TWI551204B - Assembly jig and assembly method - Google Patents
Assembly jig and assembly method Download PDFInfo
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- TWI551204B TWI551204B TW101121587A TW101121587A TWI551204B TW I551204 B TWI551204 B TW I551204B TW 101121587 A TW101121587 A TW 101121587A TW 101121587 A TW101121587 A TW 101121587A TW I551204 B TWI551204 B TW I551204B
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Description
本發明是有關於一種組裝治具以及組裝方法，特別是有關於一種顯示器相關的組裝治具以及組裝方法。 The present invention relates to an assembly jig and an assembly method, and more particularly to a display related assembly jig and assembly method.
近年來，由於電子、資訊工業的迅速發展，其相關之產品亦日益精密。就目前個人電腦領域觀之，除了尋求更高速、運算能力更強之計算功能之運算單元和各式各樣週邊設備之配合來滿足使用者需求外，針對輕薄短小之可攜式電腦亦為業界發展之重點領域。以液晶顯示器為例，其具有高畫質、體積小、重量輕、低電壓驅動、低消耗功率及應用範圍廣等優點，故廣泛地應用於可攜式電視、行動電話、攝錄放影機、筆記型電腦、桌上型顯示器等消費性電子產品中，成為顯示器的主流。 In recent years, due to the rapid development of electronics and information industry, its related products have become increasingly sophisticated. In the current field of the personal computer, in addition to the search for a higher-speed, more computationally-computing computing unit and a wide range of peripheral devices to meet the needs of users, the portable computer for thin and light is also the industry. Key areas of development. Taking liquid crystal display as an example, it has the advantages of high image quality, small size, light weight, low voltage driving, low power consumption and wide application range, so it is widely used in portable TVs, mobile phones, video recorders. In consumer electronics such as notebook computers and desktop monitors, it has become the mainstream of displays.
隨著人們對顯示裝置的厚度要求有越來越薄的趨勢，因此顯示裝置內的各主要元件(例如，顯示面板、背光模組…等)也必須越做越薄。以液晶顯示器的顯示面板來說，在其組裝過程中，顯示面板的軟性電路板(Flexible Printed Circuit,FPC)通常會被彎折以黏合至顯示面板的背面，藉以在有限的空間內與液晶顯示器中的其他元件(例如，背光模組)電性連接。 As people have become thinner and thinner on the thickness requirements of display devices, the main components (eg, display panels, backlight modules, etc.) within the display device must also become thinner and thinner. In the display panel of the liquid crystal display, during the assembly process, the flexible printed circuit (FPC) of the display panel is usually bent to be bonded to the back of the display panel, thereby allowing the liquid crystal display to be in a limited space. Other components in the device (for example, a backlight module) are electrically connected.
目前，為了將顯示面板的軟性電路板彎折以黏合至顯示面板的背面，一種現有的習知組裝治具包含載台以及樞接載台的蓋體。習知組裝治具的載台具有定位槽。習知組 裝治具的使用方法，主要包含下列步驟：(a)將顯示面板放入定位槽中；(b)將蓋體蓋合於顯示面板上，蓋體局部覆蓋顯示面板；以及(c)將軟性電路板相對顯示面板彎折，軟性電路板疊置於未被蓋體覆蓋的區域，並於對齊蓋體的邊緣之後將軟性電路板抹平壓合至顯示面板的背面，即以蓋體邊緣為對位基準將軟性電路板抹平壓合至顯示面板上。 At present, in order to bend a flexible circuit board of a display panel to be bonded to the back surface of a display panel, a conventional conventional assembly jig includes a stage and a cover body of the pivoting stage. The stage of the conventional assembly fixture has a positioning groove. Learning group The method for using the fixture mainly includes the following steps: (a) placing the display panel into the positioning slot; (b) covering the cover to the display panel, the cover partially covering the display panel; and (c) softening The circuit board is bent relative to the display panel, and the flexible circuit board is stacked on the area not covered by the cover body, and after the edge of the cover body is aligned, the flexible circuit board is smoothed and pressed to the back surface of the display panel, that is, the edge of the cover body is The alignment reference flattens the flexible circuit board onto the display panel.
然而，習知組裝治具的使用方法往往面臨以下的問題點：(1)由於軟性電路板是軟性的，因此在軟性電路板對齊蓋體的邊緣以及抹平壓合至顯示面板的背面的過程中，容易發生材料變形而影響製程能力指標(Capability Index,CPK)；(2)需要操作人員手動地將軟性電路板對齊蓋體的邊緣，不夠防呆；以及(3)手動地定位軟性電路板耗費操作人員的心力與負擔，進而使得生產效率降低。 However, the conventional method of using the assembly jig often faces the following problems: (1) Since the flexible circuit board is soft, the process of aligning the edge of the cover with the flexible circuit board and smearing the back surface of the display panel Medium, prone to material deformation affecting the Capability Index (CPK); (2) requiring the operator to manually align the flexible circuit board to the edge of the cover, not enough to prevent fool; and (3) manually positioning the flexible circuit board It takes the effort and burden of the operator, which in turn reduces production efficiency.
為解決習知技術的問題，本發明的一技術樣態是一種組裝治具，其主要可以定位槽中的定位結構卡合並定位軟性電路板的邊緣，並可以定位槽卡合並定位面板的邊緣。因此，為了完成將軟性電路板彎折以黏合至面板的背面的程序，可先將軟性電路板卡合並定位於定位槽中的定位結構，再將面板卡合並定位於定位槽，最後再將面板沿定位槽的側壁朝向軟性電路板壓合。藉此，本發明的組裝治具除了可藉由定位結構與定位槽分別確保軟性電路板與面板之間的相對位置之外，還可避免使用習知組裝治具的過程中因抹平壓合等動作造成軟性電路板形變而影響軟性電路 板相對面板的定位精度的問題發生。並且，由於本發明的組裝治具可分別卡合並定位軟性電路板與面板，因此操作人員在進行將軟性電路板彎折以黏合至面板的背面的程序時，相較於使用習知組裝治具除了可更精確之外，還可更省時。 In order to solve the problem of the prior art, a technical aspect of the present invention is an assembly jig, which can mainly position a positioning structure in a slot to form an edge of a flexible circuit board, and can position the slot card to merge the edge of the positioning panel. Therefore, in order to complete the process of bending the flexible circuit board to be bonded to the back side of the panel, the flexible circuit board card may be firstly positioned and positioned in the positioning structure in the positioning slot, and then the panel card is merged and positioned in the positioning slot, and finally the panel is assembled. Pressing along the sidewall of the positioning groove toward the flexible circuit board. Therefore, in addition to ensuring the relative position between the flexible circuit board and the panel by the positioning structure and the positioning groove, the assembly jig of the present invention can also avoid the flat pressing by using the conventional assembly jig. Other actions cause soft board deformation and affect the soft circuit The problem of the positioning accuracy of the board relative to the panel occurs. Moreover, since the assembly jig of the present invention can be respectively engaged with the positioning flexible circuit board and the panel, the operator performs the procedure of bending the flexible circuit board to adhere to the back surface of the panel, compared to using the conventional assembly jig. In addition to being more precise, it can be more time-saving.
根據本發明的一種組裝治具係用以組裝相互連接的面板與軟性電路板。組裝治具包含載台以及定位結構。載台具有定位槽。定位槽用以容納面板，並卡合面板的邊緣。定位結構設置於定位槽的底部。定位結構用以卡合軟性電路板的邊緣。當面板於定位槽中壓合軟性電路板時，定位結構相對定位槽的底部的距離等於或小於軟性電路板的厚度。 An assembly jig according to the present invention is used to assemble interconnected panels and flexible circuit boards. The assembly jig includes a stage and a positioning structure. The stage has a positioning groove. The positioning slot is used to receive the panel and engage the edge of the panel. The positioning structure is disposed at the bottom of the positioning groove. The positioning structure is used to engage the edge of the flexible circuit board. When the panel presses the flexible circuit board in the positioning groove, the distance of the positioning structure from the bottom of the positioning groove is equal to or smaller than the thickness of the flexible circuit board.
本發明的另一技術樣態是一種組裝方法。 Another aspect of the invention is an assembly method.
根據本發明的一種組裝方法係用以組裝相互連接的面板與軟性電路板。組裝方法包含下列步驟。提供組裝治具，其中組裝治具包含載台及定位結構，載台具有定位槽，定位結構設置於定位槽的底部。卡合軟性電路板的邊緣至定位結構。相對軟性電路板翻轉面板，致使面板位於軟性電路板上方。卡合經翻轉的面板的邊緣至定位槽。壓合經翻轉的面板至軟性電路板。 An assembly method in accordance with the present invention is used to assemble interconnected panels and flexible circuit boards. The assembly method consists of the following steps. The assembly fixture is provided, wherein the assembly fixture comprises a loading platform and a positioning structure, the loading platform has a positioning groove, and the positioning structure is disposed at the bottom of the positioning groove. Engage the edge of the flexible board to the positioning structure. The relatively flexible board flips the panel so that the panel is above the flexible board. Engage the edge of the flipped panel to the locating slot. Press the flipped panel onto the flexible board.
以下將以圖式揭露本發明的複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本發明。 也就是說，在本發明部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示。 The embodiments of the present invention are disclosed in the following drawings, and for the purpose of clarity However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic representation.
本發明的一技術態樣是一種組裝治具。更具體地說，其主要係以定位槽中的定位結構卡合並定位軟性電路板的邊緣，並可以定位槽卡合並定位面板的邊緣。為了完成將軟性電路板彎折以黏合至面板的背面的程序，可先將軟性電路板卡合並定位於定位槽中的定位結構，再將面板卡合並定位於定位槽，最後再將面板沿定位槽的側壁朝向軟性電路板壓合。 One aspect of the present invention is an assembly jig. More specifically, it mainly integrates the edge of the flexible circuit board by positioning the positioning structure in the positioning slot, and can position the slot card to merge the edge of the positioning panel. In order to complete the process of bending the flexible circuit board to be bonded to the back side of the panel, the flexible circuit board card may be firstly positioned and positioned in the positioning structure in the positioning slot, and then the panel card is merged and positioned in the positioning slot, and finally the panel edge is positioned. The sidewalls of the slots are pressed toward the flexible circuit board.
請參照第1A圖、第1B圖以及第1C圖。第1A圖為繪示依照本發明一實施例的組裝治具1的立體圖，其中軟性電路板200受定位塊102卡合。第1B圖為繪示第1A圖中的組裝治具1的立體圖，其中壓條106壓抵部分軟性電路板200。第1C圖為繪示第1A圖中的組裝治具1的立體圖，其中面板20卡合定位槽100並壓合至軟性電路板200。 Please refer to FIG. 1A, FIG. 1B, and FIG. 1C. FIG. 1A is a perspective view showing the assembly jig 1 in which the flexible circuit board 200 is engaged by the positioning block 102 in accordance with an embodiment of the present invention. FIG. 1B is a perspective view showing the assembly jig 1 of FIG. 1A in which the bead 106 is pressed against a portion of the flexible circuit board 200. 1C is a perspective view showing the assembly jig 1 in FIG. 1A, in which the panel 20 is engaged with the positioning groove 100 and pressed to the flexible circuit board 200.
本發明的組裝治具1可以應用來使連接面板20的軟性電路板200進行彎折，並於定位之後壓合至面板20的背面，但並不以此為限。換言之，任何產品內只要有將兩板材壓合在一起的需求時，皆可應用本發明的組裝治具1來進行板材的定位與壓合的功能。以下將進行本發明各實施例的詳述。 The assembly jig 1 of the present invention can be applied to bend the flexible circuit board 200 of the connection panel 20 and press it to the back surface of the panel 20 after positioning, but is not limited thereto. In other words, the assembly jig 1 of the present invention can be applied to the positioning and pressing of the sheet material in any product as long as there is a need to press the two sheets together. The details of the various embodiments of the invention are set forth below.
如第1A圖、第1B圖與第1C圖所示，於本實施例中，組裝治具1用以組裝相互連接的面板20與軟性電路板200。面板20具有相對的顯示面20a(亦即，第1C圖中的 面板20朝上的一面)以及背面20b(亦即，第1A圖中的面板20朝上的一面)。軟性電路板200具有貼合面200a。當軟性電路板200未相對面板20彎折並翻轉時，軟性電路板200的貼合面200a與面板20的背面20b皆朝同一方向，如第1A圖所示。組裝治具1包含載台10以及定位結構。組裝治具1的載台10具有定位槽100。載台10的定位槽100用以容納面板20，並可卡合面板20的邊緣，藉以定位面板20。因此，面板20可沿著定位槽100的側壁朝向或遠離定位槽100的底部移動。組裝治具1的定位結構設置於定位槽100的底部。組裝治具1的定位結構用以卡合軟性電路板200的邊緣，藉以定位軟性電路板200。 As shown in FIG. 1A, FIG. 1B and FIG. 1C, in the present embodiment, the assembly jig 1 is used to assemble the interconnected panel 20 and the flexible circuit board 200. The panel 20 has an opposite display surface 20a (ie, in FIG. 1C) The upper side of the panel 20) and the back side 20b (i.e., the side of the panel 20 in Fig. 1A facing upward). The flexible circuit board 200 has a bonding surface 200a. When the flexible circuit board 200 is not bent and turned over with respect to the panel 20, the bonding surface 200a of the flexible circuit board 200 and the back surface 20b of the panel 20 are all facing in the same direction, as shown in FIG. 1A. The assembly jig 1 includes a stage 10 and a positioning structure. The stage 10 on which the jig 1 is assembled has a positioning groove 100. The positioning slot 100 of the stage 10 is used to receive the panel 20 and can engage the edge of the panel 20 to position the panel 20. Therefore, the panel 20 can move toward or away from the bottom of the positioning groove 100 along the sidewall of the positioning groove 100. The positioning structure of the assembly jig 1 is disposed at the bottom of the positioning groove 100. The positioning structure of the assembly jig 1 is used to engage the edge of the flexible circuit board 200 to position the flexible circuit board 200.
請參照第2A圖以及第2B圖。第2A圖為繪示第1A圖中的組裝治具1沿線段2A-2A’的剖面示意圖，其中面板20尚未壓合至軟性電路板200。第2B圖為繪示第1C圖中的組裝治具1沿線段2B-2B’的剖面示意圖，其中面板20已壓合至軟性電路板200。 Please refer to Figure 2A and Figure 2B. Fig. 2A is a schematic cross-sectional view showing the assembly jig 1 of Fig. 1A along the line segment 2A-2A', wherein the panel 20 has not been pressed to the flexible circuit board 200. Fig. 2B is a schematic cross-sectional view showing the assembly jig 1 of Fig. 1C taken along line 2B-2B', wherein the panel 20 has been pressed to the flexible circuit board 200.
如第2A圖與第2B圖所示，於本實施例中，組裝治具1的定位結構包含複數個定位塊102。定位結構的定位塊102設置於定位槽100的底部。軟性電路板200的邊緣卡合並定位於定位塊102之間。定位塊102的數量可依據需求而彈性地調整。另外，組裝治具1的載台10具有複數個容置空間100a。載台10的每一容置空間100a皆連通定位槽100。組裝治具1進一步包含複數個彈性件104。組裝治具1的每一彈性件104皆分別容納於對應的容置空間100a中。定位結構的每一定位塊102由定位槽100部分穿入對 應的容置空間100a，並接觸對應的彈性件104。於本實施例中，組裝治具1的彈性件104為壓縮彈簧，但並不以此為限。於另一實施例中，組裝治具1的彈性件104還可為拉伸彈簧、彈片…等元件。 As shown in FIGS. 2A and 2B, in the present embodiment, the positioning structure of the assembly jig 1 includes a plurality of positioning blocks 102. The positioning block 102 of the positioning structure is disposed at the bottom of the positioning slot 100. The edges of the flexible circuit board 200 are card-joined and positioned between the positioning blocks 102. The number of positioning blocks 102 can be flexibly adjusted as needed. Further, the stage 10 on which the jig 1 is assembled has a plurality of accommodation spaces 100a. Each of the accommodating spaces 100a of the stage 10 communicates with the positioning groove 100. The assembly jig 1 further includes a plurality of elastic members 104. Each of the elastic members 104 of the assembly jig 1 is respectively accommodated in the corresponding accommodating space 100a. Each positioning block 102 of the positioning structure is partially penetrated by the positioning slot 100 The space 100a is accommodated and contacts the corresponding elastic member 104. In the present embodiment, the elastic member 104 of the assembly jig 1 is a compression spring, but is not limited thereto. In another embodiment, the elastic member 104 of the assembly jig 1 may also be an element such as a tension spring, a spring piece, or the like.
本發明的組裝治具1於第2A圖與第2B圖的結構配置之下，在面板20於載台10的定位槽100中朝向軟性電路板200壓合的過程中，面板20會先以背面20b抵靠定位結構的定位塊102，並使每一定位塊102壓縮對應的彈性件104。並且，在面板20的背面20b完整壓合軟性電路板200的貼合面200a時，每一定位塊102相對定位槽100的底部的高度恰好等於軟性電路板200的厚度(如第2B圖所示)。而當面板20的背面20b未抵靠定位結構的定位塊102時，組裝治具1的每一彈性件104係將對應的定位塊102朝向定位槽100推擠，進而使每一定位塊102相對定位槽100的底部的高度大於軟性電路板200的厚度(如第2A圖所示)。 In the structural arrangement of the assembly jig 1 of the present invention, in the structural arrangement of the second and second embodiments, the panel 20 is firstly pressed in the process of pressing the panel 20 into the positioning slot 100 of the stage 10 toward the flexible circuit board 200. The 20b abuts the positioning block 102 of the positioning structure and causes each positioning block 102 to compress the corresponding elastic member 104. Moreover, when the back surface 20b of the panel 20 is completely pressed against the bonding surface 200a of the flexible circuit board 200, the height of each positioning block 102 relative to the bottom of the positioning slot 100 is exactly equal to the thickness of the flexible circuit board 200 (as shown in FIG. 2B). ). When the back surface 20b of the panel 20 does not abut the positioning block 102 of the positioning structure, each elastic member 104 of the assembly jig 1 pushes the corresponding positioning block 102 toward the positioning slot 100, thereby making each positioning block 102 relatively The height of the bottom of the positioning groove 100 is greater than the thickness of the flexible circuit board 200 (as shown in FIG. 2A).
如第1A圖、第1B圖與第1C圖所示，於本實施例中，組裝治具1進一步可包含壓條106。組裝治具1的壓條106樞設於載台10。當軟性電路板200受定位結構的定位塊102定位時，壓條106可朝向軟性電路板200相對載台10旋轉，進而可將部分軟性電路板200(亦即，第1A圖中軟性電路板200左側突出的部位)壓抵至定位槽100的底部。進一步來說，組裝治具1的壓條106包含本體106a以及壓抵部106b。壓條106的本體106a樞設於載台10，並可於軟性電路板200受定位結構的定位塊102定位時朝向軟性電 路板200相對載台10旋轉。壓條106的壓抵部106b設置於本體106a上，並可於本體106a抵靠載台10時延伸至定位槽100中將部分軟性電路板200壓抵至定位槽100的底部。換言之，當壓條106的本體106a抵靠載台10時，壓條106的壓抵部106b同時於定位槽100中壓抵軟性電路板200。藉此，本發明的組裝治具1在固定軟性電路板200時，除了以定位槽100中的定位塊102卡合並定位軟性電路板200之外，還可藉由壓條106的壓抵部106b壓抵並固定軟性電路板200至定位槽100的底部。 As shown in FIG. 1A, FIG. 1B and FIG. 1C, in the present embodiment, the assembly jig 1 may further include a bead 106. The bead 106 of the assembly jig 1 is pivotally mounted on the stage 10. When the flexible circuit board 200 is positioned by the positioning block 102 of the positioning structure, the bead 106 can be rotated toward the flexible circuit board 200 relative to the stage 10, so that part of the flexible circuit board 200 can be replaced (ie, the left side of the flexible circuit board 200 in FIG. 1A). The protruding portion is pressed against the bottom of the positioning groove 100. Further, the bead 106 of the jig 1 includes a body 106a and a pressing portion 106b. The body 106a of the bead 106 is pivotally mounted on the stage 10, and can be oriented toward the soft state when the flexible circuit board 200 is positioned by the positioning block 102 of the positioning structure. The road board 200 rotates relative to the stage 10. The pressing portion 106b of the bead 106 is disposed on the body 106a, and can extend into the positioning slot 100 when the body 106a abuts the stage 10 to press a portion of the flexible circuit board 200 against the bottom of the positioning slot 100. In other words, when the body 106a of the bead 106 abuts against the stage 10, the pressing portion 106b of the bead 106 is simultaneously pressed against the flexible circuit board 200 in the positioning groove 100. Therefore, the fixing jig 1 of the present invention can be pressed by the pressing portion 106b of the bead 106 in addition to the positioning of the flexible circuit board 200 by the positioning block 102 in the positioning groove 100 when the flexible circuit board 200 is fixed. The flexible circuit board 200 is abutted and fixed to the bottom of the positioning slot 100.
同樣示於第1A圖，於本實施例中，組裝治具1的載台10進一步包含第一固定件108。組裝治具1的壓條106進一步包含第二固定件106c。第二固定件106c設置於壓條106的本體106a，並可於本體106a抵靠載台10時與第一固定件108相互固定。於一實施例中，載台10的第一固定件108與壓條106的第二固定件106c皆為磁性元件，因此第二固定件106c可於本體106a抵靠載台10時與第一固定件108相互吸附而固定，但並不以此為限。於另一實施例中，載台10的第一固定件108可為磁性元件，壓條106的第二固定件106c的材料可包含鐵，抑或載台10的第一固定件108的材料可包含鐵，壓條106的第二固定件106c可為磁性元件，同樣可達到使第一固定件108與第二固定件106c相互吸附而固定的目的。 Also shown in FIG. 1A, in the present embodiment, the stage 10 of the assembly jig 1 further includes a first fixing member 108. The bead 106 of the assembly jig 1 further includes a second fixing member 106c. The second fixing member 106c is disposed on the body 106a of the bead 106, and is fixed to the first fixing member 108 when the body 106a abuts against the stage 10. In one embodiment, the first fixing member 108 of the stage 10 and the second fixing member 106c of the bead 106 are both magnetic elements, so that the second fixing member 106c can be opposite to the first fixing member when the body 106a abuts the stage 10. 108 is adsorbed and fixed to each other, but is not limited thereto. In another embodiment, the first fixing member 108 of the stage 10 may be a magnetic element, and the material of the second fixing member 106c of the bead 106 may include iron, or the material of the first fixing member 108 of the stage 10 may include iron. The second fixing member 106c of the bead 106 can be a magnetic element, and the purpose of the first fixing member 108 and the second fixing member 106c being adsorbed and fixed to each other can also be achieved.
於另一實施例中，載台10的第一固定件108為一卡合件，壓條106的第二固定件106c為另一卡合件，因此第二固定件106c可於本體106a抵靠載台10時與第一固定件 108相互卡合而固定。 In another embodiment, the first fixing member 108 of the loading platform 10 is a locking member, and the second fixing member 106c of the pressing strip 106 is another engaging member, so that the second fixing member 106c can bear against the body 106a. Table 10 and the first fixture 108 is engaged with each other and fixed.
請參照第3圖。第3圖為繪示依照本發明另一實施例的組裝治具3的剖面示意圖。 Please refer to Figure 3. FIG. 3 is a cross-sectional view showing the assembly jig 3 according to another embodiment of the present invention.
如第3圖所示，於本實施例中，組裝治具3包含載台30以及定位結構。組裝治具3的定位結構包含複數個定位塊302。組裝治具3的載台30具有定位槽300。載台30的定位槽300用以容納面板20，並可卡合面板20的邊緣，藉以定位面板20。面板20可沿著定位槽300的側壁朝向或遠離定位槽300的底部移動。組裝治具3的定位塊302設置於定位槽300的底部。組裝治具3的定位結構用以卡合軟性電路板200的邊緣，藉以定位軟性電路板200。 As shown in Fig. 3, in the present embodiment, the assembly jig 3 includes a stage 30 and a positioning structure. The positioning structure of the assembly jig 3 includes a plurality of positioning blocks 302. The stage 30 on which the jig 3 is assembled has a positioning groove 300. The positioning slot 300 of the stage 30 is used to receive the panel 20 and can engage the edge of the panel 20 to position the panel 20. The panel 20 is movable toward or away from the bottom of the positioning slot 300 along the sidewall of the positioning slot 300. The positioning block 302 of the assembly jig 3 is disposed at the bottom of the positioning groove 300. The positioning structure of the assembly jig 3 is used to engage the edge of the flexible circuit board 200 to position the flexible circuit board 200.
在此要說明的是，本實施例的組裝治具3與第2A圖與第2B圖所示的組裝治具1的差異處，在於本實施例的組裝治具3設置於定位槽300的底部的定位塊302為固定高度。並且，於本實施例中，組裝治具3的定位塊302相對定位槽300的底部的高度小於軟性電路板200的厚度，因此在面板20於載台30的定位槽300中朝向軟性電路板200的貼合面200a壓合的過程中，定位塊302並不會因為受到面板20抵靠而相對定位槽300的底部移動(如第3圖所示)。 It is to be noted that the difference between the assembly jig 3 of the present embodiment and the assembly jig 1 shown in FIGS. 2A and 2B is that the assembly jig 3 of the present embodiment is disposed at the bottom of the positioning groove 300. The positioning block 302 is a fixed height. Moreover, in the present embodiment, the height of the positioning block 302 of the assembly jig 3 relative to the bottom of the positioning slot 300 is smaller than the thickness of the flexible circuit board 200, so that the panel 20 faces the flexible circuit board 200 in the positioning slot 300 of the stage 30. During the pressing process of the bonding surface 200a, the positioning block 302 does not move relative to the bottom of the positioning groove 300 due to the abutment of the panel 20 (as shown in FIG. 3).
於另一實施例中，組裝治具3的定位塊302相對定位槽300的底部的高度可恰好等於軟性電路板200的厚度，只要能使面板20於載台30的定位槽300中朝向定位槽300的底部抵靠時能夠恰好壓合軟性電路板200的貼合面200a即可。 In another embodiment, the height of the positioning block 302 of the assembly jig 3 relative to the bottom of the positioning slot 300 can be exactly equal to the thickness of the flexible circuit board 200, so that the panel 20 can be oriented in the positioning slot 300 of the stage 30 toward the positioning slot. When the bottom of the 300 is abutted, the bonding surface 200a of the flexible circuit board 200 can be just pressed.
請參照第4圖。第4圖為繪示依照本發明另一實施例 的組裝治具3的剖面示意圖。 Please refer to Figure 4. FIG. 4 is a view showing another embodiment of the present invention A schematic cross-sectional view of the assembly jig 3.
如第4圖所示，於本實施例中，組裝治具5包含載台50以及定位結構。組裝治具5的載台50具有定位槽500。組裝治具5的定位結構為子定位槽502。載台50的定位槽500用以容納面板20，並可卡合面板20的邊緣，藉以定位面板20。面板20可沿著定位槽500的側壁朝向或遠離定位槽500的底部移動。組裝治具5的子定位槽502形成於定位槽500的底部。組裝治具5的定位結構用以卡合軟性電路板200的邊緣，藉以定位軟性電路板200。 As shown in Fig. 4, in the present embodiment, the assembly jig 5 includes a stage 50 and a positioning structure. The stage 50 on which the jig 5 is assembled has a positioning groove 500. The positioning structure of the assembly jig 5 is a sub-positioning groove 502. The positioning slot 500 of the stage 50 is used to receive the panel 20 and can engage the edge of the panel 20 to position the panel 20. The panel 20 is movable toward or away from the bottom of the positioning slot 500 along the sidewall of the positioning slot 500. The sub-positioning groove 502 of the assembly jig 5 is formed at the bottom of the positioning groove 500. The positioning structure of the assembly jig 5 is used to engage the edge of the flexible circuit board 200 to position the flexible circuit board 200.
在此要說明的是，本實施例的組裝治具5與第2A圖與第2B圖所示的組裝治具1的差異處，在於本實施例的組裝治具5設置於定位槽500的底部的子定位槽502為固定深度。並且，於本實施例中，組裝治具5的子定位槽502相對定位槽500的底部的深度小於軟性電路板200的厚度，因此在面板20於載台50的定位槽500中朝向軟性電路板200的貼合面200a壓合的過程中，面板20會在接觸定位槽500的底部之前先壓合至軟性電路板200的貼合面200a(如第4圖所示)。 It is to be noted that the difference between the assembly jig 5 of the present embodiment and the assembly jig 1 shown in FIGS. 2A and 2B is that the assembly jig 5 of the present embodiment is disposed at the bottom of the positioning groove 500. The sub-positioning slots 502 are of a fixed depth. Moreover, in the present embodiment, the depth of the sub-positioning groove 502 of the assembly jig 5 is smaller than the thickness of the bottom of the positioning groove 500, so that the panel 20 faces the flexible circuit board in the positioning groove 500 of the stage 50. During the pressing of the bonding surface 200a of the 200, the panel 20 is pressed to the bonding surface 200a of the flexible circuit board 200 (as shown in FIG. 4) before contacting the bottom of the positioning groove 500.
