TWI554653B - Electroplating device - Google Patents
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- TWI554653B TWI554653B TW103124012A TW103124012A TWI554653B TW I554653 B TWI554653 B TW I554653B TW 103124012 A TW103124012 A TW 103124012A TW 103124012 A TW103124012 A TW 103124012A TW I554653 B TWI554653 B TW I554653B
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Description
本發明係有關於一種電鍍治具，更詳而言之，是一種用於在電鍍槽中對圓導電線的選擇性區域進行電鍍的電鍍治具。The present invention relates to an electroplating jig, and more particularly to a plating jig for electroplating a selective region of a circular conductive wire in a plating bath.
隨著網路的普及與發展，可用於訊號高速傳輸的雙絞線連接器被廣泛的使用，雙絞線連接器主要分成兩種，一種為電信網路所使用的RJ11連接器，另一種為局部區域網路及寬頻網路應用的RJ45連接器。雙絞線連接器的導電端子通常會選擇銅製成，但是銅經長時間的使用容易發生氧化而降低導電性，為增加銅的導電性及抗氧化性，通常還會在銅上鍍上一層鎳，因為鎳的還原電位小於銅，而比銅更容易氧化，可在銅的外表面形成緻密的氧化鎳層，以保護銅不被氧化。此外，導電端子鎳層的外表面上還可鍍上金，以利用金優異的導電性能，提高導電端子的訊號傳輸能力。With the popularity and development of the network, twisted pair connectors that can be used for high-speed signal transmission are widely used. The twisted pair connectors are mainly divided into two types, one is the RJ11 connector used in the telecommunication network, and the other is RJ45 connector for local area network and broadband network applications. The conductive terminals of the twisted pair connectors are usually made of copper, but the copper is easily oxidized for a long time to reduce the conductivity. To increase the conductivity and oxidation resistance of the copper, a layer of nickel is usually plated on the copper. Since nickel has a lower reduction potential than copper and is more susceptible to oxidation than copper, a dense nickel oxide layer can be formed on the outer surface of copper to protect the copper from oxidation. In addition, the outer surface of the nickel layer of the conductive terminal may be plated with gold to utilize the excellent electrical conductivity of the gold to improve the signal transmission capability of the conductive terminal.
由於金是貴重金屬，因此各大導電端子的製造商無不苦思，如何在導電端子的製作過程中減少金的使用量，以節約材料成本的支出而增加產品售價的競爭力。由於導電端子的導電接觸部位通常僅在局部區域，所以遂有人提出僅需在導電端子的接觸部位鍍金就能達成訊號傳輸能力提升，藉以節約金的使用量的想法。目前雙絞線連接器的導電端子，有人會以整捆具有圓形斷面的銅線透過裁切及彎折的方式製成，如此可減少導電端子的製作程序以及銅材的損耗，但目前並無有效方法可以僅針對整捆圓形銅線的局部區域進行鍍金，導致整捆圓形銅線的外表面都必須被鍍上厚度均勻的金，使得金的耗損居高不下。Since gold is a precious metal, manufacturers of major conductive terminals have a hard time thinking about how to reduce the amount of gold used in the production process of conductive terminals, and to increase the competitiveness of product prices by saving material costs. Since the conductive contact portion of the conductive terminal is usually only in a partial region, it has been proposed to increase the signal transmission capability by simply plating gold at the contact portion of the conductive terminal, thereby saving the use of gold. At present, the conductive terminals of the twisted pair connector are formed by cutting and bending a bundle of copper wires having a circular cross section, thereby reducing the manufacturing process of the conductive terminals and the loss of the copper material, but currently There is no effective way to plate gold only for a partial area of a bundle of round copper wires, so that the outer surface of the entire bundle of round copper wires must be plated with a uniform thickness of gold, so that gold consumption is high.
基於前述，如何在圓形銅線的局部區域鍍金，以在製作雙絞線連接器導電端子的過程中，減少金的浪費，實為所屬技術領域人士所迫切需要解決的問題。Based on the foregoing, how to plate gold in a partial region of a circular copper wire to reduce the waste of gold in the process of fabricating the conductive terminal of the twisted pair connector is an urgent problem to be solved by those skilled in the art.
