TWI536410B - Particle - type inductance element and package manufacturing method thereof - Google Patents

Description

微粒型電感元件及其封裝製造方法 Particulate inductor element and package manufacturing method thereof

本發明是有關一種微粒型電感元件及其封裝製造方法，特別是指以陣列形式生產電感元件，不僅使電感元件可以達到微小型化需求，而且能達成快速生產目標，提昇生產效率，以及降低製造成本者。 The invention relates to a particulate type inductor component and a package manufacturing method thereof, in particular to an inductor component produced in an array form, which not only enables the inductor component to meet the miniaturization requirement, but also achieves a rapid production target, improves production efficiency, and reduces manufacturing. Cost.

習見電感線圈，如第1A圖至第1D圖所示，係將一螺旋捲繞的線圈10貼附在一電路板12上，該線圈10的外部設一殼體14，線圈10再從殼體14向外延伸出一第一導線16與一第二導線18，該第一導線16與第二導線18分別與電路板上的焊接點20、22連接。 As shown in FIGS. 1A to 1D, a spirally wound coil 10 is attached to a circuit board 12, and a housing 14 is disposed outside the coil 10, and the coil 10 is further removed from the housing. 14 extends outwardly from a first wire 16 and a second wire 18, and the first wire 16 and the second wire 18 are respectively connected to the solder joints 20, 22 on the circuit board.

該習見線圈10，可為如第1B、1C圖所示截面為直角形扁平導線所繞成的螺旋狀繞線體24，或如第1D圖所示截面為圓形導線所繞成的螺旋狀繞線體40。其中，螺旋狀繞線體24設有一內側端26和一外側端28，螺旋狀繞線體40則設有二條拉出的導線41、42。在鑄模之前，先將螺旋狀繞線體24的內側端26、外側端28，或螺旋狀繞線體40的二導線41、42，和一導線架32的兩個末端34、38連接成一體後，再將螺旋狀繞線體24、40放入模具中，填入固 狀粉末進行鑄膜作業。鑄膜完成後再將導線架32切斷分離，由此製成單一的電感線圈。 The coil 10 can be a spiral wound body 24 surrounded by a rectangular wire having a rectangular cross section as shown in FIGS. 1B and 1C, or a spiral formed by a circular wire as shown in FIG. 1D. Winding body 40. The spiral winding body 24 is provided with an inner end 26 and an outer end 28, and the spiral winding body 40 is provided with two drawn wires 41, 42. Prior to molding, the inner end 26, the outer end 28 of the spiral wound body 24, or the two wires 41, 42 of the spiral wound body 40, and the two ends 34, 38 of a lead frame 32 are integrally joined together. After that, the spiral wound bodies 24 and 40 are placed in the mold and filled in. The powder is subjected to a casting operation. After the casting film is completed, the lead frame 32 is cut and separated, thereby forming a single inductor coil.

由於該習見電感線圈在鑄模成型之前均需逐一進行注模作業，業者乃多以排狀的方式生產，也就是在一呈排狀的導線架上間隔焊接數個電感線圈，再將數個電感線圈放入模穴之中進行個別注模作業。然而，由於每一排電感線圈之間的間隔較大，需要較大的場地和機台來生產；而且一次只能生產數量有限的電感線圈，生產效率差；導線架的使用也是造成製造成本無法降低的因素。 Since it is known that the induction coils need to be injection-molded one by one before the molding, the manufacturer is mostly produced in a row, that is, several inductor coils are welded on a row of lead frames, and then several inductors are connected. The coil is placed in the cavity for individual injection molding operations. However, due to the large spacing between each row of inductor coils, a larger field and machine are required for production; and only a limited number of inductor coils can be produced at a time, resulting in poor production efficiency; the use of leadframes also causes manufacturing costs to fail. Reduced factors.

有鑑於習見電感線圈之製造方法存在上述缺失，本發明人乃針對該些缺失研究改進之道，經長時研究終有本發明產生。 In view of the above-mentioned deficiencies in the manufacturing method of the induction coil, the present inventors have made improvements to the research of the defects, and the invention has been produced by long-term research.

因此，本發明旨在提供一種微粒型電感元件及其封裝製造方法，係使電感線圈不需使用傳統導線架而能大量生產製造者。 Accordingly, the present invention is directed to a particulate inductive component and a method of fabricating the same that enable the inductor to be mass produced by a manufacturer without the use of a conventional lead frame.

