TWI553790B - 具有位置反向的微電子單元及封裝 - Google Patents
具有位置反向的微電子單元及封裝 Download PDFInfo
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- TWI553790B TWI553790B TW103106381A TW103106381A TWI553790B TW I553790 B TWI553790 B TW I553790B TW 103106381 A TW103106381 A TW 103106381A TW 103106381 A TW103106381 A TW 103106381A TW I553790 B TWI553790 B TW I553790B
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Description
本發明關於微電子封裝。
一典型半導體晶片係形成為一大體上薄的矩形立方體,具有前和後主要表面及延伸於該前表面和後表面之間的小小邊緣表面。該晶片的前表面和後表面之間的厚度或距離典型地係較在該前表面或後表面平面所測量的晶片長度和寬度小許多倍。該晶片典型地在它的前表面上具有接觸件且在連接至該接觸件的晶片內具有電子電路。使用時,該接觸件係電性連接至一較大型電路。通常,晶片係藉由處理一較大平面晶圓以同時形成許多晶片的電子電路和接觸件,並接著沿著形成個別晶片的邊緣或邊界且稱之為“小方塊切割道”的線將該晶圓切斷而製造之。
晶片典型地係安裝在稱之為封裝的結構。一封裝可包含例如具有終端於其上的小型電路面板的封裝基板。該晶片係實體上附接至該封裝基板,且該晶片的接觸件係電性連接至該封裝基板的終端。具有或沒有其它元件的封裝基板提供該晶片實體保護。甚至,該封裝基板的終端被安排以使得該整個封裝可輕易地安裝至一電路面板或其它結構以提供該晶片及該較大型電路之間的相互連接。許多晶片封裝具有較該晶片的接觸件
大、彼此間分開的比該晶片的接觸件的間隔更大或上述兩者的終端,使得該終端可使用例如表面黏著技術的標準接合技術來輕易地焊接至一較大型電路面板上的傳導性結構。例如,在一晶片封裝上的終端可被安排成對應至例如由該JEDEC固態技術協會所公告那些的正規或非正規工業標準的圖案。
某些半導體晶片係配備著它們的接觸件,置放成沿著該晶片前表面的行方向延伸的一或更多行中。典型地,該行方向係平行於該晶片的二邊緣。例如,該行接觸件或該行接觸件可被置放於該晶片的左和右邊緣間的中間並可平行於該晶片的邊緣。例如動態隨機存取記憶體(“DRAM”)晶片的記憶體晶片一般係提供於本架構中。本類型晶片一般係使用具有上和下表面、下表面處的終端及自該上表面延伸貫穿該基板至該下表面的槽孔形式的孔隙之封裝基板來封裝之。該基板可在鄰接該槽孔的下表面處具有接合墊片,該接合墊片係經由該封裝基板上的導線來電性連接至該終端。該晶片係以該晶片前表面面向下朝著該封裝基板且在該晶片上的該行接觸件或該行接觸件對準著該封裝基板中的槽孔來安裝至該封裝基板的上表面。該晶片的接觸件係經由延伸貫穿該封裝基板中的槽孔的打線來連接至該封裝基板的接合墊片,使得該晶片的接觸件係電性連接至該封裝基板的終端。該打線典型地係由填充該槽孔的密封劑所覆蓋。在該封裝基板下表面的終端可被接合至一電路面板上的接觸件墊片,使得該晶片係與整合於該電路面板內的較大型電路互相連接。
一些半導體封裝包含在一堆疊架構中的多個晶片並可在該電路板上佔據相同於或僅稍大於包含同類型單一晶片的封裝的區域。這個
保留該電路板上的空間。甚至,堆疊一封裝中的複數個晶片降低必須安裝至該電路板上以形成該完整電路的封裝數量,並因此可降低完成品的成本。將一堆疊架構中的複數個晶片的相對應接觸件連接至該封裝的共同終端通常係可行的。例如,包含幾乎全部晶片在內,複數個晶片的電力及地面接觸件可被連接至該封裝基板上的共同電力及地面終端。例如動態隨機存取記憶體晶片的記憶體晶片除了共同連接的電力及地面接觸件外,典型地還具有許多接觸件。例如,典型動態隨機存取記憶體晶片使用位址及命令接觸件,其被安排以使得複數個晶片的相對應位址及命令終端可被連接在一起以在操作期間接收相同訊號。每一個晶片典型地具有必須連接至該封裝基板上的唯一終端而不與其它晶片上的接觸件分享的一些其它接觸件。例如,在一封裝包含記憶體晶片的所在處,每一個晶片上的一或更多接觸件可被安排以接收指定一特定晶片為一讀取或寫入命令的接收者的晶片選擇訊號。
將一封裝內的複數個晶片的相對應接觸件連接至該封裝基板上的共同終端降低該封裝基板上所需的總終端數量。若一堆疊內的每一個晶片具有N接觸件,則堆疊架構中攜帶二晶片的封裝基板上的終端數量可相當地小於2N。這個係具有優勢的,因為它節省空間並簡化該封裝基板及該搭配電路板。
一堆疊封裝類型整合具有它的前面面向下朝著該封裝基板且它的後面面向上離開該封裝基板的一底部晶片。一頂部晶片係置放於該底部晶片上方。該頂部晶片的後面面向下,而該頂部晶片的前面面向上,使得該頂部及底部晶片被安排成後面對後面或“背對背”架構。在該堆疊
內的兩晶片具有鄰接它們各自前表面的中間所置放的接觸行的所在處,如同上述在該動態隨機存取記憶體晶片中般地,該底部晶片可如上述以相同方式使用延伸貫穿該封裝基板中的槽孔至鄰接該槽孔的接合墊片的打線來電性連接至該封裝基板的終端。該頂部晶片的面向上接觸件可經由打線來連接至該封裝基板,該打線延伸自該頂部晶片的接觸件,透過該頂部晶片的前面並經過該頂部晶片的邊緣,延伸向下鄰接該堆疊晶片的邊緣。這些打線連結封裝基板上靠近該底部晶片的邊緣置放的額外接合墊片。該額外接合墊片也經由該基板上的傳導性導線來連接至該封裝基板上的終端。