鑒於上述先前技術之種種問題，本發明主要在於提供一種電鍍治具，係用於在電鍍槽中對圓導電線的選擇性區域進行電鍍，具有治具本體、治具導流罩、夾持組件以及蓋體。治具本體係具有治具電鍍液流動空間以及外露的電鍍液入口。電鍍槽所收容的電鍍液可藉由電鍍液入口進入治具電鍍液流動空間。治具導流罩係設於治具電鍍液流動空間中，並位於電鍍液入口的上方，係可改變或限制由電鍍液入口進入的電鍍液的流動方向，俾減緩治具電鍍流動空間中電鍍液的流速。夾持組件係設於治具導流罩的上方，夾持組件包括有上、下夾座以及上、下彈性墊。上、下夾座可分別延伸出邊框以分別形成上、下內凹空間。上、下夾座邊框左右兩端的相鄰處分別凹設有上、下孔槽，其中，上、下孔槽的寬度尺寸與總和高度尺寸係大於圓導電線的線徑尺寸。上、下彈性墊係分別置於上、下內凹空間，且頂面係分別高於上、下孔槽的底面，用於相對靠近而彈性夾持圓導電線。夾持組件位置對應圓導電線選擇性區域的部位還形成有複數電鍍液流道，各該電鍍液流道係隔開有等距或非等距的距離，並分別貫穿上、下夾座以及上、下彈性墊，俾使治具電鍍流動空間中的電鍍液流入，而與受夾持圓導電線選擇性區域的外表面接觸以進行選擇性電鍍。蓋體係接合夾持組件的上夾座，具有蓋體電鍍液流動空間以及外露的電鍍液出口，由上夾座所流出的電鍍液可進入蓋體電鍍液流動空間，並經由蓋體的電鍍液出口流回到電鍍槽。In view of the above problems of the prior art, the present invention mainly provides an electroplating fixture for electroplating a selective region of a circular conductive wire in a plating bath, having a fixture body, a jig, and a clamping assembly. And the cover. Fixture This system has a plating solution flow space and an exposed plating solution inlet. The plating solution contained in the plating tank can enter the jig plating liquid flow space through the plating liquid inlet. The fixture shroud is disposed in the flow space of the electroplating solution of the jig and is located above the inlet of the electroplating solution, which can change or limit the flow direction of the plating solution entering from the inlet of the electroplating solution, and slow the electroplating in the electroplating flow space of the jig The flow rate of the liquid. The clamping component is disposed above the fixture shroud, and the clamping assembly includes upper and lower clamping seats and upper and lower elastic pads. The upper and lower holders can respectively extend out of the frame to form upper and lower concave spaces, respectively. The upper and lower holes of the upper and lower clamping frame are respectively recessed with upper and lower holes, wherein the width dimension and the total height dimension of the upper and lower holes are larger than the wire diameter of the circular conductive wire. The upper and lower elastic pads are respectively placed in the upper and lower concave spaces, and the top surface is respectively higher than the bottom surfaces of the upper and lower holes, for relatively close to elastically sandwich the circular conductive lines. The position of the clamping component corresponding to the selective area of the circular conductive line is further formed with a plurality of plating liquid flow channels, each of which is equidistantly or non-equidistantly spaced, and penetrates the upper and lower clamping seats respectively. The upper and lower elastic pads allow the plating solution in the electroplating flow space of the jig to flow into contact with the outer surface of the selective region of the circular conductive wire to be selectively plated. The cover system engages the upper holder of the clamping assembly, has a cover plating solution flow space and an exposed plating solution outlet, and the plating solution flowing out from the upper holder can enter the cover plating solution flow space and the plating solution through the cover body The outlet flows back to the plating bath.
另外，治具導流罩可為具有開口端朝向電鍍液入口的ㄇ字型斷面。本發明的電鍍治具還可設置位於蓋體電鍍液流動空間中的蓋體導流罩，以引導由上夾座所流出的電鍍液朝特定的方向流動，俾減緩蓋體電鍍液流動空間中電鍍液的流速。與治具導流罩相同，蓋體導流罩的斷面可為具有開口端朝向該上夾座的ㄇ字型斷面。本發明的電鍍治具還可具有穿過治具本體的架設桿，俾將治具本體架設於電鍍槽中，以對圓導電線進行選擇性電鍍。In addition, the jig shroud may be a U-shaped cross section having an open end toward the plating solution inlet. The electroplating jig of the present invention can also be provided with a cover shroud located in the flow space of the plating liquid of the cover body to guide the plating liquid flowing out from the upper clamping seat to flow in a specific direction, and to slow down the flow space of the plating liquid of the cover body. The flow rate of the plating solution. Similar to the jig shroud, the cross section of the cover shroud may be a U-shaped cross section having an open end facing the upper clamp. The electroplating jig of the present invention may further have a erecting rod passing through the jig body, and the jig body is erected in the plating tank to selectively electroplate the circular conductive wire.