於另一實施例中，組裝治具5的子定位槽502相對定位槽500的底部的深度可恰好等於軟性電路板200的厚度，只要能使面板20於載台50的定位槽500中朝向定位槽500的底部抵靠時能夠恰好壓合軟性電路板200的貼合面200a即可。 In another embodiment, the depth of the sub-positioning groove 502 of the assembly jig 5 relative to the bottom of the positioning groove 500 may be exactly equal to the thickness of the flexible circuit board 200 as long as the panel 20 can be oriented in the positioning groove 500 of the stage 50. When the bottom of the groove 500 abuts, the bonding surface 200a of the flexible circuit board 200 can be just pressed.
請參照第5圖。第5圖為繪示依照本發明一實施例的組裝方法的流程圖。 Please refer to Figure 5. FIG. 5 is a flow chart showing an assembly method in accordance with an embodiment of the present invention.
如第5圖所示，於本實施例中，組裝流程主要係用以組裝相互連接的面板與軟性電路板。本實施例的組裝方法包含下列步驟。 As shown in FIG. 5, in the present embodiment, the assembly process is mainly used to assemble the interconnected panels and the flexible circuit board. The assembly method of this embodiment includes the following steps.
步驟S100：提供組裝治具。 Step S100: providing an assembly jig.
本實施例的組裝治具的內部結構以及其所包含的各部元件之間的連接與作動關係可配合參照第1A圖至第2B圖及上述相關說明，在此不再贅述。本實施例的組裝方法接著包含下列步驟。 The internal structure of the assembly jig of the present embodiment and the connection and actuation relationship between the various components included in the embodiment can be referred to the drawings 1A to 2B and the related description, and will not be described herein. The assembly method of this embodiment then includes the following steps.
步驟S102：卡合並定位軟性電路板的邊緣至定位塊之間，其中軟性電路板與面板相互連接。 Step S102: The card merges and positions the edge of the flexible circuit board to the positioning block, wherein the flexible circuit board and the panel are connected to each other.
步驟S104：朝向軟性電路板相對載台旋轉本體，致使本體抵靠載台，並同時使壓抵部延伸至定位槽中將部分軟性電路板壓抵至定位槽的底部。 Step S104: Rotating the body toward the flexible circuit board opposite to the stage, causing the body to abut against the stage, and at the same time extending the pressing portion into the positioning groove to press a part of the flexible circuit board against the bottom of the positioning groove.
步驟S106：相對軟性電路板翻轉面板，致使面板位於軟性電路板上方。 Step S106: The panel is flipped relative to the flexible circuit board, so that the panel is located above the flexible circuit board.
步驟S108：卡合經翻轉的面板的邊緣至定位槽。 Step S108: Engage the edge of the flipped panel to the positioning slot.
步驟S110：朝向軟性電路板放置經翻轉的面板，致使面板抵靠定位塊，並使每一定位塊壓縮對應的彈性件。 Step S110: placing the flipped panel toward the flexible circuit board, causing the panel to abut against the positioning block, and compressing each of the positioning blocks to compress the corresponding elastic member.
步驟S112：壓合經翻轉的面板至貼合面，致使面板與軟性電路板藉由背膠而相互黏合，其中每一定位塊相對定位槽的底部的高度等於軟性電路板的厚度。 Step S112: Pressing the flipped panel to the bonding surface, so that the panel and the flexible circuit board are bonded to each other by the adhesive, wherein the height of each positioning block relative to the bottom of the positioning groove is equal to the thickness of the flexible circuit board.
其中，若軟性電路板能夠很穩固地固定於定位塊之間，則上述步驟S104可省略。 Wherein, if the flexible circuit board can be firmly fixed between the positioning blocks, the above step S104 can be omitted.
於另一實施例中，若採用第3圖中所示的組裝治具3(亦即，設置於定位槽的底部的定位塊為固定高度，且組 裝治具3的定位塊相對定位槽的底部的高度小於軟性電路板200的厚度)，則本實施例的組裝方法可省略上述步驟S110。於本實施例中，組裝治具3的定位塊302相對定位槽300的底部的高度小於軟性電路板200的厚度，因此在面板20於載台30的定位槽300中朝向軟性電路板200的貼合面200a壓合的過程中，定位塊302並不會因為受到面板20抵靠而相對定位槽300的底部移動(如第3圖所示)。 In another embodiment, if the assembly jig 3 shown in FIG. 3 is used (that is, the positioning block disposed at the bottom of the positioning groove is a fixed height, and the group The assembly method of the fixture 3 is smaller than the thickness of the bottom of the flexible circuit board 200. The assembly method of the embodiment may omit the above step S110. In this embodiment, the height of the positioning block 302 of the assembly jig 3 relative to the bottom of the positioning slot 300 is smaller than the thickness of the flexible circuit board 200. Therefore, the panel 20 is attached to the flexible circuit board 200 in the positioning slot 300 of the stage 30. During the pressing of the facing surface 200a, the positioning block 302 does not move relative to the bottom of the positioning groove 300 by the abutment of the panel 20 (as shown in Fig. 3).
於另一實施例中，組裝治具3的定位塊302相對定位槽300的底部的高度可恰好等於軟性電路板200的厚度，只要能使面板20於載台30的定位槽300中朝向定位槽300的底部抵靠時能夠恰好壓合軟性電路板200的貼合面200a即可。 In another embodiment, the height of the positioning block 302 of the assembly jig 3 relative to the bottom of the positioning slot 300 can be exactly equal to the thickness of the flexible circuit board 200, so that the panel 20 can be oriented in the positioning slot 300 of the stage 30 toward the positioning slot. When the bottom of the 300 is abutted, the bonding surface 200a of the flexible circuit board 200 can be just pressed.
請參照第6圖。第6圖為繪示依照本發明另一實施例的組裝方法的流程圖。 Please refer to Figure 6. FIG. 6 is a flow chart showing an assembly method according to another embodiment of the present invention.
如第6圖所示，於本實施例中，組裝方法包含下列步驟。 As shown in Fig. 6, in the present embodiment, the assembly method includes the following steps.
步驟S300：提供組裝治具。 Step S300: providing an assembly jig.