依本發明之微粒型電感元件及其封裝製造方法，係以陣列型式生產電感元件，該陣列型式可為矩形、圓形或其他型式，可一次生產四百個電感線圈以上，相較於習見一次只能生產數個或數十個電感線圈，本發明之生產效率可提高數倍之多，為本發明之次一目的。 According to the particle type inductor element and the package manufacturing method thereof, the inductor element is produced in an array type, and the array type can be rectangular, circular or other types, and can produce four hundred or more inductor coils at a time, compared with the prior art. Only a few or dozens of inductor coils can be produced, and the production efficiency of the present invention can be increased by several times, which is the second object of the present invention.

依本發明之微粒型電感元件及其封裝製造方 法，由於是以陣列型式生產電感元件，只需較小場地即可製造生產，為本發明之再一目的。 Microparticle type inductor component and package manufacturing method thereof according to the present invention The method, since the inductor element is produced in an array type, can be manufactured in a small field, and is another object of the present invention.

依本發明之微粒型電感元件及其封裝製造方法，可簡化製程，且能減少導線架的成本，為本發明之又一目的。 According to the particle type inductance element and the package manufacturing method thereof of the present invention, the process can be simplified, and the cost of the lead frame can be reduced, which is another object of the present invention.

依本發明之微粒型電感元件及其封裝製造方法，係使用液態膠作為封裝材料，液態膠可在一次印刷作業中完成矩陣排列之電感線圈封裝，液態膠液也可以滲入線圈內部以改善習見固體粉末壓填容易有空隙產生的缺失，為本發明之又一目的。 According to the particle type inductor component and the package manufacturing method thereof, the liquid glue is used as a packaging material, and the liquid glue can complete the matrix arrangement of the inductor coil package in one printing operation, and the liquid glue can also penetrate into the coil to improve the solid. It is a further object of the present invention that powder compaction is susceptible to the absence of voids.

至於本發明之詳細構造，應用原理，作用與功效，則請參照下列依附圖所作之說明即可得到完全了解。 As for the detailed construction, application principle, function and effect of the present invention, please refer to the following description according to the drawings to obtain a complete understanding.

10‧‧‧線圈 10‧‧‧ coil

12‧‧‧電路板 12‧‧‧ boards

14‧‧‧殼體 14‧‧‧Shell

16‧‧‧第一導線 16‧‧‧First wire

18‧‧‧第二導線 18‧‧‧second wire

20、22‧‧‧焊接點 20, 22‧‧‧ solder joints

24‧‧‧螺旋狀繞線體 24‧‧‧Spiral Wound Body

26‧‧‧內側端 26‧‧‧Inside

28‧‧‧外側端 28‧‧‧Outside

32‧‧‧導線架 32‧‧‧ lead frame

34、38‧‧‧導線架末端 34, 38‧‧‧ lead frame end

40‧‧‧螺旋狀繞線體 40‧‧‧Spiral winding body

41、42‧‧‧導線 41, 42‧‧‧ wires

100‧‧‧微粒型電感元件 100‧‧‧Particle Inductive Components

101‧‧‧螺旋線圈 101‧‧‧ spiral coil

102‧‧‧封裝層 102‧‧‧Encapsulation layer

103、104‧‧‧銅箔金屬片 103, 104‧‧‧copper foil

100a‧‧‧底層製備步驟 100a‧‧‧Bottom preparation steps

100b‧‧‧電感元件佈建步驟 100b‧‧‧Inductive component deployment steps

100c‧‧‧膠材被覆步驟 100c‧‧‧Colloid coating step

100d‧‧‧沖壓切割步驟 100d‧‧‧ Stamping and cutting steps

200‧‧‧膠帶層 200‧‧‧ tape layer

201、202、203‧‧‧線圈單元 201, 202, 203‧‧ ‧ coil unit

2‧‧‧螺旋線圈本體 2‧‧‧ spiral coil body

2A、2B‧‧‧引出線 2A, 2B‧‧‧ lead line

300‧‧‧鐵合金膠 300‧‧‧ iron alloy glue

400‧‧‧銅箔金屬板 400‧‧‧copper metal sheet

401、402、403‧‧‧導孔 401, 402, 403‧‧ ‧ guide holes

第1A~1D圖為習見功率電感的實施例示意圖。 Figures 1A to 1D are schematic views of an embodiment of a power inductor.

第2圖為本發明之微粒型電感元件的剖面示意圖。 Fig. 2 is a schematic cross-sectional view showing the particulate inductor element of the present invention.

第3圖為本發明之微粒型電感元件之封裝製造方法的流程方塊圖。 Fig. 3 is a block diagram showing the flow of a package manufacturing method of the particulate inductor element of the present invention.