在每一個晶片具有二行或更多行接觸件時,包含一左行和一右行,因為該堆疊內的二晶片的相反方位而引起一問題。以前面向上方位置放的頂部晶片具有置放於該封裝基板的參考畫面左邊的左行接觸件並具有置放於相同參考畫面的右邊的右接觸件。換言之,該頂部晶片的左行接觸件置於較接近該基板的左邊緣,而該頂部晶片的右行接觸件置於較接近該基板的右邊緣。然而,該底部晶片係一反向的前面向下方位。因此,該底部晶片的左行接觸件置於較接近該基板的右邊緣,而該底部晶片的右行接觸件置於較接近該基板的左邊緣。來自該底部晶片的右行接觸件的打線會落在沿著該槽孔左邊緣的接合墊片上。在該封裝基板上提供與該槽孔交叉的導線係困難的。因此,在該底部晶片上的右接觸行的接觸件必須被連接至置放於該槽孔及該基板左邊緣之間的終端。反之,該底部晶片的左行接觸件會被連接至置放於該槽孔右邊緣及該基板右邊緣之間的終端。
若該二晶片的相對應接觸件係欲連接至該封裝基板上的共同終端,則源自該頂部晶片上的左行接觸件的打線中至少一些必須通過該
頂部晶片的前面到達該右邊且必須跨越該頂部晶片的右邊緣並連接至鄰接該封裝基板右邊緣的墊片。反之,源自該頂部晶片上右行的接觸件的至少一些打線必須通過該頂部晶片的左邊緣並連結鄰接該基板左邊緣的導線。這個暗示著源自該頂部晶片上的接觸件中至少一些的導線彼此間會交叉。這類安排會引入可靠性問題,尤其是在該打線於該行方向緊密地分隔之處。該打線可例如於製造期間經由施用於覆蓋該打線的密封劑來取代於該行方向中。這類取代會推動一打線接觸一鄰接交叉打線。這類接觸可導致錯誤繞線訊號並使得該封裝晶片不動作。因此,進一步改進會是可期待的。
本發明一觀點提供一半導體單元。根據本發明本觀點的單元包含一第一晶片,具有相對方向的前和後表面並具有與該前和後表面接界且在一橫向方向上彼此互相隔開的左和右邊緣。該第一晶片在該前表面也具有左行接觸件和右行接觸件。該行接觸件延伸於橫切至該左-右方向的行方向。根據本發明本觀點的單元也整合位在該晶片前表面上方的互連墊片。該互連墊片係連接至該接觸件中的至少一些。該互連墊片連同該接觸件或者該互連墊片單獨形成一外部連接構件陣列。該外部連接構件係連接至該晶片的接觸件,使得一第一組外部連接構件被置放於一第二組外部連接構件的左邊,該第一組外部連接構件包含至少一些該右行接觸件或連接至該右行接觸件的互連墊片,該第二組包含至少一些該左行接觸件或連接至該左行接觸件的互連墊片。換言之,該外部連接構件陣列包含至少一些外部連接構件,其中,該左行接觸件和右行接觸件的位置係反向的。
這類單元尤其可被使用於具有上述背對背方位的堆疊封裝
中。在該堆疊封裝中的晶片之一係如上述地由一單元所取代的所在處,可消除對於交叉打線的需求。
該晶片的接觸件可成對地安排,每一對包含該左行接觸件中的一者和該右行接觸件中的一者,且與該接觸件對中的至少一些聯結的互連墊片也可成對地安排。每一個互連墊片對可包含連接至該聯結接觸件對中的一接觸件的左互連墊片及置放於該左互連墊片右邊且連接至該聯結接觸件對中的另一接觸件的右互連墊片。該第一組外部連接構件可包含該左互連墊片,而該第二組外部連接構件可包含該右互連墊片。該接觸件對可包含一或更多反向對。每一個反向對的左互連墊片係連接至該聯結接觸件對的右接觸件,而每一個反向對的右互連墊片係電性連接至該聯結接觸件對的左接觸件。該接觸件對也可包含一或更多非反向對。在一非反向對中,該左互連墊片係連接至該聯結接觸件對的左接觸件,而該右互連墊片係連接至該聯結接觸件對的右接觸件。
該互連墊片對可被置放以使得各對的左互連墊片形成一左行互連墊片且各對的右互連墊片形成一右行互連墊片,該行互連墊片延伸於該行方向,平行於該晶片上的行接觸件。該單元可包含一重分佈層,位於該晶片前表面的至少一部分上方。該重分佈層可包含該互連墊片,且可包含將該互連墊片連接至該晶片上的接觸件中的至少一些的重分佈導體。
替代性地,該單元可包含置放於該晶片前表面上的重分佈中介層。該互連墊片可被置放於該重分佈中介層上。該重分佈中介層也可具有例如經由該重分佈中介層上的導線來電性連接至該互連墊片的接合墊片。該接合墊片係經由打線連接至該晶片的接觸件,使得該晶片的接觸件
被電性連接至該互連墊片。該接觸件和互連墊片可被提供做為反向或非反向墊片,依據該重分佈中介層上重分佈導線的安排而定。該接合墊片可成對地置放,每一個接合墊片對係與一互連墊片對和一接觸件對聯結。每一個接合墊片對可期待地包含一左接合墊片和一右接合墊片。該左接合墊片可期待地係經由一第一打線來連接至該聯結接觸件對的右接觸件,而該右接合墊片可經由一第二打線來連接至該聯結接觸件對的左接觸件。該第二打線可延伸於該第一打線上方,使得該第一和第二打線彼此間不會交叉。
在一進一步變化例中,該晶片的接觸件中的一些可充當外部連接構件,而該晶片的其它接觸件係電性連接至充當外部連接構件的互連墊片。
本發明一進一步觀點提供一半導體封裝。根據本發明本觀點的封裝可期待地包含一晶片,具有相對方向的前和後表面、在與該前和後表面接界的左-右方向上彼此互相隔開的左和右邊緣及在橫切於該左-右方向的行方向上延伸的前表面處的左行接觸件和右行接觸件。根據本發明本觀點的半導體封裝也包含位在該第一晶片前表面上方的互連墊片。再次地,該互連墊片係連接至該接觸件中的至少一些。該互連墊片和該接觸件或該互連墊片單獨形成一外部連接構件陣列,使得一第一組外部連接構件被置放於第二組外部連接構件的左邊,該第一組外部連接構件包含至少一些該右行接觸件或連接至該右行接觸件的互連墊片的,該第二組外部連接構件包含至少一些該左行接觸件或連接至該左行接觸件的互連墊片。
