣部的一部分55a變高，從而形成目標高度的外緣部55。 As shown in FIG. 5D, by further repeatedly scanning the substrate 50, a portion 55a of the outer edge portion is raised to form the outer edge portion 55 of the target height.
於圖6A表示形成內側部時成為塗佈膜材料對象之像素53b。圖6A中，塗佈對象的像素53b帶有陰影線。形成內側部時，可選擇比形成外緣部55時成為塗佈對象之像素53a的一排更靠內側的像素53b作為塗佈對象。 Fig. 6A shows a pixel 53b which is a target of a coating film material when the inner portion is formed. In Fig. 6A, the pixel 53b of the coating object is hatched. When the inner portion is formed, the pixel 53b on the inner side of the row of the pixels 53a to be coated when the outer edge portion 55 is formed can be selected as the application target.
如圖6B所示，藉由掃描基板50，將膜材料塗佈於圖6A所示之塗佈對象的像素53b並使其硬化。由 此，形成內側部的下層的一部分56a。依據噴嘴孔23(圖2B)的間距及塗佈對象的像素53b的間距來決定基板50的掃描次數。 As shown in FIG. 6B, by scanning the substrate 50, the film material is applied to the pixel 53b of the object to be coated shown in FIG. 6A and hardened. by Thus, a portion 56a of the lower layer of the inner portion is formed. The number of scans of the substrate 50 is determined in accordance with the pitch of the nozzle holes 23 (Fig. 2B) and the pitch of the pixels 53b to be coated.
如圖6C所示，在內側部的一部分56a之上，藉由進一步塗佈膜材料並使其硬化，從而使內側部的一部分56a變厚。圖6B所示之掃描基板50時的塗佈對象的像素53b與圖6C所示之掃描基板50時的塗佈對象的像素53b相同。藉由進一步反覆掃描基板50，使內側部的一部分56a變厚，直至達到目標厚度，從而形成內側部56。由外緣部55及內側部56構成單元層57。調整內側部56的厚度及外緣部55的高度，以使單元層57的上表面凹陷。具體而言，藉由使形成內側部56時的基板50的掃描次數少於形成外緣部55時的基板50的掃描次數，能夠形成上表面凹陷之單元層57。 As shown in FIG. 6C, a portion of the inner portion portion 56a is thickened by further coating and hardening the film material on a portion 56a of the inner portion. The pixel 53b to be coated when the substrate 50 is scanned as shown in FIG. 6B is the same as the pixel 53b to be coated when the substrate 50 is scanned as shown in FIG. 6C. By further repeatedly scanning the substrate 50, a portion 56a of the inner portion is thickened until the target thickness is reached, thereby forming the inner portion 56. The unit layer 57 is composed of the outer edge portion 55 and the inner portion 56. The thickness of the inner portion 56 and the height of the outer edge portion 55 are adjusted to recess the upper surface of the unit layer 57. Specifically, the number of scanning of the substrate 50 when the inner portion 56 is formed is smaller than the number of scanning of the substrate 50 when the outer edge portion 55 is formed, whereby the unit layer 57 having the upper surface recessed can be formed.
如圖7A所示，在第1層的單元層57之上進一步形成外緣部55。該外緣部55的形成方法與圖5B~圖5D所示之第1層單元層57的外緣部55的形成方法相同。另外，外緣部55的高度可以不同。亦即，形成外緣部55時的基板50的掃描次數可以不同。 As shown in FIG. 7A, an outer edge portion 55 is further formed on the unit layer 57 of the first layer. The method of forming the outer edge portion 55 is the same as the method of forming the outer edge portion 55 of the first layer unit layer 57 shown in FIGS. 5B to 5D. In addition, the height of the outer edge portion 55 may be different. That is, the number of times of scanning the substrate 50 when the outer edge portion 55 is formed may be different.
如圖7B所示，在第1層單元層57之上形成第2層內側部56。第2層內側部56的形成方法與圖6B~圖6C所示之第1層單元層57的內側部56的形成方法形同。另外，內側部56的厚度可以不同。亦即，形成內側部56時的基板50的掃描次數可以不同。由此，形成由在 第1層單元層57之上所形成之外緣部55及內側部56構成之第2層單元層57。第2層單元層57的上表面亦凹陷。由於第1層單元層57的上表面凹陷，因此亦可以使第2層內側部56的厚度與第2層外緣部55的高度大致相同。 As shown in FIG. 7B, a second layer inner portion 56 is formed on the first layer unit layer 57. The method of forming the second layer inner portion 56 is similar to the method of forming the inner portion 56 of the first layer unit layer 57 shown in FIGS. 6B to 6C. In addition, the thickness of the inner portion 56 may be different. That is, the number of scans of the substrate 50 when the inner portion 56 is formed may be different. Thus, formed by The second layer unit layer 57 composed of the outer edge portion 55 and the inner portion 56 is formed on the first layer unit layer 57. The upper surface of the second layer unit layer 57 is also recessed. Since the upper surface of the first layer unit layer 57 is recessed, the thickness of the second layer inner portion 56 can be made substantially the same as the height of the second layer outer edge portion 55.