本實施例的組裝治具的內部結構以及其所包含的各部元件之間的連接與作動關係可配合參照第4圖及上述相關說明，在此不再贅述。本實施例的組裝方法接著包含下列步驟。 The internal structure of the assembly jig of the present embodiment and the connection and actuation relationship between the components of the components of the present embodiment can be referred to with reference to FIG. 4 and the related description, and details are not described herein again. The assembly method of this embodiment then includes the following steps.
步驟S302：卡合軟性電路板的邊緣至子定位槽，其中軟性電路板與面板相互連接。 Step S302: Snap the edge of the flexible circuit board to the sub-positioning slot, wherein the flexible circuit board and the panel are connected to each other.
步驟S304：朝向軟性電路板相對載台旋轉本體，致使本體抵靠載台，並同時使壓抵部延伸至定位槽中將部分軟 性電路板壓抵至定位槽的底部。 Step S304: rotating the body opposite to the stage toward the flexible circuit board, causing the body to abut against the stage, and at the same time extending the pressing portion into the positioning groove to be partially soft The circuit board is pressed against the bottom of the positioning slot.
步驟S306：相對軟性電路板翻轉面板，致使面板位於軟性電路板上方。 Step S306: The panel is flipped relative to the flexible circuit board, so that the panel is located above the flexible circuit board.
步驟S308：卡合經翻轉的面板的邊緣至定位槽。 Step S308: Engage the edge of the flipped panel to the positioning slot.
步驟S310：壓合經翻轉的面板至貼合面，致使面板與軟性電路板藉由背膠而相互黏合。 Step S310: Pressing the flipped panel to the bonding surface, so that the panel and the flexible circuit board are bonded to each other by backing.
其中，若軟性電路板能夠很穩固地固定於子定位槽中，則上述步驟S304可省略。 Wherein, if the flexible circuit board can be firmly fixed in the sub-positioning slot, the above step S304 can be omitted.
由以上對於本發明的具體實施例的詳述，可以明顯地看出，本發明的組裝治具以及組裝方法主要係以定位槽中的定位結構卡合並定位軟性電路板的邊緣，並可以定位槽卡合並定位面板的邊緣。因此，為了完成將軟性電路板彎折以黏合至面板的背面的程序，可先將軟性電路板卡合並定位於定位槽中的定位結構，再將面板卡合並定位於定位槽，最後再將面板沿定位槽的側壁朝向軟性電路板壓合。藉此，本發明的組裝治具除了可藉由定位結構與定位槽分別確保軟性電路板與面板之間的相對位置之外，還可避免使用習知組裝治具的過程中因抹平壓合等動作造成軟性電路板形變而影響軟性電路板相對面板的定位精度的問題發生。並且，由於本發明的組裝治具可分別卡合並定位軟性電路板與面板，因此操作人員在進行將軟性電路板彎折以黏合至面板的背面的程序時，相較於使用習知組裝治具除了可更精確之外，還可更省時。 From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that the assembly jig and the assembly method of the present invention mainly integrate the positioning of the flexible circuit board with the positioning structure in the positioning groove, and can position the groove. The card merges the edges of the positioning panel. Therefore, in order to complete the process of bending the flexible circuit board to be bonded to the back side of the panel, the flexible circuit board card may be firstly positioned and positioned in the positioning structure in the positioning slot, and then the panel card is merged and positioned in the positioning slot, and finally the panel is assembled. Pressing along the sidewall of the positioning groove toward the flexible circuit board. Therefore, in addition to ensuring the relative position between the flexible circuit board and the panel by the positioning structure and the positioning groove, the assembly jig of the present invention can also avoid the flat pressing by using the conventional assembly jig. The problem that the action of the flexible circuit board is deformed and affects the positioning accuracy of the flexible circuit board relative to the panel occurs. Moreover, since the assembly jig of the present invention can be respectively engaged with the positioning flexible circuit board and the panel, the operator performs the procedure of bending the flexible circuit board to adhere to the back surface of the panel, compared to using the conventional assembly jig. In addition to being more precise, it can be more time-saving.
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明的精神和 範圍內，當可作各種的更動與潤飾，因此本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and those skilled in the art, without departing from the spirit of the invention. In the scope of the invention, the scope of the invention is defined by the scope of the appended claims.
1‧‧‧組裝治具 1‧‧‧Assembled fixture
10‧‧‧載台 10‧‧‧ stage
100‧‧‧定位槽 100‧‧‧ positioning slot
100a‧‧‧容置空間 100a‧‧‧ accommodating space
102‧‧‧定位塊 102‧‧‧ Positioning block
104‧‧‧彈性件 104‧‧‧Flexible parts
106‧‧‧壓條 106‧‧‧Pressing
106a‧‧‧本體 106a‧‧‧ Ontology
106b‧‧‧壓抵部 106b‧‧‧Fighting Department
106c‧‧‧第二固定件 106c‧‧‧Second fixture
108‧‧‧第一固定件 108‧‧‧First fixture
20‧‧‧面板 20‧‧‧ panel
20a‧‧‧顯示面 20a‧‧‧ display surface
20b‧‧‧背面 20b‧‧‧back
200‧‧‧軟性電路板 200‧‧‧Soft circuit board
200a‧‧‧貼合面 200a‧‧‧Fitting surface
3‧‧‧組裝治具 3‧‧‧Assembled fixtures
30‧‧‧載台 30‧‧‧stage
300‧‧‧定位槽 300‧‧‧ positioning slot
302‧‧‧定位塊 302‧‧‧ Positioning block
5‧‧‧組裝治具 5‧‧‧Assembled fixture
50‧‧‧載台 50‧‧‧ stage
500‧‧‧定位槽 500‧‧‧ positioning slot
502‧‧‧子定位槽 502‧‧‧Sub Positioning Slot
S100~S310‧‧‧步驟 S100~S310‧‧‧Steps
第1A圖為繪示依照本發明一實施例的組裝治具的立體圖，其中軟性電路板受定位塊卡合。 1A is a perspective view of an assembly jig in which a flexible circuit board is engaged by a positioning block in accordance with an embodiment of the present invention.