根據本發明本觀點的封裝可期待地包含一封裝基板。該第一晶片可期待地係以該第一半導體晶片的前表面面向上方式來置放於該封裝
基板上方。該封裝可期待地也包含透過該第一半導體晶片的左邊緣自該第一組外部連接構件延伸至該封裝基板的左引線及透過該第一半導體晶片的右邊緣自該第二組外部連接構件延伸至該封裝基板的右引線。該左和右引線可以是打線。該封裝可進一步包含一第二或底部晶片,其也具有相對方向的前表面和後表面、在該晶片的左-右方向上彼此互相隔開且與該前和後表面接界的左邊緣和右邊緣。該第一晶片和該第二晶片可期待地係以該晶片的後表面彼此面對且該第二晶片前表面的面向下的堆疊方式來置放之。因此,該第一晶片的左邊緣和該第二晶片的右邊緣定義該堆疊的左邊,而該第一晶片的右邊緣和該第二晶片的左邊緣定義該堆疊的右邊。該封裝基板可期待地具有一底部表面及在該底部表面處的終端。該終端中的至少一些可期待地係透過該左引線和右引線來電性連接至該第一晶片上的接觸件中的至少一些,使得終端及該第一晶片的接觸件之間的電性連接中的至少一些包含該互連墊片。在該封裝基板上的終端中的至少一些可期待地也被電性連接至該第二晶片的接觸件。該終端中的至少一些可期待地係共同終端,每一個共同終端係連接至該第一晶片的一接觸件及該第二晶片的一接觸件。較佳地,該第一和第二晶片的接觸件係以實際上相同的安排來置放於該第一和第二晶片的前表面上,且該共同終端係連接至該第一和第二晶片上相對應位置處的接觸件。該封裝基板可具有對準著該第二晶片的接觸件的接合視窗,例如,一槽孔。因此,該終端可包含自該接合視窗往該堆疊左邊並列的左終端及自該接合視窗往該堆疊右邊並列的右終端。該左終端中的至少一些可期待地係透過該左引線來連接至該第一晶片的接觸件,而該右終端中的至少一些可期待地係透過該右引線來連接至該第一晶片的
接觸件。再次地,該封裝可不需交叉打線來製造之,而仍可具有連接至共同終端的接觸件。
本發明更多其它觀點包含製造晶片封裝的方法。根據本發明本觀點的方法可期待地包含提供一包含上述單元的套件及一封裝基板,該單元係置放於該封裝基板上方,使得該單元內的第一半導體晶片的前表面面向上遠離該封裝基板。根據本發明本觀點的方法可期待地包含連接左引線以使得該左引線透過該第一晶片左邊緣自該第一組外部連接構件延伸至該封裝基板,及連接右引線以使得該右引線透過該第一晶片右邊緣自該第二組外部連接構件延伸至該封裝基板。
本發明這個及其它目的、特徵與優勢會因為結合該附圖來進行下述較佳具體實施例的詳細說明而更加顯而易見。
20、120、220、221、320、321、420‧‧‧晶片
22、122、222、322‧‧‧前表面
24、124‧‧‧後表面
26、126、156、226、326、426‧‧‧右邊緣
28、128、158、228、328、428‧‧‧左邊緣
30‧‧‧第一末端
32‧‧‧第二末端
34、34a、34b、134b、234、234a、234b、334、334a、334b、434‧‧‧左接觸件
36、36a、36b、136b、236、236a、236b、336、336a、336b、436‧‧‧右接觸件
38‧‧‧電子電路
40、40a、40b、240、240a、240b、440、440a、440b‧‧‧左互連墊片
42、42a、42b、242、242a、242b、342、342a、442、442a、442b‧‧‧右互連墊片
44、172、174、344‧‧‧導線
102‧‧‧左側
150、252、352‧‧‧封裝基板
152‧‧‧上表面
154‧‧‧下表面
160、260、360‧‧‧槽孔或孔隙
162‧‧‧右終端
164‧‧‧左終端
168、170、203、203a、205、205a‧‧‧接合墊片
180、184、186、209、211、284、286、386‧‧‧引線或打線
182‧‧‧虛擬中間平面
190‧‧‧理論性中間表面
201‧‧‧重分佈中介層
207‧‧‧導體
X‧‧‧橫向方向
Y‧‧‧行方向
圖1係根據本發明一實施例的單元的示意性俯視平面圖。
圖2係說明整合圖1單元以結合其它構件的封裝的示意性剖面立視圖。
圖3係根據本發明一進一步實施例的單元的示意性俯視平面圖。
圖4係說明整合圖3單元以結合其它構件的晶片封裝的示意性剖面立視圖。
圖5係根據本發明再一實施例的單元的示意性俯視平面圖。
圖6係說明整合圖5單元以結合其它構件的封裝的示意性剖面立視圖。
圖7係根據本發明再一實施例的單元的示意性俯視平面圖。
根據本發明一實施例的半導體單元包含一第一晶片20,具有面朝著圖1觀看者的前表面22及在圖2末端視野所見的後表面24。該晶片也具有一右邊緣26和一左邊緣28,彼此間在以圖1所示箭頭“X”的左至右或橫向方向上被隔開。甚至,該晶片具有一第一末端30及一第二末端32,彼此間在橫切於該左至右或橫向方向的行方向上被隔開,該行方向係由圖1箭頭“X”表示之。該晶片在該前表面也具有一左行接觸件34和一右行接觸件36。如參考至例如一晶片或基板的結構來使用於本揭示地,一電性傳導構件係“在”一結構表面的陳述指示著當該結構未與任何其它構件進行組合時,該電性傳導構件係可用於接觸在垂直於該結構表面的方向上自該結構外部往該結構表面移動的理論點。因此,在一結構表面的終端、接觸件或其它傳導構件可凸出自這類表面;可齊平於這類表面;或可凹陷至該結構內相對應這類表面的孔洞或凹地中。進一步,該晶片具有圖1虛線所述的內部電子電路38。
該行接觸件34和36延伸於與邊緣26和28平行的行方向。該左行接觸件和該右行接觸件係置放於一相當窄的細長接觸區域。例如,該接觸區域在該橫向方向的寬度可實際上小於該晶片的寬度,例如,小於幾毫米寬,而典型地為小於1毫米寬。該接觸區域可鄰接等距於該右邊緣26和左邊緣28的晶片中間平面來置放之。在所示特定實施例中,全部接觸件係以接觸件對方式來置放,每一個這類接觸件對包含一左接觸件34和一右接觸件36。基於簡潔說明起見,只有少數接觸件和少數內部電路被描述。在實務上,一晶片可具有數千接觸件並可具有數百萬或數十憶內部電子電路。同時,該晶片厚度或該前表面22及後表面24間的距離相對於圖2晶片
的其餘者尺寸係大大地擴大。
單元20進一步包含位在該晶片前表面上方且因此也置放於該前表面的左互連墊片40和右互連墊片42。該互連墊片也被置放於在該行或Y方向延伸的行中。互連墊片40和42也是成對地安排,每一對包含一左互連墊片40和一右互連墊片42。該互連墊片係經由重分佈導體以利用一接觸件34或36將導線44連接每一個互連墊片40和42的方式來連接至該接觸件。因此,使得每一個互連墊片對係電性連接至一接觸件對並聯結該接觸件對。該互連墊片和導線可經由使用例如沉積及蝕刻例如銅與金的傳導性材料的製程的傳統方法來製造之。該互連墊片和導線可直接形成在例如一氧化物或氮化物層的保護層上的晶片前表面22上、形成於該晶片製造期間或可沉積在例如黏接至該晶片前表面的旋塗上介電層類的介電塗佈層上方。該重分佈導體或導線和該互連墊片可形成於該晶片係將該晶片自晶圓中切斷前的整合許多晶片的晶圓內之時。該導線可選擇性地由一進一步介電層(未顯示)所覆蓋,但是這類進一步介電層應在該互連墊片40和42處具有開口。
該聯結接觸件和互連墊片對包含反向對和非反向對。在每一個非反向對中,該左互連墊片40係連接至該聯結接觸件對的左接觸件34,而該右互連墊片42係連接至該聯結接觸件對的右接觸件36。例如,互連墊片40a和42a係一非反向對。該左互連墊片40a係連接至該左接觸件34a,而該右互連墊片42a係連接至該聯結接觸件對的右接觸件36a。在每一個反向對中,該左互連墊片係連接至該聯結接觸件對的右接觸件,而該右互連墊片係連接至該聯結接觸件對的左接觸件。例如,互連墊片40b和42b係一
反向對。左互連墊片40b係連接至該右接觸件36b,而右互連墊片42b係連接至該左接觸件34b。
該左行互連墊片40構成一第一組外部連接構件。這組包含至少一些外部連接構件(該反向組的互連墊片,例如,墊片40b),其係連接至該右行接觸件的接觸件36。該第一組外部連接構件40位於一第二組外部連接構件的左邊;亦即,該右行互連墊片42。該第二組外部連接構件42包含至少一些外部連接構件,其係連接至該左行的接觸件34;亦即,例如互連墊片42b的反向組的右行互連墊片42。然而,該第一組外部連接構件(墊片40)係置放於該第二組的左邊。
根據本發明一實施例的封裝整合圖1單元與一第二半導體晶片120(圖2)在一起。晶片120係與該第一晶片20相同。因此,該晶片具有一前表面122和一後表面124,以及如上述地在該前表面處安排成一行行與一對對的接觸件。只有這些接觸件134b和136b中的二者係可見於圖2中。晶片120也具有一右邊緣126和一左邊緣128。然而,晶片120係以該前表面122面向下且該後表面124面向上的方式來置放之。因此,該左和右邊緣位置相對於該第一晶片20的位置係反向的。換言之,除了該第二晶片自圖1所示第一晶片位置繞著該行方向延伸的軸旋轉180度之外,第二晶片120係相同於第一晶片20。因此,該第二晶片的右邊緣126係朝著圖2所示圖式的左邊來置放並因此對準著該第一晶片20的左邊緣28。同時,該第二晶片的左邊緣128係朝著該圖式的右邊來置放並對準著該第一晶片的右邊緣126。
該二晶片係以該第二或底部晶片的後表面124面向上且該
第一或頂部晶片20置放於該第二晶片上方的方式背對背地安裝。該第一或頂部晶片20係以該前面22面向上且該後表面24面向下朝著該第二晶片的後表面124的面向上方位來置放之。為了方便起見,由該第一晶片的右邊緣26和該第二晶片的左邊緣128所定義的晶片堆疊側104係稱之為該堆疊右邊,而由該第一晶片的左邊緣28和該第二晶片的右邊緣126所定義的堆疊相對側102係稱之為該堆疊左邊。
因為第二或底部晶片12係反向的,該行接觸件位置也與該第一晶片的位置反向。因此,例如圖2所示接觸件的右行接觸件位置較接近該第二晶片的右邊緣126且因此較例如接觸件134b的左行接觸件更接近該堆疊左邊102。
該封裝進一步包含一封裝基板150。該封裝基板150具有一上表面152及一下表面154。該封裝基板具有一右邊緣156及一左邊緣158,以及平行延伸於該基板左和右邊緣,即進出圖2所見圖式平面的槽孔形式的孔隙160。該封裝基板包含例如終端的電性傳導特性。該終端包含置放在孔隙160和右邊緣156之間的右終端162,及置放在該封裝基板的槽孔或孔隙160和左邊緣158之間的左終端164。該電性傳導特性進一步包含在其相對側上沿著孔隙160延伸的基板下表面154處的中央行基板接合墊片168與鄰接該基板右和左邊緣來置放的周邊行基板接合墊片170。該周邊基板接合墊片被安排以接觸來自該上表面152上方,往下行朝著該基板的打線。換言之,該周邊基板接合墊片係在上表面152處。
該封裝基板進一步包含右導線172,其係利用位於該孔隙160右邊的中央基板接合墊片168及鄰接該基板右邊緣156的周邊基板接合
墊片170來連接各種右終端162的細長電性導體。甚至,該基板包含連接該左終端164至位於該孔隙160左邊的中央基板接合墊片168並與鄰接左邊緣158置放的周邊基板接合墊片170連接的左導線174。