如圖7C所示，在第2層單元層57之上，藉由形成第3層外緣部55及內側部56，從而形成第3層單元層57。 As shown in FIG. 7C, the third layer unit layer 57 is formed on the second layer unit layer 57 by forming the third layer outer edge portion 55 and the inner portion 56.
如圖7D所示，在已形成之單元層57之上堆積其他單元層57。此時，維持最上層單元層57的上表面凹陷之狀態之同時堆積單元層57。在複數個單元層57堆積至目標高度之後，藉由用膜材料填埋最上層單元層57的上表面的凹陷，形成具有幾乎平坦的上表面之平坦化層58。以到此為止的製程，形成由堆積之複數個單元層57及平坦化層58構成之膜60。 As shown in FIG. 7D, other unit layers 57 are stacked on the formed unit layer 57. At this time, the unit layer 57 is deposited while maintaining the state in which the upper surface of the uppermost unit layer 57 is recessed. After the plurality of unit layers 57 are stacked to the target height, the planarization layer 58 having the almost flat upper surface is formed by filling the recess of the upper surface of the uppermost unit layer 57 with the film material. The film 60 composed of a plurality of stacked unit layers 57 and flattening layers 58 is formed in the process up to this point.
參閱圖8A~圖8D，對上述實施例的效果進行說明。於圖8A，表示形成第1層外緣部55之後，開始形成第1層內側部56(圖6B)之時刻的基板50及外緣部55的概略圖。 The effects of the above embodiment will be described with reference to Figs. 8A to 8D. FIG. 8A is a schematic view showing the substrate 50 and the outer edge portion 55 at the time when the first layer inner portion 56 (FIG. 6B) is formed after the first layer outer edge portion 55 is formed.
由於塗佈於基板50表面之膜材料的液滴向基板50的平面方向擴散，因此外緣部55的寬度會變得比由形成外緣部55時成為塗佈對象之像素53a(圖5A)構成之像素列的寬度更寬。形成內側部56時成為塗佈對象之像素53b(圖6A)中塗佈於最外側像素53b之被液滴化之 膜材料61與第1層外緣部55重疊，且彈著於比外緣部55的最上方更靠被塗佈區域52的內側。 Since the droplets of the film material applied to the surface of the substrate 50 are diffused in the planar direction of the substrate 50, the width of the outer edge portion 55 becomes larger than the pixel 53a to be coated when the outer edge portion 55 is formed (FIG. 5A). The pixel columns formed are wider. When the inner portion 56 is formed, the pixel 53b (FIG. 6A) to be coated is applied to the outermost pixel 53b to be dropletized. The film material 61 overlaps the first layer outer edge portion 55 and is elastically placed on the inner side of the coated region 52 from the uppermost portion of the outer edge portion 55.
如圖8B所示，彈著於比外緣部55的最上方更靠內側之膜材料61流向較低的一側。亦即，膜材料61向被塗佈區域52的內側流動。膜材料61幾乎不會流出至外緣部55的外側的側面。 As shown in Fig. 8B, the film material 61 which is projected on the inner side of the uppermost portion of the outer edge portion 55 flows to the lower side. That is, the film material 61 flows toward the inside of the coated region 52. The film material 61 hardly flows out to the side of the outer side of the outer edge portion 55.
如圖8C所示，即使在使內側部的一部分56a變厚之製程(圖6C)中，被液滴化之膜材料61亦會彈著於比外緣部55的最上方更靠內側。因此，如圖8D所示，膜材料61從外緣部55的最上方向被塗佈區域52的內側流動。 As shown in FIG. 8C, even in the process of making the inner portion a portion 56a thick (FIG. 6C), the dropletized film material 61 is also projected on the inner side of the uppermost portion of the outer edge portion 55. Therefore, as shown in FIG. 8D, the film material 61 flows from the inner side of the coating region 52 from the uppermost direction of the outer edge portion 55.
如前述，形成內側部56(圖6C)時，膜材料不會流出至外緣部55的外側的側面。因此能夠抑制膜60(圖7D)的側面的傾斜變小。 As described above, when the inner portion 56 (FIG. 6C) is formed, the film material does not flow out to the outer side surface of the outer edge portion 55. Therefore, it is possible to suppress the inclination of the side surface of the film 60 (Fig. 7D) from becoming small.