相較於先前技術，本發明的電鍍治具，用於在電鍍槽中對圓導電線的選擇性區域進行電鍍。該電鍍治具設置具有彈性墊的夾持組件，該夾持組件可利用彈性墊有效夾持定位圓導電線，以供對圓導電線進行電鍍。所述的彈性墊可於夾持圓導電線時，包覆圓導電線的非選擇性區域藉以提供遮蔽的效果，阻止圓導電線的非選擇性區域與電鍍液接觸，即便圓導電線被通上陰極電，圓導電線的非選擇性區域的表面也不會與電鍍液反應而生成一層電鍍材料，如此可減少電鍍槽中電鍍材料的浪費。另外，本發明的電鍍治具於對應圓導電線選擇性的電鍍區域的位置設有複數電鍍液流道，以使圓導電線的選擇性區域能與電鍍液接觸，而達成對圓導電線的選擇性區域進行電鍍。Compared to the prior art, the electroplating jig of the present invention is used for electroplating a selective region of a circular conductive line in a plating bath. The electroplating fixture is provided with a clamping assembly having an elastic pad, which can effectively clamp the circular conductive wire with the elastic pad for electroplating the circular conductive wire. The elastic pad can cover the non-selective area of the circular conductive line when clamping the circular conductive line to provide a shielding effect, preventing the non-selective area of the circular conductive line from contacting the plating solution even if the circular conductive line is On the upper cathode, the surface of the non-selective region of the circular conductive line does not react with the plating solution to form a plating material, which can reduce the waste of plating material in the plating bath. In addition, the electroplating jig of the present invention is provided with a plurality of electroplating liquid flow paths at positions corresponding to the selective electroplating regions of the circular conductive lines, so that the selective regions of the circular conductive wires can be in contact with the plating solution to achieve the circular conductive lines. The selective area is plated.
以下係藉由特定的具體實施例說明本發明之技術內容，熟悉此技術之人士可由本說明書所揭示之內容輕易地了解本發明之其他優點與功效。本發明亦可藉由其他不同的具體實施例加以施行或應用。本說明書中的各項細節亦可基於不同觀點與應用，在不悖離本發明之精神下，進行各種修飾與變更。The technical contents of the present invention are described below by way of specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention from the disclosure of the present specification. The invention may also be embodied or applied by other different embodiments. The details of the present invention can be variously modified and changed without departing from the spirit and scope of the invention.
本發明係提供一種電鍍治具，係用於在電鍍槽中夾持圓導電線，並可遮蔽圓導電線的非選擇性區域（即圓導電線上非必要電鍍的區域），僅讓圓導電線的選擇性區域（即圓導電線上必要電鍍的區域）接觸電鍍液，導致圓導電線在被通上陰極電後，圓導電線僅有選擇性區域會與電鍍液進行電解反應鍍上一層電鍍材料，如此可有效減少例如為金的電鍍材料的浪費。請一併參閱圖1至圖9，係本發明電鍍治具一實施例的結構示意圖。The invention provides a plating fixture for clamping a circular conductive line in a plating tank and shielding a non-selective area of a circular conductive line (ie, an area unnecessary for plating on a circular conductive line), and only allowing a circular conductive line The selective region (ie, the region that needs to be plated on the circular conductive line) contacts the plating solution, and after the circular conductive wire is electrically connected to the cathode, only the selective region of the circular conductive wire is electrolyzed with the plating solution to be plated with a plating material. This can effectively reduce the waste of plating materials such as gold. Please refer to FIG. 1 to FIG. 9 together, which is a schematic structural view of an embodiment of the electroplating fixture of the present invention.