該封裝基板150係置放於該第二或下晶片120下方,使得該基板的邊緣156和158平行延伸於該晶片邊緣。換言之,該邊緣156、158延伸於該晶片的行方向,且該槽孔或孔隙160也延伸於進出圖2所見圖式平面的行方向。該第二晶片120的面向下前表面122因此面對該封裝基板的上表面152。一黏接劑(未顯示)或其它接合劑可被提供於這些表面之間以將該堆疊晶片緊固至該封裝基板。該第二晶片的行接觸件134和136係對準著該封裝基板中的槽孔或孔隙160。
該第二晶片的接觸件係經由打線180來連接至該基板中央接合墊片168。打線180被安排以使得來自位在較接近該堆疊右邊緣和該基板右邊緣的第二晶片左行接觸件(例如接觸件134b)的打線延伸至該右邊並延伸至沿著該孔隙160右邊緣平放的基板中央接合墊片168。反之,例如圖2所見接觸件136b的右行接觸件位在較接近該堆疊左邊緣102和該基板左邊緣158。延伸自例如接觸件136b的第二晶片的右接觸件列的打線延伸至該堆疊和基板參考畫面中的左邊,並因此延伸至平放於該孔隙或槽孔160左邊的中央基板接合墊片。因此,這些打線未與在該行方向延伸的槽孔160的一虛擬中間平面182交叉,且彼此間也未交叉。
左打線184形式的左引線延伸自該第一組的外部連接構件,即該左行互連墊片40。這些左引線或打線184自該第一晶片參考畫面及該堆疊和封裝基板參考畫面中的第一組外部連接構件或互連墊片40延伸
至該左邊。這些左引線或打線184延伸過該第一晶片左邊緣28並延伸向下至該封裝基板,其中,它們連結鄰接該基板左邊緣158置放的周邊接合墊片170。因此,該左引線184係電性連接至該左導線174並至左終端164。
打線186形式的右引線自該一晶片的第二組外部連接構件或互連墊片42延伸該右邊(在該第一晶片、堆疊及封裝基板的參考畫面中)。這些右引線或打線186延伸過該第一晶片右邊緣26並向下至該封裝基板,其中,它們連結鄰接該封裝基板右邊緣156置放的基板周邊接合墊片170。因此,該右引線係電性連接至該右導線172並因此至右終端162。
該左引線184和右引線186彼此間不交叉。該左引線係完全地置放於一理論性中間表面190的左邊,該中間表面置放於該第一組外部連接構件或左互連墊片40及該第二組外部連接構件或接觸件墊片42之間。
上述安排有助於將該二晶片上相對應接觸件連接至一共同終端。例如,第一晶片20的右行接觸件36b對應至第二晶片120的右行接觸件136b。這些接觸件中的每一個係位在該個別晶片的完全相同位置上。因為該第一晶片的右接觸件36b係聯結著一反向互連墊片對,故該右接觸件36b係連接至該左互連墊片40b並因此經由一左引線或打線184來連接至該封裝基板左邊緣處的接合墊片170。因此,該右接觸件36b係電性連接至該封裝基板上的一左導線。類似地,該右接觸件136b係經由一打線來連接至位在該孔隙160左邊的基板中央接合墊片168並因此也連接至一左導線174。這些左導線中的每一個可到達該左終端164的任一者而不與該孔隙或槽孔160交叉。若這些左導線中的兩者被連接至一左終端164,則這個提供接觸件36b和136b兩者的共同繞線至這類終端。
基於相同理由,該第一晶片的左接觸件34b係透過外部連接構件或互連墊片42b來連接至一右導線172,而該第二晶片的左接觸件134b也是經由一打線180來連接至一左導線172。因此,這兩個接觸件在想要時可被繞路至該右終端162中的一共同終端,不再對延伸跨越該孔隙或槽孔160的導線有任何需要。本繞線並未交叉打線而同時被完成。甚至,不需要製造相對或鏡射影像佈局的晶片;兩晶片20和120具有相同的結構。因此,可以低成本大量取得的共同製造晶片可被運用於該封裝中。
根據本發明(圖3)一進一步實施例的單元整合與上面參考至圖1和2所述晶片20類似或相同的晶片220。因此,晶片220包含與該晶片前表面222接界的右邊緣226和左邊緣228。再次地,該左和右邊緣彼此間在一橫向或左至右方向上係互相並列的。該晶片包含一左行接觸件234和一右行接觸件236,該行延伸於橫切至該橫向方向的行方向。再次地,該橫向方向係由圖3的箭頭“X”所標示,且該行方向係由圖3的箭頭“Y”所標示。
該單元包含一左行互連墊片240及位在該晶片前表面222上方的一右行互連墊片242。在本實施例中,互連墊片240和242係實現於其可為一小型介電材料件形式的重分佈中介層201上。該重分佈中介層係例如經由一黏接劑(未顯示)來緊固至該晶片的前表面222。重分佈中介層201也支持一第一接合墊片或右邊行接合墊片203及一第二接合墊片或左邊行接合墊片205。該接合墊片係經由該重分佈中介層201所攜帶的導線或導體207來連接至該互連墊片240和242。再次地,該接觸件234和236被成對地安排,使得每一個這類接觸件對包含該左行的一接觸件234及該右行的
一接觸件236。同樣地,該互連墊片240、242也被成對地安排,每一對包含一左互連墊片240及一右互連墊片242。該接合墊片203和205同樣被成對地安排,每一個這類接合墊片對包含一右或第一接合墊片203和一第二或左接合墊片205。每一互連墊片240、242對係聯結著一接合墊片203、205對與一接觸件234、236對。該接觸件和接合墊片被安排以使得對於每一接合墊片203、205對和該聯結接觸件234、236對而言,具有置放在寬間距橫向位置的第一或右接合墊片203和第一或左接觸件234。同時,該對中的第二接合墊片(該左接合墊片205)和該聯結接觸件對中的第二接觸件(該右接觸件236)係置放於該第一接合墊片及第一接觸件的橫向位置之間的橫向位置。換言之,該第二接合墊片205和接觸件236係置放於該第一接合墊片203及該第一接觸件234之間。
