TWI563890B - Solder mask manufacturing method for substrates - Google Patents

Solder mask manufacturing method for substrates

Info

Publication number
TWI563890B
TWI563890B TW103144408A TW103144408A TWI563890B TW I563890 B TWI563890 B TW I563890B TW 103144408 A TW103144408 A TW 103144408A TW 103144408 A TW103144408 A TW 103144408A TW I563890 B TWI563890 B TW I563890B
Authority
TW
Taiwan
Prior art keywords
substrates
solder mask
mask manufacturing
manufacturing
solder
Prior art date
Application number
TW103144408A
Other languages
Chinese (zh)
Other versions
TW201524295A (en
Inventor
Peter Pang
ming yi Wu
Original Assignee
T Top Technology Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by T Top Technology Optical Co Ltd filed Critical T Top Technology Optical Co Ltd
Priority to TW103144408A priority Critical patent/TWI563890B/en
Publication of TW201524295A publication Critical patent/TW201524295A/en
Application granted granted Critical
Publication of TWI563890B publication Critical patent/TWI563890B/en

Links

TW103144408A 2014-12-19 2014-12-19 Solder mask manufacturing method for substrates TWI563890B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103144408A TWI563890B (en) 2014-12-19 2014-12-19 Solder mask manufacturing method for substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103144408A TWI563890B (en) 2014-12-19 2014-12-19 Solder mask manufacturing method for substrates

Publications (2)

Publication Number Publication Date
TW201524295A TW201524295A (en) 2015-06-16
TWI563890B true TWI563890B (en) 2016-12-21

Family

ID=53935899

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103144408A TWI563890B (en) 2014-12-19 2014-12-19 Solder mask manufacturing method for substrates

Country Status (1)

Country Link
TW (1) TWI563890B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115696773A (en) * 2022-11-28 2023-02-03 精捷科技光学股份有限公司 Laser welding-proof layer removing process method for substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI302230B (en) * 2005-03-09 2008-10-21 Seiko Epson Corp Photomask, manufacturing method thereof, and manufacturing method of electronic device
TWI455669B (en) * 2009-12-07 2014-10-01 San Ei Kagaku Co Printed wiring board and method for producing the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI302230B (en) * 2005-03-09 2008-10-21 Seiko Epson Corp Photomask, manufacturing method thereof, and manufacturing method of electronic device
TWI455669B (en) * 2009-12-07 2014-10-01 San Ei Kagaku Co Printed wiring board and method for producing the same

Also Published As

Publication number Publication date
TW201524295A (en) 2015-06-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees