TWI560248B - Photosensitive conductive paste and method for manufacturing conductive pattern - Google Patents
Photosensitive conductive paste and method for manufacturing conductive patternInfo
- Publication number
- TWI560248B TWI560248B TW102109792A TW102109792A TWI560248B TW I560248 B TWI560248 B TW I560248B TW 102109792 A TW102109792 A TW 102109792A TW 102109792 A TW102109792 A TW 102109792A TW I560248 B TWI560248 B TW I560248B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- photosensitive
- conductive pattern
- conductive paste
- paste
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- Materials For Photolithography (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Electric Cables (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012064946 | 2012-03-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201348353A TW201348353A (zh) | 2013-12-01 |
TWI560248B true TWI560248B (en) | 2016-12-01 |
Family
ID=49222471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102109792A TWI560248B (en) | 2012-03-22 | 2013-03-20 | Photosensitive conductive paste and method for manufacturing conductive pattern |
Country Status (6)
Country | Link |
---|---|
US (1) | US9081278B2 (zh) |
JP (1) | JP5403187B1 (zh) |
KR (1) | KR101716722B1 (zh) |
CN (1) | CN104204946A (zh) |
TW (1) | TWI560248B (zh) |
WO (1) | WO2013141009A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6225708B2 (ja) * | 2012-11-13 | 2017-11-08 | 東レ株式会社 | 静電容量型タッチパネル |
CN107407870B (zh) * | 2015-04-01 | 2018-12-14 | 东丽株式会社 | 感光性树脂组合物、导电性图案的制造方法、基板、触摸面板及显示器 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101031845A (zh) * | 2004-08-06 | 2007-09-05 | E.I.内穆尔杜邦公司 | 用在光图案化方法中的可水溶液显影的可光成像的组合物前体 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2790301B2 (ja) | 1989-02-03 | 1998-08-27 | 横浜ゴム株式会社 | シール材組成物 |
JPH1064333A (ja) | 1996-08-21 | 1998-03-06 | Taiyo Ink Mfg Ltd | 導電性銅ペースト組成物及びそれを用いたプリント回路基板の製造方法 |
US6309502B1 (en) * | 1997-08-19 | 2001-10-30 | 3M Innovative Properties Company | Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods |
JP3947287B2 (ja) * | 1997-12-27 | 2007-07-18 | 大日本印刷株式会社 | 感光性導体ペーストおよびこれを用いた転写シート |
JP4101918B2 (ja) * | 1998-03-02 | 2008-06-18 | 太陽インキ製造株式会社 | アルカリ現像型光硬化性組成物及びそれを用いて得られる焼成物パターン |
JP4046405B2 (ja) * | 1998-03-06 | 2008-02-13 | 太陽インキ製造株式会社 | 導体パターン形成用感光性組成物及びそれを用いて得られる導体パターン |
US6762009B2 (en) * | 2001-10-12 | 2004-07-13 | E. I. Du Pont De Nemours And Company | Aqueous developable photoimageable thick film compositions with photospeed enhancer |
AU2002361101A1 (en) | 2002-12-26 | 2004-07-29 | Taiyo Ink Mfg. Co., Ltd. | Photocurable thermosetting conductive composition, conductive circuit formed from the conductive composition, and method of forming the same |
JP4160449B2 (ja) | 2003-06-06 | 2008-10-01 | 株式会社神戸製鋼所 | 自動探傷装置 |
JP2005240092A (ja) | 2004-02-26 | 2005-09-08 | Dowa Mining Co Ltd | 銀粉およびその製造方法 |
KR100989744B1 (ko) * | 2005-07-13 | 2010-10-26 | 다이요 잉키 세이조 가부시키가이샤 | 은 페이스트 조성물, 및 그것을 이용한 도전성 패턴의 형성방법 및 그의 도전성 패턴 |
US20090103236A1 (en) * | 2005-09-06 | 2009-04-23 | Toshihisa Nonaka | Paste composition, dielectric composition, capacitor, and method for production of paste composition |
JP4635888B2 (ja) | 2006-02-01 | 2011-02-23 | 藤倉化成株式会社 | 導電性ペーストおよび導電性回路の製造方法 |
JP5178178B2 (ja) | 2006-12-22 | 2013-04-10 | 太陽ホールディングス株式会社 | 感光性樹脂組成物及びそれを用いて得られる焼成物パターンの製造方法 |
JP4959411B2 (ja) * | 2007-04-27 | 2012-06-20 | 富士フイルム株式会社 | 着色光重合性組成物並びにそれを用いたカラーフィルタ及びカラーフィルタの製造方法 |
JP2009086376A (ja) * | 2007-09-28 | 2009-04-23 | Fujifilm Corp | 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、プリント基板 |
JP2009086374A (ja) * | 2007-09-28 | 2009-04-23 | Fujifilm Corp | 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板 |
JP5094315B2 (ja) * | 2007-10-04 | 2012-12-12 | 富士フイルム株式会社 | 着色画素用硬化性組成物及びカラーフィルタ |
JP2009237245A (ja) | 2008-03-27 | 2009-10-15 | Toray Ind Inc | 感光性導電ペースト |
US7887992B2 (en) * | 2008-12-23 | 2011-02-15 | E. I. Du Pont De Nemours And Company | Photosensitive paste and process for production of pattern using the same |
WO2010113287A1 (ja) * | 2009-03-31 | 2010-10-07 | 太陽インキ製造株式会社 | 感光性導電ペースト及び電極パターン |
JP2010256887A (ja) * | 2009-03-31 | 2010-11-11 | Fujifilm Corp | 感光性着色組成物、カラーフィルタ及びその製造方法、並びに液晶表示装置 |
JP5533043B2 (ja) | 2010-03-05 | 2014-06-25 | 東レ株式会社 | 感光性導電ペーストおよび導電パターンの製造方法 |
CN102214497B (zh) * | 2010-04-07 | 2013-05-01 | 太阳控股株式会社 | 导电糊剂及导电图案 |
KR20110136150A (ko) * | 2010-06-14 | 2011-12-21 | 정승원 | 친환경적인 터치패널용 감광성 전극 페이스트 조성물 |
CN105867067A (zh) | 2011-03-14 | 2016-08-17 | 东丽株式会社 | 感光性导电糊剂和导电图案的制造方法 |
-
2013
- 2013-03-04 CN CN201380015563.1A patent/CN104204946A/zh active Pending
- 2013-03-04 JP JP2013514478A patent/JP5403187B1/ja active Active
- 2013-03-04 KR KR1020147025689A patent/KR101716722B1/ko active IP Right Grant
- 2013-03-04 US US14/386,497 patent/US9081278B2/en not_active Expired - Fee Related
- 2013-03-04 WO PCT/JP2013/055808 patent/WO2013141009A1/ja active Application Filing
- 2013-03-20 TW TW102109792A patent/TWI560248B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101031845A (zh) * | 2004-08-06 | 2007-09-05 | E.I.内穆尔杜邦公司 | 用在光图案化方法中的可水溶液显影的可光成像的组合物前体 |
Also Published As
Publication number | Publication date |
---|---|
TW201348353A (zh) | 2013-12-01 |
US9081278B2 (en) | 2015-07-14 |
CN104204946A (zh) | 2014-12-10 |
KR101716722B1 (ko) | 2017-03-15 |
KR20140138722A (ko) | 2014-12-04 |
US20150050586A1 (en) | 2015-02-19 |
WO2013141009A1 (ja) | 2013-09-26 |
JPWO2013141009A1 (ja) | 2015-08-03 |
JP5403187B1 (ja) | 2014-01-29 |
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