TWI561935B - Exposure apparatus and device manufacturing method - Google Patents

Exposure apparatus and device manufacturing method

Info

Publication number
TWI561935B
TWI561935B TW099120064A TW99120064A TWI561935B TW I561935 B TWI561935 B TW I561935B TW 099120064 A TW099120064 A TW 099120064A TW 99120064 A TW99120064 A TW 99120064A TW I561935 B TWI561935 B TW I561935B
Authority
TW
Taiwan
Prior art keywords
exposure apparatus
device manufacturing
manufacturing
exposure
Prior art date
Application number
TW099120064A
Other languages
English (en)
Other versions
TW201106113A (en
Inventor
Go Ichinose
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW201106113A publication Critical patent/TW201106113A/zh
Application granted granted Critical
Publication of TWI561935B publication Critical patent/TWI561935B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW099120064A 2009-06-19 2010-06-21 Exposure apparatus and device manufacturing method TWI561935B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US21845009P 2009-06-19 2009-06-19
US12/818,644 US8355116B2 (en) 2009-06-19 2010-06-18 Exposure apparatus and device manufacturing method

Publications (2)

Publication Number Publication Date
TW201106113A TW201106113A (en) 2011-02-16
TWI561935B true TWI561935B (en) 2016-12-11

Family

ID=43356840

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099120064A TWI561935B (en) 2009-06-19 2010-06-21 Exposure apparatus and device manufacturing method

Country Status (7)

Country Link
US (1) US8355116B2 (zh)
EP (2) EP2443516B1 (zh)
JP (1) JP5348629B2 (zh)
KR (3) KR102130964B1 (zh)
CN (1) CN102460305B (zh)
TW (1) TWI561935B (zh)
WO (1) WO2010147244A2 (zh)

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KR102080875B1 (ko) 2013-01-23 2020-04-16 삼성디스플레이 주식회사 스테이지 이송 장치 및 이를 이용한 스테이지 위치 측정 방법
JP6774031B2 (ja) * 2015-03-25 2020-10-21 株式会社ニコン レイアウト方法、マーク検出方法、露光方法、計測装置、露光装置、並びにデバイス製造方法
NL2016877A (en) 2015-06-18 2016-12-22 Asml Holding Nv An apparatus including a gas gauge and method of operating the same
JP6631871B2 (ja) * 2015-08-31 2020-01-15 株式会社リコー 光加工装置
KR20180059814A (ko) * 2015-09-30 2018-06-05 가부시키가이샤 니콘 노광 장치, 플랫 패널 디스플레이의 제조 방법, 및 디바이스 제조 방법
WO2021040269A1 (ko) 2019-08-30 2021-03-04 (주) 엘지화학 (메트)아크릴레이트 그라프트 공중합체를 포함하는 열가소성 수지 조성물 및 이의 제조방법
EP4372790A1 (de) * 2022-11-18 2024-05-22 Dr. Johannes Heidenhain GmbH Positioniereinrichtung

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DE4033556A1 (de) * 1990-10-22 1992-04-23 Suess Kg Karl Messanordnung fuer x,y,(phi)-koordinatentische
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Also Published As

Publication number Publication date
KR101799118B1 (ko) 2017-11-17
EP2443516B1 (en) 2020-01-01
WO2010147244A3 (en) 2011-08-04
CN102460305A (zh) 2012-05-16
KR102022788B1 (ko) 2019-11-04
KR20190107752A (ko) 2019-09-20
KR102130964B1 (ko) 2020-07-07
US20110007290A1 (en) 2011-01-13
JP2012531031A (ja) 2012-12-06
TW201106113A (en) 2011-02-16
KR20120031074A (ko) 2012-03-29
WO2010147244A2 (en) 2010-12-23
US8355116B2 (en) 2013-01-15
EP3657258A1 (en) 2020-05-27
KR20170128619A (ko) 2017-11-22
CN102460305B (zh) 2016-01-27
JP5348629B2 (ja) 2013-11-20
EP2443516A2 (en) 2012-04-25

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