如圖1、圖2及圖3所示，本發明之電鍍治具1係具有治具本體11、治具導流罩12、夾持組件13以及蓋體14。所述的治具本體11係可由聚丙烯材料製成，治具本體11的四周環設有側壁以形成治具電鍍液流動空間111，治具本體11還具有穿孔以形成外露的電鍍液入口112。電鍍槽內的電鍍液可藉由電鍍液入口112進入治具本體11的治具電鍍液流動空間111。圖1所示的電鍍治具1還具有穿過治具本體11的架設桿15，俾將治具本體11架設於電鍍槽，以對治具本體11提供定位。治具導流罩12亦可選由聚丙烯材料製成。治具導流罩12係置於治具電鍍液流動空間111中，具有位於電鍍液入口112上方的導流面，可引導由電鍍液入口112進入電鍍液流動空間111的電鍍液在特定方向的流動，藉以減緩治具電鍍流動空間111中電鍍液的流速，使電鍍流動空間111中各區域的電鍍液的高度上升趨於同步，而避免治具電鍍流動空間111中的電鍍液發生紊流，而使圓導電線選擇性區域的電鍍效果不均勻。如圖7所示，治具導流罩12係具有開口端朝向電鍍液入口112的ㄇ字型斷面。如圖8所示，夾持組件13係設於治具導流罩12的上方，具有彈性墊以彈性夾持圓導電線2。As shown in FIG. 1, FIG. 2 and FIG. 3, the electroplating jig 1 of the present invention has a jig body 11, a jig, a clamp assembly 13, and a lid 14. The jig body 11 can be made of a polypropylene material, and the side wall of the jig body 11 is provided with a side wall to form a jig plating liquid flow space 111, and the jig body 11 further has a perforation to form an exposed plating solution inlet 112. . The plating solution in the plating tank can enter the jig plating liquid flow space 111 of the jig body 11 through the plating solution inlet 112. The electroplating jig 1 shown in FIG. 1 further has an erecting rod 15 passing through the jig body 11, and the jig body 11 is mounted on the plating tank to provide positioning of the jig body 11. The jig shroud 12 can also be made of a polypropylene material. The jig guide 12 is placed in the jig plating liquid flow space 111, and has a flow guiding surface located above the plating liquid inlet 112 to guide the plating liquid entering the plating liquid flow space 111 from the plating liquid inlet 112 in a specific direction. Flowing, thereby slowing the flow rate of the plating solution in the electroplating flow space 111, so that the height of the plating solution in each region of the plating flow space 111 tends to be synchronized, and the turbulent flow of the plating solution in the plating plating flow space 111 is prevented. The plating effect of the selective area of the circular conductive line is not uniform. As shown in FIG. 7, the jig guide 12 has a U-shaped cross section with an open end facing the plating solution inlet 112. As shown in FIG. 8, the clamping assembly 13 is disposed above the jig shroud 12 and has an elastic pad for elastically holding the circular conductive wire 2.
關於夾持組件，如圖2及圖3所示，夾持組件13具有上、下夾座131、132以及上、下彈性墊133、134。較佳地，上夾座131與下夾座132具有相同的結構，而上彈性墊133與下彈性墊134具有相同的結構。上、下夾座131、132的側邊分別延伸出邊框1311、1321，以分別形成上、下內凹空間1312、1322。上、下彈性墊133、134係可分別容置於上、下內凹空間1312、1322，並可分別鎖附於上、下夾座131、132。上、下夾座131、132邊框左右兩端的相鄰處分別凹設有上、下孔槽13111、13211。於圖5所示，上、下孔槽的寬度尺寸W3與總和高度尺寸H係大於圓導電線2的線徑尺寸D，以避免上、下夾座131、132相對靠近時夾壞圓導電線2，使圓導電線2能順利經由上、下孔槽伸出夾持組件13。較佳地，上、下孔槽的寬度尺寸W3係至少大於圓導電線2線徑尺寸D的四倍，而使本發明的電鍍治具可同時對至少四條到六條的圓導電線2的選擇性區域進行電鍍，以提高電鍍產能。Regarding the clamping assembly, as shown in FIGS. 2 and 3, the clamping assembly 13 has upper and lower holders 131, 132 and upper and lower elastic pads 133, 134. Preferably, the upper holder 131 and the lower holder 132 have the same structure, and the upper elastic pad 133 has the same structure as the lower elastic pad 134. The side edges of the upper and lower holders 131, 132 respectively extend out of the frame 1311, 1321 to form upper and lower concave spaces 1312, 1322, respectively. The upper and lower elastic pads 133, 134 can be respectively received in the upper and lower concave spaces 1312, 1322, and can be respectively locked to the upper and lower holders 131, 132. Upper and lower holes 13111 and 13211 are recessed in the adjacent portions of the left and right ends of the upper and lower holders 131 and 132, respectively. As shown in FIG. 5, the width dimension W3 and the total height dimension H of the upper and lower holes are larger than the wire diameter D of the circular conductive wire 2, so as to prevent the upper and lower clamps 131, 132 from being close to each other when the circular conductive wire is broken. 2. The circular conductive wire 2 can be smoothly extended out of the clamp assembly 13 via the upper and lower holes. Preferably, the width dimension W3 of the upper and lower holes is at least four times larger than the wire diameter D of the circular conductive wire 2, so that the electroplating fixture of the present invention can simultaneously have at least four to six circular conductive wires 2 Selective areas are plated to increase plating capacity.