第4A~4F圖為本發明之微粒型電感元件之封裝製造方法的製作流程示意圖。 4A to 4F are schematic views showing the manufacturing process of the package manufacturing method of the particulate inductor element of the present invention.

本發明之微粒型電感元件，如第2圖所示，該 微粒型電感元件100包括一螺旋線圈101、一包覆在該螺旋線圈101外部的封裝層102、以及和螺旋線圈101之二端導線連接的銅箔金屬片103、104。其中，該封裝層102係以濕式鐵合金膠經高壓施作所形成者。 The particulate type inductance element of the present invention, as shown in Fig. 2, The particulate inductor element 100 includes a spiral coil 101, an encapsulation layer 102 coated on the outside of the spiral coil 101, and copper foil metal sheets 103, 104 connected to the two ends of the spiral coil 101. Wherein, the encapsulation layer 102 is formed by applying a wet iron alloy glue by high pressure.

本發明之微粒型電感元件，如第3圖所示，其封裝製造方法包括有以下步驟：底層製備步驟100a：製作一可供多數電感元件佈設的底層；電感元件佈建步驟100b：將多數具有二向外延伸導線之電感元件，以矩形或其他型式排列之陣列型式，佈建於上述底層的上方表面；膠材被覆步驟100c：以液態膠塗佈於上述底層的上方，使液態膠將呈陣列排列的多數電感元件完全包覆，而且滲入各個電感元件的內部；沖壓切割步驟100d：待液態膠乾固後，將每一個電感元件切割分離，以製成單顆的微粒狀電感元件。 The particle type inductor component of the present invention, as shown in FIG. 3, the package manufacturing method comprises the following steps: a bottom layer preparation step 100a: forming a bottom layer which can be disposed for a plurality of inductance elements; and an inductance element construction step 100b: The inductive component of the outwardly extending wire is arranged in a rectangular or other type of array pattern, and is disposed on the upper surface of the bottom layer; the rubber coating step 100c: coating the liquid layer on the upper layer to make the liquid glue appear Most of the inductor elements arranged in the array are completely covered and penetrate into the interior of each of the inductor elements. Stamping and cutting step 100d: After the liquid glue is dried, each of the inductor elements is cut and separated to form a single particulate inductor element.

有關本發明之微粒型電感元件之封裝製造方法，茲以下列實施例配合圖式說明，其製造流程為： The method for manufacturing the package of the particulate type inductor element of the present invention is described in the following embodiments with reference to the drawings. The manufacturing process is as follows:

1.設置一作為底層的膠帶層200，該膠帶層200的上表面具有黏性；(如第4A圖所示)在膠帶層200的上方表面設置呈矩形陣列排列的多數線圈單元201、202、203...，該線圈單元201、202、 203...各包括一螺旋線圈本體2，以及從螺旋線圈本體2的兩端延伸出的引出線2A、2B。(如第4B圖所示) 1. A tape layer 200 as a bottom layer is provided, the upper surface of the tape layer 200 having adhesiveness; (as shown in FIG. 4A), a plurality of coil units 201, 202 arranged in a rectangular array are disposed on the upper surface of the tape layer 200, 203..., the coil unit 201, 202, Each of 203... includes a spiral coil body 2, and lead wires 2A, 2B extending from both ends of the spiral coil body 2. (as shown in Figure 4B)

2.在上述線圈單元201、202、203...的外部以鐵合金膠300塗覆包覆，該鐵合金膠300為液態狀，其塗覆於線圈單元201、202、203...時，不僅可以將各個線圈單元201、202、203...全面包覆，而且可充填滲入各個線圈單元201、202、203...的內部。也就是，不論是各個線圈單元201、202、203...彼此之間，或是各個線圈單元201、202、203...的內部空間，均可以被鐵合金膠300填滿包覆。(如第4C圖所示) 2. The outer surface of the coil unit 201, 202, 203, ... is coated with a ferroalloy glue 300, which is in a liquid state, and is applied to the coil units 201, 202, 203, ... Each of the coil units 201, 202, 203, ... can be completely covered, and can be filled into the inside of each of the coil units 201, 202, 203, .... That is, the inner space of each of the coil units 201, 202, 203, ... or the respective coil units 201, 202, 203, ... can be filled and covered with the ferroalloy glue 300. (as shown in Figure 4C)

