TWI548877B - Connecting mechanism for semiconductor testing device - Google Patents
Connecting mechanism for semiconductor testing device Download PDFInfo
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- TWI548877B TWI548877B TW104101108A TW104101108A TWI548877B TW I548877 B TWI548877 B TW I548877B TW 104101108 A TW104101108 A TW 104101108A TW 104101108 A TW104101108 A TW 104101108A TW I548877 B TWI548877 B TW I548877B
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Description
本發明係關於一種半導體元件測試連接機構,尤指一種適用於連結測試頭與針測機之半導體元件測試連接機構。 The invention relates to a semiconductor component test connection mechanism, in particular to a semiconductor component test connection mechanism suitable for connecting a test head and a needle tester.
關於習知半導體元件測試連接機構存在了幾項缺失,首先光源供應裝置阻擋了探針卡的取放路徑,使得操作人員每次都必須將光源供應裝置移開後,才能進行更換作業,便利性有待加強。其次,此種連接對位方式,缺乏緩衝及調整機制,在連接定位過程中易產生偏差,精準度不高。再者,電路板上須利用各種排線與測試頭作連接,在維修過程中,易拉扯或彎折而導致傳輸之測試訊號異常,降低測試的穩定性。 There are several shortcomings regarding the conventional semiconductor component test connection mechanism. Firstly, the light source supply device blocks the pick-and-place path of the probe card, so that the operator must remove the light source supply device every time before the replacement operation can be performed, and the convenience is facilitated. It needs to be strengthened. Secondly, this kind of connection alignment method lacks buffering and adjustment mechanism, and it is easy to produce deviation during the connection and positioning process, and the accuracy is not high. Moreover, the circuit board must be connected with the test head by using various kinds of wires, and during the maintenance process, the test signal is abnormally transmitted and bent, and the stability of the test is lowered.
發明人緣因於此,本於積極發明之精神,亟思一種可以解決上述問題之半導體元件測試連接機構,幾經研究實驗終至完成本發明。 Inventors for this reason, in the spirit of active invention, thinking about a semiconductor component test connection mechanism that can solve the above problems, after several research experiments to complete the present invention.
本發明之主要目的係在提供一種半導體元件測試連接機構,該連接機構之結構主體係設置於測試頭上,故二者可依一樞轉軸進行同軸翻轉,有別於傳統結構主體與針測機相連之設計模式,藉此便於使用者安裝、維修及取放探針卡,同時藉由連接時之微調機構,使得結構主體能水平搭接針測機,提高連接定位之精準度。 The main object of the present invention is to provide a semiconductor component test connection mechanism. The main structure of the connection mechanism is disposed on the test head, so that the two can be coaxially inverted according to a pivot axis, which is different from the traditional structure body and the needle tester. The design mode is convenient for the user to install, repair and pick up the probe card, and at the same time, the fine adjustment mechanism during the connection enables the structural body to be horizontally overlapped with the needle measuring machine, thereby improving the accuracy of the connection positioning.
為達成上述目的,本發明之半導體元件測試連接機構,用於連接一測試頭及一針測機,包括有一支撐部、一主體部及一套環部。支撐部固設於測試頭,包括有一連結板及複數滑柱,每一滑柱係分別固設於連結板,藉以作為主體部滑動時之滑移軌道。主體部包括一具有複數滑槽之結構主體、複數緩衝件及複數卡扣件,每一緩衝件係連接連結板及結構主體,可作為結構主體與針測機連結及卸除時之微調緩衝機制,而每一卡扣件係設置於結構主體上,提供一卡扣單元部件,在本發明中可為一插銷,使得結構主體與套環部可相連結。上述卡扣件係配合固設於針測機上之套環部,其具有可分別與每一卡扣件卡接之複數卡扣槽,以及分別滑設每一導引柱之複數斜向槽。藉此,利用旋轉卡合的方式將二者固定結合。 To achieve the above object, the semiconductor component test connection mechanism of the present invention is used for connecting a test head and a needle measuring machine, and includes a support portion, a main body portion and a set of ring portions. The support portion is fixed to the test head, and includes a connecting plate and a plurality of sliding columns, and each of the sliding columns is respectively fixed on the connecting plate, thereby being used as a sliding track when the main body portion slides. The main body portion comprises a structural body having a plurality of chutes, a plurality of buffering members and a plurality of latching members, each of the buffering members connecting the connecting plate and the structural body, and can be used as a fine adjustment buffering mechanism when the structural main body is connected and removed from the needle measuring machine. And each of the fastening components is disposed on the structural body to provide a buckle unit component. In the present invention, the latching member can be a latch so that the structural body and the collar portion can be coupled. The fastening component is matched with a collar portion fixed on the needle measuring machine, and has a plurality of locking grooves respectively engageable with each of the fastening members, and a plurality of oblique grooves respectively sliding each guiding column . Thereby, the two are fixedly combined by means of a rotational engagement.