分別容置於上、下內凹空間1312、1322的上、下彈性墊133、134的頂面係分別高於上、下孔槽13111、13211的底面，當上、下彈性墊133、134相對靠近時可藉由兩者的頂面彈性夾持圓導電線，以對圓導電線提供夾持定位。夾持組件13對應圓導電線選擇性區域的特定部位還具有貫穿孔以形成複數電鍍液流道135，該些電鍍液流道135係貫穿該上、下夾座131、132以及上、下彈性墊133、134，俾使治具電鍍流動空間111中的電鍍液，能藉由電鍍液流道135流進夾持組件13，而接觸受到夾持組件13夾持的圓導電線的選擇性區域，以對圓導電線的選擇性區域進行電鍍。此時，上、下彈性墊133、134會包覆圓導電線2的非選擇性區域以提供遮蔽的效果，阻止圓導電線2的非選擇性區域與電鍍液接觸，故即便圓導電線被通上陰極電，圓導電線的非選擇性區域表面上也不會被鍍上電鍍材料，如此可減少電鍍槽中電鍍材料的浪費。The top surfaces of the upper and lower elastic pads 133, 134 respectively received in the upper and lower concave spaces 1312, 1322 are higher than the bottom surfaces of the upper and lower holes 13111, 13211, respectively, when the upper and lower elastic pads 133, 134 are opposite When close, the circular conductive lines can be elastically clamped by the top surfaces of the two to provide a clamping position for the circular conductive lines. The clamping component 13 further has a through hole for a specific portion of the selective area of the circular conductive line to form a plurality of plating liquid flow channels 135. The plating liquid flow paths 135 extend through the upper and lower clamping seats 131 and 132 and the upper and lower elastic portions. The pads 133, 134, so that the plating solution in the plating plating flow space 111 can flow into the clamping assembly 13 through the plating liquid flow path 135, and contact the selective region of the circular conductive wire held by the clamping member 13. , electroplating is performed on selective regions of the circular conductive lines. At this time, the upper and lower elastic pads 133, 134 may cover the non-selective region of the circular conductive wire 2 to provide a shielding effect, preventing the non-selective region of the circular conductive wire 2 from contacting the plating solution, so even if the circular conductive wire is By the cathode electricity, the non-selective region of the circular conductive wire is not plated with a plating material, which can reduce the waste of plating material in the plating bath.
應說明的是，如圖1所示，該些電鍍液流道135係可根據圓導電線2選擇性區域的範圍，隔開等距或非等距的距離。治具導流罩12不於完全遮蔽該些電鍍液流道135，使治具電鍍流動空間111中的電鍍液能夠順利經由該些電鍍液流道135流入夾持組件13，以接觸受到夾持組件13夾持的圓導電線的選擇性區域。It should be noted that, as shown in FIG. 1, the plating liquid flow channels 135 may be equidistant or non-equidistant distances according to the range of the selective regions of the circular conductive wires 2. The jig shroud 12 does not completely shield the plating liquid flow channels 135, so that the plating solution in the jig plating flow space 111 can smoothly flow into the clamping assembly 13 through the plating liquid flow channels 135 to be contacted and clamped. A selective area of the circular conductive line held by the assembly 13.