如圖8E所示，在堆積單元層57之製程中，在當前之最上層單元層57的外緣部55的正上方進一步彈著用於形成外緣部55的膜材料61。如圖8F所示，由於單元層57的上表面凹陷，因此用於形成外緣部55之膜材料61不僅從其下方的外緣部55的最上方向外側流動，亦向內側流動。單元層57的上表面沒有凹陷時，在其之上形成外緣部時被塗佈之膜材料的絕大部分會向外側流動。上述實施例中，由於最上層的單元層57的上表面凹陷，因此即使在形成外緣部55(圖7A)時，亦能夠減少前述膜材料向膜60(圖7D)的側面流出。由此，能夠抑制膜 60(圖7D)的側面的傾斜變小。 As shown in FIG. 8E, in the process of the stacking unit layer 57, the film material 61 for forming the outer edge portion 55 is further bounced directly above the outer edge portion 55 of the current uppermost unit layer 57. As shown in FIG. 8F, since the upper surface of the unit layer 57 is recessed, the film material 61 for forming the outer edge portion 55 flows not only from the uppermost side of the outer edge portion 55 of the lower side but also to the inner side. When the upper surface of the unit layer 57 is not recessed, most of the film material applied when the outer edge portion is formed thereon flows outward. In the above embodiment, since the upper surface of the uppermost unit layer 57 is recessed, even when the outer edge portion 55 (Fig. 7A) is formed, it is possible to reduce the outflow of the film material toward the side surface of the film 60 (Fig. 7D). Thereby, the film can be suppressed The inclination of the side of 60 (Fig. 7D) becomes small.
參閱圖9A及圖9B，對使用了藉由上述實施例之方法形成之膜60(圖7D)之厚銅基板的製造方法進行說明。 A method of manufacturing a thick copper substrate using the film 60 (Fig. 7D) formed by the method of the above embodiment will be described with reference to Figs. 9A and 9B.
如圖9A所示，在基板50的表面的、配置厚銅之區域63以外的區域，藉由上述實施例之方法形成膜60。如圖9B所示，藉由將銅填入沒有形成膜60之區域63，從而形成厚銅64。 As shown in FIG. 9A, a film 60 is formed by a method of the above embodiment in a region other than the region 63 where the thick copper is disposed on the surface of the substrate 50. As shown in FIG. 9B, thick copper 64 is formed by filling copper into the region 63 where the film 60 is not formed.
上述實施例中，藉由堆積單元層57(圖7D)，能夠使膜60的厚度增加到50μm~2mm左右。因此，能夠形成厚度為50μm~2mm左右的厚銅64。並且，由於能夠使膜60的側面的傾斜陡峭，因此能夠使厚銅64的截面積變大。由此，能夠得到適於應用在大電流之厚銅64。 In the above embodiment, the thickness of the film 60 can be increased to about 50 μm to 2 mm by the deposition unit layer 57 (Fig. 7D). Therefore, thick copper 64 having a thickness of about 50 μm to 2 mm can be formed. Further, since the inclination of the side surface of the film 60 can be steep, the cross-sectional area of the thick copper 64 can be increased. Thereby, thick copper 64 suitable for application to a large current can be obtained.
根據以上實施例對本發明進行了說明，但是本發明不限於此。例如，能夠進行各種變更、改良、組合等，這對本案發明所屬技術領域中具有通常知識者來講是顯而易見的。 The present invention has been described based on the above embodiments, but the present invention is not limited thereto. For example, various changes, modifications, combinations, and the like can be made, which will be apparent to those of ordinary skill in the art to which the invention pertains.
50‧‧‧基板 50‧‧‧Substrate
55‧‧‧外緣部 55‧‧‧The outer edge
56‧‧‧內側部 56‧‧‧ inside part
57‧‧‧單元層 57‧‧‧Unit level
58‧‧‧平坦化層 58‧‧‧Destivation layer
60‧‧‧膜 60‧‧‧ film
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| JP6862041B2 (en) * | 2016-08-10 | 2021-04-21 | 住友重機械工業株式会社 | Membrane forming method and film forming apparatus |
| JP6925749B2 (en) * | 2018-01-30 | 2021-08-25 | 住友重機械工業株式会社 | Membrane forming method and film forming apparatus |
| CN112437698A (en) * | 2019-06-26 | 2021-03-02 | Abb瑞士股份有限公司 | Coating machine and coating method |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6085578B2 (en) | 2017-02-22 |
| JP2015167944A (en) | 2015-09-28 |
| CN104907227B (en) | 2017-04-19 |
| TW201534402A (en) | 2015-09-16 |
| CN104907227A (en) | 2015-09-16 |
| KR20150106322A (en) | 2015-09-21 |
| KR101713813B1 (en) | 2017-03-09 |
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