此外,上述主體部可更包括一光源供應裝置,其設置於結構主體之一容置空間中,並電連接測試頭。該光源供應裝置可為LED光源,係作為影像測試之光源供應裝置。藉此,將光源供應裝置設置於主體部可提升更換或 檢測探針卡之便利性,同時妥善利用結構裝置內之容置空間。 In addition, the main body portion may further include a light source supply device disposed in one of the accommodating spaces of the structural body and electrically connected to the test head. The light source supply device can be an LED light source and is used as a light source supply device for image testing. Thereby, the light source supply device is disposed in the main body portion to enhance replacement or The convenience of detecting the probe card while properly utilizing the accommodation space in the structural device.
上述主體部可更固設有複數電路板,其環繞設置於結構主體之側表面上,並電連接測試頭。其中,電路板係用來進行影像測試,其裸露固定於結構主體之側表面上,可增加散熱效果及便於檢查電路板之外觀狀況。 The main body portion can be further provided with a plurality of circuit boards which are disposed around the side surface of the structural body and electrically connected to the test head. Among them, the circuit board is used for image testing, and its bareness is fixed on the side surface of the structural body, which can increase the heat dissipation effect and facilitate the inspection of the appearance of the circuit board.
其中,上述光源供應裝置可更包括複數定位孔,其對應連接針測機之複數定位銷。該每一電路板更包括複數插槽,其可對應連接該針測機之複數定位接點。藉此,可將結構主體之各部件更精準的卡接於針測機上,提供最完善之檢測環境,同時也可避免光源供應裝置發生漏光的情形產生。 Wherein, the light source supply device may further comprise a plurality of positioning holes corresponding to the plurality of positioning pins connected to the needle measuring machine. Each of the circuit boards further includes a plurality of slots corresponding to the plurality of positioning contacts of the needle measuring machine. Thereby, the components of the structural body can be more accurately engaged on the needle measuring machine, thereby providing the most perfect detection environment, and also avoiding the occurrence of light leakage of the light source supply device.
再者,上述每一緩衝件可為一彈簧,利用彈簧伸縮形變的特性,可改善結構主體對位接合針測機時之不均勻施力或不平整狀態。更進一步,上述每一緩衝件可為一氣壓缸,藉由氣壓活塞桿與氣墊氣體的交互作用,提供縱向上之緩衝調整,可同樣改善結構主體對位接合針測機時之不均勻施力或不平整狀態。 Furthermore, each of the buffering members may be a spring, and the characteristics of the spring telescopic deformation may improve the uneven force or unevenness of the structural body when the positional engagement of the needle measuring machine is performed. Further, each of the buffering members may be a pneumatic cylinder, and the interaction between the pneumatic piston rod and the air cushion gas provides a buffer adjustment in the longitudinal direction, which can also improve the uneven force applied when the structural body is aligned with the needle measuring machine. Or uneven state.
上述每一滑槽內可分別設置一包覆於滑柱之彈性元件。藉此,提供結構主體對位接合針測機時在水平方向上之緩衝位移,增進接合之精準度。 An elastic member covering the strut can be separately disposed in each of the sliding grooves. Thereby, the buffer displacement in the horizontal direction when the structural body is aligned with the needle measuring machine is provided, and the precision of the joint is improved.
以上概述與接下來的詳細說明皆為示範性質是為了進一步說明本發明的申請專利範圍。而有關本發明的其他目的與優點,將在後續的說明與圖示加以闡述。 The above summary and the following detailed description are exemplary in order to further illustrate the scope of the invention. Other objects and advantages of the present invention will be described in the following description and drawings.
1‧‧‧半導體元件測試連接機構 1‧‧‧Semiconductor component test connection mechanism
10‧‧‧半導體元件測試裝置 10‧‧‧Semiconductor component tester
101‧‧‧支撐臂 101‧‧‧Support arm
102‧‧‧樞轉軸 102‧‧‧ pivot shaft
2‧‧‧支撐部 2‧‧‧Support
20‧‧‧測試頭 20‧‧‧Test head
21‧‧‧連結板 21‧‧‧Link board
22‧‧‧滑柱 22‧‧‧Sliding column
23‧‧‧彈性元件 23‧‧‧Flexible components
3‧‧‧主體部 3‧‧‧ Main body
31‧‧‧結構主體 31‧‧‧Structural subject
311‧‧‧滑槽 311‧‧ ‧ chute
312‧‧‧容置空間 312‧‧‧ accommodating space
32‧‧‧緩衝件 32‧‧‧ cushioning parts
33‧‧‧卡扣件 33‧‧‧Card fasteners
4‧‧‧套環部 4‧‧‧ collar
40‧‧‧針測機 40‧‧‧needle measuring machine
401‧‧‧定位銷 401‧‧‧Locating pin
402‧‧‧定位接點 402‧‧‧ Positioning contacts
41‧‧‧卡扣槽 41‧‧‧Snap slot
42‧‧‧斜向槽 42‧‧‧ oblique slot
43‧‧‧導引柱 43‧‧‧ Guide column
5‧‧‧光源供應裝置 5‧‧‧Light source supply device
51‧‧‧定位孔 51‧‧‧Positioning holes
52‧‧‧抵推件 52‧‧‧Reminder
6‧‧‧電路板 6‧‧‧Circuit board
61‧‧‧插槽 61‧‧‧ slots
7‧‧‧探針卡 7‧‧‧ probe card
9‧‧‧半導體元件測試連接機構 9‧‧‧Semiconductor component test connection mechanism
902‧‧‧樞轉軸承 902‧‧‧ pivot bearing
931‧‧‧結構主體 931‧‧‧ Structure subject
94‧‧‧針測機 94‧‧‧Needle measuring machine
941‧‧‧定位銷 941‧‧‧Locating pin
942‧‧‧插槽 942‧‧‧Slots
95‧‧‧光源供應裝置 95‧‧‧Light source supply unit
96‧‧‧電路板 96‧‧‧ boards
圖1係本發明一較佳實施例之半導體元件測試連接機構之接合狀態立體圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view showing the joined state of a semiconductor component test connection mechanism in accordance with a preferred embodiment of the present invention.
圖2係本發明一較佳實施例之半導體元件測試連接機構之分離狀態立體圖。 2 is a perspective view showing a separated state of a semiconductor component test connection mechanism according to a preferred embodiment of the present invention.
圖3係圖2之半導體元件測試連接機構之分離狀態之局部放大圖。 Fig. 3 is a partially enlarged view showing the separated state of the semiconductor element test connection mechanism of Fig. 2.
圖4係本發明一較佳實施例之半導體元件測試連接機構之鎖定狀態之A-A剖視圖。 4 is a cross-sectional view along line A-A showing the locked state of the semiconductor component test connection mechanism in accordance with a preferred embodiment of the present invention.
圖5係本發明一較佳實施例之半導體元件測試連接機構之卸除狀態之A-A剖視圖。 Figure 5 is a cross-sectional view along line A-A of the state in which the semiconductor component test connection mechanism of the preferred embodiment of the present invention is removed.
圖6係本發明一較佳實施例之半導體元件測試連接機構之鎖定狀態之A-A局部剖視圖。 Figure 6 is a partial cross-sectional view, taken along line A-A, of the locked state of the semiconductor component test connection mechanism in accordance with a preferred embodiment of the present invention.
圖7係本發明一較佳實施例之半導體元件測試連接機構之卸除狀態之A-A局部剖視圖。 Figure 7 is a partial cross-sectional view, taken along line A-A, of the state in which the semiconductor component test connection mechanism of the preferred embodiment of the present invention is removed.
圖8係本發明另一較佳實施例之半導體元件測試連接機構之立體圖。 Figure 8 is a perspective view of a semiconductor component test connection mechanism in accordance with another preferred embodiment of the present invention.
請參閱圖1至圖3,係本發明一較佳實施例之半導體元件測試連接機構之接合狀態立體圖、分離狀態立體圖及分離狀態之局部放大圖。圖1~3中出示一種半導體 元件測試連接機構1,係設置於一半導體元件測試裝置10中,主要用於連接該裝置之一測試頭20及一針測機40,其中,測試頭20係以一支撐臂101樞設於針測機40之一樞轉軸102上,然而,因半導體元件測試連接機構1之一結構主體31係設置於測試頭20上,故二者可依所述之樞轉軸102進行同軸翻轉,有別於傳統結構主體與針測機相連之設計模式,其翻轉的情形可對照圖1及圖2所示。 1 to 3 are a perspective view showing a joined state of a semiconductor component test connection mechanism according to a preferred embodiment of the present invention, a perspective view of a separated state, and a partially enlarged view of a separated state. A semiconductor is shown in Figures 1-3. The component test connection mechanism 1 is disposed in a semiconductor component testing device 10, and is mainly used to connect one of the test heads 20 and a needle measuring machine 40. The test head 20 is pivotally mounted on the needle by a support arm 101. One of the measuring machines 40 pivots on the shaft 102. However, since one of the structural members 31 of the semiconductor component test connection mechanism 1 is disposed on the test head 20, the two can be coaxially inverted according to the pivot axis 102, which is different from The design mode in which the traditional structural body is connected to the needle measuring machine can be reversed as shown in FIG. 1 and FIG. 2 .
接著,請參閱圖2及圖3,本發明之半導體元件測試連接機構1主要包括三大部分,包括有固設於測試頭20之一支撐部2、在外表面裝設有電路版6之主體部3以及固設於針測機40之一套環部4。前述之電路板6,係以裸露結構之配置方式設置於主體部3上,可增加散熱效果及便於檢查電路板之外觀狀況。 2 and FIG. 3, the semiconductor component test connection mechanism 1 of the present invention mainly comprises three major parts, including a support portion 2 fixed to the test head 20, and a main body portion on which the circuit board 6 is mounted on the outer surface. 3 and a set of ring portions 4 fixed to the needle measuring machine 40. The foregoing circuit board 6 is disposed on the main body portion 3 in a configuration of a bare structure, which can increase the heat dissipation effect and facilitate inspection of the appearance of the circuit board.
測試頭20之支撐部2,係以一連結板21將下方連接機構之主體部3支撐固定於測試頭20上,同時在連結板21上另固設有四支滑柱22,藉以作為主體部3滑動時之滑移軌道。 The support portion 2 of the test head 20 supports and fixes the main body portion 3 of the lower connecting mechanism to the test head 20 by a connecting plate 21, and at the same time, four sliding posts 22 are additionally fixed on the connecting plate 21, thereby serving as a main body portion. 3 Sliding track when sliding.
再著,主體部3包括一具有複數滑槽311(如圖4所示)之結構主體31、複數緩衝件32及複數卡扣件33,在本實施例中,上述緩衝件32係為一彈簧,但不以此為限,舉凡可提供結構主體31一緩衝作用力之構件,例如:氣壓缸等元件,皆在本發明保護之專利範圍內。而所述每一緩衝件32係以掛勾連接連結板21及結構主體31。另外,每一卡扣件33係設置於該結構主體31上,提供一卡扣單元部 件,在本發明中可為一插銷,使得結構主體31與套環部4可相連結。主體部3之結構主體31係為一中空架體,其具有一容置空間312,可供存放不同的測試套件,在本實施例中,上述容置空間312設有一光源供應裝置5,其為一LED光源,並電連接測試頭20,作為影像測試之光源供應。 The main body 3 includes a structural body 31 having a plurality of sliding grooves 311 (shown in FIG. 4), a plurality of cushioning members 32, and a plurality of latching members 33. In the embodiment, the buffering member 32 is a spring. However, not limited thereto, any component that can provide a buffering force of the structural body 31, such as a pneumatic cylinder, is within the scope of the patent protection of the present invention. Each of the buffering members 32 is connected to the connecting plate 21 and the structural body 31 by a hook. In addition, each of the fastening members 33 is disposed on the structural body 31 to provide a buckle unit. In the present invention, a latch may be provided so that the structural body 31 and the collar portion 4 can be coupled. The structure main body 31 of the main body portion 3 is a hollow frame body having an accommodating space 312 for storing different test kits. In the embodiment, the accommodating space 312 is provided with a light source supply device 5, which is An LED light source is electrically connected to the test head 20 for supply as a light source for image testing.
以上為與測試頭20相連接之各部構件,再次強調上述結構係以樞轉軸102為樞轉軸線,具備可同軸翻轉之特性,且至少可翻轉90度以上。接著,請再次參閱圖2及圖3,設置於針測機上之套環部4包括有複數卡扣槽41及複數斜向槽42,其中,複數卡扣槽41在結構主體31與套環部4上下接合的過程中,會先與卡扣件33先行卡合,使得套環部4與結構主體31成為一體的結構後,再利用旋轉卡合的方式,使得上述結構得以透過複數導引柱43分別沿著每一斜向槽42之軌跡向下滑移,而完成整體性之接合作業。 The above is the respective members connected to the test head 20, and it is again emphasized that the above-described structure has the pivot axis 102 as a pivot axis, and has the property of being coaxially inverted, and can be turned over at least 90 degrees. Next, referring to FIG. 2 and FIG. 3 again, the collar portion 4 disposed on the needle measuring machine includes a plurality of locking grooves 41 and a plurality of oblique grooves 42. The plurality of locking grooves 41 are in the structural body 31 and the collar. During the process of joining the upper and lower portions of the portion 4, the first fastening member 33 is firstly engaged with the locking member 33, so that the structure of the collar portion 4 and the structural body 31 are integrated, and then the rotation is engaged to make the structure pass through the plurality of guides. The columns 43 are respectively slid down along the trajectory of each of the oblique grooves 42 to complete the integral joining operation.
請參閱圖4及圖5,係本發明一較佳實施例之半導體元件測試連接機構之鎖定狀態之A-A剖視圖及卸除狀態之A-A剖視圖。如前所述,在本發明中,當複數卡扣槽41與卡扣件33先行卡合完畢後,為了達成水平接合之步驟,在過程中會包括有以下兩種情況,其一為鎖定狀態、其二為卸除狀態。 4 and FIG. 5 are a cross-sectional view along the line A-A and a cross-sectional view of the removed state of the semiconductor device test connection mechanism in a locked state according to a preferred embodiment of the present invention. As described above, in the present invention, after the plurality of snap grooves 41 and the snap members 33 are first engaged, in order to achieve the horizontal joint step, the following two situations are included in the process, one of which is a locked state. The second is the dismounting state.
在鎖定狀態下,如圖4所示,整個結構主體31及套環部4已接合下方針測機40,該每一斜向槽42對應一旁的導引柱43進行相對滑移而達到鎖定狀態,此時在縱向 上,連結支撐部2與結構主體31之緩衝件32將隨著整體位置向下移動而跟著被拉長,使得連結板21及結構主體31之間間隔一距離D,在本實施例中可達30公釐。在橫向上,因本發明之連接機構係透過複數滑柱22在複數滑槽311滑移,且二者之間填充有彈性元件23,在本實施例中,在滑柱22外包覆有一彈簧,係可有效防止不必要的橫向偏移,增進對位的精確性。 In the locked state, as shown in FIG. 4, the entire structural body 31 and the collar portion 4 are engaged with the lower guide measuring machine 40, and each oblique groove 42 is relatively slipped corresponding to the guiding post 43 to reach the locked state. At this time in the portrait The buffer member 32 connecting the support portion 2 and the structural body 31 will be elongated as the overall position moves downward, so that the connecting plate 21 and the structural body 31 are separated by a distance D, which is reachable in this embodiment. 30 mm. In the lateral direction, the connecting mechanism of the present invention is slid in the plurality of sliding grooves 311 through the plurality of spools 22, and is filled with elastic members 23 therebetween. In the present embodiment, a spring is coated on the outer periphery of the sliding column 22. , can effectively prevent unnecessary lateral offset and improve the accuracy of alignment.
在卸除狀態下,如圖5所示,整個結構主體31及套環部4已脫離下方針測機40,該每一斜向槽42對應一旁的導引柱43進行相對滑移而回到卸除狀態,此時在縱向上,連結支撐部2與結構主體31之緩衝件32隨著整體位置向上移動而恢復原長,使得套環部4及針測機40表面之間間隔一距離D,在本實施例中可達30公釐。藉此,藉由上述微調緩衝機構,使得結構主體在一穩定狀態中能夠水平搭接針測機,提高連接定位之精準度。 In the unloading state, as shown in FIG. 5, the entire structural body 31 and the collar portion 4 have been separated from the lower guide measuring machine 40, and each oblique groove 42 is relatively slipped corresponding to the guide post 43 on the side and returned. In the unloading state, the buffer member 32 connecting the support portion 2 and the structural body 31 is restored to the original length as the overall position is moved in the longitudinal direction, so that the distance between the collar portion 4 and the surface of the needle measuring machine 40 is a distance D. In this embodiment, it can be up to 30 mm. Thereby, the fine adjustment buffer mechanism is used to make the structural body horizontally overlap the needle measuring machine in a stable state, thereby improving the accuracy of the connection positioning.
更進一步,請參閱圖6及圖7,係本發明一較佳實施例之半導體元件測試連接機構之鎖定狀態之A-A局部剖視圖及卸除狀態之A-A局部剖視圖,亦可同時參閱圖3,其包含內部之結構特徵。如圖6所示,光源供應裝置5係位於結構主體31之一容置空間312中。在鎖定狀態下,為了避免測試中發生光源漏光的現象產生,必須確保所述光源供應裝置5能緊貼針測機40中之一探針卡7。因此,除了在光源供應裝置5之外殼上設置複數定位孔51藉以對位針測機40之複數定位銷401之外,本發明在結構主體31 與光源供應裝置5另設有複數抵推件52,在本實施例中同樣為複數彈簧,藉由彈簧的壓縮推力將上述二者彼此密合,可有效避免光源漏光的現象。此外,在探針卡7上包括複數定位接點402,在鎖定狀態下可對應連接每一電路板6之插槽61,使得電路板6係以垂直方向***水平置放之探針卡7之插槽61中,俾能提供影像偵測訊號進入連接於探針卡之晶圓中,藉以篩選出不良品以利進行後續之封裝工程。 Furthermore, referring to FIG. 6 and FIG. 7 , FIG. 6 is a partial cross-sectional view showing a locked state of a semiconductor component test connection mechanism according to a preferred embodiment of the present invention, and a partial cross-sectional view of the AA portion of the removal state, and may also refer to FIG. 3, which includes Internal structural features. As shown in FIG. 6, the light source supply device 5 is located in one of the accommodation spaces 312 of the structural body 31. In the locked state, in order to avoid the occurrence of light leakage of the light source during the test, it is necessary to ensure that the light source supply device 5 can abut against one of the probe cards 7 in the needle measuring machine 40. Therefore, the present invention is in the structural body 31 except that a plurality of positioning holes 51 are provided on the outer casing of the light source supply device 5 to thereby align the plurality of positioning pins 401 of the alignment measuring machine 40. The light source supply device 5 is further provided with a plurality of abutting members 52. In the present embodiment, the plurality of springs are also used. The two sides are closely adhered to each other by the compression thrust of the spring, so that the light source leakage phenomenon can be effectively avoided. In addition, the probe card 7 includes a plurality of positioning contacts 402. In the locked state, the slots 61 of each circuit board 6 can be correspondingly connected, so that the circuit board 6 is inserted into the horizontally placed probe card 7 in a vertical direction. In the slot 61, the image detecting signal can be supplied into the wafer connected to the probe card, thereby screening for defective products for subsequent packaging work.
同理,如圖7所示,在卸除狀態下,當結構主體31與套環部4向上移動前述之距離D後,不論在光源供應裝置5之定位孔51或在電路板6上之插槽61,皆會與對應之定位銷401及定位接點402脫離,此外,複數抵推件52可恢復至原長度,懸吊該光源供應裝置5。藉由上述設計,本發明之半導體元件測試連接機構可將結構主體之各部件更精準的卡接於針測機上,提供最完善之檢測環境,同時也可避免光源供應裝置發生漏光的情形產生。 Similarly, as shown in FIG. 7, in the unloading state, when the structural body 31 and the collar portion 4 are moved upward by the aforementioned distance D, regardless of the positioning hole 51 of the light source supply device 5 or the insertion on the circuit board 6, The slots 61 are detached from the corresponding positioning pins 401 and the positioning contacts 402. Further, the plurality of pushing members 52 can be restored to the original length to suspend the light source supply device 5. With the above design, the semiconductor component test connection mechanism of the present invention can more accurately snap the components of the structural body to the needle measuring machine, thereby providing the most perfect detection environment, and also avoiding the occurrence of light leakage of the light source supply device. .