3.待鐵合金膠300乾固後，將上述膠帶200從線圈單元201、202、203...的下方撕離，使各個線圈單元201、202、203...僅外部包覆鐵合金膠300，其下表面則保持著膠帶撕離後的黏性。(如第4D圖所示) 3. After the ferroalloy glue 300 is dried, the tape 200 is peeled off from below the coil units 201, 202, 203, ... so that the respective coil units 201, 202, 203... are only coated with the iron alloy glue 300, The lower surface maintains the tack after the tape is peeled off. (as shown in Figure 4D)

4.製備一銅箔金屬板400，該銅箔金屬板400的表面鍍鎳和鍍錫，板面上並且形成矩形陣列的多數導孔401、402、403...，該多數導孔401、402、403...的位置和各線圈單元201、202、203...的位置相對。(如第4E圖所示) 4. Preparing a copper foil metal plate 400. The surface of the copper foil metal plate 400 is plated with nickel and tin, and a plurality of via holes 401, 402, 403, ... of a rectangular array are formed on the surface of the plate, and the plurality of via holes 401, The positions of 402, 403, ... are opposite to the positions of the respective coil units 201, 202, 203, .... (as shown in Figure 4E)

5.將上述製備的銅箔金屬板400黏附到上述各個線圈單元201、202、203...的下端，使各個線圈單元201、202、203...正好位於銅箔金屬板400的各導孔401、402、403...之間。(如第4F圖所示) 5. The copper foil metal plate 400 prepared above is adhered to the lower ends of the respective coil units 201, 202, 203, ... so that the respective coil units 201, 202, 203... are located at the respective guides of the copper foil metal plate 400. Between holes 401, 402, 403.... (as shown in Figure 4F)

6.以點焊，焊接，研磨，塗金屬膠...等方式，將每一線圈單元201、202、203...的引出線2A、2B固定至銅箔金屬板400之不同導孔401、402、403...上。 6. Fixing the lead wires 2A, 2B of each coil unit 201, 202, 203... to different guide holes 401 of the copper foil metal plate 400 by means of spot welding, welding, grinding, metal coating, etc. , 402, 403... on.

7.再以一沖壓機械從上而下對包覆各線圈單元201、202、203...的鐵合金膠300施以高壓力，使鐵合金膠300和各個線圈單元201、202、203...更為密接而結合成整體；同時將每一線圈單元201、202、203...切開分離。以此製得之每一線圈單體，都具有一螺旋線圈101、一包覆在該螺旋線圈101外部的封裝層102、以及和螺旋線圈101之二端導線連接的銅箔金屬片103、104。(如第2圖所示) 7. Applying a high pressure to the iron alloy glue 300 covering each coil unit 201, 202, 203... from top to bottom by a punching machine, so that the iron alloy glue 300 and the respective coil units 201, 202, 203... More closely connected and integrated into one body; at the same time, each coil unit 201, 202, 203... is cut and separated. Each coil unit thus obtained has a spiral coil 101, an encapsulation layer 102 coated on the outside of the spiral coil 101, and copper foil metal sheets 103, 104 connected to the two ends of the spiral coil 101. . (as shown in Figure 2)

本發明之微粒型電感元件及其封裝製造方法，上述步驟僅是其中之一種實施方式，實施時也可以是在一開始就將呈矩形(圓形、橢圓形或其他型式)陣列排列的多數電感線圈直接放置到銅箔金屬板的上表面，然後再以液態膠塗覆於多數電感線圈的外部，等液態膠乾固後再進行沖壓切割分離作業。而鐵合金膠只是一種封裝層的材料應用，封裝膠層並不以該材料為限。 In the particulate type inductor component and the package manufacturing method thereof, the above steps are only one of the embodiments, and may be implemented as a plurality of inductors arranged in a rectangular (circular, elliptical or other) array at the beginning. The coil is placed directly on the upper surface of the copper foil metal plate, and then coated with liquid glue on the outside of most of the inductor coils, and the liquid glue is dried and then subjected to stamping and cutting separation work. Ferroalloy is only a material for the encapsulation layer, and the encapsulant layer is not limited to this material.

綜上所述可知，本發明之微粒型電感元件及其封裝製造方法，確實具有構造更為簡單，製造更為容易，實施更具彈性，且成本更為降低之功效，該等功效可以改進習見電感元件之弊，而其並未見諸公開使用，合於專利法之規定，懇請賜准專利，實為德便。 In summary, the microparticle-type inductor component and the package manufacturing method thereof have the advantages of simpler structure, easier manufacture, more flexibility, and lower cost, and the effects can be improved. The disadvantages of the inductive component, and it has not been seen in public use, in conjunction with the provisions of the Patent Law, please give the patent, it is a virtue.

