TWI559984B - Device and method for treating surfaces of wafer-shaped articles - Google Patents
Device and method for treating surfaces of wafer-shaped articlesInfo
- Publication number
- TWI559984B TWI559984B TW101148713A TW101148713A TWI559984B TW I559984 B TWI559984 B TW I559984B TW 101148713 A TW101148713 A TW 101148713A TW 101148713 A TW101148713 A TW 101148713A TW I559984 B TWI559984 B TW I559984B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- shaped articles
- treating surfaces
- treating
- articles
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/336,685 US9548223B2 (en) | 2011-12-23 | 2011-12-23 | Apparatus for treating surfaces of wafer-shaped articles |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201341059A TW201341059A (zh) | 2013-10-16 |
TWI559984B true TWI559984B (en) | 2016-12-01 |
Family
ID=48653163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101148713A TWI559984B (en) | 2011-12-23 | 2012-12-20 | Device and method for treating surfaces of wafer-shaped articles |
Country Status (6)
Country | Link |
---|---|
US (1) | US9548223B2 (zh) |
JP (1) | JP2015508570A (zh) |
KR (1) | KR20140110970A (zh) |
CN (1) | CN104011847A (zh) |
TW (1) | TWI559984B (zh) |
WO (1) | WO2013093759A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10269615B2 (en) * | 2011-09-09 | 2019-04-23 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
JP6001896B2 (ja) * | 2012-03-27 | 2016-10-05 | 株式会社Screenセミコンダクターソリューションズ | 基板洗浄装置およびそれを備えた基板処理装置 |
US9748120B2 (en) | 2013-07-01 | 2017-08-29 | Lam Research Ag | Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus |
KR102119690B1 (ko) * | 2013-12-06 | 2020-06-08 | 세메스 주식회사 | 기판 가열 유닛 |
US10043686B2 (en) * | 2013-12-31 | 2018-08-07 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
US10490426B2 (en) * | 2014-08-26 | 2019-11-26 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
US10167552B2 (en) * | 2015-02-05 | 2019-01-01 | Lam Research Ag | Spin chuck with rotating gas showerhead |
JP6625891B2 (ja) * | 2016-02-10 | 2019-12-25 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
JP7297664B2 (ja) * | 2016-11-09 | 2023-06-26 | ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ,インコーポレイテッド | プロセスチャンバ中でマイクロエレクトロニクス基板を処理するための磁気的な浮上および回転するチャック |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6440320B1 (en) * | 1999-10-13 | 2002-08-27 | Ebara Corporation | Substrate processing method and apparatus |
TW200505599A (en) * | 2003-06-24 | 2005-02-16 | Sez Ag | Device and method for wet treating disc-like substrates |
TW200739800A (en) * | 2006-03-08 | 2007-10-16 | Sez Ag | Device for fluid treating plate-like articles |
TW200807510A (en) * | 2006-05-30 | 2008-02-01 | Applied Materials Inc | Process chamber for dielectric gapfill |
TW201029070A (en) * | 2008-11-06 | 2010-08-01 | Applied Materials Inc | Rapid thermal processing chamber with micro-positioning system |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT389959B (de) | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
DE59407361D1 (de) | 1993-02-08 | 1999-01-14 | Sez Semiconduct Equip Zubehoer | Träger für scheibenförmige Gegenstände |
JP2001524259A (ja) * | 1995-07-10 | 2001-11-27 | シーヴィシー、プラダクツ、インク | マイクロエレクトロニクス製造装置用プログラマブル超クリーン電磁サブストレート回転装置及び方法 |
US6485531B1 (en) | 1998-09-15 | 2002-11-26 | Levitronix Llc | Process chamber |
JP2001351874A (ja) * | 2000-06-09 | 2001-12-21 | Ebara Corp | 基板回転装置 |
US7959139B2 (en) * | 2005-12-16 | 2011-06-14 | Niigata University | Noncontact rotating processor |
CN101326629B (zh) * | 2006-05-30 | 2011-05-25 | 应用材料股份有限公司 | 填充介电质间隙的制程室 |
US8314371B2 (en) * | 2008-11-06 | 2012-11-20 | Applied Materials, Inc. | Rapid thermal processing chamber with micro-positioning system |
US8791614B2 (en) * | 2008-12-19 | 2014-07-29 | Lam Research Ag | Device for treating disc-like article and method for operating same |
JP5533335B2 (ja) * | 2009-07-22 | 2014-06-25 | 東京エレクトロン株式会社 | 処理装置及びその動作方法 |
-
2011
- 2011-12-23 US US13/336,685 patent/US9548223B2/en active Active
-
2012
- 2012-12-17 KR KR1020147020603A patent/KR20140110970A/ko not_active Application Discontinuation
- 2012-12-17 JP JP2014548288A patent/JP2015508570A/ja active Pending
- 2012-12-17 WO PCT/IB2012/057383 patent/WO2013093759A1/en active Application Filing
- 2012-12-17 CN CN201280063592.0A patent/CN104011847A/zh active Pending
- 2012-12-20 TW TW101148713A patent/TWI559984B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6440320B1 (en) * | 1999-10-13 | 2002-08-27 | Ebara Corporation | Substrate processing method and apparatus |
TW200505599A (en) * | 2003-06-24 | 2005-02-16 | Sez Ag | Device and method for wet treating disc-like substrates |
TW200739800A (en) * | 2006-03-08 | 2007-10-16 | Sez Ag | Device for fluid treating plate-like articles |
TW200807510A (en) * | 2006-05-30 | 2008-02-01 | Applied Materials Inc | Process chamber for dielectric gapfill |
TW201029070A (en) * | 2008-11-06 | 2010-08-01 | Applied Materials Inc | Rapid thermal processing chamber with micro-positioning system |
Also Published As
Publication number | Publication date |
---|---|
CN104011847A (zh) | 2014-08-27 |
US9548223B2 (en) | 2017-01-17 |
WO2013093759A1 (en) | 2013-06-27 |
TW201341059A (zh) | 2013-10-16 |
JP2015508570A (ja) | 2015-03-19 |
KR20140110970A (ko) | 2014-09-17 |
US20130160260A1 (en) | 2013-06-27 |
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