如圖8所示,係本發明另一較佳實施例之半導體元件測試連接機構之立體圖。半導體元件測試連接機構9設置於一針測機94(Prober)上,主要包括有一結構主體931、複數電路板96以及相對應之定位銷941與插槽942。其中,該結構主體931係樞設於一樞轉軸承902上,使得結構主體931係為一種單邊固定之上掀式蓋體,並於其四周固設有複數電路板96,該電路板電連接測試頭,藉以提供影像測試訊號控制。此外,當結構主體931蓋回針測機94時,將上 述結構主體931及電路板96對應卡合至定位銷941及插槽942,完成後即可進行測試作業;反之當結構主體931處於上掀狀態且將光源供應裝置95移開後,即可進行探針卡的更換作業,或針對內部構件進行維修或更新。 As shown in FIG. 8, a perspective view of a semiconductor component test connection mechanism according to another preferred embodiment of the present invention. The semiconductor component test connection mechanism 9 is disposed on a probe 94, and mainly includes a structural body 931, a plurality of circuit boards 96, and corresponding positioning pins 941 and slots 942. The structural body 931 is pivotally mounted on a pivot bearing 902, such that the structural body 931 is a single-sided fixed upper cover body, and a plurality of circuit boards 96 are fixed around the circuit board. Connect the test head to provide image test signal control. In addition, when the structural body 931 is covered back to the needle measuring machine 94, it will be on The structure main body 931 and the circuit board 96 are correspondingly engaged to the positioning pin 941 and the slot 942, and the test operation can be performed after completion; otherwise, when the structure main body 931 is in the upper state and the light source supply device 95 is removed, the operation can be performed. Replace the probe card or repair or update the internal components.
上述實施例僅係為了方便說明而舉例而已,本發明所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。 The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.
1‧‧‧半導體元件測試連接機構 1‧‧‧Semiconductor component test connection mechanism
101‧‧‧支撐臂 101‧‧‧Support arm
102‧‧‧樞轉軸 102‧‧‧ pivot shaft
2‧‧‧支撐部 2‧‧‧Support
20‧‧‧測試頭 20‧‧‧Test head
21‧‧‧連結板 21‧‧‧Link board
22‧‧‧滑柱 22‧‧‧Sliding column
3‧‧‧主體部 3‧‧‧ Main body
31‧‧‧結構主體 31‧‧‧Structural subject
32‧‧‧緩衝件 32‧‧‧ cushioning parts
33‧‧‧卡扣件 33‧‧‧Card fasteners
4‧‧‧套環部 4‧‧‧ collar
40‧‧‧針測機 40‧‧‧needle measuring machine
41‧‧‧卡扣槽 41‧‧‧Snap slot
42‧‧‧斜向槽 42‧‧‧ oblique slot
43‧‧‧導引柱 43‧‧‧ Guide column
5‧‧‧光源供應裝置 5‧‧‧Light source supply device
6‧‧‧電路板 6‧‧‧Circuit board
Claims (9)
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TW104101108A TWI548877B (en) | 2015-01-13 | 2015-01-13 | Connecting mechanism for semiconductor testing device |
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TW201625957A TW201625957A (en) | 2016-07-16 |
TWI548877B true TWI548877B (en) | 2016-09-11 |
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TWI720769B (en) * | 2019-12-31 | 2021-03-01 | 致茂電子股份有限公司 | Test equipment and movably connected mechanism thereof |
Citations (4)
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US6104202A (en) * | 1994-09-01 | 2000-08-15 | Aesop, Inc. | Interface apparatus for automatic test equipment |
US6747447B2 (en) * | 2002-09-25 | 2004-06-08 | Advantest Corporation | Locking apparatus and loadboard assembly |
CN100403506C (en) * | 2003-03-17 | 2008-07-16 | 飞而康公司 | Probe positioning and bonding device and probe bonding method |
TWM355381U (en) * | 2008-12-05 | 2009-04-21 | Chroma Ate Inc | Semiconductor testing system with improved precise position auxiliary interface |
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2015
- 2015-01-13 TW TW104101108A patent/TWI548877B/en active
Patent Citations (4)
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US6104202A (en) * | 1994-09-01 | 2000-08-15 | Aesop, Inc. | Interface apparatus for automatic test equipment |
US6747447B2 (en) * | 2002-09-25 | 2004-06-08 | Advantest Corporation | Locking apparatus and loadboard assembly |
CN100403506C (en) * | 2003-03-17 | 2008-07-16 | 飞而康公司 | Probe positioning and bonding device and probe bonding method |
TWM355381U (en) * | 2008-12-05 | 2009-04-21 | Chroma Ate Inc | Semiconductor testing system with improved precise position auxiliary interface |
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