第1B圖為繪示第1A圖中的組裝治具的立體圖，其中壓條壓抵部分軟性電路板。 FIG. 1B is a perspective view showing the assembly jig in FIG. 1A, in which the bead is pressed against a part of the flexible circuit board.
第1C圖為繪示第1A圖中的組裝治具的立體圖，其中面板卡合定位槽並壓合至軟性電路板。 1C is a perspective view showing the assembly jig of FIG. 1A, wherein the panel is engaged with the positioning groove and pressed to the flexible circuit board.
第2A圖為繪示第1A圖中的組裝治具沿線段2A-2A’的剖面示意圖，其中面板尚未壓合至軟性電路板。 Fig. 2A is a schematic cross-sectional view showing the assembly jig of Fig. 1A along line 2A-2A', wherein the panel has not been pressed to the flexible circuit board.
第2B圖為繪示第1C圖中的組裝治具沿線段2B-2B’的剖面示意圖，其中面板已壓合至軟性電路板。 Fig. 2B is a schematic cross-sectional view showing the assembly jig of Fig. 1C along line 2B-2B', wherein the panel has been pressed to the flexible circuit board.
第3圖為繪示依照本發明另一實施例的組裝治具的剖面示意圖。 3 is a cross-sectional view showing an assembly jig according to another embodiment of the present invention.
第4圖為繪示依照本發明另一實施例的組裝治具的剖面示意圖。 4 is a cross-sectional view showing an assembly jig according to another embodiment of the present invention.
第5圖為繪示依照本發明一實施例的組裝方法的流程圖。 FIG. 5 is a flow chart showing an assembly method in accordance with an embodiment of the present invention.
第6圖為繪示依照本發明另一實施例的組裝方法的流程圖。 FIG. 6 is a flow chart showing an assembly method according to another embodiment of the present invention.
1‧‧‧組裝治具 1‧‧‧Assembled fixture
10‧‧‧載台 10‧‧‧ stage
100‧‧‧定位槽 100‧‧‧ positioning slot
100a‧‧‧容置空間 100a‧‧‧ accommodating space
102‧‧‧定位塊 102‧‧‧ Positioning block
104‧‧‧彈性件 104‧‧‧Flexible parts
20‧‧‧面板 20‧‧‧ panel
20a‧‧‧顯示面 20a‧‧‧ display surface
20b‧‧‧背面 20b‧‧‧back
200‧‧‧軟性電路板 200‧‧‧Soft circuit board
200a‧‧‧貼合面 200a‧‧‧Fitting surface
Claims (14)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210092663.1A CN102625649B (en) | 2012-03-28 | 2012-03-28 | Assembling jig and assembling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201340800A TW201340800A (en) | 2013-10-01 |
| TWI551204B true TWI551204B (en) | 2016-09-21 |
Family
ID=46565254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101121587A TWI551204B (en) | 2012-03-28 | 2012-06-15 | Assembly jig and assembly method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102625649B (en) |
| TW (1) | TWI551204B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108051935A (en) * | 2018-01-02 | 2018-05-18 | 京东方科技集团股份有限公司 | A kind of display module assembled fixture |
| CN108601222B (en) * | 2018-04-18 | 2019-09-17 | 霸州市云谷电子科技有限公司 | Flexible circuit board apparatus for turning |
| CN108819267B (en) * | 2018-05-25 | 2020-09-08 | 江苏毅昌科技有限公司 | Foot pad attaching jig |
| CN108535900A (en) * | 2018-06-13 | 2018-09-14 | 广东速美达自动化股份有限公司 | A kind of detection clamp tool |
| CN108519695B (en) * | 2018-06-13 | 2024-02-02 | 广东速美达自动化股份有限公司 | LCD screen detects assembly line |
| CN109637366B (en) * | 2018-12-28 | 2020-10-09 | 厦门天马微电子有限公司 | Jig and bending method of display module |
| CN109733042B (en) * | 2019-02-13 | 2020-12-08 | 业成科技（成都）有限公司 | Device for preparing pressure reverse folding angle structure |
| CN110494031B (en) * | 2019-08-19 | 2024-06-07 | 新辉开科技（深圳）有限公司 | Jig and method for attaching FPC and lens |
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|---|---|---|---|---|
| TW531475B (en) * | 2002-08-21 | 2003-05-11 | Quanta Display Inc | A jig utilized during an assembly step of a TFT panel and a backlight module |
| US7623217B2 (en) * | 2005-07-14 | 2009-11-24 | Via Optronics, Llc | Tool for use in affixing an optical component to a liquid crystal display (LCD) |
| TWM389410U (en) * | 2010-05-19 | 2010-09-21 | Flexium Interconnect Inc | Universal adhering jig of flexible printed circuit and its jig plate set |
| TW201105190A (en) * | 2009-07-17 | 2011-02-01 | Htc Corp | Fixture assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60502147A (en) * | 1983-08-26 | 1985-12-12 | セ− オ− デ− アンテ−ル テクニ−ク エスア− | Assembly robot that can apply force to parts |
| CN201562260U (en) * | 2009-11-23 | 2010-08-25 | 英业达股份有限公司 | Assembly jig for touch display panel and assembly parts applying same |
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2012
- 2012-03-28 CN CN201210092663.1A patent/CN102625649B/en not_active Expired - Fee Related
- 2012-06-15 TW TW101121587A patent/TWI551204B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW531475B (en) * | 2002-08-21 | 2003-05-11 | Quanta Display Inc | A jig utilized during an assembly step of a TFT panel and a backlight module |
| US7623217B2 (en) * | 2005-07-14 | 2009-11-24 | Via Optronics, Llc | Tool for use in affixing an optical component to a liquid crystal display (LCD) |
| TW201105190A (en) * | 2009-07-17 | 2011-02-01 | Htc Corp | Fixture assembly |
| TWM389410U (en) * | 2010-05-19 | 2010-09-21 | Flexium Interconnect Inc | Universal adhering jig of flexible printed circuit and its jig plate set |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102625649B (en) | 2014-12-10 |
| TW201340800A (en) | 2013-10-01 |
| CN102625649A (en) | 2012-08-01 |
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