關於本發明的蓋體14，係可由聚丙烯材料製成，並可與該夾持組件13的上夾座131接合。蓋體14的四周環設有側壁以形成蓋體電鍍液流動空間141，以及具有穿孔以形成外露的電鍍液出口142，由上夾座131所流出的電鍍液可進入蓋體電鍍液流動空間141中，並經由電鍍液出口142流出電鍍治具1回到電鍍槽。本發明的電鍍治具還可於該蓋體電鍍液流動空間中設置蓋體導流罩，以藉由引導由上夾座所流出的電鍍液的朝特定的方向流動，達成蓋體電鍍液流動空間中電鍍液流速的減緩，於本發明的一實施例中，蓋體導流罩係可具有開口端朝向上夾座的ㄇ字型斷面。The cover 14 of the present invention may be made of a polypropylene material and engageable with the upper holder 131 of the clamp assembly 13. The cover body 14 is provided with a side wall to form a cover plating solution flow space 141, and a perforation to form an exposed plating solution outlet 142. The plating solution flowing out of the upper holder 131 can enter the cover plating solution flow space 141. And flowing out of the plating fixture 1 through the plating solution outlet 142 to return to the plating tank. The electroplating jig of the present invention can also provide a cover shroud in the flow space of the cover plating solution to guide the flow of the plating solution by guiding the plating solution flowing out of the upper holder to flow in a specific direction. In the embodiment of the present invention, the cover shroud may have a U-shaped cross section with an open end facing the upper clamp.
綜上所述，本發明乃提供一種電鍍治具，係具有夾持組件，以利用彈性墊彈性夾持圓導電線，而在電鍍時對圓導電線提供定位以及遮蔽。夾持組件對應圓導電線的選擇性區域的部位還形成有複數電鍍液流道，俾使電鍍液能夠穿過夾持組件，而與夾持的圓導電線的選擇性區域接觸，以對圓導電線的選擇性區域進行電鍍，如此以減少電鍍材料的浪費，本發明的電鍍治具可用於在雙絞線連接器導電端子的製程，以減少金的浪費。In summary, the present invention provides a plating fixture having a clamping assembly for elastically holding a circular conductive wire with an elastic pad to provide positioning and shielding of the circular conductive wire during plating. The portion of the clamping component corresponding to the selective region of the circular conductive line is further formed with a plurality of plating liquid flow channels, so that the plating solution can pass through the clamping assembly and contact with the selective region of the clamped circular conductive wire to The selective regions of the conductive lines are electroplated, so as to reduce the waste of the plating material, the electroplating jig of the present invention can be used in the process of the conductive terminals of the twisted pair connectors to reduce the waste of gold.
上述實施例僅例示性說明本發明之原理及功效，而非用於限制本發明。任何熟習此項技術之人士均可在不違背本發明之精神及範疇下，對上述實施例進行修飾與改變。因此，本發明之權利保護範圍，應如後述之申請專利範圍。The above embodiments are merely illustrative of the principles and effects of the invention and are not intended to limit the invention. Modifications and variations of the above-described embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the claims of the present invention should be as described in the following claims.
1‧‧‧電鍍治具
11‧‧‧治具本體
111‧‧‧治具電鍍液流動空間
112‧‧‧電鍍液入口
12‧‧‧治具導流罩
13‧‧‧夾持組件
131‧‧‧上夾座
1311‧‧‧邊框
13111‧‧‧上孔槽
1312‧‧‧上內凹空間
132‧‧‧下夾座
1321‧‧‧邊框
13211‧‧‧下孔槽
1322‧‧‧下內凹空間
133‧‧‧上彈性墊
134‧‧‧下彈性墊
135‧‧‧電鍍液流道
14‧‧‧蓋體
141‧‧‧蓋體電鍍液流動空間
142‧‧‧電鍍液出口
15‧‧‧架設桿
2‧‧‧圓導電線1‧‧‧Electroplating fixture
11‧‧‧ fixture body
111‧‧‧ Fixture plating solution flow space
112‧‧‧ plating solution inlet
12‧‧ ‧ fixture shroud
13‧‧‧Clamping components
131‧‧‧Upper holder
1311‧‧‧Border
13111‧‧‧Upper slot
1312‧‧‧Upper recessed space
132‧‧‧ lower holder
1321‧‧‧Border
13211‧‧‧low hole slot
1322‧‧‧ Under recessed space
133‧‧‧Upper elastic pad
134‧‧‧ under the elastic pad
135‧‧‧ plating solution flow channel
14‧‧‧ Cover
141‧‧‧ cover plating solution flow space