每一對中的第一或右邊接合墊片203係最佳如圖4立視圖所見地經由一第一打線209來連接至該晶片上的聯結接觸件對中的第一或左邊接觸件234。每一對中的第二或左邊接合墊片205係經由一第二打線211來連接至該晶片上的聯結接觸件對中的第二或右邊接觸件236。聯結著每一接合墊片對的第一打線209延伸於聯結著相同接合墊片對的第二打線211上方。也就是,該第一打線209以較該第二打線211大的距離延伸自該晶片前表面222。因此,與每一對聯結的第二打線係在與相同接合墊片對聯結的第一打線209內進行套疊。該打線211和209彼此間未交叉。
同樣在本實施例中,該接觸件234和236與互連墊片240和242對包含反向對和非反向對。在一反向對中,該左互連墊片240係連接至該右接觸件236,而該右互連墊片242係連接至該聯結接觸件對的左接觸件
234。例如,互連墊片240和240a形成一反向對。該左互連墊片240a係連接至該聯結接合墊片對中的第二或左接合墊片205a。接合墊片205a接著係連接至該聯結接觸件對的第二或右接觸件236a。反之,該右互連墊片242a係連接至該第一或右接合墊片203a,其接著係連接至該第一或左接觸件234a。在例如接觸件墊片240b和242b的非反向對中,在該重分佈中介層201的導線安排係反向的,使得該左互連墊片240b係連接至該聯結對的右或第一接合墊片,其接著經過連接至該聯結接觸件對的左接觸件234b來連接至該聯結對的左或第一接觸件234b。反之,該右互連墊片242b係連接至該第二或左邊互連墊片205b並因此電性連接至該聯結接觸件對的第二或右接觸件236b。
本類型單元可被使用於結合一第二半導體晶片221(圖4)和與上面連接圖1所述實際上相同的基板252以形成一封裝。再次地,該第一組互連墊片或左行互連墊片240係經由左引線或打線284來連接,其自該第一組互連構件或墊片240,透過該晶片220的左邊緣228並向下朝著該封裝基板252來延伸至該左邊。該第二組互連構件242係經由右引線或打線286來連接,其自該第些互連墊片242並透過該晶片220的右邊緣226到達基板252來延伸至該右邊。
同樣在本實施例中,該左行互連墊片240形成一第一組外部連接構件。該第一組外部連接構件包含至少一些互連墊片或連接構件,其係連接至該右行接觸件的接觸件236。再次地,該右互連墊片242形成一第二組外部連接構件。這些構件包含至少一些外部連接構件或接觸件墊片242,其係連接到至少一些該左行接觸件234。然而,該第一組外部連接構
件或互連墊片240位於該第二組外部連接構件或互連墊片242的左邊。
根據圖3和4實施例的單元和封裝可提供相同於上面參考至圖1所述單元及封裝的功能。再次地,不需要任何交叉打線,或在封裝基板252內交叉該槽孔260的任何導線。連接該接觸件至該接合墊片203和205的套疊打線209和211彼此間未交叉,且同樣地,該左打線284和右打線286彼此間也未交叉。該左引線284延伸於該打線209和211上方,並未交叉於這些打線。
根據一進一步實施例(圖5)的單元整合一第一半導體晶片320,其再次地具有一右邊緣326和一左邊緣328,彼此間在一左至右或橫向方向上互相並列的,且再次地具有一左行接觸件334和一右行接觸件336,延伸於橫切至該橫向方向的行方向。再次地,該接觸件334和336係提供於該晶片前表面322處。根據圖5的單元進一步包含互連墊片342,延伸於與該行接觸件334和336平行的行互連墊片。該行互連墊片342係置放於該右行接觸件336的右邊。該互連墊片342係經由類似於上面參考至圖1所述導線44的導線344來連接至該左行接觸件334。在本實施例中,該晶片的某些接觸件,連同該互連墊片一起充當該單元的外部連接構件。一反向外部連接構件對包含例如接觸件336a的右接觸件及電性連接至一左接觸件334a的互連墊片342a。該左接觸件334a未充當一外部連接構件來使用,且可經由例如連接至其上的導線或一介電材料所覆蓋。一非反向外部連接構件對係由例如接觸件334b和336b的接觸件對所提供,並未具有任何互連墊片。在本實施例中,該互連墊片及該接觸件中的一些共同合作地形成該外部連接構件陣列。該陣列包含由該非反向對中的左接觸件334和該反向
對中的右接觸件336所構成的第一組外部連接構件。該第一組的外部連接構件係示於圖5和6中的實線圈所圈住者。該外部連接構件陣列也包含由該非反向對中的右接觸件336和該接觸件墊片342所構成的第二組外部連接構件。該第二組外部連接構件係示於圖5和6中的虛線圈所圈住者。該第一組外部連接構件包含至少一些該右行接觸件且係完全地置放於該第二組外部連接構件的左邊。在本實施例中,如上述實施例般地,反向對數量係完全可選擇的。該單元可利用反向對所提供的全部外部連接構件對,或者只利用一或少數反向對來產生之。
如圖6中所述地,圖5單元可被使用於類似上述封裝的半導體封裝中。再次地,該單元係連結類似上述相對應構件的第二半導體晶片321和封裝基板352來使用之。再次地,左引線或打線延伸自例如接觸件336a的第一組外部連接構件,透過該第一晶片320的左邊緣328到達該封裝基板。右引線或打線386延伸自例如互連墊片342的第二組外部連接構件,透過該第一晶片的右邊緣326,並延伸向下到達該封裝基板352。本實施例可提供類似上述那些的繞線優勢。再次地,包含連接該晶片的相對應接觸件至該基板上的共同終端的對該封裝基板上的終端的連接可被產生而不需要交叉打線,也不需要將該封裝基板上的導線交叉該封裝基板內為了容納聯結著該第二晶片321的打線所使用的孔隙360。