以上所述者乃是本發明較佳具體的實施例，若依本發明之構想所作之改變，其產生之功能作用，仍未超出說明書與圖示所涵蓋之精神時，均應在本發明之範圍內，合予陳明。 The above is a preferred embodiment of the present invention. If the function of the present invention is changed, the functional function of the present invention should not be exceeded in the spirit of the specification and the drawings. Within the scope, it is combined with Chen Ming.

100a‧‧‧底層製備步驟 100a‧‧‧Bottom preparation steps

100b‧‧‧電感元件佈建步驟 100b‧‧‧Inductive component deployment steps

100c‧‧‧膠材被覆步驟 100c‧‧‧Colloid coating step

100d‧‧‧沖壓切割步驟 100d‧‧‧ Stamping and cutting steps

Claims (7)

一種微粒型電感元件之封裝製造方法，其製造步驟包括：底層製備步驟：製作一可供多數電感元件佈設的底層；電感元件佈建步驟：將多數具有二向外引出線之電感元件，以矩型或其他型式排列之陣列型式，佈建於上述底層的上方表面；被覆步驟：以液態膠塗佈於上述底層的上方，使液態膠將多數電感元件完全包覆，而且滲入各個電感元件的內部；沖壓切割步驟：待液態膠乾固後，以一沖壓機械從上而下對包覆各電感元件的液態膠施壓，使液態膠和各個電感元件密接結合成整體，再將每一個電感元件切割分離，以製成單一微粒狀之電感元件；其中，所述底層在完成被覆步驟後，係先將其從多數電感元件的底部去除，再於多數電感元件的底部貼附一銅箔金屬層，然後再進行沖壓切割步驟。 A manufacturing method of a package of a particulate-type inductor component, the manufacturing step comprising: a bottom layer preparation step: fabricating a bottom layer that can be disposed for a plurality of inductor elements; and an inductor component routing step: a plurality of inductor elements having two outward lead wires, at a moment The array type of the type or other type is arranged on the upper surface of the bottom layer; the coating step: coating the upper layer of the bottom layer with liquid glue, so that the liquid glue completely covers most of the inductance elements and penetrates into the interior of each inductance element Stamping and cutting step: After the liquid glue is dried and solidified, the liquid glue covering each of the inductance elements is pressed from top to bottom by a punching machine, so that the liquid glue and the respective inductance elements are closely combined into one body, and then each of the inductance elements is combined. Cutting and separating to form a single particle-shaped inductive component; wherein, after completing the coating step, the underlayer is removed from the bottom of the plurality of inductive components, and a copper foil metal layer is attached to the bottom of the plurality of inductive components. Then, the stamping and cutting step is performed. 如申請專利範圍第1項所述之封裝製造方法，其中所述底層為可去除之膠態層，亦可直接為一銅箔金屬層而無需去除。 The package manufacturing method according to claim 1, wherein the bottom layer is a removable colloid layer, and may directly be a copper foil metal layer without removing. 如申請專利範圍第2項所述之封裝製造方法，其中所述 底層直接為銅箔金屬層時，在佈設多數電感元件後，需先將各個電感元件的二導線連接至銅箔金屬層上，再進行被覆步驟。 The package manufacturing method according to claim 2, wherein the When the bottom layer is directly a copper foil metal layer, after laying a plurality of inductor elements, the two wires of each inductor element are first connected to the copper foil metal layer, and then the coating step is performed. 如申請專利範圍第1項至第3項中任一項所述之封裝製造方法，其中所述銅箔金屬層的表面設有多數個導孔，該導孔分別位於電感元件的兩側，供與電感元件的導線連接。 The package manufacturing method according to any one of claims 1 to 3, wherein a surface of the copper foil metal layer is provided with a plurality of via holes respectively located on both sides of the inductor element. Connect to the wires of the inductive component. 如申請專利範圍第4項所述之封裝製造方法，其中所述銅箔金屬層的導孔與電感元件之導線連接型式可為點焊連接、焊接，研磨連接或塗金屬膠連接。 The package manufacturing method of claim 4, wherein the wire connection pattern of the via hole of the copper foil metal layer and the inductance component is a spot welding connection, a soldering connection, a grinding connection or a metallization connection. 如申請專利範圍第1項所述之封裝製造方法，其中所述液態膠為鐵合金膠。 The package manufacturing method according to claim 1, wherein the liquid glue is an iron alloy glue. 一種微粒型電感元件，係經由申請專利範圍第1項至第6項中任一項之封裝製造方法所製成者。 A particulate type inductance element produced by the package manufacturing method according to any one of claims 1 to 6.