142‧‧‧ Electroplating solution outlet
15‧‧‧Setting rod
2‧‧‧ round conductive wire
【圖1】係本發明電鍍治具之一實施例的構件分解圖。 【圖2】係圖1所示電鍍治具之夾持組件第一視角的部分構件分解圖。 【圖3】係圖1所示電鍍治具之夾持組件第二視角的部分構件分解圖。 【圖4】係圖1所示電鍍治具的立體組合圖。 【圖5】係圖4所示電鍍治具中E區域的放大圖。 【圖6】係圖4所示電鍍治具沿AA線段截切的截面圖。 【圖7】係圖4所示電鍍治具沿BB線段截切的截面圖，圖7中標示的箭頭方向係為電鍍液在電鍍治具中的流動方向。 【圖8】係圖4所示電鍍治具沿CC線段截切的截面圖，圖8所示的圓導電線乃分別受夾持組件的上、下彈性墊夾持。 【圖9】係圖8所示電鍍治具中F區域的放大圖。Fig. 1 is an exploded perspective view showing an embodiment of an electroplating jig of the present invention. Fig. 2 is an exploded perspective view showing a part of the first viewing angle of the clamp assembly of the electroplating jig shown in Fig. 1. Fig. 3 is an exploded perspective view showing a part of the second viewing angle of the clamp assembly of the electroplating fixture shown in Fig. 1. Fig. 4 is a perspective assembled view of the electroplating jig shown in Fig. 1. Fig. 5 is an enlarged view of an E region in the electroplating fixture shown in Fig. 4. Fig. 6 is a cross-sectional view of the electroplating jig shown in Fig. 4 taken along line AA. 7 is a cross-sectional view of the electroplating jig shown in FIG. 4 taken along line BB, and the direction of the arrow indicated in FIG. 7 is the flow direction of the plating solution in the electroplating jig. 8 is a cross-sectional view of the electroplating fixture shown in FIG. 4 taken along line CC. The circular conductive lines shown in FIG. 8 are respectively clamped by the upper and lower elastic pads of the clamping assembly. Fig. 9 is an enlarged view of a F region in the electroplating jig shown in Fig. 8.
1‧‧‧電鍍治具 1‧‧‧Electroplating fixture
11‧‧‧治具本體 11‧‧‧ fixture body
111‧‧‧治具電鍍液流動空間 111‧‧‧ Fixture plating solution flow space
112‧‧‧電鍍液入口 112‧‧‧ plating solution inlet
12‧‧‧治具導流罩 12‧‧ ‧ fixture shroud
13‧‧‧夾持組件 13‧‧‧Clamping components
131‧‧‧上夾座 131‧‧‧Upper holder
132‧‧‧下夾座 132‧‧‧ lower holder
1321‧‧‧邊框 1321‧‧‧Border
1322‧‧‧下內凹空間 1322‧‧‧ Under recessed space
133‧‧‧上彈性墊 133‧‧‧Upper elastic pad
134‧‧‧下彈性墊 134‧‧‧ under the elastic pad
135‧‧‧電鍍液流道 135‧‧‧ plating solution flow channel
14‧‧‧蓋體 14‧‧‧ Cover
142‧‧‧電鍍液出口 142‧‧‧ Electroplating solution outlet
15‧‧‧架設桿 15‧‧‧Setting rod
2‧‧‧圓導電線 2‧‧‧ round conductive wire
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103124012A TWI554653B (en) | 2014-07-11 | 2014-07-11 | Electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103124012A TWI554653B (en) | 2014-07-11 | 2014-07-11 | Electroplating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201602422A TW201602422A (en) | 2016-01-16 |
| TWI554653B true TWI554653B (en) | 2016-10-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103124012A TWI554653B (en) | 2014-07-11 | 2014-07-11 | Electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI554653B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM272226U (en) * | 2005-03-18 | 2005-08-01 | Jun Star Entpr Co Ltd | Wafer electroplating fixture |
| CN101435102A (en) * | 2008-11-10 | 2009-05-20 | 昆山鼎鑫电子有限公司 | Jig fixing frame |
-
2014
- 2014-07-11 TW TW103124012A patent/TWI554653B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM272226U (en) * | 2005-03-18 | 2005-08-01 | Jun Star Entpr Co Ltd | Wafer electroplating fixture |
| CN101435102A (en) * | 2008-11-10 | 2009-05-20 | 昆山鼎鑫电子有限公司 | Jig fixing frame |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201602422A (en) | 2016-01-16 |
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