再根據一進一步實施例(圖7)的單元具有一第一半導體晶片420,內含與該晶片前表面接界的右邊緣426和左邊緣428。再次地,該晶片具有一左行接觸件434及一右行接觸件436。本實施例包含一左行互連墊片440及一右行互連墊片442。在本實施例中,該互連墊片充當該單元的外
部連接構件。同樣在本實施例中,該互連墊片係成對地提供,其可為一反向對或非反向對。在一反向對中,該左行互連構件440係連接至該聯結對中的右行接觸件436,且該右行互連墊片442係連接至該聯結對中的右行接觸件434。例如,互連墊片440a和442a係一反向對。在例如互連墊片440b和442b的非反向對中,該左行互連墊片440b係連接至該左邊接觸件434,而該右行互連墊片442b係連接至該右行接觸件436。在本實施例中,再次地,該左行互連墊片440形成一第一組外部連接構件,而該右行互連墊片442形成一第二組外部連接構件。再次地,該第一組係置放於該第二組左邊,並包含連接至該右行的接觸件的至少一些外部連接構件。在本實施例中,該二行互連墊片係置放於該行接觸件的相對側。同時,在本實施例中,該行互連墊片位置鄰接該晶片的邊緣426和428。這個允許使用較短打線來連接至一封裝基板。
上述特性的許多變化及結合可被利用而不偏離本發明,例如,在例如上面對圖2、4和6所述封裝的二晶片封裝中,該第一和第二晶片位置可為反向的。也就是,整合該第一晶片和例如互連墊片的外部連接構件的單元可以面向下方位來置放,具有該第一晶片的前面面向下且具有該單元的外部連接構件對準著該封裝基板內的槽孔。替代性地,整合上述外部連接構件的單元可被利用於沒有一第二晶片且具有不是面向上就是面向下方位來定位的單元的單一晶片封裝中,或於具有或不具有複數個晶片的其它封裝形式中。
整合於具有例如互連墊片的外部連接構件的單元中的晶片可具有大於二行的接觸件,且任二行的接觸件可充當在此所參考的右接觸
件和左接觸件。
在上述特性的這些和許多其它變化及結合可被利用而不偏離本發明時,前述較佳實施例說明應是舉例說明申請專利範圍所定義的本發明,而非限制用。
20‧‧‧第一晶片
22‧‧‧前表面
24‧‧‧後表面
26‧‧‧右邊緣
28‧‧‧左邊緣
30‧‧‧第一末端
32‧‧‧第二末端
34、34a、34b、36、36a、36b‧‧‧接觸件
38‧‧‧電子電路
40、40a、40b、42、42a、42b‧‧‧互連墊片
44‧‧‧導線
Claims (28)
- 一種半導體單元,包括:(a)一第一晶片,具有相對方向的前表面和後表面,在一橫向方向上彼此互相隔開且與該前表面和該後表面接界的左邊緣和右邊緣,及於橫切至該橫向方向的行方向上延伸且在該前表面處的左行接觸件和右行接觸件;以及(b)互連墊片,其位在該晶片前表面上方,該互連墊片係連接到至少一些該接觸件,該互連墊片與該接觸件或是該互連墊片單獨形成一外部連接構件的陣列,使得一第一組外部連接構件被置放於一第二組外部連接構件的左邊,該第一組外部連接構件包含至少一些該右行接觸件或連接至該右行接觸件的互連墊片,該第二組外部連接構件包含至少一些該左行接觸件或連接至該左行接觸件的互連墊片。
- 如申請專利範圍第1項所述之半導體單元,其中該互連墊片構成全部的外部連接構件。
- 如申請專利範圍第1項所述之半導體單元,其中,該互連墊片係安排成至少一行,每一行互連墊片延伸於該行方向且在該橫向方向上與該行接觸件並列。
- 如申請專利範圍第1項所述之半導體單元,其中,該接觸件包含接觸件對,其包含該左行接觸件的一者及該右行接觸件的一者,該互連墊片包含互連墊片對,其與至少一些該接觸件對相關,此類每一個互連墊片對包含連接至相關的該接觸件對中的一接觸件之一左互連墊片,以及置放於該左互連墊片右邊並連接至相關的該接觸件對中的另一接觸件的之一右互連 墊片,該第一組外部連接構件包含該左互連墊片,該第二組外部連接構件包含該右互連墊片。
- 如申請專利範圍第4項所述之半導體單元,其中,該互連墊片對包含一或更多反向對,每一個反向對的左互連墊片係連接至相關的該接觸件對的右接觸件,每一個反向對的右互連墊片係連接至相關的該接觸件對的左接觸件。
- 如申請專利範圍第5項所述之半導體單元,其中,該互連墊片對包含一或更多非反向對,每一個非反向對的左互連墊片係連接至相關的該接觸件對的左接觸件,每一個反向對的右互連墊片係連接至相關的該接觸件對的右接觸件。
- 如申請專利範圍第6項所述之半導體單元,其中,該接觸件對被置放以使得該左互連墊片形成一左行互連墊片且該右互連墊片形成一右行互連墊片,該行互連墊片延伸於該行方向。
- 如申請專利範圍第7項所述之半導體單元,其中,該左行互連墊片和該右行互連墊片係置放於該右行接觸件的右邊。
- 如申請專利範圍第8項所述之半導體單元,其中,該左行互連墊片和該右行互連墊片彼此間係相鄰置放。
- 如申請專利範圍第8項所述之半導體單元,進一步包括置放於該晶片的前表面上的一重分佈中介層,該互連墊片係置放於該重分佈中介層上,該重分佈中介層上也具有電性連接至該互連墊片的接合墊片,該互連墊片係透過該接合墊片來電性連接至該接觸件。
- 如申請專利範圍第10項所述之半導體單元,其中,該接合墊片係成 對地置放,每一個接合墊片對係與該互連墊片對中之一者與該接觸件對中之一者相關,該接合墊片和該接觸件被安排以使得對於每一個接合墊片對及相關的該接觸件對而言,一第一接合墊片和一第一接觸件係置放於彼此互相隔開的橫向方向上的位置處,且一第二接合墊片和一第二接觸件係置放於該第一接合墊片位置和該第一接觸件位置之間的橫向方向上的位置處,該單元進一步包括連接該第一接觸件與該第一接合墊片的第一打線,及連接該第二接觸件與該第二接合墊片的第二打線。
- 如申請專利範圍第11項所述之半導體單元,其中,該第一打線延伸於該第二打線上方。
- 如申請專利範圍第1項所述之半導體單元,進一步包括位在該晶片的前表面中至少一部分上方的一重分佈層,該重分佈層包含該互連墊片和連接該互連墊片至該晶片上的接觸件中的至少一些的重分佈導體。
- 如申請專利範圍第13項所述之半導體單元,其中,該互連墊片包含置放於該右行接觸件右邊的右互連墊片,以及置放於該左行接觸件左邊的左互連墊片,至少一些該右互連墊片連接至該左行接觸件,至少一些該左互連墊片連接至該右行接觸件。
- 如申請專利範圍第14項所述之半導體單元,其中,該左行接觸件和該右行接觸件係位在該晶片的左邊緣和右邊緣遠端,該左互連墊片係鄰接該晶片的左邊緣而置放,且該右互連墊片係鄰接該晶片的右邊緣而置放。
- 如申請專利範圍第1項所述之半導體單元,其中,該晶片係一記憶體晶片,且其中,連接至該第一互連墊片的接觸件包含位址及資料接觸件。
- 一種處理複數個實際上相同的半導體晶片的方法,其包括在一些該 晶片上提供互連墊片,藉此形成申請專利範圍第1項所述之半導體單元並使得其他該晶片沒有該互連墊片。
- 一種半導體封裝,包括:(a)一第一晶片,具有相對方向的前表面和後表面,在一橫向方向上彼此互相隔開且與該前表面和該後表面接界的左邊緣和右邊緣,及延伸於橫切至該橫向方向的行方向上的前表面處的左行接觸件和右行接觸件;以及(b)互連墊片,其位在該第一晶片前表面上方,該互連墊片係連接至至少一些該接觸件,該互連墊片與該接觸件或是該互連墊片單獨形成一外部連接構件的陣列,使得一第一組外部連接構件被置放於一第二組外部連接構件的左邊,該第一組外部連接構件包含至少一些該右行接觸件或連接至該右行接觸件的互連墊片,該第二組外部連接構件包含至少一些該左行接觸件或連接至該左行接觸件的互連墊片;(c)一封裝基板,該第一晶片係以該第一半導體晶片的前表面面向下方式來置放於該封裝基板上方;(d)左引線,自該第一組外部連接構件透過該第一半導體晶片的左邊緣來延伸至該封裝基板;(e)右引線,自該第二組外部連接構件透過該第一半導體晶片的右邊緣來延伸至該封裝基板。
- 如申請專利範圍第18項所述之半導體封裝,其中,該左引線和該左右引線係打線。
- 如申請專利範圍第18項所述之半導體封裝,進一步包括一第二晶片,具有相對方向的前表面和後表面,在一橫向方向上彼此互相隔開且與 該前表面和該後表面接界的左邊緣和右邊緣,及在該前表面處的接觸件,該第一晶片和該第二晶片係以其後表面面對彼此的方式堆疊置放,該第二晶片的前表面面向下,使得該第一晶片的左邊緣和該第二晶片的右邊緣定義該堆疊的左邊,而該第二晶片的前表面面向下,使得該第一晶片的右邊緣和該第二晶片的左邊緣定義該堆疊的右邊。
- 如申請專利範圍第20項所述之半導體封裝,其中,該封裝基板具有一底部表面及在該底部表面處的終端,至少一些該終端係透過該左引線和該右引線來電性連接至該第一晶片上的至少一些接觸件,在該第一晶片的終端及接觸件之間的至少一些電性連接包含該互連墊片。
- 如申請專利範圍第21項所述之半導體封裝,其中,該封裝基板的至少一些終端也是電性連接至該第二晶片的接觸件,至少一些該終端係共同終端,每一個共同終端係連接至該第一晶片的接觸件和該第二晶片的接觸件。
- 如申請專利範圍第22項所述之半導體封裝,其中,該第一晶片和該第二晶片的接觸件係以實際上相同的安排來置放於該第一晶片和該第二晶片的前表面上,且其中,該共同終端係連接至該第一晶片和該第二晶片上相對應位置的接觸件。
- 如申請專利範圍第23項所述之半導體封裝,其中,該第一晶片和該第二晶片彼此間實際上係相同的。
- 如申請專利範圍第24項所述之半導體封裝,其中,該第一晶片和該第二晶片係記憶體晶片,且其中,該共同終端係連接至該第一晶片和該第二晶片的位址及資料接觸件。
- 如申請專利範圍第18項所述之半導體封裝,其中,該封裝基板具有對準著該第二晶片接觸件的一接合視窗。
- 如申請專利範圍第26項所述之半導體封裝,其中,該終端包含朝著該堆疊的左邊與該接合視窗並列的左終端,以及朝著該堆疊的右邊與該接合視窗並列的右終端,至少一些該左終端係透過該左引線來連接至該第一晶片的接觸件,至少一些該右終端係透過該右引線來連接至該第一晶片的接觸件。
- 一種製造晶片封裝的方法包括:(a)提供一套件,包含:(1)一單元,包含:(i)一第一晶片,具有相對方向的前表面和後表面,在一橫向方向上彼此互相隔開且與該前表面和該後表面接界的左邊緣和右邊緣,及延伸於橫切至該橫向方向的行方向上的前表面處的左行接觸件和右行接觸件;及(ii)位在該晶片前表面上方的互連墊片,該互連墊片係連接至至少一些該接觸件,該互連墊片與該接觸件或者該互連墊片單獨形成一外部連接陣列,使得一第一組外部連接構件被置放於一第二組外部連接構件的左邊,該第一組外部連接構件包含至少一些該右行接觸件或連接至該右行接觸件的互連墊片,該第二組外部連接構件包含至少一些該左行接觸件或連接至該左行接觸件的互連墊片;(2)一封裝基板,該第一晶片係以該第一半導體晶片的前表面面向下方式來置放於該封裝基板上方;及 (b)連接左引線,使得該左引線延伸自該第一組外部連接構件,透過該第一晶片的左邊緣而到達該封裝基板;以及(c)連接右引線,使得該右引線延伸自該第一組外部連接構件,透過該第一晶片的右邊緣而到達該封裝基板。
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